KR20180050820A - Electronic device comprising antenna - Google Patents

Abstract

Disclosed is an electronic device which forms at least two slits on a housing of the electronic device, thereby realizing an antenna resonating in at least two bands. According to an embodiment of the present invention, the electronic device comprises: the housing composed to form a first slit which has the length corresponding to a first frequency and a second slit which extends in a direction different from the first slit from one point of the first slit and has the length corresponding to a second frequency, and to resonate at the first frequency and the second frequency by the first slit and the second slit; a printed circuit board which is located inside the housing, and in which at least a part of a region corresponding to the first slit and the second slit is made of a non-conductive material; and a feeding part feeding a power through one point of the housing adjacent to the first slit or the second slit. Also, other embodiments are also possible.

Description

ELECTRONIC DEVICE COMPRISING ANTENNA < RTI ID = 0.0 >

The embodiments disclosed herein relate to techniques for implementing an antenna of an electronic device.

BACKGROUND OF THE INVENTION [0002] Wireless communication technologies enable various types of information to be transmitted and received, such as text, images, video, or voice. These wireless technologies are evolving to enable more information to be transmitted and received faster. As wireless communication technologies evolve, electronic devices such as smart phones or tablets that are capable of wireless communication can be used for digital multimedia broadcasting (DMB), global positioning system (GPS), Wi-Fi, long-term evolution (LTE) communication, or magnetic stripe transmission (MST). In order to provide such a service, an electronic device may have one or more antennas.

The electronic device may comprise a housing made of metal. The housing may cover most of the back of the electronic device or the front of the electronic device. The above-described housing can degrade the performance of the antenna included in the electronic device. In order to overcome the performance degradation of the antenna, the housing can be utilized as a radiator by forming a slit in the housing. The resonance frequency of the housing can be adjusted by adjusting the length of the slit. However, when a slit is formed in the housing, it is difficult to implement a multi-band antenna using the housing. When feeding to two or more points to implement a multi-band antenna, the radiation performance of the antenna may be degraded.

The embodiments disclosed herein are for implementing a multi-band antenna that resonates at two or more frequencies by forming a slit in the housing of the electronic device to solve the above-mentioned problems and the problems raised in this document.

An electronic device according to an embodiment disclosed in this document includes a first slit having a length corresponding to a first frequency and a second slit extending in a direction different from the first slit from one point of the first slit and having a length corresponding to the second frequency A second slit having a first slit and a second slit, the housing being configured to resonate at a first frequency and a second frequency by a first slit and a second slit; A printed circuit board that is partly made of a non-conductive material, and a feed portion that feeds through a point of the housing adjacent to the first slit or the second slit.

Also, in one embodiment disclosed herein, an electronic device is configured to resonate at a first frequency and a second frequency, wherein a first slit having a length corresponding to the first frequency and a second slit A housing having a second slit extending in a direction different from the first slit and having a length corresponding to the second frequency; a printed circuit board disposed inside the housing, the slit being formed in at least a part of the area corresponding to the first slit and the second slit; And a feed part that feeds power through a point of the housing adjacent to the first slit or the second slit.

In addition, the portable electronic device according to one embodiment disclosed in this document includes a first plate, a second plate facing away from the first plate, a side member surrounding a space between the first plate and the second plate , A substantial portion of the second plate comprises a housing made of electrically conductive material, a first plate and a second plate, a printed circuit board (PCB) located in the space, a processor located on the PCB, Wherein the second plate has a rectangular shape and the rectangular shape extends in a first direction and includes a first side having a first length, a first side having a second side orthogonal to the first direction, A second side extending in two directions and having a second length longer than the first length, a third side extending parallel to the first side in the first direction and having a first length; And a fourth side extending in parallel to the second side in a second direction and having a second length, A first slit extending in a first direction between a first side and a third side when viewed from above the second plate, from a first position of the second side, or from a first position of the second side, A second slit extending in a second direction as viewed from above the second plate, the second slit being connected to the first slit, and an electrically non-conductive material filling at least a portion of the first slit or the second slit, Wherein the wireless communication circuit is electrically connected to the first conductive portion on the PCB and the first conductive portion is electrically connected to the second plate on the second plate when viewed from above the second plate, And between the first side and the first slit of the second plate and the first conductive portion may be electrically connected to a point on the second plate facing the first conductive portion of the PCB All.

According to the embodiments disclosed in this document, by forming two or more slits in the housing of the electronic device, an antenna resonating in two or more bands can be realized.

The performance of the slit antenna formed in the housing can be improved by adopting the printed circuit board in which the conductive material is removed in the region corresponding to the slit formed in the housing.

By supplying power to one point of the housing, the isolation of the multi-band antenna can be ensured.

In addition, various effects can be provided that are directly or indirectly understood through this document.

1 illustrates an electronic device in a network environment according to various embodiments.
2 shows a block diagram of an electronic device according to various embodiments.
3 shows a block diagram of a program module according to various embodiments.
4 shows a housing and a printed circuit board included in an electronic device according to an embodiment.
5 shows a housing and a printed circuit board included in an electronic device according to an embodiment.
6 illustrates a resonant current path on a housing included in an electronic device according to one embodiment.
7 is a graph showing reflection coefficients according to frequency of an antenna included in an electronic device according to an embodiment.
8 is an exploded view showing an internal structure of an electronic device according to an embodiment.
9 is a rear view of an electronic device according to one embodiment.
10 is a graph showing the total radiation efficiency and reflection coefficient according to the frequency of an antenna included in an electronic device according to various embodiments.
11 shows a housing and a printed circuit board included in an electronic device according to various embodiments.
12 shows reflection coefficients according to frequencies corresponding to housings and housings included in an electronic device according to various embodiments.
13 is a rear view of an electronic device according to an embodiment.
14 is a rear view of an electronic device according to an embodiment.
15 is a rear view and a cross-sectional view of a housing included in an electronic device according to an embodiment.
16 is a front view and a rear view of an electronic device according to an embodiment.
17 is a front view and a rear view of an electronic device according to an embodiment.

Hereinafter, various embodiments of the present document will be described with reference to the accompanying drawings. It is to be understood that the embodiments and terminologies used herein are not intended to limit the invention to the particular embodiments described, but to include various modifications, equivalents, and / or alternatives of the embodiments. In connection with the description of the drawings, like reference numerals may be used for similar components. The singular expressions may include plural expressions unless the context clearly dictates otherwise. In this document, the expressions "A or B" or "at least one of A and / or B" and the like may include all possible combinations of the items listed together. Expressions such as " first, "" second," " first, "or" second, " But is not limited to those components. When it is mentioned that some (e.g., first) component is "(functionally or communicatively) connected" or "connected" to another (second) component, May be connected directly to the component, or may be connected through another component (e.g., a third component).

In this document, the term " configured to (or configured) to "as used herein is intended to encompass all types of hardware, software, , "" Made to "," can do ", or" designed to ". In some situations, the expression "a device configured to" may mean that the device can "do " with other devices or components. For example, a processor configured (or configured) to perform the phrases "A, B, and C" may be implemented by executing one or more software programs stored in a memory device or a dedicated processor (e.g., an embedded processor) , And a general purpose processor (e.g., a CPU or an application processor) capable of performing the corresponding operations.

Electronic devices in accordance with various embodiments of the present document may be used in various applications such as, for example, smart phones, tablet PCs, mobile phones, videophones, electronic book readers, desktop PCs, laptop PCs, netbook computers, workstations, a portable multimedia player, an MP3 player, a medical device, a camera, or a wearable device. Wearable devices may be of the type of accessories (eg, watches, rings, bracelets, braces, necklaces, glasses, contact lenses or head-mounted-devices (HMD) (E.g., a skin pad or tattoo), or a bio-implantable circuit. In some embodiments, the electronic device may be, for example, a television, a digital video disk (Such as Samsung HomeSync ™, Apple TV ™, or Google TV ™), which can be used in a variety of applications such as home appliances, audio, refrigerator, air conditioner, vacuum cleaner, oven, microwave oven, washing machine, air purifier, set top box, home automation control panel, , A game console (e.g., Xbox (TM), PlayStation (TM)), an electronic dictionary, an electronic key, a camcorder, or an electronic frame.

