KR20180053790A - Method for preparing a conductive film - Google Patents

Abstract

The present invention relates to a conductive film which simplifies a manufacturing process of the conductive film, reduces a manufacturing cost and improves reliability of the process and a product. A manufacturing method of a conductive film comprises a step of mixing a first solution (A) which includes 20 wt% or less of a curing agent containing compound (a1) and a second solution (B) which is immiscible with the first solution and includes a liquid crystal or a conductive particle (b1), and forming the liquid crystal of the second solution (B) within a mixture of the first solution and the second solution.

Description

TECHNICAL FIELD The present invention relates to a method for preparing a conductive film,

The present application relates to a method for producing a conductive film.

When the electrically driven cell includes charged particles or liquid crystal, a barrier is used to confine the charged particles or liquid crystal in a certain space inside the cell. Such barrier ribs are formed by patterning a polymer layer provided on a substrate, and photolithography, photoresist, or mold printing or the like is generally used for the patterning. However, the above-described process of forming the barrier ribs complicates the fabrication process, increases the manufacturing cost, and causes a problem of electrode damage during the process.

On the other hand, although emulsions have been used in various fields, there is a problem that it is difficult to maintain the dispersion stability of droplets as dispersed phases for a long time.

One object of the present invention is to provide a conductive film which is simplified in manufacturing process and reduced in manufacturing cost.

Another object of the present invention is to provide a method for manufacturing a conductive film capable of improving process and product reliability.

These and other objects of the present application can be resolved entirely by the present application, which is described in detail below.

In one example of this application, the present application relates to a method of making a conductive film. The method of the present invention can greatly improve the dispersion stability of the emulsion by forming a droplet in the emulsion and forming a crosslinked structure that can surround the surface of the droplet.

In one example, the production method comprises mixing a first solution (A) containing a curing agent-containing compound (a1) and a second solution (B) containing conductive particles (b1) ) To form droplets of the liquid. The mixture may be prepared by mixing 1 to 50 parts by weight of the second solution (B) with respect to 100 parts by weight of the first solution (A) in consideration of dispersion stability of the emulsion and visibility in the final product. In the present application, " part by weight " may mean a weight ratio between the respective components.

In the present application, the mixture of the first solution (A) and the second solution (B) can form an emulsion. To this end, the first and second solutions may each comprise a solvent which is immiscible with each other. The term " immiscible " in the present application can be used in the same way as the meaning used in a conventional emulsification method. For example, if two or more solvents or solutions are simply mixed, the mixed solvent or solutions may be said to be immiscible with each other if phase separation occurs without intermixing one another. Specifically, when the solvent constituting the main component of the first solution (A) is water or an alcohol such as isopropyl alcohol, methanol, or ethanol, or acetone or ethyl acetate (MC), which is a major component of the second solution (B), has a hydrophilic property such as ethyl acetate which is mixed with water without being phase-separated. The solvent is preferably a solvent such as cyclohexanone, methylene chloride , N-hexane or toluene, isoparaffin, and the like. The opposite case is also possible. As described above, since the immiscibility between solvents or solutions can be relatively determined depending on the solvents to be mixed with each other, the types of the solvents included in the first solution (A) and the second solution (B) The solvent is not limited to the solvents listed above, and a known solvent having immiscibility with each other may be appropriately selected and used.

In one example, each of the solvents contained in the first solution and the second solution may be non-curable, i.e., a solvent that does not have a curable functional group, and may not be cured even after the curing process described below.

In one example, the first solution (A) may contain the curing agent-containing compound (a1) in an amount of 20 wt% or less in the total weight of the first solution (A). The term "% by weight" used in connection with the curable group-containing compound (a1) in the present application may mean the ratio of the weight of the curable group-containing compound (a1) in the total components of the first solution (A). When the content of the curing agent-containing compound (a1) is more than 20% by weight, aggregation of droplets occurs due to excessive crosslinking in the process of forming a coating film surrounding the droplet surface described below, have.

The kind of the curing agent-containing compound (a1) can be selected in consideration of miscibility with a solvent contained in the first solution (A), and is not particularly limited. For example, a (meth) acrylate-based or epoxy-based compound may be used. More specifically, when isopropyl alcohol is used as the solvent contained in the first solution (A), WS2100 (Miwon Specialty Chemical Co., Ltd.), which is a hydrophilic acrylate, may be used as the curing group-containing compound (a1). When toluene is used as the solvent included in the first solution (A), MB1000 (Miwon Specialty Chemical Co., Ltd.), which is a hydrophobic acrylate, may be used.

