KR20180045317A - Three-dimensional electrode structure and secondary battery including the same - Google Patents

Abstract

A three-dimensional electrode structure and a secondary battery including the same are disclosed. The disclosed three-dimensional electrode structure includes a plurality of plates including an active material on a collector layer and a plurality of inner supporting layers provided between the plates. The plates may include at least first, second and third plates, and at least one inner supporting layer provided between the first and second plates and at least one inner supporting layer provided between the second and third plates may be disposed at different positions in the longitudinal direction of the second plate. At least one partition wall for supporting the plates may be further provided on the current collector layer. The electrode structure (three-dimensional electrode structure) capable of improving the energy density of the secondary battery is provided.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a three-dimensional electrode structure and a secondary battery including the same,

The disclosed embodiments relate to an electrode structure and a battery including the electrode structure.

A secondary battery is a battery that can be charged and discharged unlike a primary battery that can not be charged, and is widely used in various electronic devices such as a mobile phone, a notebook computer, and a camcorder. Particularly, lithium secondary batteries have higher voltage and higher energy density per unit weight than nickel-cadmium batteries and nickel-hydrogen batteries, and their demand is increasing.

As the kinds of electronic devices to which the secondary batteries are applied are diversified and the related market is growing, there is a need to improve performance in various aspects such as improvement of energy density, rate capability, stability and durability, Demand is also increasing. The energy density is related to the capacity increase of the secondary battery, and the rate characteristic is related to the improvement of the charging speed of the secondary battery.

An electrode structure (electrode structure of a three-dimensional structure) capable of improving energy density of a secondary battery is provided.

Provided is an electrode structure which is advantageous in capacity increase of a secondary battery and improves structural stability.

The present invention provides an electrode structure which is advantageous in improving the performance and extending the service life of the secondary battery.

An electrode structure capable of improving a rate characteristic of a secondary battery is provided.

And a secondary battery including the electrode structure.

The electrode structure and the method for manufacturing the secondary battery are provided.

According to one aspect, a collector layer; A plurality of plates electrically connected to the current collector layer and protruding from the current collector layer and including an active material; And a plurality of inner support layers provided between the plurality of plates, wherein the plurality of plates include at least first, second, and third plates, and at least one And at least one inner support layer provided between the second and third plates is disposed at a different position in the longitudinal direction of the second plate.

The plurality of inner support layers may include a first inner support layer provided between the first and second plates and a second inner support layer provided between the second and third plates, The inner supporting layer may not exist at a position corresponding to the first inner supporting layer.

The plurality of inner support layers may further include a third inner support layer spaced apart from the first inner support layer between the first and second plates, And may be located between the first and third inner support layers. A separate inner support layer may not be present between the first and third inner support layers between the first and second plates.

The plurality of plates may further include a fourth plate, at least one inner support layer provided between the third and fourth plates includes at least one inner support layer provided between the first and second plates, And a fourth inner supporting layer provided between the third and fourth plates and the center of the first inner supporting layer provided between the first and second plates, A straight line connecting the centers of the plurality of plates may be perpendicular to the plurality of plates.

The plurality of plates may further include a fourth plate, and at least one inner supporting layer provided between the third and fourth plates may include at least one inner supporting layer provided between the first and second plates And a third inner supporting layer provided between the first and second plates and a fourth inner portion provided between the third and fourth plates, The straight line connecting the centers of the support layers may be inclined with respect to the plurality of plates.

The straight line connecting the center of the first inner support layer and the center of the fourth inner support layer may be inclined by? With respect to the first plate, wherein? Can satisfy 70??? <90.

The plurality of inner supporting layers may be arranged to form a plurality of rows, wherein at least 50% of the inner supporting layers existing in the nth row among the plurality of rows are divided into inner supporting layers existing in the (n + As shown in FIG.

The plurality of inner supporting layers may be arranged to form a plurality of rows, wherein at least 50% of the inner supporting layers existing in the nth column among the plurality of rows are divided into inner supporting layers existing in the (n + 2) As shown in FIG.

Each of the plurality of plates may have a thickness of about 5 to 100 mu m.

Each of the plurality of plates may have a length of about 3 to 30 mm.

Each of the plurality of plates may have a height of about 50 to 1000 mu m.

The plurality of plates may be arranged at intervals of about 1 to 100 mu m.

Each of the plurality of inner supporting layers may have a thickness of about 5 to 50 mu m.

In the longitudinal direction of the plurality of plates, the plurality of inner supporting layers may be formed at intervals of about 100 to 1000 mu m.

The plurality of plates may include a cathode active material, and the three-dimensional electrode structure may be an anode structure.

Each of the plurality of plates may include an inner current collector layer disposed therein, and the inner current collector layer may be electrically connected to the current collector layer.

