KR20180108086A - Hall boring device using laser and hall boring method thereof - Google Patents

Abstract

The present invention relates to a hall boring device using laser, including a focusing lens; a scanning optical system for reflecting an incident laser beam toward the focusing lens while changing a reflection angle within a set angle range; a prism installed between the scanning optical system and the focusing lens, in which at least one of an incidence plane and an emission plane is a slope not perpendicular to a rotation center axis; and a prism driving unit rotating the prism about the rotation center axis. According to the present invention, a beam spot of a laser beam is incident on a material while moving over the entire surface of a hall machining region. Accordingly, not only a through hole but also a groove with a blocked bottom can be formed with high processing quality. Also, the incident angle of the laser beam with respect to the material can be reduced or adjusted by means of multiple prisms. As a result, it is possible to stably form a vertical hole with a high aspect ratio, and it is possible to more smoothly implement a hole inner wall.

Description

[0001] The present invention relates to a hole boring device using a laser,

[0001] The present invention relates to a hole processing apparatus using a laser, and more particularly, to a laser hole processing apparatus which drastically improves hole processing quality by inducing a laser beam spot to move along a synthetic locus in a linear direction and a circumferential direction on a surface of a material .

In general, the method of forming a hole in a material includes a mechanical drilling method, a dry etching method, a wet etching method, and a laser drilling method. Of these, the laser drilling method is less dusty than a mechanical drilling method, In comparison with the method, not only the process time is short, but also the process device has a simple advantage.

Accordingly, in recent years, in areas where precision machining is required, such as semiconductors and displays, A case where a laser processing apparatus is used for forming or cutting holes in a material such as ceramics is increasing.

A laser processing apparatus focuses a laser beam emitted from a laser light source onto a material through a focusing lens to process the material.

When the material is fixed, melting and / or evaporation of the material occurs at the portion where the beam spot is formed, so that a hole having almost the same diameter as the beam spot is formed.

If the diameter of the hole to be formed is larger than the diameter of the beam spot, the process must be carried out while moving the beam spot within the hole processing region defined in the material. For example, the position of the beam spot may be moved while the material is fixed, or the hole may be processed while moving the material while fixing the position of the beam spot.

Patent Literature 1 is directed to a laser hole processing apparatus for forming holes while moving the position of a beam spot while fixing a material, and a prism is provided between the material and the focusing lens so that the incident surface and the exit surface are not parallel to each other, So that the beam spot is circumferentially moved around the optical axis of the focusing lens.

That is, when the prism is rotated, the path of the laser beam passing through the prism is circumferentially moved about the rotation axis of the prism. As a result, as shown in FIG. 1, Exercise.

However, the laser hole processing apparatus according to Patent Document 1 has some problems as follows.

First, in the case where the diameter of the hole is two times or more larger than the diameter of the beam spot, as shown in Fig. 1, since the beam spot is not formed properly in the center of the hole machining area only by circumferential movement of the beam spot, It is difficult to do. In this case, although it is possible to form the through-hole, there is a problem that it is difficult to apply this method to form the bottomed groove.

Patent Document 1 discloses a configuration in which the circumferential movement diameter of the beam spot is adjusted by changing the distance between the focusing lens and the prism using a servo motor. Therefore, if the interval between the focusing lens and the prism is continuously changed during the hole processing, Can be improved.

However, when the laser beam passes through the rotating prism, the beam spot has to perform a circumferential movement on the surface of the material. Therefore, it is difficult to uniformly enter the laser beam throughout the entire hole processing region with the prism alone.

Further, even if the prism is moved along the optical axis, since the prism must be moved very finely when the diameter of the hole to be formed is small, it is burdensome to use an expensive high-precision servomotor.

Secondly, since the prism is positioned between the focusing lens and the material and the laser beam passing through the prism is obliquely incident on the material, it is difficult to realize the vertical wall as the aspect ratio of the hole becomes larger.

