KR20180119535A - A LED Displaying Apparatus Having a Structure of Controlling Each LED Module Independently - Google Patents

Abstract

The present invention relates to an LED display apparatus of an individual control method and, more specifically, to an LED display apparatus of an individual control method for improving a display effect of various patterns by individually controlling operation of a plurality of regularly arranged LED elements. The LED display apparatus for displaying information by controlling emission of a plurality of LED element chips (E_11-E_NM) comprises: a base frame (10) having a plurality of base members (12_1-12_L) arranged in parallel with each other; placement frames (20) coupled to an upper side of the base frame (10) and having placement members (22_1-22_L) coupled to upper sides of each base member (12_1-12_L); and a plurality of LED element chips (E_11-E_NM) separately arranged at predetermined intervals in the placement frames (20). Each of the LED element chips (E_11-E_NM) includes at least one LED element and a driving IC for controlling operation of at least one LED element.

Description

[0001] The present invention relates to an LED display device,

The present invention relates to an LED display device of an individual control type and more specifically to an LED display device of a separate control type for improving the display effect of various patterns by individually controlling the operation of a plurality of regularly arranged LED elements .

BACKGROUND ART Display boards having a function of displaying information by regularly arranging elements such as a light emitting diode (LED), a liquid crystal or a light bulb and regulating light emission are known in this field. The electronic board may include an LED module and a controller. When data to be displayed through the controller is inputted, the controller controls the operation of each pixel of the LED module so that the information is displayed. The application range of the electric signboard or display device using the LED module is gradually increasing due to the advantage of the other display device of the LED device.

Patent Registration No. 10-1310741 discloses an LED electronic display including an LED module composed of a plurality of LEDs arranged in a matrix form and a plurality of drive pins connected to a plurality of nodes connected in series with a predetermined number of LEDs in a one- do. Further, Patent Registration No. 10-1041743 includes a first controller for outputting a main pixel control signal; And a second controller for outputting a subpixel control signal for controlling the subpixel of the LED pixel panel.

The prior art or known LED electric signboard has a structure in which a driving chip controls the operation of a plurality of LED elements and a plurality of LED elements are arranged in a frame having a predetermined shape, Is complicated. Also, since a plurality of LED elements are operated in association with each other, it is difficult to display a precise pattern or the pattern control becomes complicated.

Therefore, although the operation of each of the LED elements is performed independently, a simple electronic display board having a simple structure as a whole needs to be developed, but the prior art does not disclose a display board or a display board having such a structure.

The present invention has the following problems in order to solve the problems of the prior art.

Prior Art 1: Patent Registration No. 10-1310741 (Kookmin University Industry & University Collaboration Foundation, announcement on September 25, 2013) Driving chip incorporated in LED display board and LED display board Prior Art 2: Patent Registration No. 10-1041743 (Adtronic, Ltd., June 16, 2011) An LED display panel having a main pixel and a sub pixel independently controlled

It is an object of the present invention to provide an LED display device of a discrete control type which is formed in a simple structure while each operation is independently controlled so that information can be displayed with improved precision and visibility while manufacturing and maintenance costs are reduced.

According to a preferred embodiment of the present invention, there is provided an LED display device for displaying information by controlling light emission of a plurality of LED element chips, comprising: a base frame having a plurality of base members arranged in parallel to each other; A placement frame coupled to the top of the base frame and having a placement member coupled to the top of each base member; And a plurality of LED element chips disposed separately at predetermined intervals in each of the plurality of layout elements, wherein each of the plurality of LED element chips includes at least one LED element and a driving IC for controlling the operation of the at least one LED element .

According to another preferred embodiment of the present invention, the arrangement frame further includes a conduction pattern forming unit for electrically connecting ends of the adjacent arrangement members.

According to another preferred embodiment of the present invention, each drive IC includes a Signal Shaping Amplification Circuit, a Constant Current Circuit, and an RC oscillator.

According to another preferred embodiment of the present invention, each of the arrangement members includes: a wiring pattern layer having a conductive wiring pattern electrically connecting adjacent LED element chips; And a protective layer for protecting the wiring pattern layer.

