KR20190023643A - Display Device - Google Patents

Abstract

A display device of the present invention comprises: a display panel for displaying an image; a cover unit on the lower part of the display panel; and an adhesive member between the display panel and the cover unit. The cover unit has a through-hole overlapping the adhesive member, and a low melting point metal having a melting point of 120°C or less is located in the through-hole. Therefore, the display panel and the cover unit can be easily separated from each other through the through-hole when a failed adhesion occurs, and the low melting point metal in the through-hole comes in contact with the adhesive member such that a decrease in adhesive force can be prevented.

Description

[0001]

The present invention relates to a display apparatus, and more particularly to a display apparatus having a narrow bezel.

In view of the information age, the display field has also been rapidly developed. As a flat panel display device (FPD) having the advantages of thinning, light weight, and low power consumption in response to the information age, ) And an electroluminescent display device (ELD) have been developed and widely used.

Such a flat panel display device is widely used in a portable device such as a smartphone, a monitor of a computer, or a television. The display panel of each flat panel display device is modularized, manufactured, and supplied through various devices such as a case or a cover .

At this time, the display panel of the flat panel display has a display area for displaying an image and a non-display area surrounding the display area, and a case or a cover located on the front surface of the display panel covers the non-display area. Here, the case or the cover portion covering the non-display region is a bezel region of the product.

This bezel area is an area where no image is displayed, which increases the size of the product and deteriorates the appearance of the product.

Therefore, in recent years, by omitting or minimizing a mechanism such as a case, it is possible to reduce the thickness and weight and reduce the bezel area, maximize the size of the display area in the same size display device, borderless products are being researched and developed.

To this end, a structure is proposed in which an adhesive member is applied between a display panel and an instrument supporting the display panel, and the adhesive member fixes the display panel on the instrument by a strong adhesive force.

However, if adhesion failure occurs, the display panel and the structure must be separated from each other, and separate equipment is required for separation, which increases the cost. In addition, it is difficult to separate the display panel and the structure due to the strong adhesive force of the adhesive member, and a problem occurs that the display panel is damaged in the process of separating the display panel and the structure. Therefore, the display device in which the adhesion failure occurs can not be recycled, which lowers the productivity and increases the cost.

SUMMARY OF THE INVENTION The present invention has been made in order to solve the above-mentioned problems, and it is an object of the present invention to solve a problem of a decrease in productivity and an increase in cost due to adhesion failure of a display device.

In order to achieve the above object, a display device of the present invention includes a display panel for displaying an image, a cover unit under the display panel, and an adhesive member between the display panel and the cover unit, And a low melting point metal having a melting point of 120 degrees Celsius or less is located in the through hole.

Here, the low melting point metal may be composed of gallium, a gallium alloy, or a hot-melt alloy.

Further, the through hole differs from the bottom area away from the adhesive member in the upper surface area adjacent to the adhesive member.

In the present invention, the weight and thickness of the display device can be reduced by fixing the display panel to the structure using the adhesive member.

In addition, the bezel area can be reduced and the borderless structure can be realized, thereby making it possible to differentiate the design.

Further, in the present invention, when the adhesion failure occurs, the display panel can be easily separated from the structure without damaging it, so that the productivity and the cost can be improved by recycling the display panel and the structure.

1 is an exploded perspective view schematically showing a display device according to an embodiment of the present invention.
2 is a cross-sectional view schematically showing a display device according to an embodiment of the present invention.
3A and 3B are schematic cross-sectional views illustrating an example of a display panel of a display device according to an embodiment of the present invention.
4A to 4G are cross-sectional views schematically showing a manufacturing process of a display device according to an embodiment of the present invention.
5A to 5C are views schematically showing a structure of a through hole of a cover unit according to an embodiment of the present invention.
6A to 6C are views schematically showing another structure of the through hole of the cover unit according to the embodiment of the present invention.

A display device according to an embodiment of the present invention includes: a display panel for displaying an image; A cover unit under the display panel; And an adhesive member between the display panel and the cover unit, wherein the cover unit has a through hole overlapping the adhesive member.

The maximum width of the through hole adjacent to the adhesive member is equal to or smaller than the width of the adhesive member.

A low melting point metal having a melting point of 120 DEG C or less is placed in the through hole.

And the low melting point metal is in contact with the adhesive member.

The low melting point metal may be made of gallium, a gallium alloy, or a fusible alloy.

The through hole has an upper surface area adjacent to the adhesive member different from a lower surface area away from the adhesive member.

