KR20180116188A - Biometric sensor and device comprising the same - Google Patents

Abstract

According to various embodiments of the present invention, a display device comprises: a display panel; a cover glass disposed on the display panel; and a biometric sensor module disposed under the display panel, and including a circuit board, a biometric sensor disposed on the circuit board, and a housing in which an opening is formed. The biometric sensor is received in an opening of the housing, and the biometric sensor module is attached to one surface of the display panel by the housing. In addition, other embodiments are also possible. By preventing a foreign material from introducing between a display and a sensor, and stably maintaining a distance between the display and the sensor, the degradation in the performance of the sensor can be prevented.

Description

TECHNICAL FIELD [0001] The present invention relates to a biosensor and a device including a biosensor,

The present invention relates to a biosensor for sensing biometric information of a user and an apparatus including the biosensor.

In recent years, techniques for performing user authentication using biometric information (e.g., fingerprint, iris, etc.) of a user acquired by a biometric sensor have been developed. In case of a biosensor for fingerprint recognition, it can be classified into an optical ultrasonic wave method and an electrostatic method according to a method of acquiring fingerprint information.

For optical sensors, a constant distance must be maintained between the display and the sensor, and foreign objects (eg dust) must be prevented from entering the display. However, in the process of using the electronic device, the distance between the display and the biosensor may be changed due to external impact or aging, or the sensor performance may be deteriorated due to foreign matter introduced between the display and the sensor.

Various embodiments of the present invention provide a device including a biosensor and a biosensor having a structure for stably maintaining a distance between a display and a sensor and preventing a foreign matter inflow between the display and the sensor.

The sensor device according to various embodiments of the present invention may include a circuit board, a housing disposed on one side of the circuit board and including an opening in which the biosensor is housed.

A display device according to various embodiments of the present invention includes a display panel, a cover glass disposed on the display panel, and a biosensor module disposed under the display panel, wherein the biosensor module includes a circuit board, The living body sensor module may be attached to one surface of the display panel by the housing. The living body sensor module may be attached to one side of the display panel by the housing.

An electronic device according to various embodiments of the present invention includes a display panel, a cover glass disposed on the display panel, a biosensor module disposed below the display panel, and a display unit electrically connected to the display and the biosensor module, A biosensor module comprising: a circuit board; a biosensor disposed on the circuit board; and a housing having an opening formed therein, wherein the biosensor module comprises: A biosensor may be accommodated and attached to one side of the display panel by the housing.

According to various embodiments of the present invention, it is possible to stably maintain the distance between the display and the sensor and to prevent the inflow of foreign matter between the display and the sensor, thereby preventing deterioration of the performance of the sensor.

1 is a block diagram of an electronic device in a network environment in accordance with various embodiments.
2 shows the appearance of an electronic device according to one embodiment.
3 shows an exploded perspective view of an electronic device according to one embodiment.
4A and 4B show a coupling structure of an electronic device according to an embodiment.
5 shows a cross-sectional view of an electronic device according to one embodiment.
6 shows a package structure of a biosensor according to an embodiment.
7A is a cross-sectional view of a biosensor according to an embodiment.
7B is a cross-sectional view of a biosensor according to an embodiment.
8 shows a part of the package structure of the living body sensor according to the embodiment.
9 shows a cross-sectional view of an electronic device according to one embodiment.
10A and 10B illustrate a manufacturing process of a biosensor according to an embodiment.

Various embodiments of the invention will now be described with reference to the accompanying drawings. It should be understood, however, that the invention is not intended to be limited to the particular embodiments, but includes various modifications, equivalents, and / or alternatives of the embodiments of the invention. In connection with the description of the drawings, like reference numerals may be used for similar components.

1 is a block diagram of an electronic device in a network environment in accordance with various embodiments.

1, the network environment 100 includes an electronic device 101 that communicates with the electronic device 102 via a short range wireless communication 198 or via the network 199 to an electronic device 104 or server 108). According to one embodiment, the electronic device 101 is capable of communicating with the electronic device 104 via the server 108. According to one embodiment, the electronic device 101 includes a processor 120, a memory 130, an input device 150 (e.g., a microphone or a mouse), a display device 160, an audio module 170, a sensor module 176 An interface 177, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, and a subscriber identification module 196. In some embodiments, at least one (e.g., display device 160 or camera module 180) of these components may be omitted from the electronic device 101 or other components may be added. In some embodiments, some components, such as, for example, a sensor module 176 (e.g., a fingerprint sensor, an iris sensor, or an ambient light sensor) embedded in a display device 160 Can be integrated.

Processor 120 may control an operating system or at least one other component (e.g., hardware or software component) of electronic device 101 connected to processor 120 by driving an application program , Various data processing and calculation can be performed. Processor 120 loads or processes commands or data received from other components (e.g., sensor module 376 or communication module 190) into volatile memory 132 and processes the resulting data into nonvolatile memory 134. [ Lt; / RTI > The processor 120 may include one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communications processor. According to one embodiment, the processor 120 may operate in conjunction with a main processor 121 (e.g., a central processing unit or an application processor) and, independently, or additionally or alternatively, Or a co-processor 123 (e.g., a graphics processing unit, an image signal processor, a sensor hub processor, or a communications processor) specific to the designated function. In this case, for example, in place of the main processor 121 while the main processor 121 is in an inactive (e.g., sleep) state, or on behalf of the main processor 121 in an active At least one of the components (e.g., display 160, sensor module 176, or communication module 190) of components 130-196 of electronic device 101, along with main processor 121, , ≪ / RTI > According to one embodiment, the coprocessor 123 (e.g., an image signal processor or communications processor) is implemented as a component of some other functionally related component (e.g., camera module 180 or communication module 190) . According to one embodiment, the processor 120 may be implemented as a system on chip (SoC) or a system in package (SiP).

