KR20180120397A - Stripping compositions for photoresist - Google Patents

Abstract

The present invention provides a photoresist stripping liquid composition comprising a cyclodextrin or a derivative thereof. According to the present invention, not only a stripping liquid composition which is excellent in stripping performance against photoresist and corrosion resistance against metal wiring can be provided, but also an environmentally friendly stripping liquid having less harmfulness to human body and environment can be provided.

Description

[0002] STRIPPING COMPOSITIONS FOR PHOTORESIST [0003]

The present invention relates to a photoresist stripping liquid composition, and more particularly, to a photoresist stripping liquid composition having excellent photoresist stripping performance and corrosion resistance against metal wiring while being environmentally friendly.

Photoresist is a resin that causes chemical changes when irradiated with light. It is composed of PAC (photoactive compound), resin, additive, solvent and so on. Such a photoresist is removed by an exfoliation liquid after an etching process for forming a pattern of the photoresist electrode.

In general, the exfoliating liquid is composed of a basic component, a polar aprotic solvent, a protic solvent, a corrosion inhibitor, an antifoaming agent and the like. The basic component, which is one component of the release liquid composition, serves to break the bond of the cross-linked photoresist, and the polar aprotic solvent serves to dissociate the PAC and the Novolak resin, , Protic Solvent (Protic Solvent) serves to dissolve novolac resin. In addition, the corrosion inhibitor in the exfoliation liquid serves to prevent corrosion of the metal wiring electrode, and the antifoaming agent serves to prevent the occurrence of bubbles during the process.

Such a photoresist peeling liquid is required to have high peeling performance and corrosion resistance. That is, the photoresist stripper must be capable of stripping the photoresist component at a low temperature within a short time, and must not only have high stripping efficiency so that no residue remains on the substrate even after cleaning, but also minimizes corrosion damage to the metal wiring of the photoresist lower layer Is required.

On the other hand, the photoresist stripper solution composition can be divided into an organic stripper solution in which the main component of the solvent used is an organic material, and water, and a main component thereof is an aqueous stripper solution.

In the case of the organic release solution composition, in order to improve the peeling ability, an aprotic polar solvent such as dimethylsulfoxide, N, N-dimethylformamide, N, N-dimethylacetamide, N-methylpyrrolidone or the like and a protonic solvent Glycol ethers such as diethylene glycol monomethyl ether, diethylene glycol monobutyl ether, dipropylene glycol monomethyl ether and dipropylene glycol monobutyl ether are used as the main components. Therefore, not only the manufacturing cost of the exfoliation solution is increased but also components such as glycol ethers are highly toxic and harmful to the brain and nerves.

On the other hand, in the case of a water-based exfoliation solution using water as a main solvent, not only the manufacturing cost can be reduced but the use of the organic component having high toxicity is small, which is advantageous in terms of the treatment process of wastewater and environment, The peeling performance is lowered and the corrosion resistance against metal wiring such as Al and Cu is high.

Recently, as environmental problems have been raised, there is a growing demand for environmentally friendly exfoliating liquids. As a result, research and development on a water-based exfoliating liquid composition capable of improving the peeling performance and corrosion resistance and reducing the manufacturing cost by using water as a main solvent need.

Novel phosphorus-containing cyclodextrin polymers and their affinity for calcium cations and hydroxyapatite, Carbohydrate Polymers 98 (2013), 896-904

DISCLOSURE Technical Problem Accordingly, the present invention has been made in view of the above problems, and it is an object of the present invention to provide a peeling liquid composition which is water-soluble as a main component of a solvent and has high peelability and corrosion resistance and is environmentally friendly.

According to an aspect of the present invention, there is provided a photoresist stripper composition comprising a compound represented by Chemical Formula 1 and a basic compound.

≪ Formula 1 >

Another aspect of the present invention provides a water-based exfoliant composition for removing photoresist comprising phosphorylated-cyclodextrin or phosphorylated-cyclodextrin derivatives.