The LED display device according to the present invention allows each LED element or chip forming the LED module to be individually controlled so that the LED module can be manufactured independently of the controller module that controls the operation of the LED element or chip. By allowing the operation of each LED element or chip to be independently produced, various patterns of patterns can be precisely expressed, and at the same time the visibility can be improved. Also, the LED module can be manufactured independently of the controller, so that the LED module can be designed or manufactured in various forms and connected to various types of controllers according to the installation position. Further, the LED display device according to the present invention can be installed in various environments such as indoor or outdoor due to the simple LED module structure and improved durability. Further, the display device according to the present invention has an advantage that it is simple to install and maintain.

FIG. 1 shows an embodiment of an exploded structure of an LED module applied to an individual control type LED display device according to the present invention.
2 shows an embodiment of an LED display device according to the present invention.
FIG. 3 shows an embodiment of a layer structure of an LED module applied to an LED display device according to the present invention.
4 shows an embodiment in which the display device according to the present invention is applied.
5 shows an embodiment of an LED chip applied to a display device according to the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the embodiments shown in the accompanying drawings, but the present invention is not limited thereto. In the following description, components having the same reference numerals in different drawings have similar functions, so that they will not be described repeatedly unless necessary for an understanding of the invention, and the known components will be briefly described or omitted. However, It should not be understood as being excluded from the embodiment of Fig.

FIG. 1 shows an embodiment of an exploded structure of an LED module applied to an individual control type LED display device according to the present invention.

Referring to FIG. 1, an LED display device of an individual control type includes a plurality of base members 12_1 to 12_L arranged to be parallel to each other to display information by controlling light emission of a plurality of LED element chips E_11 to E_NM A base frame 10; A placement frame 20 coupled to the upper side of the base frame 10 and having placement members 22_1 to 22_L coupled to the upper side of the respective base members 12_1 to 12_L; And a plurality of LED element chips (E_11 to E_NM) arranged separately at predetermined intervals in the respective arrangement frames (20), wherein each of the plurality of LED element chips (E_11 to E_NM) includes at least one LED element And a driving IC for controlling the operation of the at least one LED element.

The display device operates on each of the LED element chips E_11 to E_NM arranged in the LED module and the LED module composed of the frame in which the plurality of LED element chips E_11 to E_NM and the plurality of LED element chips E_11 to E_NM are arranged. A main controller (not shown) for transmitting signals, and power supply means. In this specification, the display device means an LED module, or may include a main controller or connection means for operation of the LED module. Therefore, the present invention is not limited by the inclusion of the main controller, the power supply means or the connecting means.

The base frame 10 may be made of metal, synthetic resin or similar material, and may have a circular or polygonal planar structure as a whole. The base frame 10 includes a pair of frame members 11a and 11b, which are arranged to face each other and extend linearly; A plurality of base members 12_1 to 12_L that are connected to both ends of the frame members 11a and 11b and are arranged in parallel with each other; And at least one balance member 13_1 to 13_K for preventing deformation of the plurality of base members 12_1 to 12_L.

The base frame 10 may have the function of coupling the LED module to a window, a wall of a building or the like, for example, while forming the overall structure of the LED module. The base frame 10 may be formed into a suitable shape according to the information or image to be displayed on the LED module, and may be formed, for example, in a rectangular planar structure.

The pair of frame members 11a and 11b may be arranged to extend in a linearly and parallel manner so that the base frame 10 is installed on the structure while a plurality of base members 12_1 to 12_L are formed. A plurality of fastening holes may be formed along the longitudinal direction of a pair of linearly extending frame members 11a and 11b. The plurality of base members 12_1 to 12_L may be arranged in parallel to each other with a linear structure extending in a direction perpendicular to the extending direction of the frame members 11a and 11b. One end of each of the base members 12_1 to 12_L may be connected to one frame member 11a and the other end may be connected to the other frame member 11b. The plurality of base members 12_1 to 12_L may be arranged to be parallel to each other and to have the same spacing. At least one of the balance members 13_1 to 13_K may be disposed in a direction perpendicular to the base members 12_1 to 12_L. The balance members 13_1 to 13_K can be extended in a direction parallel to the frame members 11a and 11b while being disposed between the frame members 11a and 11b.