Memory 130 may store various data used by at least one component (e.g., processor 120 or sensor module 176) of electronic device 101, e.g., software component (e.g., program 140) and input data or output data for the associated command. The memory 130 may include a volatile memory 132 or a non-volatile memory 134. Volatile memory 132 may be comprised of, for example, a random access memory (RAM) (e.g., DRAM, SRAM, or SDRAM). Non-volatile memory 134 may include, for example, an OTPROM, a programmable read-only memory (PROM), an erasable programmable read-only memory (EPROM), an electrically erasable programmable read-only memory), mask ROM, flash ROM, flash memory, hard drive, or solid state drive (SSD). The nonvolatile memory may be constituted by an internal memory 136 disposed in the electronic device 101 or a stand-alone external memory 138 connected to the electronic device 101 only when necessary, depending on the connection with the electronic device 101 have. The external memory 138 may be any type of storage medium such as, for example, a hard disk, a floppy disk, a magnetic medium (e.g., a magnetic tape), an optical recording medium (e.g., CD-ROM, DVD, A flash drive, a CF, a secure digital (SD), a micro-SD, a mini-SD, an extreme digital (xD), a multi-media card (MMC), or a memory stick. The external memory 138 may be functionally or physically connected to the electronic device 101 via a wired (e.g., universal serial bus) or wireless (e.g., Bluetooth).

The program 140 is a software component stored, for example, in the memory 130, such as a kernel 141, a library 143, an application framework 145, or an application program (interchangeably & . ≪ / RTI >

The input device 150 is an apparatus for receiving a command or data to be used for a component (e.g., processor 120) of the electronic device 101 from the outside (e.g., a user) of the electronic device 101, For example, a microphone, a mouse, or a keyboard may be included. According to one embodiment, the keyboard may include a physical keyboard, or a virtual keyboard that is displayed through the display device 160.

Display device 160 may be an apparatus for visually providing information to a user of electronic device 101 and may include, for example, a display, a hologram device, or a projector and control circuitry for controlling the projector. The display may include, for example, a liquid crystal display (LCD), a light emitting diode (LED) display, an organic light emitting diode (OLED) display, a microelectromechanical system (MEMS) display, or an electronic paper display . The display, according to the temporal example, can be implemented to be flexible, transparent, or wearable on a part of the body. According to one embodiment, the display includes a pressure sensor (interchange-bly force sensor) capable of sensing touch, gesture, proximity, or hovering input of the user, capable of sensing touch circuitry or pressure intensity on the touch can do. The touch circuit or pressure sensor may be implemented integrally with the display, or may be implemented with one or more sensors separate from the display. The hologram device can display stereoscopic images in the air using the interference of light. The projector can display an image by projecting light onto a screen located inside or outside the electronic device 101. [

The audio module 170 is capable of bi-directionally converting sound and electrical signals. According to one embodiment, the audio module 170 may be configured to acquire sound through an input device 150 (e.g., a microphone) or to output sound output devices (not shown) Receiver) or an external electronic device (e.g., an electronic device 102 (e.g., a speaker or headphone)) that is wired or wirelessly connected to the electronic device 101.

The sensor module 176 measures or senses the internal operating state (e.g., power or temperature) of the electronic device 101 or an external environmental condition (e.g., altitude, humidity, or brightness) It is possible to generate an electric signal or a data value corresponding to the state information. The sensor module 176 may be, for example, a gesture sensor, a gyro sensor, a barometric sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor (e.g., an RGB (red, An infrared sensor, a biological sensor such as an iris sensor, a fingerprint sensor, or a heartbeat rate monitoring (HRM) sensor, an e-nose sensor, an electromyography (EMG) sensor, an electroencephalogram (EEG) Sensor, an electrocardiogram (ECG) sensor), a temperature sensor, a humidity sensor, an illumination sensor, or an ultraviolet (UV) sensor. The sensor module 176 may further include a control circuit for controlling at least one or more sensors belonging thereto. In some embodiments, the sensor module 176 may be controlled by a main processor 121 (e.g., an application processor) or by a coprocessor 123 (e.g., a sensor hub processor) that operates independently of the main processor 121 . In this case, for example, while the main processor 121 (e.g., an application processor) is in a sleep state, the main processor 121 (e.g., an application processor) At least some of the operation or state of the sensor module 176 may be controlled.

The interface 177 may provide a means to connect with an external electronic device (e.g., the electronic device 102) in accordance with a specified standard. According to one embodiment, the interface 177 may be a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an optical interface, a recommended standard 232 interface, a D-subminiature ) Interface, a mobile high-definition link (MHL) interface, an SD card interface, a multi-media card (MMC) interface, or an audio interface.

The connection terminal 178 may physically connect the electronic device 101 and an external electronic device (e.g., the electronic device 102). According to one embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card, an MMC connector, or an audio connector (e.g., a headphone connector).

The haptic module 179 may convert electrical signals into mechanical stimuli (e.g., vibrations or movements) or electrical stimuli that the user may perceive through tactile or kinesthetic sensations. The haptic module 179 may comprise, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 can capture a still image and a moving image. According to one embodiment, camera module 180 may include one or more lenses (e.g., a wide angle lens and a telephoto lens, or a front lens and a rear lens), an image sensor, an image signal processor, or a flash ).

The power management module 188 is a module for managing the power supplied to the electronic device 101, and may be configured as at least a part of, for example, a power management integrated circuit (PMIC).

The battery 189 may be an apparatus for supplying power to at least one component of the electronic device 101, for example, a non-rechargeable primary battery, or a rechargeable secondary battery or a fuel cell.

The communication module 190 is responsible for establishing a wired or wireless communication channel between the electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108) Lt; / RTI > According to one embodiment, the communication module 190 includes a wireless communication module 192 or a wired communication module 194, and the first network 198 (e.g., Bluetooth, WiFi (e. g., a short distance communication network such as direct or infrared data association (IrDA)) or a second network 199 (e. g., a telecommunication network such as a cellular network, E.g., a first external electronic device 102, a second external electronic device 104, or a server 108).