According to the present invention, by using phosphorylated-cyclodextrin or a derivative thereof as one component of the release liquid composition, it is possible to provide a release liquid composition having excellent peeling performance and corrosion resistance. This effect may be due to the high interfacial activity of the phosphate group introduced into the cyclodextrin skeleton and the inhibition of metal corrosion due to the pH buffering effect.

In addition, according to the present invention, it is possible to prepare an aqueous stripping solution containing cyclodextrin or a derivative thereof, which is soluble in water, by using water as a main component of the solvent in place of an excessive amount of organic solvent, It is possible to reduce the production cost of the liquid composition and to provide an environmentally friendly peeling liquid which is less harmful to humans and the environment.

1 is IR data of phosphorylated-cyclodextrin (b-CD-P3) prepared according to one embodiment of the present invention.

Hereinafter, the photoresist stripper composition according to one aspect of the present invention will be described in detail.

The release liquid composition according to one aspect of the present invention includes phosphorylated-cyclodextrin or a derivative thereof. More specifically, the release liquid composition of the present invention comprises (a) phosphorylated-cyclodextrin and / or a derivative thereof, (b) a basic compound and (c) water and further comprises a polar solvent, a surfactant, .

Preferably, the release liquid composition may contain 1 to 50 parts by weight of phosphorylated-cyclodextrin and / or a derivative thereof, 1 to 30 parts by weight of basic compound and 10 to 80 parts by weight of water based on the total exfoliant composition, 60 parts by weight of a polar solvent, 0.01 to 30 parts by weight of a surfactant, and 0.01 to 10 parts by weight of a corrosion inhibitor.

First, phosphorylated-cyclodextrin or a derivative thereof (hereinafter also referred to as a phosphorylated-cyclodextrin compound or phosphorylated-CDs), which is one component of the exfoliation solution of the present invention, will be described.

The phosphorylated-cyclodextrin or its derivative, which is one component of the release liquid composition of the present invention, may be a compound represented by the following general formula (1).

≪ Formula 1 >

In the general formula (1), n is an integer of 6 to 8, and R ¹ is represented by the following general formula (2).

(2)

In Formula 2, m is an integer of 0 to 2, and X, Y, and Z are each independently -OH or -OM, wherein M is Li, Na, or K. When m is 2, each Z may be the same or different from each other.

R ² and R ³ are independently selected from the group consisting of hydrogen, a substituted or unsubstituted alkyl group, a sulfonic acid group, an acyl group, a substituted or unsubstituted benzyl group and a substituted or unsubstituted benzoyl group.

In the above formula 1, phosphorylated-alpha-cyclodextrin or a derivative thereof when n = 6, phosphorylated-beta-cyclodextrin or a derivative thereof when n = 7, phosphorylated-gamma-cyclodextrin when n = 8, Corresponding to the derivatives thereof.

In the above formula (2), when X, Y and Z are -OH, R ¹ may be represented by the following formula (3).

(3)

Preferably, when X, Y and Z are each -OM, R ¹ may be represented by the following formula (4).

≪ Formula 4 >

When R ² and R ³ are alkyl groups, they may be preferably a C ₁ -C ₁₀ alkyl group, and at least one group selected from the group consisting of a hydroxyl group, an alkoxy group, a sulfonic acid group, a phosphoric acid group and an amino group substituted or unsubstituted with an alkyl group May be further substituted with a substituent.

When R ² and R ³ are an acyl group which may be represented by 'RCO-', it may preferably be a C ₁ -C ₁₀ acyl group, wherein R may be H (hydrogen) or a substituted or unsubstituted alkyl group .

When R ² and R ³ are a benzyl group or a benzoyl group, they may be further substituted with at least one substituent selected from the group consisting of a hydroxyl group, an alkoxy group, a sulfonic acid group, a phosphoric acid group, and an amino group substituted or unsubstituted with an alkyl group.

