KR102101145B1 - Method for preparing a conductive film - Google Patents

Abstract

This application relates to conductive films. The present application can simplify the manufacturing process of the conductive film, reduce manufacturing costs, and improve the reliability of the process and products.

Description

Method for preparing a conductive film

The present application relates to a method for manufacturing a conductive film.

When the electrically driven cell contains charged particles or liquid crystal, a partition wall is used to confine the charged particles or liquid crystal in a certain space inside the cell. The partition wall is formed by patterning a polymer layer provided on a substrate, and photolithography, photoresist or mold printing is generally used for the patterning. However, the above-described partition wall forming process complicates the manufacturing process, increases the manufacturing cost, and has a problem of causing electrode damage during the process.

On the other hand, the emulsion (emulsion) is used in various fields, there is a problem that it is difficult to maintain the dispersion stability of the dispersed phase of the droplet for a long time.

One object of the present application is to provide a conductive film having a simplified manufacturing process and reduced manufacturing cost.

Another object of the present application is to provide a method of manufacturing a conductive film that can improve process and product reliability.

The above and other objects of the present application can all be solved by the present application described in detail below.

In an example related to the present application, the present application relates to a method for manufacturing a conductive film. In the preparation method, droplets are formed in the emulsion, but the dispersion stability of the emulsion can be greatly improved by forming a crosslinked structure that can surround the surface of the droplet.

In one example, the manufacturing method, a first solution (A) containing a curing agent-containing compound (a1), and a second solution (B) containing conductive particles (b1) are mixed to form a second solution (B It may include the step of forming a droplet of. In consideration of dispersion stability of the emulsion and visibility in the final product, the mixture may be prepared by mixing 1 to 50 parts by weight of the second solution (B) relative to 100 parts by weight of the first solution (A). In the present application, "parts by weight" may mean a weight ratio between each component.

In the present application, the mixture of the first solution (A) and the second solution (B) may form an emulsion. To this end, the first and second solutions may include solvents that are immiscible with each other. In the present application, "immiscible" may be used in the same manner as used in a conventional emulsification method. For example, if two or more solvents or solutions are simply mixed and phase separation occurs without mixing with each other, the mixed solvents or solutions may be said to be immiscible with respect to each other. Specifically, the solvent constituting the main component of the first solution (A) is water, or alcohols such as isopropyl alcohol, methanol, ethanol, or acetone or ethyl acetate When having so-called hydrophilic properties that are mixed without being phase-separated with water, such as (ethyl acetate), the solvent forming the main component of the second solution (B) is cyclohexanone, methylene chloride (MC) , It may have so-called hydrophobic properties such as n-hexane or toluene, isoparaffin, and the like. Also, the reverse is also possible. As described above, since the immiscibility between solvents or solutions can be relatively determined depending on the solvent mixed with each other, the types of solvents included in the first solution (A) and the second (B) solution used in the present application are It is not limited to the solvents listed above, and a known solvent having immiscibility with each other may be appropriately selected and used.

In one example, each of the solvents included in the first solution and the second solution may not be cured even though a curing process mentioned below is performed as a non-curable, ie, solvent having no curable functional group.

In one example, the first solution (A) may include a curing group-containing compound (a1), up to 20% by weight of the total weight of the first solution (A). The term "% by weight" used in connection with the curing group-containing compound (a1) in the present application may mean a ratio of the weight of the curing group-containing compound (a1) among all components of the first solution (A). When the content of the curing group-containing compound (a1) exceeds 20% by weight, agglomeration between the droplets occurs due to excessive crosslinking in the process of forming a coating film surrounding the droplet surface described below, so that visibility of the final product may deteriorate. have.

The type of the curing group-containing compound (a1) may be selected in consideration of miscibility with a solvent included in the first solution (A), and is not particularly limited. For example, (meth) acrylate-based or epoxy-based compounds may be used. More specifically, when isopropyl alcohol is used as a solvent included in the first solution (A), a hydrophilic acrylate WS2100 (Miwon Specialty Chemical Co., Ltd.) may be used as the curing group-containing compound (a1). Further, when toluene is used as a solvent included in the first solution (A), a hydrophobic acrylate MB1000 (Miwon Specialty Chemical Co., Ltd.) may be used.

In one example, the first solution (A) may further include a thermal initiator or photoinitiator. The type of initiator is not particularly limited, and known initiators such as Irgacure can be used without limitation. The initiator may be included in 1% by weight or less based on the total weight of the first solution (A).