In one example, the first solution (A) may further comprise a thermal initiator or a photo initiator. The kind of the initiator is not particularly limited, and known initiators such as Irgacure and the like can be used without limitation. The initiator may be contained in an amount of 1% by weight or less based on the total weight of the first solution (A).

The second solution (B) may include a driving solvent and particles (b1). More specifically, it may include 0.05 to 10 parts by weight of conductive particles relative to 100 parts by weight of the driving solvent.

The particles (b1) may be liquid crystal or conductive particles. Specifically, the conductive particles contained in the second solution (B) may be charged particles having (-) or (+) electric charge. The specific conductive particles are not particularly limited. For example, carbon black, ferric oxides, chromium copper (CrCu), or aniline black may be used as the conductive particles.

Since the driving solvent contained in the second solution (B) has no curing unit, the mobility of the conductive particles in the final product can be ensured. The driving solvent may be a solvent in which the first solution and the second solution are selected to have immiscibility with each other, as mentioned above. The type of usable driving solvent is not particularly limited and may be selected in consideration of the method of forming the emulsion.

The mixture of the first solution and the second solution may further comprise a surfactant. The time point of introduction of the surfactant is not particularly limited. For example, the surfactant may be preliminarily contained in at least one of the first and / or the second solution before the formation of the mixture, or may be added together at the time of mixing the first and second solutions, 1 and the second solution may be mixed.

In one example, in consideration of dispersion stability of droplets, the surfactant may be included in the range of 0.1 to 15 parts by weight relative to 100 parts by weight of the first solution (A).

As the surfactant, for example, a surfactant of a known molecular type such as a cationic surfactant, an anionic surfactant, an amphoteric surfactant or a nonionic surfactant can be used without limitation. More specifically, a cationic surfactant such as a quaternary ammonium compound, a sulfonium compound, an amine salt, or an imidazolinium salt; Anionic surfactants such as ammonium lauryl sulfate, sodium 1-heptanesulfonate, sodium hexanesulfonate, or sodium dodecyl sulfate; Amphoteric surfactants such as N-dodecyl-N, N-dimethyl-3-ammonio-1-propanesulfonate, betaine or alkylbetaine; And non-ionic surfactants such as SPAN 60, polypropylene glycol or polyvinylpyrrolidone can be used without limitation.

In one example, the surfactant may be an amphipathic nanoparticle having a size of 5 nm to 500 nm. More specifically, the amphiphilic nanoparticle may comprise a core portion comprising nanoparticles, and a shell portion comprising an amphipathic compound surrounding the core portion. For example, a portion of the shell may surround a portion of the nanoparticle as a hydrophilic portion, and another portion of the shell may be formed to surround another portion of the nanoparticle as a hydrophobic portion.

In one example, a nano-particles used in the core portion, for example, gold, silver, and the metal particles of copper, platinum, palladium, nickel, manganese or zinc, SiO _2, Al ₂ O _3, TiO _2, Oxide particles such as ZnO, NiO, CuO, MnO ₂ , MgO, SrO or CaO, or polymers such as PMMA (polymethacrylate) or PS (polystyrene).

In one example, as the amphiphilic compound used in the shell part, Triton X-114 (CAS No. 9036-19-5), Triton X-100 (CAS No. 92046 -34-9), Brij-58 (CAS No .: 9004-95-9), octyl glucoside (CAS No .: 29836-26-8), octylthio glucoside (CAS No .: 85618 -21-9), decaethylene glycol monododecyl ether (CAS No .: 9002-92-0), N-decanoyl-N-methylglucamine (CAS No : 85261-20-7), decyl maltopyranoside (CAS No .: 82494-09-5), Ndodecylmaltoside (CAS No .: 69227-93-6), Nonna N-nonanoyl-N-methylglucamine (CAS No .: 85261-19-N-methylglucamine), ethylene glycol monododecyl ether (CAS No .: 3055-99-0) 4), octaethylene glycol monododecyl ether (CAS No : 3055-98-9), span 20 (CAS No. 1338-39-2), polyvinylpyrrolidone (CAS No. 9003-39-8) or Synperonic F108 (PEO-b -PPO-b-PEO, CAS No .: 9003-11-06) and the like, but the materials listed above are not particularly limited.

