KR102307736B1 - Biometric sensor and device comprising the same - Google Patents

Abstract

A display device according to various embodiments of the present disclosure includes a display panel, a cover glass disposed on the display panel, and a biosensor module disposed under the display panel, wherein the biosensor module includes: a circuit board; A biometric sensor disposed on a circuit board and a housing having an opening formed therein, wherein the biometric sensor is accommodated in the opening of the housing, and the biometric sensor module may be attached to one surface of the display panel by the housing. Also, other embodiments are possible.

Description

Biometric sensors and devices comprising biometric sensors

The present invention relates to a biosensor for detecting user's biometric information and a device including the same.

Recently, a technology for performing user authentication using biometric information (eg, fingerprint, iris, etc.) of a user obtained by a biometric sensor has been developed. A biosensor for fingerprint recognition may be classified into an optical ultrasonic method and an electrostatic method according to a method of acquiring fingerprint information.

In the case of optical sensors, a certain distance must be maintained between the display and the sensor, and it is necessary to prevent the ingress of foreign substances (eg, dust) between the display and the sensor. However, in the process of using the electronic device, the distance between the display and the biosensor may be changed due to an external shock or aging, or the sensor performance may be deteriorated due to a foreign object introduced between the display and the sensor.

Various embodiments of the present invention provide a biosensor and a device including the biosensor having a structure for stably maintaining a distance between the display and the sensor and preventing the introduction of foreign substances between the display and the sensor.

The sensor device according to various embodiments of the present disclosure may include a circuit board and a housing disposed on one surface of the circuit board and including an opening in which the biometric sensor is accommodated.

A display device according to various embodiments of the present disclosure includes a display panel, a cover glass disposed on the display panel, and a biosensor module disposed under the display panel, wherein the biosensor module includes: a circuit board; A biometric sensor disposed on a circuit board and a housing having an opening formed therein, wherein the biometric sensor is accommodated in the opening of the housing, and the biometric sensor module may be attached to one surface of the display panel by the housing.

An electronic device according to various embodiments of the present disclosure may include a display panel, a cover glass disposed on the display panel, a biosensor module disposed under the display panel, and the display and the biosensor module electrically connected to the display panel. a processor configured to acquire fingerprint information by using a biosensor module, wherein the biosensor module includes a circuit board, a biosensor disposed on the circuit board, and a housing having an opening formed therein; A biometric sensor may be accommodated and attached to one surface of the display panel by the housing.

According to various embodiments of the present disclosure, it is possible to prevent deterioration of the performance of the sensor by maintaining a stable distance between the display and the sensor and preventing the inflow of foreign substances between the display and the sensor.

1 is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure;
2 illustrates an appearance of an electronic device according to an exemplary embodiment.
3 is an exploded perspective view of an electronic device according to an exemplary embodiment.
4A and 4B illustrate a coupling structure of an electronic device according to an exemplary embodiment.
5 is a cross-sectional view of an electronic device according to an exemplary embodiment.
6 illustrates a package structure of a biosensor according to an exemplary embodiment.
7A is a cross-sectional view of a biosensor according to an exemplary embodiment.
7B is a cross-sectional view of a biosensor according to an exemplary embodiment.
8 illustrates a portion of a package structure of a biosensor according to an exemplary embodiment.
9 is a cross-sectional view of an electronic device according to an exemplary embodiment.
10A and 10B illustrate a manufacturing process of a biometric sensor according to an exemplary embodiment.

Hereinafter, various embodiments of the present invention will be described with reference to the accompanying drawings. However, this is not intended to limit the present invention to specific embodiments, and it should be understood that various modifications, equivalents, and/or alternatives of the embodiments of the present invention are included. In connection with the description of the drawings, like reference numerals may be used for like components.

1 is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure;

Referring to FIG. 1 , in a network environment 100 , an electronic device 101 communicates with an electronic device 102 through short-range wireless communication 198 , or through a network 199 , an electronic device 104 or a server ( 108). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 . According to an embodiment, the electronic device 101 includes a processor 120 , a memory 130 , an input device 150 (eg, a microphone or a mouse), a display device 160 , an audio module 170 , and a sensor module 176 . ), an interface 177 , a haptic module 179 , a camera module 180 , a power management module 188 , a battery 189 , a communication module 190 , and a subscriber identification module 196 . In some embodiments, at least one of these components (eg, the display device 160 or the camera module 180 ) may be omitted or another component may be added to the electronic device 101 . In some embodiments, for example, as in the case of a sensor module 176 (eg, a fingerprint sensor, an iris sensor, or an illuminance sensor) embedded in a display device 160 (eg, a display), some components It can be integrated and implemented.

The processor 120 may control at least one other component (eg, a hardware or software component) of the electronic device 101 connected to the processor 120 by, for example, driving an operating system or an application program, , various data processing and operations can be performed. The processor 120 loads and processes commands or data received from other components (eg, the sensor module 376 or the communication module 190 ) into the volatile memory 132 , and stores the result data in the non-volatile memory 134 . can be stored in The processor 120 may include one or more of a central processing unit, an application processor, a graphic processing unit, an image signal processor, a sensor hub processor, and a communication processor. According to an embodiment, the processor 120 is operated independently of the main processor 121 (eg, central processing unit or application processor), and additionally or alternatively, uses less power than the main processor 121, Alternatively, the auxiliary processor 123 (eg, a graphic processing unit, an image signal processor, a sensor hub processor, or a communication processor) specialized for a specified function may be included. In this case, for example, on behalf of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or when the main processor 121 is in an active (eg, executing an application) state. While together with the main processor 121 , at least one of the components 130 - 196 of the electronic device 101 (eg, the display device 160 , the sensor module 176 , or the communication module 190 ) ) can control at least some of the related functions or states. According to one embodiment, the co-processor 123 (eg, image signal processor or communication processor) is implemented as some component of another functionally related component (eg, camera module 180 or communication module 190). can be According to an embodiment, the processor 120 may be implemented as a system on chip (SoC) or a system in package (SiP).

The memory 130 includes various data used by at least one component (eg, the processor 120 or the sensor module 176 ) of the electronic device 101 , for example, a software component (eg, a program ( 140)) and input data or output data for commands related thereto. The memory 130 may include a volatile memory 132 or a non-volatile memory 134 . The volatile memory 132 may include, for example, random access memory (RAM) (eg, DRAM, SRAM, or SDRAM). Non-volatile memory 134 is, for example, one time programmable read-only memory (ROM) (OTPROM), programmable read-only memory (PROM), erasable programmable read-only memory (EPROM), electrically erasable programmable (EEPROM) read-only memory), mask ROM, flash ROM, flash memory, hard drive, or solid state drive (SSD)). In addition, the non-volatile memory may include an internal memory 136 disposed therein, or an external memory 138 in a stand-alone form that can be connected and used only when necessary, depending on the connection type to the electronic device 101 . have. The external memory 138 may include, for example, a hard disk, a floppy disk, a magnetic medium (eg, magnetic tape), an optical recording medium (eg, CD-ROM, DVD, a magneto-optical medium (eg, a floppy disk); It may include a flash drive, compact flash (CF), secure digital (SD), Micro-SD, Mini-SD, extreme digital (xD), multi-media card (MMC), or memory stick. The external memory 138 may be functionally or physically connected to the electronic device 101 through a wired (eg, universal serial bus (USB)) or wireless (eg, Bluetooth).