At this time, the bottom area of the through hole may be larger than the top area.

A coating layer covering the through hole is formed on the back surface of the cover unit.

Hereinafter, a display device according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is an exploded perspective view schematically showing a display device according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view schematically showing a display device according to an embodiment of the present invention.

1 and 2, a display device 100 according to an embodiment of the present invention includes a display panel 110, a cover unit 120 positioned on a rear surface side of the display panel 110, And an adhesive member 130 between the display panel 110 and the cover unit 120.

The display panel 110 includes a plurality of pixels, and displays an image through a front surface. For example, the display panel 110 may be an electroluminescent display panel including a light emitting diode or a liquid crystal display panel including a liquid crystal capacitor, but the present invention is not limited thereto.

Such a display panel 110 will be described in more detail with reference to FIGS. 3A and 3B. 3A and 3B are schematic cross-sectional views showing an example of a display panel of a display device according to an embodiment of the present invention, and show one pixel region.

First, as shown in FIG. 3A, the display panel 110 of the present invention may be an electroluminescent display panel.

That is, the display panel 110 includes a substrate 150, a thin film transistor Tr disposed on the substrate 150, a light emitting diode D connected to the thin film transistor Tr, D of the encapsulation film 190.

In more detail, a semiconductor layer 154 is formed on the substrate 150. The substrate 150 may be made of glass or plastic, and may have flexibility. A buffer layer (not shown) may be formed between the substrate 150 and the semiconductor layer 154, and the buffer layer may be formed of an inorganic insulating material such as silicon oxide or silicon nitride.

Meanwhile, the semiconductor layer 154 may be formed of an oxide semiconductor material or polycrystalline silicon.

When the semiconductor layer 154 is made of an oxide semiconductor material, a light shielding pattern (not shown) may be formed under the semiconductor layer 154, and the light shielding pattern may prevent light from being incident on the semiconductor layer 154 Thereby preventing the semiconductor layer 154 from being deteriorated by light. Alternatively, the semiconductor layer 154 may be made of polycrystalline silicon. In this case, impurities may be doped on both edges of the semiconductor layer 154.

A gate insulating layer 156 made of an insulating material is formed on the semiconductor layer 154. The gate insulating layer 156 may be formed of an inorganic insulating material such as silicon oxide or silicon nitride.

A gate electrode 160 made of a conductive material such as metal is formed on the gate insulating layer 156 to correspond to the center of the semiconductor layer 154.

3A, the gate insulating layer 156 is formed on the entire surface of the substrate 150, but the gate insulating layer 156 may be patterned to have the same shape as the gate electrode 160.

An interlayer insulating layer 162 made of an insulating material is formed on the gate electrode 160. The interlayer insulating film 162 may be formed of an inorganic insulating material such as silicon oxide or silicon nitride, or an organic insulating material such as benzocyclobutene or photo-acryl.

The interlayer insulating layer 162 has first and second contact holes 164 and 166 that expose both sides of the semiconductor layer 154. The first and second contact holes 164 and 166 are spaced apart from the gate electrode 160 on both sides of the gate electrode 160.

Here, the first and second contact holes 164 and 166 are also formed in the gate insulating film 166. Alternatively, when the gate insulating film 166 is patterned in the same shape as the gate electrode 160, the first and second contact holes 164 and 166 may be formed only in the interlayer insulating film 162.

A source electrode 170 and a drain electrode 172 made of a conductive material such as a metal are formed on the interlayer insulating layer 162.

The source electrode 170 and the drain electrode 172 are spaced apart from each other around the gate electrode 160 and are connected to both sides of the semiconductor layer 154 through the first and second contact holes 164 and 166, / RTI >

The semiconductor layer 154 and the gate electrode 160, the source electrode 170 and the drain electrode 172 constitute the thin film transistor Tr, and the thin film transistor Tr includes a driving element ).

The thin film transistor Tr has a coplanar structure in which the gate electrode 160, the source electrode 170, and the drain electrode 172 are positioned above the semiconductor layer 154.

Alternatively, the thin film transistor Tr may have an inverted staggered structure in which a gate electrode is positioned below the semiconductor layer and a source electrode and a drain electrode are located above the semiconductor layer. In this case, the semiconductor layer may be made of amorphous silicon.

Although not shown, a gate line and a data line cross each other to define a pixel region, and a switching element connected to the gate line and the data line is further formed. The switching element is connected to the thin film transistor Tr which is a driving element.

