KR20180079098A - Thermoplastic resin composition for laser direct structuring and article manufactured using the same - Google Patents

Abstract

The present invention relates to a thermoplastic resin composition for a laser direct structuring (LDS) process and to molded articles manufactured using the same. In one embodiment, the thermoplastic resin composition comprises a polyamide resin; a polyester resin; inorganic fillers; and additives for LDS. An object of the present invention is to provide the thermoplastic resin composition for the LDS process which is excellent in bonding properties to a substrate and capable of double injection.

Description

TECHNICAL FIELD [0001] The present invention relates to a thermoplastic resin composition for a laser direct structuring process and a molded article produced from the thermoplastic resin composition. [0002]

The present invention relates to a thermoplastic resin composition for laser direct structuring process and a molded article produced therefrom.

The laser direct structuring (LDS) process is one of the pretreatment methods for plating the metal layer on the surface of the resin material. Such laser direct structuring can be modified by irradiating the surface of the resin material with a laser in the form of a region to be plated so that the region to be plated has properties suitable for plating.

In general, resin-based materials to be applied to direct laser structuring include additives for laser direct structuring processes in the resin composition. The additive for the laser direct structuring process is decomposed by the laser beam irradiated on the surface of the resin material to emit metal atoms and form metal nuclei. The metal nuclei are embedded in the laser irradiated area in a fine size to increase the surface roughness, and can act as crystal nuclei during plating to enhance the plating ability.

By using the laser direct structuring process, it is possible to form an electric / electronic circuit on a three-dimensional shape of a molded article quickly and economically. For example, the laser direct structuring process can be utilized in the manufacture of antennas for portable electronic devices, radio frequency identification (RFID) antennas, and the like.

In recent years, a thermoplastic resin composition having excellent mechanical properties and molding processability (appearance characteristics) has been required in accordance with the trend of weight reduction and thinning of a portable device product. As the thickness of a fine pattern (plating area) There is a problem that the plating peeling phenomenon easily occurs.

In addition, the waterproof function of smart phones and other handset devices is emerging recently. In order to prevent moisture from penetrating the circuitry located inside these handset devices, complete bonding is required, not simple assembly with the back cover of the cell phone and the LDS material of the antenna part. Therefore, in order to ensure a waterproof function, there is a need for a process of inserting an LDS material during injection molding, and then producing a material for the rear cover to double-inject the materials for completely bonding these different materials. However, when inserting an LDS material such as a polycarbonate used in the past, there is a problem that the LDS pattern is lost during double injection due to low heat resistance.

The background art of the present invention is disclosed in Korean Patent Publication No. 2011-0018319.

SUMMARY OF THE INVENTION An object of the present invention is to provide a thermoplastic resin composition for direct laser beam structuring which is excellent in plating adhesion, flexural modulus, impact resistance and heat resistance.

Another object of the present invention is to provide a thermoplastic resin composition for laser direct structuring process which is excellent in bonding property with a substrate and capable of double injection.

It is still another object of the present invention to provide a molded article formed from the thermoplastic resin composition for laser direct structuring process.

One aspect of the present invention relates to a thermoplastic resin composition for a direct laser structuring process. In one embodiment, the thermoplastic resin composition comprises a base resin 100 comprising 35 to 65 wt% of a polyamide resin, 10 to 35 wt% of a polyester resin having an intrinsic viscosity of 0.6 to 2.0 dl / g, and 20 to 50 wt% Weight part; And 0.1 to 20 parts by weight of an additive for laser direct structuring.

In one embodiment, the polyamide resin may be an aliphatic polyamide resin.

In one embodiment, the polyamide resin is selected from the group consisting of polyamide 6, polyamide 66, polyamide 46, polyamide 610, polyamide 612, polyamide 11, polyamide 12, polyamide 910, polyamide 912, polyamide 913, poly Amide 914, polyamide 915, polyamide 616, polyamide 936, polyamide 1010, polyamide 1012, polyamide 1013, polyamide 1014, polyamide 1210, polyamide 1212, polyamide 1213, polyamide 1214, polyamide 614 , Polyamide 615, polyamide 616, and polyamide 613.