The form of the particles of the surfactant is not particularly limited and may be spherical, elliptic spherical, rod-like, or amorphous. In case of rod-like or amorphous, the length of the largest dimension may be set to satisfy the size of the range. When the particulate surfactant is used as described above, the droplet formation time in the emulsion can be greatly shortened, and the degree of aggregation of the droplets with each other can be greatly reduced, and high dispersion stability of the droplet can be ensured. In comparison of the droplet formation time, when a conventional molecular type surfactant is used and the stirring time required for forming an emulsion particle having an appropriate degree of dispersibility and size is more than 1 hour or more than 2 hours, a particle type surfactant is used For example, 10 seconds to 10 minutes. As described above, when the amphipathic nanoparticles are used as a surfactant, there is an advantage that the particle formation time can be shortened to 1/10 or more as well as high dispersion stability.

In one example, the production method of the present application can carry out stirring for the mixture in order to increase the dispersion stability of droplets formed in the mixture of the first solution and the second solution. The stirring may be performed using a known homogenizer or the like. The stirring speed or stirring time is not particularly limited and may be suitably controlled in consideration of the size and dispersibility of the droplets.

Emulsified particles, which are droplets formed from the second solution (B), may be contained in the emulsion formed from the mixture prepared by mixing the solution of the above composition through the above method, that is, the first and second solutions. Inside the droplet, the constituent components of the second solution (B), that is, the driving solvent and the conductive particles may be included. Further, when the surfactant is contained in the mixture, the surfactant may be located at the interface between the droplet and the first solution (A).

After the formation of the emulsion, curing to the curing agent-containing compound (a1) can be performed. This curing causes the crosslinking structure formed from the curing agent-containing compound (a1) to surround the surface of each droplet by crosslinking the curing agent-containing compound (a1) floating in the vicinity of the droplet in the first solution (A). In the case of the present application, since the content of the curing agent-containing compound (a1) in the total weight of the first solution (A) is adjusted to 20 wt% or less, the whole curing of the continuous phase in the emulsion can not be caused. In addition, since the curing-group-containing compound (a1) is dispersed irregularly in a small amount in the first solution by the above amount, it is possible to prevent the droplets from aggregating through the crosslinking, It is possible to maintain a distributed shape in an independent shape. In the present application, the droplet surrounded by the crosslinking structure formed from the curing agent-containing compound (a1) may be referred to as a droplet having a crosslinking coating film or a crosslinking structure coating film. The crosslinking structure by the curing can greatly increase the dispersion stability of droplets containing conductive particles.

The curing may be carried out by any one or more of stirring, heat irradiation and light irradiation. For example, the crosslinked structure can be formed only by light irradiation, or the crosslinked structure can be formed by conducting light irradiation or heat irradiation simultaneously with stirring.

In one example, the curing for forming the crosslinked structure can be effected by stirring. The stirring conditions are not particularly limited, but may be, for example, from 100 rpm to 3,000 rpm for 1 hour to 48 hours. Although not particularly limited, the stirring may be carried out at room temperature or in a warmed state for at least 1 hour or at least 2 hours. In the present application, the normal temperature may mean a temperature in the range of 18 ° C to 28 ° C, more specifically in the range of 23 ° C to 25 ° C, and the heating is a state in which the temperature is higher than the normal temperature, Lt; / RTI > The apparatus used for stirring and the specific stirring method are not particularly limited.

In another example, the curing for forming the crosslinked structure may be performed by heat irradiation. Thermal curing by heat irradiation can be performed, for example, when an epoxy compound is used as the curing agent-containing compound (a1). Although not particularly limited, the thermosetting may be performed by irradiating a predetermined heat or forming a predetermined temperature condition for a time ranging from 1 minute to 48 hours or less. The temperature of the heat to be irradiated for curing or the high temperature conditions to be formed may be for example 80 ° C or higher, 90 ° C or higher, 100 ° C or higher, 110 ° C or higher or 120 ° C or higher and 180 ° C or lower, 170 ° C or 160 ° C or lower . The thermosetting may be carried out together with the stirring mentioned above.

In another example, the curing for forming the crosslinked structure may be performed by light irradiation. Photocuring by light irradiation can be performed, for example, when an acrylic compound is used as the curing agent-containing compound (a1). Although not particularly limited, UV light having a wavelength of, for example, 200 nm to 400 nm may be used for the photo-curing. More specifically, photo curing can be performed while UV light is irradiated for 1 minute to 1 hour at an intensity ranging from 500 mJ / cm ² to 1,500 mJ / cm ² . The photo-curing may be performed together with the above-mentioned stirring.