In addition, a storage capacitor is formed so that the power wiring is spaced apart in parallel to the gate wiring or the data wiring, and the voltage of the gate electrode of the thin film transistor (Tr), which is a driving element during one frame, Lt; / RTI >

A protective layer 174 having a drain contact hole 176 exposing the drain electrode 172 of the thin film transistor Tr is formed to cover the thin film transistor Tr.

A first electrode 180 connected to the drain electrode 172 of the thin film transistor Tr through the drain contact hole 176 is formed on the passivation layer 174 for each pixel region. The first electrode 180 may be an anode and may be formed of a conductive material having a relatively large work function value. For example, the first electrode 170 may be made of a transparent conductive material such as indium-tin-oxide (ITO) or indium-zinc-oxide (IZO) .

Meanwhile, when the display panel 110 of the present invention is a top emission type electroluminescent display panel, a reflective electrode or a reflective layer may be further formed under the first electrode 170. For example, the reflective electrode or the reflective layer may be formed of an aluminum-palladium-copper (APC) alloy.

A bank layer 186 covering the edge of the first electrode 180 is formed on the passivation layer 174. The bank layer 186 exposes the center of the first electrode 180 corresponding to the pixel region.

A light emitting layer 182 is formed on the first electrode 180. The light emitting layer 182 may be a single layer structure of a light emitting material layer made of a light emitting material. Alternatively, the light emitting layer 182 may have a multilayer structure. For example, the light emitting layer 182 may include a hole injection layer, a hole injection layer, and a hole injection layer sequentially stacked on the first electrode 180. a transporting layer, a light emitting material layer, an electron transporting layer, and an electron injection layer. Here, the light emitting material of the light emitting material layer may be an organic light emitting material or an inorganic light emitting material such as a quantum dot.

A second electrode 184 is formed on the substrate 150 on which the light emitting layer 182 is formed. The second electrode 184 is disposed on the entire surface of the display region and is made of a conductive material having a relatively small work function value and can be used as a cathode. For example, the second electrode 184 may be formed of any one of aluminum (Al), magnesium (Mg), and aluminum-magnesium alloy (AlMg).

The first electrode 180, the light emitting layer 182, and the second electrode 184 form a light emitting diode (D).

An encapsulation film 190 is formed on the second electrode 184 to prevent external moisture from penetrating the light emitting diode D. The encapsulation film 190 may have a laminated structure of a first inorganic insulating layer 192, an organic insulating layer 194, and a second inorganic insulating layer 196, but is not limited thereto.

When the display panel 110 of the present invention is a top emission type electroluminescence display panel, a polarizing plate (not shown) for reducing external light reflection may be attached on the encapsulation film 190. For example, the polarizer may be a circular polarizer.

Meanwhile, as shown in FIG. 3B, the display panel 110 of the present invention may be a liquid crystal display panel.

That is, the display panel 110 includes first and second substrates 210 and 250 facing each other, and a liquid crystal layer 262 interposed between the first and second substrates 210 and 250, Layer 260 and the first and second polarizers 272 and 274 may be disposed on the outer surfaces of the first and second substrates 210 and 250, respectively.

The first substrate 210 may be made of glass or plastic, and may have flexibility. In addition, a buffer layer (not shown) may be further formed on the first substrate 210.

A gate electrode 222 is formed on the first substrate 210 and a gate insulating film 224 is formed to cover the gate electrode 222. A gate wiring (not shown) connected to the gate electrode 222 is formed on the first substrate 110.

A semiconductor layer 226 is formed on the gate insulating layer 224 in correspondence with the gate electrode 222. The semiconductor layer 226 may be made of an oxide semiconductor material. Meanwhile, the semiconductor layer 226 may include an active layer made of amorphous silicon and an ohmic contact layer made of impurity amorphous silicon.

A source electrode 230 and a drain electrode 232 are formed on the semiconductor layer 226. In addition, a data line (not shown) connected to the source electrode 230 intersects the gate line to define a pixel region.

The gate electrode 222, the semiconductor layer 226, the source electrode 230, and the drain electrode 232 constitute a thin film transistor Tr.

A protective layer 234 having a drain contact hole 236 exposing the drain electrode 232 is formed on the thin film transistor Tr.

A pixel electrode 240 connected to the drain electrode 232 through the drain contact hole 236 and a common electrode 242 alternately arranged with the pixel electrode 240 are formed on the passivation layer 234, .