The plurality of inner support layers may include an active material having the same composition as the plurality of plates, or an active material having a different composition, or may include an inactive material.

Each of the plurality of inner supporting layers may include an inner collector layer disposed therein, and the inner collector layer may be electrically connected to the collector layer.

And at least one partition wall provided on the current collector layer and disposed perpendicularly to the plurality of plates so as to support the plurality of plates, They may be provided to support them.

And a base layer including an active material between the current collector layer and the plurality of plates.

The base layer may include an active material-metal composite sintered body.

The active material-metal composite sintered body may include at least one metal selected from the group consisting of Al, Cu, Ni, Co, Cr, W, Mo, Ag, Au, Pt and Pd.

The content of the metal in the active material-metal complex sintered body may be about 1 to 30 vol%.

According to another aspect, a collector layer; A plurality of plates electrically connected to the current collector layer and protruding from the current collector layer and including an active material; At least one partition wall provided on the current collector layer and arranged to support the outside of the plurality of plates; And a plurality of inner supporting layers provided between the plurality of plates to support the three-dimensional electrode structure.

The plurality of plates may include at least first, second, and third plates, wherein the plurality of inner support layers include a first inner support layer disposed between the first and second plates, And a second inner supporting layer provided between the first inner supporting layer and the second inner supporting layer. And an inner support layer may not be present at a position corresponding to the first inner support layer in a region between the second and third plates.

The plurality of inner support layers may further include a third inner support layer spaced apart from the first inner support layer between the first and second plates, And may be located between the first and third inner support layers. A separate inner support layer may not be present between the first and third inner support layers between the first and second plates.

Each of the plurality of plates may include an inner current collector layer disposed therein, and the inner current collector layer may be electrically connected to the current collector layer.

The plurality of inner support layers may include an active material having the same composition as the plurality of plates, or an active material having a different composition, or may include an inactive material.

Each of the plurality of inner supporting layers may include an inner collector layer disposed therein, and the inner collector layer may be electrically connected to the collector layer.

According to another aspect, there is provided a plasma display panel comprising: a first electrode structure; A second electrode structure disposed apart from the first electrode structure; And an electrolyte disposed between the first electrode structure and the second electrode structure, wherein the first electrode structure includes the three-dimensional electrode structure described above.

The first electrode structure may be a cathode structure, and the second electrode structure may be a cathode structure.

The first electrode structure may include a plurality of first plates including a first active material and the second electrode structure may include a plurality of second plates including a second active material, One plate and the plurality of second plates may be arranged alternately.

The first electrode structure, the electrolyte, and the second electrode structure may constitute a battery cell, and a plurality of the battery cells may be stacked.

An electrode structure (an electrode structure having a three-dimensional structure) capable of improving the energy density of the secondary battery can be realized. It is possible to realize an electrode structure which is advantageous in increasing the capacity of the secondary battery and can improve the structural stability. It is possible to realize an electrode structure which is advantageous in improving the performance and life of the secondary battery. An electrode structure capable of improving the rate characteristics of the secondary battery can be realized.

A secondary battery having excellent performance can be realized by applying the electrode structure. A secondary battery which can be applied to various electronic devices including a mobile device and a wearable device can be realized.

FIG. 1 is a perspective view showing a three-dimensional electrode structure according to one embodiment.
2 is a perspective view illustrating an electrode structure according to a comparative example and its problem.
FIG. 3 is a SEM (scanning electron microscope) photograph showing a problem of the electrode structure according to the comparative example formed by the structure of FIG.
4 is a graph showing a change in energy density according to an aspect ratio of a plurality of active material plates in a three-dimensional electrode structure.
5 is a graph showing a change in relative energy density (%) according to a length of a unit cell when a module is formed using a plurality of unit cells (battery cells) to which a three-dimensional electrode structure is applied.
6 is a perspective view showing a three-dimensional electrode structure according to another embodiment.
7 is a plan view showing an arrangement of a plurality of active material plates and a plurality of inner supporting layers that can be applied to the three-dimensional electrode structure according to one embodiment.
FIG. 8 is a plan view showing an arrangement of a plurality of active material plates and a plurality of inner supporting layers, which can be applied to a three-dimensional electrode structure according to another embodiment.
9 is a plan view showing an exemplary planar structure of a three-dimensional electrode structure according to another embodiment.
10 is a perspective view showing a three-dimensional electrode structure according to another embodiment.
11 is a perspective view showing a three-dimensional electrode structure according to another embodiment.
12 is a perspective view showing a three-dimensional electrode structure according to another embodiment.
13 is a perspective view showing a three-dimensional electrode structure according to another embodiment.
14 is a perspective view showing a three-dimensional electrode structure according to another embodiment.
15 is a perspective view showing a three-dimensional electrode structure according to another embodiment.
16 is a perspective view showing a three-dimensional electrode structure according to another embodiment.
17 is a view for explaining the constitution and characteristics of the sintered active material and the active material-metal composite sintered body.
18 is a view for explaining the configuration and characteristics of the active material-metal composite sintered body according to another embodiment.
19 is a view for explaining a method for manufacturing a secondary battery including a three-dimensional electrode structure according to an embodiment.
20 is a cross-sectional view illustrating a secondary battery including a three-dimensional electrode structure according to an embodiment.
FIG. 21 is a cross-sectional view illustrating a stacked type secondary battery including a three-dimensional electrode structure according to another embodiment.
22 is a cross-sectional view illustrating a secondary battery including a three-dimensional electrode structure according to another embodiment.
23 is a sectional view showing a secondary battery including a three-dimensional electrode structure according to another embodiment.
24 is a plan view for explaining the influence of stress that may occur in an electrode structure during operation of a secondary battery including a three-dimensional electrode structure according to an embodiment.
25 is a plan view for explaining the influence of stress that may occur in an electrode structure during operation of a secondary battery including a three-dimensional electrode structure according to a comparative example.
FIGS. 26A to 26M are views for explaining a method of manufacturing a three-dimensional electrode structure according to an embodiment.
27A to 27C are views for explaining a method of manufacturing a three-dimensional electrode structure according to another embodiment.
28A to 28C are views for explaining a method of manufacturing a three-dimensional electrode structure according to another embodiment.