In an alternative embodiment, the electronic device may be any of a variety of medical devices (e.g., various portable medical measurement devices such as a blood glucose meter, a heart rate meter, a blood pressure meter, or a body temperature meter), magnetic resonance angiography (MRA) A navigation system, a global navigation satellite system (GNSS), an event data recorder (EDR), a flight data recorder (FDR), an automobile infotainment device, a marine electronic equipment (For example, marine navigation systems, gyro compasses, etc.), avionics, security devices, head units for vehicles, industrial or domestic robots, drones, ATMs at financial institutions, of at least one of the following types of devices: a light bulb, a fire detector, a fire alarm, a thermostat, a streetlight, a toaster, a fitness device, a hot water tank, a heater, a boiler, . According to some embodiments, the electronic device may be a piece of furniture, a building / structure or part of an automobile, an electronic board, an electronic signature receiving device, a projector, or various measuring devices (e.g., Gas, or radio wave measuring instruments, etc.). In various embodiments, the electronic device is flexible or may be a combination of two or more of the various devices described above. The electronic device according to the embodiment of the present document is not limited to the above-described devices. In this document, the term user may refer to a person using an electronic device or a device using an electronic device (e.g., an artificial intelligence electronic device).

Referring to Figure 1, in various embodiments, an electronic device 101 in a network environment 100 is described. The electronic device 101 may include a bus 110, a processor 120, a memory 130, an input / output interface 150, a display 160, and a communication interface 170. In some embodiments, the electronic device 101 may omit at least one of the components or additionally include other components. The bus 110 may include circuitry to connect the components 110-170 to one another and to communicate communications (e.g., control messages or data) between the components. Processor 120 may include one or more of a central processing unit, an application processor, or a communications processor (CP). The processor 120 may perform computations or data processing related to, for example, control and / or communication of at least one other component of the electronic device 101.

Memory 130 may include volatile and / or non-volatile memory. Memory 130 may store instructions or data related to at least one other component of electronic device 101, for example. According to one embodiment, the memory 130 may store software and / or programs 140. The program 140 may include, for example, a kernel 141, a middleware 143, an application programming interface (API) 145, and / or an application program . At least some of the kernel 141, middleware 143, or API 145 may be referred to as an operating system. The kernel 141 may include system resources used to execute an operation or function implemented in other programs (e.g., middleware 143, API 145, or application program 147) (E.g., bus 110, processor 120, or memory 130). The kernel 141 also provides an interface to control or manage system resources by accessing individual components of the electronic device 101 in the middleware 143, API 145, or application program 147 .

The middleware 143 can perform an intermediary role such that the API 145 or the application program 147 can communicate with the kernel 141 to exchange data. In addition, the middleware 143 may process one or more task requests received from the application program 147 according to the priority order. For example, middleware 143 may use system resources (e.g., bus 110, processor 120, or memory 130, etc.) of electronic device 101 in at least one of application programs 147 Prioritize, and process the one or more task requests. The API 145 is an interface for the application 147 to control the functions provided by the kernel 141 or the middleware 143. The API 145 is an interface for controlling the functions provided by the application 141. For example, An interface or a function (e.g., a command). Output interface 150 may be configured to communicate commands or data entered from a user or other external device to another component (s) of the electronic device 101, or to another component (s) of the electronic device 101 ) To the user or other external device.

The display 160 may include a display such as, for example, a liquid crystal display (LCD), a light emitting diode (LED) display, an organic light emitting diode (OLED) display, or a microelectromechanical system (MEMS) display, or an electronic paper display . Display 160 may display various content (e.g., text, images, video, icons, and / or symbols, etc.) to a user, for example. Display 160 may include a touch screen and may receive a touch, gesture, proximity, or hovering input using, for example, an electronic pen or a portion of the user's body. The communication interface 170 establishes communication between the electronic device 101 and an external device (e.g., the first external electronic device 102, the second external electronic device 104, or the server 106) . For example, communication interface 170 may be connected to network 162 via wireless or wired communication to communicate with an external device (e.g., second external electronic device 104 or server 106).

The wireless communication may include, for example, LTE, LTE-A (LTE Advance), code division multiple access (CDMA), wideband CDMA (WCDMA), universal mobile telecommunications system (UMTS), wireless broadband (WiBro) System for Mobile Communications), and the like. According to one embodiment, the wireless communication may be wireless communication, such as wireless fidelity (WiFi), Bluetooth, Bluetooth low power (BLE), Zigbee, NFC, Magnetic Secure Transmission, Frequency (RF), or body area network (BAN). According to one example, wireless communication may include GNSS. GNSS may be, for example, Global Positioning System (GPS), Global Navigation Satellite System (Glonass), Beidou Navigation Satellite System (Beidou) or Galileo, the European global satellite-based navigation system. Hereinafter, in this document, " GPS " can be used interchangeably with " GNSS ". The wired communication may include, for example, at least one of a universal serial bus (USB), a high definition multimedia interface (HDMI), a recommended standard 232 (RS-232), a power line communication or a plain old telephone service have. Network 162 may include at least one of a telecommunications network, e.g., a computer network (e.g., LAN or WAN), the Internet, or a telephone network.

Each of the first and second external electronic devices 102, 104 may be the same or a different kind of device as the electronic device 101. According to various embodiments, all or a portion of the operations performed in the electronic device 101 may be performed in one or more other electronic devices (e.g., electronic devices 102, 104, or server 106). According to the present invention, when electronic device 101 is to perform a function or service automatically or on demand, electronic device 101 may perform at least some functions associated therewith instead of, or in addition to, (E.g., electronic device 102, 104, or server 106) may request the other device (e.g., electronic device 102, 104, or server 106) Perform additional functions, and forward the results to the electronic device 101. The electronic device 101 may process the received results as is or additionally to provide the requested functionality or services. For example, Cloud computing, distributed computing, or client-server computing techniques can be used.

2 is a block diagram of an electronic device 201 according to various embodiments. The electronic device 201 may include all or part of the electronic device 101 shown in Fig. 1, for example. The electronic device 201 may include one or more processors (e.g., AP) 210, a communications module 220, a subscriber identification module 224, a memory 230, a sensor module 240, an input device 250, An interface 270, an audio module 280, a camera module 291, a power management module 295, a battery 296, an indicator 297, and a motor 298. The processor 290, The processor 210 may be, for example, an operating system or an application program to control a plurality of hardware or software components coupled to the processor 210, and to perform various data processing and operations. ) May be implemented, for example, as a system on chip (SoC). According to one embodiment, the processor 210 may further include a graphics processing unit (GPU) and / or an image signal processor. The cellular module 210 may include at least some of the components shown in Figure 2 (e.g., the cellular module 221) The processor 210 other components: processing by loading the command or data received from at least one (e.g., non-volatile memory) in the volatile memory) and can store the result data into the nonvolatile memory.

May have the same or similar configuration as communication module 220 (e.g., communication interface 170). The communication module 220 may include, for example, a cellular module 221, a WiFi module 223, a Bluetooth module 225, a GNSS module 227, an NFC module 228 and an RF module 229 have. The cellular module 221 can provide voice calls, video calls, text services, or Internet services, for example, over a communication network. According to one embodiment, the cellular module 221 may utilize a subscriber identity module (e.g., a SIM card) 224 to perform the identification and authentication of the electronic device 201 within the communication network. According to one embodiment, the cellular module 221 may perform at least some of the functions that the processor 210 may provide. According to one embodiment, the cellular module 221 may comprise a communications processor (CP). At least some (e.g., two or more) of the cellular module 221, the WiFi module 223, the Bluetooth module 225, the GNSS module 227, or the NFC module 228, according to some embodiments, (IC) or an IC package. The RF module 229 can, for example, send and receive communication signals (e.g., RF signals). The RF module 229 may include, for example, a transceiver, a power amplifier module (PAM), a frequency filter, a low noise amplifier (LNA), or an antenna. According to another embodiment, at least one of the cellular module 221, the WiFi module 223, the Bluetooth module 225, the GNSS module 227, or the NFC module 228 transmits / receives an RF signal through a separate RF module . The subscriber identification module 224 may include, for example, a card or an embedded SIM containing a subscriber identity module, and may include unique identification information (e.g., ICCID) or subscriber information (e.g., IMSI (international mobile subscriber identity).

