KR20180092887A - Removing agent for rust-preventive film - Google Patents

Removing agent for rust-preventive film Download PDF

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KR20180092887A
KR20180092887A KR1020180016035A KR20180016035A KR20180092887A KR 20180092887 A KR20180092887 A KR 20180092887A KR 1020180016035 A KR1020180016035 A KR 1020180016035A KR 20180016035 A KR20180016035 A KR 20180016035A KR 20180092887 A KR20180092887 A KR 20180092887A
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rust
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nitrogen
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KR102335365B1 (en
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카즈타카 젠후쿠
타카하시 다나카
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아라까와 가가꾸 고교 가부시끼가이샤
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    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
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    • C09D9/005Chemical paint or ink removers containing organic solvents

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Abstract

The present invention aims to provide a remover for a rust preventative film, which can remove a rust preventative film comprising a nitrogen-containing heterocyclic compound having at least two nitrogen atoms. The remover for the rust preventative film comprising the nitrogen-containing heterocyclic compound having at least two nitrogen atoms contains: alkanolamine (A) represented by general formula 1: R^1(NHCH_2CH_2)_n-OH, a glycol ether solvent (B) and an organic carboxylic acid and/or a salt thereof (C). In the formula (1), R^1 represents hydrogen or an alkyl group having 1 to 4 carbon atoms, and n represents an integer of 1 to 2.

Description

방청막용 제거제{REMOVING AGENT FOR RUST-PREVENTIVE FILM}{REMOVING AGENT FOR RUST-PREVENTIVE FILM}

본 발명은 방청막용 제거제, 특히 2 이상의 질소 원자를 가지는 함질소 복소환 화합물로 이루어지는 방청막용 제거제에 관한 것이다.The present invention relates to a rust preventive film remover comprising a nitrogen-containing heterocyclic compound having at least two nitrogen atoms.

금속 표면의 방청을 목적으로 하여, 종래부터 이미다졸류 또는 트리아졸, 벤조트리아졸 등의 2 이상의 질소 원자를 가지는 함질소 복소환 화합물이 방청제로서 이용되고 있다. 특히, 프린트 배선판이나 인터포저(interposer) 등의 동 범프, 스루홀(through hole), 얼라인먼트 마크(alignment mark), 식별번호 부분 등의 동면에는 이들 방청제가 범용되고 있고, 형성된 방청막은 동과 킬레이트 결합함으로써 동면을 보호하여 높은 방청 효과를 가진다.Conventionally, imidazoles or nitrogen-containing heterocyclic compounds having two or more nitrogen atoms such as triazole and benzotriazole have been used as rust inhibitors for the purpose of rusting metal surfaces. Particularly, these antirusting agents are commonly used on copper surfaces such as copper bumps, through holes, alignment marks, identification number parts, etc. of printed wiring boards and interposers, and the formed anti- Thereby protecting the hibernation and having high rust prevention effect.

그렇지만, 상기 방청막은 동면에의 도포 후에 열화하거나 땜납 접합 공정에서의 열에 노출되는 등으로 착색되는 경우가 있다. 특히 얼라인먼트 마크나 식별번호 부분 등이 착색되면, 제조 장치의 센서로 기판이 인식되지 않기도 하고, 위치맞춤을 할 수 없는 등의 문제가 생기는 경우가 있다.However, the rust preventive film may be deteriorated after application to the hibernation, or may be colored due to exposure to heat in the solder jointing process. Particularly, when an alignment mark or an identification number portion is colored, the substrate may not be recognized by the sensor of the manufacturing apparatus, and alignment problems may arise.

상기 과제를 해결하기 위해, 방청막을 제거하는 기술로서, 예를 들면 제4급 암모늄 수산화물 용액을 이용하여 동 및 동 합금 표면의 착체 피막을 제거하는 방법이 공지이지만, 당해 발명은 미세배선 형성 기술이 필요한 첨단 전자부품 제조에서는 유용하지만, 방청막을 완전히 제거하기 때문에 단기간에 동면이 재차 변색된다.As a technique for removing the rust preventive film to solve the above problems, for example, a method of removing a complex film on the surface of copper and copper alloy using a quaternary ammonium hydroxide solution is known, It is useful in the production of high-tech electronic components as needed, but since the anticorrosive film is completely removed, the hibernation is discolored again in a short period of time.

일본국 특허공개 2002-097587호 공보Japanese Patent Application Laid-Open No. 2002-097587

본 발명의 과제는, 2 이상의 질소 원자를 가지는 함질소 복소환 화합물로 이루어지는 방청막을 단시간에 제거할 수 있는 방청막용 제거제를 제공하는 것에 있다.A problem to be solved by the present invention is to provide a rust preventive membrane remover capable of removing a rust preventive film composed of a nitrogen-containing heterocyclic compound having two or more nitrogen atoms in a short time.

본 발명자는 예의 검토한 결과, 특정의 알칸올아민, 그리고 글리콜에테르 용제 및 유기 카복실산을 함유하는 방청막용 제거제가, 상기 방청막에 있어서의 과제를 해결하는 것을 알아내어 본 발명을 완성시키기에 이르렀다. 즉, 본 발명은 이하의 방청막용 제거제에 관한 것이다.The present inventors have intensively studied and found that a specific alkanolamine, a glycol ether solvent, and a rust preventive film-containing remover containing an organic carboxylic acid solve the problems in the rustproof film, thereby completing the present invention. That is, the present invention relates to the following anti-rust film removing agent.