The second solution (B) may include a driving solvent and particles (b1). More specifically, it may include 0.05 to 10 parts by weight of conductive particles compared to 100 parts by weight of the driving solvent.

The particles (b1) may be liquid crystal or conductive particles. Specifically, the conductive particles included in the second solution (B) may be charged particles having a (-) or (+) charge. The type of the specific conductive particles is not particularly limited, but, for example, carbon black, ferric oxides, chromium copper (CrCu), or aniline black may be used as the conductive particles.

Since the driving solvent included in the second solution (B) does not have a curing group, it is possible to ensure the mobility of the conductive particles in the final product. The driving solvent may be a solvent selected such that the first solution and the second solution are immiscible with each other, as mentioned above. The type of driving solvent that can be used is not particularly limited, and may be selected in consideration of the method of forming the emulsion.

The mixture of the first solution and the second solution may further include a surfactant. The timing of the introduction of the surfactant is not particularly limited. For example, a surfactant may be previously included in any one or more of the first and / or second solution before the mixture is formed, or may be added together when mixing the first and second solutions. It may also be added after mixing the first and second solutions.

In one example, considering the dispersion stability of the droplet, the surfactant may be included in a range of 0.1 to 15 parts by weight compared to 100 parts by weight of the first solution (A).

As the surfactant, for example, cationic surfactants, anionic surfactants, amphoteric surfactants, or nonionic surfactants of known molecular type surfactants can be used without limitation. More specifically, cationic surfactants such as quaternary ammonium compounds, sulfonium compounds, amine salts, or imide azolinium salts; Anionic surfactants such as ammonium lauryl sulfate, sodium 1-heptanesulfonate, sodium hexanesulfonate, or sodium dodecylsulfate; Amphoteric surfactants such as N-dodecyl-N, N-dimethyl-3-ammonio-1-propanesulfonate, betaine or alkyl betaine; And non-anionic surfactants such as SPAN 60, polypropylene glycol or polyvinylpyrrolidone, and the like.

In one example, the surfactant may be an amphiphilic nanoparticle having a size of 5 nm to 500 nm. More specifically, the amphiphilic nanoparticles may include a core portion including nanoparticles, and a shell portion containing an amphiphilic compound surrounding the core portion. For example, a portion of the shell may be formed to surround some areas of the nanoparticles as hydrophilic sites, and another portion of the shell may be formed to surround other areas of the nanoparticles as hydrophobic sites.

In one example, the nanoparticles used in the core portion include, for example, metal particles such as gold, silver, copper, platinum, palladium, nickel, manganese, or zinc, SiO ₂ , Al ₂ O ₃ , TiO ₂ , It may be an oxide particle such as ZnO, NiO, CuO, MnO ₂ , MgO, SrO or CaO, or a polymer such as PMMA (polymethacrylate) or PS (polystyrene).

In one example, amphiphilic compounds used in the shell portion include, in addition to the molecular surfactants mentioned above, Triton X-114 (CAS No .: 9036-19-5), Triton X-100 (CAS No .: 92046) -34-9), Brij-58 (CAS No .: 9004-95-9), octyl glucoside (CAS No .: 29836-26-8), octylthio glucoside (CAS No .: 85618 -21-9), decaethylene glycol monododecyl ether (CAS No .: 9002-92-0), N-decanoyl-N-methylglucamine, CAS No .: 85261-20-7), decyl maltopyranoside (CAS No .: 82494-09-5), N-dodecylmaltoside (CAS No .: 69227-93-6), nona Ethylene glycol monododecyl ether (CAS No .: 3055-99-0), N-nonanoyl-N-methylglucamine (CAS No .: 85261-19- 4), octaethylene glycol monododecyl ether, CAS No .: 3055-98-9), Span20 (CAS No .: 1338-39-2), polyvinylpyrrolidone (CAS No .: 9003-39-8) or Synperonic F108 (PEO-b -PPO-b-PEO, CAS No .: 9003-11-06) may be used, but the materials listed above are not particularly limited.

The shape of the particles possessed by the surfactant is not particularly limited, and may be spherical, elliptical spherical, rod-shaped, or amorphous. In the case of a rod or an amorphous shape, the length of the largest dimension may be provided to satisfy the size of the range. When the particulate surfactant is used as described above, droplet formation time in the emulsion can be significantly shortened, and the dispersion stability of the droplets can be secured, such as the degree of aggregation between droplets. When comparing the droplet formation time, if a conventional molecular type surfactant is used, if the stirring time required to form emulsified particles having an appropriate degree of dispersibility and size is 1 hour or more or 2 hours or more, a particle type surfactant is used. In the case of, the time is within tens of minutes, for example, 10 seconds to 10 minutes. As such, when the amphiphilic nanoparticles are used as a surfactant, there is an advantage of shortening the particle formation time by 1/10 or more with high dispersion stability.