The wireless communication module 192 may support, for example, cellular communications, short range wireless communications, or global navigation satellite system (GNSS) communications. Cellular communications may include, for example, Long Term Evolution (LTE), LTE Advance (LTE), code division multiple access (CDMA), wideband CDMA (WCDMA), universal mobile telecommunications system (UMTS) ), Or Global System for Mobile Communications (GSM). The short range wireless communication may be, for example, wireless fidelity, WiFi Direct, LiFi, Bluetooth, Bluetooth low power, Zigbee, near field communication, Magnetic Secure Transmission, Radio Frequency (RF), or Body Area Network (BAN). The GNSS may include, for example, Global Positioning System (GPS), Global Navigation Satellite System (Glonass), Beidou Navigation Satellite System (Beidou), or Galileo, the European global satellite-based navigation system. Hereinafter, in this document, " GPS " can be used interchangeably with " GNSS ".

According to one embodiment, the wireless communication module 192 may use the subscriber identification module (e.g., a SIM card) 196, for example, to support electronic communication in the communication network, Can be distinguished and authenticated. According to one embodiment, the wireless communication module 192 may include a communications processor (CP) that operates independently from the processor 120 (e.g., an application processor (AP)). In such a case, the communications processor may be configured to communicate with the processor 120, for example, on behalf of the processor 120 while the processor 120 is in an inactive (e.g., sleep) May perform at least some of the functions associated with at least one component of the components 130-196 of the electronic device 101. For example, According to one embodiment, the wireless communication module 192 may be composed of a plurality of communication modules that support only a corresponding communication method of a cellular communication module, a short-range wireless communication module, or a GNSS communication module.

The wired communication module 194 may include a communication processor supporting wired communication methods, such as, for example, a local area network (LAN), a power line communication, or a plain old telephone service (POTS).

Some of the components 120-196 may include a communication method (e.g., bus, general purpose input / output, serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) To exchange signals (e.g., commands or data) with each other.

 According to one embodiment, the command or the data may be transmitted or received between the electronic device 101 and the second external electronic device 104 via the server 108 connected to the second network. Each of the first and second external electronic devices 102, 104 may be the same or a different kind of device as the electronic device 101. According to one embodiment, all or a portion of the operations performed on the electronic device 101 may be performed on another or a plurality of external electronic devices (e.g., the electronic device 102, 104, or the server 108). According to an embodiment, in the event that the electronic device 101 has to perform certain functions or services automatically or upon request, the electronic device 101 may be configured to perform functions or services on behalf of, or in addition to, (E. G., Electronic device 102,104, or server 108) that has received the request. ≪ RTI ID = 0.0 & 108) may execute the requested function or additional function and pass the result to the electronic device 101. The electronic device 101 may process the received result as is or additionally to provide the requested function or service It can By, for example, cloud computing, distributed computing, or client-server computing techniques can be used.

2 shows the appearance of an electronic device according to one embodiment.

Referring to FIG. 2, a display (or a display panel) 210 and a housing 220 may be exposed on a front surface of the electronic device 201 according to one embodiment. According to one embodiment, the electronic device 201 may include various hardware modules not shown. For example, a pressure sensor for sensing the intensity (or pressure) of a user's touch input and / or a biosensor for detecting a fingerprint of a user may be disposed on the back surface of the display 210.

According to one embodiment, through the second area 212 of the display 210, the electronic device 201 can detect the user's fingerprint. To this end, a biosensor for detecting the fingerprint may be disposed on the back surface of the second area 212 of the display 210. [

According to various embodiments of the present invention, even if the biosensor is disposed on the back surface of the display 210, it is possible to accurately obtain the user's fingerprint information by maintaining a proper distance with the display 210, It is possible to provide a sensor package structure capable of preventing the performance degradation caused by the heat sink.

In Fig. 2, the electronic device 201 is not limited to the example described above as an example. For example, a receiver, a camera module, an iris sensor, and a biosensor may be disposed on the back of the display 210.

3 shows an exploded perspective view of an electronic device according to one embodiment.

3, an electronic device 301 (e.g., electronic device 201) in accordance with an embodiment includes a cover glass 310, a display (or display panel) 320 (e.g., a display 210) A pressure sensor 330, a biosensor module 340 (e.g., fingerprint sensor), a housing 350 (e.g., a housing 220), a circuit board 360, a battery 370, and a back cover ) ≪ / RTI > According to various embodiments, the electronic device 301 may not include some of the configurations shown in FIG. 3, and may further include configurations not shown in FIG.

The cover glass 310 may transmit the light generated by the display 320. In addition, on the cover glass 310, a user can touch a part of the body (e.g., a finger) to perform touching (including contact using the electronic pen). The cover glass 310 may be formed of, for example, tempered glass, reinforced plastic, a flexible polymeric material, or the like so as to separate each configuration contained in the display 320 and the electronic device 301 from external impact Can be protected. According to various embodiments, the cover glass 310 may also be referred to as a glass window.

The display 320 may be disposed under or coupled to the cover glass 310 and exposed through at least a portion of the cover glass 310. The display 320 may output content (e.g., text, images, video, icons, widgets, or symbols), or may receive touch input or electronic pen input from a user.

According to one embodiment, the display 320 may include a display panel, a touch sensor, and / or an electronic pen sensor. The display panel may be, for example, a liquid crystal display (LCD) panel, a light emitting diode (LED) display panel, an organic light emitting diode (OLED) display panel, or a microelectromechanical system . The touch sensor may include an electrostatic touch panel, a pressure sensitive touch panel, a resistive touch panel, an infrared touch panel, or an ultrasonic touch panel. The touch sensor may be inserted between the display panels (an add-on touch panel), directly formed on the display panel (on-cell touch panel), or included within the display panel An in-cell touch panel). The electronic pen sensor (e.g., a digitizer) can detect contact, gesture, hovering, and the like from the electronic pen.

According to one embodiment, the display 320 includes a planar area 321 and one side (e.g., upper side, lower side, left side) of the flat area 321 And a bending area 322 extending from the right side of the display area 321. The flat area 321 may include pixels of a display panel such as an OLED, And a conductive pattern of the electronic pen sensor may be disposed on the display 320. The bending area 322 is electrically connected to the FPCB 323 located on the back surface of the display 320 and various conductive patterns .