In one embodiment, the polyester resin may include at least one of polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polytrimethylene terephthalate, and polycyclohexylene terephthalate.

In one embodiment, the inorganic filler and the polyamide resin may be included in a weight ratio of 1: 1 to 1: 5.

In one embodiment, the polyester resin and the inorganic filler are present in a ratio of 1: 1 to 1: 3 Weight ratio.

In one embodiment, the inorganic filler may include at least one of glass fiber, talc, wollastonite, whisker, silica, mica, and basalt fiber.

In one embodiment, the laser direct structuring additive may comprise at least one of heavy metal complex oxide spinel and copper salt.

In one embodiment, the laser direct structuring additive and the polyester resin may be included in a weight ratio of 1: 1.5 to 1: 8.

In one embodiment, the thermoplastic resin composition and the polycarbonate base material are bonded and injected to measure a bonding strength measured at a speed of 5 mm / min using a UTM instrument to a bonded specimen having a bonding portion of 1.2 cm x 1.2 cm x 3.2 mm. May be 5 to 30 kgf / cm < ² >.

Another aspect of the present invention relates to a molded article formed from the thermoplastic resin composition for laser direct structuring process.

In one embodiment, the shaped article may comprise a metal layer formed on at least a portion of the surface by a laser direct structuring process and a plating process.

INDUSTRIAL APPLICABILITY The thermoplastic resin composition for laser direct structuring process of the present invention and the molded article produced therefrom are excellent in plating adhesion, excellent in flexural modulus, impact resistance and heat resistance, excellent in bonding property to a substrate such as polycarbonate, .

1 shows a molded article according to one embodiment of the present invention.
Fig. 2 (a) shows a specimen for measuring the bonding strength obtained by double injection using the thermoplastic resin composition and polycarbonate substrate of the present invention, and Fig. 2 (b) is a photograph showing the side surface of the specimen for measuring the bonding strength .

In the following description of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the invention as claimed.

Thermoplastic resin composition for laser direct structuring process

One aspect of the present invention relates to a thermoplastic resin composition for a direct laser structuring process. In one embodiment, the thermoplastic resin composition comprises a polyamide resin; Polyester resin; Inorganic fillers; And an additive for laser direct structuring.

For example, the thermoplastic resin composition contains 35 to 65% by weight of the polyamide resin; 0.1 to 20 parts by weight of the additive for direct laser structuring may be added to 100 parts by weight of a base resin containing 10 to 35% by weight of a polyester resin and 20 to 50% by weight of an inorganic filler.

Hereinafter, the constituent components of the thermoplastic resin composition will be described in detail.

Polyamide resin

In one embodiment, the polyamide resin may comprise an aliphatic polyamide resin. The aliphatic polyamide resin is a polyamide containing no aromatic ring in the molecular chain, and may contain, for example, an aliphatic group having 10 to 20 carbon atoms.

In one embodiment, the aliphatic polyamide resin may be a homopolymer, a copolymer, a terpolymer or a polymer formed from an aminocarboxylic acid, a lactam or a diamine and a dicarboxylic acid. Here, the term "copolymer" means a polyamide having two or more amide and / or diamide molecular repeat units.

The aminocarboxylic acid may be an aminocarboxylic acid having 6 to 12 carbon atoms. For example, 6-aminocaproic acid, 7-aminoheptanoic acid, 9-aminononanoic acid, 11-aminoundecanoic acid or 12-aminododecanoic acid and the like may be included.

The lactam may be a lactam having 4 to 12 carbon atoms. For example, α-pyrrolidone, ε-caprolactam, ω-laurolactam or ε-enolactam, and the like.

The diamine may be an aliphatic or alicyclic diamine. For example, tetramethylenediamine, hexamethylenediamine, 2-methylpentamethylenediamine, nonamethylenediamine, undecamethylenediamine, dodecamethylenediamine, 2,2,4-trimethylhexamethylenediamine, 2,4,4- (Aminomethyl) cyclohexane, 1,4-bis (aminomethyl) cyclohexane, 1-amino-3-aminomethyl-3,5, Bis (4-aminocyclohexyl) methane, 2,2-bis (4-aminocyclohexyl) propane, bis (aminopropyl) Piperazine, aminoethylpiperazine, bis (p-aminocyclohexyl) methane; 1,8-diaminododecane, 1,12-diaminododecane, m-xylylenediamine, 1,8-diaminododecane, 1,8- And the like.