1. 일반식 (1)로 표시되는 알칸올아민(A), 글리콜에테르 용제(B), 그리고 유기 카복실산 및/또는 그 염(C)을 포함하는 2 이상의 질소 원자를 가지는 함질소 복소환 화합물로 이루어지는 방청막용 제거제.1. A nitrogen-containing heterocyclic compound having two or more nitrogen atoms, which comprises an alkanolamine (A) represented by the general formula (1), a glycol ether solvent (B), and an organic carboxylic acid and / And

R1-(NHCH2CH2)n-OH ···(1)R 1 - (NHCH 2 CH 2 ) n -OH (1)

(식 (1) 중 R1은 수소 또는 탄소수 1~4의 알킬기, n은 1~2의 정수를 나타낸다)(In the formula (1), R 1 represents hydrogen or an alkyl group having 1 to 4 carbon atoms, and n represents an integer of 1 to 2)

2. (A) 성분이 N-메틸에탄올아민, N-에틸에탄올아민, N-n-부틸에탄올아민 및 N-(2-아미노에틸)에탄올아민으로 이루어지는 군에서 선택되는 적어도 1종을 포함하는 전항 1의 방청막용 제거제.2. The method according to item 1, wherein the component (A) comprises at least one member selected from the group consisting of N-methylethanolamine, N-ethylethanolamine, N-n-butylethanolamine and N- 1 < / RTI >

3. (B) 성분이 일반식 (2)로 표시되는 전항 1 또는 2의 방청막용 제거제.3. The remover for rust-preventive membrane according to item 1 or 2, wherein the component (B) is represented by the general formula (2).

R2-(OCH2CHX)m-OH ···(2)R 2 - (OCH 2 CHX) m -OH (2)

(식 (2) 중 R2는 탄소수 1~4의 알킬기, X는 수소 또는 메틸기, m은 1~3의 정수를 나타낸다)(In the formula (2), R 2 represents an alkyl group having 1 to 4 carbon atoms, X represents a hydrogen or a methyl group, and m represents an integer of 1 to 3)

4. (C) 성분이 유기 모노카복실산, 유기 디카복실산, 유기 트리카복실산 및 이들의 염으로 이루어지는 군에서 선택되는 적어도 1종을 포함하는 전항 1~3 중 어느 한 항의 방청막용 제거제.4. The remover for the rust inhibitor film according to any one of items 1 to 3, wherein the component (C) comprises at least one member selected from the group consisting of an organic monocarboxylic acid, an organic dicarboxylic acid, an organic tricarboxylic acid and salts thereof.

5. (A) 성분이 N-알킬디에탄올아민을 더 포함하는 전항 1~4 중 어느 한 항의 방청막용 제거제.5. The remover for a rust inhibitor film according to any one of items 1 to 4, wherein the component (A) further comprises N-alkyldiethanolamine.

6. 제거제 중의 함유 비율이 (A) 성분 1~20중량%, (B) 성분 75~98.5중량% 및 (C) 성분 0.1~5중량%인 전항 1~5 중 어느 한 항의 방청막용 제거제.6. The remover for a rust inhibitor film according to any one of items 1 to 5, wherein the content in the remover is from 1 to 20% by weight of the component (A), from 75 to 98.5% by weight of the component (B) and from 0.1 to 5% by weight of the component (C).

7. 기판 상에 인쇄된 얼라인먼트 마크 및/또는 식별번호 부분에 형성되는 상기 방청막을 제거하는 전항 1~6 중 어느 한 항의 방청막용 제거제.7. A remover for a rust-preventive film according to any one of items 1 to 6, wherein the rust-inhibitive film formed on the alignment mark and / or identification number portion printed on the substrate is removed.

본 발명의 방청막용 제거제에 의하면, 기판 상에 형성된, 2 이상의 질소 원자를 가지는 함질소 복소환 화합물로 이루어지는 방청막을 단시간에 제거할 수 있지만, 완전히 제거하는 것이 아니라 방청막의 막두께를 수십nm 정도 남기기 때문에 방청 효과도 유지된다.According to the removal agent for a rust preventive film of the present invention, a rust preventive film formed of a nitrogen-containing heterocyclic compound having two or more nitrogen atoms and formed on a substrate can be removed in a short period of time, but not completely removed but the film thickness of the rust- Therefore, the rust prevention effect is also maintained.

본 발명의 2 이상의 질소 원자를 가지는 함질소 복소환 화합물로 이루어지는 방청막용 제거제(이하 간결하게“방청막용 제거제”라고도 한다)는, 일반식 (1)로 표시되는 알칸올아민(A)(이하 (A) 성분이라고 한다), 글리콜에테르 용제(B)(이하 (B) 성분이라고 한다), 그리고 유기 카복실산 및/또는 그 염(C)(이하 (C) 성분이라고 한다)을 함유한다.The rust preventive film remover comprising a nitrogen-containing heterocyclic compound having two or more nitrogen atoms of the present invention (hereinafter briefly referred to as " rust-inhibiting film remover ") comprises an alkanolamine (A) represented by the general formula (1) (Hereinafter referred to as component (A)), a glycol ether solvent (B) (hereinafter referred to as component (B)), and an organic carboxylic acid and / or salt thereof (hereinafter referred to as component (C)).

(A) 성분으로서는 식 (1)로 표시되는 것이 방청막을 단시간에 제거하기 위해 필요한 성분이다.As the component (A), the component represented by the formula (1) is a component necessary for removing the anticorrosive film in a short time.