According to one embodiment, a portion of the bending region 322 may be folded toward the backside of the planar region 321. According to various embodiments, the wiring of the FPCB 323 may be electrically connected to the circuit board 360 through a designated connector. Depending on the design of the electronic device 301, pixels may be arranged in the bending area 322 for displaying various information, similar to the flat area 321, according to various embodiments.

The pressure sensor 330 may be disposed or coupled under the display 320. For example, the pressure sensor 330 may be disposed between the flat area 321 of the display 320 and the FPCB 323. The pressure sensor 330 may detect or sense the pressure (or force) of the exterior (e.g., a user's finger) with respect to the cover glass 310. According to one embodiment, the pressure sensor 330 may include a plurality of electrodes and a dielectric layer. For example, the pressure sensor 330 may sense the pressure of the touch based on the capacitance between the first electrode and the second electrode that changes according to a user's touch.

The biometric sensor module 340 (e.g., a fingerprint sensor) may be disposed or coupled under the display 320. For example, the biosensor module 340 may be attached to the flat area 321 of the display 320. According to one embodiment, the pressure sensor 330 may include a sensor arrangement area (or an opening) in which the front and rear surfaces are perforated for placement of the biosensor module 340. The biosensor module 340 may be inserted into the sensor arrangement region of the pressure sensor 330 and disposed in parallel with the pressure sensor 330. [

The biosensor module 340 can sense biometric information (e.g., fingerprint information) of a user. The biosensor module 340 may include, for example, an optical biosensor. For example, the biosensor module 340 captures a user's fingerprint image using an embedded image sensor (e.g., a complementary metal oxide semiconductor image sensor (CMOS), a complementary metal oxide semiconductor image sensor (CCD) can do. A unique fingerprint minutiae of the fingerprint can be extracted from the fingerprint image and the fingerprint minutiae can be used for user authentication by collating with the previously registered fingerprint minutiae.

The biosensor module 340 receives at least some light (for example, light reflected by a user's finger) out of light output from at least one light emitting element included in the display 320 to acquire fingerprint information have. According to various embodiments, the biosensor module 340 includes a light emitting unit and a light receiving unit, outputs light by using a light emitting unit, receives light reflected from an external object (e.g., finger), and obtains the fingerprint information You may.

The housing 350 forms at least a part of the appearance of the electronic device 301 and can accommodate the respective constituents contained in the electronic device 301. [ For example, the housing 350 may form an external appearance on a side (e.g., an upper side, a lower side, a left side, and / or a right side) of the electronic device 301. According to various embodiments, the housing 350 may include a plurality of housings. The housing 350 may also be referred to as a rear case, a rear plate, or the like. According to one embodiment, at least a part of the side surface of the housing 350 may be formed of a metal material and used as an antenna structure.

According to one embodiment, the housing 350 may include a bracket. The bracket may, for example, consist of a magnesium alloy and may be disposed below the display 320 and above the circuit board 360. The brackets may be coupled to the display 320 and the circuit board 360 to physically support them.

According to one embodiment, the circuit board 360 may be disposed below the housing 350 (or above the housing 350). The circuit board 360 may be mounted or arranged in various electronic components, devices, printed circuits, etc. (e.g., processors, memories, communication circuits, etc.) of the electronic device 301. According to various embodiments, the circuit board 360 may be referred to as a main board, a printed board assembly (PBA), or simply a PCB. The circuit board 360 may include, for example, a main circuit board and a sub circuit board. According to one embodiment, the main circuit board and the sub circuit board may be electrically connected to each other through a designated connector or a designated wiring. The circuit board 360 may be, for example, a rigid printed circuit board (FPCB) and / or a flexible printed circuit board (FPCB).

The battery 370 can convert chemical energy and electrical energy in both directions. For example, the battery 370 may convert chemical energy into electrical energy, which may be supplied to the display 320, the pressure sensor 330, the biosensor module 340 and the circuit board 360, Module. According to one embodiment, the circuit board 360 may include a power management module (e.g., a power management integrated circuit (PMIC)) for managing the charging and discharging of the battery 370.

The rear cover 380 may be coupled to the rear surface of the electronic device 301. [ The rear cover 380 may be formed of tempered glass, plastic injection molding, and / or metal. According to various embodiments, the rear cover 380 may be implemented integrally with the housing 350 or detachable by a user.

4A and 4B show a coupling structure of an electronic device according to an embodiment.

The electronic device 401 shown in Figs. 4A and 4B shows, for example, a perspective view when the electronic device 401 is viewed from the rear side.

Referring to Figure 4A, an electronic device 401 (e.g., electronic device 301 of Figure 3) in accordance with an embodiment includes a display (or display panel) 420 (e.g., display 320 of Figure 3) And pressure sensor 430 (e.g., pressure sensor 330 of FIG. 3). Referring to FIG. 4B, an electronic device 401 (e.g., electronic device 301 of FIG. 3) according to an embodiment may further include a biosensor module 440 (e.g., biosensor module 340 of FIG. 3) .

According to one embodiment, the display 420 may include a panel layer 421 and a layer 425. According to one embodiment, the panel layer 421 may include at least one light emitting device. According to one embodiment, the panel layer 421 may include at least one hole or gap through which light of a particular wavelength band may be transmitted. For example, the panel layer 421 may include at least one gap between a plurality of pixels and wirings. The reflected light output from the panel layer 421 and reflected by the user's finger may pass through at least one gap included in the panel layer 421 and reach the biosensor module 440. According to one embodiment, the layer 425 may be disposed to face the back surface of the panel layer 421. [ According to one embodiment, the layer 425 may include a sensor arrangement area 427 for receiving a biosensor module (e.g., the biosensor module 340 of FIG. 3). The sensor arrangement region 427 may have a configuration in which the front and rear surfaces are penetrated so as to face a part of the panel layer 421 in a state where the biosensor module is inserted.

Referring to the enlarged image 5 of the partial area 3 of the layer 425, the layer 425 may include a first layer 425-1 and a second layer 425-2. According to one embodiment, the sizes of the through regions (or openings) formed in the first layer 425-1 and the second layer 425-2 may be different from each other. For example, the area of the penetration area of the second area 425-2 may be larger than the area of the penetration area of the first layer 425-1.