The dicarboxylic acid may be an aliphatic or alicyclic dicarboxylic acid. In one embodiment, the dicarboxylic acid includes adipic acid, 2-methyladipic acid, trimethyladipic acid, glutaric acid, 2,2-dimethylglutaric acid, pimelic acid, suberic acid, Sebacic acid, dodecanedioic acid, 1,4-cyclohexanedicarboxylic acid, malonic acid, dimethyl malonic acid, succinic acid or 2,2-diethyl succinic acid and the like.

In one embodiment, the aliphatic polyamide resin includes polyamide 6, polyamide 66, polyamide 46, polyamide 610, polyamide 612, polyamide 11, polyamide 12, polyamide 910, polyamide 912, polyamide 913 , Polyamide 914, polyamide 915, polyamide 616, polyamide 936, polyamide 1010, polyamide 1012, polyamide 1013, polyamide 1014, polyamide 1210, polyamide 1212, polyamide 1213, polyamide 1214, poly Amide 614, polyamide 615, polyamide 616, or polyamide 613. These may be used singly or as a mixture of two or more thereof, if necessary.

In one embodiment, at least one of polyamide 6, polyamide 66, polyamide 612, polyamide 1010, and polyamide 1012 may be used as the aliphatic polyamide resin. In this case, the impact resistance, heat resistance and processability of the thermoplastic resin composition can be further improved.

In one embodiment, the aliphatic polyamide resin may have a glass transition temperature (Tg) of 30 to 90 ° C. For example, 40 to 70 ° C. The aliphatic polyamide resin may have a melting point (Tm) of 160 to 270 ° C. When an aliphatic polyamide having a glass transition temperature and a melting point in the above range is used, excellent impact strength and processability can be obtained.

In one embodiment, the number average molecular weight (Mn) of the aliphatic polyamide resin is not particularly limited, but may be 10,000 to 200,000 g / mol. Within the above range, the thermoplastic resin composition may have excellent heat resistance and processability. For example from 20,000 to 150,000 g / mol.

In one embodiment, the polyamide resin is contained in an amount of 35 to 65 wt% based on the total weight of the base resin including the polyamide resin, the polyester resin and the inorganic filler. When the polyamide resin is contained in an amount of less than 35% by weight, it is difficult to secure the heat resistance and impact resistance of the present invention. When the polyamide resin is contained in an amount exceeding 65% by weight, it may be difficult to secure bonding properties. For example, 40 to 60% by weight.

Polyester resin

The above-mentioned polyester resin is included to ensure bonding property with a substrate such as a polycarbonate resin, and to improve heat resistance, mechanical strength and fluidity.

In one embodiment, the polyester resin is selected from the group consisting of terephthalic acid (TPA), isophthalic acid (IPA), 1,2-naphthalene dicarboxylic acid, 1,4-naphthalene dicarboxylic acid, Naphthalene dicarboxylic acid, 1,6-naphthalene dicarboxylic acid, 1,6-naphthalene dicarboxylic acid, 1,6-naphthalene dicarboxylic acid, 1,6-naphthalene dicarboxylic acid, Naphthalene dicarboxylic acid, 2,7-naphthalene dicarboxylic acid, dimethyl terephthalate (DMT), aromatic isophthalate (DMT), aromatic dicarboxylate in which an acid is substituted with a dimethyl group, ), Alkyl esters of naphthalene dicarboxylic acids or alkyl esters of dimethyl-1,2-naphthalate, dimethyl-1,5-naphthalate, dimethyl-1,7-naphthalate, , 8-naphthalate, dimethyl-2,3-naphthalate, dimethyl-2,6-naphthalate, di Naphthalate, mixtures thereof, and the like, and ethylene glycol having 2 to 12 carbon atoms as the diol, 1,2-propylene glycol, 1,3-propylene glycol, 2,2-dimethyl- 1,3-butanediol, 1,4-butanediol, 1,5-pentanediol, 1,5-pentanediol, 1,6-hexanediol, 1,6- 3-cyclohexane dimethanol, 1,4-cyclohexane dimethanol, or a mixture thereof, and the like.