R1-(NHCH2CH2)n-OH ···(1)R 1 - (NHCH 2 CH 2 ) n -OH (1)

(식 (1) 중 R1은 수소 또는 탄소수 1~4의 알킬기, n은 1~2의 정수를 나타낸다)(In the formula (1), R 1 represents hydrogen or an alkyl group having 1 to 4 carbon atoms, and n represents an integer of 1 to 2)

식 (1)로 표시되는 것으로서는 예를 들면, 모노에탄올아민, N-메틸에탄올아민, N-에틸에탄올아민, N-n-프로필에탄올아민, N-이소프로필에탄올아민, N-n-부틸에탄올아민, N-이소부틸에탄올아민, N-sec-부틸에탄올아민, N-tert-부틸에탄올아민, N-(2―아미노에틸)에탄올아민 등을 들 수 있고, 이들은 단독으로도 2종 이상을 조합해도 좋다. 이들 중에서도 제거제의 헹굼성의 점에서, N-메틸에탄올아민, N-에틸에탄올아민, N-n-부틸에탄올아민 또는 N-(2-아미노에틸)에탄올아민이 바람직하다.Examples of the compound represented by the formula (1) include monoethanolamine, N-methylethanolamine, N-ethylethanolamine, N-n-propylethanolamine, N-isopropylethanolamine, N- Amine, N-isobutylethanolamine, N-sec-butylethanolamine, N-tert-butylethanolamine, N- (2-aminoethyl) ethanolamine and the like. Maybe. Of these, N-methylethanolamine, N-ethylethanolamine, N-n-butylethanolamine or N- (2-aminoethyl) ethanolamine are preferable in view of the rinsability of the removing agent.

본 발명의 방청막용 제거제 중에 있어서의 (A) 성분의 중량 비율은 특히 한정되지 않지만, 제거제의 헹굼성 및 제거 효과의 밸런스(balance)로부터, 고형분 환산으로 통상은 1~20중량% 정도, 바람직하게는 1~15중량% 정도, 보다 바람직하게는 1~10중량% 정도이다.The weight ratio of the component (A) in the removing agent for a rust preventive film of the present invention is not particularly limited, but it is usually from 1 to 20% by weight in terms of solid content from the balance of the rinsing property and the removing effect of the removing agent Is about 1 to 15% by weight, and more preferably about 1 to 10% by weight.

(B) 성분으로서는 특히 한정되지 않고 각종 공지의 것을 사용할 수 있지만, 예를 들면, 하기 식 (2)로 표시되는 것 등을 들 수 있다.The component (B) is not particularly limited and various known compounds can be used. Examples thereof include those represented by the following formula (2).

R2-(OCH2CHX)m-OH ···(2)R 2 - (OCH 2 CHX) m -OH (2)

(식 (2) 중 R2는 탄소수 1~4의 알킬기, X는 수소 또는 메틸기, m은 1~3의 정수를 나타낸다)(In the formula (2), R 2 represents an alkyl group having 1 to 4 carbon atoms, X represents a hydrogen or a methyl group, and m represents an integer of 1 to 3)

식 (2)로 표시되는 것으로서는, m의 값으로 이하의 것을 각각 들 수 있다.As the value represented by the formula (2), the following values are respectively listed as m.

m=1로서는 메틸글리콜, 에틸글리콜, n-프로필글리콜, 이소프로필글리콜, n-부틸글리콜, 이소부틸글리콜, sec-부틸글리콜, tert-부틸글리콜, 메틸프로필렌글리콜, 에틸프로필렌글리콜, n-프로필프로필렌글리콜, 이소프로필프로필렌글리콜, n-부틸프로필렌글리콜, 이소부틸프로필렌글리콜, sec-부틸프로필렌글리콜, tert-부틸프로필렌글리콜 등을 들 수 있다.Examples of m = 1 include methyl glycol, ethyl glycol, n-propyl glycol, isopropyl glycol, n-butyl glycol, isobutyl glycol, sec-butyl glycol, tert-butyl glycol, methylpropylene glycol, Glycol, isopropyl propylene glycol, n-butyl propylene glycol, isobutyl propylene glycol, sec-butyl propylene glycol, tert-butyl propylene glycol and the like.

m=2로서는 메틸디글리콜, 에틸디글리콜, n-프로필디글리콜, 이소프로필디글리콜, n-부틸디글리콜, 이소부틸디글리콜, sec-부틸디글리콜, tert-부틸디글리콜, 메틸프로필렌디글리콜, 에틸프로필렌디글리콜, n-프로필프로필렌디글리콜, 이소프로필프로필렌디글리콜, n-부틸프로필렌디글리콜, 이소부틸프로필렌디글리콜, sec-부틸프로필렌디글리콜, tert-부틸프로필렌디글리콜 등을 들 수 있다.Examples of m = 2 include methyldiglycol, ethyldiglycol, n-propyldiglycol, isopropyldiglycol, n-butyldiglycol, isobutyldiglycol, sec-butyldiglycol, tert-butyldiglycol, Propyleneglycol, isopropylpropyleneglycol, n-butylpropyleneglycol, isobutylpropyleneglycol, sec-butylpropyleneglycol, tert-butylpropyleneglycol and the like can be mentioned .

m=3으로서는 메틸트리글리콜, 에틸트리글리콜, n-프로필트리글리콜, 이소프로필트리글리콜, n-부틸트리글리콜, 이소부틸트리글리콜, sec-부틸트리글리콜, tert-부틸트리글리콜, 메틸프로필렌트리글리콜, 에틸프로필렌트리글리콜, n-프로필프로필렌트리글리콜, 이소프로필프로필렌트리글리콜, n-부틸프로필렌트리글리콜, 이소부틸프로필렌트리글리콜, sec-부틸프로필렌트리글리콜, tert-부틸프로필렌트리글리콜 등을 들 수 있다.Examples of m = 3 include methylene glycol, ethyltriglycol, n-propyltriglycol, isopropyltriglycol, n-butyltriglycol, isobutyltriglycol, sec-butyltriglycol, tert-butyltriglycol, , Ethyl propylene triglycol, n-propyl propylene triglycol, isopropyl propylene triglycol, n-butyl propylene triglycol, isobutyl propylene triglycol, sec-butyl propylene triglycol and tert- butyl propylene triglycol .