The program 140 is a software component stored in the memory 130 , for example, a kernel 141 , a library 143 , an application framework 145 , or an application program (interchangeably “application”) 147 . may include.

The input device 150 is a device for receiving commands or data to be used in a component (eg, the processor 120) of the electronic device 101 from the outside (eg, a user) of the electronic device 101, for example, For example, it may include a microphone, mouse, or keyboard. According to an embodiment, the keyboard may include a physical keyboard or a virtual keyboard displayed through the display device 160 .

The display device 160 is a device for visually providing information to a user of the electronic device 101 , and may include, for example, a display, a hologram device, or a projector and a control circuit for controlling the corresponding device. The display may include, for example, a liquid crystal display (LCD), a light emitting diode (LED) display, an organic light emitting diode (OLED) display, a microelectromechanical system (MEMS) display, or an electronic paper display. . The display may be implemented to be flexible, transparent, or to be worn on a part of the body, according to an embodiment. According to one embodiment, the display includes touch circuitry capable of detecting a user's touch, gesture, proximity, or hovering input, or an interchangebly force sensor capable of measuring the intensity of pressure with respect to the touch. can do. The touch circuit or pressure sensor may be implemented integrally with the display, or may be implemented with one or more sensors separate from the display. The holographic device may display a three-dimensional image in the air by using interference of light. The projector may display an image by projecting light onto a screen located inside or outside the electronic device 101 .

The audio module 170 may interactively convert a sound and an electrical signal. According to an embodiment, the audio module 170 acquires a sound through the input device 150 (eg, a microphone) or a sound output device (not shown) included in the electronic device 101 (eg, a speaker or receiver) or an external electronic device (eg, the electronic device 102 (eg, a speaker or headphones) connected to the electronic device 101 by wire or wirelessly).

The sensor module 176 measures or senses an internal operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, altitude, humidity, or brightness) of the electronic device 101, and the measured or sensed An electrical signal or data value corresponding to the state information may be generated. The sensor module 176 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, and a color sensor (eg, an RGB (red, green, blue) sensor). , IR (infrared) sensor, biometric sensor (e.g. iris sensor, fingerprint sensor, or heartbeat rate monitoring (HRM), olfactory (e-nose) sensor, electromyography (EMG) sensor, electroencephalogram (EEG) sensor, electrocardiogram (ECG) sensor), a temperature sensor, a humidity sensor, an illuminance sensor, or an ultra violet (UV) sensor. The sensor module 176 may further include a control circuit for controlling at least one or more sensors included therein. In some embodiments, the sensor module 176 may be controlled by a main processor 121 (eg, an application processor) or a secondary processor 123 (eg, a sensor hub processor) that operates independently of the main processor 121 . can In this case, for example, while the main processor 121 (eg, an application processor) is in a sleep state, the main processor 121 (eg, an application processor) is operated by a separate low-power processor without waking up. At least a part of the operation or state of the sensor module 176 may be controlled.

The interface 177 may provide a means for connecting with an external electronic device (eg, the electronic device 102 ) according to a specified standard. According to an embodiment, the interface 177 includes a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an optical interface, a recommended standard232 (RS-232) interface, and a D-subminiature (D-sub) interface. ) interface, a mobile high-definition link (MHL) interface, an SD card interface, a multi-media card (MMC) interface, or an audio interface.

The connection terminal 178 may physically connect the electronic device 101 and an external electronic device (eg, the electronic device 102 ). According to an embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card, an MMC connector, or an audio connector (eg, a headphone connector).

The haptic module 179 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic sense. The haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 may capture still images and moving images. According to an embodiment, the camera module 180 includes one or more lenses (eg, a wide-angle lens and a telephoto lens, or a front lens and a rear lens), an image sensor, an image signal processor, or a flash (eg, a light emitting diode or a xenon lamp, etc.). ) may be included.

The power management module 188 is a module for managing power supplied to the electronic device 101 , and may be configured as, for example, at least a part of a power management integrated circuit (PMIC).

The battery 189 is a device for supplying power to at least one component of the electronic device 101 , and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

The communication module 190 establishes a wired or wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102 , the electronic device 104 , or the server 108 ), and establishes the established communication channel. It can support performing communication through According to an embodiment, the communication module 190 includes a wireless communication module 192 or a wired communication module 194, and the first network 198 (eg, Bluetooth, WiFi) using a corresponding communication module among them. An external electronic device (such as a direct or local area communication network such as an infrared data association (IrDA)) or a second network 199 (such as a cellular network, the Internet, or a telecommunication network such as a computer network (such as a LAN or WAN)) Example: The first external electronic device 102 , the second external electronic device 104 , or the server 108 may communicate.

The wireless communication module 192 may support, for example, cellular communication, short-range wireless communication, or global navigation satellite system (GNSS) communication. Cellular communication is, for example, Long-Term Evolution (LTE), LTE Advance (LTE-A), code division multiple access (CDMA), wideband CDMA (WCDMA), universal mobile telecommunications system (UMTS), Wireless Broadband (WiBro). ), or GSM (Global System for Mobile Communications). Short-range wireless communication, for example, WiFi (wireless fidelity), WiFi Direct, LiFi (light fidelity), Bluetooth, Bluetooth low energy (BLE), Zigbee (Zigbee), NFC (near field communication), magnetic secure transmission (Magnetic Secure) Transmission), radio frequency (RF), or body area network (BAN). The GNSS may include, for example, Global Positioning System (GPS), Global Navigation Satellite System (Glonass), Beidou Navigation Satellite System (hereinafter, “Beidou”) or Galileo, the European global satellite-based navigation system. Hereinafter, in this document, “GPS” may be used interchangeably with “GNSS”.

According to an embodiment, when the wireless communication module 192 supports cellular communication, for example, the electronic device 101 in a communication network using a subscriber identification module (eg, a SIM card) 196 . can be distinguished and authenticated. According to an embodiment, the wireless communication module 192 may include a communication processor (CP) independently operated from the processor 120 (eg, an application processor (AP)). In this case, the communication processor may, for example, act on behalf of the processor 120 while the processor 120 is in an inactive (eg, sleep) state, or the processor 120 while the processor 120 is in an active state. together, at least some functions of functions related to at least one of the components 130 to 196 of the electronic device 101 may be performed. According to an embodiment, the wireless communication module 192 may include a plurality of communication modules supporting only a corresponding communication method among a cellular communication module, a short-range wireless communication module, or a GNSS communication module.

The wired communication module 194 may include, for example, a communication processor supporting a wired communication scheme such as a local area network (LAN), power line communication, or plain old telephone service (POTS).

Some of the components 120 to 196 use a communication method between peripheral devices (eg, a bus, general purpose input/output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)). can be connected to each other to exchange signals (such as commands or data) with each other.