Memory 230 (e.g., memory 130) may include, for example, internal memory 232 or external memory 234. Volatile memory (e.g., a DRAM, an SRAM, or an SDRAM), a non-volatile memory (e.g., an OTPROM, a PROM, an EPROM, an EEPROM, a mask ROM, a flash ROM , A flash memory, a hard drive, or a solid state drive (SSD). The external memory 234 may be a flash drive, for example, a compact flash (CF) ), Micro-SD, Mini-SD, extreme digital (xD), multi-media card (MMC), or memory stick, etc. External memory 234 may communicate with electronic device 201, Or may be physically connected.

The sensor module 240 may, for example, measure a physical quantity or sense the operating state of the electronic device 201 to convert the measured or sensed information into an electrical signal. The sensor module 240 includes a gesture sensor 240A, a gyro sensor 240B, an air pressure sensor 240C, a magnetic sensor 240D, an acceleration sensor 240E, a grip sensor 240F, A temperature sensor 240G, a UV sensor 240G, a color sensor 240H (e.g., an RGB (red, green, blue) sensor), a living body sensor 240I, And a sensor 240M. Additionally or alternatively, the sensor module 240 may be configured to perform various functions such as, for example, an e-nose sensor, an electromyography (EMG) sensor, an electroencephalograph (EEG) sensor, an electrocardiogram An infrared (IR) sensor, an iris sensor, and / or a fingerprint sensor. The sensor module 240 may further include a control circuit for controlling at least one or more sensors belonging to the sensor module 240. In some embodiments, the electronic device 201 further includes a processor configured to control the sensor module 240, either as part of the processor 210 or separately, so that while the processor 210 is in a sleep state, The sensor module 240 can be controlled.

The input device 250 may include, for example, a touch panel 252, a (digital) pen sensor 254, a key 256, or an ultrasonic input device 258. As the touch panel 252, for example, at least one of an electrostatic type, a pressure sensitive type, an infrared type, and an ultrasonic type can be used. Further, the touch panel 252 may further include a control circuit. The touch panel 252 may further include a tactile layer to provide a tactile response to the user. (Digital) pen sensor 254 may be part of, for example, a touch panel or may include a separate recognition sheet. Key 256 may include, for example, a physical button, an optical key, or a keypad. The ultrasonic input device 258 can sense the ultrasonic wave generated by the input tool through the microphone (e.g., the microphone 288) and confirm the data corresponding to the ultrasonic wave detected.

Display 260 (e.g., display 160) may include panel 262, hologram device 264, projector 266, and / or control circuitry for controlling them. The panel 262 may be embodied, for example, flexibly, transparently, or wearably. The panel 262 may comprise a touch panel 252 and one or more modules. According to one embodiment, the panel 262 may include a pressure sensor (or force sensor) capable of measuring the intensity of the pressure on the user's touch. The pressure sensor may be integrated with the touch panel 252 or may be implemented by one or more sensors separate from the touch panel 252. The hologram device 264 can display a stereoscopic image in the air using interference of light. The projector 266 can display an image by projecting light onto a screen. The screen may be located, for example, inside or outside the electronic device 201. The interface 270 may include, for example, an HDMI 272, a USB 274, an optical interface 276, or a D-sub (D-subminiature) 278. The interface 270 may, for example, be included in the communication interface 170 shown in FIG. Additionally or alternatively, the interface 270 may include, for example, a mobile high-definition link (MHL) interface, an SD card / multi-media card (MMC) interface, or an infrared data association have.

The audio module 280 can, for example, convert sound and electrical signals in both directions. At least some of the components of the audio module 280 may be included, for example, in the input / output interface 145 shown in FIG. The audio module 280 may process sound information input or output through, for example, a speaker 282, a receiver 284, an earphone 286, a microphone 288, or the like. The camera module 291 is, for example, a device capable of capturing still images and moving images, and according to one embodiment, one or more image sensors (e.g., a front sensor or a rear sensor), a lens, an image signal processor (ISP) , Or flash (e.g., an LED or xenon lamp, etc.). The power management module 295 can, for example, manage the power of the electronic device 201. [ According to one embodiment, the power management module 295 may include a power management integrated circuit (PMIC), a charging IC, or a battery or fuel gauge. The PMIC may have a wired and / or wireless charging scheme. The wireless charging scheme may include, for example, a magnetic resonance scheme, a magnetic induction scheme, or an electromagnetic wave scheme, and may further include an additional circuit for wireless charging, for example, a coil loop, a resonant circuit, have. The battery gauge can measure, for example, the remaining amount of the battery 296, the voltage during charging, the current, or the temperature. The battery 296 may include, for example, a rechargeable battery and / or a solar cell.

The indicator 297 may indicate a particular state of the electronic device 201 or a portion thereof (e.g., processor 210), e.g., a boot state, a message state, or a state of charge. The motor 298 can convert the electrical signal to mechanical vibration, and can generate vibration, haptic effects, and the like. The electronic device 201 is a mobile TV support device capable of processing media data conforming to standards such as digital multimedia broadcasting (DMB), digital video broadcasting (DVB), or the like : GPU). Each of the components described in this document may be composed of one or more components, and the name of the component may be changed according to the type of the electronic device. In various embodiments, an electronic device (e. G., Electronic device 201) may have some components omitted, further include additional components, or some of the components may be combined into one entity, The functions of the preceding components can be performed in the same manner.

3 is a block diagram of a program module according to various embodiments. According to one embodiment, program module 310 (e.g., program 140) includes an operating system that controls resources associated with an electronic device (e.g., electronic device 101) and / E.g., an application program 147). The operating system may include, for example, Android ™, iOS ™, Windows ™, Symbian ™, Tizen ™, or Bada ™. 3, program module 310 includes a kernel 320 (e.g., kernel 141), middleware 330 (e.g., middleware 143), API 360 (e.g., API 145) ), And / or an application 370 (e.g., an application program 147). At least a portion of the program module 310 may be preloaded on an electronic device, 102 and 104, a server 106, and the like).

The kernel 320 may include, for example, a system resource manager 321 and / or a device driver 323. The system resource manager 321 can perform control, allocation, or recovery of system resources. According to one embodiment, the system resource manager 321 may include a process manager, a memory manager, or a file system manager. The device driver 323 may include, for example, a display driver, a camera driver, a Bluetooth driver, a shared memory driver, a USB driver, a keypad driver, a WiFi driver, an audio driver, or an inter-process communication . The middleware 330 may provide various functions through the API 360, for example, to provide functions that are commonly needed by the application 370 or allow the application 370 to use limited system resources within the electronic device. Application 370 as shown in FIG. According to one embodiment, the middleware 330 includes a runtime library 335, an application manager 341, a window manager 342, a multimedia manager 343, a resource manager 344, a power manager 345, a database manager The location manager 350, the graphic manager 351, or the security manager 352. In this case, the service manager 341 may be a service manager, a service manager, a service manager, a package manager 346, a package manager 347, a connectivity manager 348, a notification manager 349,

The runtime library 335 may include, for example, a library module that the compiler uses to add new functionality via a programming language while the application 370 is executing. The runtime library 335 may perform input / output management, memory management, or arithmetic function processing. The application manager 341 can manage the life cycle of the application 370, for example. The window manager 342 can manage GUI resources used in the screen. The multimedia manager 343 can recognize the format required for reproducing the media files and can perform encoding or decoding of the media file using a codec according to the format. The resource manager 344 can manage the source code of the application 370 or the space of the memory. The power manager 345 may, for example, manage the capacity or power of the battery and provide the power information necessary for operation of the electronic device. According to one embodiment, the power manager 345 may interoperate with a basic input / output system (BIOS). The database manager 346 may create, retrieve, or modify the database to be used in the application 370, for example. The package manager 347 can manage installation or update of an application distributed in the form of a package file.

