KR20180114552A - Correction of shapes produced in laminate manufacturing - Google Patents

Abstract

A method of manufacturing a polishing pad using a laminate manufacturing system includes receiving data indicative of a desired shape of a polishing pad to be produced by droplet discharge. The desired shape defines an outline that includes one or more grooves on the polishing pad and the polishing surface. In order to at least partially compensate for the contour distortions caused by the laminate manufacturing system, data representing a modified pattern for dispensing the feed material is generated, and the plurality of layers of feed material are ejected by droplet ejection in accordance with the modified pattern Lt; / RTI >

Description

Correction of shapes produced in laminate manufacturing

This specification relates to laminate manufacturing.

Integrated circuits are typically formed on a substrate by sequential deposition of conductive, semi-conductive or insulating layers on a silicon wafer. Various fabrication processes require planarization of the layers on the substrate. In the case of polishing a metal layer to form vias, plugs, and lines in certain applications, for example, trenches of the patterned layer, the overlying layer may be patterned until the top surface of the patterned layer is exposed Flattened. In other applications, for example planarization of the dielectric layer for photolithography, the overlying layer is polished until the desired thickness remains on the underlying layer.

Chemical mechanical polishing (CMP) is one accepted planarization method. This planarization method typically requires that the substrate be mounted on a carrier head. The exposed surface of the substrate is typically positioned relative to the rotating polishing pad. The carrier head provides a controllable load on the substrate for pressing the substrate against the polishing pad. A polishing liquid, such as a slurry with abrasive particles, is typically supplied to the surface of the polishing pad.

One purpose of the chemical mechanical polishing process is polishing uniformity. If different regions on the substrate are polished at different speeds, it is possible that too much material is removed ("over-polished") or too little material is removed ("under-polished") in some regions of the substrate. In addition to planarization, the polishing pads can be used for finishing operations such as buffing.

Abrasive pads are typically made by molding, casting or sintering polyurethane materials. In the case of molding, the polishing pads can be made one at a time, for example, by injection molding. In the case of casting, a liquid precursor is cast and cured into a cake, which is subsequently sliced into individual pad pieces. These pad pieces can then be machined to final thickness. The grooves may be formed as part of the injection molding process or machined into the polishing surface.

In an aspect, a method of manufacturing a polishing pad using a laminate manufacturing system includes receiving data representative of a desired shape of a polishing pad to be produced by droplet ejection. The desired shape defines an outline that includes one or more grooves on the polishing pad and the polishing surface. In order to at least partially compensate for the contour distortions caused by the laminate manufacturing system, data representing a modified pattern for dispensing the feed material is generated, and the plurality of layers of feed material are ejected by droplet ejection in accordance with the modified pattern Lt; / RTI >

In another aspect, a method of manufacturing an object using a laminate manufacturing system includes receiving data representing a desired shape of an object to be produced by a droplet discharge. The desired shape defines an outline that includes one or more grooves and a top surface. In order to at least partially compensate for the contour distortions caused by the laminate manufacturing system, data representing a modified pattern for dispensing the feed material is generated, and the plurality of layers of feed material are ejected by droplet ejection in accordance with the modified pattern Lt; / RTI >

In another aspect, a computer program product tangibly embodied in a computer-readable medium includes instructions for causing a processor to receive data indicative of a desired shape of a polishing pad to be produced by droplet dispensing in a laminate manufacturing system. The desired shape defines an outline that includes one or more grooves on the polishing pad and the polishing surface. In order to at least partially compensate for the contour distortions caused by the laminate manufacturing system, data representing a modified pattern for dispensing the feed material is generated, and the laminate manufacturing system is configured to dispense the feed material To distribute the plurality of layers.

In yet another aspect, a computer program product tangibly embodied in a computer-readable medium includes instructions for causing a processor to receive data indicative of a desired shape of an object to be produced by droplet dispensing in a laminate manufacturing system. The desired shape defines an outline that includes one or more grooves and a top surface. In order to at least partially compensate for the contour distortions caused by the laminate manufacturing system, data representing a modified pattern for dispensing the feed material is generated, and the laminate manufacturing system is configured to dispense the feed material To distribute the plurality of layers.

In yet another aspect, a laminate manufacturing system includes a platform for holding a polishing pad being manufactured, a printhead for forming a plurality of layers on a platform or on a previously deposited layer of a polishing pad by ejecting droplets, Receiving the data indicative of the desired shape of the polishing pad-the desired shape defining one or more grooves on the polishing pad and the contour comprising the polishing surface, and at least partially compensating for the contour distortions caused by the laminate manufacturing system And a controller configured to cause the printhead to distribute the plurality of layers of feed material by droplet ejection in accordance with the modified pattern.