Thereafter, a droplet having a crosslinked structure coating film separated from the mixture can be applied onto the conductive substrate. More specifically, a coating composition comprising a droplet having the crosslinked structure coating film may be applied on the conductive substrate. Application of the coating composition to the conductive substrate can be effected by known methods. The coating composition may be applied to a conductive substrate using known methods such as, for example, bar coating, gravure coating, dipping, spin coating, and the like. In the present application, a layer prepared by drying or curing a coated coating composition, as described below, may be referred to as a coating layer.

In one example, a coating composition applied on a conductive substrate may be a mixture of a first solution and a second solution. In this case, in the manufacturing method of the present application, the mixture may be applied to place the droplet having the crosslinked structure coating film on the conductive substrate, followed by drying. Through this drying, a plurality of droplets having a crosslinked structure coating film can be dense or packed on a conductive substrate to form a uniform layer, so that a separate matrix is not required in this case have. The drying condition is not particularly limited, and may be, for example, stored at a room temperature between 18 ° C and 28 ° C for a certain period of time, or at a temperature of 30 ° C to 100 ° C or under a hot air condition.

In another example, the coating composition applied on the conductive substrate may include a liquid droplet having the crosslinked structure coating film and a curable resin (C). The specific kind of the curable resin (C) is not particularly limited. For example, an epoxy resin or an acrylic resin capable of heat or photo-curing can be used as the curable resin (C). After the coating composition is applied onto the conductive substrate, curing to the coating composition can be effected. The curing method is not particularly limited, and thermal curing or photo curing may be used. When the coating composition is cured, the curable resin (C) may function as a matrix or a binder for a droplet having a crosslinked structure coating film. In addition, the droplet having the crosslinked structure coating film may include a conductive solvent and a driving solvent that ensures the possibility of the conductive particle to move within the coating film.

As described above, when the coating composition comprises a liquid having a coating film of a crosslinked structure and the curable resin (c), the production method of the present application is characterized in that before applying the coating composition onto the conductive substrate, Separating the mixture from the mixture of the first and second solutions. The separation method is not particularly limited, and for example, a method such as washing or centrifugation can be used.

The manufacturing method of the present application may further include the step of cementing another conductive base material to oppose the conductive base material after drying or curing the coating composition. The opposite conductive substrate may be referred to as an upper conductive substrate or a lower conductive substrate, depending on its position with respect to the coating layer.

In another example of the present application, the present application relates to a conductive film produced through the above process. The conductive film may be a laminate of a conductive substrate and a coating layer. Alternatively, the lower conductive substrate, the coating layer, and the upper conductive substrate may be sequentially stacked.

The coating layer may include a matrix, which is a cured product of the curable resin, and a plurality of droplets distributed in the matrix. The droplets may be produced according to the method of the presently filed application and have a coating film of a crosslinked structure. Also, the droplet may include a driving solvent and conductive particles.

In one example, the conductive substrate may be an electrode comprising a transparent conductive metal oxide. Examples of the transparent conductive metal oxide include ITO (Indium Tin Oxide), In ₂ O ₃ (indium oxide), IGO (indium gallium oxide), FTO (fluoro-doped tin oxide), AZO Gallium doped zinc oxide (GZO), antimony doped tin oxide (ATO), indium doped zinc oxide (IZO), niobium doped titanium oxide (NTO), zinc oxide (ZnO), or cesium tungsten oxide (CTO).

In another example, the conductive substrate may be a metal mesh electrode. Examples of the metal material for forming the metal mesh include metals such as silver, copper, aluminum, magnesium, gold, platinum, tungsten, Molybdenum (Mo), titanium (Ti), nickel (Ni), or alloys thereof may be used.

In another example, the conductive substrate may be an oxide / metal / oxide (OMO) electrode. The OMO (oxide / metal / oxide) electrode may have a metal layer interposed between two metal oxide layers. The metal oxide layer included in the oxide / metal / oxide (OMO) electrode may include, for example, Sb, Ba, Ga, Ge, Hf, In, La, Ma, Se, Si, Ta, Se, Y, Zn, and Zr may be used. The metal layer interposed between the metal oxide layers may contain at least one selected from the group consisting of Ag, Cu, Al, Mg, Au, Pt, , Molybdenum (Mo), titanium (Ti), or nickel (Ni) may be used, but it is not particularly limited.