Illustratively, R ² and R ³ are independently from each other hydrogen, methyl, ethyl, propyl, octyl, methoxyethyl, hydroxypropyl, sulfobutyl, vinyl, allyl, cyclohexyl, tetrahydropyranyl, pyrrolyl, , Acetyl, propionyl, propenoyl, benzyl, methoxybenzyl, benzoyl, 2-piperidine acetyl, cinnamyl, styrene and the like, but is not limited thereto.

The phosphorylated cyclodextrin according to the present invention is represented by the following chemical formulas 5 and 6 when n = 7 and R ² and R ³ = H and m = 0 and X, Y and X = Na in the above Chemical Formulas 1 and 2, As shown in FIG.

≪ Formula 5 >

The compounds represented by Formula 1 are cylindrical cyclodextrin compounds (CDs) cyclized by bonding with D-glucose, and alpha-CD (n = 6), beta-CD (n = 7) and gamma-CD (n = 8).

In particular, CDs have a high solubility in water due to the presence of excessive hydrophilic hydroxyl groups on the outside of the cylinder, while they have a large vacancy space in the inside of the cylinder and may form capsules with other substances, But also to aliphatic and aromatic hydrocarbons.

Since the constituent unit of these CDs is glucose, it is not toxic and is very safe for human body, and is widely used for foods, medicines, cosmetics, toiletries and the like.

The phosphorylated-cyclodextrin according to the present invention achieves improved detachment performance and metal corrosion prevention performance by inhibiting metal corrosion due to high surfactant activity and pH buffering effect by the phosphate group introduced into the cyclodextrin skeleton.

In the present invention, oily or poorly soluble substances can be emulsified and homogenized in a water-based owing to the lipophilic and hydrophilic properties of CDs. Therefore, it is possible to dissolve or emulsify an oily substance such as a photosensitizer (PAC) or an organic salt into the water system without using a toxic organic solvent such as glycol ethers, thereby increasing the peeling effect.

CDs are also capable of coordinating with metal surfaces because of the abundance of alcohol and ether functionalities in the molecule. Therefore, the CDs bonded to the surface of the metal wiring can prevent the metal from coming into contact with water or oxygen, and consequently have the effect of coating the metal surface, thereby preventing corrosion of the metal. In addition, strongly basic compounds such as inorganic bases and organic bases that can corrode metal can be trapped inside the CDs, thereby improving the corrosion inhibiting ability.

The phosphorylated-cyclodextrin compound represented by Formula 1 may be used in an amount of 1 to 50 parts by weight, preferably 5 to 20 parts by weight, based on the whole composition of the exfoliant. If the weight of the cyclodextrin compound is less than 1 part by weight, the surfactant may not be sufficiently removed, and if it exceeds 50 parts by weight, the viscosity of the peeling liquid may increase and the peeling efficiency may be lowered.

Hereinafter, a mechanism for a method for producing a phosphorylated-cyclodextrin compound according to one aspect of the present invention is described (Carbohydrate Polymers 98 (2013) 896-904).

The mechanism of saccharide cross-linking by sodium trimetaphosphate (STMP) has been previously demonstrated by a ³¹ P NMR study on? -D-glucopyranoside (Lack, Dulong , 2007), and starch (Sang et al., 2007)), polysaccharides have also been studied (Picton, Cerf, & Condamine, 2007) .

The mechanism below is a summary of the main steps: (a) the conversion of the hydroxyl group to alcoholate by NaOH, (b) the opening of the STMP ring by NaOH leads to sodium tripolyphosphate, or (C) TPPg is reacted with an alcoholate to form a phosphate bridge, thereby forming a grafted tripolyphosphate (TPPg) which is opened by the alcoholate of the STMP to form a grafted tripolyphosphate To produce a phosphate diester (Pc), or to react with NaOH to produce grafted monophosphate (Pg) as the main product and inorganic pyrophosphate (PPi) as a by-product.