The connectivity manager 348 may, for example, manage the wireless connection. The notification manager 349 may provide the user with an event such as, for example, an arrival message, an appointment, a proximity notification, and the like. The location manager 350 can manage the location information of the electronic device, for example. The graphic manager 351 may, for example, manage the graphical effects to be presented to the user or a user interface associated therewith. Security manager 352 may provide, for example, system security or user authentication. According to one embodiment, the middleware 330 may include a telephony manager for managing the voice or video call function of the electronic device, or a middleware module capable of forming a combination of the functions of the above-described components . According to one embodiment, the middleware 330 may provide a module specialized for each type of operating system. Middleware 330 may dynamically delete some existing components or add new ones. The API 360 may be provided in a different configuration depending on the operating system, for example, as a set of API programming functions. For example, for Android or iOS, you can provide a single API set for each platform, and for Tizen, you can provide two or more API sets for each platform.

The application 370 may include a home 371, a dialer 372, an SMS / MMS 373, an instant message 374, a browser 375, a camera 376, an alarm 377, Contact 378, voice dial 379, email 380, calendar 381, media player 382, album 383, watch 384, healthcare (e.g., measuring exercise or blood glucose) , Or environmental information (e.g., air pressure, humidity, or temperature information) application. According to one embodiment, the application 370 may include an information exchange application capable of supporting the exchange of information between the electronic device and the external electronic device. The information exchange application may include, for example, a notification relay application for communicating specific information to an external electronic device, or a device management application for managing an external electronic device. For example, the notification delivery application can transmit notification information generated in another application of the electronic device to the external electronic device, or receive notification information from the external electronic device and provide the notification information to the user. The device management application may, for example, control the turn-on / turn-off or brightness (or resolution) of an external electronic device in communication with the electronic device (e.g., the external electronic device itself Control), or install, delete, or update an application running on an external electronic device. According to one embodiment, the application 370 may include an application (e.g., a healthcare application of a mobile medical device) designated according to the attributes of the external electronic device. According to one embodiment, the application 370 may include an application received from an external electronic device. At least some of the program modules 310 may be implemented (e.g., executed) in software, firmware, hardware (e.g., processor 210), or a combination of at least two of the same, Program, routine, instruction set or process.

4 shows a housing and a printed circuit board included in an electronic device according to an embodiment.

Referring to FIG. 4, an electronic device according to an embodiment may include a housing 410, a printed circuit board 420, and a power feeder 430.

According to one embodiment, the housing 410 may include a conductive member. For example, the housing 410 may be substantially formed of metal. The housing 410 may be configured to cover at least a portion of one side of the electronic device. The housing 410 may cover at least a portion of, for example, the back (or front) and side of the electronic device. The housing 410 has, for example, a rectangular shape, and the rectangular shape extends in a first direction and includes a first side 410a having a first length, a second side 410b extending in a second direction perpendicular to the first direction, A second side 410b having a second length greater than the first length, a third side 410c extending in parallel with the first side 410a in the first direction and having a first length, And may include a fourth side 410d extending parallel to the second side 410b and having a second length. The housing 410 may be configured to resonate at a first frequency and a second frequency. For example, the housing 410 may resonate at the first frequency and the second frequency by the first slit 411 and the second slit 412, which will be described below.

According to one embodiment, the first slit 411 and the second slit 412 may be formed in the housing 410. [ The first slit 411 may extend, for example, in a direction perpendicular to the edge from the edge (e.g., the right edge) of the housing 410. The first slit 411 extends from the first position of the second side 410b or from the vicinity of the first position to the first side 410a and the third side 410c when viewed from above the housing 410, . The first slit 411 may have a length corresponding to the first frequency. For example, a signal in the first frequency band can be transmitted and received through the first slit 411. The second slit 412 may extend in a direction different from the first slit 411 from one point of the first slit 411. The second slit 412 may extend in a direction perpendicular to the first slit 411 from one point of the first slit 411, for example. The second slit 412 extends from the first position of the second side 410b or from the vicinity of the first position in a second direction when viewed from above the housing 410 and can be connected to the first slit 411 . The second slit 412 may be formed on the second side 410b of the housing 410 and a part of the side member. The second slit 412 may have a length corresponding to the second frequency. For example, signals in the second frequency band can be transmitted and received through the second slit 412 (or the second slit 412 and the first slit 411). By forming two or more slits 421 and 422 in the housing 410, the housing 410 can operate as an antenna radiator that resonates at two or more frequencies. The first slit 411 and the second slit 412 may form an L-shape together. The housing may include an electrically non-conductive material that fills at least a portion of the first slit 411 and the second slit 412.

According to one embodiment, the printed circuit board 420 may be disposed under the housing 410. Although not shown in FIG. 4, other configurations of the electronic device (such as communication circuits) may be disposed on the printed circuit board 420. The printed circuit board 420 may include a conductive material that transmits an electrical signal.

According to one embodiment, the printed circuit board 420 may include a slit facing the first slit 411 or the second slit 412. According to one embodiment, slits 421 and 422 may be formed in at least a portion of the area of the printed circuit board 420 corresponding to the first slit 411 and the second slit 412 of the housing 410 . A portion of the printed circuit board 420 overlapping the first slit 411 and the second slit 412 of the housing 410 when the printed circuit board 420 is disposed under the housing 410. [ The slits 421 and 422 can be formed. The slits 421 and 422 are formed on the printed circuit board 420 so that the first slits 411 and the second slits 412 of the housing 410 are electrically connected to the conductive material included in the printed circuit board 420 and the housing 410 may not overlap when viewed from the rear. The conductive material adjacent to the first slit 411 and the second slit 412 of the housing 410 may be removed so that the radiation performance of the first slit 411 and the second slit 412 may not be deteriorated .

According to another embodiment, at least a portion of the area of the printed circuit board 420 corresponding to the first slit 411 and the second slit 412 of the housing 410 may be made of a non-conductive material. For example, the slits 421 and 422 of the printed circuit board 420 shown in FIG. 4 may be filled with a non-conductive material. An embodiment in which a portion of the printed circuit board 420 is made of a non-conductive material is shown in Fig. For example, when the printed circuit board 420 is disposed under the housing 410, a portion of the printed circuit board 420 overlapping the first slit 411 and the second slit 412 of the housing 410 The region may be made of a non-conductive material. The area of the printed circuit board 420 corresponding to the first slit 411 and the second slit 412 may be a fill cut region, for example. The first slit 411 and the second slit 412 of the housing 410 are electrically connected to the conductive material included in the printed circuit board 420 and the housing 410 may not overlap when viewed from the rear. The area adjacent to the first slit 411 and the second slit 412 of the housing 410 is made of a non-conductive material so that the radiation performance of the first slit 411 and the second slit 412 is not deteriorated .

According to one embodiment, the feeding part 430 may be electrically connected to one point 410 of the housing 410. For example, the feeding part 430 may be electrically connected to a point 413 of the housing 410 through a point 423 of the printed circuit board 420. One point 423 of the printed circuit board 420 and one point 413 of the housing 410 may be electrically connected, for example, via a connecting member. The power feeder 430 may be electrically connected to the processor 120, the communication interface 170, the communication module 220 or the processor 210 shown in FIG. 1, for example.

According to one embodiment, the feed part 430 may be fed to one point 423 of the printed circuit board 420. An electric signal fed to one point 423 of the printed circuit board 420 is transmitted to one point 413 of the housing 410 adjacent to the first slit 411 or the second slit 412 of the housing 410 . For example, an electric signal fed to one point 423 of the printed circuit board 420 by the feeder 430 is transmitted to the first slit 411 and the second slit 412 in a region where the first slit 411 and the second slit 412 overlap, To a point 413 of the base station 410.

According to one embodiment, a point 423 (or first conductive portion) of the printed circuit board 420 may be electrically connected to the wireless communication circuitry. For example, the wireless communication circuitry may be electrically connected to a point 423 of the printed circuit board 420 through a cable including a conductive line. The cable may traverse a slit formed in the printed circuit board 420, for example, when viewed from above the housing 410. One point 423 of the printed circuit board 420 may be positioned between the first side 410a and the first slit 411 of the housing 410 when viewed from above the housing 410. [ One point 413 of the printed circuit board 420 may be electrically connected to a point 413 of the housing 410 facing a point 423 of the printed circuit board 420. A flexible conductive member can be inserted between one point 423 of the printed circuit board 420 and one point 413 of the housing 410. [

5 shows a housing and a printed circuit board included in an electronic device according to an embodiment.

Referring to FIG. 5, an electronic device according to an embodiment may include a housing 510, a printed circuit board 520, and a power feeder 530. For the sake of convenience of description, a description overlapping with the description with reference to FIG. 4 will be omitted.