The LED element chips E_11 to E_NM may be arranged at the upper portions of the respective base members 12_1 to 12_L and the LED element chips E_11 to E_NM may be arranged at equal intervals. The balance members 13_1 to 13_K may have a function of preventing deformation of the base frame 10 or the base members 12_1 to 12_L. The balance members 13_1 to 13_K can be arranged in an appropriate number and can be arranged at equal intervals when a plurality of balance members 13_1 to 13_K are arranged.

The fastening tabs 14a, 14b, 14c, and 14d may be formed at four corner portions when the base frame 10 is formed into a rectangular structure as a whole, but it is not necessarily required. Also, the frame members 11a and 11b, the base members 12_1 to 12_L and the balance members 13_1 to 13_K may be integrally formed or may be formed by combining independent members. For example, the frame members 11a and 11b, the base members 12_1 to 12_L, and the balance members 13_1 to 13_K may be integrally formed using a metal mold. And can be engaged with the placement frame 20 by fastening tabs 14a, 14b, 14c, 14d.

The layout frame 20 is arranged or formed above the base frame 10 so that each of the LED element chips E_11 to E_NM is fixed at a predetermined position. In addition, the placement frame 20 may have a function of protecting the placement frame 20 against the external environment while electrically connecting the different LED element chips E_11 to E_NM.

The placement frame 20 may be formed to cover the upper side of the base frame 10 and may have a shape corresponding to the base frame 10. For example, the placement frame 20 may include the base members 12_1 to 12_L, the placement members 22_1 to 22_L disposed above the balance members 13_1 to 13_K, and the stabilization members 23_1 to 23_K. Conductive pattern forming units 21a to 21s may be disposed above the frame members 11a and 11b. Each of the conductive pattern forming units 21a to 21s may be formed so as to connect the ends of the adjacent arrangement members 22_1 to 22_L. Specifically, the conductive pattern forming units 21a to 21s disposed above the respective base members 11a and 11b have a structure in which the end portions of two adjacent arranging members 22_1 to 22_L are connected in the form of stepping legs . Due to the arrangement structure of the conductive pattern forming units 21a to 21s, the conductive pattern forming units 21a to 21s disposed above the respective base members 11a and 11b are arranged separately from each other. The conductive pattern forming units 21a to 21s disposed above the base members 11a and 11b facing each other can face each other in a staggered form. Specifically, the one conductive pattern forming unit 21a connects the end portions of the adjacent one or two arrangement members 22_1 to 22_2, and the two conductive pattern formation units 21b connects the three or four arrangement members 22_3 to 22_4. Are connected to each other. As described above, the conductive pattern forming units 21a to 21s are disposed above the frame members 11a and 11b in a separated structure, and adjacent conductive pattern forming units 21a to 21s are formed of a suitable linear insulating coating material or insulating material Lt; / RTI >

The electrical connectors 25a and 25b can be disposed at one end of the arrangement members 22_1 to 22_L disposed at both ends and the fixing tabs 24a to 24d coupled to the upper ends of the locking tabs 14a, 14b, 14c, 24c, and 24d may be disposed at corresponding positions. The fixing tabs 24a, 24b, 24c, and 24d may have a function of coupling the base frame 10 and the placement frame 20 to each other.

The placement frame 20 may be formed to coat the upper side of the base frame 10, or may be made of one independent frame. For example, an insulating layer may be formed on the upper side of the base frame 10, and each LED element chip E_11 to E_NM belonging to the LED chip element group EG may be disposed above the insulating layer. Thereafter, a wiring pattern for connecting the different LED element chips E_11 to E_NM to each other is formed, and the conductive pattern forming units 21a to 21s for electrically connecting the ends of the wiring pattern to each other can be disposed. Then, a protecting layer for protecting the arrangement frame 10 and the LED element chips E_11 to E_NM may be formed in a coating manner. In this way, the placement frame 20 can be formed.