Next, the basic compound which is one component of the release liquid composition of the present invention will be described. The basic compound serves to enhance the peeling force by weakening the hydrogen bonding between the phenol components of the modified photoresist resin. The basic compound having such a role may be an organic base or an inorganic base, and an organic base and an inorganic base may be mixed and used.

The organic basic compound is selected from the group consisting of monomethylamine, dimethylamine, triethylamine, diisopropylethylamine, monoethanolamine, monoisopropanol, diethanolamine, triethanolamine, 2- (2-aminoethoxy) (2-hydroxyethyl) piperazine, 1- (2-aminoethyl) piperazine, 1- (2- Methylpiperazine, 1-amino-4-methylpiperazine, 1-benzylpiperazine, 1-phenyl (2-methylpiperazin-1-yl) One selected from the group consisting of piperazine, tetramethylguanidine, 1,8-diazabicycloundec-7-ene, and 1,5-diazabicyclo (4,3,0) May be a single compound or a mixture of two or more compounds, but is not limited thereto.

Inorganic basic compounds are ammonium hydroxide, sodium hydroxide, potassium hydroxide, phosphoric acid, ammonium ((NH _{4) 2} HPO _4), ammonium dihydrogen phosphate ((NH ₄₎ H ₂ PO _4), tricalcium phosphate, ammonium ((NH _{4) 3} PO ₄ ), sodium dihydrogen phosphate (Na ₂ HPO ₄ ), sodium dihydrogen phosphate (NaH ₂ PO ₄ ), trisodium phosphate (Na ₃ PO ₄ ), potassium dihydrogen phosphate (K ₂ HPO ₄ ) Potassium hydroxide (KH ₂ PO ₄ ), and tripotassium phosphate (K ₃ PO ₄ ), or a mixture of two or more of them. However, the present invention is not limited thereto.

The content of the basic compound in the peeling liquid composition may be 1 to 30 parts by weight, preferably 1 to 15 parts by weight, based on the total peeling liquid composition. When the organic basic compound and the inorganic basic compound are mixed, it is preferable that the organic base in the peeling liquid is 5 to 20 parts by weight and the inorganic base is 1 to 5 parts by weight. If the weight of the basic compound is less than 1 part by weight, the bond existing between the PAC resin may not be sufficiently broken, and the peeling effect may be deteriorated. If the amount exceeds 30 parts by weight, the metal wiring may be corroded.

The release liquid composition according to an embodiment of the present invention includes water. Water contained in the release liquid composition is for dissolving the compound 1 and a water-soluble compound such as a basic compound, and may be distilled water, deionized water, ultrapure water, or the like, and is preferably ultra pure water.

Such water may be 10 to 80 parts by weight, preferably 30 to 70 parts by weight, based on the release liquid composition. If the content of the water is less than 10 parts by weight, the concentration of the base component may be increased, thereby increasing the corrosiveness of the metal wiring, and the amount of the toxic organic solvent may be increased. In addition, if the content of water in the peeling liquid exceeds 80 parts by weight, the concentration of the base component may be lowered, and the photoresist peeling performance may be deteriorated.

In addition, the peeling liquid composition according to the embodiment of the present invention may further include a polar solvent. These polar solvents increase solubility in oily materials such as PAC (photoactive compound) and Novolak Resin. The polar solvent may be 1 to 60 parts by weight, preferably 20 to 40 parts by weight, based on the total exfoliant composition. If the content of the polar solvent is less than 1 part by weight, the solubility of the photosensitive agent and the novolac resin may be lowered and the peeling effect may be lowered. If the amount exceeds 60 parts by weight, the harmfulness to the environment and human body may be increased, .