According to an embodiment, the command or the data may be transmitted or received between the electronic device 101 and the second external electronic device 104 through the server 108 connected to the second network. Each of the first and second external electronic devices 102 and 104 may be the same as or different from the electronic device 101 . According to an embodiment, all or part of the operations executed by the electronic device 101 may be executed by one or a plurality of external electronic devices (eg, the electronic devices 102 and 104 , or the server 108 ). According to an embodiment, when the electronic device 101 needs to perform a function or service automatically or upon request, the electronic device 101 performs the function or service associated therewith instead of or in addition to executing the function or service itself. At least some functions may be requested from another device (eg, the electronic device 102, 104, or the server 108) The other electronic device that has received the request (eg, the electronic device 102, 104, or the server) 108)) executes the requested function or additional function, and transmits the result to the electronic device 101. The electronic device 101 provides the requested function or service by processing the received result as it is or additionally. For this purpose, for example, cloud computing, distributed computing, or client-server computing technology may be used.

2 illustrates an appearance of an electronic device according to an exemplary embodiment.

Referring to FIG. 2 , according to an embodiment, the display (or display panel) 210 and the housing 220 may be exposed on the front surface of the electronic device 201 . According to an embodiment, the electronic device 201 may include various hardware modules not shown. For example, a pressure sensor for sensing the intensity (or pressure) of a user's touch input and/or a biometric sensor for detecting the user's fingerprint may be disposed on the rear surface of the display 210 .

According to an embodiment, the electronic device 201 may detect the user's fingerprint through the second area 212 of the display 210 . To this end, a biosensor for detecting the fingerprint may be disposed on the rear surface of the second region 212 of the display 210 .

According to various embodiments of the present disclosure, even if the biometric sensor is disposed on the rear surface of the display 210 , it is possible to accurately obtain the user's fingerprint information by maintaining an appropriate distance from the display 210 , and to prevent the inflow of foreign substances outside the biometric sensor. It is possible to provide a structure of a sensor package capable of preventing performance degradation caused by the present invention.

The electronic device 201 in FIG. 2 is an example and is not limited to the example described above. For example, a receiver, a camera module, an iris sensor, and other biometric sensors may be disposed on the rear surface of the display 210 .

3 is an exploded perspective view of an electronic device according to an exemplary embodiment.

Referring to FIG. 3 , the electronic device 301 (eg, the electronic device 201 ) according to an embodiment includes a cover glass 310 , a display (or a display panel) 320 (eg, the display 210 ). , a pressure sensor 330 , a biometric sensor module 340 (eg, a fingerprint sensor), a housing 350 (eg, the housing 220 ), a circuit board 360 , a battery 370 , and a back cover ) (380). According to various embodiments, the electronic device 301 may not include some components illustrated in FIG. 3 , or may additionally include components not illustrated in FIG. 3 .

The cover glass 310 may transmit light generated by the display 320 . Also, on the cover glass 310 , the user may perform a touch (including contact using an electronic pen) by touching a part of the body (eg, a finger). The cover glass 310 is formed of, for example, tempered glass, reinforced plastic, a flexible polymer material, etc. to protect each component included in the display 320 and the electronic device 301 from external impact. can protect According to various embodiments, the cover glass 310 may also be referred to as a glass window.

The display 320 may be disposed or coupled under the cover glass 310 to be exposed through at least a portion of the cover glass 310 . The display 320 may output content (eg, text, image, video, icon, widget, or symbol) or receive a touch input or an electronic pen input from a user.

According to an embodiment, the display 320 may include a display panel, a touch sensor, and/or an electronic pen sensor. The display panel comprises, for example, a liquid crystal display (LCD) panel, a light emitting diode (LED) display panel, an organic light emitting diode (OLED) display panel, or a microelectromechanical system (MEMS) display panel, or an electronic paper display panel. may include The touch sensor may include a capacitive touch panel, a pressure-sensitive touch panel, a resistive touch panel, an infrared touch panel, or an ultrasonic touch panel. The touch sensor may be inserted between display panels (add-on touch panel), formed directly on the display panel (on-cell touch panel), or included inside the display panel ( in-cell touch panel). The electronic pen sensor (eg, a digitizer) may detect a contact, a gesture, a hovering, etc. from the electronic pen.

According to an embodiment, the display 320 includes a planar area 321 and one side (eg, upper side, lower side, and left side of the planar area 321 ). ) and a bending area extending from the right side 322. The flat area 321 includes pixels of a display panel (eg, OLED, etc.) and a touch sensor. A conductive pattern and/or a conductive pattern of an electronic pen sensor may be disposed, etc. The bending region 322 is electrically connected to the FPCB 323 positioned on the rear surface of the display 320 through various conductive patterns (wirings). can be connected to

According to an embodiment, a portion of the bending region 322 may be folded toward the rear surface of the flat region 321 . According to various embodiments, the wiring of the FPCB 323 may be electrically connected to the circuit board 360 through a designated connector. According to various embodiments, pixels for displaying various information may be disposed in the bending area 322 similar to the flat area 321 depending on the design of the electronic device 301 .

The pressure sensor 330 may be disposed or coupled under the display 320 . For example, the pressure sensor 330 may be disposed between the flat area 321 and the FPCB 323 of the display 320 . The pressure sensor 330 may detect or sense an external (eg, user's finger) pressure (or force) on the cover glass 310 . According to an embodiment, the pressure sensor 330 may include a plurality of electrodes and a dielectric layer. For example, the pressure sensor 330 may sense the pressure of the touch based on the capacitance between the first electrode and the second electrode that is changed by the user's touch.

The biometric sensor module 340 (eg, a fingerprint sensor) may be disposed or coupled under the display 320 . For example, the biometric sensor module 340 may be attached to the flat area 321 of the display 320 . According to an embodiment, the pressure sensor 330 may include a sensor arrangement area (or an opening) through which the front and rear surfaces are penetrated for the arrangement of the biometric sensor module 340 . The biosensor module 340 may be inserted into the sensor arrangement region of the pressure sensor 330 to be disposed in parallel with the pressure sensor 330 .

The biometric sensor module 340 may sense the user's biometric information (eg, fingerprint information). The biometric sensor module 340 may include, for example, an optical biometric sensor. For example, the biosensor module 340 uses a built-in image sensor (eg, a complementary metal oxide semiconductor image sensor (CMOS) or a complementary metal oxide semiconductor image sensor (CCD)) to capture a user's fingerprint image. can do. A unique fingerprint minutiae of a fingerprint may be extracted from the fingerprint image, and the fingerprint minutiae may be used for user authentication by matching with a previously registered fingerprint minutiae.

The biometric sensor module 340 may acquire fingerprint information by receiving at least some light (eg, light reflected by a user's finger, etc.) among the light output from at least one light emitting device included in the display 320 . have. According to various embodiments, the biometric sensor module 340 includes a light emitting unit and a light receiving unit, outputs light using the light emitting unit, and receives the light reflected by an external object (eg, a finger) to obtain the fingerprint information You may.

The housing 350 may form at least a part of the exterior of the electronic device 301 and accommodate each component included in the electronic device 301 . For example, the housing 350 may form the exterior (eg, an upper side, a lower side, a left side, and/or a right side) exterior of the electronic device 301 . According to various embodiments, the housing 350 may include a plurality of housings. The housing 350 may also be referred to as a rear case or a rear plate. According to an embodiment, at least a portion of the side surface of the housing 350 may be formed of a metal material and used as an antenna structure.