According to one embodiment, the display 420 may include a circuit board 423 (e.g., the FPCB 323 of FIG. 3) in which a display IC and / or a touch sensor IC, etc. are disposed. According to one embodiment, the circuit board 423 may extend from one side (e.g., lower side) of the panel layer 421 and be electrically connected to the panel layer 421.

According to one embodiment, the pressure sensor 430 may include a sensor arrangement area 431 for receiving the biosensor module 340. The sensor arrangement region 431 of the pressure sensor 430 may be configured such that the front and back surfaces thereof penetrate to face a part of the panel layer 421 in a state where the biosensor module is inserted. The area of the sensor arrangement area 431 of the pressure sensor 430 may be equal to or greater than the area of the sensor arrangement area 427 of the layer 425. [

The circuit board 423 is folded in the backward direction of the layer 425 so as to overlap with at least a portion of the layer 425 and the pressure sensor 430 and is connected to the layer 425 and the pressure sensor 430 .

4B, the biosensor module 440 (e.g., the biosensor module 340 of FIG. 3) may be attached to the rear surface of the display 420. FIG. For example, one surface of the bio-sensor module 440 may be attached to the first layer 425-1 of the layer 425 through the pressure sensor 430 and the second layer 425-2 of the layer 425, .

5 shows a cross-sectional view of an electronic device according to one embodiment.

5 corresponds to a cross-sectional view in a state in which a biosensor module (for example, the biosensor module 340 in Fig. 3) is not attached to the display 520. Fig. Referring to Figure 5, an electronic device 501 (e.g., electronic device 301 of Figure 3) includes a cover glass 510 (e.g., cover glass 310 of Figure 3), a display (or display panel) 520) (e.g., display 320 of FIG. 3) and a pressure sensor 530 (e.g., pressure sensor 330 of FIG. 3).

The cover glass 510 may be located at the top layer of the electronic device 501. The display 520 may be disposed under the cover glass. Display 520 may include a panel layer 521 (e.g., panel layer 421) and a layer 525 (e.g., layer 425). The panel layer 521 may comprise at least one light emitting device and may be disposed under the cover glass 510, according to one embodiment. According to one embodiment, the layer 525 may be disposed below the panel layer 521. According to one embodiment, the layer 525 includes a first layer 525-1 (e.g., a first layer 425-1) and a second layer 525-2 (e.g., a second layer 425-2 )). The first layer 515-1 includes a supporting member 51 having a pattern formed thereon, a digitizer (or electronic pen sensor) 53 for receiving an input from the electronic pen, and a metal layer 55 : Copper layer). The support member 51 absorbs external impact to the panel layer 521, improves the optical characteristics, and can visually obscure the pattern included in the digitizer 53. [ The second layer 515-2 may include, for example, a heat dissipation layer 57 for performing a heat dissipation function and a cushion layer 59 for absorbing an external impact. The laminated structure of the first layer 515-1 and the second layer 515-2 shown in Fig. 5 is merely an example, and the layer 525 does not include some of the plurality of layers shown in Fig. 5 , At least one other layer may be further included, or at least some of the plurality of layers may be arranged in a varying position. For example, the layer 515 may not include the digitizer 53 and the metal layer 55 shown in FIG. As another example, the layer 515 may not include the support member 51 and the heat-radiating sheet 57.

According to one embodiment, the sizes of the through regions (or openings) formed in the first layer 525-1 and the second layer 525-2 may be different from each other. For example, the width w2 of the penetration area of the second area 525-2 may be greater than the width w1 of the penetration area of the first layer 525-1. Accordingly, the layer 525 can form a step structure by the first layer 525-1 and the second layer 525-2.

According to one embodiment, the pressure sensor 530 may be disposed below the layer 525. According to one embodiment, the circuit board 523 may be disposed beneath the pressure sensor 530. The circuit board 523 may be folded in the backward direction of the layer 525 to extend from one side of the display 520 (e.g., the panel layer 521), for example, as described with reference to Figure 4A, Gt; 530 < / RTI > According to one embodiment, the electronic device 501 may not include the pressure sensor 530.

6 shows a package structure of a biosensor module according to an embodiment.

6 is a perspective view of a biosensor module (e.g., a fingerprint sensor) 640 (e.g., the biosensor module 340 of FIG. 3), and an image of the biosensor module 640 And an image is a rear view of the biosensor module 640. [

6, the biosensor module 640 includes a circuit board 641, a housing 642, an image sensor (or an image sensor array) 643, an optical layer 644, an optical filter layer 645, A conductive wire 646, a conductive wire 647, and a magnetic screen layer 648 (e.g., a magnetic metal powder sheet). The image sensor 643 and the optical layer 644 (and the optical filter layer 645) may be combined in a single package structure and may be referred to, for example, as a biosensor. According to various embodiments, the biosensor module 640 may not include some configurations shown in Fig. 6, and may further include configurations not shown in Fig.

According to one embodiment, the circuit board 641 may include a rigid printed circuit board (RPCB) 641-1 and a flexible printed circuit board (FPCB) 641-2. The rigid printed circuit board 641-1 may include a passive element, a printed circuit, and a sensor IC for controlling the biosensor. The passive element, the printed circuit, and the sensor IC may be disposed, for example, on the back surface of the rigid printed circuit board 641. The flexible printed circuit board 641-2 may extend from one side of the rigid printed circuit board 641-1. The flexible printed circuit board 641-1 (or the connection portion) may be electrically connected to another circuit board (e.g., the circuit board 423 of FIG. 4A) while attached to the display (e.g., the display 420 of FIG. 4A) Can be connected.

According to one embodiment, the housing 642 may be disposed on one side (e.g., an upper surface) of the circuit board 641. [ According to one embodiment, the housing 642 may include an opening. At least a portion of the top surface of the housing 642 may be open, such that the housing 642 may have a sidewall shape surrounding the biosensor. For example, the housing 642 may have a 'ㅁ' shape surrounding the periphery of the living body sensor when the upper surface of the living body sensor module 640 is viewed. For example, the housing 642 may have a 'C' shape or an '11' shape in which a part of the periphery of the living body sensor is opened when the upper surface of the living body sensor module 640 is viewed. With the biosensor module attached to the display (e.g., the display 420 of FIG. 4A), the biosensor can face one side of the display through the opening. The housing 642 may comprise, for example, a polymeric material such as epoxy and / or a metallic material such as stainless steel or aluminum.