On the second substrate 250, a black matrix 254 covering the non-display regions such as the thin film transistor Tr, the gate line, and the data line is formed. Further, a color filter layer 256 is formed corresponding to the pixel region. A buffer layer (not shown) may be further formed between the second substrate 250 and the color filter layer 256.

The first and second substrates 210 and 250 are bonded together with the liquid crystal layer 260 interposed therebetween and the liquid crystal layer 260 is formed by an electric field generated between the pixel electrode 240 and the common electrode 242. [ Of the liquid crystal molecules 262 are driven. The pixel electrode 240, the common electrode 242, and the liquid crystal layer 260 form a liquid crystal capacitor, and the liquid crystal capacitor is connected to the thin film transistor Tr.

Although not shown, an alignment layer may be formed on each of the first and second substrates 210 and 250 in contact with the liquid crystal layer 260.

On the other hand, first and second polarizers 272 and 274, which transmit only linear polarized light in a specific direction, are attached to the outer surfaces of the first and second substrates 210 and 250, respectively. Polarizing plate 274 and the light-transmitting axis of the polarizing plate 274.

The common electrode 242 is arranged on the first substrate 210 in an alternating manner with the pixel electrode 240. Alternatively, the common electrode 242 may be disposed on the entire surface of the second substrate 250 And the pixel electrode 240 may be formed in a plate shape in the pixel region.

1 and 2, a cover unit 120 is located on the rear side of the display panel 110, that is, below the display panel 110, and a gap between the display panel 110 and the cover unit 120 The adhesive member 130 is positioned and the display panel 110 and the cover unit 20 are fixed to each other via the adhesive member 130. [

Here, the adhesive member 130 has a rectangular frame shape and contacts the lower surface of the liquid crystal panel 110 and the upper surface of the cover unit 120.

The adhesive member 130 may be an elastic adhesive, a foam pad, or a double-sided tape.

More specifically, the adhesive member 130 may be an elastic adhesive having a relatively low modulus and high adhesion. The elastic adhesive may include an acrylic material, a urethane material, a silicone material, or a mixture thereof.

On the other hand, the bonding member 130 may be a double-sided tape and a foam pad including an adhesive layer on both sides of the base substrate and the base substrate. The base substrate of the foam pad is made of a material having elasticity. For example, the base substrate of the foam pad may be made of polyethylene, polyacryl, or polyurethane.

Alternatively, the base substrate of the double-sided tape may be made of polyethylene terephthalate (PET), and the adhesive layer of the double-sided tape may be made of acrylic or silicone material.

The cover unit 120 supports and protects the display panel 110 and has at least one through hole 122 that overlaps with the adhesive member 130.

The cover unit 120 may include a horizontal portion in the form of a flat plate corresponding to the back surface of the display panel 110. Further, the cover unit 120 may further include a vertical portion surrounding the side surface of the display panel 110 and connected to the horizontal portion. Alternatively, the cover unit 120 may have a rectangular frame shape corresponding to the adhesive member 130, but is not limited thereto.

When the display panel 110 is an electroluminescent display panel, the cover unit 120 may be a back cover. Alternatively, when the display panel 110 is a liquid crystal display panel, the cover unit 120 may be a bottom cover. At this time, a backlight unit (not shown) may be used as a light source between the display panel 110 and the bottom cover ) Can be located.

Alternatively, the cover unit 120 may be a middle frame between the back cover and the display panel 110, or between the bottom cover and the display panel 110.

The cover unit 120 may be made of a metal material having a relatively high stiffness, but is not limited thereto. For example, the cover unit 120 may be formed of an electrolytic galvanized iron (EGI) containing iron (Fe) as a main component.

As described above, the cover unit 120 has at least one through-hole 122 overlapping with the adhesive member 130. The through holes 122 are used to facilitate peeling of the display panel 110 and the cover unit 120 when adhesion failure occurs.

As the number of the through holes 122 increases, peeling of the display panel 110 and the cover unit 120 can be facilitated when adhesion failure occurs, but the appearance aesthetics of the display device 100 may be reduced. Therefore, it is preferable that the number of the through holes 122 is determined in consideration of appearance aesthetics and ease of peeling. For example, the number of the through holes 122 may be one to four, but is not limited thereto.

These through holes 122 may be formed corresponding to the edges of the adhesive member 130 in the form of a rectangular rim. Here, it is preferable that the maximum width of the through hole 122 adjacent to the adhesive member 130 is equal to or smaller than the width of the adhesive member 130, in order to prevent it from being visually recognized outside. The diameter of the through hole 122 adjacent to the adhesive member 130 is preferably equal to or smaller than the width of the adhesive member 130 when the plane of the through hole 122 is circular.