According to an embodiment, the housing 350 may include a bracket. The bracket is made of, for example, a magnesium alloy, and may be disposed below the display 320 and above the circuit board 360 . The bracket may be coupled to the display 320 and the circuit board 360 to physically support them.

According to an embodiment, the circuit board 360 may be disposed below the housing 350 (or above the housing 350 ). In the circuit board 360 , various electronic components, devices, printed circuits, etc. (eg, a processor, a memory, a communication circuit, etc.) of the electronic device 301 may be mounted or arranged. According to various embodiments, the circuit board 360 may be referred to as a main board, a printed board assembly (PBA), or simply a PCB. The circuit board 360 may include, for example, a main circuit board and a sub circuit board. According to an embodiment, the main circuit board and the sub circuit board may be electrically connected to each other through a designated connector or a designated wiring. The circuit board 360 may be implemented as, for example, a rigid printed circuit board (rigid PCB) and/or FPCB.

The battery 370 may convert chemical energy and electrical energy in both directions. For example, the battery 370 converts chemical energy into electrical energy, and converts the electrical energy into various components connected to the display 320 , the pressure sensor 330 , the biometric sensor module 340 and the circuit board 360 , or module can be supplied. According to an embodiment, the circuit board 360 may include a power management module (eg, a power management integrated circuit (PMIC)) for managing charging and discharging of the battery 370 .

The rear cover 380 may be coupled to the rear surface of the electronic device 301 . The rear cover 380 may be formed of tempered glass, plastic injection molding, and/or metal. According to various embodiments, the rear cover 380 may be implemented integrally with the housing 350 or may be implemented to be detachable by a user.

4A and 4B illustrate a coupling structure of an electronic device according to an exemplary embodiment.

The electronic device 401 illustrated in FIGS. 4A and 4B is, for example, a perspective view of the electronic device 401 when viewed from the rear.

Referring to FIG. 4A , an electronic device 401 (eg, the electronic device 301 of FIG. 3 ) according to an embodiment has a display (or display panel) 420 (eg, the display 320 of FIG. 3 ). and a pressure sensor 430 (eg, the pressure sensor 330 of FIG. 3 ). Referring to FIG. 4B , the electronic device 401 (eg, the electronic device 301 of FIG. 3 ) according to an embodiment further includes a biosensor module 440 (eg, the biosensor module 340 of FIG. 3 ). may include

According to an embodiment, the display 420 may include a panel layer 421 and a layer 425 . According to an embodiment, the panel layer 421 may include at least one light emitting device. According to an embodiment, the panel layer 421 may include at least one hole or gap through which light of a specific wavelength band may be transmitted. For example, the panel layer 421 may include at least one gap between the plurality of pixels and the wirings. The reflected light output from the panel layer 421 and reflected on the user's finger may pass through at least one gap included in the panel layer 421 to reach the biosensor module 440 . According to an embodiment, the layer 425 may be disposed to face the rear surface of the panel layer 421 . According to an embodiment, the layer 425 may include a sensor arrangement area 427 for accommodating the biosensor module (eg, the biosensor module 340 of FIG. 3 ). The sensor arrangement area 427 may be of a form in which front and rear surfaces are penetrated so as to face a partial area of the panel layer 421 in a state in which the biosensor module is inserted.

Referring to the enlarged image 5 of the partial region 3 of the layer 425 , the layer 425 may include a first layer 425 - 1 and a second layer 425 - 2 . According to an embodiment, the sizes of the penetration regions (or openings) formed in each of the first layer 425 - 1 and the second layer 425 - 2 may be different from each other. For example, the area of the penetration region of the second region 425 - 2 may be larger than the area of the penetration region of the first layer 425 - 1 .

According to an embodiment, the display 420 may include a circuit board 423 (eg, the FPCB 323 of FIG. 3 ) on which a display IC and/or a touch sensor IC are disposed. According to an embodiment, the circuit board 423 may extend from one side (eg, a lower side) of the panel layer 421 and may be electrically connected to the panel layer 421 .

According to an embodiment, the pressure sensor 430 may include a sensor arrangement area 431 for accommodating the biosensor module 340 . The sensor arrangement area 431 of the pressure sensor 430 may have a front and rear surface through which it faces a partial area of the panel layer 421 in a state in which the biosensor module is inserted. According to an embodiment, the area of the sensor arrangement area 431 of the pressure sensor 430 may be greater than or equal to the area of the sensor arrangement area 427 of the layer 425 .

According to an embodiment, the circuit board 423 is folded in the rear direction of the layer 425 so as to overlap with at least a portion of the layer 425 and the pressure sensor 430 to the layer 425 and the pressure sensor 430 . can be attached.

Referring to FIG. 4B , the biosensor module 440 (eg, the biosensor module 340 of FIG. 3 ) may be attached to the rear surface of the display 420 . For example, one surface of the biosensor module 440 passes through the pressure sensor 430 and the second layer 425 - 2 of the layer 425 and is attached to the first layer 425 - 1 of the layer 425 . can be

5 is a cross-sectional view of an electronic device according to an exemplary embodiment.

The cross-sectional view shown in FIG. 5 corresponds to a cross-sectional view in a state in which the biosensor module (eg, the biosensor module 340 of FIG. 3 ) is not attached to the display 520 . Referring to FIG. 5 , an electronic device 501 (eg, the electronic device 301 of FIG. 3 ) includes a cover glass 510 (eg, the cover glass 310 of FIG. 3 ), a display (or a display panel) ( 520) (eg, the display 320 of FIG. 3 ) and a pressure sensor 530 (eg, the pressure sensor 330 of FIG. 3 ).

The cover glass 510 may be located on a top layer of the electronic device 501 . The display 520 may be disposed under the cover glass. The display 520 may include a panel layer 521 (eg, a panel layer 421 ) and a layer 525 (eg, a layer 425 ). According to an embodiment, the panel layer 521 may include at least one light emitting device and may be disposed under the cover glass 510 . According to an embodiment, the layer 525 may be disposed under the panel layer 521 . According to an embodiment, the layer 525 includes a first layer 525-1 (eg, a first layer 425-1) and a second layer 525-2 (eg, a second layer 425-2). )) may be included. The first layer 515 - 1 includes, for example, a patterned support member 51 , a digitizer (or electronic pen sensor) 53 that receives an input from an electronic pen, and a metal layer 55 (eg, : copper layer) may be included. The support member 51 may absorb an external impact on the panel layer 521 , improve optical properties, and visually cover the pattern included in the digitizer 53 . The second layer 515 - 2 may include, for example, a heat dissipation layer 57 performing a heat dissipation function and a cushion layer 59 absorbing an external shock. The stacked structure of the first layer 515-1 and the second layer 515-2 shown in FIG. 5 is only an example, and the layer 525 does not include some of the plurality of layers shown in FIG. , at least one other layer may be further included, or the positions of at least some of the plurality of layers may be changed. For example, the layer 515 may not include the digitizer 53 and the metal layer 55 shown in FIG. 5 . As another example, the layer 515 may not include the support member 51 and the heat dissipation sheet 57 .