In yet another aspect, a laminate manufacturing system includes a platform for holding a polishing pad being manufactured, a printhead for forming a plurality of layers on a platform or on a previously deposited layer of a polishing pad by ejecting droplets, Receiving the data indicative of the desired shape of the polishing pad-the desired shape defining one or more grooves on the polishing pad and the contour comprising the polishing surface, and at least partially compensating for the contour distortions caused by the laminate manufacturing system And a controller configured to cause the printhead to distribute the plurality of layers of feed material by droplet ejection in accordance with the modified pattern.

Implementations may include one or more of the following features.

One or more grooves on the polishing pad may be defined by side walls that are substantially perpendicular to the plurality of layers. The distortions of the one or more grooves may include vertical distortions of the sidewall relative to the polishing surface.

The polishing surface may be substantially parallel to the plurality of layers. The modified pattern can be configured to at least partially compensate for distortions in the polishing surface of the polishing pad caused by the laminate manufacturing system. Distortions on the polishing surface of the polishing pad may include distortions in the flatness of the polishing surface.

Data representing a desired shape of the polishing pad may include data representing a pattern for dispensing a plurality of layers of a supply material and the data representing the pattern comprises data representing a flat top surface. Data representing the modified pattern may include data representing a concave top surface generated based on data representing a flat top surface. The data representing the concave top surface can be generated to at least partially compensate for the flatness distortions of the polishing surface of the polishing pad formed using data representing the pattern.

Generating data representing the modified pattern may include modifying data representing the original pattern to form a desired shape of the polishing pad. Data representing the original pattern can be corrected based on the correction contour for the original pattern. The correction contour may include portions extending beyond the width of the original pattern. The correction contour can be determined by identifying the original shape - the original shape is at least partially defined by distortions - and the difference between the desired shape. Modifying the data representing the original pattern may include modifying the amount of feed material deposited per voxel.

The polishing surface may include a compartment separating at least two grooves and modifying the data representing the original pattern may include determining a first volume of material dispensed close to an edge portion of the compartment adjacent the groove, Determining a second volume of material dispensed in a central portion of the compartment and modifying the distribution of the volume of feed material based on the first volume and the second volume such that the second volume is greater than the first volume .

Distortion distortions caused by the stack manufacturing apparatus may include distortions caused by the flow of ejected droplets on the features being fabricated. Distortions in the contour may include distortions in the height of one or more grooves. The desired shape of the polishing pad includes a flat surface defining a polishing surface, and the modified pattern may include a non-planar portion corresponding to a flat surface. The non-planar portion can be configured to at least partially compensate for the distortions of the abrasive surface caused by the laminate manufacturing system.

Advantages of the foregoing may include, but are not limited to, the following. The geometry of the polishing pad can be controlled more precisely, thereby improving the polishing efficiency of the polishing pad. In addition, the correction contour can compensate for potential distortions by adjusting the data used by the laminate manufacturing apparatus to form the article, rather than removing the article, e.g., after the polishing pad is initially formed . It is possible to reduce the amount of post-treatment of the article after the article is formed by the laminate manufacturing apparatus. As a result, it is possible to reduce the amount of supply material waste, and increase the yield and throughput.

The details of one or more implementations of the claimed subject matter described herein are set forth in the accompanying drawings and the description below. Other potential features, aspects and advantages will become apparent from the description, drawings, and claims.

1 is a schematic side view of a polishing system.
2 is a schematic side view of a laminate manufacturing apparatus.
Figure 3a is a top view of an example of a polishing pad.
Figure 3B is a side view of the polishing pad of Figure 3A.
4 is a flow diagram of a process for forming an article.
5 illustrates an example of an actual shape formed based on a desired shape.
Figure 6 illustrates the actual shape formed based on the modification of the desired shape of Figure 5;
Fig. 7 illustrates another example of an actual shape formed based on a desired shape.
8A-8C are bitmap representations of patterns of feed material to be dispensed.
Figure 9 illustrates the resulting shapes formed using the bitmap representations of Figures 8A-8C.
Figure 10 shows a process for generating data representing a modified shape.
11 is an example of a bitmap representation of a pattern of feed material to be dispensed, the order of which layers of feed material to be dispensed is adjusted.
Figure 12 is an example of a bitmap representation of a pattern of feed material to be dispensed, in which a portion of the bitmap representation extends beyond the original width of the desired shape to be formed.
Like numbers and names in the various figures indicate like elements.

A laminate manufacturing apparatus can be used to form the polishing pad. In the laminate manufacturing apparatus, an initial pattern for distributing the supply material may be provided. The initial pattern corresponds to the desired shape of the polishing pad to be formed. When the polishing pad is formed by a laminate manufacturing apparatus using an initial pattern, the actual shape of the polishing pad may include distortions for the desired shape of the polishing pad. As described herein, an initial pattern provided in a laminate manufacturing apparatus may be modified by a correction contour to generate a modified pattern to at least partially compensate for such distortions. Thus, the resulting shape formed using the modified pattern can be more closely matched to the desired shape of the polishing pad.