이들 (B) 성분은 단독으로도 2종 이상을 조합해도 좋다. 이들 중에서도 제거제의 제거 효과 및 환경 특성의 점에서, 식 (2)에서 R1이 탄소수 3 또는 4의 알킬기를 가지는 것이 바람직하고, n-부틸글리콜, n-프로필프로필렌글리콜, n-프로필디글리콜, n-부틸디글리콜 및 n-부틸트리글리콜로 이루어지는 군에서 선택되는 적어도 1종이 보다 바람직하다.These components (B) may be used alone or in combination of two or more. Among them, R 1 in the formula (2) preferably has an alkyl group having 3 or 4 carbon atoms in view of the removal effect of the removing agent and environmental characteristics, and is preferably an alkyl group having 3 or 4 carbon atoms such as n-butyl glycol, n-propyleneglycol, n-propyldiglycol, n-butyldiglycol and n-butyltriglycol.

본 발명의 방청막용 제거제 중에 있어서의 (B) 성분의 중량 비율은 특히 한정되지 않지만, 제거제의 제거 효과의 점에서, 고형분 환산으로 통상은 75~98.5중량% 정도, 바람직하게는 80~97중량% 정도이다.The weight ratio of the component (B) in the removal agent for a rust preventive film of the present invention is not particularly limited, but is usually from 75 to 98.5% by weight, preferably from 80 to 97% by weight, in terms of solid content, Respectively.

(C) 성분으로서는 특히 한정되지 않고 각종 공지의 것을 사용할 수 있고, 예를 들면, 폼산, 초산, 프로피온산, 유산, 안식향산, 살리실산 등의 유기 모노카복실산; 옥살산, 말론산, 호박산, 글루타르산, 아디프산, 세박산, 아젤라산, 도데칸 이산, 사과산, 프탈산, 이소프탈산, 테레프탈산 등의 유기 디카복실산; 트리카발릴산, 구연산, 트리멜리트산 등의 유기 트리카복실산; 에틸렌테트라카복실산, 부탄테트라카복실산 등의 유기 테트라카복실산 등을 들 수 있다. 또 그 염으로서는 암모늄염 등을 들 수 있다. 이들은 단독으로도 2종 이상을 조합해도 좋다. 이들 중에서도 제거제의 제거 효과의 점에서, 유기 모노카복실산, 유기 디카복실산, 유기 트리카복실산 및 이들의 염으로 이루어지는 군에서 선택되는 적어도 1종을 포함하는 것이 바람직하고, 폼산, 초산, 초산암모늄, 구연산, 호박산, 사과산, 유산, 말론산 및 살리실산으로 이루어지는 군에서 선택되는 적어도 1종을 포함하는 것이 보다 바람직하다.The component (C) is not particularly limited and various known ones can be used, and examples thereof include organic monocarboxylic acids such as formic acid, acetic acid, propionic acid, lactic acid, benzoic acid and salicylic acid; Organic dicarboxylic acids such as tricarboxylic acid, citric acid, and trimellitic acid; organic dicarboxylic acids such as ethylene tetracarboxylic acid, butanetetracarboxylic acid, and the like Of organic tetracarboxylic acids. Examples of the salt include ammonium salts and the like. These may be used singly or in combination of two or more. Among them, at least one selected from the group consisting of an organic monocarboxylic acid, an organic dicarboxylic acid, an organic tricarboxylic acid and a salt thereof is preferable in view of the removal effect of the removing agent, and it is preferable to contain at least one member selected from the group consisting of formic acid, And more preferably at least one selected from the group consisting of succinic acid, malic acid, lactic acid, malonic acid and salicylic acid.

본 발명의 방청막용 제거제 중에 있어서의 (C) 성분의 중량 비율은 특히 한정되지 않지만, 제거제의 제거 효과의 점에서, 고형분 환산으로 통상은 0.1~5중량% 정도, 바람직하게는 0.1~4중량% 정도, 보다 바람직하게는 0.1~3중량% 정도이다.The weight ratio of the component (C) to the component (C) in the rust preventive film of the present invention is not particularly limited, but is usually about 0.1 to 5% by weight, preferably 0.1 to 4% by weight in terms of solid content, , More preferably about 0.1 to 3 wt%.