In one example, the manufacturing method of the present application, to increase the dispersion stability of the droplets formed in the mixture of the first solution and the second solution, may be stirred for the mixture. The stirring may be performed using a known homogenizer. The stirring speed and the stirring time are not particularly limited, and can be appropriately controlled in consideration of the size and dispersibility of the droplets.

A mixture prepared by mixing the solution of the composition through the above method, that is, in the emulsion formed from the first and second solutions, emulsifying particles that are a plurality of droplets formed from the second solution (B) may be included. Inside the droplet, the components of the second solution (B), that is, a driving solvent and conductive particles may be included. In addition, when the surfactant is included in the mixture, the surfactant may be located at the interface between the droplet and the first solution (A).

After forming the emulsion, curing for the curing group-containing compound (a1) may be performed. The curing crosslinks the curing group-containing compound (a1) suspended in the vicinity of the droplet in the first solution (A), so that the crosslinked structure formed from the curing group-containing compound (a1) surrounds the surface of each droplet. In the case of the present application, since the content of the curing group-containing compound (a1) in the total weight of the first solution (A) is adjusted to 20% by weight or less, overall curing of the continuous phase in the emulsion may not occur. In addition, since the amount of the curing group-containing compound (a1) as described above is irregularly dispersed in a small amount in the first solution, while preventing the droplets from agglomerating through crosslinking, each droplet whose surface is enclosed by the crosslinking structure is prevented. It is possible to maintain a distributed shape in an independent shape. In the present application, droplets surrounded by a crosslinked structure formed from the curing group-containing compound (a1) may be referred to as droplets having a crosslinkable coating film or a crosslinked structure coating film. The crosslinked structure by curing may significantly increase the dispersion stability of droplets containing conductive particles.

The curing may be achieved by any one or more of stirring, heat irradiation and light irradiation. For example, the crosslinked structure may be formed only by light irradiation, or light irradiation or thermal irradiation may be performed simultaneously with stirring to form a crosslinked structure.

In one example, curing for forming the crosslinked structure may be achieved by stirring. The stirring conditions are not particularly limited, but may be, for example, at a speed of 100 rpm to 3,000 rpm for 1 hour to 48 hours. Although not particularly limited, the stirring may be performed at room temperature or at a warm state, for 1 hour or more or 2 hours or more. In the present application, the normal temperature may mean a temperature in the range of 18 ° C to 28 ° C, more specifically in the range of 23 ° C to 25 ° C, and the warming is a state in which the temperature is higher than the normal temperature, for example, about 80 ° C or less It can be a temperature. The device used for stirring or the specific stirring method is not particularly limited.

In another example, curing for forming the crosslinked structure may be achieved by thermal irradiation. Thermal curing by thermal irradiation can be performed, for example, when an epoxy-based compound is used as the curing group-containing compound (a1). Although not particularly limited, the thermal curing may be performed by irradiating a predetermined heat or forming a predetermined temperature condition for a time of 1 minute or more and 48 hours or less. The temperature of the heat irradiated for curing or the high temperature conditions to be formed are, for example, 80 ° C or higher, 90 ° C or higher, 100 ° C or higher, 110 ° C or higher, or 120 ° C or higher, and 180 ° C or lower, 170 ° C or lower, or 160 ° C or lower. You can. The thermal curing can be achieved with the aforementioned agitation.

In another example, curing for forming the crosslinked structure may be achieved by light irradiation. Light curing by light irradiation can be performed, for example, when an acrylic compound is used as the curing group-containing compound (a1). Although not particularly limited, UV light having a wavelength of 200 nm to 400 nm may be used for the light curing. More specifically, with an intensity in the range of 500 mJ / cm ² to 1,500 mJ / cm ² , light curing may be performed while UV light is irradiated for 1 minute to 1 hour. The photo-curing can be achieved with the aforementioned agitation.