Alternatively, the placement frame 20 may be formed by a mold or the like, and a wiring pattern may be formed inside the placement frame 20 in a state where the peripheral portion thereof is insulated. The layout grooves for arranging the LED element chips E_11 to E_NM may be formed in the layout frame 20 and the layout grooves may be formed such that the wiring patterns and the LED element chips E_11 to E_NM are electrically connected to each other have. The fastening tabs 24a, 24b, 24c and 24d are fastened to the fastening tabs 14a, 14b, 14c and 14d so that the fastening tabs 20 can be fastened to the base frame 10 by suitable fastening means.

The placement frame 20 can be formed in various structures, and is not limited to the illustrated embodiment.

* Each of the LED element chips E_11 to E_NM may be arranged in the base frame 10 or the arrangement frame 20 at a uniform interval, and may be arranged in a matrix form. A wiring pattern for electrically connecting the LED element chips E_11 to E_NM disposed adjacent to each of the arrangement members 22_1 to 22_L may be formed. The adjacent arrangement members 22_1 to 22_L may be electrically connected to each other by the conductive pattern forming units 21a to 21s. The arrangement members 22_1 to 22_L arranged in parallel to each other can be arranged in series or in parallel. The plurality of LED element chips E_11 to E_NM may be connected to each other in series by arranging the conductive pattern forming units 21a to 21s disposed in opposing frame members 11a and 11b to be mutually staggered. Depending on the design structure of the LED module, the plurality of LED element chips E_11 to E_NM may be connected to each other in various ways and are not limited to the illustrated embodiments.

According to one embodiment of the present invention, each LED element chip disposed in the LED module is individually controlled in operation, and each of the LED element chips E_11 to E_NM for operation of each LED element chip E_11 to E_NM A driving IC (Driving Integrated Chip) may be disposed in the E_NM. And the driving ICs disposed in the respective LED element chips E_11 to E_NM may include elements such as a processing processor, a signal forming circuit, a current control circuit or an oscillator, but are not limited thereto. The driving ICs may be formed in a chip shape, and the operation of each of the LED element chips E_11 to E_NM may be controlled by a main controller provided separately from the LED module. The main controller can be connected to the electrical connectors 25a and 25b and a control signal for the operation of each of the LED element chips E_11 to E_NM can be transmitted through the electrical connectors 25a and 25b. In this manner, the driving ICs are disposed in the respective LED element chips E_11 to E_NM, and the main controller is independently installed and connected so that the respective LED element chips E_11 to E_NM are independently operated. The degree of freedom can be improved. Specifically, the LED module and the main controller can be independently designed, thereby enabling the design of the LED module having various structures.

2 shows an embodiment of an LED display device according to the present invention.

Fig. 2 shows an embodiment in which the display device 30 is completed by coupling each LED element chip E_11 to E_NM and an arrangement frame to a base frame.

The display device (30) is arranged to face each other and includes fixing members (31a, 31b) including a frame member; Pattern members 32_1 to 32_L in which the LED element chips E_11 to E_NM are arranged while connecting the fixing members 31a and 31b to each other; And at least one structural member 33 structurally stabilizing while preventing deformation of the plurality of pattern members 32_1 to 32_L arranged in parallel with each other. Electrical connectors may be disposed at both ends of one fixing member 31b to transmit power and signals to the LED element chips E_11 to E_NM.

As described above, each LED element chip E can be independently operated, and brightness, color, output or waveform can be individually adjusted. The LED element chip E can be made in the form of an element package EM and includes a package housing 351; A driving IC (ICD) disposed inside the element package (EM); At least one light emitting diode (R, G, B) connected to the driving IC (ICD) and controlled in operation; And a working wire 352. [

According to one embodiment of the present invention, the driving IC may comprise a Signal Shaping Amplification Circuit, a Constant Current Circuit and an RC oscillator. The signal forming circuit may include a differential circuit, an integrating circuit, or a pulse signal forming circuit. The driving IC (ICD) may include various elements or circuits for controlling the operation of each LED element chip E. [ The operation safety elements RE1 and RE2 may be disposed at the input or output ends of the LED element chips E_11 to E_NM and the operation safety elements RE1 and RE2 may be provided for removing signal noise, Function.

Each of the LED element chips E, E_11 to E_NM forming the display device 30 may include various elements or circuits for controlling light emission, and is not limited to the illustrated embodiment.