본 발명의 방청막용 제거제에는, 제거제의 헹굼성의 점에서, (A) 이외의 알칸올아민(D)(이하 (D) 성분이라고 한다)을 더 포함해도 좋다. (D) 성분으로서는 특히 한정되지 않지만, 예를 들면, N-메틸디에탄올아민, N-에틸디에탄올아민, N-n-프로필디에탄올아민, N-이소프로필디에탄올아민, N-n-부틸디에탄올아민, N-이소부틸디에탄올아민, N-sec-부틸디에탄올아민, N-tert-부틸디에탄올아민 등의 N-알킬디에탄올아민; N, N-디메틸에탄올아민, N, N-디에틸에탄올아민, N, N-디-n-프로필에탄올아민, N, N-디이소프로필에탄올아민, N, N-디-n-부틸에탄올아민, N, N-디이소부틸에탄올아민, N, N-디-sec-부틸에탄올아민, N, N-디-tert-부틸에탄올아민, N, N-디(2―아미노에틸)에탄올아민 등의 N, N-디알킬에탄올아민; 디에탄올아민 등을 들 수 있다. 이들은 단독으로도 2종 이상을 조합해도 좋다.The rust preventive membrane removing agent of the present invention may further contain an alkanolamine (D) (hereinafter referred to as (D) component) other than (A) in view of the rinsability of the removing agent. Examples of the component (D) include, but are not limited to, N-methyldiethanolamine, N-ethyldiethanolamine, N-n-propyldiethanolamine, N-isopropyldiethanolamine, N- Alkyldiethanolamines such as N, N-dimethylethanolamine, N, N-dimethylethanolamine, N, N-dimethylethanolamine, N, N-dimethyldiethanolamine, N-tert- butyldiethanolamine, Diethanolamine, N, N-di-n-butylethanolamine, N, N-diisobutylethanolamine, N, N-diisopropylethanolamine, N, N-dialkylethanolamines such as N, N-di-tert-butylethanolamine, N, N-di- And the like. These may be used singly or in combination of two or more.

본 발명의 방청막용 제거제 중에 있어서의 (D) 성분의 중량 비율은 특히 한정되지 않지만, 고형분 환산으로 0.1~10중량% 정도가 바람직하다.The weight ratio of the component (D) in the removing agent for a rust preventive film of the present invention is not particularly limited, but is preferably about 0.1 to 10% by weight in terms of solid content.

본 발명의 방청막용 제거제는 인화성의 점에서, 필요에 따라 물을 포함해도 좋다. 본 발명의 제거제 중에 있어서의 물의 중량 비율도 특히 한정되지 않지만, 2~30중량% 정도가 바람직하다.The rust-preventive-film removing agent of the present invention may contain water as necessary in view of flammability. The weight ratio of water in the remover of the present invention is not particularly limited, but is preferably about 2 to 30% by weight.

본 발명의 방청막용 제거제는 각종 공지의 첨가제를 포함해도 좋다. 첨가제로서는 특히 한정되지 않고, 예를 들면, 킬레이트제, 산화방지제, 소포제, pH 조정제, 이미다졸계 방청제, 트리아졸계 방청제, 안정화제, 분산제, 계면활성제 등을 들 수 있다. 또, 첨가제의 사용량도 특히 한정되지 않지만, 통상은 방청막용 제거제 100중량부에 대해 1중량부 미만이다.The rust preventive film removing agent of the present invention may contain various known additives. The additive is not particularly limited, and examples thereof include a chelating agent, an antioxidant, a defoaming agent, a pH adjuster, an imidazole-based rheological agent, a triazole-based rheological agent, a stabilizer, a dispersant and a surfactant. The amount of the additive to be used is not particularly limited, but is usually less than 1 part by weight based on 100 parts by weight of the rust inhibitor removing agent.

본 발명의 방청막용 제거제는 2 이상의 질소 원자를 가지는 함질소 복소환 화합물로 이루어지는 방청막에 적용한다. 상기 함질소 복소환 화합물로서는 특히 한정되지 않지만, 예를 들면, 이미다졸류 또는 트리아졸류 등을 들 수 있고, 이들은 단독으로도 2종 이상을 조합해도 좋다.The rust preventive film removing agent of the present invention is applied to a rust preventive film comprising a nitrogen-containing heterocyclic compound having two or more nitrogen atoms. Examples of the nitrogen-containing heterocyclic compound include, but are not limited to, imidazoles, triazoles, etc. These compounds may be used singly or in combination of two or more.

이미다졸류로서는 특히 한정되지 않지만, 예를 들면, 이미다졸, 2-메틸이미다졸, 2-에틸이미다졸, 2-프로필이미다졸, 2-이소프로필이미다졸, 2-부틸이미다졸, 2-t-부틸이미다졸, 2-펜틸이미다졸, 2-헥실이미다졸, 2-헵틸이미다졸, 2-(1-에틸펜틸)이미다졸, 2-옥틸이미다졸, 2-노닐이미다졸, 2-데실이미다졸, 2-운데실이미다졸, 2-도데실이미다졸, 2-트리데실이미다졸, 2-테트라데실이미다졸, 2-펜타데실이미다졸, 2-헥사데실이미다졸, 2-헵타데실이미다졸, 2-(1-메틸펜틸)이미다졸, 2-(1-에틸펜틸)이미다졸, 2-(1-헵틸디실)이미다졸, 2-(5-헥세닐)이미다졸, 2-(9-옥테닐)이미다졸, 2-(8-헵타데세닐)이미다졸, 2-(4-클로로부틸)이미다졸, 2-(9-히드록시노닐)이미다졸, 2-에틸-4-메틸이미다졸, 2-운데실-4-메틸이미다졸, 2-헵타데실-4-메틸이미다졸, 2-페닐이미다졸, 2-페닐-4-메틸이미다졸, 2-(1-나프틸)이미다졸, 2-(1-나프틸)-4-메틸이미다졸, 2-(2-나프틸)이미다졸, 2-(2-나프틸)-4-메틸이미다졸, 2-메틸-4-페닐이미다졸, 4-페닐이미다졸, 4-메틸이미다졸, 4-이소프로필이미다졸, 4-옥틸이미다졸, 2, 4, 5-트리메틸이미다졸 등을 들 수 있다.Examples of imidazoles include, but are not limited to, imidazole, 2-methylimidazole, 2-ethylimidazole, 2-propylimidazole, 2-isopropylimidazole, (2-heptylimidazole, 2-heptylimidazole, 2- (1-ethylpentyl) imidazole, 2-octylimidazole, 2-undecylimidazole, 2-undecylimidazole, 2-tridecylimidazole, 2-tetradecylimidazole, 2-pentadecyl (1-methylpentyl) imidazole, 2- (1-ethylpentyl) imidazole, 2- (1-heptyldisilyl) imidazole, 2- Imidazole, 2- (8-heptadecenyl) imidazole, 2- (4-chlorobutyl) imidazole, 2- (9-hydroxynonyl) imidazole, 2-ethyl-4-methylimidazole, 2-undecyl- Phenylimidazole, 2-phenyl-4-methylimidazole, 2- (1-naphthyl) imidazole, 2- (1-naphthyl) Phenylimidazole, 4-phenylimidazole, 2- (2-naphthyl) imidazole, 2- 4-methylimidazole, 4-isopropylimidazole, 4-octylimidazole, 2,4,5-trimethylimidazole, and the like.

