KR20180090663A - High-precise 3-demensions thermal analysis method - Google Patents

Abstract

The present invention provides a high-precision three-dimensional composite thermal analysis method which can increase accuracy for a thermal analysis by reducing an error for a surrounding environmental element. The high-precision three-dimensional composite thermal analysis method comprises a target measurement step of measuring a material, a temperature, and a reflection factor of a target for modeling; an environment measurement step of measuring and collecting a state of an environmental condition around the target for modeling; and a thermal analysis step of performing a thermal analysis on information of the measured target by reflecting the measured environmental information around the target. Therefore, an error between a modeling result and a result of an actual photo is reduced, thereby increasing accuracy of a target modeling result.

Description

{HIGH-PRECISE 3-DEMENSIONS THERMAL ANALYSIS METHOD}

The present invention relates to infrared target modeling, and more particularly, to a complex thermal analysis method having the same precision as a result obtained by measuring up to environmental factors around a target, characteristics of a target to be measured, and using an actual infrared sensor.

Intelligent surveillance systems using infrared sensors are widely used as systems for detecting, tracking, and recognizing targets in military and industrial applications. Particularly, infrared image provides intensity information by heat of main and night, unlike visible image. In order to detect and track the target in the infrared image, it is necessary to analyze the characteristics of the target.

Thermal analysis methods for measuring the target temperature are used for design and analysis in many applications such as construction, satellite, and ship as well as weapon systems.

In this thermal analysis, the designer analyzes the ambient temperature or the environment at arbitrary values, and the tendency can be seen. However, the absolute temperature result itself differs greatly from the actual one.

In addition, it is difficult to detect the target in the image when the size of the target is large in the infrared image, but it is difficult to distinguish the target from the target when the size of the target is small. Therefore, target modeling is proposed to detect the target effectively.

If the size of the target is small, it may be difficult to distinguish the modeling. To compensate for this, the data input values for the target are measured precisely, such as by observing the material of the target and precisely measuring the reflectivity of the target.

In the prior art, only the material and reflectivity of the target are measured, and the designer has arbitrarily assumed the environmental conditions such as the sun, wind, humidity and visibility around the target, thereby analyzing the infrared signal.

However, when the modeler applying the above-described complementary technology is implemented, there is a case where a difference between the actual temperature of the target and the actual result of the actual appearance occurs even if the characteristics related to the target are observed very precisely.

As the designers arbitrarily set up without precise investigation of the surrounding environment, the absolute characteristics and information of the target to be modeled were not known, and results indicating only the tendency to the value set by the designer were displayed.

Korean Registered Patent No. 10-0643700 (registered)

The present invention aims at providing a high-precision three-dimensional complex thermal analysis method by complementing the disadvantage that the existing technology of infrared target modeling using the characteristics of the target in the infrared target modeling can not accurately represent the temperature and characteristics of the actual target.

According to an aspect of the present invention, there is provided a high-precision three-dimensional composite thermal analysis method including: a target measurement step of measuring a material, a temperature, and a reflectivity of a target to be modeled; An environment measurement step of measuring and collecting a state of an environmental condition around the target to be modeled; And a thermal analysis step of performing thermal analysis on the information of the measured target by reflecting environmental information of the measured target surroundings.

With the present invention, thermal analysis is performed by precisely and automatically measuring not only the characteristics of the target to be modeled but also the characteristics of the surrounding environment of the target, without using the environmental element values assumed by the previous designer. Using the thermal analysis method, it is possible to minimize the influence and error on the surrounding environmental factors, and the result of the modeling becomes similar to that of a real infrared camera. And while the previous technique can only observe the tendency of the target, by using the above method, the absolute temperature value can be known and it is possible to observe more precisely.

In addition, when the infrared signal model is formed using the above-described precise thermal analysis method, it can be used in many fields of use such as architecture, satellite, ship, and the like, and can accurately observe the absolute temperature or condition of the target.

1 is a flowchart of a high-precision three-dimensional complex thermal analysis method according to an embodiment of the present invention.
FIG. 2 is a schematic view showing a configuration of a high-precision three-dimensional complex thermal analysis method according to an embodiment of the present invention.
3 is a diagram related to a high-precision three-dimensional complex thermal analysis method according to an embodiment of the present invention.

In order to fully understand the objects to be achieved, reference should be made to the accompanying drawings and the accompanying drawings which illustrate preferred embodiments of the invention.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in detail with reference to the preferred embodiments of the present invention with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. In order to clearly explain the present invention, parts not related to the description are omitted, and the same reference numerals in the drawings indicate the same members.

Throughout the specification, when a component is referred to as " comprising ", it does not exclude other components unless specifically stated to the contrary. The terms "part", "unit", "module", "block", and the like described in the specification mean units for processing at least one function or operation, And a combination of software.

In the case of a navigator using an infrared sensor, it detects an infrared signal emitted by the object. The larger the temperature difference between the target and the background, the more intense the infrared signal can be obtained, but the image quality varies depending on the quality of the target material and the climate environment. The infrared signal of the target according to the environment is the most accurate measurement method, but preparing the measurement infrared device and the target and the place is often wasteful and impossible in terms of time and cost. Therefore, the environment and the target are often modeled by software and used for prediction and algorithms.