Such a polar solvent may be selected from the group consisting of formamide, N-methylformamide, N, N-dimethylformamide, acetamide, N-methylacetamide, N, N-dimethylacetamide, Diethylene glycol monoethyl ether, ethylene glycol monoisopropyl ether, ethylene glycol monoethyl ether, ethylene glycol monomethyl ether, ethylene glycol monomethyl ether, ethylene glycol monomethyl ether, ethylene glycol monomethyl ether, Ethylene glycol monomethyl ether, ethylene glycol monobutyl ether, triethylene glycol monoethyl ether, triethylene glycol monoisopropyl ether, triethylene glycol monobutyl ether, polyethylene glycol monomethyl ether, polyethylene glycol monoisopropyl ether, polyethylene glycol monobutyl ether, propylene glycol mono Methyl ether, propylene glycol monoisopropyl ether, propylene glycol monobutyl ether, and propylene glycol Be a call monomethyl ether alone or a compound or mixture of two or more selected from the group consisting of acetate, and the like, but is not limited to.

In addition, the photoresist stripper solution composition according to an embodiment of the present invention may further comprise a surfactant, preferably a cationic surfactant component. Surfactant refers to components that change the inherent properties of the interface and lower the tensile force and play a role of emulsifying or cleaning depending on the application. By increasing the penetration power between the interfaces, uniform cleaning can be performed, It increases the power. Therefore, anionic surfactants, cationic surfactants, nonionic surfactants, and amphoteric surfactants can be applied as surfactants, but cationic surfactants are preferred.

The content of the surfactant in the release liquid composition may be 0.01 to 30 parts by weight, preferably 5 to 30 parts by weight, based on the whole composition. If the content of the surfactant is less than 0.01 part by weight, the peeling may not be uniform. If the amount is more than 30 parts by weight, bubbles may be generated severely, and the toxicity to the environment and the human body may be increased.

The cationic surfactant may be a single compound or a mixture of two or more selected from the group consisting of tetramethylammonium hydroxide, tetraethylammonium hydroxide, tetrapropylammonium hydroxide and tetrabutylammonium hydroxide, but is not limited thereto.

In addition, the photoresist stripper composition according to an embodiment of the present invention may further include a corrosion inhibitor. The corrosion inhibitor is a chemical substance which suppresses corrosion by adding a small amount when the corrosion resistance is insufficient only by the metal itself. It is preferable that the corrosion inhibitor is adsorbed on the metal surface to prevent the penetration of the corrosive substance. More preferred are azole-based corrosion inhibitors which can facilitate chemical adsorption on the surface.

The content of such a corrosion inhibitor is preferably 0.01 to 10 parts by weight relative to the total composition of the peeling liquid. When the content of the corrosion inhibitor is less than 0.01 part by weight, corrosion resistance may be deteriorated. When the amount of the corrosion inhibitor exceeds 10 parts by weight, not only bubbles are generated but also peeling force may be lowered. .

The corrosion inhibitor may be selected from the group consisting of 1,2,3-triazole, 1,2,4-triazole, 3-amino-1,2,4-triazole, But are not limited to, benzotriazole, 1-hydroxybenzotriazole, 1-methylbenzotriazole, 2-methylbenzotriazole, 5-methylbenzotriazole, tolyltriazole, benzotriazole- Sol, 2- (2H-benzotriazol-2-yl) -4,5-di-t-butylphenol, imidazole, 2- mercaptobenzimidazole, 2,5-dimercapto-1,3,4 Thiadiazole, 2-mercaptobenzothiazole, and 2-thiouracil, or a mixture of two or more thereof, but the present invention is not limited thereto.

As described above, the use of the photoresist stripper composition according to the present invention minimizes the detachment efficiency and the damage of the metal wiring while harmless to the human body and the environment, thereby peeling the photoresist.

Hereinafter, embodiments of the photoresist stripper composition according to an embodiment of the present invention will be described. The following examples are merely illustrative of the present invention, and the scope of the present invention is not limited to these examples.

< Example  1 > Preparation of peeling liquid composition and evaluation of peeling performance

(1) Preparation of specimen

A positive type photoresist was coated on a glass substrate patterned with Al metal wiring with a thickness of 60 nm with a spin coater so as to have a thickness of 1 mu m and then baked at about 150 DEG C for about 10 minutes to form a modified resist thin film .