Thereafter, droplets having a crosslinked structure coating film separated from the mixture can be applied on the conductive substrate. More specifically, a coating composition including a droplet having the cross-linked structure coating film may be applied on a conductive substrate. Application of the coating composition to the conductive substrate can be accomplished through known methods. For example, the coating composition may be applied on a conductive substrate using a method known for bar coating, gravure coating, dipping, spin coating, and the like. In the present application, as described below, a layer prepared by drying or curing the applied coating composition may be referred to as a coating layer.

In one example, the coating composition applied on the conductive substrate can be a mixture of a first solution and a second solution. In this case, in the manufacturing method of the present application, the mixture may be applied to place a droplet having a crosslinked structure coating film on a conductive substrate, and then dry. Through the drying, a plurality of droplets having a cross-linked structured coating film can be dense or packed on a conductive substrate to form a uniform layer, and in this case, a separate matrix may not be required. have. The conditions for drying are not particularly limited, and for example, storage at a normal temperature between 18 ° C. and 28 ° C. for a certain period of time, or may be performed under warm or hot air conditions in the range of 30 ° C. to 100 ° C.

In another example, the coating composition applied on the conductive substrate may include a droplet having the crosslinked structure coating film and a curable resin (C). The specific type of curable resin (C) is not particularly limited. For example, heat- or photo-curable epoxy resin or acrylic resin can be used as the curable resin (C). After the coating composition is applied on the conductive substrate, curing for the coating composition may be achieved. The method of curing is not particularly limited, and thermal curing or photo curing may be used. When curing the coating composition, the curable resin (C) may function as a matrix or binder for droplets having a crosslinked structure coating film. In addition, the droplet having the cross-linked structure coating film may include conductive particles and a driving solvent that ensures the mobility of the conductive particles in the coating film.

As described above, when the coating composition includes a droplet having a coating film of a crosslinked structure and a curable resin (c), the manufacturing method of the present application, before applying the coating composition on a conductive substrate, the droplet having a coating film of the crosslinked structure And separating from the mixture of the first and second solutions. The separation method is not particularly limited, and for example, a method such as washing or centrifugation can be used.

The manufacturing method of the present application, after drying or curing the coating composition, may further include the step of bonding another conductive substrate to face the conductive substrate. The opposing conductive substrate may be referred to as an upper conductive substrate or a lower conductive substrate, depending on the position with the coating layer.

In another example related to the present application, the present application relates to a conductive film manufactured through the above process. The conductive film may be a laminate of a conductive substrate and a coating layer. Alternatively, the lower conductive substrate, the coating layer, and the upper conductive substrate may be stacked sequentially.

The coating layer may include a matrix that is a cured product of the curable resin, and a plurality of droplets distributed in the matrix. The droplet may be prepared according to the above-mentioned method of the present application to have a coating film having a crosslinked structure. In addition, the droplet may include a driving solvent and conductive particles.

In one example, the conductive substrate may be an electrode including a transparent conductive metal oxide. The transparent conductive metal oxide includes, for example, Indium Tin Oxide (ITO), Indium Oxide (In ₂ O ₃ ), Indium Galium Oxide (IGO), Fluor doped Tin Oxide (FTO), Aluminum Doped Zinc Oxide (AZO), GZO (Galium doped Zinc Oxide), ATO (Antimony doped Tin Oxide), IZO (Indium doped Zinc Oxide), NTO (Niobium doped Titanium Oxide), ZnO (zink oxide), or CTO (Cesium Tungsten Oxide) may be used.

In another example, the conductive substrate may be a metal mesh electrode. As a metal material for forming a metal mesh, for example, silver (Ag), copper (Cu), aluminum (Al), magnesium (Mg), gold (Au), platinum (Pt), tungsten (W), Molybdenum (Mo), titanium (Ti), nickel (Ni) or alloys thereof can be used.

In another example, the conductive substrate may be an OMO (oxide / metal / oxide) electrode. The OMO (oxide / metal / oxide) electrode may have a form in which a metal layer is interposed between two metal oxide layers. The metal oxide layer included in the OMO (oxide / metal / oxide) electrode, for example, Sb, Ba, Ga, Ge, Hf, In, La, Ma, Se, Si, Ta, Se, Ti, V, One or more metal oxides selected from the group consisting of Y, Zn and Zr can be used. In addition, silver (Ag), copper (Cu), aluminum (Al), magnesium (Mg), gold (Au), platinum (Pt), tungsten (W) is formed as a component of the metal layer interposed between the metal oxide layers. , Molybdenum (Mo), titanium (Ti), or nickel (Ni) may be used, but is not particularly limited.