Referring now to FIG. 1, a polishing system 100 includes a polishing pad 102 that may be used to polish one or more substrates 104. A description of suitable polishing apparatus can be found in U.S. Patent No. 5,738,574, the entire disclosure of which is incorporated herein by reference. The polishing system 100 may include a rotatable platen 106 on which the polishing pad 102 is disposed. The abrasive slurry may be supplied to the abrasive surface 103 of the polishing pad 102 by a slurry feed port or a composite slurry / The abrasive liquid 108 may comprise abrasive particles, pH adjusting agents, or chemically active components.

The substrate 104 is held against the polishing pad 102 by a carrier head 112. The carrier head 112 is suspended in a support structure, such as a carousel, and is connected to the carrier head rotating motor by a carrier drive shaft 114 so that the carrier head can rotate about an axis 116. The relative movement of the substrate 104 and the polishing pad 102 in the presence of the polishing liquid 108 results in polishing of the substrate 104.

Referring to Figure 2, in some instances, a laminate manufacturing apparatus 120 that dispenses successive layers of feed material may be used to form the polishing pad 102. Referring to FIGS. 1 and 2, a laminate manufacturing apparatus 120 operates to form at least an abrasive layer 122 of a polishing pad 102. In the manufacturing process, thin layers of feed material are progressively dispensed and cured. For example, droplets 124 of a feed material, such as a polishing pad precursor material, may be dispensed from a dispenser 128, such as a nozzle 126 of a droplet dispenser printer, to form a layer 130 of a feed material. Can be discharged. The dispenser 128 is similar to an inkjet printer, but uses a feedstock instead of ink to form the polishing pad 102.

The controller 129 is operable to control the dispensing operations of the dispenser 128 and, if applicable, curing operations using an energy source 131 such as a lamp or a laser. The nozzle 126 translates (as indicated by arrow A) across the support 134 to distribute the feed material at any portion of the accumulation region on the support 134.

In some implementations, the energy source 131 follows the nozzle 126 when the nozzle 126 is translationally moving over the support 134, whereby the dispensed feed material through the nozzle 126 Can be cured immediately. In some implementations, the energy source 131 leads the nozzle 126 forward as the nozzle 126 translates across the support 134 in the first scanning direction while dispensing the feed material. For example, when the energy source 131 is scanned over the support portion 134 in a second scanning direction opposite to the first scanning direction, the energy source 131 may cure such dispensed feed material, And provides a supply material addition time to reach a steady state before being exposed to the radiation of the energy source 131. [ In some implementations, the energy source 131 leads the nozzle 126 ahead when the nozzle 126 is translationally moved over the support 134 in the first scanning direction, and the energy source 131, When scanned in the first scanning direction, it is used to cure the dispensed feed material. Thus, the previously dispensed layer of feed material can be hardened almost immediately prior to dispensing the other layer through the nozzle 126. In some implementations, there are multiple energy sources from which the energy source 131 follows the nozzle 126 and the energy source 131 drives the nozzle 126 forward.

In the case of the deposited first layer 130a, the nozzle 126 may discharge the feed material onto the support 134. [ In the case of the subsequently deposited layers 130b, the nozzles 126 may be ejected onto the already coagulated feedstock 132. After each layer 130 has solidified, a new layer is then deposited over the previously deposited layer, until a complete three-dimensional polishing layer 122 is fabricated. Each layer is applied by a nozzle 126 in a pattern stored in a 3D drawing computer program running on the computer 60. Each layer 130 is less than 50%, for example less than 10%, for example less than 5%, for example less than 1%, of the total thickness of the abrasive layer 122.

The abrasive layer 122 may be formed on the support 134. In some instances, the support 134 includes a rigid base or a flexible membrane, e.g., a layer of polytetrafluoroethylene (PTFE). If the support 134 comprises a flexible membrane, the support 134 forms a portion of the polishing pad 102. For example, support portion 134 may include a back layer 136 (shown in FIG. 1) or a layer between back layer and polishing layer 122 of polishing pad 102. The support portion 134 includes the back layer 136 of the polishing pad 102 and the support portion 134 is not removed from the polishing pad 102 after fabrication of the polishing pad 102 is completed. Referring to FIG. 1, a polishing pad 102 is mounted to the polishing system 100 with a backing layer 136 (e.g., a support 134) facing the rotatable platen 106. Alternatively, the polishing layer 122 may be removed from the support 134 after the fabrication of the polishing pad 102 is completed, if the support 134 does not include the backside layer 136 of the polishing pad 102. [ have.

The solidification of the layers 130 of the feed material can be achieved by polymerization. For example, the layer of feed material 130 may be a monomer, and the monomer may be in-situ polymerized by ultraviolet (UV) curing. The feed material can be effectively cured immediately upon deposition, or the entire layer 130 of the pad precursor material can be deposited and then the entire layer 130 can be cured simultaneously. Alternatively, the droplets 124 may be a polymer melt that solidifies upon cooling. In further implementations, the apparatus 120 creates an abrasive layer 122 by diffusing a layer of powder and ejecting droplets of binder material onto the layer of powder. In this case, the powder may contain additives, for example abrasive particles.