FIG. 3 shows an embodiment of a layer structure of an LED module applied to an LED display device according to the present invention.

3, the LED element chips E1, E2 and E3 may be arranged at uniform intervals in the pattern members 32 having linear strips, and the pattern member 32 may be composed of a plurality of layers . Specifically, the pattern member 32 includes a base member 12; An insulating layer 321 disposed above the base member 12; A wiring pattern layer 322 formed above the insulating layer 321; And a protective layer 323 formed above the wiring pattern layer 322 and protecting the pattern member 32. [

As described above, when the base member 12 is made of an insulating material such as synthetic resin, the insulating layer 321 may not be formed. The wiring pattern layer 322 can be made by various methods of forming a wiring pattern, but not limited to, a method of printing a conductive paint. The wiring pattern layer 322 can be formed in a linear pattern connecting different LED element chips E, but is not limited thereto. The protective layer 323 can also be made by coating a paint containing an elastomer having waterproofness, weatherability and corrosion resistance. The input terminal, the output terminal, the ground terminal and the supply terminal are connected to the wiring pattern layer 322 on the bottom surface of the LED device chip E and the input pad P1, the output pad P2, the ground pad P3 And a supply pad P4 may be disposed. The wiring pattern layer 322 may include at least two circuit patterns 322a and 322b and each of the pads P1, P2, P3 and P4 may be formed by arranging the circuit patterns 322a and 322b on the LED chip E, And can be electrically connected to the internal connection pin of the connector. Then, the circuit patterns 322a and 322b can transmit power or control signals to the LED element chips E, respectively.

When the LED element chips E1, E2 and E3 are arranged and operated on the pattern member 32, a heat radiation structure is required because heat is generated in the operation process. For the formation of the heat dissipation structure, each of the pads P1 to P4 may be formed to have a thickness surface. Each of the pads P1 to P4 is made of a conductive material and can be bonded to the bottom surface of the pattern member 32 or the LED element chips E1, E2 and E3 by soldering or soldering. Or a conductive portion connected to the circuit patterns 322a and 322b may be formed on each of the pads P1 to P4. Each of the pads P1 to P4 may be formed to have a uniform thickness so that a flow space is formed between the plane of the pattern member 32 and the bottom surface of the LED element chips E1, E2, E3 .

A buffer groove 36 may be formed on the bottom surface of the LED element chips E1, E2 and E2. The bonding pads 341 and 342 may be disposed on the LED chip E1, E2 and E3 and the bonding pads 341 and 342 may be made of an insulating synthetic resin adhesive. The respective LED element chips E1, E2 and E2 can be fixed to the pattern member 32 by the bonding pads 341 and 342 and the bonding pads 341 and 342 arranged to face each other as necessary Fixing pads 353 and 354 may be disposed. The heat generated from the LED element chips E1, E2, and E3 is transmitted downward from the inside by the arrangement structure of the LED element chips E1, E2, and E3 and can be discharged to both sides. As a result of the heat dissipation structure, heat is quickly dissipated, and heat transmission to the pattern member 32 is effectively blocked.

The LED element chips E1, E2 and E3 can be fixed to the pattern member 32 in various ways, and the present invention is not limited to the illustrated embodiments.

FIG. 4 shows an embodiment in which the display device 30 according to the present invention is applied.

4, the display device 30 can be fixed to the inside or the outside of the window W, and the operation of each of the LED device chips is individually controlled so that the information pattern P for image or information transfer Display. The main controller 42 and the display device 30 can be installed at appropriate positions separated from the display device 30 and the main controller 42 and the display device 30 are connected to each other by a transmission cable 41 for transmitting signals or electric power . The main controller 42 may store a signal for operation of each LED element chip and transmit it to the display device 30. The main controller 42 may be operated by a remote control unit 43, for example. The display device 30 and the main controller 42 are independently manufactured and connected to each other so that the manufacturing and construction of the display device 30 can be simplified while simultaneously inputting various display information to the main controller 42 Let's do it. In addition, various designs of the display device 30 can be made, and at the same time, the display device 30 can be installed in various structures.

5 shows an embodiment of an LED chip applied to a display device according to the present invention.