According to one embodiment, a biosensor (e.g., image sensor 643, optical layer 644, optical filter layer 645) may be disposed on one surface (e.g., an upper surface) of the circuit board 641. The biosensor may be disposed within the housing 642. For example, the biosensor may be disposed within the housing 642 through an opening in the housing 642. [

According to one embodiment, an image sensor (e.g., CMOS, CCD) 643 may be disposed on one side (e.g., an upper surface) of the circuit board 641. The image sensor 643 may be, for example, an array type image sensor in which a plurality of image sensors are arranged at specified intervals. The image sensor 643 can acquire fingerprint information (or a fingerprint image) using the reflected light reflected on the finger of the user.

According to one embodiment, the optical layer 644 may be disposed over the image sensor. The optical layer 644 can improve the optical characteristics of the reflected light reflected by, for example, an external object (e.g., a finger) and refract the reflected light to improve the light receiving efficiency of the image sensor 643.

According to one embodiment, an optical filter layer 645 may be disposed over the optical layer 644. According to one embodiment, the optical filter layer 645 may be disposed on at least a portion of the region of the optical layer 644. The optical filter layer 645 can transmit only light of a specific wavelength (for example, visible light) out of the reflected light reflected by, for example, an external object (e.g., a finger). For example, the optical filter layer 645 can pass through a hole formed in the panel layer (e.g., the panel layer 421 of FIG. 4A) at the wavelength required by the image sensor 643 or for the acquisition of fingerprint information It is possible to transmit only light of a certain wavelength (for example, green light). According to one embodiment, the optical filter layer 645 may comprise a poly ethylene terephthalate (PET) film.

According to one embodiment, the adhesive member 646 may be disposed on one surface (e.g., an upper surface) of the housing 642. [ The adhesive member 646 may be attached to one surface (e.g., a back surface) of the display, thereby attaching the biosensor module 640 to the display.

According to one embodiment, the conductive wire 647 can electrically connect the circuit board 641 and the biometric sensor (e.g., the image sensor 643). The conductive wire 647 may include a plurality of wires connecting the circuit board 641 and the image sensor 643, for example. The fingerprint information obtained by the image sensor 643 can be transmitted to the sensor IC disposed on the circuit board 641 via the conductive wire 647. [

According to one embodiment, the shielding layer 648 may be attached to one side (e.g., the back side) of the circuit board 641. The shielding layer 648 may comprise, for example, magnetic powder and / or metal powder. As the shielding layer 648 forms a sensor placement area in a layer of the display (e.g., layer 425 in FIG. 4A), holes may be formed in some areas of the digitizer included in the layer. The shielding layer 648 can compensate for the change in the magnetic field caused by the holes formed in the layer, thereby preventing performance deterioration of the digitizer. If the layer does not include a digitizer, the shielding layer 648 may be omitted.

7A is a cross-sectional view of a bio-sensor module according to an embodiment.

7A, the biosensor module 701 (e.g., the biosensor module 640 of FIG. 6) includes a circuit board 741 (e.g., a circuit board 641), a housing 742 ), An image sensor (or image sensor array) 743 (e.g., image sensor 643), an optical layer 744 (e.g., optical layer 644), an optical filter layer 745 (E.g., conductive layer 645), an adhesion member 746 (e.g., adhesion member 646), a conductive wire 747 (e.g., conductive wire 647), a magnetic screen layer 748 (648) and a protective member (749).

According to one embodiment, the housing 742 and the image sensor 743 may be disposed on the circuit board 741. For example, the housing 742 and the image sensor 743 may be attached to the circuit board 741 by a first adhesive film (e.g., DAF (die attach film) 71).

According to one embodiment, the optical filter layer 745 may be disposed on at least a portion of the region of the optical layer 744. For example, the optical filter layer 745 is bonded to the optical layer 744 by a second adhesive film (e.g., an optically clear adhesive (OCA) film, an optically clear resin (OCR) Lt; / RTI > The second adhesive film 73 may be transparent to ensure optical characteristics.

According to one embodiment, the protective member 749 is formed by the housing 742 and the biosensor (e.g., image sensor 743, optical layer 744 and optical filter layer 745) and the circuit board 741 So that the housing 742 and the living body sensor can be fixed. According to one embodiment, the protective member 749 may surround the conductive wire 747 to secure the conductive wire 747 and protect it from the outside. The conductive wire 747 can be completely cut off from the outside by the protective member 749. [ The protective member 749 may include, for example, an epoxy resin or silicone.

The height h1 from the circuit board 741 to the bonding member 746 may be greater than or equal to the height h2 from the circuit board 741 to the optical layer 744. In one embodiment, Accordingly, the biosensor module 701 can be disconnected from the outside in a state in which the biosensor module 701 is attached to a display (e.g., the display 320 in Fig. 3).

7B is a cross-sectional view of a bio-sensor module according to an embodiment.

7B, the biosensor module 703 (for example, the biosensor module 640 in FIG. 6) includes a main circuit board 741, a sub circuit board 79, a housing 742, an image sensor A sensor array) 743, an optical layer 744, an optical filter layer 745, an adhesive member 746, a conductive wire 747, a shielding layer 748 and a protective member 749.

According to one embodiment, the sub circuit board 79 may be disposed on the main circuit board 741. [ For example, the sub circuit board 79 may be attached to the main circuit board 741 by at least one third adhesive member 75. According to one embodiment, the third adhesive member 75 may comprise a conductive material, for example, and may electrically connect the main circuit board 741 and the sub circuit board 79. For example, the third adhesive member 75 may comprise a conductive epoxy or a solder.