In some implementations, the backside layer 136 may also be fabricated by a 3D printing process. For example, the backside layer 136 and the abrasive layer 122 may be fabricated by continuous operation by the device 120. Different hardness can be provided to the backside layer 136, for example, by using UV radiation of different intensities, or by using different materials, different from the polishing layer 122. In other implementations, the backside layer 136 is made by a conventional process and then secured to the abrasive layer 122. For example, the abrasive layer 122 may be secured to the backing layer 136 by, for example, a thin adhesive layer, such as a pressure sensitive adhesive.

2, 3a, and 3b, when the abrasive layer 122 is formed, the apparatus 120 may be configured to form grooves 138 in the abrasive layer 122, The portions can be selectively distributed and / or selectively cured. The grooves 138 may carry the polishing liquid 108 (shown in Fig. 1). The grooves 138 can be almost any pattern, such as concentric circles, straight lines, crossed patterns, spirals, and the like. Assuming that the grooves are present, the sections 140 between the grooves 138 define the polishing surface 103. For example, the polishing surface 103 including the segments 140 between the grooves 138 can be about 25-90%, for example, 70-90% of the total horizontal surface area of the polishing pad 102 have. Thus, the grooves 138 may occupy 10-75%, for example, 10-30% of the total horizontal surface area of the polishing pad 102. The spaces between the grooves 138 may have a lateral width of about 0.1 to 2.5 mm.

Referring to the examples illustrated in FIGS. 3A and 3B, in some implementations, the grooves 138 include concentric grooves. The grooves 138 can be uniformly spaced at a pitch P. [ The pitch P is the radial distance between adjacent grooves 138. The spaces 140 between the grooves 138 have a width W _p . Each groove 138 is defined by sidewalls 142 that extend from the bottom surface 144 of the groove 138 and terminate at the polishing surface 103, e.g., in the partition 140. Each groove 138 may have a depth D _g and a width W _g .

The sidewalls 142 may extend downward from the polishing surface 103 and may be generally perpendicular to the polishing surface. In this regard, the sidewalls are substantially perpendicular to the layers 130 of feed material dispensed on the support 134. Additionally, the sections 140 extend substantially parallel to the layers of feed material 130 dispensed on the supports 134.

Each polishing cycle results in wear of the polishing pad 102, which is generally a thinning form of the polishing pad 102 when the polishing surface 103 is worn. Substantially in the width (W _g) of the groove having the vertical side walls 142, and does not change as the polishing pad is worn. Thus, generally vertical sidewalls 142 ensure that the polishing pad has a substantially uniform surface area over the operating lifetime of the polishing pad 102. As described herein, the fabrication process for forming the polishing pad 102 may be performed in any suitable manner, for example, to prevent the polishing surface 103 from becoming uneven, And compensating operations for making the sidewalls 142 perpendicular to the polishing surface 103.

The grooves 138 may have a minimum width (W _g) of about 0.34 mm. Each of the grooves 138 is, for 0.34 mm to 2.71 mm, for example, may have a width (W _g) of about 0.38 mm to about 1.02 mm. In particular, the grooves 138 may have a width (W _g) of about 0.51 mm or 0.68 mm. The pitch P between the grooves 138 may be between about 0.68 mm and 6.10 mm, for example, between about 2.29 mm and 5.40 mm. In particular, the pitch can be approximately 2.03 or 3.05 mm. Each of the sections 140 between the grooves 138 may have a width W _p of at least 0.34 mm. Width (W _g) the ratio of the width (W _p) of the large compartments of the grooves may be selected to be about 0.10 to 0.4. The ratio can be about 0.2 or 0.3.

In some implementations, if the polishing pad 102 comprises a backside layer 136, the grooves 138 can extend completely through the polishing layer 122. [ In some implementations, the grooves 138 may extend through about 20-80%, e.g., 40%, of the thickness of the abrasive layer 122. [ The depth (D _g ) of the grooves 138 may be 0.25 to 1 mm. The abrasive layer 122 may have a thickness T of about 1 mm to 3 mm. The thickness T should be chosen such that the distance D _p between the bottom surface 144 of the groove 138 and the backside layer 136 is between about 0.5 mm and 4 mm. In particular, the distance D _p may be about 1 or 2 mm.

Referring to FIG. 4, a manufacturing process 200 for forming a polishing pad 102 is illustrated. For example, the laminate manufacturing apparatus 120 including the controller 129 may perform the operations of the manufacturing process 200.

At act 202, data indicative of the desired shape of the polishing pad 102 to be manufactured is received. Data representing shapes including data representing a desired shape can be defined by a two-dimensional or three-dimensional bitmap. In some implementations, the shape data includes data representing a computer aided design (CAD) model. For example, if the shape data corresponds to data representing a desired shape, then the CAD model represents the polishing pad 102 to be manufactured.