However, the present invention is not limited thereto, and the maximum width of the through-hole 122 adjacent to the adhesive member 130 may be larger than the width of the adhesive member 130. [

On the other hand, a low melting point metal 124 having a relatively low melting point may be disposed in the through hole 122, and a low melting point metal 124 may have a melting point of 120 degrees or less . The low melting point metal 124 fills the through hole 122 and contacts the adhesive member 130. Accordingly, the adhesive force between the adhesive member 130 and the cover unit 120 is not lowered.

The low melting point metal 124 may be made of gallium (Ga), gallium alloy or fusible alloy. Here, the fusing alloy preferably has melting points in the range of 80 to 120 degrees Celsius considering the driving environment and reliability of the display device 100. [ That is, when the melting point of the low melting point metal 124 is less than 80 degrees Celsius, the low melting point metal 124 may be removed by heat generated during driving of the display device 100, When the melting point of the metal 124 is greater than 120 degrees Celsius, the elements of the display device 100 may be damaged due to the heat applied to remove the low melting point metal 124 when adhesion failure occurs.

Such a fusable alloy may consist of bismuth (Bi) and three to four selected from lead (Pb), tin (Sn), cadmium (Cd), and indium .

For example, the fusable alloy is a Newton's alloy consisting of 50% bismuth (Bi), 31% lead (Pb) and 19% indium (In) and having a melting point of about 95 degrees Celsius, Rose's alloy consisting of 28% of lead (Pb) and 22% of indium (In) and having a melting point of about 100 degrees Celsius, 50% of bismuth (Bi) and 30% of bismuth Onion's alloy consisting of lead (Pb) and 20% indium (In) and having a melting point of about 95 to 100 degrees Celsius, or 50% bismuth (Bi) and 25% lead (Pb) And 25% of indium (In), and having a melting point of about 95 to 100 degrees Celsius (Darcet's alloy).

On the other hand, the melting point of gallium is about 30 degrees Celsius, but it is not removed when external force is not applied. In addition, gallium exists in the form of gallium oxide (Ga ₂ O ₃ ) in the atmosphere, and it must be heated to a temperature of 80 degrees Celsius or more to melt and remove it. Therefore, even if gallium is applied to the low melting point metal 124, the driving environment and reliability of the display device 100 are not affected.

Although not shown, a coating layer covering the through hole 122 may be formed on the back surface of the cover unit 120. Such a coating layer may be formed on the entire rear surface of the cover unit 120. [ Further, the coating layer may be made of acrylic paint, but is not limited thereto. This coating layer covers the low melting point metal 124 in the through hole 122 and the through hole 122 to prevent the low melting point metal 124 in the through hole 122 from being removed during driving of the display device 100 .

As described above, in the display device 100 according to the embodiment of the present invention, the display panel 110 is fixed to the cover unit 120 by using the adhesive member 130 so that the weight and thickness of the display device 100 And the bezel area can be reduced.

The cover unit 120 may include the through hole 122 so that the display panel 110 and the cover unit 120 can be easily separated from each other through the through hole 122 when adhesion failure occurs, The low melting point metal 124 is injected into the bonding member 130 and the low melting point metal 124 is brought into contact with the bonding member 130 to prevent the adhesive strength from lowering.

Hereinafter, a manufacturing process of a display device according to an embodiment of the present invention will be described with reference to the drawings.

4A to 4G are cross-sectional views schematically showing a manufacturing process of a display device according to an embodiment of the present invention.

First, as shown in FIG. 4A, a cover unit 120 is prepared, and at least one through hole 122 is formed in the cover unit 120.

Next, as shown in FIG. 4B, a low melting point metal 124 having a melting point of 120 degrees Celsius or less is injected into the through hole 122. Then, as shown in FIG.

Next, as shown in FIG. 4C, a rectangular-shaped bonding member 130 is formed on the cover unit 120 so as to overlap with the through-hole 122. At this time, the bonding member 130 is in contact with the low melting point metal 124 in the through hole 122. The display panel 110 is placed on the adhesive member 130 and the display panel 110 and the cover unit 120 are bonded to each other through the adhesive member 130 to complete the display device.

The adhesive member 130 is formed on the cover unit 120. Alternatively, the adhesive member 130 may be formed on the display panel 110 to adhere the display panel 110 and the cover unit 120 It is possible.