According to an embodiment, the sizes of the through regions (or openings) formed in each of the first layer 525 - 1 and the second layer 525 - 2 may be different from each other. For example, the width w2 of the penetrating region of the second region 525 - 2 may be greater than the width w1 of the penetrating region of the first layer 525 - 1 . Accordingly, the layer 525 may form a stepped structure formed by the first layer 525 - 1 and the second layer 525 - 2 .

According to an embodiment, the pressure sensor 530 may be disposed under the layer 525 . According to an embodiment, a circuit board 523 may be disposed under the pressure sensor 530 . The circuit board 523 extends from one side of the display 520 (eg, the panel layer 521 ) and is folded toward the rear side of the layer 525 as described with reference to FIG. 4A , for example, as a pressure sensor. 530 may be attached. According to an embodiment, the electronic device 501 may not include the pressure sensor 530 .

6 illustrates a package structure of a biosensor module according to an embodiment.

The image <61> of FIG. 6 shows a perspective view of a biosensor module (eg, a fingerprint sensor) 640 (eg, the biosensor module 340 of FIG. 3), and the image is a view of the biosensor module 640 A front view is shown, and the image shows a rear view of the biosensor module 640 .

Referring to FIG. 6 , the biosensor module 640 includes a circuit board 641 , a housing 642 , an image sensor (or an image sensor array) 643 , an optical layer 644 , an optical filter layer 645 , and an adhesive member. 646 , a conductive wire 647 , and a magnetic screen layer 648 (eg, magnetic metal powder sheet). The image sensor 643 and the optical layer 644 (and the optical filter layer 645 ) may be combined into one package structure, for example, may be referred to as a biosensor. According to various embodiments, the biosensor module 640 may not include some components illustrated in FIG. 6 , or may additionally include components not illustrated in FIG. 6 .

According to an embodiment, the circuit board 641 may include a rigid printed circuit board (RPCB) 641-1 and a flexible printed circuit board (FPCB) 641-2. The rigid printed circuit board 641-1 may include a passive element, a printed circuit, and a sensor IC for controlling the biosensor. The passive element, the printed circuit, and the sensor IC may be disposed, for example, on the rear surface of the rigid printed circuit board 641 . The flexible printed circuit board 641-2 may extend from one side of the rigid printed circuit board 641-1. The flexible printed circuit board 641-1 (or the connection part) is electrically connected to another circuit board (eg, the circuit board 423 of FIG. 4A ) while being attached to the display (eg, the display 420 of FIG. 4A ). can be connected

According to an embodiment, the housing 642 may be disposed on one surface (eg, an upper surface) of the circuit board 641 . According to an embodiment, the housing 642 may include an opening. At least a partial area (eg, all) of the upper surface of the housing 642 may be opened so that the housing 642 may have a sidewall shape surrounding the biosensor. For example, the housing 642 may have a 'ㅁ' shape surrounding the biometric sensor when the upper surface of the biosensor module 640 is viewed. For another example, the housing 642 may have a 'C' shape or an '11' shape in which a portion of the periphery of the biosensor is opened when the upper surface of the biosensor module 640 is viewed. In a state in which the biometric sensor module is attached to a display (eg, the display 420 of FIG. 4A ), the biometric sensor may face one surface of the display through the opening. The housing 642 may include, for example, a polymer material such as epoxy and/or a metal material such as stainless steel or aluminum.

According to an embodiment, the biosensor (eg, the image sensor 643 , the optical layer 644 , and the optical filter layer 645 ) may be disposed on one surface (eg, an upper surface) of the circuit board 641 . The biometric sensor may be disposed within the housing 642 . For example, the biometric sensor may be disposed within the housing 642 through an opening in the housing 642 .

According to an embodiment, the image sensor (eg, CMOS, CCD) 643 may be disposed on one surface (eg, top surface) of the circuit board 641 . The image sensor 643 may be, for example, an array-type image sensor in which a plurality of image sensors are disposed at predetermined intervals. The image sensor 643 may acquire fingerprint information (or a fingerprint image) by using the reflected light reflected by the user's finger.

According to an embodiment, the optical layer 644 may be disposed on the image sensor. The optical layer 644 may, for example, improve optical properties of reflected light reflected by an external object (eg, a finger) and refract the reflected light to improve light reception efficiency of the image sensor 643 .

According to an embodiment, the optical filter layer 645 may be disposed on the optical layer 644 . According to an embodiment, the optical filter layer 645 may be disposed on at least a partial region of the optical layer 644 . The optical filter layer 645 may transmit, for example, only light of a specific wavelength (eg, visible light) among reflected light reflected by an external object (eg, a finger). For example, the optical filter layer 645 may pass well a wavelength required by the image sensor 643 to obtain fingerprint information or a hole formed in the panel layer of the display (eg, the panel layer 421 in FIG. 4A ). Only light of a certain wavelength (eg green light) can be transmitted. According to an embodiment, the optical filter layer 645 may include a polyethylene terephthalate (PET) film.

According to an embodiment, the adhesive member 646 may be disposed on one surface (eg, an upper surface) of the housing 642 . The adhesive member 646 may attach the biosensor module 640 to the display as it is attached to one surface (eg, a rear surface) of the display.

According to an embodiment, the conductive wire 647 may electrically connect the circuit board 641 and the biosensor (eg, the image sensor 643 ). The conductive wire 647 may include, for example, a plurality of wires connecting the circuit board 641 and the image sensor 643 . The fingerprint information obtained by the image sensor 643 may be transmitted to the sensor IC disposed on the circuit board 641 through the conductive wire 647 .

According to an embodiment, the shielding layer 648 may be attached to one surface (eg, a rear surface) of the circuit board 641 . The shielding layer 648 may include, for example, magnetic powder and/or metal powder. As the shielding layer 648 forms a sensor arrangement area in the layer of the display (eg, the layer 425 of FIG. 4A ), a hole may be generated in a partial area of the digitizer included in the layer. The shielding layer 648 may compensate for a change in a magnetic field caused by a hole formed in the layer to prevent deterioration of the performance of the digitizer. When the layer does not include a digitizer, the shielding layer 648 may be omitted.

7A is a cross-sectional view of a biosensor module according to an exemplary embodiment.

Referring to FIG. 7A , the biosensor module 701 (eg, the biosensor module 640 of FIG. 6 ) includes a circuit board 741 (eg, the circuit board 641 ), a housing 742 (eg, a housing 642 ). )), image sensor (or image sensor array) 743 (eg, image sensor 643), optical layer 744 (eg, optical layer 644), optical filter layer 745 (eg, optical filter layer) 645), an adhesive member 746 (eg, an adhesive member 646), a conductive wire 747 (eg, a conductive wire 647), a magnetic screen layer 748 (eg, a shielding layer) 648 ) and a protective member 749 .

According to an embodiment, the housing 742 and the image sensor 743 may be disposed on the circuit board 741 . For example, the housing 742 and the image sensor 743 may be attached to the circuit board 741 by a first adhesive film (eg, a die attach film (DAF)) 71 .