According to one embodiment, the first slit 510 and the second slit 520 may be formed in the housing 510. The first slit 510 may extend, for example, in a direction perpendicular to the edge from an edge (e.g., a right edge) of the housing 510. The second slit 520 may extend in a first direction perpendicular to the first slit 510 and in a second direction opposite to the first direction, for example, from one point of the first slit 510. For example, the second slit 520 may extend upward and downward from one point of the first slit 510. The center of the second slit 520 may intersect the first slit 510.

According to one embodiment, slits 521 and 522 may be formed in at least a portion of the area of the printed circuit board 520 corresponding to the first slit 511 and the second slit 512 of the housing 510 . A portion of the printed circuit board 520 overlapping the first slit 511 and the second slit 512 of the housing 510 when the printed circuit board 520 is disposed below the housing 510. [ The slits 521 and 522 can be formed.

According to another embodiment, at least a portion of the area of the printed circuit board 520 corresponding to the first slit 511 and the second slit 512 of the housing 510 may be made of a non-conductive material. For example, the slits 521 and 522 of the printed circuit board 520 shown in Fig. 5 may be filled with a non-conductive material. The area of the printed circuit board 520 corresponding to the first slit 510 and the second slit 520 may be, for example, a fill cut region.

The power feeder 530 may be electrically connected to a point 513 of the housing 510 through a point 523 of the printed circuit board 520. [ For example, the power feeder 530 can feed power to one point 523 of the printed circuit board 520, and an electrical signal fed to one point 523 of the printed circuit board 520 can be transmitted to the first slit 511 and the second slit 512 can be transmitted to a point 513 of the housing 510 adjacent to the overlapping area.

6 illustrates a resonant current path on a housing included in an electronic device according to one embodiment.

Referring to FIG. 6, the housing 610 according to one embodiment may include a first slit 611 and a second slit 612. One point 613 of the housing 610 is connected to one point of a printed circuit board (e.g., 420 in Fig. 4) electrically connected to the feed part (e.g., the feed part 430 in Fig. 4) (423 of FIG.

According to an embodiment, the electric signal supplied by the power feeder may be transmitted along the first path (1), the second path (2), and / or the third path (3). The electrical signal is transmitted along the first path (1), the second path (2) and / or the third path (3) so that the housing 610 can operate as an antenna. For example, the electrical signal may be transmitted along the first path (1). A signal of the first frequency band among the electrical signals transmitted along the first path (1) may be radiated through the first slit 611. As another example, the electrical signal may be transmitted along the second path (2). The edge portion of the housing 610 separated by the first slit 611 can be electrically coupled. Of the electrical signals transmitted along the second path (2), the signal of the second frequency band may be radiated through the second slit 612. As another example, the electrical signal may be transmitted along the third path (3). A signal in the second frequency band of the electrical signal along the third path (3) may be radiated through the second slit 612 (or the first slit 611 and the second slit 612).

According to one embodiment, the housing 610 may be electrically connected to the first switch 641 and the second switch 642. For example, the first switch 641 may be electrically connected to a part of the first slit 611. When the first switch 641 is closed, the electrical length of the first slit 611 can be shortened. The second switch 642 may be electrically connected to a portion of the second slit 612. When the second switch 642 is closed, the electrical length of the second slit 612 can be shortened. The resonance frequency of the housing 610 by the first slit 611 and the second slit 612 can be changed by opening and closing the first switch 641 and the second switch 642. [ For example, when the first switch 641 and / or the second switch 642 are closed, the resonance frequency of the housing 610 can be increased. The first switch 641 and the second switch 642 may be connected to each other via a connection member such as a C-clip or the like.

Although the housing 610 is shown as being electrically connected to the first switch 641 and the second switch 642 in Figure 6, the first switch 641 and the second switch 642 may be omitted as an optional configuration have.

7 is a graph showing reflection coefficients according to frequency of an antenna included in an electronic device according to an embodiment.

Referring to FIG. 7, for example, the housing 410 of the electronic device shown in FIG. 4 may have a low reflection coefficient at the first frequency f1 and the second frequency f2. For example, the housing 410 may resonate at the first frequency f1 and the second frequency f2. If the electronic device is a mobile device, the housing 410 may be difficult to resonate at low frequencies due to the limited size of the electronic device. For example, the housing 410 including only the first slit 411 can resonate at a first frequency f1 which is a relatively high frequency. 4, the second slit 412 is formed in the housing 410 so that the housing 410 can resonate at a first frequency f1 and a second frequency f2 lower than the first frequency f1, can do. A part of the conductive layer of the printed circuit board is removed to form the slit 421 in the area of the printed circuit board 420 corresponding to the first slit 411 and the second slit 412, A sufficiently low reflection coefficient can be exhibited at the first frequency f1 and the second frequency f2 by supplying power to the first slit 411 and the second slit 412 using the first slit 411 and the second slit 412. [

8 is an exploded view showing an internal structure of an electronic device according to an embodiment.

Referring to Figure 8, an electronic device according to one embodiment may be a clamshell mobile device. The electronic device may include a body portion 802 and a folder portion 801 that is rotatably coupled to the body portion 802 by a hinge 803. [ The electronic device may include a front housing 810 and a rear housing 820 surrounding the body portion 802 of the electronic device. The electronic device may include side members that enclose spaces between the front housing 810 and the rear housing 820. According to one embodiment, the rear housing 820 and the side member may be integrally formed. The electronic device may include a touch screen display (not shown) exposed through the front housing 810. In this document, the main body portion 802 may be referred to as the lower portion of the electronic device, and the folder portion 901 may be referred to as the upper portion of the electronic device. In this document, the front housing 810 may be referred to as a first plate, and the rear housing 820 may be referred to as a second plate.

According to one embodiment, the printed circuit board 830 may be disposed in a space between the front housing 810 and the rear housing 820. [ For example, the printed circuit board 830 may be disposed on the rear surface of the front housing 810. Although not shown in FIG. 8, an input device such as a keypad or a touch panel may be exposed through the front surface of the front housing 810 exposed to the outside. The printed circuit board 830 may include various configurations of electronic devices. For example, a wireless communication circuit and a processor electrically connected to the wireless communication circuit may be disposed on a printed circuit board. The second area 832 of the printed circuit board 830 may be made of a non-conductive material. A connecting member may be disposed in the third area 833 of the printed circuit board 830.

According to one embodiment, the rear housing 820 may be coupled to the front housing 810. [ When viewed from the back of the electronic device, the back housing 820 may be disposed on the printed circuit board 830. A substantial portion of the rear housing 820 may be made of an electrically conductive material. For example, one side of the rear housing 820 exposed to the outside may be made of metal. A slit (e.g., a first slit and a second slit) may be formed in the housing. For example, a slit may be formed in the first region 821 of the rear housing 820. The conductive material may be exposed through the second region 822 of the rear housing 820 when the inner surface of the rear housing is viewed. The second area 822 of the rear housing 820 may be electrically connected to a connection member disposed in the third area 833 of the printed circuit board 830.

According to one embodiment, at least a portion of the first area 831 of the printed circuit board 830 corresponding to the first area 821 of the slit-formed rear housing 820 may be made of a non-conductive material. For example, the second area 832 of the printed circuit board 830 corresponding to the first area 821 of the rear housing 820 may be made of a non-conductive material. The second region 832 may be, for example, a fill cut region. The area adjacent to the slit of the housing is made of a non-conductive material, so that the radiation performance by the slit may not be deteriorated.

9 is a rear view of an electronic device according to one embodiment.

Referring to FIG. 9, the housing 910 of the electronic device according to an embodiment may include a first slit 911 and a second slit 912. Signals can be wirelessly transmitted and received from the electronic device through the first slit 911 and the second slit 912. The frequency of the signal transmitted and received through the first slit 911 and the second slit 912 can be determined according to the lengths of the first slit 911 and the second slit 912. For example, the frequencies of the signals transmitted and received through the first slit 911 and the second slit 912 may be lowered as the lengths of the first slit 911 and the second slit 912 are longer. The length L1 of the second slit 912 may be, for example, 20 mm.