In one embodiment, the polyester resin is selected from the group consisting of polyethylene terephthalate (PET), polybutylene terephthalate (PBT), polyethylene naphthalate (PEN), polytrimethylene terephthalate (PTT) and polycyclohexylene terephthalate ). ≪ / RTI > When the polyester resin of the above kind is included, the thermoplastic resin composition of the present invention can be excellent in bonding properties to other substrates such as polycarbonate resin and excellent in heat resistance and mechanical strength at the time of double injection molding. For example, polybutylene terephthalate (PBT).

In one embodiment, the intrinsic viscosity of the polyester resin ranges from 0.6 to 2.0 dl / g. In embodiments, the intrinsic viscosity may be the result of measurement in an o-chlorophenol solution at 35 < 0 > C.

When the intrinsic viscosity is less than 0.6 dl / g, the mechanical properties of the thermoplastic resin composition are deteriorated. When the intrinsic viscosity exceeds 2.0 dl / g, the moldability and appearance of the thermoplastic resin composition of the present invention may be deteriorated. For example 0.8 to 1.6 dl / g. Another example is 0.8 to 1.4 dl / g.

In one embodiment, the weight average molecular weight of the polyester resin may range from 5,000 to 30,000 g / mol. Within the above range, the mechanical properties of the present invention can be excellent. For example from 5,000 to 20,000 g / mol.

In one embodiment, the polyester resin is contained in an amount of 10 to 35% by weight based on the total weight of the base resin including the polyamide resin, the polyester resin and the inorganic filler. When the polyester resin is contained in an amount of less than 10% by weight, it is difficult to ensure bonding with other base materials and double injection is difficult. When the content exceeds 35% by weight, the heat resistance, workability and impact resistance of the present invention may be lowered . For example, 13 to 30% by weight.

Inorganic filler

In one embodiment, the inorganic filler may include at least one of glass fiber, talc, wollastonite, whisker, silica, mica, and basalt fiber. For example, glass fibers.

In one embodiment, the inorganic filler may include glass fibers having a cross-sectional aspect ratio (long diameter of cross section / short diameter of cross section) of 1.5 to 10 and an average length of 2 to 10 mm. Within the above range, the thermoplastic resin composition is excellent in heat resistance, impact resistance, mechanical properties such as modulus, and can further improve the plating adhesion.

In one embodiment, the inorganic filler is included in an amount of 20 to 50% by weight based on the total weight of the base resin including the polyamide resin, the polyester resin and the inorganic filler. When the inorganic filler is contained in an amount of less than 20% by weight, it is difficult to secure heat resistance. When the inorganic filler is contained in an amount of more than 50% by weight, moldability of the thermoplastic resin composition may be deteriorated. The dielectric constant of the antenna may increase, which may cause problems in antenna performance. For example, 25 to 40% by weight.

In one embodiment, the inorganic filler and the polyamide resin may be included in a weight ratio of 1: 1 to 1: 5. When the content is within the above range, the moldability and the plating adhesion of the present invention are excellent, the bonding property with the base material is excellent, and the impact resistance, heat resistance, appearance, and physical properties thereof can be excellent. For example, 1: 1.1 to 1: 3 Weight ratio.

In one embodiment, the polyester resin and the inorganic filler are present in a ratio of 1: 1 to 1: 3 Weight ratio. When included in the above range, the moldability and the plating adhesion of the present invention are excellent, and the bonding property with the base material can be excellent. For example, from 1: 1 to 1: 2.5 by weight.

Additives for direct laser structuring

The additive for laser direct structuring (LDS) is capable of forming metal nuclei by laser, and it is possible to use an additive for direct laser structuring used in general resin composition for laser direct structuring.

In one embodiment, the laser direct structuring additive may include one or more of heavy metal mixture oxide spinel and copper salt.