In some examples, referring to FIG. 5, the desired shape includes the desired features 300. Without further manipulation of the data representing the desired shape, the laminate manufacturing apparatus 120 can be used to form a desired shape, for example, by dispensing the feed material and curing the feed material or by curing the feed material to form the desired shape The actual feature 310 may be formed based on data representing the desired shape, including the desired features 300. For example, For example, to form a rectangular desired feature 300, the distributor 128 is controlled to distribute the parallel layers 130 of feed material. For each layer, a selected portion of the feed material is cured, with a uniform width corresponding to the width of the desired rectangular feature 300.

During such dispensing and curing processes, the resolution and material properties of the laminate manufacturing apparatus 120 may cause the edges of the actual features 310 to undesirably become rounded or beveled. In particular, if the layers 130 of the feed material are distributed according to the original pattern determined based on the data representing the desired shape, then the resulting shape may be rounded or tilted, as shown for the actual feature 310 . As shown in FIG. 5, the top surface 302 of the desired feature 300 is flat, but the corresponding top surface 312 of the actual feature 310 is not planar. The lateral edges 304a and 304b of the desired features 300 are substantially parallel to the actual lateral edges 314a and 314b of the actual features formed by the layered manufacturing apparatus 120, Lt; / RTI > The desired features 300 may correspond to the spaces 140 between the grooves 138 (shown in Figures 3A and 3B). In this regard, the rounding or tilting effect with respect to the top surface 312 may cause the polishing surface 103 defined by the sections 140 to be uneven. Without being limited to any particular theory, it is believed that the liquid droplets of the feed material, e.g., liquid pad precursor material, being ejected onto the previously deposited layer can be diffused and, for example, , Which results in rounding.

To reduce rounding or tilting effects, data representing the desired shape may be modified. In this regard, referring back to FIG. 4, at operation 204, data is generated or received that represents a modified pattern for dispensing the feed material to compensate for polishing pad distortions. The distortions include distortions of the polishing surface 103 of the polishing pad 102. These distortions, in some cases, are caused by the laminate manufacturing apparatus 120, as described herein. The modified pattern differs from the original pattern that dispenses the feed material in that the modified pattern deals with distortions in the actual feature 310 for the desired feature. In this regard, in some implementations, the data representing the modified pattern is determined based on the relative differences between the actual feature 310 and the desired feature 300.

For example, as shown in FIG. 6, the data representing the modified shape includes data representing the modified feature 320. The top surface 322 of the modified feature 320 may compensate for distortions in the top surface 312 of the actual feature 310 formed in the original pattern, even though the top surface 302 of the desired feature 300 is flat. , It is not flat. The modified feature 320 is determined based on the relative differences between the actual feature 310 and the desired feature 300. The top surface 322 of the modified feature 320 is concave to compensate for the convexity of the top surface 312 of the actual feature 310. In this regard, data representing the modified shape is determined based on a combination of data representing the actual shape formed using the original pattern and data representing the desired shape.

Referring again to FIG. 4, at act 206, the layers of feed material 130 are dispensed by droplet discharge in accordance with the modified pattern. The resulting actual features 330 are formed based on data representing a modified pattern for dispensing the feed material, wherein the modified pattern is determined based on data representing the modified shape.

When the distributor 128 is controlled to dispense the layers 130 of feed material according to the data representing the modified pattern, the size and shape of the selected portions of the layers 130 of feed material, which are cured, Can change. This is in contrast to the process of forming the actual features 310, where the selected portion of the cured supply material is layer-by-layer, as the width of the desired features 300 is consistent from layer to layer. The modified features 320 include concave portions 326 having varying widths from layer to layer. The modified pattern for dispensing the feed material to form the concave portion 326 is such that the selected hardened portions of the layers 130 of feed material for the modified pattern have varying widths and shapes, Differs from the corresponding portion of the original pattern for forming the top portion of the substrate 300. These varying widths and shapes are determined by the actual features 310 that are formed using the modified pattern so that the resulting actual features 330 have reduced convexity compared to the actual features 310 formed using the original pattern. ≪ / RTI > For example, the top surface 332 of the actual feature 330 has increased flatness and flatness compared to the top surface 312 of the actual feature 310. By intentionally controlling where the feed material is dispensed and cured, this correction, defined by the modified pattern, results in a better match of the shape of the resulting polishing pad 102 to the original desired shape for the polishing pad 102 .

For example, the controller 129 may receive a data object, e.g., a computer-aided design (CAD) compatible file, specifying an initial or intended bitmap. The data object may be stored in a non-volatile computer readable medium. The controller 129 can be programmed to generate a modified bitmap that includes features for rounding and reducing tilting based on the desired bitmap. Thus, if the polishing pad 102 is manufactured using a modified bitmap, it is more closely matched to the desired design.