According to various embodiments, the housing 920 of the electronic device may include a first slit 921 and a second slit 922. Signals can be wirelessly transmitted and received from the electronic device through the first slit 921 and the second slit 922. The length of the first slit 921 may be equal to the length of the first slit 911. The length L2 of the second slit 922 may be shorter than the length L1 of the second slit 912. [ The length L2 of the second slit 922 may be, for example, 15 mm. In this case, the frequency of the signal transmitted / received through the second slit 922 may be higher than the frequency of the signal transmitted / received through the second slit 912.

10 is a graph showing the total radiation efficiency and reflection coefficient according to the frequency of an antenna included in an electronic device according to various embodiments. The graph according to the first embodiment shows the total radiation efficiency and reflection coefficient of the antenna using the housing 910 of FIG. 9 as the radiator, and the graph according to the second embodiment shows the total of the antenna using the housing 920 of FIG. 9 as the radiator Radiation efficiency and reflection coefficient.

Referring to FIG. 10, the antenna according to the first embodiment and the antenna according to the second embodiment can resonate at 2.2 GHz in common. The resonance at 2.2 GHz can be generated by the slits in the transverse direction (e.g., the first slit 911 and the first slit 921).

The antenna according to Embodiment 1 can resonate at 2.2 GHz and 1.4 GHz. The antenna according to the second embodiment can resonate at 2.2 GHz and 1.6 GHz. Resonance at 1.4 GHz and 1.6 GHz can be generated by a slit in the longitudinal direction (e.g., the second slit 912 or the second slit 922). Since the length of the second slit 912 of the antenna according to the first embodiment is longer than the length of the second slit 922 of the antenna according to the second embodiment, the resonance frequency of the antenna according to the second embodiment is May be higher than the resonance frequency of the antenna. By adjusting the length of the slit in the longitudinal direction, the resonance frequency of the other frequency band can be adjusted while maintaining the performance at 2.2 GHz.

11 shows a housing and a printed circuit board included in an electronic device according to various embodiments.

11, an electronic device according to an embodiment includes a housing 1110, a printed circuit board 1120, a feeding portion 1130, a first ground portion 1141, a second ground portion 1142, and a third And a grounding part 1143.

According to various embodiments, the housing 1110 may include a first slit 1111 and a second slit 1112. The printed circuit board 1120 may include slits 1121 and 1122. [ The feed portion 1130 may be electrically connected to the point 1113 of the housing 1110 through the point 1123 of the printed circuit board 1120. [ The power feeder 1130 can feed power to the point 1123 of the printed circuit board 1120. The electric power fed can be transmitted to the point 1113 of the housing 1110. The housing 1110, the printed circuit board 1120 and the feed part 1130 of FIG. 11 are similar to the housing 410, the printed circuit board 420 and the feeder 430 of FIG. 4, do.

According to various embodiments, one or more points 1114, 1115, 1116 of the housing 1110 adjacent to the first slit 1111 or the second slit 1112 may be electrically connected to a ground layer (not shown). For example, one or more points 1114, 1115, and 1116 of housing 1110 may be connected to the ground layer through first ground 1141, second ground 1142 and third ground 1143, respectively .

The first ground 1141, the second ground 1142 and the third ground 1143 may be electrically connected to one or more switches (not shown). The first ground 1141, the second ground 1142 and the third ground 1143 may be selectively connected to the ground layer through a switch. For example, depending on the operation of the switch, a portion of the first ground 1141, the second ground 1142 and the third ground 1143 may be connected to the ground layer. Alternatively, all of the first ground 1141, the second ground 1142, and the third ground 1143 may be connected to the ground layer. Alternatively, all of the first ground 1141, the second ground 1142, and the third ground 1143 may not be connected to the ground layer. For example, some of the first point 1114, the second point 1115, and the third point 1116 of the housing 1110 may be connected to the ground layer. Alternatively, all of the first point 1114, the second point 1115, and the third point 1116 may be connected to the ground layer. Alternatively, not all of the first point 1114, the second point 1115 and the third point 1116 may be connected to the ground layer.

According to one embodiment, the switch may be controlled by a processor (e.g., processor 120 of FIG. 1, communication interface 170, processor 210 of FIG. 2, or communication module 220). The processor may be, for example, a communications processor or an application processor.

According to one embodiment, the processor can control the switch such that the housing 1110 resonates at the desired frequency. For example, the processor can verify the communication environment of the electronic device. The processor may set the target frequency based on the communication environment of the electronic device. The resonant frequency of the housing 1110 can be varied according to the points 1114, 1115, and / or 1116 where the housing 1110 is connected to the ground layer. The processor may not connect or connect the first point 1114, the second point 1115, and / or the third point 1116 with the ground layer so that the housing 1110 resonates at the target frequency by controlling the switch.

According to one embodiment, the housing 1110 may be grounded via one or more points 1114, 1115, and 1116. The housing 1110 may be powered through a point 1113 of the housing 1110.

12 shows reflection coefficients according to frequencies corresponding to housings and housings included in an electronic device according to various embodiments.

12, longitudinal lengths of slits 1212, 1222, 1232, and 1242 formed in the housings 1210, 1220, 1230, and 1240 may be equal to each other. The lengths of the horizontal slits 1211, 1221, 1231, and 1241 formed in the housings 1210, 1220, 1230, and 1240 may be different. For example, the length W1 of the slit 1211 is shorter than the length W2 of the slit 1221, the length W2 of the slit 1221 is shorter than the length W3 of the slit 1231, 1231 may be shorter than the length W4 of the slit 1241. [ The slit 1241 may extend from one edge of the housing 1240 to the opposite edge. 12, the lengths of the lateral slits or the lateral fill-cut regions formed on the printed circuit board included in the housings 1210, 1220, 1230, and 1240 are equal to the length W2 of the slits 1221, Can be the same.

According to various embodiments, when the length of the slits 1211, 1221, 1231, and 1241 formed in the housing is different from the length of the slits (not shown) formed on the printed circuit board corresponding to the slits 1211, 1221, 1231, and 1241 The resonance frequency can be changed.

According to various embodiments, the housings 1210, 1220, 1230, and 1240 may resonate at frequency f1 in common. The resonance at the frequency f1 can be generated by the slits 1212, 1222, 1232, and 1242 in the longitudinal direction. The housings 1210, 1220, 1230 and 1240 can resonate at frequencies other than the frequency f1 by the slits 1211, 1221, 1231 and 1241 in the transverse direction. Different resonance frequencies of the housings 1210, 1220, 1230 and 1240 can be changed according to the length of the slits 1211, 1221, 1231 and 1241 in the transverse direction.

For example, the housing 1220 may resonate at frequency f2. Alternatively, the housing 1210 in which the length W1 of the slit 1211 in the transverse direction is shorter than the housing 1220 can resonate at a frequency higher than the frequency f2. As another example, the housing 1230 in which the length W3 of the slit 1231 in the transverse direction is longer than the housing 1220 can resonate at a frequency lower than the frequency f2. As another example, the housing 1240 in which the length W4 of the slit 1241 in the transverse direction is longer than the housing 1230 can resonate at a frequency lower than the frequency f1.

According to one embodiment, the housings 1210, 1220, 1230, 1240 may be supplied with electrical signals from a printed circuit board (not shown). For example, the housing 1210, 1220, 1230, 1240 may be supplied with an electrical signal via point A or point B. For example, when an electrical signal is supplied through the point A, the lengthwise slits 1211, 1221, 1231, or 1241 of the transverse slits 1211, 1221, 1231, 1221, 1231, or 1241 can be changed, and the resonance frequency by the slits 1212, 1222, 1232, or 1242 in the vertical direction can be maintained. In another example, when electrical signals are supplied through the point B, the width of the slit 1211 (1211, 1221, 1231, or 1241) , 1221, 1231, or 1241 and the vertical slits 1212, 1222, 1232, or 1242 can be changed.

13 is a rear view of an electronic device according to an embodiment.

Referring to FIG. 13, the electronic device may include a housing 1310 and a non-conductive member 1320. The housing 1310 may be a back cover of the electronic device. The slit formed in the housing 1310 may be filled by the non-conductive member 1320.