According to an embodiment, the optical filter layer 745 may be disposed on at least a partial region of the optical layer 744 . For example, the optical filter layer 745 may be formed by the second adhesive film (eg, an optically clear adhesive (OCA) film, an optically clear resin (OCR) film, or a die attach film (DAF)) 73 to form the optical layer 744 . can be attached to The second adhesive film 73 may be transparent to ensure optical properties.

According to an embodiment, the protective member 749 is formed by the housing 742 and the biometric sensor (eg, the image sensor 743 , the optical layer 744 and the optical filter layer 745 ) and the circuit board 741 . It is disposed in the space to fix the housing 742 and the biosensor. According to an embodiment, the protection member 749 may surround the conductive wire 747 to fix the conductive wire 747 and protect it from the outside. The conductive wire 747 may be completely blocked from the outside by the protection member 749 . The protection member 749 may include, for example, an epoxy resin or silicone.

According to an embodiment, the height h1 from the circuit board 741 to the adhesive member 746 may be greater than or equal to the height h2 from the circuit board 741 to the optical layer 744 . Accordingly, the biometric sensor may be blocked from the outside while the biometric sensor module 701 is attached to the display (eg, the display 320 of FIG. 3 ).

7B is a cross-sectional view of a biosensor module according to an exemplary embodiment.

Referring to FIG. 7B , the biosensor module 703 (eg, the biosensor module 640 of FIG. 6 ) includes a main circuit board 741 , a sub circuit board 79 , a housing 742 , an image sensor (or an image). sensor array) 743 , an optical layer 744 , an optical filter layer 745 , an adhesive member 746 , a conductive wire 747 , a shielding layer 748 , and a protection member 749 .

According to an embodiment, the sub circuit board 79 may be disposed on the main circuit board 741 . For example, the sub circuit board 79 may be attached to the main circuit board 741 by at least one third adhesive member 75 . According to an embodiment, the third adhesive member 75 may include, for example, a conductive material, and may electrically connect the main circuit board 741 and the sub circuit board 79 . For example, the third adhesive member 75 may include conductive epoxy or solder.

According to an embodiment, the image sensor 743 may be disposed on the sub circuit board 79 . For example, the image sensor 743 may be attached to the sub circuit board 79 by a first adhesive film (eg, a die attach film (DAF)) 71 .

8 illustrates a part of a package structure of a biosensor module according to an exemplary embodiment.

The image <81> of FIG. 8 shows a perspective view of the first side corner part when looking at the rear side of the biosensor module (eg, the biosensor) 840 (eg, the biosensor module 640). denotes a rear view of the first side corner of the biosensor module 840, and the image shows a rear view of the second side corner of the biosensor module 840.

Referring to FIG. 8 , the biosensor module 840 includes a circuit board 841 (eg, circuit board 641), a housing 842 (eg, housing 642), and an adhesive member 846 (eg, an adhesive member). 646 ) and a shielding layer 848 (eg, a shielding layer 648 ). According to an embodiment, a portion of the housing 842 may protrude to the outside of the circuit board 841 . For example, the edge of the circuit board 841 may have an inwardly concave shape, and the edge of the housing 842 may protrude to the outside of the circuit board 841 . According to another embodiment, the housing 842 may be located inside (or at the same position) of the circuit board 841 in all areas.

As the boundary line of the edge of the circuit board 841 is located inside the boundary line of the edge of the housing 842 , the second adhesive member (eg, the second adhesive member 92 in FIG. 9 ) is applied when the second adhesive member is applied. The adhesive member can be effectively applied to the area between the biosensor module 840 and the display by flowing down the housing 842 at the corner.

9 is a cross-sectional view of an electronic device according to an exemplary embodiment.

The cross-sectional view shown in FIG. 9 corresponds to a cross-sectional view in a state in which the biometric sensor module 940 is attached to the display 920 . Referring to FIG. 9 , the electronic device 901 (eg, the electronic device 301 of FIG. 3 ) includes a cover glass 910 (eg, the cover glass 310 of FIG. 3 ), a display (or a display panel) ( 920 (eg, display 320 of FIG. 3 ), pressure sensor 930 (eg, pressure sensor 330 of FIG. 3 ), and biometric sensor module 940 (eg, biometric sensor module 340 of FIG. 3 ). ) may be included.

According to an embodiment, the biosensor module 940 includes a sensor arrangement area (eg, the sensor arrangement area 427 of FIG. 4A ) formed in the display 920 and a sensor arrangement area (eg, FIG. 4A ) formed in the pressure sensor 930 . It may be attached to the rear surface of the display 920 through the sensor arrangement area 431 of 4a). For example, the first adhesive member 946 (eg, the adhesive member 646 ) of the biosensor module 940 may include the first layer 925 - 1 (eg, the layer 425 ) of the layer 925 . : It may be attached to one surface (eg, a rear surface) of the first layer 425 - 1 ). In a state where the biometric sensor module 940 is attached to the display 920 , the biometric sensor (eg, the image sensor 943 (eg, the image sensor 643 )), the optical layer 944 (eg, the optical layer 644 )) and the optical filter layer 945 (eg, the optical filter layer 645) may face the panel layer 921 (eg, the panel layer 421). According to an embodiment, the performance of the biosensor module 940 The optical filter layer 945 may be disposed to be spaced apart from the panel layer 921 by a specified interval h3 to secure the .

According to an embodiment, the electronic device 901 may include a second adhesive member 92 for attaching the biometric sensor module 940 to the display 920 . The second adhesive member 92 may be inserted between the outer surface of the housing 942 and the inner surface of the layer 925 to fix the biosensor module 940 to the display 920 . The biosensor module 940 is doublely attached to the display 920 by the first adhesive member 946 and the second adhesive member 92 , so that the attachment force of the biosensor module 940 may be improved. According to an embodiment, the second adhesive member 92 may include a UV adhesive that can be cured by UV light, such as UV (ultraviolet rays) ink or UV curable resin.

In the embodiment described with reference to FIG. 9 , it has been described that the biosensor module 940 is attached to the display 920 by the first adhesive member 946 , but the biosensor module 940 is compressed without the adhesive member 946 . It may also be attached to the display 920 as a result or may be attached to the display 920 through an additional mechanical fixing method (eg, screws, fixing grooves, fixing members, etc.).

10A and 10B illustrate a manufacturing process of a biometric sensor according to an exemplary embodiment.

Referring to the <1001> image and the <1002> image of FIG. 10A , the biosensor module 1040 (eg, the biosensor module 640 of FIG. 6 ) may include a circuit board 1041 (eg, the circuit board of FIG. 6 ) 641 ) and a housing 1042 (eg, housing 642 of FIG. 6 ). The housing 1042 may be disposed on the upper surface of the circuit board 1041 and include an opening 1091 . Referring to the <1003> image and the <1004> image of FIG. 10A , a biometric sensor (eg, an image sensor 1043 (eg, the image sensor 643 of FIG. 6 )) and an optical layer ( 1044 (eg, optical layer 645 of FIG. 6 ) may be disposed. For example, the image sensor 1043 may be disposed on at least a portion of the opening 1091 of the housing 1042 , and the optical layer 1044 may be disposed on at least a portion of the image sensor 1043 . Referring to the <1005> image and the <1006> image of FIG. 10A , in a state where the biometric sensor is disposed on the circuit board 1041 , the circuit board 1041 and the image sensor 1043 are connected with a conductive wire 1047 (eg: It may be electrically connected using the conductive wire 647 of FIG. 6 ). The circuit board 1041 and the image sensor 1043 may be electrically connected through, for example, a plurality of conductive wires.