FIG. 7 illustrates another example of an actual feature 410 that is formed based on distribution and cure patterns determined according to the desired feature 400 and the data representing the desired feature 400. In this particular example, while the other dimensions in the implemented process were adequate, the desired features 400 had a width of 680 mu m and a height of 500 mu m. As illustrated, actual features 410 have uneven top surfaces and tilted sidewalls.

The desired feature 400 is a section 140 that separates features of a given width, e.g., the grooves 138 of the polishing pad 102. A constant width of the sections 140 can improve wafer-to-wafer polishing uniformity. In addition, the polishing efficiency of the polishing pad 102 may depend on the flatness of the polishing surface 103. [ Data representing the modified pattern may be generated using the processes described herein so that the resulting actual feature formed using the modified pattern is more closely matched to the desired feature 400. In particular, the modified pattern corresponds to the original pattern with an additional correction contour determined using the processes described herein. The additional correction contours compensate for distortions in the actual feature 410 that were created using the original pattern.

8A-8C represent data representing shapes used by the laminate manufacturing apparatus 120 to dispense and cure the feed material. In some implementations, the data representing the shapes described herein include bitmap representations of shapes to be formed or formed shapes. Each bit of the bitmap may correspond to a voxel of a feature of the polishing pad 102 to be formed. For example, FIG. 8A illustrates a bitmap representation 500 generated based on a desired feature 400. FIGS. 8B and 8C illustrate bitmap representations 502 and 504 generated to compensate for distortions in the actual feature 410. FIG. Thus, the bitmap representations 502 and 504 represent modified features generated based on the desired feature 400 and the actual feature 410. The bitmap representations 502 and 504 include stepped portions 506 and 508 for approximating the concavities of the modified features to compensate for the convexity of the actual feature 410. The concavities that are approximated by the stepped portions 506 are less than the concavities that are approximated by the stepped portions 508.

9 illustrates the resulting actual features 510, 512, 514 formed using modified patterns that generally correspond to the bitmap representations 500, 502, 504, respectively. The actual features 510, 512, 514 each include variable width portions 516, 518, 520, wherein the variable width portion of the actual feature 510 has the highest height. The variable width portion 518 has a height that is higher than the variable width portion 520. Thus, a constant width may be more easily achieved through bitmap representations 502, 504 that include non-uniform width patterns that compensate for distortions in the actual feature 510 formed using the bitmap representation 500 have.

10 illustrates an exemplary process for determining a modified feature and thus a modified pattern for dispensing a feed material to form a feature that better matches the desired feature. The actual shape is formed using, for example, the laminate manufacturing apparatus 120 as described herein, based on the data representing the desired shape 600, and then the measured shape 602 of the actual shape The data to be represented is determined. Data representing the measured shape 602 may be determined, for example, using a confocal laser microscope to measure the height contour of the actual shape. The data representing the difference 604 between the measured shape 602 and the desired shape 600 is then determined. The difference 604 may indicate a distortion of the measured shape 602 with respect to the desired shape 600 and / or a distortion of the actual shape with respect to the desired shape 600. [ The difference 604 may correspond to the measured shape 602 subtracted from the desired shape 600. The data representing the difference 604 represents, for example, a portion of the measured shape 602 that does not match the desired shape 600. [

The data representing the inverted difference 606 is determined based on the data representing the difference 604. The data representing the inverted difference 606 is complementary to the difference 604, thereby compensating for the distortion of the measured shape 602. [ In some implementations, the inverted difference may be scaled to any multiple within one to three times to form data representing the inverted difference 606. [ The inverted difference 606 corresponds to the correction contour used to modify the original desired shape 600. [ In this regard, the data representing the inverted difference 606 is added to the data representing the desired shape 600 to form data representing the modified shape 608. The data described in this example may correspond to bitmaps, as described herein.

The controller, for example, the controller 129, may be embodied as digital electronic circuitry, or may be implemented as computer software, firmware, or hardware, or combinations thereof. A controller may be coupled to an information carrier for execution by, or control of, one or more computer program products, e.g., a data processing apparatus, e.g., a programmable processor, computer, or multiple processors or computers, For example, non-volatile machine-readable storage media, or one or more computer programs tangibly embodied in the propagated signal. A computer program (also known as a program, software, software application, or code) may be written in any form of programming language, including compiled or interpreted languages, Or distributed as other units suitable for use in a computing environment. A computer program may be distributed on one computer, or distributed on a plurality of computers that are distributed in one place or across multiple locations and interconnected by a communications network.

The processes and logic flows described herein may be performed by one or more programmable processors executing one or more computer programs that perform functions by operating input data and generating an output. Processes and logic flows may also be performed by special purpose logic circuitry, e.g., a field programmable gate array (FPGA) or an application specific integrated circuit (ASIC), and the device may also be implemented as such special purpose logic circuitry .

