KR20190022029A - Package and packing method for preventing water infiltration - Google Patents

Abstract

The present invention proposes a package and a package method capable of preventing moisture permeation, which can form a trench penetrating an upper and a lower part of a partition wall surrounding an image sensor chip, and effectively prevent moisture permeation into a space in which chips are installed through the partition wall by forming a bonding material, which prevents moisture permeation and has a bonding function, in the trench. The package capable of preventing moisture permeation comprises a substrate, a partition wall, and a transparent panel. The packaging method capable of preventing moisture permeation comprises a component preparation step of manufacturing a package capable of preventing moisture permeation in accordance with Claim 1, a partition wall attaching step, a moisture permeation preventing means forming step, and a glass panel bonding step.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a packaging method and a packaging method for preventing moisture infiltration,

The present invention relates to a package capable of preventing moisture penetration, and more particularly, to a trench penetrating upper and lower portions of a partition wall surrounding an image sensor chip, forming a bonding function and an adhesive material not permeable to moisture, And more particularly, to a package and a packaging method capable of effectively preventing water infiltration into a space in which chips are installed through moisture penetration.

One photo diode generates an electric charge corresponding to the magnitude of the photon energy applied from the outside, and converts the difference of electric charge which increases or decreases at a constant time interval into an electric signal The change of the light energy applied to the unit photodiode can be expressed by an electric signal. A plurality of photodiodes performing a function of converting energy can be arranged two-dimensionally, and electric signals corresponding to light detected by each photodiode can be arranged in a matrix form. By processing the thus arranged electric signal in an appropriate manner, it is possible to generate a digital image signal corresponding to a light applied to a constant moment photo diode, that is, an external image.

A photo diode, a conversion unit for converting a charge change of the photodiode into an electric signal, a signal processing unit for processing an electric signal output from the conversion unit, and a signal storage unit for storing the signal. The image sensor circuit is produced in the form of a chip in a semiconductor factory. Since the upper part of the photodiode must be opened, the method of using the actual image sensor chip is not limited to the use of a memory semiconductor or an ordinary semiconductor chip It differs from the method.

An image sensor chip is used for a camera or a CCTV. In general, an image sensor chip is attached to a board on which an electric wiring is already formed, with the upper part of the photodiode open. Since the upper portion of the photodiode must be continuously opened to receive the external light, the upper portion of the photodiode must be protected from foreign substances or worms. Therefore, a transparent plastic panel or a glass panel is provided on the photodiode It is common.

The photodiodes are made of semiconductors. At the top of the photodiodes, nitride, which protects the underlying circuits, is formed. Even transparent plastic panels or glass panels can not be placed in direct contact with the nitride film on top of the photodiode. Thus, a wall having a constant height is formed around the image sensor chip, and a transparent plastic panel or a glass panel is bonded to the top of the wall using a bonding material such as an epoxy. A closed space of a certain volume is formed between the wall, the image sensor chip and the transparent panel. There is no space between the panel and the wall because it is bonded using a bonding material such as epoxy, so moisture will not penetrate through these cracks.

The walls are best made of materials that prevent external moisture from penetrating into the interior space where the image sensor chip is mounted, but it is possible to prevent moisture penetration to some extent to reduce costs and to reduce the cost of the material Making it economical. However, when moisture permeates, water droplets are formed on a transparent plastic panel or a glass panel positioned at a certain distance from the upper part of the image sensor chip, thereby deteriorating the quality of the photographed image. There is a disadvantage in that it is practically impossible to remove the infiltrated moisture.

Korean Patent Publication No. 10-2011-0077902 (July 7, 2011)

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and it is an object of the present invention to provide a trench which passes through upper and lower portions of a partition wall enclosing an image sensor chip and forms a bonding function and an adhesive material not penetrating moisture, Which can prevent water penetration which can effectively prevent the penetration of water.

According to another aspect of the present invention, there is provided a method of manufacturing a semiconductor device, comprising: forming a trench passing through upper and lower portions of a partition wall surrounding an image sensor chip; forming a bonding function and an adhesive material not permeable to moisture, And it is an object of the present invention to provide a packaging method capable of preventing moisture infiltration, which can prevent a moisture infiltration which can effectively prevent moisture from permeating.

