KR20180046669A - Donor substrate assembly for organic material deposition - Google Patents

Abstract

The present invention relates to a donor substrate assembly for organic material deposition, which allows planar deposition of an organic material onto a target substrate in order to manufacture an organic light-emitting device. The donor substrate assembly for the organic material deposition includes: a frame including at least one longitudinal member elongated in a longitudinal direction, and at least one transverse member elongated in a transverse direction; a foil substrate which is seated on the frame in the longitudinal direction and is formed of a thin film-shaped conductive material such that the surface is heated when an electric field is applied, thereby enabling planar deposition of an organic material; a first fixing member making contact with one end portion of the foil substrate such that the one end portion of the foil substrate is fixed to the frame, and fixed onto one end portion of the frame by a fixing device; and a second fixing member making contact with an opposite end portion of the foil substrate such that the opposite end portion of the foil substrate is fixed to the frame, and fixed onto an opposite end portion of the frame by the fixing device.

Description

[0001] The present invention relates to a donor substrate assembly for organic material deposition,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a donor substrate assembly for organic vapor deposition, and more particularly, to an organic vapor deposition donor substrate assembly that enables organic substances to be deposited on a target substrate in a plane for manufacturing an organic light emitting device.

Among the flat panel display devices, the organic light emitting display device has a response speed of 1 ms or less and has a high response speed, low power consumption, and self light emission, so there is no problem with the viewing angle, . In addition, since it can be manufactured at a low temperature and the manufacturing process is simple based on the existing semiconductor process technology, it is attracting attention as a next generation flat panel display device. In addition, since the organic layer used in the organic light emitting display device emits light by itself, it can be used in an OLED lighting device by applying an electric field to the upper and lower ends of the multi-layer organic film after the entire deposition. OLED lighting is a point light source, while LED light is a point light source.

The formation of the organic thin film in the organic light emitting display device and OLED lighting manufacturing process can be broadly classified into a polymer type device using a wet process and a low molecular type device using a deposition process depending on the materials and processes used. For example, in the case of an inkjet printing method among the methods of forming a polymer or a low molecular weight light emitting layer, the materials of the organic layers other than the light emitting layer are limited, and there is a need to form a structure for inkjet printing on the substrate. When a light emitting layer is formed by a vapor deposition process, a separate metal mask is used. In a metal mask, the size of the metal mask must be increased as the size of the flat panel display increases. At this time, There is a problem that it is difficult to manufacture a large-sized device.

On the other hand, a technique of depositing an organic material by using line heating has already been disclosed. In this technique, an organic material is formed on the donor substrate in a plane, and then the donor substrate and the target substrate are positioned to face each other. Then, an electric field is formed on the donor substrate, Can be deposited.

However, as the size of the target substrate is increased, the size of the donor substrate must be widened. Also, when the size of the conventional donor substrate, which is made of glass or quartz, is expanded according to the target substrate, the manufacturing cost is increased due to a large load, The flatness of the substrate is lowered due to the substrate deflection phenomenon, and the substrate is easily damaged or deformed by external impact or fatigue load.

The idea of the present invention is to solve these problems, and it is possible to cope with the enlargement of a target substrate by using a foil substrate in the form of a thin film and an ultra lightweight frame capable of supporting the foil substrate flatly, And improves the accuracy and reliability of the deposition by improving the flatness of the foil substrate and is structurally robust using the length member and the width member and is excellent in strength and durability against external impact or fatigue load To thereby prevent breakage and deformation of the component. However, these problems are illustrative, and thus the scope of the present invention is not limited thereto.

According to an aspect of the present invention, there is provided a donor substrate assembly for organic vapor deposition, comprising: at least one elongated member in a longitudinal direction; and at least one elongated member in a width direction; A foil substrate made of a conductive material in the form of a thin film so as to be deposited on the frame in the longitudinal direction and to be heated on a surface when an electric field is applied to deposit the organic material on the surface; A first fixing member in contact with the one end of the foil substrate to fix one end of the foil substrate to the frame and fixed on one end of the frame using a fixture; And a second fixing member that is in contact with the other end of the foil substrate to fix the other end of the foil substrate to the frame and is fixed on the other end of the frame using a fixture.

Also, according to the present invention, the longitudinal member or the width member of the frame may be a rectangular pipe-shaped pipe member having a hollow portion formed therein.

Also, according to the present invention, the frame may have a square shape as a whole and an inner grid-like frame shape.

Further, according to the present invention, the frame may further include an L-shaped connecting plate for connecting the length member and the width member, and a T-shaped connecting plate and a cross-connecting plate.