Third, the material melted by the beam spot is re-fused, and the inner wall of the hole and the entrance of the hole are not smooth and rugged phenomenon appears, which may lead to cracking of the material or separation of the fused material into particles, have.

Korean Registered Patent No. 10-1291381 (Announced on August 3, 2013)

SUMMARY OF THE INVENTION The present invention has been made to solve such a problem, and it is an object of the present invention to uniformly remove a material throughout a hole machining area by moving a beam spot more uniformly within a hole machining area. Further, the present invention aims at realizing more perfect vertical holes of high aspect ratio and minimizing re-fusion of materials to realize smoother cut surfaces.

In order to achieve this object, one aspect of the present invention relates to Focusing lens; A scanning optical system for reflecting the incident laser beam toward the focusing lens while changing a reflection angle within a set angle range; At least one of an incidence plane and an emission plane being a slope not perpendicular to a rotation center axis; And a prism driving unit for rotating the prism about the rotation center axis.

In the hole processing apparatus according to one aspect of the present invention, the prism includes a first prism and a second prism arranged along a path of a laser beam, and the first prism and the second prism are arranged such that the inclined surfaces of the first prism and the second prism are opposed to each other As shown in FIG. At this time, the prism driver may rotate the first prism and the second prism at the same speed as the same direction.

According to another aspect of the present invention, there is provided a zoom lens comprising: a focusing lens; A scanning optical system for reflecting the incident laser beam toward the focusing lens while changing a reflection angle within a set angle range; There is provided a hole processing apparatus using a laser, which includes a rotary drive section for rotating a material around a center of a hole processing region defined in a material as a rotation center.

In the hole processing apparatus according to the present invention, the oscillation frequency of the scanning optical system may be 10 Hz to 1 MHz.

Yet another aspect of the present invention is a method of manufacturing a semiconductor laser, comprising: reflecting a laser beam transmitted from a laser light source while changing a reflection angle within a set angle range of a scanning optical system; Converting the path of the laser beam incident from the scanning optical system to move along a circumferential direction about the rotational center axis of the prism while the prism is rotating; When the laser beam passing through the prism is focused on the material through the focusing lens, the beam spot of the laser beam travels along the combined trajectory in the linear direction and the circumferential direction about the optical axis within the hole processing region defined in the material A method of processing a hole using a laser, comprising the step of processing the material.

In the hole processing method according to the present invention, the prism includes a first prism and a second prism arranged along a path of a laser beam, and the first prism and the second prism are arranged such that their inclined surfaces are opposite to each other And the first prism and the second prism can rotate at the same speed as the same direction.

Also, in the hole processing method according to the present invention, the prism includes a first prism and a second prism arranged along a path of the laser beam, wherein the first prism and the second prism are formed so that their inclined surfaces are opposite to each other And the rotational speed or rotational direction of the first prism and the second prism may be different from each other.

Further, in the hole processing method according to the present invention, after the step of processing the material, fixing the scanning optical system; The laser beam reflected from the scanning optical system passes through the rotating prism and then is focused on the material through the focusing lens. The beam spot of the laser beam is directed in the circumferential direction about the optical axis in the hole processing region defined in the material And processing the material while moving.

Yet another aspect of the present invention is a method of manufacturing a semiconductor laser, comprising: reflecting a laser beam transmitted from a laser light source while changing a reflection angle within a set angle range of a scanning optical system; The material is rotated by the center of the hole machining area as a rotation axis, and when the laser beam reflected by the scanning optical system is focused on the material through the focusing lens, the beam spot of the laser beam moves in a linear direction And processing the material while moving along a locus of synthesized circumferential direction around the optical axis.

In the hole processing method, after the step of processing the material, fixing the material; The step of processing the material while the laser beam reflected from the scanning optical system is focused on the material through the focusing lens and the beam spot of the laser beam moves in the circumferential direction about the optical axis in the hole processing region defined in the material .