According to one embodiment, the image sensor 743 may be disposed on the sub-circuit substrate 79. For example, the image sensor 743 may be attached to the sub-circuit substrate 79 by a first adhesive film (e.g., DAF (die attach film)

8 shows a part of the package structure of the biosensor module according to one embodiment.

8 shows a perspective view of the first side edge portion when the rear side of the living body sensor module (e.g., the living body sensor) 840 (e.g., the living body sensor module 640) is viewed. Is a rear view of the first side edge portion of the biosensor module 840 and an image is a rear view of the second side edge portion of the biosensor module 840. [

8, the biosensor module 840 includes a circuit board 841 (e.g., a circuit board 641), a housing 842 (e.g., a housing 642), an adhesive member 846 (e.g., (E.g., shield layer 646) and a shield layer 848 (e.g., shield layer 648). According to one embodiment, a portion of the housing 842 may protrude outside the circuit board 841. For example, the edge of the circuit board 841 may have an inwardly concave shape, and the edge of the housing 842 may project outside the circuit board 841. According to another embodiment, the housing 842 may be located on the inside (or the same position) of the circuit board 841 in all areas.

When the second bonding member (for example, the second bonding member 92 of FIG. 9) is applied as the boundary line of the edge of the circuit board 841 is located inside the edge of the edge of the edge of the housing 842, So that the adhesive member can be effectively applied to the area between the living body sensor module 840 and the display.

9 shows a cross-sectional view of an electronic device according to one embodiment.

9 corresponds to a cross-sectional view in a state in which the biosensor module 940 is attached to the display 920. FIG. 9, electronic device 901 (e.g., electronic device 301 of FIG. 3) includes a cover glass 910 (e.g., cover glass 310 of FIG. 3), a display (or display panel) (E.g., display 320 of FIG. 3), pressure sensor 930 (e.g., pressure sensor 330 of FIG. 3), and biometric sensor module 940 (e.g., biometric sensor module 340 of FIG. ).

According to one embodiment, the biosensor module 940 includes a sensor arrangement area (e.g., sensor arrangement area 427 in FIG. 4A) formed in the display 920 and a sensor arrangement area (e.g., 4a) and may be attached to the rear surface of the display (920). For example, the first adhesive member 946 (e.g., adhesive member 646) of the biosensor module 940 may be attached to a first layer 925-1 (e.g., a layer 425) of a layer 925 (E.g., the first layer 425-1). An image sensor 943 (e.g., an image sensor 643), an optical layer 944 (e.g., an optical layer 644) with the biosensor module 940 attached to the display 920, And the optical filter layer 945 (e.g., optical filter layer 645) may face the panel layer 921 (e.g., the panel layer 421). According to one embodiment, the performance of the biosensor module 940 The optical filter layer 945 may be disposed apart from the panel layer 921 by a specified distance h3.

According to one embodiment, the electronic device 901 may include a second adhesive member 92 for attaching the biosensor module 940 to the display 920. The second adhesive member 92 may be inserted between the outer surface of the housing 942 and the inner surface of the layer 925 to fix the biosensor module 940 to the display 920. The biometric sensor module 940 can be doubly attached to the display 920 by the first adhesive member 946 and the second adhesive member 92 so that the adhesion of the biosensor module 940 can be improved. According to one embodiment, the second adhesive member 92 may comprise a UV adhesive that can be cured by UV light, such as UV (ultraviolet rays) ink or UV curable resin.

9, the biosensor module 940 is described as being attached to the display 920 by the first adhesive member 946. However, the biosensor module 940 may be attached to the display 920 without the adhesive member 946, Or may be attached to the display 920 via additional mechanical fixing methods (e.g., screws, fixing grooves, fixing members, etc.).

10A and 10B illustrate a manufacturing process of a biosensor according to an embodiment.

The biosensor module 1040 (e.g., the biosensor module 640 of FIG. 6) may be mounted on the circuit board 1041 (e.g., the circuit board (not shown) of FIG. 6 641) and a housing 1042 (e.g., housing 642 of FIG. 6). The housing 1042 is disposed on the upper surface of the circuit board 1041 and may include an opening 1091. [ 10A, an image sensor 1043 (e.g., an image sensor 643 in FIG. 6) and an optical layer (not shown) on the top surface of a circuit board 1041 1044 (e.g., optical layer 645 in FIG. 6)) can be disposed. For example, the image sensor 1043 may be disposed on at least a portion of the area in the opening 1091 of the housing 1042, and the optical layer 1044 may be disposed on at least a portion of the area of the image sensor 1043. 10A, a circuit board 1041 and an image sensor 1043 are electrically connected to a conductive wire 1047 (for example, a printed circuit board) with a biosensor disposed on a circuit board 1041. [ (The conductive wire 647 in Fig. 6). The circuit board 1041 and the image sensor 1043 can be electrically connected, for example, via a plurality of conductive wires.

An optical filter layer 1045 (e.g., the optical filter layer 645 in FIG. 6) may be disposed on the upper surface of the optical layer 1044, referring to the images 1008 and 1008 in FIG. 10B. The optical filter layer 1045 may be disposed on at least a portion of the region of the optical layer 1044. The optical filter layer 1045 may be attached to the optical layer 1044 by, for example, an optically clear adhesive (OCA) film). 10B, the housing 1042 and the biosensor (e.g., the image sensor 1043, the optical layer 1044, and the optical filter layer 1045) and the circuit board 1041 are connected to the housing 1042, A protective member 1049 (e.g., a protective member 739 in Fig. According to one embodiment, the protective member 1049 may be formed to completely surround the conductive wire 1047 so that the conductive wire 1047 is shielded from the outside. According to one embodiment, a shielding layer 1048 (e.g., a shielding layer 648 of FIG. 6) may be attached to the backside of the circuit board 1041. Referring to FIGS. 10B and 10C, an adhesive member 1046 may be disposed on at least a portion of the housing 1042. FIG. The biometric sensor 1040 may be attached to the back surface of the display (e.g., the display 320 of Fig. 3) via the adhesive member 1046. [

The electronic device according to the various embodiments disclosed herein can be various types of devices. The electronic device may be, for example, a personal digital assistant (PDA), a tablet personal computer (PC), a laptop PC, a desktop PC, a workstation, A portable medical device (e.g., cardiac, blood glucose, blood pressure, or body temperature gauge), a camera, or a wearable device, as well as a portable multimedia device such as an electronic book reader or MP3 player. Wearable devices may be of the type of accessories (eg, watches, rings, bracelets, braces, necklaces, glasses, contact lenses or head-mounted-devices (HMD) (E.g., a skin pad or tattoo), or a bio-implantable circuit. In some embodiments, the electronic device may be, for example, a television, a digital video disk Audio devices, audio accessory devices such as speakers, headphones, or headsets, refrigerators, air conditioners, vacuum cleaners, ovens, microwave ovens, washing machines, air purifiers, set top boxes, home automation control panels, An electronic dictionary, an electronic key, a camcorder, or an electronic photo frame.