Hereinafter, a three-dimensional electrode structure according to embodiments, a secondary battery including the same, and a method of manufacturing the same will be described in detail with reference to the accompanying drawings. The width and thickness of the layers or regions illustrated in the accompanying drawings may be somewhat exaggerated for clarity and ease of description. Like reference numerals designate like elements throughout the specification.

FIG. 1 is a perspective view showing a three-dimensional electrode structure according to one embodiment.

Referring to FIG. 1, a current collecting layer CL10 may be provided. The current collector layer CL10 may be a first electrode current collector, for example, a cathode current collector. The current collector layer CL10 may have a plate shape. In this case, the current collector layer CL10 may be referred to as a current collecting plate.

A plurality of active material plates AP10 which are electrically connected to the current collector layer CL10 and protruded from the current collector layer CL10 may be provided. The plurality of active material plates AP10 may be disposed perpendicularly to one surface of the current collector layer CL10. The plurality of active material plates AP10 may be spaced apart from each other at a predetermined interval, and may be arranged in parallel with each other. The plurality of active material plates AP10 may be, for example, a cathode active material plate. An inner current collecting layer (hereinafter referred to as an internal current collecting layer) Cp10 may be provided in each of the active material plates AP10. In other words, each of the active material plates AP10 may include therein an internal current-carrying layer Cp10. Each of the active material plates AP10 can be divided into two portions AP10a and AP10b by the internal current-collecting layer Cp10. That is, the first plate portion AP10a may be provided on one side of the internal current-collecting layer Cp10 and the second plate portion AP10b may be provided on the other side of the internal current-collecting layer Cp10. The internal current-collecting layer Cp10 may be formed at the same height as the active material plate AP10, but in some cases, it may have a lower height than the active material plate AP10. The height H, length L, and thickness (width) T of the active material plate AP10 may be as shown. Here, the ratio of the height (T) to the height (H) can be referred to as an aspect ratio (AR).

A plurality of inner supporting layers NS10 may be provided between the plurality of active material plates AP10. A plurality of inner support layers NS10 may be arranged to support them between the active material plates AP10. The plurality of inner support layers NS10 may be provided perpendicular (or substantially perpendicular) to the plurality of active material plates AP10. Both ends of the inner support layer NS10 can be contacted with opposite sides of the two adjacent active material plates AP10. The thickness t _N of the inner support layer NS10 may be the width of the inner support layer NS10 in the direction of the length L of the active material plate AP10. The length of the inner supporting layer NS10 may correspond to the distance d between the active material plates AP10 and the height of the inner supporting layer NS10 may correspond to the height H of the active material plate AP10. Arrangement / arrangement of the plurality of inner support layers NS10 will be described later in detail with reference to FIGS. 7 and 8. FIG.