According to an aspect of the present invention, there is provided a package capable of preventing moisture penetration, including a substrate, a partition, and a transparent panel. The partition wall has an image sensor chip attached to the substrate in an empty space inside by the wall surface surrounded by the partition wall, and the lower surface is attached to the upper surface of the substrate. The transparent panel is attached to the upper surface of the partition to cover the entire upper surface of the partition. A trench is formed in the partition wall so as to pass through the partition wall vertically and an adhesive material is formed around the entrance of the trench in the trench and the upper surface of the partition wall, It has features that water can not penetrate.

According to another aspect of the present invention, there is provided a packaging method for preventing moisture permeation according to the present invention, which comprises: preparing a package capable of preventing moisture permeation according to claim 1; A penetration preventing means formation step and a glass panel bonding step. In the component preparing step, the image sensor chip is attached to the substrate, and the partition is prepared. And attaching the lower part of the barrier rib to the substrate on the same surface as the surface to which the image sensor chip is attached using the adhesive material in a state in which the image sensor chip is included in the empty internal space do. In the moisture permeation preventing means forming step, moisture permeation preventing means having a certain thickness in the direction from the upper portion of the partition wall attached to the substrate to the lower substrate is formed. In the glass panel joining step, the adhesive material is applied to the entrance of the moisture permeation preventing means and the moisture permeation preventing means, and then the transparent panel is attached to the upper portion of the partition wall.

According to the present invention, there is provided a package and a packaging method for preventing moisture penetration, comprising: forming a trench passing through upper and lower portions of a partition wall enclosing an image sensor chip; forming a bonding function and an adhesive material not permeable to moisture, It is possible to prevent water infiltration which can effectively prevent water from penetrating into the space where chips are installed.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 shows components of a package capable of preventing moisture penetration according to the present invention. Fig.
2 shows a packaging method capable of preventing moisture infiltration according to the present invention.
FIG. 3 illustrates a process of performing a packaging method to prevent moisture infiltration according to the present invention.
Figure 4 illustrates the shape, width and depth of the trench.
Fig. 5 shows a state in which the junction epoxy is applied to the trench.
FIG. 6 compares the appearance of a product with a packaging method capable of preventing moisture penetration according to the present invention and the appearance of a conventional product.

In order to fully understand the present invention and the operational advantages of the present invention and the objects achieved by the practice of the present invention, reference should be made to the accompanying drawings, which are provided for explaining exemplary embodiments of the present invention, and the contents of the accompanying drawings.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. Like reference symbols in the drawings denote like elements.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 shows components of a package capable of preventing moisture penetration according to the present invention. Fig.

Figure 1A shows the components of the package, and Figure 1B shows the packaged state.

1A and 1B, a component 100 of a package capable of preventing moisture penetration according to the present invention includes a printed circuit board 110, a partition wall 120 to be attached to a top surface of the substrate 110, And a transparent panel 130 to be attached to the upper surface of the partition 120. A plurality of squares shown in the middle of the substrate 110 are electrically connected to pads (not shown) of the image sensor chip 140 to be attached to the surfaces thereof as pads, The rectangular space defined by the one-dot chain line represents a portion to which the barrier rib 120 is to be attached, respectively. The area of the transparent panel 130 should be at least as large as the entire upper surface of the partition 120. As the transparent panel 130, a transparent glass panel as well as transparent plastic may be used. For convenience of explanation, a transparent panel will be described as a glass panel in the following.

1B, a partition wall 120 surrounding the image sensor chip 140 and the image sensor chip 140 is attached to an upper portion of the substrate 110. A transparent panel 130 is formed on the partition wall 120, And the image sensor chip 140, the partition 120, and the transparent panel 130 form an empty internal space 150. In this case,

The partition wall 120 constitutes a closed loop in which the interior is hollow and the area and shape of the empty interior can cover the edge of the image sensor chip 140. The height of the interior of the image sensor chip 140 140). ≪ / RTI > Generally, since the image sensor chip 140 has a rectangular shape, the partition 120 will also have a rectangular shape.

The barrier rib 120 serves to secure a transparent panel 130 while forming a certain space in the upper portion of the image sensor chip 140. It is preferable that the barrier rib 120 is made of a material capable of minimizing the cost, ) May be used.

The substrate 110 to which the image sensor chip 140 is attached corresponds to one corresponding to one image sensor chip 140 and also means a substrate panel in which a plurality of substrates are two-dimensionally arranged. They will be described together.

Hereinafter, a packaging method for blocking moisture infiltration path to the upper space 150 of the image sensor chip 140 using the component 100 of the package shown in FIG. 1A will be described.