In one example, the conductive film may include a plurality of conductive substrates. In this case, a coating layer may be provided between any two conductive substrates, and the conductive film may be configured so that at least two electrodes bonded via the coating layer can face each other. Although not particularly limited, it is preferable that any one of the two opposing electrodes is a metal mesh electrode.

The conductive substrate may be a laminate of any one of the above-mentioned electrode materials and a transmissive substrate having a transmittance for visible light in a range of about 50% to 90%. The type of the translucent substrate is not particularly limited, and for example, transparent glass or polymer resin may be used. More specifically, a polyester film such as PC (Polycarbonate), PEN (poly (ethylene naphthalate)) or PET (poly (ethylene terephthalate)), an acrylic film such as PMMA (poly (methyl methacrylate)), or PE (polyethylene) Alternatively, a polyolefin film such as PP (polypropylene) may be used, but is not limited thereto.

The coating layer may include droplets having a cured structure coating film. According to the above-mentioned manufacturing method, the coating layer may have a different configuration. For example, in one example, the coating layer may have a structure in which droplets having a cured structure coating film are dispersed in a matrix formed from the curable resin (c). In another example, the coating layer may be a layer formed by packing or densely droplets having a cured structure coating film without a matrix.

The droplet having the cured structure coating film may have a so-called core-shell structure. The core may include a driving solvent and liquid crystal or conductive particles. The shell may include an inner-shell defined by a surfactant surrounding a surface when forming emulsified particles, and an outer-shell formed by a crosslinked structure formed by a curing group-containing compound. . On the other hand, as mentioned above, since the driving solvent does not have a curing group, it is possible to ensure the mobility of the liquid crystal or conductive particles.

In one example, the conductive film may further include a power source. The power source can be configured to apply an appropriate level of voltage to the conductive film. The magnitude of the voltage applied by the power source or the electrical connection method between the conductive film and the power source can be appropriately selected and applied by a person skilled in the art.

The conductive film as described above may be used in a variable transmittance element or an electronic paper. For example, since the conductive film includes conductive particles movable according to an applied voltage, it may have a predetermined change in transmittance, or a predetermined shape may be realized by the movement of the conductive particles.

This application has the effect of the invention, which simplifies the manufacturing process and reduces the manufacturing cost because the driveable solution containing conductive particles or liquid crystals can be confined in the cell by only a simple process of mixing between solvents without forming a partition. In addition, since the present application uses a droplet having a crosslinked structure coating film, it is possible to improve the dispersion stability of the droplet, thereby improving process reliability and product reliability.

1 schematically shows a manufacturing method of the present application.
2 is an image of a droplet having a crosslinked structure coating film prepared according to Examples and Comparative Examples of the present application. 2A is a droplet of Example 1, FIG. 2B is a droplet of Example 2, and FIG. 2C is an image of the droplet of Comparative Example 1. It can be seen that the droplets of the examples are more uniform than the comparative examples, and the droplets are also formed independently. In addition, it can be confirmed that the dispersion stability of the droplets of Example 2 using a particulate surfactant was more excellent than that of Example 1.
3 is a photographed image of a conductive film manufactured according to an embodiment of the present application. Specifically, Figure 3a is a conductive film prepared according to Example 1, Figure 3b is a conductive film prepared according to Example 2.

Hereinafter, the present application will be described in detail through examples. However, the protection scope of the present application is not limited by the examples described below.

Example 1

Formation of a droplet having a crosslinked structure coating film:

A first solution was prepared by mixing the hydrophilic acrylate WS2100 (Miwon Specialty Chemical Co., Ltd.) and a hydrophilic initiator (Irgacure 2959) in water. At this time, the content ratio of each component was adjusted to water: WS2100: Irgacure 2959 = 10: 1: 0.01. Subsequently, a hydrophobic isoparaffin solution (Nanobrick) and a surfactant (polyvinylpyroolidone) containing carbon black particles whose surface is negatively charged as a second solution are mixed with the first solution, and water, a hydrophobic isoparaffin solution, and A mixture of surfactants at 5: 1: 0.05 was formed. The mixture was stirred for about 2 hours to form droplets, and at the same time, 1,000 mJ / cm ² power was irradiated with UV light to form a crosslinkable coating film on the droplet surface. A microscope image of a droplet having a crosslinkable coating film is shown in Fig. 2 (a).