The controller 129 and other computing devices portion of the described systems may be configured to store a data object, e.g., a computer-aided design (CAD) compatible file that identifies a pattern in which the feedstock is to be formed for each layer Non-volatile computer readable media. For example, the data object may be an STL format file, a 3D Manufacturing Format (3MF) file, or a Laminated Manufacturing File Format (AMF) file. For example, the controller may receive a data object from a remote computer. The processor of the controller 129, for example, as controlled by firmware or software, controls the components of the stack manufacturing apparatus 120 to deposit and / or cure each layer in a desired pattern To interpret the data object received from the computer to generate a set of signals necessary for the computer.

A number of implementations have been described. Nevertheless, it will be understood that various modifications may be made.

In some implementations, referring to FIG. 12, the correction contour comprises a portion that extends beyond the width of the original desired feature. The modified bitmap representation 800 includes a protruding portion 802 that extends beyond the width of the bitmap representation 500 of the desired feature. The protruding portions 802 are distributed, for example, to the top layers of the feed material. Layers of the feed material underlying the top layers of feed material may experience expansion due to material roll-off during distribution. Consequently, briefly referring to FIG. 7, the layers underlying the feed material define an expanded portion 402 that is wider than the width of the desired feature. The protruding portion 802 may be a portion of the expanded portion 402 that is to be dispensed on top of the expanded portion 402 to compensate for the varying width of the expanded portion 402 and to improve the consistency of the width of the feature in the expanded portion 402. [ It can cope with the material.

The approach shown in Figures 8B and 8C is to deposit one or more additional layers of feed material to compensate for the height of the features below the desired. For example, one or more additional layers of the feedstock may be deposited in areas that are rounded or tilted. However, alternatively or additionally, to compensate for the height of the features less than desired, a predetermined amount of feed material may be deposited in the layer. For example, the number of droplets ejected or the size of droplets can be increased for voxels located in regions where the height of the feature is less than desired, e.g., rounded or tilted.

In some implementations, the distribution of the volume of feed material is modified depending on where the droplets 124 are to be dispensed. The volume of droplets 124 of the feed material is varied during the dispensing operation. 6, the volume of droplets 124 for forming the edges of the feature 322a, 322b is greater than the volume of droplets 124 for forming the interior portion 322c of the feature ≪ / RTI > The controller 129 determines the appropriate weight for forming the edges 322a and 322b and the weight for forming the inner portion 322c based on the material properties of the feed material. The distributor 128 may dispense less of the feed material to minimize the roll-off of the feed material. As the dispenser 128 moves to form the interior portion 322c of the feature, the volume of droplets is increased. In some implementations, the volume of droplets 124 defines a gradient from the edges of the features 322a, 322b to the center. Depending on the wetting effect of the feedstock, this type of volumetric control can be used to adjust the amount of feedstock that is cured when the energy source is operated, in the presence of the energy source 131. For example, when the energy source 131 is scanned over the support 134 to cure different parts of the dispensed feed, the drop volume control may be controlled by the edge of the feature to reduce the tilting effect described herein. May allow for less feed material to roll off during each pass of the energy source 131 while injecting more feed material into the openings 322a, 322b.

In some implementations, multiple types of feed material are dispensed. The stack manufacturing apparatus 120 includes, for example, two or more distributors, each distributing a different type of feed material. In some cases, a single distributor, for example, a distributor 128, accommodates multiple types of feed material and distributes a mixture of these multiple types of feed material. Modifications to the original pattern for dispensing the first type of feed material may be performed by dispensing a second type of feed material, as the characteristics of the first type of feed material may differ from those of the second type of feed material Lt; RTI ID = 0.0 > or less < / RTI > Alternatively, when the droplet weight is controlled, the weights of the droplets of the first type of feed material may be controlled to be heavier or lighter than the weights of the droplets of the second type of feed material. In some cases, the size of the droplets of the first type of feed material can be controlled to be larger or smaller than the sizes of the droplets of the second type of feed material.

In some implementations, for example, to form the abrasive layer 122 and the backside layer 136, or to form different portions of the abrasive layer 122, for example, Many types of feed material form different parts of the polishing pad 102 to provide an abrasive layer with varying abrasive properties. The second type of feed material may comprise a first type of feed material having an additive that alters the characteristics of the feed material of the second type relative to the feed material of the first type. The additive includes, for example, a surfactant capable of adjusting the properties of uncured feed materials, such as zeta potential, hydrophilicity, and the like.

The thickness of each layer of layers of feed material and the size of each voxel of the voxels may vary from implementation to implementation. In some implementations, when distributed on the support portion 134, each voxel may include, for example, 10 microns to 50 microns (e.g., 10 microns to 30 microns, 20 microns to 40 microns, 30 microns to 50 microns Mu m, about 20 mu m, about 30 mu m, or about 50 mu m). Each layer may have a predetermined thickness. The thickness may be, for example, 1 to 80 占 퐉, for example, 2 to 40 占 퐉 (e.g., 2 占 퐉 to 4 占 퐉, 5 占 퐉 to 7 占 퐉, 10 占 퐉 to 20 占 퐉, 25 占 퐉 to 40 占 퐉) .