In one embodiment, the heavy metal complex oxide spinel may be represented by the following formula:

[Chemical Formula 1]

AB ₂ O ₄

A is a metal cation having a valence of 2 such as magnesium, copper, cobalt, zinc, tin, iron, manganese, nickel, combinations thereof, etc., and B is a metal cation having a valence of 3, Such as manganese, nickel, copper, cobalt, tin, titanium, iron, aluminum, chromium, combinations thereof, and the like.

In one embodiment, the laser direct structuring additive includes copper iron spinel, copper-containing magnesium aluminum oxide, copper chromium manganese oxide, copper manganese iron oxide (optionally oxygen in each case) Copper salts and oxides such as copper (I) oxide, copper (II) oxide, copper phosphate, copper sulfate, cuprous thiocyanate and metal complex compounds, chelate compounds of copper, tin, nickel, cobalt, silver and palladium Or a mixture of such systems and / or a copper chromium manganese mixed oxide, a copper manganese iron mixed oxide, a copper chromium oxide, a zinc iron oxide, a cobalt chromium oxide, a cobalt aluminum oxide, a magnesium aluminum oxide and mixtures thereof and / And / or a form in which oxygen is bonded. More specifically, copper hydroxide, copper chromium oxide spinel, copper phosphate, copper sulfate, cuprous thiocyanate, and combinations thereof may be used.

In one embodiment, the laser direct structuring additive is included in an amount of 0.1 to 20 parts by weight based on 100 parts by weight of the base resin including the polyamide resin, the polyester resin and the inorganic filler. When the additive for direct laser structuring is contained in an amount of less than 0.1 part by weight, the addition effect thereof is insignificant. When the additive exceeds 20 parts by weight, the moldability, appearance and rigidity of the present invention are lowered, The plating adhesion may be lowered. For example, 1 to 15 parts by weight.

In one embodiment, the laser direct structuring additive and the polyester resin may be included in a weight ratio of 1: 1.5 to 1: 8. Within the above range, the thermoplastic resin composition may have excellent moldability, appearance, plating adhesion, and heat resistance. For example, from 1: 2 to 1: 5 by weight.

The thermoplastic resin composition according to one embodiment of the present invention may be in the form of a pellet obtained by melt-extruding the above components at a temperature of 200 to 300 ° C, for example 220 to 260 ° C, using a conventional twin-screw extruder.

In one embodiment, the thermoplastic resin composition and the polycarbonate base material are bonded and injected to measure a bonding strength measured at a speed of 5 mm / min using a UTM instrument to a bonded specimen having a bonding portion of 1.2 cm x 1.2 cm x 3.2 mm. May be 5 to 30 kgf / cm < ² >.

For example, after preparing a stepped specimen using the thermoplastic resin composition and a polycarbonate substrate, the joint portion is formed by 1.2 cm (width) X 1.2 cm (width) X 3.2 mm (thickness) After the polycarbonate as the primary side was fixed, the specimen part of the thermoplastic resin composition, which is the secondary side, was bent 180 °, and this part was cut at a rate of 5 mm / min using a UTM machine (shimadzu company) The bond strength can be calculated by measuring the bond strength at a rate and dividing the result by the bond area.

Molded products formed from thermoplastic resin composition

The molded article according to the present invention is formed from the thermoplastic resin composition. For example, the thermoplastic resin composition can be used to produce a molded article by a molding method such as injection molding, double injection molding, blow molding, extrusion molding, or thermoforming. The molded article can be easily formed by a person having ordinary skill in the art to which the present invention belongs.

1 shows a molded article according to one embodiment of the present invention. In the drawings, the size of elements constituting the invention is exaggerated for clarity of description, and is not limited thereto. 1, the molded article 10 according to one embodiment of the present invention may include a metal layer 20 formed on at least a part of the surface of the molded article 10 by a laser direct structuring process and a plating process. The molded article 10 according to one embodiment of the present invention may be a circuit carrier or the like used for manufacturing an antenna. The molded article 10 may be formed of a thermoplastic resin composition, for example, 10); Irradiating a laser beam onto a specific region (a metal layer 20 portion) on the surface of the molded product 10; And then metallizing (plating) the irradiated region to form the metal layer 20.