2 shows a packaging method capable of preventing moisture infiltration according to the present invention.

Referring to FIG. 2, a packaging method 200 capable of preventing moisture penetration includes a component preparation step 210, a barrier attachment step 220, a moisture permeation prevention step 230, and a glass panel bonding step 240).

In the component preparing step 210, the image sensor chip 140 is attached to the substrate 110, and the barrier 120 is prepared.

In the step of attaching the barrier 120, the lower part of the barrier 120 is attached to the upper surface of the substrate 110, that is, the surface to which the image sensor chip 140 is attached, using an adhesive material. Of course, the image sensor chip should be located inside the empty part of the partition wall. In this case, the adhesive material is not merely made for adhesion, but a material having a certain thickness formed by the adhesive material should not penetrate through the moisture. For example, if the epoxy is used for such a function, will be.

In the moisture permeation preventing means forming step 130, water permeation preventing means having a certain thickness in the direction of the substrate 110 from the upper part of the partition 120 attached to the substrate 110 is formed. In the present invention, it is proposed to use a trench as a moisture permeation preventing means. The trenches should penetrate the barrier ribs 120 at least vertically and more preferably reach a certain depth of the substrate 110 after penetrating the barrier ribs 120. In order to form the trench, it is possible to use sawtooth of a certain thickness. In actual field, PCB drill router can be used easily. The shape of the trench, the depth and width of the trench will be described later.

In the glass panel joining step 140, an adhesive material such as epoxy is overlaid on the trench 122, and then the glass panel 130 is attached to the upper part of the partition wall 120.

Through the above-described processes, a package capable of preventing moisture infiltration shown in FIG. 1B is completed.

FIG. 3 illustrates a process of performing a packaging method to prevent moisture infiltration according to the present invention.

3A shows a state in which the image sensor chip 140 is attached to the substrate 110. FIG 3B shows a state in which the partition wall 120 is attached to the substrate 110 while surrounding the image sensor chip 140 3C shows a state in which the trench 121 is formed in the partition 120. FIG. 3D shows a state in which the epoxy 122 is put in the trench 121. FIG. And the panel 130 is covered.

Since the process of performing the packaging method can be understood with only the illustration shown in FIG. 3, it will not be described in detail here.

Figure 4 illustrates the shape, width and depth of the trench.

Fig. 4A illustrates two types of trenches formed in the partition, Fig. 4B shows a partial cross-sectional view of the trench, and Fig. 4C illustrates the width and depth of the trench.

Referring to FIG. 4A, the trench 121 is formed in a central portion of the partition 120 by a subsequent drilling operation, assuming that the partition 120 is rectangular. The trench formed at the center of the partition 120 is divided into two (Type # 2) in which the illustrated embodiment (type # 1) and the trench 121 are superimposed on each other at four corners by drilling four times. The trench formation operation may be selectively performed depending on the type of drill router prepared.

Referring to FIG. 4B, it can be seen that the trench 121 penetrates the central portion of the partition 120 vertically.

Referring to FIG. 4C, the trench 121 is formed in an embodiment that penetrates the partition 120 vertically as shown on the left and a part of the substrate 110 as well as the partition 120, It will be appreciated that embodiments are possible. (See arrow)

The semiconductor package process is a process of placing a semiconductor chip on a lead frame. To do so, it is necessary to separate and separate each chip from a semiconductor wafer. A diamond saw (Saw) is used to cut each chip from a semiconductor wafer. In the moisture permeation preventing means forming step 130 of the present invention, such a saw can be used to form a trench as a moisture permeation preventing means. In addition, a straight line or V-shaped trench can be implemented by using a router that processes grooves on the PCB in the PCB manufacturing process.

In the above description, the embodiment in which the trench 121 is formed as a single layer on the barrier 120 is described. However, it is also possible to implement a trench having two or more trenches formed in parallel with each other on the barrier.

The shape of the trench may be implemented in various shapes such as a straight shape, a V shape, and a stair shape depending on the shape of the blades or bits. However, if the trenches perform the function of preventing the penetration of moisture, It will not be a problem even if you have it.

The adhesive capable of simultaneously carrying out the adhesion function and the moisture permeation prevention function to be inserted into the trench can prevent the moisture from flowing into the inside through the partition when the trench is inserted into the trench and at the same time, It should be made of material. Epoxies with moisture barrier properties are sold on the market and will be used and the width and depth of the trenches may be determined in view of the viscosity of the epoxy containing these properties, ) Should be 60 占 퐉 to 500 占 퐉, which would be convenient in terms of workability.