In one example, the conductive film may comprise a plurality of conductive substrates. In this case, the coating layer may be provided between any two conductive substrates, and the conductive film may be configured such that at least two electrodes bonded to each other via the coating layer may face each other. Although not particularly limited, it is preferable that one of the two opposing electrodes is a metal mesh electrode.

The conductive substrate may be a laminate of any one of the above-mentioned electrode materials and a translucent substrate having a transmittance of about 50% to 90% with respect to visible light. The type of the light-transmitting base material is not particularly limited, and transparent glass or polymer resin can be used, for example. More specifically, a polyester film such as PC (Polycarbonate), PEN (poly (ethylene naphthalate)) or PET (poly terephthalate), an acrylic film such as poly (methyl methacrylate) Or a polyolefin film such as polypropylene (PP), but the present invention is not limited thereto.

The coating layer may comprise droplets having a cured coating film. According to the above-mentioned production method, the coating layer may have a different constitution. For example, in one example, the coating layer may have a droplet-dispersed structure having a cured structure coating film in a matrix formed from the curable resin (c). In another example, the coating layer may be a layer formed by packing or densifying a droplet having a cured structure coating film without a matrix.

The droplets having the cured structure coating film may have a so-called core-shell structure. The core may comprise a driving solvent and liquid crystal or conductive particles. The shell may comprise an inner-shell defined by a surfactant surrounding the surface during emulsion particle formation and an outer-shell by a crosslinking structure formed by the curing agent-containing compound . On the other hand, as mentioned above, since the driving solvent does not have a curing machine, the mobility of liquid crystal or conductive particles can be guaranteed.

In one example, the conductive film may further comprise a power source. The power source may be configured to apply a suitable level of voltage to the conductive film. The size of the voltage applied by the power source and the electrical connection between the conductive film and the power source can be suitably selected and applied by a person having ordinary skill in the art.

The conductive film may be used for a variable transmittance element or an electronic paper. For example, since the conductive film includes conductive particles that are movable according to a voltage to be applied, the conductive film may have a predetermined transmittance change, or a predetermined shape may be realized by the movement of the conductive particles.

The present application has the effect of simplifying the manufacturing process and reducing the manufacturing cost since the driving liquid containing the conductive particles or the liquid crystal can be confined within the cell by a simple process of mixing the solvent without forming the barrier ribs. Further, since the present application uses a droplet having a crosslinked structure coating film, dispersion stability of the droplet can be improved, thereby improving process reliability and product reliability.

Fig. 1 schematically shows a manufacturing method of the present application.
2 is an image of a droplet having a crosslinked structure coating film prepared according to Examples and Comparative Examples of the present application. FIG. 2A is a droplet of Example 1, FIG. 2B is a droplet of Example 2, and FIG. 2C is an image of a droplet of Comparative Example 1. It can be seen that the droplets of the Examples are more uniform than the Comparative Examples and the droplets are also formed independently. Further, it can be confirmed that the dispersion stability of the droplet of Example 2 using the particulate surfactant is superior to that of Example 1.
3 is a photographed image of a conductive film produced according to an embodiment of the present application. Specifically, FIG. 3A shows a conductive film produced according to Example 1, and FIG. 3B shows a conductive film produced according to Example 2. FIG.

Hereinafter, the present application will be described in detail by way of examples. However, the scope of protection of the present application is not limited by the embodiments described below.

Example 1

Formation of droplets having crosslinked structure coating film:

A first solution was prepared by mixing water-soluble acrylate WS2100 (Miwon Specialty Chemical Co., Ltd.) and a hydrophilic initiator (Irgacure 2959) in water. At this time, the content ratio of each component was adjusted to water: WS2100: Irgacure 2959 = 10: 1: 0.01. Thereafter, a hydrophobic isoparaffin solution (Nanobrick) containing carbon black particles whose surface was negatively charged as a second solution and a surfactant (polyvinylpyroolidone) were mixed with the first solution, and water, a hydrophobic isoparaffin solution, and Surfactant in a ratio of 5: 1: 0.05. The mixture was stirred for about 2 hours to form a droplet, and simultaneously UV light having a power of 1,000 mJ / cm ² was irradiated to form a crosslinkable coating film on the surface of the droplet. A microscope image of the droplet having the crosslinkable coating film is shown in Fig. 2 (a).