Although the method and apparatus have been described in the context of the manufacture of a polishing pad, such methods and apparatus can be adapted to the manufacture of other articles by laminate manufacture. In this case, instead of the polishing surface, it will simply be the top surface of the object to be produced, with the top surface having recesses. The modified pattern can at least partially compensate for distortions caused by the laminate manufacturing system.

Additionally, although the method and apparatus are described in the context of manufacturing by droplet discharge, such methods and apparatus may be adapted to manufacture by other lamination fabrication techniques, such as selective powder distribution followed by sintering.

Accordingly, other implementations are within the scope of the claims.

Claims (15)

A method of manufacturing a polishing pad using a laminate manufacturing system,
Receiving data representative of a desired shape of the polishing pad to be produced by droplet ejection, the desired shape defining an outline comprising one or more grooves on the polishing pad and a polishing surface;
Generating data representative of a modified pattern for dispensing a feed material to at least partially compensate for distortions in the contour caused by the laminate manufacturing system; And
And dispensing the plurality of layers of the feed material by droplet ejection in accordance with the modified pattern. The method according to claim 1,
Wherein the one or more grooves on the polishing pad are defined by sidewalls substantially perpendicular to the plurality of layers and wherein the distortions of the one or more grooves include vertical distortions of the sidewalls relative to the polishing surface. How to. The method according to claim 1,
Wherein the polishing surface is substantially parallel to the plurality of layers and the distortions of the polishing surface of the polishing pad comprise distortions of the flatness of the polishing surface. The method according to claim 1,
Wherein the contour distortions caused by the stack manufacturing apparatus include distortions caused by the flow of ejected droplets on the features being fabricated. The method according to claim 1,
Wherein the desired shape of the polishing pad includes a flat surface defining the polishing surface and the modified pattern includes a non-planar portion corresponding to the planar surface, wherein the non- Wherein the polishing pad is configured to at least partially compensate for distortions in the polishing surface caused by the system. A computer program product tangibly embodied in a non-transitory computer readable medium,
Processor:
Instructions for receiving data indicative of a desired shape of a polishing pad to be produced by droplet dispensing in a laminate manufacturing system, the desired shape defining an outline comprising one or more grooves on the polishing pad and a polishing surface;
Instructions for causing data generated by the laminate manufacturing system to generate data indicative of a modified pattern for dispensing a feed material to at least partially compensate for distortions in the contour; And
Wherein the laminate manufacturing system includes instructions to cause a plurality of layers of the feed material to be dispensed by droplet dispensing according to the modified pattern. The method according to claim 6,
Wherein the data representing the desired shape of the polishing pad comprises data representing a pattern of distributing a plurality of layers of a supply material and wherein the data representing the pattern comprises data representing a flat top surface,
Wherein the data representing the modified pattern comprises data representing a concave top surface generated based on data representing the flat top surface. 8. The method of claim 7,
Wherein the data representing the concave top surface is generated to at least partially compensate for distortions in the flatness of the polishing surface of the polishing pad formed using data representing the pattern. The method according to claim 6,
Wherein the instructions for generating data representing the modified pattern comprise instructions for modifying data representing an original pattern to form a desired shape of the polishing pad. 10. The method of claim 9,
Wherein the data representing the original pattern is modified based on a correction contour for the original pattern. 11. The method of claim 10,
Wherein the correction contour comprises a portion extending beyond the width of the original pattern. 11. The method of claim 10,
Wherein said correction contour is determined by identifying a difference between said original shape and said desired shape, said original shape being at least partially defined by distortions. 10. The method of claim 9,
Wherein the instructions for modifying data representing the original pattern comprise instructions for modifying an amount of feed material deposited per voxel. 10. The method of claim 9,
Wherein the original pattern includes data representing a polishing surface comprising a section separating at least two grooves, the instructions for modifying data representing the original pattern comprise:
Instructions for determining a first volume of material dispensed proximate to an edge portion of the compartment adjacent the groove,
Instructions for determining a second volume of material dispensed to a central portion of the compartment, and
Instructions for modifying the distribution of the volume of feed material based on the first volume and the second volume such that the second volume is greater than the first volume. As a laminate manufacturing system,
A platform for holding a polishing pad to be manufactured;
A printhead for forming a plurality of layers by ejecting droplets on the platform or on a layer previously deposited on the polishing pad; And
A controller,
Receiving data representative of a desired shape of the polishing pad, the desired shape defining an outline comprising one or more grooves on the polishing pad and a polishing surface;
To generate data representative of a modified pattern for dispensing the feed material to at least partially compensate for distortions in the contour caused by the laminate manufacturing system; And
Wherein the print head is configured to dispense a plurality of layers of the feed material by droplet ejection in accordance with the modified pattern.

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