Infrared signals occupy a large portion of the self-radiant energy depending on the surface temperature of the object. For accurate infrared modeling, accurate surface temperature prediction of the object should precede. The surface temperature of an object is calculated through complex thermal analysis by conduction, radiation, and convection. For this, the surface temperature of the object is calculated by complex thermal analysis by conduction, radiation and convection. Temperature and many other environmental conditions must be considered.

To reduce the errors of the surrounding elements, the precision of the 3D complex thermal analysis must be improved. To this end, a precise and automated environment measurement / collection device is included and the module is used to perform thermal analysis using this data. In general thermal analysis, various analytical conditions are entered by the user, but when the environmental conditions are input by using a precise and automated device, the error caused by the analogy of the actual environment can be reduced, so that the modeling result is photographed with a real infrared camera So that a high-accuracy thermal analysis result can be obtained.

1 is a flowchart of a high-precision three-dimensional complex thermal analysis method according to an embodiment of the present invention.

As shown in FIG. 1, the high-precision three-dimensional composite thermal analysis method according to the present invention measures the material, temperature, and reflectivity of a target to be modeled (S110).

Next, in step S110, the high-precision three-dimensional complex thermal analysis method measures and collects the state of the environmental condition around the target to be modeled (S120).

At this time, environmental conditions such as visibility that can be visually confirmed at a long distance are measured according to the amount of light transmitted by the sun around the target, the wind direction, wind speed, humidity, temperature, and turbidity of the atmosphere.

Next, in the high-precision three-dimensional complex thermal analysis method, thermal analysis is performed on the information of the measured target by reflecting environmental information of the target measured in step S120 (S130).

In this case, since the data received in step S120 is directly measured, the error can be reduced compared to the case where the actual environment is inferred, so that the result of modeling becomes similar to that of an actual infrared camera.

Next, the high-precision three-dimensional complex thermal analysis method performs step S130 and presents the derived result (S140).

FIG. 2 is a schematic view showing a configuration of a high-precision three-dimensional complex thermal analysis method according to an embodiment of the present invention.

2, the high-precision infrared modeler of the present invention includes a visibility measuring unit 201, a sun component measuring unit 202, a wind, temperature and humidity measuring unit 203, a shadow measuring unit 204, 210, and a result display unit 220.

The corrective measurement unit 201 measures the overall shape and shape of a target to be modeled. Correction in one direction is the maximum distance at which the object at a long distance in the horizontal direction can be normally identified by the naked eye during the daytime and the maximum distance at which the target can be identified when the light state is the same as during the daytime at night, . Visibility is dependent on the degree of turbidity of suspended matter such as fog and dust in the atmosphere. This correction is measured using a camera. It is possible to measure the temperature change of the target according to atmospheric turbidity, and it is possible to measure both when the target to be modeled is moving or stopped.

The solar component measurement unit 202 measures the direct sun component and the sun diffusion component.

The direct sunlight component means that the intense light of the sun is transmitted to the target as it is, and the shadow also becomes thick.

The sun diffusion component is the diffusion of the light of the target exposed to the direct sunlight. In this case, the light and shade are softened.

The temperature can be determined using the specific wavelength emitted by the temperature of the target using the sun component measurement unit 202.

The wind and temperature / humidity measuring unit 203 measures wind direction, wind speed, temperature, and humidity. The wind direction, wind speed, temperature, and humidity measurement part can not approach the target to be modeled, so it is difficult to attach directly, and because of its size, it can be measured on the ground instead of high altitude.

The shadow measurement unit 204 measures instantaneous shadows due to clouds or the like. Using the camera at the observatory, it measures the shape of the shadow that occurs momentarily on the target due to factors such as cloud, which causes the shadow to appear outside the target. By using this, it measures the temperature change by the shadow.

The three-dimensional complex thermal analysis module 210 receives the characteristics of the target and the target surrounding environment measured by the measuring unit 200, and performs an accurate infrared signal analysis on the current environment.

The result display unit 220 displays the high-precision infrared image, which is the result of the three-dimensional complex thermal analysis module 210.

3 is a diagram illustrating a high-precision three-dimensional complex thermal analysis method according to an embodiment of the present invention.

As shown in Fig. 3, the sun is instantaneously blinded by the corrective measurement data of the target flying object, the direct sun of the flying object, the diffusion component data, the wind direction / wind speed / temperature / humidity measurement data around the flying object, The results of the temperature analysis show various information such as altitude and temperature of the airplane.

Furthermore, all terms including technical or scientific terms have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs, unless otherwise defined in the Detailed Description. Commonly used terms, such as predefined terms, should be interpreted to be consistent with the contextual meanings of the related art, and are not to be construed as ideal or overly formal, unless expressly defined to the contrary.

It will be apparent to those skilled in the art that various modifications, substitutions and substitutions are possible, without departing from the scope and spirit of the invention as disclosed in the accompanying claims. will be. Therefore, the embodiments disclosed in the present invention and the accompanying drawings are intended to illustrate and not to limit the technical spirit of the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments and the accompanying drawings . The scope of protection of the present invention should be construed according to the following claims, and all technical ideas within the scope of equivalents should be construed as falling within the scope of the present invention.

Claims (1)

A target measuring step of measuring the material, temperature and reflectivity of the target to be modeled;
An environment measurement step of measuring and collecting a state of an environmental condition around the target to be modeled; And
And a thermal analysis step of performing thermal analysis on the information of the measured target by reflecting environmental information of the measured target surroundings.

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