(2) Preparation of phosphorylated-cyclodextrin

200 g (0.17 mol) of? -Cyclodextrin was slowly added to and dissolved in 24.7 g (0.617 mol) of sodium hydroxide and 400 g of ultrapure water, followed by stirring at room temperature for 3 hours and 30 minutes. After the temperature of the reaction was raised to 50 캜, 189 g (0.617 mol) of sodium trimetaphosphate was slowly added thereto, followed by stirring at 50 캜 for 1 hour and 30 minutes. After the reaction was cooled to room temperature, 2 L of acetone was added to crystallize. The crystallized product was filtered to obtain 370 g of? -CD-P3 in the form of phosphorylated cyclodextrin. Phosphorylated-cyclodextrin derivatives can be prepared in various forms depending on the ratio of equivalents of cyclodextrins (? -CD,? -CD, r-CD), STMP and base, which become the parent nucleus. IR data for the produced? -CD-P3 are shown in FIG.

(3) Preparation of peeling liquid

The phosphorylated-cyclodextrins prepared as described above, the organic bases, and the respective subcomponents were dissolved in ultrapure water according to the content ratios (% by weight) shown in the following Table 1, and the solutions were uniformly mixed so as to be uniform.

(4) Peeling performance evaluation

The stripping solution prepared according to (3) above was heated to 50 캜. The specimen prepared in accordance with the above (1) was immersed in the exfoliation solution for 1 minute, followed by washing with ultrapure water and drying with nitrogen. The dried specimens were evaluated for peelability by observing the residual degree of photoresist residue with a naked eye and a microscope, and the results are shown in Table 1 according to the peelability measurement standard.

[Measurement criteria for peelability]

◎: Photoresist residue is completely removed

○: Remaining photoresist residue remains

?: More than 1/2 of the photoresist residue remained

X: Photoresist residue not removed

(5) Evaluation of corrosion resistance

The exfoliating liquid prepared in accordance with the above (3) was heated to 50 캜, and the specimen completely peeled off in the above (4) was immersed in the exfoliating liquid for 10 minutes, followed by washing with ultrapure water and drying with nitrogen. The dried specimens were evaluated for corrosion by measuring surface changes and thickness changes of the metal thin films using a microscope and SEM equipment. The results are shown in Table 1 according to the metal corrosivity measurement standard.

[Criteria for measurement of corrosion resistance in metal]

◎: No change in thickness and surface of metal thin film

○: The metal thin film was partially dissolved

?: The metal thin film was dissolved in 1/2 or more

X: The metal thin film is completely dissolved

< Example  2 to 14, Comparative Example  1 to 6> Preparation of peeling liquid composition and evaluation of peeling performance

The peeling performance of the photoresist stripper composition was evaluated in the same manner as in Example 1, except that a stripper was prepared and used according to the composition ratios shown in Table 1 below.

The peeling performance and the corrosion resistance according to Examples 1 to 14 and Comparative Examples 1 to 6 were evaluated and the results are shown in Table 1 below.

[Table 1]

MEA: monoethanolamine, DMPA: N, N-dimethylpropionamide

THFA: tetrahydrofurfuryl alcohol, BTZ: benzotriazole

p-CD: (2-hydroxypropyl) -beta-cyclodextrin

alpha -CD-P6: Alpha-cyclodextrin 6 phosphorylated sodium salt

β-CD-P1: Beta-cyclodextrin monophosphate sodium salt

β-CD-P3: Beta-cyclodextrin 3 phosphorylated sodium salt

β-CD-P7: Beta-cyclodextrin 7 is a phosphate sodium salt

r-CD-P8: Gamma-cyclodextrin 8 is a sodium phosphate salt

The results are shown in Table 1. As shown in Table 1, in Comparative Examples 1 to 3, only basic compounds other than water, ie, monoethanolamine (MEA) were contained (Comparative Example 1), and monoethanolamine (MEA) as a basic compound and cyclodextrin (p-CD) alone (Comparative Example 2), the photoresist residue peeling performance is low, and the basic compound monoethanolamine (MEA) and the cyclodextrin (p-CD) When the inorganic basic compound is mixed in a small amount (Comparative Example 3), the peeling performance is improved, but metal corrosion is partially observed.