According to the present invention, since the beam spot of the laser beam is incident on the material while moving over the entire surface of the hole machining area, not only the through hole but also the bottom clogged groove can be formed with high processing quality. Also, by using a plurality of prisms, it is possible to reduce or adjust the angle of incidence of the laser beam with respect to the material, thereby stably forming a vertical hole with a high aspect ratio, and more smoothly implementing the inner wall of the hole.

1 is a view showing a path of a beam spot by rotation of a prism in a conventional laser beam machining apparatus
2 is a schematic configuration diagram of a laser hole machining apparatus according to the first embodiment of the present invention
3 is a schematic configuration diagram of a laser hole processing apparatus using a polygon as a scanning optical system
4 is a view showing the path of a laser beam spot when the prism is fixed and when the prism is rotated in the laser hole processing apparatus according to the first embodiment of the present invention
5 is a view illustrating a hole forming process using the laser hole machining apparatus according to the first embodiment of the present invention.
Figure 6 is a photograph of a hole prepared according to an embodiment of the present invention and a hole prepared according to the prior art
7 is a front view and a side view of an optical module used in the laser hole machining apparatus according to the first embodiment of the present invention
8 is a schematic configuration diagram of a laser hole machining apparatus according to a second embodiment of the present invention
9 is a view showing a modified example of the hole machining method according to the embodiment of the present invention

Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

For example, when an element is connected to or coupled with another element, the element is not directly connected or coupled to another element, but is indirectly connected or coupled with another element intervening therebetween. . Also, when an element is directly connected or coupled to another element, it means that the element is connected or coupled without any other element in between. It is also to be understood that the term " including any element " means that the element may include other elements, not the other elements, unless specifically stated otherwise. It should be understood that the drawings are not intended to limit the scope of the present invention in any way.

1st Example

2, a laser beam source 10, a transfer optical system 20, a scanning optical system 30, a focusing lens 40, A first prism 51 and a second prism 52 disposed between the scanning optical system 30 and the focusing lens 40 and a stage 100 on which the material 200 is placed.

The laser light source 10 generates and emits a continuous wave or pulsed wave laser light, and a specific kind of the laser light can be selected according to the characteristics of the material and the necessity.

The transmission optical system 20 is composed of an optional combination of a mirror, an attenuator, a splitter, an aperture and the like. The laser beam emitted from the laser light source 10 is converted into a laser beam 1 Conversion.

The scanning optical system 30 reflects the laser beam 1 transmitted through the transmission optical system 20 toward the focusing lens 40 and serves to continuously change the traveling path of the laser beam 1 within a set range do.

2 shows the case where the mirror type scanning optical system 30 is used. The mirror type scanning optical system 30 is driven by the driving unit 32 to rotate the laser beam 1 while oscillating or reciprocating within a predetermined angle range about the rotation axis. Change the angle of reflection.

The oscillation frequency of the mirror-type scanning optical system 30 is preferably 10 Hz to 1 MHz, but is not limited thereto. The vibration frequency can be appropriately selected in consideration of the characteristics of the material, the size of the hole, the aspect ratio, and the like.

A rotational driving means such as a motor or a rotating cylinder for rotating the rotational axis of the mirror-type scanning optical system 30 may be used for the driving portion 32, or a vibration generating means such as a piezo element, a vibration motor or the like may be used.

A polygonal scanning optical system 30a may be used instead of the mirror-type scanning optical system 30 as shown in Fig. The polygonal scanning optical system 30a can induce continuous displacement of the path of the laser beam 1 because each surface is repeatedly provided as a reflecting surface even if the polygon rotates in one direction.

When the scanning optical systems 30 and 30a are driven, the angle of reflection of the laser beam 1 toward the focusing lens 40 is continuously changed, and the beam spot (see FIG. 4 1a perform reciprocating linear motion or unidirectional linear motion within the hole machining region 210. At this time, the direction of the linear motion is a direction orthogonal to the rotation center axis of the scanning optical system 30, 30a.