According to one embodiment, a slit may be formed in the first region 1311 of the housing 1310. The slit may be filled by the non-conductive member 1320. The housing 1310 may receive an electrical signal through a first point 1313 of the first area 1311 (e.g., a point at the upper right end) 1313. The housing 1310 may be grounded via a second point (e.g., a point at the upper left) 1314 of the first area 1311. The signal fed through the first point 1313 can be radiated through the slit in the first region 1311. [

According to one embodiment, a slit may be formed in the second region 1312 of the housing 1310. The slit may be filled by the non-conductive member 1320. The housing 1310 may be grounded via a third point (e.g., a point at the lower left end) 1315 of the second area 1312. [ The electrical signal supplied through the first point 1313 may be transmitted to the right end of the housing 1310 by coupling. The signal supplied through the first point 1313 may be radiated through the slit in the second region 1312. [

14 is a rear view of an electronic device according to an embodiment.

Referring to Fig. 14, the electronic device can include a housing 1410 and a non-conductive member 1420. Fig. Housing 1410 may be the back cover of the electronic device. The slit formed in the housing 1410 may be filled by the non-conductive member 1420. [

According to one embodiment, a slit may be formed in the second region 1412 of the housing 1410. The slit may be filled by the non-conductive member 1420. Housing 1410 may be provided with an electrical signal through point 1413 at the upper right of region 1412. Housing 1410 may be grounded via point 1415 at the lower right of region 1412. The signal fed through point 1413 may be radiated through the slit in region 1412. [

According to one embodiment, a slit may be formed in the first region 1411 of the housing 1410. The slit may be filled by the non-conductive member 1420. The housing 1410 may be grounded via a point 1414 at the upper left of the first region 1411. Electrical signals supplied through point 1413 can be transmitted to the top of housing 1410 by coupling. The electrical signal supplied through point 1413 may be radiated through the slit in first region 1411. [

15 is a rear view and a cross-sectional view of a housing included in an electronic device according to an embodiment.

Referring to FIG. 15, the electronic device may include a housing 1510 and a non-conductive member 1520. Housing 1510 may be the back cover of the electronic device.

Referring to the sectional view of the housing 1510 according to one embodiment, the housing 1510 may be provided with a slit in the transverse direction. The transverse slits formed in the housing 1510 may be filled with the non-conductive member 1520. [

Referring to a cross-sectional view of housing 1510 according to one embodiment, housing 1510 includes at least a portion (e.g., BB 'adjacent region) that is not physically separated by a lateral slit can do. At least a portion of the housing 1510 that is not physically separated may be filled with the non-conductive member 1520.

15, the housing 1510 may be formed with a slit in the vertical direction, and the slit in the vertical direction may also be filled with the non-conductive member 1520, although it is shown only in the horizontal slit formed in the housing 1510. [

16 is a front view and a rear view of an electronic device according to an embodiment.

16, an electronic device according to one embodiment includes a first housing 1610, a first non-conductive member 1620, a second housing 1630, a second non-conductive member 1640, and a display 1650, . ≪ / RTI >

According to one embodiment, the first housing 1610 may surround the bottom of the electronic device. The first housing 1610 may be configured to resonate at a first frequency and a second frequency. For example, a first slit (e.g., a transverse slit) having a length associated with a first frequency may be formed in a first region 1611 of the first housing 1610. [ The first slit may be filled with the first non-conductive member 1620. The first housing 1610 may receive an electrical signal through a point 1613 on the upper right side of the first area 1611. The first housing 1610 may be grounded via a point 1614 at the upper left of the first region 1611. A second slit (e.g., a longitudinal slit) extending in a different direction from one point of the first slit may be formed in the second region 1612 of the first housing 1610. [ The second slit may have a length associated with the second frequency. The second slit may be filled with the first non-conductive member 1620. The first housing 1610 may be grounded via a point 1615 on the lower right side of the second region 1612.

According to one embodiment, the second housing 1630 may surround the top of the electronic device. The second housing 1630 may surround the periphery of the display 1650 disposed on top of the electronic device. According to one embodiment, the second housing 1630 may be configured to resonate at a first frequency and a second frequency. For example, the second housing 1630 may be provided with a third slit (e.g., a transverse slit) having a length associated with the first frequency. The third slit may be filled with the second non-conductive member 1640. The second housing 1630 may be provided with a fourth slit (e.g., a longitudinal slit) extending from one point of the third slit in another direction. The fourth slit may have a length associated with the second frequency. The fourth slit may be filled with the second non-conductive member 1640. The third slit and the fourth slit may be formed at positions symmetrical to the positions where the first slit and the second slit formed in the first housing 1610 are formed, for example. The second housing 1630 can be powered or grounded through a point of the second housing 1630 that is symmetrical with the points 1613, 1614, 1615 of the first housing 1610.

17 is a front view and a rear view of an electronic device according to an embodiment.

17, the electronic device may include a first housing 1710, a first non-conductive member 1720, a second housing 1730, a second non-conductive member 1740, and a display 1750 . The first housing 1710, the first non-conductive member 1720, the second housing 1730, the second non-conductive member 1740, and the display 1750 of Fig. 17 each include a first housing 1610, The first non-conductive member 1620, the second housing 1630, the second non-conductive member 1640, and the display 1650, a duplicate description will be omitted.

According to one embodiment, a first slit (e.g., a transverse slit) may be formed in the first region 1711 of the first housing 1710. The first slit may include a curve that is not a straight line. For example, the first slit may extend in the right direction from the left edge of the first housing 1710, extend in the upper left curve, and then extend in the left direction.

According to one embodiment, a second slit (e.g., a longitudinal slit) may be formed in the second region 1712 of the first housing 1710. The second slit may extend downward from the point where the first slit is bent. In Fig. 17, the second slit is shown extending along a straight line, but not limited thereto, the second slit may extend along the curve. The first slit and the second slit may be filled with the first non-conductive member 1720.

According to one embodiment, the second housing 1730 may be provided with a third slit and a fourth slit extending from one point of the third slit in another direction. The third slit and / or the fourth slit may extend along a straight line or along a curve. The third slit and the fourth slit may be formed at positions symmetrical to the positions where the first slit and the second slit formed in the first housing 1710 are formed, for example. The third slit and the fourth slit may be filled with the second non-conductive member 1740.

An electronic device according to one embodiment is configured to resonate at a first frequency and a second frequency and includes a first slit having a length associated with the first frequency and a second slit extending in a direction different from the first slit from a point of the first slit, A printed circuit board disposed below the housing, wherein at least a portion of the region corresponding to the first slit and the second slit is made of a non-conductive material, and a second slit formed in the first slit or the second slit, And a feed portion that feeds power through one point of the housing adjacent to the two slits.

According to one embodiment, the first slit extends in a direction perpendicular to the edge from the edge of the housing, and the second slit may extend in a direction perpendicular to the first slit.

According to one embodiment, the second slit may extend from a first point of the first slit in a first direction perpendicular to the first slit and in a second direction opposite to the first direction.

According to one embodiment, the power feeding part can be supplied through a point of the housing adjacent to the area where the first slit and the second slit overlap.

According to one embodiment, the first slit may extend from one edge of the housing to the opposite edge.

According to one embodiment, the non-conductive member may further include a first slit and a second slit.

According to one embodiment, the device may further comprise a ground layer electrically connected to the at least one point of the housing adjacent to the first slit or the second slit.

According to one embodiment, there is provided a method of manufacturing a semiconductor device, comprising: a ground layer electrically connected to a plurality of points of a housing adjacent to a first slit or a second slit; and one or more switches disposed between each of the plurality of points and the ground layer, And the processor may be configured to control the one or more switches such that the housing resonates at a desired frequency.

According to one embodiment, the housing may be powered only through one point of the housing.

According to one embodiment, the area corresponding to the first slit and the second slit of the printed circuit board may be a fill cut area.

An electronic device according to one embodiment is configured to resonate at a first frequency and a second frequency and includes a first slit having a length associated with the first frequency and a second slit extending in a direction different from the first slit from a point of the first slit, A printed circuit board disposed below the housing and having a slit formed in at least a portion of a region corresponding to the first slit and the second slit, and a printed circuit board having a first slit or a second slit, And a power feeder that is powered through one point of the housing adjacent to the housing.