However, in the process of bonding the display panel 110 and the cover unit 120 through the adhesive member 130, adhesion failure may occur.

4D, when heat is partially applied to the portion corresponding to the through hole 122 from the back surface side of the cover unit 120, a low melting point (low melting point) in the through hole 122 The metal 124 is melted.

Then, as shown in FIG. 4E, the molten low melting point metal 124 is removed to expose the lower surface of the adhesive member 130 through the through hole 122. At this time, the molten low melting point metal 124 can be removed by wiping the molten low melting point metal 124 from the back side of the cover unit 120 using a cloth or the like.

Next, the peeling means 140 is inserted into the through hole 122 from the back side of the cover unit 120, and a force is applied in an upward direction to attach the adhesive member 130 corresponding to the through hole 122 to the cover unit 120 And then the remaining part of the adhesive member 130 is peeled from the cover unit 120 to separate the display panel 110 from the cover unit 120.

Next, as shown in Fig. 4F, the adhesive member (130 in Fig. 4E) remaining on the display panel 110 is removed. At this time, since the separated display panel 110 and the cover unit 120 are not damaged and no residue of the adhesive member 130 remains on the surface, the display panel 110 and the cover unit 120 can be recycled .

Next, as shown in FIG. 4G, the step of FIG. 4B is performed to inject the low-melting metal 124a again into the through-hole 122 of the cover unit 120, and the step of FIG. The display panel 110 and the cover unit 120 are bonded again through the adhesive member 130a to complete the display device.

As described above, in the present invention, the display panel 110 and the cover unit 120 can be easily separated without damaging through the through hole 122, Can be recycled to increase productivity and reduce costs.

The structure of the through hole of the cover unit of the present invention will be described in more detail with reference to the drawings.

FIGS. 5A to 5C are schematic views showing the structure of the through hole of the cover unit according to the embodiment of the present invention. FIGS. 6A to 6C schematically show another structure of the through hole of the cover unit according to the embodiment of the present invention. Fig.

5A to 5C, the through hole 122 of the cover unit 120 according to the embodiment of the present invention may have a cylindrical shape with a circular planar surface.

6A to 6C, the through-hole 122 of the cover unit 120 according to the embodiment of the present invention may have a quadrangular prism shape.

5A and 6A, the upper surface area adjacent to the adhesive member (130 in FIG. 1) may be equal to the lower surface area away from the adhesive member (130 in FIG. 1).

Alternatively, as shown in FIGS. 5B and 5C, and 6B and 6C, the through hole 122 may have an upper area different from the lower area. 5B and 6B, the upper surface area of the through hole 122 may be larger than the lower surface area, and the lower surface area may be larger than the upper surface area as shown in FIGS. 5C and 6C.

Here, when the upper surface area of the through hole 122 is larger than the lower surface area, the area of the adhesive member (130 in FIG. 1) exposed through the through hole 122 is large in the case of adhesion failure, 110) from the cover unit (120). On the other hand, when the bottom area of the through hole 122 is larger than the top area, it is easy to wipe out the molten low melting metal 124 in the through hole 122 when adhesion failure occurs, .

Meanwhile, the structure of the through hole 122 of the present invention is not limited thereto. That is, the through hole 122 of the present invention may have an elliptical column shape having an elliptical planar surface. Alternatively, the through hole 122 of the present invention may be polygonal with a polygonal plane.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention as defined in the appended claims. It can be understood that

100: display device 110: display panel
120: cover unit 122: through hole
124: Low melting point metal 130: Adhesive member
140: separation means

Claims (8)

A display panel for displaying an image;
A cover unit under the display panel;
The display panel and the cover unit
Lt; / RTI >
And the cover unit has a through hole overlapping with the adhesive member.
The method according to claim 1,
And the maximum width of the through hole adjacent to the adhesive member is equal to or smaller than the width of the adhesive member.
The method according to claim 1,
And a low melting point metal having a melting point of 120 DEG C or less is located in the through hole.
The method of claim 3,
And the low melting point metal is in contact with the adhesive member.
The method of claim 3,
Wherein the low melting point metal is made of gallium, a gallium alloy, or a fusible alloy.
The method according to claim 1,
Wherein the through hole has an upper surface area adjacent to the adhesive member different from a lower surface area away from the adhesive member.
The method according to claim 6,
And the through hole has the bottom area larger than the top area.
8. The method according to any one of claims 1 to 7,
And a coating layer covering the through hole is formed on the back surface of the cover unit.

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