In addition, at least one partition wall (WL10) for supporting a plurality of active material plates (AP10) may be further provided on the current collector layer (CL10). The partition wall WL10 may be disposed perpendicular (or substantially perpendicular) to the plurality of active material plates AP10. The barrier ribs WL10 may be referred to as a supporting plate or a supporting layer. The barrier ribs WL10 may be arranged to support them on the outside of the plurality of active material plates AP10. In this regard, the partition wall WL10 may be referred to as an "external support layer ". The barrier rib WL10 may or may not include an internal current collector layer (hereinafter referred to as a partition wall current collector layer) Cw10. Here, it is shown that the barrier rib WL10 includes a barrier rib-like current-carrying layer Cw10. In this case, the partition wall WL10 can be divided into two portions WL10a and WL10b by the partition wall-inside current collection layer Cw10. In other words, the first barrier rib portion WL10a may be provided on one side of the current-collecting layer Cw10 and the second barrier rib portion WL10b may be provided on the other side of the current-barrier rib layer Cw10. The current-collecting layer Cw10 in the barrier rib may be formed at the same height as the barrier rib WL10, but in some cases it may have a lower height than the barrier rib WL10. Although not shown, the partition wall WL10 may be a first partition wall, and a second partition wall facing the first partition wall may be further provided. A plurality of active material plates AP10 are provided between the first partition wall WL10 and the second partition wall .

Each of the plurality of active material plates AP10 may have a thickness (width) T of about 5 mu m or more. For example, the thickness T may be about 5 to 100 mu m. Each of the plurality of active material plates AP10 may have a height H of about 50 mu m or more. For example, the height H may be about 50 to 1000 mu m. The ratio of the height H to the thickness T of the active material plate AP10, that is, the aspect ratio AR, may be, for example, about 10 or more, or about 12 or more or about 15 or more. Each of the plurality of active material plates AP10 may have a length L of at least about 2 mm or at least about 3 mm. For example, the length L may be about 3 to 30 mm or, in some cases, greater than 30 mm. On the other hand, each of the plurality of inner supporting layers NS10 may have a thickness t _N of about 5 탆 or more. For example, the thickness t _N of the inner supporting layer NS10 may be about 5 to 50 mu m. Each of the plurality of inner supporting layers NS10 may have a length of about 1 mu m or more or about 5 mu m or more. For example, the length of the inner supporting layer NS10 may be about 1 to 100 占 퐉 or about 5 to 100 占 퐉. The length of the inner support layer NS10 may correspond to the interval d of the active material plates AP10. Accordingly, the spacing d of the active material plates AP10 may be about 1 to 100 占 퐉 or about 5 to 100 占 퐉. In the direction of the length L of the plurality of active material plates AP10, the plurality of inner supporting layers NS10 may be formed at an interval of several tens of 탆 or more. For example, in the direction of the length L of the plurality of active material plates AP10, the plurality of inner supporting layers NS10 may be formed at intervals of about 100 to 1000 mu m. According to the present embodiment, since the three-dimensional electrode structure is excellent in structural stability, the height H and the length L of the active material plate AP10 can be easily increased, and the number of the active material plates AP10 can be easily And it is possible to easily control the interval d of the active material plates AP10. In this regard, various effects such as high energy density, high capacity, and excellent stability can be obtained. However, the length L, height H and thickness T of the active material plate AP10 and the thickness t _N , length d and interval of the inner support layer NS10 are exemplary , And may be different depending on the case.

The materials and configurations of the current collector layer CL10, the active material plate AP10, the internal current collector layer Cp10, the internal support layer NS10, the partition wall WL10 and the partition wall current-collecting layer Cw10 will be described in more detail do.

The current collector layer CL10 may include at least one of a conductive material composed of, for example, Cu, Au, Pt, Ag, Zn, Al, Mg, Ti, Fe, Co, Ni, Ge, . The current collector layer CL10 may be a metal layer, but may be a layer made of a conductive material other than a metal.

The active material plate AP10 may include a cathode active material. For example, the active material plate AP10 may comprise a Li-containing oxide. The Li-containing oxide may be an oxide including Li and a transition metal. The Li-containing oxide may be, for example, LiMO ₂ (M = metal), where M may be any one of Co, Ni, Mn, or a combination of two or more. As a specific example, the LiMO ₂ may be LiCoO ₂ . The cathode active material may include a ceramic having an anode composition, and may be a polycrystal or a single crystal. However, the specific material of the cathode active material presented herein is exemplary, and other cathode active materials may be used. The internal current-collecting layer Cp10 may be made of the same or similar material as the collector layer CL10. For example, the internal current-collecting layer Cp10 may include at least one of a conductive material composed of Cu, Au, Pt, Ag, Zn, Al, Mg, Ti, Fe, Co, Ni, Ge, In and Pd.

The plurality of inner support layers NS10 may include an active material having the same composition as the active material of the active material plate AP10, or an active material having a different composition. Alternatively, the plurality of inner supporting layers NS10 may be composed of a non-active material. Similar to the plurality of inner supporting layers NS10, the partition wall WL10 may include an active material having the same composition as the active material of the active material plate AP10, or an active material having a different composition. In other words, the first and second partition walls WL10a and WL10b may include an active material having the same composition as the active material plate AP10 or an active material having a different composition. The material of the current-collecting layer Cw10 in the bank may be the same as or similar to that of the internal current-collecting layer Cp10. In some cases, the barrier rib WL10 may be formed of a non-active material, and in this case, the barrier rib layer Cw10 may not be provided.