The first and second prisms 51 and 52 are formed so that the beam spot 1a formed on the material is incident on the optical axis of the focusing lens 40 (hereinafter referred to as 'optical axis' And to induce exercise.

The first prism 51 and the second prism 52 are rotated by the first motor 60 and the second motor 50, respectively, and each of the rotation center axes is preferably coaxial with the optical axis.

The first prism 51 has an exit plane opposite to the entrance plane toward the scanning optical system 30, 30a, and the entrance plane and the exit plane are not parallel.

In the embodiment of the present invention, the plane of incidence of the first prism 51 is perpendicular to the axis of rotation and the plane of emission is not perpendicular to the axis of rotation but is oblique. That is, the incident plane may be inclined with respect to the rotation center axis, the emission plane may be perpendicular to the rotation center axis, and both the incident plane and the emission plane may be inclined with respect to the rotation center axis.

The first prism 51 is supported by the first prism barrel 55 and the first prism barrel 55 is configured to rotate about the rotational center axis by the first motor 60. More specifically, the first prism barrel 55 can be rotated by winding the pulley 62 and the first prism barrel 55 coupled to the rotation shaft of the first motor 60 with a belt 64.

When the first prism 51 is rotated, the refraction angle at the position where the laser beam 1 is incident is continuously changed, thereby causing the path of the laser beam 1 to perform the circumferential movement about the rotation center axis, The laser beam 1 incident on the plane of incidence of the prism 52 performs a circumferential movement around the rotation center axis.

The second prism 52 is disposed between the first prism 51 and the focusing lens 40. The second prism 52 refracts the laser beam 1 transmitted through the first prism 51 and transmits the refracted laser beam 1 to the focusing lens 40 do.

The second prism 52 preferably has the same shape as the first prism 51 but is not limited thereto.

In the first embodiment of the present invention, the inclined surface of the second prism (52) is disposed so as to be opposite to the inclined surface of the first prism (51). That is, as shown in the figure, the second prism 52 is arranged in a manner such that the first prism 51 is rotated 180 degrees around the rotation center axis.

In this way, the laser beam 1 having passed through the first prism 51 and having a larger inclination with respect to the optical axis can be guided in the direction parallel to the optical axis while passing through the second prism 52.

The second prism barrel 56 is supported by the second prism barrel 56 and the second prism barrel 56 is configured to rotate about the rotational center axis by the second motor 70. The second prism barrel 56 can be rotated by winding the pulley 72 and the second prism barrel 56 coupled to the rotation shaft of the second motor 70 with the belt 74.

A laser beam 1 having passed through a rotating first prism 51 is incident on the incident plane of the second prism 52 while being circumferentially moved around the rotational center axis.

Assuming that the scanning optical systems 30 and 30a are fixed, when the first prism 51 and the second prism 52 rotate at the same speed and direction, the inclined surfaces of the first prism 51 and the second prism 52 So that the path of the laser beam 1 moves along the circumferential direction about the rotational center axis of the second prism 52. Accordingly, the beam spot 1a focused by the focusing lens 40 also moves along this locus in the hole processing region 210 of the material.

One of the first prism 51 and the second prism 52 may be fixed and only one of the first prism 51 and the second prism 52 may be fixed and the other one may be rotated. In this case, the path of the laser beam 1 may be a circumferential direction substantially centering on the rotational axis of the rotating prism, And the beam spot 1a is also moved along the corresponding trajectory in the hole processing region 210 of the material.

However, when the rotational speed and / or the rotational direction of the first prism 51 and the second prism 52 are different from each other, the path of the laser beam 1 is a circular motion around the rotational center axis of the first prism 51 And the second prism 52. The beam spot 1a moves along a relatively complicated trajectory. In this case, as shown in FIG.

Meanwhile, in the embodiment of the present invention, since the laser beam 1 passes through the first and second prisms 51 and 52 while performing the high-speed linear motion by the scanning optical system 30 and 30a, As shown in Fig. 4 (b), the movement path is a direction in which the linear direction by the vibration of the scanning optical system 30, 30a and the circumferential direction by the rotation of the first prism 51 and / And moves along the trajectory.