In one embodiment, the laser direct structuring additive contained in the molded article 10 is decomposed by the laser irradiation to generate metal nuclei. In addition, the area irradiated with the laser has a surface roughness suitable for plating. The wavelength of the laser may be 248 nm, 308 nm, 355 nm, 532 nm, 1,064 nm or 10,600 nm.

In an embodiment, the metallization process may be performed through a conventional plating process. For example, it is possible to form the metal layer 20 (electrically conductive path) on the laser-irradiated area of the surface of the molded article 10 by dipping the laser-irradiated molded article 10 into one or more electroless plating baths. Non-limiting examples of the electroless plating process include a copper plating process, a gold plating process, a nickel plating process, a silver plating process, a zinc plating process, and a tin plating process.

As described above, a molded product having a metal layer formed on at least a part of its surface by a laser direct structuring process can be easily formed by a person having ordinary skill in the art to which the present invention belongs.

INDUSTRIAL APPLICABILITY The thermoplastic resin composition for laser direct structuring process of the present invention and the molded article produced therefrom are excellent in plating adhesion, excellent in flexural modulus, impact resistance and heat resistance, excellent in bonding property to a substrate such as polycarbonate, .

Hereinafter, the configuration and operation of the present invention will be described in more detail with reference to preferred embodiments of the present invention. It is to be understood, however, that the same is by way of illustration and example only and is not to be construed in a limiting sense.

Example  And Comparative Example

Hereinafter, specifications of each component used in Examples and Comparative Examples are as follows.

(A) a polyamide resin

Polyamide 1010 resin was used.

(B) a polyester resin

(B1) Polybutylene terephthalate having an intrinsic viscosity of 0.83 dl / g was used.

(B2) Polybutylene terephthalate having an intrinsic viscosity of 1.1 dl / g was used.

(B3) Polybutylene terephthalate having an intrinsic viscosity of 1.2 dl / g was used.

(B4) Polybutylene terephthalate having an intrinsic viscosity of 1.3 dl / g was used.

(C) Inorganic filler: having an aspect ratio of 4 and an average length of (Nippon, trade name: CSG 3PA-820) having a thickness of 3 mm was used.

(D) Additive for laser direct structuring: copper hydroxide phosphate was used.

Example  1 to 12 and Comparative Example  1-5

The components were added in the amounts shown in Tables 1 and 2 and then melt extruded at a barrel temperature of 240 DEG C at a screw rotation speed of 200 rpm using a twin screw extruder having L / D = 36 and 45 mm in diameter , And a total discharge amount of 80 kg / h to prepare a thermally conductive resin composition in the form of a pellet. The prepared pellets were dried at 100 ° C. for 4 hours and then injected in a 10 oz injection machine at an injection temperature of 260 ° C. to prepare specimens. The properties of the prepared specimens were evaluated by the following methods, and the results are shown in Tables 1 and 2 below.

How to measure property

(1) Impact strength (Izod, kgf · cm / cm): Measured at 23 ° C. according to ASTM D256 for 1 / 4˝ thick specimens.

(2) Flexural modulus (FM, kgf / cm ² ): Measured at a speed of 2.8 mm / min according to the ASTM D790 standard.

(3) Flexural strength (FS, kgf / cm ² ): Measured at a speed of 2.8 mm / min in accordance with ASTM D790 standard.

(4) Heat resistance (HDT, ° C): Measured according to ASTM D648 (1.82 MPa, 120 ° C / hr).

As shown in FIG. 2, stepped specimens were prepared using the specimens of Examples 1 to 12 and Comparative Examples 1 to 5 and the polycarbonate substrate, and then the joint portions were formed by 1.2 cm (width) X 1.2 cm (Horizontal) X 3.2 mm (thickness). Then, after securing the primary side polycarbonate, the specimens of the Examples and Comparative Examples, which are the secondary side, were bent at 180 °, respectively, and this portion was bonded at a rate of 5 mm / min using a UTM instrument (shimadzu) And the result was divided by the area of the joint.