트리아졸류로서는 특히 한정되지 않지만, 예를 들면, 1, 2, 3-트리아졸, 1, 2, 4-트리아졸, 1-메틸-1, 2, 4-트리아졸, 1-에틸-1, 2, 4-트리아졸, 1-프로필-1, 2, 4-트리아졸, 1-이소프로필-1, 2, 4-트리아졸, 1-부틸-1, 2, 4-트리아졸, 1-메틸-1, 2, 3-트리아졸, 1-에틸-1, 2, 3-트리아졸, 1-프로필-1, 2, 3-트리아졸, 1-이소프로필-1, 2, 3-트리아졸, 1-부틸-1, 2, 3-트리아졸, 1-메틸벤조트리아졸 등을 들 수 있다.The triazoles are not particularly limited, and examples thereof include 1,2,3-triazole, 1,2,4-triazole, 1-methyl-1,2,4-triazole, Triazole, 1-propyl-1,2,4-triazole, 1-isopropyl-1,2,4-triazole, Triazole, 1-ethyl-1,2,3-triazole, 1-propyl-1,2,3-triazole, 1-isopropyl-1,2,3-triazole, 1 -Butyl-1,2,3-triazole, 1-methylbenzotriazole, and the like.

본 발명의 방청막용 제거제는 특히 한정되지 않고, 예를 들면, 프린트 기판이나 인터포저 등의 동 랜드(땜납 접합면), 스루홀, 얼라인먼트 마크, 식별번호 부분 등에 형성된 방청막 등을 제거할 수 있다.The rust-preventive film remover of the present invention is not particularly limited, and for example, a rust-preventive film or the like formed on a land (solder joint surface) such as a printed board or interposer, a through hole, an alignment mark, .

본 발명의 방청막용 제거제로의 처리에 즈음해서는, 특히 한정되지 않지만, 제거제의 제거 효과의 점에서, 온도 50~75℃ 정도, 시간 1~5분 정도로 행하는 것이 바람직하다. 이에 의해 단시간에 막두께 50nm 이하까지 제거할 수 있고, 또한 제거 후의 기판에는 방청막도 얇게 남기 때문에 방청 효과도 가진다. 또, 상기 제거제의 사용 방법도 특히 한정되지 않고, 예를 들면 샤워, 침지, 스프레이, 초음파 등을 들 수 있다.The treatment with the removing agent for a rust preventive film of the present invention is not particularly limited, but from the viewpoint of the removing effect of the removing agent, it is preferable to carry out the treatment at a temperature of about 50 to 75 캜 for about 1 to 5 minutes. As a result, the film thickness can be reduced to 50 nm or less in a short period of time, and the rust-preventive film is also left thin on the substrate after the removal. The method of using the remover is not particularly limited, and examples thereof include a shower, an immersion, a spray, and an ultrasonic wave.

<실시예><Examples>

이하, 본 발명을 실시예 및 비교예를 통하여 상세히 설명하지만, 그들에 의해 본 발명의 범위가 제한되지 않는 것은 물론이다. 또, 실시예 중의 「부」 및 「%」는 특히 언급이 없는 한 중량 기준을 의미한다.Hereinafter, the present invention will be described in detail with reference to Examples and Comparative Examples, but it goes without saying that the scope of the present invention is not limited by them. In the examples, &quot; part &quot; and &quot;% &quot; are by weight unless otherwise specified.

실시예Example 1 One

200ml의 비커에 N-메틸에탄올아민(이하 MEM이라고 한다) 1부, n-부틸디글리콜(이하 BDG라고 한다) 93.7부, 구연산 0.3부 및 물 5부를 실온에서 균일하게 될 때까지 혼합하여 방청막용 제거제를 조제하였다. 표 1에 조성을 나타낸다(이하 마찬가지).1 part of N-methylethanolamine (hereinafter referred to as MEM), 93.7 parts of n-butyl diglycol (hereinafter referred to as BDG), 0.3 part of citric acid and 5 parts of water were mixed at room temperature until they became homogeneous, A remover was prepared. The composition is shown in Table 1 (hereinafter the same).

실시예Example 2~23,  2 to 23, 비교예Comparative Example 1~12 1 to 12

표 1에 나타내는 것 같은 조성으로 실시예 1과 마찬가지로 행하여 방청막용 제거제를 각각 얻었다.The composition shown in Table 1 was used in the same manner as in Example 1 to obtain a rust preventive film removing agent.