According to the present invention, the foil substrate further includes: a first foil substrate disposed in the frame in the longitudinal direction; And a second foil substrate disposed adjacent to the first foil substrate in a direction parallel to the first foil substrate to widen the deposition area of the organic material.

In addition, according to the present invention, the first fixing member may include: a 1-1 fixing member for fixing one end of the first foil substrate; And a second fixing member for fixing one end of the second foil substrate, wherein the second fixing member comprises: a second fixing member for fixing the other end of the first foil substrate; And a second fixing member for fixing the other end of the second foil substrate.

According to another aspect of the present invention, there is provided a donor substrate assembly for organic vapor deposition, comprising: a first electrode member electrically connected to the first fixing member, which is a conductive material, so that an electric field can be applied to the foil substrate; And a second electrode member electrically connected to the second fixing member, which is a conductive material, so that an electric field can be applied to the foil substrate.

According to some embodiments of the present invention as described above, it is possible to cope with the enlargement of a target substrate by using a foil substrate in the form of a thin film and an ultra lightweight frame capable of supporting the foil substrate in a flat shape, And improve the accuracy and reliability of the deposition by improving the flatness of the foil substrate, structurally robust using the length member and the width member, and the strength against external impact or fatigue load Thereby improving durability and preventing breakage and deformation of the component. Of course, the scope of the present invention is not limited by these effects.

1 is a perspective view illustrating an organic vapor deposition donor substrate assembly in accordance with some embodiments of the present invention.
2 is a top view of the organic vapor deposition donor substrate assembly of FIG.
Figure 3 is a side view of the organic vapor deposition donor substrate assembly of Figure 1;
Figure 4 is an enlarged view of the organic vapor deposition donor substrate assembly of Figure 3;

Hereinafter, various embodiments of the present invention will be described in detail with reference to the accompanying drawings.

The embodiments of the present invention are described in order to more fully explain the present invention to those skilled in the art, and the following embodiments may be modified into various other forms, It is not limited to the embodiment. Rather, these embodiments are provided so that this disclosure will be more thorough and complete, and will fully convey the concept of the invention to those skilled in the art. In the drawings, the thickness and size of each layer are exaggerated for convenience and clarity of explanation.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms "a," "an," and "the" include singular forms unless the context clearly dictates otherwise. Also, " comprise "and / or" comprising "when used herein should be interpreted as specifying the presence of stated shapes, numbers, steps, operations, elements, elements, and / And does not preclude the presence or addition of one or more other features, integers, operations, elements, elements, and / or groups.

Hereinafter, embodiments of the present invention will be described with reference to the drawings schematically showing ideal embodiments of the present invention. In the figures, for example, variations in the shape shown may be expected, depending on manufacturing techniques and / or tolerances. Accordingly, the embodiments of the present invention should not be construed as limited to the particular shapes of the regions shown herein, but should include, for example, changes in shape resulting from manufacturing.

Hereinafter, an organic vapor deposition donor substrate assembly according to some embodiments of the present invention will be described in detail with reference to the drawings.

1 is a perspective view illustrating an organic vapor deposition donor substrate assembly 100 in accordance with some embodiments of the present invention. FIG. 3 is a side view of the organic vapor deposition donor substrate assembly 100 of FIG. 1, and FIG. 4 is a side view of the organic vapor deposition donor substrate assembly 100 of FIG. 0.0 > 100 < / RTI >

1 to 4, an organic vapor deposition donor substrate assembly 100 according to some embodiments of the present invention includes a frame 10, a foil substrate 20, a first fixing member (not shown) F1) and a second fixing member F2.

For example, as shown in FIGS. 1 to 4, the frame 10 includes at least one longitudinal member 10-1 and at least one width member 10- 2). ≪ / RTI >

For example, in the frame 10, the hollow member A is formed inside the length member 10-1 or the width member 10-2 of the frame 10 It may be a square pipe type of pipe.

That is, the pipe member is a pipe-shaped pipe having a hollow portion A formed therein, and can be made lightweight, and the surface area of the pipe can be enlarged structurally to greatly improve strength and durability.

In addition, the frame 10 may have a rectangular shape as a whole, and may have a grid-like frame shape inside.

Therefore, the length member 10-1 may correspond to an impact or an external force in the longitudinal direction, and the width member 10-2 may correspond to an impact or an external force in the width direction.

1 to 4, the frame 10 includes an L-shaped connecting plate C1 for connecting the length member 10-1 and the width member 10-2, , A T-shaped connecting plate C2 and a cross-shaped connecting plate C3.