Thus, as shown in the drawing, the beam spot 1a moves uniformly over the entire interior of the hole processing region 210, so that holes can be formed while uniformly removing the material inside the hole processing region 210.

However, the movement locus of the beam spot 1a shown in FIG. 4 (b) is merely an example, and the specific movement locus is different from the vibration frequency of the scanning optical system 30, 30a and the first prism 51 and / ) And the rotational direction of the motor. For example, when there is not a large difference between the oscillation frequency of the scanning optical system 30, 30a and the rotational frequency of the first prism 51 and / or the second prism 52, the beam spot 1a passes through the hole processing region 210 ) In a complex helical trajectory.

It is preferable that the rotational direction and rotational speed of the first prism 51 and the second prism 52 are the same. In this case, the inclined surfaces of the first prism 51 and the second prism 52 are always opposite to each other. For example, even if the inclination angle of the laser beam with respect to the optical axis increases while passing through the first prism 51, ) So that the direction of the laser beam can be kept as close as possible to the optical axis. Thereby making it easier to implement a vertical hole with a large aspect ratio by reducing the angle of incidence for the material 200.

If necessary, the first prism 51 and the second prism 52 may be rotated at different speeds or may be rotated in directions opposite to each other. Such control may be performed temporarily during the hole processing process, or may be continuously performed throughout the process.

On the other hand, the diameter of the hole machining area 210 is determined by the inclination angle of each of the prisms 51 and 52, the distance between the prisms 51 and 52, the position of the focusing lens 40, and the like. Therefore, the laser hole processing apparatus according to the embodiment of the present invention may include a prism moving means for moving the prisms 51 and 52 along the optical axis, a lens moving means for moving the focusing lens 40, and the like.

The stage 100 moves the hole processing region 210 of the material 200 to the lower portion of the focusing lens 40 by using the XY driving unit 110 as the workpiece 200 is placed thereon, It is preferable that the center of the region 210 is positioned on the optical axis of the focusing lens 40. [ The XY driving unit 110 may include driving means in the x-axis and y-axis directions as well as driving means in the z-axis direction.

The laser light source 10, the transmission optical system 20, the scanning optical systems 30 and 30a, the first and second prisms 51 and 52, the focusing lens 40, In this case, the entire laser module may be moved to the hole machining position by using the XY drive means while the stage 100 is fixed.

FIG. 5 is a schematic view showing a laser beam machining apparatus according to a first embodiment of the present invention, in which a laser beam reflected at various angles by a scanning optical system 30, 30a moves within a hole forming region 210, Holes 220 are formed.

As shown in the drawing, according to the first embodiment of the present invention, the laser beam is continuously moved throughout the entire interior of the hole machining area 210. Accordingly, it is possible to secure more time for the separated material to be discharged to the outside by melting or evaporating at a certain position by the laser beam. Therefore, a very smooth cutting surface can be obtained because the phenomenon that the once separated material is melted again by the laser beam and is re-fused to the inner wall of the hole or the hole entrance is minimized.

Also, according to the first embodiment of the present invention, by using two prisms 51 and 52, the incidence angle at which the laser beam is incident on the material can be minimized, so that even for the high aspect ratio hole 200, And can be stably implemented.

FIG. 6 is a photograph of a hole formed in accordance with the method of the present invention and a hole according to the prior art, and it can be seen that the inner wall of the hole formed according to the present invention is much smoother and less contamination due to re-fusion.

7 is a front view and a side view of the optical system assembly in which the first and second prisms 51 and 52 and the focusing lens 40 are modularized. The optical system assembly includes a main frame 150, First to third prism barrels 55, 56 and 57 movably mounted on the linear guide 90 and each having a prism therein, prism barrels 55 and 56, 70, 80), and pulleys (62, 72, 82) coupled to the rotary shafts of the motors (60, 70, 80). The pulleys 62, 72, and 82 and the prism barrels 55, 56, and 57 include belts 64, 74, and 84, respectively.