Preparation of a conductive film: After forming a coating film of a droplet, a mixture of the first and second solutions was coated on a PET / ITO substrate in a bar coating manner and dried in an oven at 70 캜 for 10 minutes to form a coating layer . Thereafter, a substrate including a metal mesh electrode was bonded to the other surface of the coating layer to prepare a conductive film. 3 (a) is an image of a state before (right image) and after (right image) of driving the conductive film manufactured in Example 1 at a voltage of about 30 V. FIG. 3 (a), it can be seen that the transmittance of the conductive film is changed depending on whether a voltage is applied or not.

Example 2

A conductive film was prepared in the same manner as in Example 1, except that a particle type surfactant (Sekisui, Pmma NP) having a size of 85 nm was used as a surfactant. Unlike in Example 1, the time required for droplet formation with proper dispersibility after stirring was within 10 minutes. 2 (b) is a microscope image of a droplet having the crosslinkable coating film prepared in Example 2. Fig.

As a result of applying a voltage of about 30 V in the same manner as in Example 1, the effect of varying the transmittance was clearly observed also in the conductive film produced in Example 2. [ As a result of applying a voltage of about 30 V in the same manner as in Example 1, the effect of varying the transmittance was clearly observed also in the conductive film produced in Example 2. [ The state before the voltage application of the conductive film prepared in Example 2 is as shown in Fig. 3 (b).

Comparative Example  One

A conductive film was prepared in the same manner as in Example 1, and the content of water: WS2100: Irgacure 2959 was adjusted to 10: 5: 0.01 at the time of forming the first solution. FIG. 2 (c) is an image of a state in which droplet aggregation occurs during cross-linking due to curing between excessively contained WS 2100, thereby preventing formation of droplets having a cross-linked coating film of independent shape.

Although a voltage of about 30 V was applied to the conductive film prepared in Comparative Example 1 as in Example 1, since the droplet-to-liquid accumulation was severe as shown in FIG. 2 (c) Respectively.

Claims (15)

A first solution (A) containing 20% by weight or less of the curing agent-containing compound (a1); And a second solution (B) which is immiscible with the first solution and comprises a liquid crystal or conductive particles (b1), and a second solution (B) in a mixture of the first solution and the second solution, Forming an enemy;
≪ / RTI >
The method for producing a conductive film according to claim 1, wherein 100 parts by weight of the first solution (A) and 1 to 50 parts by weight of the second solution (B) are mixed.
3. The method of claim 2, wherein stirring is performed on the mixture during droplet formation.
The method of producing a conductive film according to claim 1, wherein the mixture of the first solution (A) and the second solution (B) further comprises a surfactant.
The method of claim 1, wherein the surfactant is amphipathic nanoparticles having a size of 5 nm to 500 nm.
6. The method of claim 5, wherein the amphiphilic nanoparticle comprises a core portion and a shell portion, the core portion comprises nanoparticles, and the shell portion comprises an amphipathic compound surrounding the nanoparticles.
5. The method of claim 4, further comprising the steps of: curing the curing agent-containing compound (a1) to form a crosslinkable coating film surrounding the droplet surface;
≪ / RTI >
The method for producing a conductive film according to claim 7, wherein the curing to the curing agent-containing compound (a1) is carried out by any one of stirring, heat irradiation and light irradiation.
8. The method according to claim 7, wherein after curing to the curing agent-containing compound (a1), a mixture of the first solution and the second solution is applied on the lower conductive substrate, and a droplet having the crosslinkable coating film is placed on the lower conductive substrate ;
≪ / RTI >
The method of producing a conductive film according to claim 9, wherein a droplet having a crosslinkable coating film is placed on a lower conductive substrate, and then drying is performed to form a coating layer.
8. The method of claim 7, further comprising: after the curing to the curing agent-containing compound (a1), separating a droplet having a crosslinkable coating film from a mixture of the first solution and the second solution;
≪ / RTI >
12. The method of producing a conductive film according to claim 11, wherein the separation is performed by washing or centrifugation.
12. The method of claim 11, further comprising: providing a coating composition comprising a liquid with a crosslinkable coating film separated from the mixture and a curable resin (C), applying the coating composition on the lower conductive substrate and curing to form a coating layer;
≪ / RTI >
14. The method of producing a conductive film according to claim 13, wherein the curing for the coating composition is performed by heat irradiation or light irradiation.
13. The method of claim 10 or 12, further comprising: attaching the upper conductive substrate to oppose the lower conductive substrate via the coating layer;
≪ / RTI >

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