Referring to the <1007> image and the <1008> image of FIG. 10B , an optical filter layer 1045 (eg, the optical filter layer 645 of FIG. 6 ) may be disposed on the upper surface of the optical layer 1044 . The optical filter layer 1045 may be disposed on at least a portion of the optical layer 1044 . The optical filter layer 1045 may be attached to the optical layer 1044 by, for example, an optically clear adhesive (OCA) film. Referring to the <1009> image and the <1010> image of FIG. 10B, a housing 1042, a biosensor (eg, an image sensor 1043, an optical layer 1044, and an optical filter layer 1045) and a circuit board 1041 A protection member 1049 (eg, the protection member 739 of FIG. 7 ) may be disposed in the space formed. According to an embodiment, the protection member 1049 may be formed to completely surround the conductive wire 1047 so that the conductive wire 1047 is blocked from the outside. According to an embodiment, a shielding layer 1048 (eg, the shielding layer 648 of FIG. 6 ) may be attached to the rear surface of the circuit board 1041 . Referring to the <1011> image and the <1012> image of FIG. 10B , an adhesive member 1046 may be disposed on at least a partial area of the housing 1042 . The biometric sensor 1040 may be attached to the rear surface of the display (eg, the display 320 of FIG. 3 ) through the adhesive member 1046 .

The electronic device according to various embodiments disclosed in this document may have various types of devices. Electronic devices include, for example, portable communication devices (such as smartphones), computer devices (such as personal digital assistants (PDAs), tablet personal computers (PCs), laptop PCs, desktop PCs, workstations, or servers); It may include at least one of a portable multimedia device (eg, an e-book reader or an MP3 player), a portable medical device (eg, a heart rate, blood sugar, blood pressure, or body temperature monitor), a camera, or a wearable device. A wearable device may be an accessory (e.g., watch, ring, bracelet, anklet, necklace, glasses, contact lens, or head-mounted-device (HMD)); It may include at least one of a body-worn (eg, skin pad or tattoo) or bioimplantable circuit In some embodiments, the electronic device may include, for example, a television, a digital video disk (DVD) player; Audio devices, audio accessory devices (such as speakers, headphones, or headsets), refrigerators, air conditioners, vacuums, ovens, microwaves, washing machines, air purifiers, set-top boxes, home automation control panels, security control panels, game consoles, It may include at least one of an electronic dictionary, an electronic key, a camcorder, and an electronic picture frame.

In another embodiment, the electronic device is a navigation device, a global navigation satellite system (GNSS), an event data recorder (EDR) (eg, a black box for a car, a ship, or a plane), a car infotainment device ( For example: automotive heads-up displays, industrial or domestic robots, drones, automated teller machines (ATMs), point of sales (POS) instruments, metering instruments (such as water, electricity, or gas metering instruments); or Internet of Things (IoT) devices (eg, light bulbs, sprinkler devices, fire alarms, thermostats, or street lights). The electronic device according to the embodiment of this document is not limited to the above-described devices, and, for example, as in the case of a smartphone equipped with a function of measuring personal biometric information (eg, heart rate or blood sugar), a plurality of electronic devices The functions of the devices may be provided in a complex manner. In this document, the term user may refer to a person who uses an electronic device or a device (eg, an artificial intelligence electronic device) using the electronic device.

The various embodiments of this document and the terms used therein are not intended to limit the technology described in this document to a specific embodiment, but it should be understood to cover various modifications, equivalents, and/or substitutions of the embodiments. In connection with the description of the drawings, like reference numerals may be used for like components. The singular expression may include the plural expression unless the context clearly dictates otherwise. In this document, expressions such as “A or B”, “at least one of A and/or B”, “A, B or C” or “at least one of A, B and/or C” refer to all of the items listed together. Possible combinations may be included. Expressions such as "first," "second," "first," or "second," can modify the corresponding elements, regardless of order or importance, and to distinguish one element from another element. It is used only and does not limit the corresponding components. When an (eg, first) component is referred to as being “connected (functionally or communicatively)” or “connected” to another (eg, second) component, that component is It may be directly connected to the component or may be connected through another component (eg, a third component).

In this document, "adapted to or configured to" is, depending on the context, for example, hardware or software "suitable for," "having the ability to," "modified to, Can be used interchangeably with ""made to," "capable of," or "designed to." In some circumstances, the expression “a device configured to” may mean that the device is “capable of” with other devices or parts. For example, the phrase “a processor configured (or configured to perform) A, B, and C” refers to a processor dedicated to performing the operations (eg, an embedded processor), or one stored in a memory device (eg, memory 130). By executing the above programs, it may refer to a general-purpose processor (eg, a CPU or an application processor) capable of performing corresponding operations.

As used herein, the term “module” includes a unit composed of hardware, software, or firmware, and may be used interchangeably with terms such as, for example, logic, logic block, component, or circuit. A module may be an integrally formed part or a minimum unit or a part of one or more functions. For example, a module may be comprised of application-specific integrated circuits (ASICs) or field-programmable gate arrays (FPGAs).

At least a part of the apparatus or method according to various embodiments may be implemented as instructions stored in a computer-readable storage medium (eg, the internal memory 136 or the external memory 138) in the form of a program. When the instruction is executed by a processor (eg, the processor 120), the processor may directly or use other components under the control of the processor to perform a function corresponding to the instruction. Instructions may include code generated or executed by a compiler or interpreter.

Each of the components (eg, a module or a program) according to various embodiments may be composed of a singular or a plurality of entities, and some sub-components of the aforementioned sub-components may be omitted, or other sub-components may be included. may include more. Alternatively or additionally, some components (eg, a module or a program) may be integrated into a single entity to perform the same or similar functions performed by each corresponding component prior to integration. According to various embodiments, operations performed by a module, program, or other component are executed sequentially, parallel, iteratively, or heuristically, or at least some operations are executed in a different order, are omitted, or other operations are added. can be

Claims (23)