동판(인탈산 동판 C1220P(JIS H3100에 규정), 치수: 50mm×50mm×0.5mm)의 동면에, 막두께가 300nm로 되도록, 시판의 이미다졸(상품명: 터프에이스 F2(LX), 시고쿠화성공업(주)제)을 이용하여 소정 시간 침지한 후, 탈수, 건조하여 방청막을 형성시킨 시험용 동판을 만들었다. 상기 시험용 동판을 60℃로 가온한 실시예 1의 제거제에 침지하여 1분간 초음파 세정을 행하였다. 다음에 순수로 헹구고, 질소 블로우로 시험용 동판의 표면을 탈수한 후, 상온에서 감압 건조를 행하였다. 또, 실시예 2~23 및 비교예 1~12의 제거제에 대해서도 마찬가지로 행하였다.(Commercial name: Tough Ace F2 (LX), Shikoku Chemical Co., Ltd.) having a thickness of 300 nm on the copper surface of a copper plate (phosphorus acid copper plate C1220P (specified in JIS H3100) and dimensions: 50 mm x 50 mm x 0.5 mm) Manufactured by Kokusa Kogyo Co., Ltd.) for a predetermined period of time, followed by dehydration and drying to form a rust preventive film. The test copper board was immersed in the remover of Example 1 which had been heated to 60 DEG C and subjected to ultrasonic cleaning for 1 minute. Then, the surface of the test copper plate was dehydrated by nitrogen blowing, and then dried under reduced pressure at room temperature. Also, the removers of Examples 2 to 23 and Comparative Examples 1 to 12 were carried out in the same manner.

(제거 효과)(Removal effect)

시험용 동판의 동면을 ESCA(장치명: PHI5000 VersaProbe Ⅱ, 얼박파이(주)제)로 측정하고, 질소 원자가 검출되지 않게 될 때까지 에칭을 행하고, 그 시간부터 시험용 동판의 동면에 잔류한 방청막의 막두께를 산출하였다.The copper surface of the test copper plate was measured by ESCA (apparatus name: PHI5000 VersaProbe II, manufactured by EINBAK PIE Co., Ltd.), etching was performed until no nitrogen atoms were detected, and the thickness of the rust preventive film remained on the copper surface of the test copper plate Respectively.

◎: 처리 후의 막두께가 30nm 미만(에칭 시간: 2분 이내)?: Film thickness after treatment less than 30 nm (etching time: within 2 minutes)

○: 처리 후의 막두께가 30nm 이상 60nm 미만(에칭 시간: 2~4분)?: Film thickness after treatment of 30 nm or more and less than 60 nm (etching time: 2 to 4 minutes)

△: 처리 후의 막두께가 60nm 이상 90nm 미만(에칭 시간: 4~6분)DELTA: film thickness after treatment of 60 nm or more and less than 90 nm (etching time: 4 to 6 minutes)

×: 처리 후의 막두께가 90nm 이상(에칭 시간: 6분 이상)X: film thickness after processing: 90 nm or more (etching time: 6 minutes or more)

Figure pat00001
Figure pat00001

※ 각 성분의 사용량에 대해서는 중량%로 나타낸다.※ The amount of each component is expressed in% by weight.

표 1 중의 약호는 이하의 화합물을 나타낸다.The abbreviations in Table 1 represent the following compounds.

<(A) 성분>&Lt; Component (A) &gt;

·MEM: N-에틸에탄올아민MEM: N-ethylethanolamine

·MMA: N-메틸에탄올아민MMA: N-methylethanolamine

·EA: N-(2-아미노에틸)에탄올아민EA: N- (2-aminoethyl) ethanolamine

·MBM: N-n-부틸에탄올아민MBM: N-n-butylethanolamine

<(D) 성분>&Lt; Component (D) &gt;

·MBD: N-n-부틸디에탄올아민MBD: N-n-butyl diethanolamine

·MDA: N-메틸디에탄올아민MDA: N-methyl diethanolamine

<(B) 성분>&Lt; Component (B) &gt;

·BDG: n-부틸디글리콜BDG: n-butyl diglycol

·BG: n-부틸글리콜BG: n-butyl glycol

·BTG: n-부틸트리글리콜BTG: n-butyltriglycol

·PDG: n-프로필디글리콜PDG: n-propyl diglycol

·PFG: n-프로필프로필렌글리콜PFG: n-propyl propylene glycol

Claims (7)