A clamshell mobile device in accordance with one embodiment is configured to surround a lower portion of a folding mobile device and configured to resonate at a first frequency and a second frequency, the first slit having a length associated with the first frequency, A first housing extending from a point on the first slit in a direction different from the first slit and having a second slit having a length associated with a second frequency, a second housing surrounding the top of the folding mobile device, At least a portion of the area corresponding to the first slit and the second slit is made of a non-conductive material, and a feeding part feeding through one point of the first housing adjacent to the first slit or the second slit .

According to one embodiment, the second housing is configured to resonate at a first frequency and a second frequency, and a second slit is formed in the second housing from a third slit having a length associated with the first frequency, A fourth slit extending in the other direction and having a length associated with the second frequency may be formed.

According to one embodiment, a portable electronic device includes a first plate, a second plate facing away from the first plate, a side member surrounding a space between the first plate and the second plate, the equivalent of the second plate (PCB) positioned within the space, a processor located on the PCB, and a wireless communication circuit (100) located within the space and electrically connected to the processor, the housing comprising a first portion of the electrically conductive material, Wherein the second plate has a rectangular shape and the rectangular shape extends in a first direction and has a first side having a first length and a second side extending in a second direction perpendicular to the first direction, A second side extending in parallel with the first side in a first direction and having a third side having a first length and a second side extending parallel to the second side in a second direction, And the second plate has a fourth side having a second length and extending from the first position of the second side or from the vicinity of the first position and between the first side and the third side when viewed from above the second plate A first slit extending in a first direction, a second slit extending in a second direction when viewed from above the second plate, from a first position of the second side or a vicinity of the first position, Wherein the PCB includes a slit facing the first slit of the second plate and the wireless communication circuit is electrically connected to the first conductive portion on the PCB, And the first conductive portion is located between the first side of the second plate and the first slit near the second side of the second plate when viewed from above the second plate, 1 challenge Article may be electrically connected to one point of the second plate facing the part

According to one embodiment, the portable electronic device may further comprise a cable including a conductive line for electrically connecting the wireless communication circuit to the first conductive portion.

According to one embodiment, the cable may traverse the slit of the PCB when viewed from above the second plate.

According to one embodiment, the touch screen display may further include a touch screen display exposed through the first plate.

According to one embodiment, the PCB may further include a flexible conductive member inserted between the first conductive portion of the PCB and one point of the second plate.

According to one embodiment, the first slit and the second slit of the second plate may together form an L-shape.

According to one embodiment, the second slit of the second plate may be formed by a portion of the second side and the side member of the second plate.

As used herein, the term "module " includes units comprised of hardware, software, or firmware and may be used interchangeably with terms such as, for example, logic, logic blocks, components, or circuits. A "module" may be an integrally constructed component or a minimum unit or part thereof that performs one or more functions. "Module" may be implemented either mechanically or electronically, for example, by application-specific integrated circuit (ASIC) chips, field-programmable gate arrays (FPGAs) And may include programmable logic devices. At least some of the devices (e.g., modules or functions thereof) or methods (e.g., operations) according to various embodiments may be stored in a computer readable storage medium (e.g., memory 130) . ≪ / RTI > When the instruction is executed by a processor (e.g., processor 120), the processor may perform a function corresponding to the instruction. The computer-readable recording medium may be a hard disk, a floppy disk, a magnetic medium such as a magnetic tape, an optical recording medium such as a CD-ROM, a DVD, a magnetic-optical medium such as a floppy disk, The instructions may include code that is generated by the compiler or code that may be executed by the interpreter. Modules or program modules according to various embodiments may include at least one or more of the components described above Operations that are performed by modules, program modules, or other components, in accordance with various embodiments, may be performed in a sequential, parallel, iterative, or heuristic manner, or at least in part Some operations may be executed in a different order, omitted, or other operations may be added.

Claims (20)

In an electronic device,
A first slit having a length corresponding to a first frequency and a second slit extending from a point of the first slit in a direction different from the first slit and having a length corresponding to a second frequency are formed, A housing configured to resonate at the first frequency and the second frequency by the slit and the second slit;
A printed circuit board disposed inside the housing, wherein at least a part of the region corresponding to the first slit and the second slit is made of a non-conductive material; And
And a feeding portion that feeds power through a point of the housing adjacent to the first slit or the second slit. The method according to claim 1,
The first slit extends from a corner of the housing in a direction perpendicular to the edge,
And the second slit extends in a direction perpendicular to the first slit. The method according to claim 1,
Wherein the second slit extends from a point of the first slit in a first direction perpendicular to the first slit and in a second direction opposite to the first direction. The method according to claim 1,
Wherein the power feeding section feeds power through a point of the housing adjacent to a region where the first slit overlaps with the second slit. The method according to claim 1,
Wherein the first slit extends from one edge of the housing to an opposite edge. The method according to claim 1,
And a non-conductive member filling the first slit and the second slit. The method according to claim 1,
Further comprising a ground layer electrically connected to the at least one point of the housing adjacent the first slit or the second slit. The method according to claim 1,
A ground layer electrically connected to a plurality of points of the housing adjacent to the first slit or the second slit;
At least one switch disposed between each of the plurality of points and the ground layer; And
Further comprising a processor for controlling said one or more switches,
The processor comprising:
And to control the one or more switches such that the housing resonates at a desired frequency. The method according to claim 1,
Wherein the housing is only powered through a point on the housing. The method according to claim 1,
Wherein a region corresponding to the first slit and the second slit of the printed circuit board is a fill cut region. The method according to claim 1,
The electronic device includes a body portion, a hinge connected to the body portion, and a folder portion coupled to the body portion to be rotatable by the hinge,
And the housing covers the rear surface of the body portion. In an electronic device,
A first slit configured to resonate at a first frequency and a second frequency and having a first slit having a length corresponding to the first frequency and a second slit extending in a direction different from the first slit from a point of the first slit, A housing having a second slit having a corresponding length;
A printed circuit board disposed inside the housing and having a slit formed in at least a part of a region corresponding to the first slit and the second slit; And
And a feeding portion that feeds power through a point of the housing adjacent to the first slit or the second slit. 13. The method of claim 12,
The electronic device includes a body portion, a hinge connected to the body portion, and a folder portion coupled to the body portion to be rotatable by the hinge,
And the housing covers the rear surface of the body portion. In a portable electronic device,
A second plate facing away from the first plate, a side member surrounding a space between the first plate and the second plate, wherein a substantial portion of the second plate is electrically A housing made of a conductive material;
A printed circuit board (PCB) positioned within the space between the first plate and the second plate;
A processor located on the PCB; And
A wireless communication circuit located within the space and electrically connected to the processor,
Wherein the second plate
The rectangular shape having a first side extending in a first direction and having a first length,
A second side extending in a second direction perpendicular to the first direction and having a second length longer than the first length;
A third side extending parallel to the first side in the first direction, the third side having the first length; And
A second side extending parallel to the second side in the second direction and having a fourth side having the second length,
Wherein the second plate
A first slit extending in a first direction between the first side and the third side when viewed from above the second plate, from a first position of the second side or from a vicinity of the first position;
A second slit extending in the second direction when viewed from above the second plate, from the first position of the second side or from the vicinity of the first position, the second slit being connected to the first slit; And
And an electrically non-conductive material filling at least a portion of the first slit or the second slit,
Wherein the PCB includes a slit facing the first slit of the second plate,
The wireless communication circuit being electrically connected to a first conductive portion on the PCB,
Wherein the first conductive portion is located between the first side of the second plate and the first slit near the second side of the second plate when viewed from above the second plate,
Wherein the first conductive portion is electrically connected to a point on the second plate facing the first conductive portion of the PCB. 15. The apparatus of claim 14, further comprising a cable comprising a conductive line for electrically connecting the wireless communication circuit to the first conductive portion. 16. The apparatus of claim 15, wherein the cable traverses a slit of the PCB when viewed from above the second plate. 15. The apparatus of claim 14, further comprising a touch screen display exposed through the first plate. 15. The apparatus of claim 14, further comprising a flexible conductive member interposed between the first conductive portion of the PCB and the one point of the second plate. 15. The apparatus of claim 14, wherein the first slit and the second slit of the second plate together form an L-shape. 15. The apparatus of claim 14, wherein the second slit of the second plate is formed by the second side of the second plate and a portion of the side member.

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