The depths d2 and d2 'of the trenches 121 may be adjusted as necessary as described above. It is preferable that the depths d2 and d2' of the trenches 121 pass through at least the lower end of the barrier ribs 120. [ If the trench 120 is to be formed on the substrate 110, wiring or the like should not be formed on the substrate 110 on which the trench 121 is formed. If a wiring is required, a via hole may be used You will be able to solve the problem. At this time, the depth s2 'of the trench formed on the substrate 110 is preferably within a range of 30% to 50% of the thickness of the substrate 110. [

Fig. 5 shows a state in which the junction epoxy is applied to the trench.

Referring to FIG. 5, the bonded epoxy 122, shown in green, is deposited on top of the trench 121 by a dispensing machine to form a trench 121 And on the other hand the glass panel 130 which will be over the upper part of the trench 121 and later on the upper part of the partitions 120 can be firmly attached to the upper part of the partitions 120.

FIG. 6 compares the appearance of a product with a packaging method capable of preventing moisture penetration according to the present invention and the appearance of a conventional product.

FIG. 6A shows the entire appearance and moisture-proof glass panel 130 of a product which has been subjected to a packaging method capable of preventing moisture penetration according to the present invention, FIG. 6B shows the appearance and humidity of a conventional product, And the glass panel 130 is shown.

Referring to FIG. 6B, it can be seen that a void, indicated by a red arrow, generates water droplets on the inner surface of the glass panel 150 due to the moisture penetrating through the partition wall. On the other hand, it can be seen that no water droplets are formed on the glass panel 150 shown in FIG. 6A.

The results shown in FIG. 6 are the results of a HAST (Highly Accelerated Temperature and Humidity Stress Test) conducted at a temperature of 130 DEG C, a humidity of 85%, and an atmosphere of 2.3 atm for 48 hours. As a result of carrying out HAST on 36 products and 36 products assembled by a conventional method, the packaging method capable of preventing moisture infiltration according to the present invention, None of the 36 products that had been subjected to water penetration had moisture penetration. Of the 36 products assembled in the conventional manner, there were 13 voids of 7 voids.

While the present invention has been described in connection with what is presently considered to be the most practical and preferred embodiment, it is to be understood that the invention is not limited to the disclosed embodiments. It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the scope of the present invention.

110: substrate 120: partition wall
130: transparent panel 140: image sensor chip
150: Empty interior space
210: Component preparation steps
220: Step of attaching the partition
230: Glass panel joining step
240: step of forming moisture permeation preventing means

Claims (5)

Board;
A partition wall in which an image sensor chip attached to the substrate is positioned in an empty space inside by a wall surface surrounded and a lower surface is attached to an upper surface of the substrate; And
A transparent panel attached to an upper surface of the partition to cover the entire upper surface of the partition; / RTI >
A trench is formed in a central portion of the partition wall so as to pass through the partition wall vertically and an adhesive material is formed around the entrance of the trench in the trench and the upper surface of the partition,
Wherein moisture is not penetrated through the adhesive film formed by the adhesive material. 2. The apparatus of claim 1,
Wherein the substrate is further formed on a part of the substrate after passing through the barrier rib. The method of claim 1,
Wherein a width of the trench is 60 占 퐉 to 500 占 퐉.
A packaging method capable of preventing moisture infiltration to manufacture a package capable of preventing moisture permeation as set forth in claim 1,
A component preparing step of attaching the image sensor chip to the substrate and preparing the partition;
Attaching a lower portion of the partition wall to the substrate on the same surface as the surface to which the image sensor chip is attached using the adhesive material in a state where the image sensor chip is included in the empty internal space;
Forming a moisture permeation preventing means having a predetermined thickness in the direction from the upper portion of the partition wall attached to the substrate to the lower portion of the substrate; And
A glass panel joining step of applying the transparent panel to an upper portion of the partition wall after applying the adhesive material to the entrance of the moisture permeation preventing means and the moisture permeation preventing means; To
The method according to any one of claims 1 to 3, 5. The method of claim 4,
Wherein the moisture permeation preventing means is a trench formed at a central portion of the partition wall,
Wherein the trench further penetrates the partition wall vertically through a central portion of the partition wall or further penetrates to a portion of the substrate contacting the bottom portion of the partition wall.

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