Preparation of conductive film: After forming a coating film of droplets, a mixture of the first and second solutions is applied onto a PET / ITO substrate by a bar coating method, and dried in an oven at 70 ° C. for 10 minutes to coat the conductive substrate. Formed. Thereafter, a substrate including a metal mesh electrode was bonded to the other surface of the coating layer to prepare a conductive film. FIG. 3 (a) is an image taken before (left image) and after (right image) driving the conductive film prepared in Example 1 with a voltage of about 30V. From 3 (a), it can be confirmed that the transmittance of the conductive film changes depending on whether or not voltage is applied.

Example 2

A conductive film was prepared in the same manner as in Example 1, except that 85 nm particle-type surfactant (Sekisui, Pmma NP) was used as the surfactant. Unlike in Example 1, the time required to form droplets of appropriate dispersibility after stirring was within 10 minutes. Figure 2 (b) is a microscope image of a droplet having a crosslinkable coating film prepared in Example 2.

As in Example 1, as a result of applying a voltage of about 30V, the effect of varying the transmittance was clearly observed even in the conductive film prepared from Example 2. As in Example 1, as a result of applying a voltage of about 30V, the effect of varying the transmittance was clearly observed even in the conductive film prepared from Example 2. The state before applying the voltage of the conductive film prepared from Example 2 is shown in Figure 3 (b).

Comparative example  One

A conductive film was prepared in the same manner as in Example 1, but the content of water: WS2100: Irgacure 2959 was adjusted to 10: 5: 0.01 when forming the first solution. FIG. 2 (c) is an image of a state in which aggregation between droplets occurs during crosslinking due to curing between WS 2100 contained in an excessive amount, and thus droplet formation with an independent crosslinkable coating film is interrupted.

As in Example 1, a voltage of about 30 V was applied to the conductive film prepared from Comparative Example 1, but since the aggregation between the droplets is severe as shown in FIG. 2 (c), light transmission is almost impossible before and after voltage application. Was observed.

Claims (15)

A first solution (A) comprising a curing group-containing compound (a1); And a second solution (B) that is immiscible with the first solution and contains liquid crystals or conductive particles (b1). By mixing, the solution of the second solution (B) in a mixture of the first solution and the second solution Forming an enemy;
Including,
The first solution (A) is a method for producing a conductive film containing the curing group-containing compound (a1) at 20% by weight or less.
The method according to claim 1, wherein 100 parts by weight of the first solution (A) and 1 to 50 parts by weight of the second solution (B) are mixed.
The method according to claim 2, wherein the formation of the droplets is performed by stirring the mixture.
The method of claim 1, wherein the mixture of the first solution (A) and the second solution (B) further comprises a surfactant.
The method of claim 4, wherein the surfactant is an amphiphilic nanoparticle having a size of 5 nm to 500 nm.
The method of claim 5, wherein the amphiphilic nanoparticles include a core portion and a shell portion, the core portion includes nanoparticles, and the shell portion comprises an amphiphilic compound surrounding the nanoparticles.
The method of claim 4, further comprising curing the curing group-containing compound (a1) to form a crosslinkable coating film surrounding the droplet surface;
Method for producing a conductive film further comprising a.
The method for producing a conductive film according to claim 7, wherein the curing of the curing group-containing compound (a1) is performed by any one or more of stirring, heat irradiation, and light irradiation.
The method of claim 7, after curing for the curing group-containing compound (a1), applying a mixture of the first solution and the second solution on the lower conductive substrate, thereby placing the droplets having the crosslinkable coating on the lower conductive substrate. ;
Method for producing a conductive film further comprising a.
10. The method of claim 9, After placing a droplet having a cross-linkable coating film on the lower conductive substrate, the method of manufacturing a conductive film to form a coating layer by performing drying.
The method of claim 7, after curing for the curing group-containing compound (a1), separating a droplet having a crosslinkable coating film from a mixture of the first solution and the second solution;
Method for producing a conductive film further comprising a.
The method of claim 11, wherein the separation is performed by washing or centrifugation.
The method of claim 11, further comprising: preparing a coating composition comprising a droplet having a crosslinkable coating film separated from the mixture and a curable resin (C), and applying the coating composition on a lower conductive substrate, followed by curing to prepare a coating layer;
Method for producing a conductive film further comprising a.
The method of claim 13, wherein curing the coating composition is performed by thermal irradiation or light irradiation.
The method according to any one of claims 10 to 13, further comprising: bonding an upper conductive substrate to face the lower conductive substrate via the coating layer;
Method for producing a conductive film further comprising a.

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