5, each LED element chip E may include three light emitting elements LE1, LE2, and LE3 connected in series, and a driving IC (ICD) may be disposed inside the LED element chip E. [ Can be disposed. The driving IC (ICD) can individually control the operation of each of the light emitting elements LE1, LE2, LE3 by regulating the operation of the operation regulating unit 53. [ The operation control unit 53 may include, for example, a Signal Shaping Amplification Circuit, a Constant Current Circuit, and an RC oscillator as described above. And the LED element chip E may be electrically connected to the adjacent operation unit 51 or the light emitting unit 52. [ The operation unit 51 may be, for example, a power supply unit or a main controller, and may be connected by a suitable supply cable CH. Further, the light emitting unit 52 may be an LED element chip E disposed adjacent to the LED element chip E.

And may be connected to the driving ICs (ICD) in various ways with the respective light emitting elements LE1, LE2, LE3, and is not limited to the illustrated embodiment.

The LED display device according to the present invention allows each LED element or chip forming the LED module to be individually controlled so that the LED module can be manufactured independently of the controller module that controls the operation of the LED element or chip. By allowing the operation of each LED element or chip to be independently produced, various patterns of patterns can be precisely expressed, and at the same time the visibility can be improved. Also, the LED module can be manufactured independently of the controller, so that the LED module can be designed or manufactured in various forms and connected to various types of controllers according to the installation position. Further, the LED display device according to the present invention can be installed in various environments such as indoor or outdoor due to the simple LED module structure and improved durability. Further, the display device according to the present invention has an advantage that it is simple to install and maintain.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those of ordinary skill in the art that various changes and modifications may be made without departing from the spirit and scope of the invention . The invention is not limited by these variations and modifications, but is limited only by the claims appended hereto.

10: base frame 11a, 11b: frame member
12: base member 12_1 to 12_L: base member
13_1 to 13_K: Balance member 14a, 14b, 14c, 14d:
20: Batch frames 21a to 21s: Conductive pattern forming unit
22_1 to 22_L: Arrangement members 23_1 to 23_K:
24a, 24b, 24c, 24d: fixed tabs 25a, 25b: electrical connector
30: Display device 31a, 31b: Fixing member
32: pattern members 32_1 to 32_L: pattern member
33: structural member 36: buffering groove
41: transmission cable 42: main controller
43: remote control unit 51: operation unit
52: light emitting unit 53: operation control unit
321: insulating layer 322: wiring pattern layer
322a, 322b: Circuit pattern 323: Protective layer
341, 342: Adhesive pad 351: Package housing
352: Operation wiring 353, 354: Fixing pad
CH: Supply cable E: LED device chip
E1, E2, E3: LED element chip EG: LED chip element group
EM: Device packages E_11 to E_NM: LED device chips
ICD: driving IC LE1, LE2, LE3: light emitting element
P: information pattern P1: input pad
P2: Output pad P3: Ground pad
P4: Supply pad R, G, B: Light emitting diode
RE1, RE2: Operational safety element W: Window

Claims (2)

An LED display device for displaying information by controlling emission of a plurality of LED element chips (E_11 to E_NM)
A base frame (10) having a plurality of base members (12_1 to 12_L) arranged in parallel with each other;
Are arranged on the upper side of the base frame 10 and are arranged on the upper side of the respective base members 12_1 to 12_L so as to electrically connect the LED element chips E_11 to E_NM arranged adjacent to each other. (20); And
And a plurality of LED element chips (E_11 to E_NM) arranged separately at predetermined intervals in the respective arrangement frames (20)
Each of the plurality of LED element chips E_11 to E_NM is independently controlled by a driving IC having a signal shaping amplification circuit, a constant current circuit and an RC oscillator,
Each of the arrangement members 22_1 to 22_L includes a wiring pattern layer 322 having a conductive wiring pattern for electrically connecting the LED element chips E_11 to E_NM adjacent to each other. And a protection layer (323) for protecting the wiring pattern layer (322). The electronic device according to claim 1, wherein the arrangement frame (20) further comprises conductive pattern forming units (21a to 21s) connected by a linear insulation coating material while electrically connecting ends of the adjacent arrangement members (22_1 to 22_L) Display device.

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