일반식 (1)로 표시되는 알칸올아민(A), 글리콜에테르 용제(B), 그리고 유기 카복실산 및/또는 그 염(C)을 포함하는 2 이상의 질소 원자를 가지는 함질소 복소환 화합물로 이루어지는 방청막용 제거제.
R1-(NHCH2CH2)n-OH ···(1)
(식 (1) 중 R1은 수소 또는 탄소수 1~4의 알킬기, n은 1~2의 정수를 나타낸다)
(1), comprising an alkanolamine (A), a glycol ether solvent (B) and a nitrogen-containing heterocyclic compound having at least two nitrogen atoms including an organic carboxylic acid and / or a salt thereof Membrane remover.
R 1 - (NHCH 2 CH 2 ) n -OH (1)
(In the formula (1), R 1 represents hydrogen or an alkyl group having 1 to 4 carbon atoms, and n represents an integer of 1 to 2)
제1항에 있어서,
(A) 성분이 N-메틸에탄올아민, N-에틸에탄올아민, N-n-부틸에탄올아민 및 N-(2-아미노에틸)에탄올아민으로 이루어지는 군에서 선택되는 적어도 1종을 포함하는 것을 특징으로 하는 방청막용 제거제.
The method according to claim 1,
(A) comprises at least one member selected from the group consisting of N-methylethanolamine, N-ethylethanolamine, N-n-butylethanolamine and N- (2-aminoethyl) ethanolamine A rust inhibitor.
제1항 또는 제2항에 있어서,
(B) 성분이 일반식 (2)로 표시되는 것을 특징으로 하는 방청막용 제거제.
R2-(OCH2CHX)m-OH ···(2)
(식 (2) 중 R2는 탄소수 1~4의 알킬기, X는 수소 또는 메틸기, m은 1~3의 정수를 나타낸다)
3. The method according to claim 1 or 2,
And the component (B) is represented by the general formula (2).
R 2 - (OCH 2 CH X ) m -OH (2)
(In the formula (2), R 2 represents an alkyl group having 1 to 4 carbon atoms, X represents a hydrogen or a methyl group, and m represents an integer of 1 to 3)
제1항 내지 제3항 중 어느 한 항에 있어서,
(C) 성분이 유기 모노카복실산, 유기 디카복실산, 유기 트리카복실산 및 이들의 염으로 이루어지는 군에서 선택되는 적어도 1종을 포함하는 것을 특징으로 하는 방청막용 제거제.
4. The method according to any one of claims 1 to 3,
(C) comprises at least one member selected from the group consisting of an organic monocarboxylic acid, an organic dicarboxylic acid, an organic tricarboxylic acid, and salts thereof.
제1항 내지 제4항 중 어느 한 항에 있어서,
N-알킬디에탄올아민을 더 포함하는 것을 특징으로 하는 방청막용 제거제.
5. The method according to any one of claims 1 to 4,
Alkyldiethanolamine. &Lt; RTI ID = 0.0 &gt; 11. &lt; / RTI &gt;
제1항 내지 제5항 중 어느 한 항에 있어서,
(A)~(C) 성분의 중량 비율이 (A) 성분 1~20중량%, (B) 성분 75~98.9중량% 및 (C) 성분 0.1~5중량%인 것을 특징으로 하는 방청막용 제거제.
6. The method according to any one of claims 1 to 5,
Wherein the weight ratio of the components (A) to (C) is from 1 to 20% by weight of the component (A), from 75 to 98.9% by weight of the component (B) and from 0.1 to 5% by weight of the component (C).
제1항 내지 제6항 중 어느 한 항에 있어서,
기판 상에 인쇄된 얼라인먼트 마크 및/또는 식별번호 부분에 형성되는 상기 방청막을 제거하는 것을 특징으로 하는 방청막용 제거제.
7. The method according to any one of claims 1 to 6,
And removing the rust-preventive film formed on the alignment mark and / or identification number portion printed on the substrate.
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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002097587A (en) 2000-09-21 2002-04-02 Mitsubishi Gas Chem Co Inc Method for removing complex film on surface of copper and copper alloy
WO2010024141A1 (en) * 2008-08-27 2010-03-04 荒川化学工業株式会社 Cleaning composition for removing lead-free solder flux and system for removing lead-free solder flux
WO2010086893A1 (en) * 2009-01-27 2010-08-05 三洋化成工業株式会社 Cleaning agent for copper-wired semiconductor
KR20120073198A (en) * 2009-09-03 2012-07-04 아라까와 가가꾸 고교 가부시끼가이샤 Cleaning agent for removal of, removal method for, and cleaning method for water-soluble, lead-free solder flux
JP2012184329A (en) * 2011-03-07 2012-09-27 Arakawa Chem Ind Co Ltd Aqueous cleaning agent composition for printed-wiring board, and method for cleaning printed-wiring board using the same

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5518528A (en) * 1978-07-24 1980-02-08 Nippon T-Paul:Kk Solvent dilution type rust preventive oil film removing composition and rust preventive oil film removing method using said composition
JP3792620B2 (en) * 2001-08-03 2006-07-05 日本電気株式会社 Release agent composition
US7923423B2 (en) * 2005-01-27 2011-04-12 Advanced Technology Materials, Inc. Compositions for processing of semiconductor substrates
JP2007095939A (en) * 2005-09-28 2007-04-12 Toshiba Corp Flux composition for soldering
TW201039074A (en) * 2009-04-16 2010-11-01 Basf Se Organic photoresist stripper composition
JP5575318B1 (en) * 2013-09-02 2014-08-20 パナソニック株式会社 Resist stripper

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002097587A (en) 2000-09-21 2002-04-02 Mitsubishi Gas Chem Co Inc Method for removing complex film on surface of copper and copper alloy
WO2010024141A1 (en) * 2008-08-27 2010-03-04 荒川化学工業株式会社 Cleaning composition for removing lead-free solder flux and system for removing lead-free solder flux
WO2010086893A1 (en) * 2009-01-27 2010-08-05 三洋化成工業株式会社 Cleaning agent for copper-wired semiconductor
KR20120073198A (en) * 2009-09-03 2012-07-04 아라까와 가가꾸 고교 가부시끼가이샤 Cleaning agent for removal of, removal method for, and cleaning method for water-soluble, lead-free solder flux
JP2012184329A (en) * 2011-03-07 2012-09-27 Arakawa Chem Ind Co Ltd Aqueous cleaning agent composition for printed-wiring board, and method for cleaning printed-wiring board using the same

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