A camera 92 may be installed on one side of the main frame 150. Although not shown in the figure, the scanning optical systems 30 and 30a and the driving unit 32 may be mounted on the main frame 150 together.

Such an optical system assembly may include driving means such as a servo motor for moving the first to third prism barrels 55, 56, and 57 along the linear guide 90. And a clamp or the like for fixing the positions of the first to third prism barrels 55, 56, 57. And may include measuring means for measuring the position or movement distance of the first to third prism barrels 55, 56, And driving means for moving the focusing lens 40 in the optical axis direction.

On the other hand, FIG. 7 shows that the optical system assembly is provided with three prisms, which is an exemplary one, so that the number of prisms and / or the angle of the inclined surface can be appropriately selected in consideration of the diameter,

That is, one prism may be provided according to specific design conditions, or two prisms may be provided as shown in Figs. 2 and 3, or four or more prisms may be provided. In the case of using a plurality of prisms, it is preferable to dispose the prisms so that the directions of the inclined surfaces of the vertically adjacent prisms are opposite to each other, but the present invention is not limited thereto.

Second Example

8, the laser beam machining apparatus according to the second embodiment of the present invention includes a laser light source 10, a transfer optical system 20, a scanning optical system 30, a focusing lens 40, A stage 100 on which the material 200 is placed, and a rotation driving means 120 for rotating the stage 100. [ Although the mirror-type scanning optical system 30 is shown in Fig. 8, the polygonal scanning optical system 30a may be used as in the first embodiment.

The laser hole machining apparatus according to the second embodiment of the present invention is capable of rotating the stage 100 by using the rotation driving unit 120 without using a prism so that the locus of the laser beam spot 1a, And the like.

The rotation driving unit 120 rotates the material 200 about the center of the hole processing region 210 and the center of the hole processing region 210 as the center of rotation with the optical axis of the focusing lens 40 aligned with the center of the hole processing region 210.

By doing so, the beam spot 1a of the laser beam is simultaneously subjected to the linear motion by the vibration of the scanning optical systems 30 and 30a and the rotational motion by the rotation of the material in the hole processing region 210 as in the first embodiment It is possible to perform hole processing while moving the beam spot 1a across the entire surface of the hole machining area 210. [

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments.

As an example, in the first embodiment, it has been described that the vibration of the scanning optical system 30, 30a and the rotation of the prisms 51, 52 proceed simultaneously at the time of hole processing, but this may be slightly modified in a specific process.

That is, when the oscillation frequency of the scanning optical system 30, 30a is much larger than the rotational frequency of the prisms 51, 52, as shown in Fig. 4 (b) The number of incidence is much larger than that of the peripheral portion, so that the center portion may be removed at a much faster rate than the peripheral portion.

Such a phenomenon is not related to the formation of the through-hole, but there is a problem that the bottom becomes uneven when the bottomed groove is formed.

9, the vibration of the scanning optical systems 30 and 30 and the rotation of the prisms 51 and 52 are simultaneously performed in the first period, and the scanning optical systems 30 and 30 are simultaneously rotated in the second period, It is preferable to rotate only the prisms 51 and 52 in a state where the prisms 51 and 52 are fixed.

In this case, although the central portion is formed deeper in the hole during the first period, the process for the peripheral portion is intensively performed during the second period, so that a smoother bottom can be obtained.

This method can also be applied to the case of performing hole processing using the apparatus according to the second embodiment. For example, in the first period, the vibration of the scanning optical systems 30 and 30 and the rotation of the material 200 using the rotation driving unit 120 are simultaneously performed. Then, in the second period, the scanning optical systems 30 and 30 are stopped Only the material 200 can be rotated.