A mobile electronic device comprising:
a display panel having a plurality of layers including a front panel having a plurality of pixels and a metal sheet layer having a first opening formed therein;
a housing structure having a second opening;
a biosensor disposed under the display panel through the housing structure, wherein an upper surface of the biosensor is provided through at least a portion of the second opening of the housing structure and the first opening of the metal sheet layer, the rear surface of the front panel Faced on -,
a first flexible printed circuit board (FPCB) electrically coupled to the biosensor, wherein the first FPCB is disposed below the biosensor and at least partially overlaps the housing structure;
A metal layer integrally formed on the rear surface of the first FPCB and overlapping at least partially with the bio-sensor and the housing structure;
The upper surface of the biosensor is spaced apart from the rear surface of the front panel through an empty space formed by at least a portion of the second opening of the housing and the first opening of the metal sheet layer,
In the mobile electronic device, the light irradiated by a portion of the plurality of pixels is reflected by a finger positioned on the front surface of the mobile electronic device, and before being received by the bio-sensor, the first panel of the front panel and the metal sheet layer A mobile electronic device transmitted through each of a first opening and at least a portion of the second opening of the housing structure. The second FPCB according to claim 1, further comprising a second FPCB electrically connected to a layer extending from the display panel, wherein the second FPCB is configured such that the layer extending from the display panel is bent to form the second FPCB on the rear surface of the display panel. and a third opening overlapping the area where the biometric sensor is placed when the FPCB is placed. 3. The method of claim 2,
the housing structure is attached to at least a portion of the upper surface of the first FPCB by an adhesive;
The biometric sensor is at least partially disposed in the second opening of the housing structure, and a signal related to biometric information passes through the display panel to reach an upper surface of the biometric sensor. According to claim 1,
the housing structure is attached to at least a portion of the upper surface of the first FPCB by an adhesive;
The biometric sensor is at least partially disposed in the second opening of the housing structure, and a signal related to biometric information passes through the display panel to reach an upper surface of the biometric sensor. According to claim 1,
the housing structure is attached to at least a portion of the rear surface of the display panel by an adhesive at the periphery of the second opening;
The biometric sensor is at least partially disposed in the second opening of the housing structure, and a signal related to biometric information passes through the display panel to reach an upper surface of the biometric sensor. A mobile electronic device comprising:
a display panel each including a front panel having a plurality of pixels and a metal sheet layer having a first opening formed therein;
a biosensor disposed under the display panel, an upper surface of the biosensor being spaced apart from the front panel through an empty space in an area in which the first opening in the metal sheet layer is provided;
a first flexible printed circuit board (FPCB) electrically connected to the display panel and disposed on a rear surface of the display panel, wherein the first FPCB has a shape of an empty area corresponding to at least a portion provided with the biometric sensor;
In the mobile electronic device, the light irradiated by a portion of the plurality of pixels is reflected by a finger positioned on the front surface of the mobile electronic device, and before being received by the biosensor, the front panel and the metal sheet layer A mobile electronic device transmitted through each of the first opening and the blank area. 7. The method of claim 6,
The first FPCB is electrically connected to a layer extending from the display panel, and the layer extending from the display panel is bent so that the first FPCB is disposed on a rear surface of the display panel. 8. The method of claim 7,
a second FPCB disposed under the bio-sensor and electrically connected to the bio-sensor;
The mobile electronic device further comprising a; a metal layer integrally formed on the rear surface of the second FPCB and at least partially overlapping the bio-sensor when viewed from above. 7. The method of claim 6,
a second FPCB disposed under the bio-sensor and electrically connected to the bio-sensor;
The mobile electronic device further comprising a; a metal layer integrally formed on the rear surface of the second FPCB and at least partially overlapping the bio-sensor when viewed from above. The mobile electronic device of claim 9 , wherein the first FPCB is electrically connected to a layer extending from the display panel, and the layer extending from the display panel is bent so that the first FPCB is disposed on a rear surface of the display panel. Device. 7. The method of claim 6,
a rigid printed circuit board (PCB) disposed under the bio-sensor and electrically connected to the bio-sensor;
and a metal layer integrally formed on the rear surface of the rigid PCB and at least partially overlapping with the biometric sensor when viewed from above. The mobile electronic device of claim 11 , wherein the first FPCB is electrically connected to a layer extending from the display panel, and the layer extending from the display panel is bent so that the first FPCB is disposed on a rear surface of the display panel. Device. The method of claim 6, further comprising a housing structure having a second opening, wherein at least a part of the housing structure is attached to the rear surface of the display panel by an adhesive around the second opening,
The biometric sensor is at least partially disposed in the second opening of the housing structure, and a signal related to biometric information passes through the display panel to reach an upper surface of the biometric sensor. A mobile electronic device comprising:
a display panel having a plurality of layers including a front panel having a plurality of pixels and a sheet layer comprising a metal having a first opening formed therein;
a housing having a second opening, the second opening being formed in the housing through the housing in a direction perpendicular to the display panel;
a biosensor disposed under the display panel through the housing - an upper surface of the biosensor is disposed on the rear surface of the front panel through at least a portion of the second opening of the housing and the first opening of the sheet layer including metal Faced -,
The upper surface of the biosensor is spaced apart from the rear surface of the front panel through an empty space formed by at least a portion of the second opening of the housing and the first opening of the sheet layer including the metal;
a first flexible printed circuit board (FPCB) electrically connected to the display panel and disposed on a rear surface of the display panel, wherein the first FPCB has a blank area corresponding to at least a portion of an area provided with the biometric sensor;
In the mobile electronic device, light irradiated by a portion of the plurality of pixels is reflected by a finger positioned on the front surface of the mobile electronic device, and before being received by the biosensor, the front panel, the metal-containing sheet layer, a mobile electronic device transmitted through each of the first opening, the empty area, and at least a portion of the second opening of the housing. 15. The method of claim 14,
a second FPCB disposed under the bio-sensor and electrically connected to the bio-sensor;
The mobile electronic device further comprising a; a metal layer integrally formed on the rear surface of the second FPCB. The mobile electronic device of claim 15 , wherein the first FPCB is electrically connected to a layer extending from the display panel, and the layer extending from the display panel is bent so that the first FPCB is disposed on a rear surface of the display panel. Device. 17. The method of claim 16, wherein the housing is attached to at least a portion of the upper surface of the second FPCB by an adhesive;
The biometric sensor is at least partially disposed in the second opening of the housing, and a signal related to biometric information passes through the display panel to reach an upper surface of the biometric sensor. 15. The method of claim 14,
a rigid PCB disposed under the bio-sensor and electrically connected to the bio-sensor;
The mobile electronic device further comprising a; a metal layer integrally formed on the rear surface of the rigid PCB. The mobile electronic device of claim 18 , wherein the first FPCB is electrically connected to a layer extending from the display panel, and the layer extending from the display panel is bent so that the first FPCB is disposed on a rear surface of the display panel. Device. 19. The method of claim 18, wherein the housing is attached to at least a portion of the top surface of the rigid PCB by an adhesive;
The biometric sensor is at least partially disposed in the second opening of the housing, and a signal related to biometric information passes through the display panel to reach an upper surface of the biometric sensor. The mobile electronic device of claim 14 , wherein the first FPCB is electrically connected to a layer extending from the display panel, and the layer extending from the display panel is bent so that the first FPCB is disposed on a rear surface of the display panel. Device. 15. The method of claim 14, wherein the housing is attached to at least a portion of the rear surface of the display panel by an adhesive around the second opening,
The biometric sensor is at least partially disposed in the second opening of the housing, and a signal related to biometric information passes through the display panel to reach an upper surface of the biometric sensor. 15. The method of claim 14, wherein the first FPCB is electrically connected with a layer extending from the display panel, and the layer extending from the display panel is bent so that the first FPCB is disposed on a rear surface of the display panel - the the first FPCB comprises a first portion disposed on a first side of the mobile electronic device and a second portion disposed on a second portion of the mobile electronic device;
The biometric sensor includes a fingerprint sensor,
The fingerprint sensor is disposed with respect to the first FPCB,
Light reflected by the fingerprint passes between the first portion and the second portion of the first FPCB before being received by the fingerprint sensor.

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