The three-dimensional electrode structure of this embodiment may be a "three-dimensional anode structure ". In this case, the current collector layer CL10 may be a positive electrode collector layer, and the active material plate AP10 may be a positive electrode active material plate. When the partition wall WL10 includes an active material, the active material may be a cathode active material.

When a three-dimensional structure of the electrode structure is formed on the current collector layer CL10 with a plurality of (or substantially perpendicular) pluralities of active material plates AP10, a two-dimensional (that is, The capacity and the energy density can be greatly increased as compared with the electrode structure. The three-dimensional electrode structure can secure a high active material volume fraction and a wide reaction area as compared with the planar type electrode structure, and thus can be advantageous for improving the energy density and rate characteristics of the battery (secondary battery).

In addition, when the internal support layer NS10 includes an active material, it can contribute to the cell reaction similarly to the active material plate AP10 while supporting the plurality of active material plates AP10. Similarly, the partition wall WL10 can contribute to the cell reaction while supporting the plurality of active material plates AP10. Therefore, the inner supporting layer NS10 and the partition wall WL10 can also serve to increase the structural stability of the electrode structure while widening the reaction area. When the inner supporting layer NS10 is used, the volume fraction of the active material in the three-dimensional electrode structure is increased compared to the structure in which the inner supporting layer NS10 is not present, which may be more advantageous for increasing the energy density.

2 is a perspective view illustrating an electrode structure according to a comparative example and its problem.

Referring to FIG. 2, the electrode structure according to the comparative example includes a current collector layer CL1 and a plurality of active material plates AP1 provided on one surface of the current collector layer CL1. A partition wall WL1 for supporting a plurality of active material plates AP1 may be provided on the current collector layer CL1. An internal current-collecting layer Cp1 may be provided in the active material plate AP1 and a current-carrying layer Cw1 may be provided in the partition wall WL1.

Unlike the electrode structure according to the embodiment of FIG. 1, the electrode structure according to the comparative example does not include the inner support layer NS10. In this case, it is difficult to increase the height h of the active material plate AP1, and it is difficult to increase the length l. When the height h of the active material plate AP1 is increased or the length l is increased, a problem that the active material plate AP1 is bent or collapsed may occur. In addition, the spacing between the active material plates AP1 may be non-uniform. Therefore, it may be difficult to realize the active material plate AP1 having a high aspect ratio (ratio of height to thickness). Further, it may be difficult to increase the length of the electrode structure. As a result, it is difficult to realize a high energy density in the electrode structure according to the comparative example, and it may be difficult to secure the structural stability.

FIG. 3 is a SEM (scanning electron microscope) photograph showing a problem of the electrode structure according to the comparative example formed by the structure of FIG. (Top view) of the active material plates of the electrode structure according to the comparative example formed under various conditions.

Referring to FIG. 3, there may arise a problem that the active material plates are warped or collapsed, or the intervals between them are not uniform. Such a phenomenon makes it difficult to form an electrolyte and an anode active material on the electrode structure (anode structure), and even when the battery cell is constituted, problems such as deterioration of battery performance and shortened life span due to non- May occur.

However, since the height H and the length L of the active material plate AP10 can be easily increased by forming the three-dimensional electrode structure with the structure of the embodiment as shown in FIG. 1, the active material plate AP10, Can be implemented. In addition, the spacing between the active material plates AP10 can be controlled uniformly (or relatively uniformly). Therefore, high energy density and excellent rate characteristics can be secured, and the uniformity of the reaction and the structural stability can be improved. Further, since the inner supporting layer NS10 plays a role of suppressing a deformation problem caused by volume change (expansion / contraction) of the active material when the battery is driven, the durability and life of the battery can be improved.

4 is a graph showing a change in energy density according to an aspect ratio of a plurality of active material plates in a three-dimensional electrode structure. Here, the energy density is the energy density of the secondary battery to which the three-dimensional electrode structure is applied. The size of the secondary battery was assumed to be 13.5 x 39 x 4.4 mm, and the thickness of the active material plate was assumed to be 15 mu m. The numbers shown in parentheses below the aspect ratio in the X-axis of Fig. 4 indicate the height (mu m) of the active material plate.

Referring to FIG. 4, as the aspect ratio AR of the plurality of active material plates increases, the energy density of the secondary battery increases. In the structure according to the comparative example as shown in FIG. 2, since it is difficult to realize an aspect ratio (AR) of 4 or more, it may be difficult to secure a high energy density. However, by using the electrode structure according to the embodiment described with reference to FIG. 1, it is possible to realize a high aspect ratio (AR) of 10 or more or 12 or more, so that a high energy density of about 650 Wh / L or more or about 700 Wh / .