As another example, in the first embodiment of the present invention, a plurality of prisms are shown as being rotated by respective separate motors (60, 70, 80), but it is also possible to combine power transmission means such as gears and pulleys It is also possible to drive the prisms of the prism in one operation. In this case, the rotational speed and the rotational direction of each prism can be set as desired by adjusting the number of gears, the gear ratio, and the pulley diameter.

Similarly, the power transmission means such as the pulleys 62, 72, and 82 and the belts 64, 74, and 84 connected to the motors 60, 70, and 80 may be replaced with gears, chains,

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. Of course.

10: laser light source 20: transmission optical system
30, 30a: scanning optical system 32:
40: focusing lens 51, 52: first and second prisms
55, 56, 57: First, second, and third prism barrels
60, 70, 80: first, second and third motors
62, 72, 82: pulley 64, 74, 84: belt
90: linear guide 100: stage
110: XY driving unit 120:
150: Mainframe 200: Material
210: Hole machining area 220: Hole

Claims (11)

Focusing lens;
A scanning optical system for reflecting the incident laser beam toward the focusing lens while changing a reflection angle within a set angle range;
At least one of an incidence plane and an emission plane being a slope not perpendicular to a rotation center axis;
A prism driving unit for rotating the prism about the rotation center axis,
Hole processing apparatus using laser The method according to claim 1,
Wherein the prism includes a first prism and a second prism arranged along a path of a laser beam, wherein the first prism and the second prism are disposed so that the slopes of the first prism and the second prism are opposite to each other. Processing device 3. The method of claim 2,
Wherein the prism driving unit rotates the first prism and the second prism at the same speed as the same direction, Focusing lens;
A scanning optical system for reflecting the incident laser beam toward the focusing lens while changing a reflection angle within a set angle range;
A rotation driving part for rotating the material around the center of the hole machining area defined in the material as the center of rotation;
Hole processing apparatus using laser 5. The method according to any one of claims 1 to 4,
Characterized in that the oscillation frequency of the scanning optical system is 10 Hz to 1 MHz. Reflecting a laser beam transmitted from a laser light source while changing a reflection angle within a set angle range of the scanning optical system;
Converting the path of the laser beam incident from the scanning optical system to move along a circumferential direction about the rotational center axis of the prism while the prism is rotating;
When the laser beam passing through the prism is focused on the material through the focusing lens, the beam spot of the laser beam travels along the combined trajectory in the linear direction and the circumferential direction about the optical axis within the hole processing region defined in the material Step of processing the material
≪ / RTI > The method according to claim 6,
Wherein the prism includes a first prism and a second prism arranged along a path of a laser beam, wherein the first prism and the second prism are disposed such that their inclined surfaces are opposite to each other,
Wherein the first prism and the second prism are rotated at the same speed as the same direction. The method according to claim 6,
Wherein the prism includes a first prism and a second prism arranged along a path of a laser beam, wherein the first prism and the second prism are disposed such that their inclined surfaces are opposite to each other,
Characterized in that the rotational speed or rotational direction of the first prism and that of the second prism are different from each other. 7. The method of claim 6, wherein after the step of processing the material,
Fixing the scanning optical system;
The laser beam reflected from the scanning optical system passes through the rotating prism and then is focused on the material through the focusing lens. The beam spot of the laser beam is directed in the circumferential direction about the optical axis in the hole processing region defined in the material Processing the material while moving
Further comprising the step of: Reflecting a laser beam transmitted from a laser light source while changing a reflection angle within a set angle range of the scanning optical system;
The material is rotated by the center of the hole machining area as a rotation axis, and when the laser beam reflected by the scanning optical system is focused on the material through the focusing lens, the beam spot of the laser beam moves in a linear direction And a step of processing the material while moving along the synthesized locus in the circumferential direction about the optical axis
≪ / RTI > 11. The method of claim 10, wherein after the step of processing the material,
Fixing the material;
A step of processing the material while the laser beam reflected from the scanning optical system is focused on the material through the focusing lens and the beam spot of the laser beam moves in the circumferential direction about the optical axis in the hole processing region defined in the material
Further comprising the step of:

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