(6) Evaluation of LDS plating (plating adhesion): 5 cm X 1 cm X 1 mm size After aging the injection specimen at 25 ° C for 6 hours, the laser specimen was subjected to the laser direct structuring process to form a stripe- The surface was activated, and a plating specimen having a stripe-shaped copper layer having a thickness of 35 탆 was formed through a plating process (copper electroless plating). The plated specimens were aged at high temperature and high humidity (85 ° C, 85% humidity) for 72 hours, and then plated at 2 mm intervals to make gilt eyes. When the tape was peeled off, it was judged to be good when peeling was not observed. When peeling occurred, it was judged to be poor.

Referring to Tables 1 and 2, in the case of Examples 1 to 12 of the present invention, the thermoplastic resin composition of the present invention was superior in plating adhesion, and was excellent in bonding property with a polycarbonate base material, , The impact resistance, the flexural modulus, the flexural strength, and the physical properties thereof.

On the other hand, in the case of Comparative Example 1 in which the polyester resin of the present invention was not applied, in Comparative Example 2, which was not bonded to the polycarbonate base material but applied outside the polyamide resin content of the present invention, the heat resistance and the plating property were deteriorated In Comparative Example 3 in which the content of the polyester resin of the present invention exceeded that of the present invention, the impact resistance, heat resistance and plating ability were lowered. In Comparative Example 4 in which the content of the impact modifier was less than that of the present invention, . In addition, in Comparative Example 5 in which the additive amount for direct direct structuring of the present invention was applied, the impact strength, flexural elastic modulus and flexural strength were lowered, and the plating adhesion was lowered due to the effect of over-plating.

It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

Claims (12)

100 parts by weight of a base resin comprising 35 to 65% by weight of a polyamide resin, 10 to 35% by weight of a polyester resin having an intrinsic viscosity of 0.6 to 2.0 dl / g and 20 to 50% by weight of an inorganic filler; And
0.1 to 20 parts by weight of a laser direct structuring additive.
The thermoplastic resin composition according to claim 1, wherein the polyamide resin comprises an aliphatic polyamide resin.
The method of claim 1, wherein the polyamide resin is selected from the group consisting of polyamide 6, polyamide 66, polyamide 46, polyamide 610, polyamide 612, polyamide 11, polyamide 12, polyamide 910, polyamide 912, polyamide 913 , Polyamide 914, polyamide 915, polyamide 616, polyamide 936, polyamide 1010, polyamide 1012, polyamide 1013, polyamide 1014, polyamide 1210, polyamide 1212, polyamide 1213, polyamide 1214, poly Amide 614, polyamide 615, polyamide 616, and polyamide 613. The thermoplastic resin composition of claim 1,
The thermoplastic resin composition according to claim 1, wherein the polyester resin comprises at least one of polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polytrimethylene terephthalate and polycyclohexylene terephthalate. Composition.
The thermoplastic resin composition according to claim 1, wherein the inorganic filler and the polyamide resin are contained in a weight ratio of 1: 1 to 1: 5.
The polyester resin composition according to claim 1, wherein the polyester resin and the inorganic filler have a weight ratio of 1: 1 to 1: 3 By weight of the thermoplastic resin composition.
The thermoplastic resin composition according to claim 1, wherein the inorganic filler comprises at least one of glass fiber, talc, wollastonite, whisker, silica, mica and basalt fiber.
The thermoplastic resin composition according to claim 1, wherein the additive for direct laser structuring comprises at least one of a heavy metal complex oxide spinel and a copper salt.
The thermally conductive resin composition according to claim 1, wherein the additive for laser direct structuring and the polyester resin are contained in a weight ratio of 1: 1.5 to 1: 8.
The bonded specimen of claim 1, wherein the thermoplastic resin composition and the polycarbonate substrate are bonded and injected, and the bonded specimen having the bonded portion of 1.2 cm x 1.2 cm x 3.2 mm is measured at a speed of 5 mm / min using a UTM instrument And a bonding strength of 5 to 30 kgf / cm < ^{2 &} gt ;.
A molded article formed from the thermoplastic resin composition according to any one of claims 1 to 10.
12. A molded article according to claim 11, wherein the molded article comprises a metal layer formed on at least a part of the surface by a laser direct structuring process and a plating process.

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