5 is a graph showing a change in relative energy density (%) according to a length of a unit cell when a module is formed using a plurality of unit cells (battery cells) to which a three-dimensional electrode structure is applied. At this time, the size of the module was 10 x 30 mm 2, and the interval between the plurality of unit cells constituting the module was 0.15 mm. As the length of the unit cell increases, the number of unit cells required to construct the module decreases.

Referring to FIG. 5, as the length of the unit cell increases, the relative energy density increases. For example, when the size of the unit cell is 1 x 3.2 mm 2, the relative energy density is about 100%, and when the size of the unit cell is 5.9 x 3.2 mm 2, the relative energy density is about 112%. That is, as the length of the active material plate increases from 1 mm to 5.9 mm, the relative energy density may increase by about 12%. Therefore, the energy density of the secondary battery can be increased by increasing the length of the unit cell (i.e., the length of the active material plate) by using the inner supporting layer (NS10 of FIG. 1) as in the embodiment. 2, it may be difficult to increase the length of the unit cell, that is, the length of the active material plate to 1 mm or more. However, by using the structure according to the embodiment, the length of the unit cell, that is, the length of the active material plate can be easily increased to about 3 mm or more or about 10 mm or more. As a result, the energy density of the secondary battery can be increased . When the height of the active material plate is increased to increase the aspect ratio and at the same time, the length of the active material plate is increased, both of the two effects can be obtained, so that the energy density of the secondary battery can be further improved.

The structure of FIG. 1 may correspond to a part of the three-dimensional electrode structure applicable to one unit cell (battery cell) region. The overall structure of the three-dimensional electrode structure that can be applied to one unit cell (battery cell) region may be, for example, as shown in Fig.

Referring to FIG. 6, a plurality of partition walls WL10 may be provided on the current collector layer CL10 in a predetermined direction, for example, a Y axis direction. For example, the two partition walls WL10 may be spaced apart from each other. A plurality of active material plates AP10 may be provided between the two partition walls WL10. An internal current-collecting layer Cp10 may be provided in the active material plate AP10 and a current-carrying layer Cw10 may be provided in the partition wall WL10. A plurality of inner supporting layers NS10 may be provided between the plurality of active material plates AP10. The material and characteristics of the current collector layer CL10, the active material plate AP10, the internal current collector layer Cp10, the internal support layer NS10, the partition wall WL10 and the partition wall current collector layer Cw10, The active layer C10, the inner conductive layer Cp10, the inner support layer NS10, the partition wall WL10, and the partition wall inductor layer Cw10. The arrangement structure shown in Fig. 6 is an exemplary one, which can be expanded / repeated in a predetermined direction or modified in various ways. For example, at least three partition walls spaced in the Y-axis direction may be provided, and a plurality of active material plates and a plurality of inner supporting layers may be provided therebetween. Further, the number and arrangement of the plurality of inner supporting layers NS10 shown in Fig. 6 are illustrative and can be variously changed.

7 is a plan view showing an array of a plurality of active material plates AP10 and a plurality of inner supporting layers NS10 applicable to the three-dimensional electrode structure according to one embodiment.

Referring to Fig. 7, the plurality of active material plates AP10 may include, for example, first through sixth active material plates a1 through a6. The plurality of active material plates AP10 may extend in the Y-axis direction and be spaced apart from each other in the X-axis direction. A plurality of inner supporting layers NS10 may be provided between the plurality of active material plates AP10. The inner support layer NS10 may have a separate layer structure with the active material plate AP10. In other words, the inner supporting layer NS10 does not form one body with the active material plate AP10 but may be provided as a separate layer. Accordingly, if necessary, the inner support layer NS10 may include another material than the active material plate AP10 or may have a different layer structure.

At least one inner support layer provided between the first plate a1 and the second plate a2 and at least one inner support layer provided between the second plate a2 and the third plate a3, (n2) may be disposed at different positions in the longitudinal direction of the second plate a2. A plurality of inner supporting layers NS10 are disposed between the first inner supporting layer n1 provided between the first and second plates a1 and a2 and the second inner supporting layer n1 provided between the second and third plates a2 and a3, the inner support layer may not exist at a position corresponding to the first inner support layer n1 in the region between the second and third plates a2 and a3. Similarly, an inner support layer may not be present at a position corresponding to the second inner support layer n2 in the region between the first and second plates a1 and a2.