On the other hand, when comparing Comparative Example 2 with Examples 2 to 6 of the present invention, it was confirmed that the use of phosphorylated-cyclodextrin as one component of the peeling liquid composition improved the peeling performance even at a low concentration, Comparing Examples 2 to 6 of the present invention shows that the same peelability is exhibited in the state that the inorganic basic compound is not added, and thus the corrosion resistance of the metal is improved.

This effect can be interpreted as a result of the suppression of metal corrosion due to the high surfactant activity and the pH buffering effect of the phosphate group introduced into the cyclodextrin skeleton.

Comparing Examples 1 to 6, the phosphate groups that can be substituted (? -CD: 6,? -CD: 7, r-CD: 8) according to the skeleton of cyclodextrin are each 1 to n, It is possible to exhibit the peeling performance improving effect even when it is substituted, and it is possible to obtain the optimum peeling efficiency preferably in the case of three or more substituted forms.

Comparing Example 2 and Example 7, it can be seen that the peeling time is shortened when a polar solvent (DMPA, THFA, etc.) is partially added.

On the other hand, when Example 8 and Example 9 were compared, it was found that when the peeling temperature was lowered from 50 캜 to 45 캜, the peeling of the photoresist was not completely performed and the monoethanolamine was increased up to 20% It can be seen that a part of the resist residue remains even if the ratio of the polar solvent is increased.

On the other hand, if 5 wt% of an inorganic base such as sodium hydroxide is added as in Example 15, peeling occurs even at a low temperature, but corrosion of the metal surface occurs partially even though the corrosion inhibitor is used.

In order to improve this, it can be seen that when the amount of the inorganic base is minimized by adding a polar solvent partially as in the case of Example 16, the peeling performance and the corrosion resistance are both excellent at 45 ° C. and 50 sec.

As shown in Table 1, when the phosphorylated-cyclodextrin is used as one component of the peeling liquid, it is possible to improve the peeling performance of the photoresist and the corrosion resistance against the metal wiring, and manufacture the aqueous stripping solution containing water as the main component , The use of organic compounds and corrosion inhibitors which are harmful to the environment and human body can be minimized.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. Therefore, the embodiments disclosed in the present invention are intended to illustrate rather than limit the scope of the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. The scope of protection of the present invention should be construed according to the claims below, and all technical ideas within the scope of equivalents or equivalents thereof should be construed as being included in the scope of the present invention.

Claims (11)

A photoresist stripper composition comprising a compound represented by the following general formula (1) and a basic compound:
&Lt; Formula 1 >

In Formula 1, n is an integer of 6 to 8,
R ² and R ³ are independently selected from the group consisting of hydrogen, a substituted or unsubstituted alkyl group, a sulfonic acid group, an acyl group, a substituted or unsubstituted benzyl group, and a substituted or unsubstituted benzoyl group,
R ¹ is represented by the following formula (2)
(2)