Therefore, a plurality of the length members 10-1 and the width members 10-2 (10-2) are formed by using the L-type connecting plate C1, the T-shaped connecting plate C2, and the cross- ) Can be welded, assembled or glued to each other.

1 to 4, the foil substrate 20 is mounted on the frame 10 in the longitudinal direction, and when the electric field is applied, the foil substrate 20 is heated in a plane to deposit the organic material on the surface A thin film-like conductive material. More specifically, for example, the foil substrate 20 may be made of an invar material having excellent exothermic property when applied with an electric field and having a very small coefficient of thermal expansion.

For example, this invar is called 'in var (change)' in the sense that it is invariant to temperature. It is around one millionth at 100 ℃ or less. At room temperature, even if the temperature changes slightly, the dimensions remain almost unchanged. It is used to make precision machine, parts of optical machine, parts of watch and so on, because it can reduce the error when it is used in the machine where error occurs when the dimension changes according to the temperature change. When chromium is added to invar, the elastic modulus is almost unchanged near room temperature. Therefore, it is called "elinvar" because it is called elasticity and invariable, and it is a material that can be used for watchmaking.

The foil substrate 20 may be manufactured by a method such as rolling or plating with a very thin thickness. However, the present invention is not limited thereto, and a metal thin film of various materials having a very thin thickness can be applied.

Therefore, it is possible to cope with the enlargement of the target substrate by using the foil substrate 20 in the form of a thin film and the frame 10 which is capable of supporting the foil substrate 20 in a flat state, and it is possible to reduce the manufacturing cost by reducing the load as much as possible, And improves the accuracy and reliability of deposition by improving the flatness of the foil substrate 20 and is structurally robust using the length member 10-1 and the width member 10-2 , It is possible to improve the strength and durability against an external impact or fatigue load, thereby preventing breakage and deformation of the component.

1 to 4, the first fixing member F1 is fixed to the frame 10 so as to fix one end of the foil substrate 20 to the frame 10, And may be a kind of rod-like fixing member which is in contact with the one end and fixed to the foil substrate 20 on one end of the frame 10 by using a fixture 1 such as a screw.

1 to 4, the second fixing member F2 is fixed to the frame 10 to fix the other end of the foil substrate 20 to the frame 10, And may be a kind of rod-shaped fixing member which is in contact with the other end and is fixed to the foil substrate 20 on the other end of the frame by using a fastener 1 such as a screw.

Therefore, both end portions of the foil substrate 20 can be firmly fixed to the frame 10 by using the first fixing member F1 and the second fixing member F2.

In addition, since the width of the foil substrate 20 made of rolled material is limited, a plurality of the foil substrates 20 can be installed side by side on the frame 10 as the target substrate is enlarged.

For example, as shown in FIGS. 1 to 4, the foil substrate 20 includes a first foil substrate 20-1 arranged in the longitudinal direction of the frame 10, A second foil substrate 20-2 disposed adjacent to the first foil substrate 20-1 so as to be parallel to the first foil substrate 20-1 so that the second foil substrate 20-2 A third foil substrate 20-3 disposed adjacently in parallel with the third foil substrate 20-3 in a direction parallel to the third foil substrate 20-3 and a fourth foil substrate 20-3 disposed adjacent to the third foil substrate 20-3 in a direction parallel to the third foil substrate 20-3, And a foil substrate 20-4.

Here, the four foil substrates 20 are illustrated as being installed in the frame 10, but the present invention is not limited thereto, and a plurality of the foil substrates 20 may be arranged in parallel with the enlargement of the target substrates such as two, three, .

1 to 4, the first foil substrate 20-1, the second foil substrate 20-2, the third foil substrate 20-3, When the four-foil substrate 20-4 is disposed so as to be in close contact with one frame 10, the first fixing member F1 includes a first fixing member F1, which fixes one end of the first foil substrate 20-1, -1 fixing member F1-1 for fixing one end of the first foil substrate 20-2 and a first fixing member F1-2 for fixing one end of the second foil substrate 20-2, A first to third fixing member F1-3 for fixing one end portion and a fourth to fourth fixing member F1-4 for fixing one end portion of the fourth foil substrate 20-4.

The second fixing member F2 includes a second-1 fixing member F2-1 for fixing the other end of the first foil substrate 20-1 and a second fixing member F2-1 for fixing the second foil substrate 20-2 A second fixing member F2-2 for fixing the other end of the third foil substrate 20-3, a second fixing member F2-3 fixing the other end of the third foil substrate 20-3, 4 fixing member F2-4 for fixing the other end of the four-foil substrate 20-4.

Accordingly, both end portions of the plurality of foil substrates can be firmly fixed to the frame 10 by using the plurality of movable bands.