When the plurality of inner support layers NS10 further include a third inner support layer n3 spaced apart from the first inner support layer n1 between the first and second plates a1 and a2, The second inner support layer n2 may be positioned between the first and third inner support layers n1 and n3. At this time, a separate inner supporting layer may not exist between the first and third inner supporting layers n1 and n3 in the region between the first and second plates a1 and a2.

The arrangement of the at least one inner support layer n1, n3 provided between the first and second plates a1, a2 may be repeated equally or similarly in the region between the third and fourth plates a3, a4 . The arrangement of the at least one inner support layer n2 provided between the second and third plates a2 and a3 is also the same or similar in the region between the fourth and fifth plates a4 and a5 .

The at least one inner support layer n4 and n5 provided between the third and fourth plates a3 and a4 includes at least one inner support layer n1 and n3 provided between the first and second plates a1 and a2, And the plurality of active material plates AP10 in the longitudinal direction. The center of the first inner support layer n1 provided between the first and second plates a1 and a2 and the center of the fourth inner support layer n4 provided between the third and fourth plates a3 and a4 The connected straight line can be perpendicular to the plurality of active material plates AP10.

A plurality of inner supporting layers n1 to n5 provided between the first and second plates a1 and a2, between the second and third plates a2 and a3 and between the third and fourth plates a3 and a4, Can be repeated in the X-axis direction and the Y-axis direction.

8 is a plan view showing an arrangement of a plurality of active material plates AP10 and a plurality of inner supporting layers NS10 applicable to the three-dimensional electrode structure according to another embodiment. In the three-dimensional electrode structure of this embodiment, the plurality of inner supporting layers NS10 may have a modified arrangement in Fig.

Referring to FIG. 8, at least one inner supporting layer n4 ', n5' provided between the third and fourth plates a3 and a4 includes at least one inner supporting layer n4 ', n5' provided between the first and second plates a1 and a2 May be arranged to be shifted to some extent in the longitudinal direction of the active material plate AP10 with respect to one inner supporting layer n1 ', n3'. A fourth inner supporting layer n4 'provided between the center of the first inner supporting layer n1' provided between the first and second plates a1 and a2 and the third and fourth plates a3 and a4 The straight line connecting the centers may be inclined at a predetermined angle? With respect to the active material plate AP10. A straight line connecting the center of the first inner support layer n1 'and the center of the fourth inner support layer n4' may be inclined by? With respect to the active material plate AP10 where? ° can be satisfied. However, the inclination angle &amp;thetas; is not limited to that described above, but may be varied. In some cases, the inclination angle? May be less than 70 degrees.

In this embodiment, the plurality of inner support layers NS10 may not overlap each other in the X axis direction. In this case, the stress that may occur in the electrode structure due to the plurality of inner supporting layers NS10 can be alleviated. Therefore, the structural stability of the electrode structure and the operating characteristics of the battery can be improved. However, in some cases, a part of the plurality of inner supporting layers NS10 may overlap each other in the X-axis direction. If the ratio of the overlapping inner support layer NS10 is not high, in other words, if the ratio of the non-overlapping inner support layer NS10 is relatively high, the stress relaxation effect due to such shift placement can be obtained. In this regard, the ratio of the internal support layer NS10 that does not overlap in the X-axis direction may be about 50% or more or about 70% or more.

The plurality of inner support layers NS10 may be arranged to form a plurality of rows. The plurality of rows may be disposed between the plurality of active material plates AP10. about 50% or more or about 70% or more of the inner supporting layers existing in the n-th row may not overlap with the inner supporting layers existing in the (n + 1) -th row in the X-axis direction. In addition, about 50% or more or about 70% or more of the inner supporting layers existing in the (n + 1) -th row may not overlap with the inner supporting layers existing in the (n + 2) -th row in the X-axis direction. Also, at least about 50% or about 70% of the inner supporting layers existing in the n-th row may not overlap with the inner supporting layers existing in the (n + 2) -th row in the X-axis direction. However, in the embodiment of FIG. 7, the inner supporting layers existing in the nth column may substantially overlap with the inner supporting layers existing in the (n + 2) th column.

9 is a plan view showing an exemplary planar structure of a three-dimensional electrode structure according to another embodiment. Part of the structure of Fig. 9 may correspond to the embodiment of Fig.

Referring to FIG. 9, two partition walls WL10 may be disposed apart from each other, and a plurality of active material plates AP10 may be provided therebetween. The plurality of active material plates AP10 may be disposed perpendicular to the partition wall WL10. A plurality of inner supporting layers NS10 may be provided between the plurality of active material plates AP10. The plurality of inner support layers NS10 may be arranged perpendicular to the plurality of active material plates AP10. The arrangement of the plurality of inner supporting layers NS10 may be the same as or similar to that described in Fig. Therefore, the plurality of inner supporting layers NS10 may not overlap each other in the X axis direction.