In Formula 2,
m is an integer from 0 to 2, X, Y, and Z are independently from each other -OH or -OM, wherein M is Li, Na, or K,
When m is 2, each Z may be the same or different from each other. The method according to claim 1,
Wherein the alkyl group is further substituted with at least one substituent selected from the group consisting of a hydroxyl group, an alkoxy group, a sulfonic acid group, a phosphoric acid group, and an amino group substituted or unsubstituted with an alkyl group. The method according to claim 1,
A photoresist stripper liquid composition further comprising a polar solvent. The method according to claim 1,
A surfactant, and a corrosion inhibitor. The method according to claim 1,
Wherein the basic compound is an organic basic compound or a mixture of an organic basic compound and an inorganic basic compound. The method of claim 3,
The polar solvent may be selected from the group consisting of formamide, N-methylformamide, N, N-dimethylformamide, acetamide, N-methylacetamide, N, N-dimethylacetamide, Diethylene glycol monoethyl ether, ethylene glycol monoisopropyl ether, ethylene glycol monoethyl ether, ethylene glycol monomethyl ether, ethylene glycol monomethyl ether, ethylene glycol monomethyl ether, ethylene glycol monomethyl ether, Ethylene glycol monomethyl ether, ethylene glycol monobutyl ether, triethylene glycol monoethyl ether, triethylene glycol monoisopropyl ether, triethylene glycol monobutyl ether, polyethylene glycol monomethyl ether, polyethylene glycol monoisopropyl ether, polyethylene glycol monobutyl ether, propylene glycol mono Methyl ether, propylene glycol monoisopropyl ether, propylene glycol monobutyl ether, and propylene glycol Monomethyl ether, and select at least one from the group consisting of acetate,
The basic compound may be selected from the group consisting of monomethylamine, dimethylamine, triethylamine, diisopropylethylamine, monoethanolamine, monoisopropanol, diethanolamine, triethanolamine, 2- (2-aminoethoxy) (2-hydroxyethyl) piperazine, 1- (2-aminoethyl) piperazine, 1- (2- Methylpiperazine, 1-amino-4-methylpiperazine, 1-benzylpiperazine, 1-phenyl (2-methylpiperazin-1-yl) One in the group of organic basic compounds consisting of piperazine, tetramethylguanidine, 1,8-diazabicycloundec-7-ene and 1,5-diazabicyclo (4,3,0) Or more; Ammonium hydroxide, ammonium hydroxide, sodium hydroxide, potassium hydrogen phosphate _{((NH 4) 2 HPO 4} ), ammonium dihydrogen phosphate, ammonium _{((NH 4) H 2 PO} 4), tricalcium phosphate _{((NH 4) 3 PO 4} ) (Na ₂ HPO ₄ ), sodium dihydrogen phosphate (NaH ₂ PO ₄ ), trisodium phosphate (Na ₃ PO ₄ ), potassium dihydrogen phosphate (K ₂ HPO ₄ ), potassium dihydrogen phosphate ₂ PO ₄ ), and tripotassium phosphate (K ₃ PO ₄ ), or one or more selected from the group of inorganic basic compounds; Wherein the mixture is a mixture of at least one selected from the organic basic compound group and at least one selected from the inorganic basic compound group. 5. The method of claim 4,
The surfactant is at least one selected from the group consisting of tetramethylammonium hydroxide salt, tetraethylammonium hydroxide salt, tetrapropylammonium hydroxide salt, and tetrabutylammonium hydroxide salt,
The corrosion inhibitor may be selected from the group consisting of 1,2,3-triazole, 1,2,4-triazole, 3-amino-1,2,4-triazole, But are not limited to, benzotriazole, 1-hydroxybenzotriazole, 1-methylbenzotriazole, 2-methylbenzotriazole, 5-methylbenzotriazole, tolyltriazole, benzotriazole- Sol, 2- (2H-benzotriazol-2-yl) -4,5-di-t-butylphenol, imidazole, 2- mercaptobenzimidazole, 2,5-dimercapto-1,3,4 -Thiadiazole, 2-mercaptobenzothiazole, and 2-thiouracil. 2. A photoresist stripper composition according to claim 1, The method according to claim 1,
Wherein the amount of the compound represented by Formula 1 is 1 to 50 parts by weight and the amount of the basic compound is 1 to 30 parts by weight based on 100 parts by weight of the total composition. The method of claim 3,
Wherein the polar solvent is 1 to 60 parts by weight based on 100 parts by weight of the total composition. 5. The method of claim 4,
Wherein the surfactant is 0.01 to 30 parts by weight based on 100 parts by weight of the total composition, and the corrosion inhibitor is 0.01 to 10 parts by weight. A photoresist stripping liquid composition for removing photoresist comprising a phosphorylated-cyclodextrin derivative.

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