1, a donor substrate assembly 100 for organic vapor deposition according to some embodiments of the present invention includes a first fixing member 110, which is a conductive material, such that an electric field can be applied to the foil substrate 20, A first electrode member E1 electrically connected to the foil substrate F1 and a second electrode member electrically connected to the second fixing member F2 which is a conductive material so that an electric field can be applied to the foil substrate 20. [ E2).

Therefore, an electric field can be applied to the foil substrate 20 by using the first electrode member E1 and the second electrode member E2, and the foil substrate 20 is heat- Organic materials coated on the substrate 20 can be instantaneously and uniformly deposited on the target substrate in a plane in a chamber such as a vacuum chamber.

Therefore, it is possible to cope with the enlargement of the target substrate by using the foil substrate 20 in the form of a thin film and the frame 10 which is capable of supporting the foil substrate 20 in a flat state, and by reducing the load as much as possible, And improves the accuracy and reliability of deposition by improving the flatness of the foil substrate 20 and is structurally robust using the length member 10-1 and the width member 10-2 , It is possible to improve the strength and durability against an external impact or fatigue load, thereby preventing breakage and deformation of the component.

In particular, the donor substrate assembly 100 for organic vapor deposition according to some embodiments of the present invention may be manufactured by coating an organic material on a first donor substrate by a method such as spray coating or printing, A second donor substrate method in which the organic material is firstly deposited on a surface of a second donor substrate by applying a voltage to the second donor substrate and then an electric field is applied to the second donor substrate, In organic material deposition equipment, it may be applied to the primary donor substrate which is lightened to facilitate movement of the chamber and chamber.

While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the invention. Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims.

1: Fixture
10: frame
10-1: Length member
10-2: width member
A: hollow part
C1: L-type connecting plate
C2: T-type connecting plate
C3: Cross-link plate
20: foil substrate
20-1: First foil substrate
20-2: second foil substrate
20-3: third foil substrate
20-4: fourth foil substrate
F1: first fixing member
F1-1: the 1-1 fixing member
F1-2: the 1-2 fixing member
F1-3: 1-3 th fixing member
F1-4: first to fourth fixing members
F2: second fixing member
F2-1: 2nd-1 fixing member
F2-2: 2nd-2nd fixing member
F2-3: second and third fixing members
F2-4: 2-4 fixing member
E1: the first electrode member
E2: second electrode member
100: Organic vapor deposition donor substrate assembly

Claims (7)

A frame comprising at least one elongated member longitudinally formed and at least one elongated member elongated in the widthwise direction;
A foil substrate which is mounted on the frame in a longitudinal direction and is made of a conductive material in the form of a thin film so that the organic material can be deposited on the surface when the electric field is applied;
A first fixing member in contact with the one end of the foil substrate to fix one end of the foil substrate to the frame and fixed on one end of the frame using a fixture; And
A second fixing member that is in contact with the other end of the foil substrate to fix the other end of the foil substrate to the frame and is fixed on the other end of the frame using a fixture;
Wherein the donor substrate assembly comprises an organic substance vapor donor substrate assembly. The method according to claim 1,
Wherein the length or width of the frame is hollow. ≪ Desc / Clms Page number 20 > The method according to claim 1,
Wherein the frame is generally rectangular in shape and has a grid-like frame shape therein. The method according to claim 1,
The frame includes:
An L-shaped connecting plate for connecting the length member and the width member; a T-shaped connecting plate and a cross-shaped connecting plate;
Further comprising: an organic vapor deposition donor substrate assembly. The method according to claim 1,
Wherein the foil substrate comprises:
A first foil substrate disposed longitudinally in the frame; And
A second foil substrate disposed adjacent to the first foil substrate in a direction parallel to the first foil substrate to widen the deposition area of the organic material;
Wherein the donor substrate assembly comprises a donor substrate. 6. The method of claim 5,
Wherein the first fixing member comprises:
A first fixing member for fixing one end of the first foil substrate; And
A first fixing member for fixing one end of the second foil substrate;
Lt; / RTI >
Wherein the second fixing member comprises:
A second-1 fixing member for fixing the other end of the first foil substrate; And
A second fixing member for fixing the other end of the second foil substrate;
Wherein the donor substrate assembly comprises an organic substance vapor donor substrate assembly. The method according to claim 1,
A first electrode member electrically connected to the first fixing member, which is a conductive material, so that an electric field can be applied to the foil substrate; And
A second electrode member electrically connected to the second fixing member, which is a conductive material, so that an electric field can be applied to the foil substrate;
Further comprising: an organic vapor deposition donor substrate assembly.

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