In other embodiments, the electronic device may be a navigation device, a global navigation satellite system (GNSS), an event data recorder (EDR) (e.g., a black box for a car, a ship, or a plane), an automotive infotainment device (For example, a head-up display for a vehicle), an industrial or household robot, a drone, an automated teller machine (ATM), a POS (point of sale) instrument, a measuring instrument (E.g., a light bulb, a sprinkler device, a fire alarm, a temperature regulator, or a streetlight). The electronic device according to the embodiment of the present document is not limited to the above-described devices and may also be provided with a plurality of electronic devices such as a smart phone having a function of measuring biometric information (e.g., heartbeat or blood sugar) It is possible to combine the functions of the devices. In this document, the term user may refer to a person using an electronic device or a device using an electronic device (e.g., an artificial intelligence electronic device).

It should be understood that the various embodiments of the present document and the terms used therein are not intended to limit the techniques described herein to specific embodiments, but rather to include various modifications, equivalents, and / or alternatives of the embodiments. In connection with the description of the drawings, like reference numerals may be used for similar components. The singular expressions may include plural expressions unless the context clearly dictates otherwise. In this document, the expressions "A or B," "at least one of A and / or B," "A, B or C," or "at least one of A, B, and / Possible combinations. Expressions such as " first, "" second," " first, "or" second, " But is not limited to those components. When it is mentioned that some (e.g., first) component is "(functionally or communicatively) connected" or "connected" to another (second) component, May be connected directly to the component, or may be connected through another component (e.g., a third component).

In this document, the term " adapted to or configured to "as used herein is intended to encompass all types of information, including, but not limited to, "Quot;, " made to do ", " designed to ", or "designed to" In some situations, the expression "a device configured to" may mean that the device can "do " with other devices or components. For example, a processor configured (or configured) to perform the phrases "A, B, and C" may be a processor dedicated to performing the operations (e.g., an embedded processor) May refer to a general purpose processor (e.g., a CPU or an application processor) capable of performing the operations by executing the above programs.

As used herein, the term "module " includes units comprised of hardware, software, or firmware and may be used interchangeably with terms such as, for example, logic, logic blocks, components, or circuits. A module may be an integrally constructed component or a minimum unit or part thereof that performs one or more functions. For example, a module may be configured as an application-specific integrated circuit (ASIC) or field-programmable gate arrays (FPGAs).

At least some of the devices or methods according to various embodiments may be implemented with instructions stored in a computer-readable storage medium (e.g., internal memory 136 or external memory 138) in the form of a program. When the instruction is executed by a processor (e.g., processor 120), the processor may perform the function corresponding to the instruction, either directly or using other components under the control of the processor. The instructions may include code generated or executed by the compiler or interpreter.

Each of the components (e.g., modules or programs) according to various embodiments may be comprised of a single entity or a plurality of entities, and some subcomponents of the previously mentioned subcomponents may be omitted, or other subcomponents . Alternatively or additionally, some components (e.g., modules or programs) may be integrated into a single entity to perform the same or similar functions performed by each respective component prior to integration. Operations performed by a module, program, or other component, in accordance with various embodiments, may be performed sequentially, in parallel, repetitively, or heuristically, or at least some operations may be performed in a different order, .

Claims (13)

In a mobile electronic device,
A display panel including a first surface capable of displaying a screen and a second surface opposite to the first surface;
A housing having an opening region facing the second surface on one side and attached to the second side along the opening region by an adhesive member lying on at least a part of the periphery of the opening region;
A circuit board covering at least a part of the area by the housing;
A biosensor disposed over the at least a partial region of the circuit board and visually exposing at least a portion thereof toward the second face through the opening region and collecting a signal related to the biometric information through the first face; And
And an optical layer placed on the biosensor and refracting reflected light. The method according to claim 1,
A metallic sheet placed on the back surface of the circuit board; And
An optical filter layer disposed on at least a portion of the optical layer; ≪ / RTI > 3. The method of claim 2,
Wherein the optical filter layer is disposed at a distance from the second side of the display panel. The method according to claim 1,
And a rear layer disposed on a second side of the display panel at a lower portion thereof,
The back-
And an opening formed in the back layer and configured to transmit a signal related to the biometric information to the biosensor. 5. The method of claim 4,
The opening
A first opening formed in a part of the rear layer, the opening having a first width;
And a second opening formed in the remainder of the back layer with a second width and having at least a portion overlapping the first opening. 5. The method of claim 4,
The second opening is disposed below the first opening,
Wherein the cross section of the second opening is larger than the cross section of the first opening. 5. The method of claim 4,
And an adhesive member disposed between the housing and the periphery of the second opening of the back layer. 5. The method of claim 4,
And an adhesive member disposed between the back layer and the housing. 9. The method of claim 8,
Wherein a height between the circuit board and the adhesive member is greater than a height between the circuit board and the optical layer. The method according to claim 1,
Wherein the biometric sensor is a fingerprint sensor. The method according to claim 1,
The edge of the circuit board has a concave shape inward,
Wherein a corner of the housing protrudes outside the circuit board. The method according to claim 1,
Wherein the biosensor has a rectangular shape. The method according to claim 1,
Wherein the biosensor is disposed at a specified distance from a second side of the display panel.

Images