Although not shown, a structure in which a plurality of internal support layers NS10 are arranged in a randomly or irregular manner is possible without being regularly arranged. Even in this case, a part thereof may have the arrangement described with reference to Fig. 7 or Fig.

According to another embodiment, in the structure of FIG. 1, the internal current-carrying layer Cp10 may not be used in the active material plate AP10, and the current-carrying layer Cw10 in the partition wall may not be used. An example thereof is shown in Fig.

Referring to FIG. 10, the active material plate AP10 'may not include the internal current collecting layer, and the partition wall WL10' may not include the internal current collecting layer (that is, the current collecting layer in the partition wall). The active material plate AP10 'may include a cathode active material. The material of the active material plate AP10 'may be the same as or similar to the first and second plate portions AP10a and AP10b of FIG. The barrier rib WL10 'may also include a cathode active material. In this case, the active material of the partition wall WL10 'may have the same composition as the active material of the active material plate AP10' or may have a different composition.

According to another embodiment, in the structures of Figs. 1 and 6 to 10, the inner supporting layer NS10 may be composed of an inactive material. Examples thereof are shown in Figs. 11 and 12. Fig.

FIG. 11 shows a case where the non-active material inner supporting layer NS15 is applied to the structure of FIG. 10, and FIG. 12 shows the case where the non-active inner supporting layer NS15 is applied to the structure of FIG. 11, except for the inner support layer NS15, may be the same as in FIG. 10, and the remaining structure except for the inner support layer NS15 in FIG. 12 may be the same as FIG. When an inner supporting layer NS15 made of an inactive material is used, the kinds of materials applicable to the inner supporting layer NS15 can be varied. Therefore, an appropriate material can be applied to the inner support layer (NS15) in consideration of structural strength enhancement and ease of manufacture. As a specific example, the non-active material that can be applied to the inner support layer NS15 may be Al oxide, Zr oxide, Si oxide, Li-Si oxide, or the like. In some cases, the partition wall WL10 'in the structures of Figs. 10 and 11 may be formed of an inactive material.

According to another embodiment, an inner current collecting layer may be provided in the inner supporting layer NS10 in the structures of FIGS. 1 and 6 to 10. FIG. An example thereof is shown in Fig.

Referring to FIG. 13, an inner current collector layer (hereinafter referred to as a current-carrying layer in the support layer) Cn11 may be provided in the internal support layer NS11. The current-collecting layer Cn11 in the supporting layer can be electrically contacted to the current-collector layer CL10. The material of the current-collecting layer Cn11 in the supporting layer may be the same as or similar to the internal current-collecting layer Cp10 or the partitioning-wall current-collecting layer Cw10 described in Fig. For example, the current-carrying layer Cn11 in the support layer may include at least one of a conductive material composed of Cu, Au, Pt, Ag, Zn, Al, Mg, Ti, Fe, Co, Ni, Ge, . Each inner supporting layer NS11 can be divided into the first and second supporting layer portions by the current-collecting layer Cn11 in the supporting layer. The first and second support layer portions may include a cathode active material. In this case, the active material of the first and second support layer portions may have the same composition as the active material of the active material plate AP10 or may have a different composition. When the current-collecting layer Cn11 in the supporting layer is used, current can be easily supplied to the entire internal supporting layer NS11 through the current-carrying layer Cn11 in the supporting layer. In addition, the charge (electrons) generated in the inner supporting layer NS11 can easily move to the collector layer CL10 through the in-support layer Cn11. In this regard, the performance of the secondary battery employing the three-dimensional electrode structure can be further improved.

According to another embodiment, a base layer (active material base layer) including an active material is additionally provided between the collector layer CL10 and the plurality of active material plates AP10 and AP10 'in the structures of FIGS. 1 and 6 to 13 . An example thereof is shown in Fig.

FIG. 14 shows a case where an active material base layer AB10 is provided in the structure of FIG. The active material base layer AB10 may be provided on the collector layer CL10 and the plurality of active material plates AP10 may be provided on the active material base layer AB10. Accordingly, the plurality of active material plates AP10 can be electrically connected to the collector layer CL10 via the active material base layer AB10. When the plurality of active material plates AP10 include the internal current-collecting layer Cp10, the internal current-collecting layer Cp10 may be in electrical contact with the active material base layer AB10. Further, a plurality of inner support layers NS11 and barrier ribs WL10 may also be provided on the active material base layer AB10. When the current-carrying layer Cn11 in the supporting layer and the current-carrying layer Cw10 in the partition are used, they may be in electrical contact with the active material base layer AB10. The active material (cathode active material) of the active material base layer AB10 may have the same composition as the active material of the active material plate AP10 or may have a different composition.

The active material base layer AB10 can improve the structural stability of the three-dimensional electrode structure. When the active material base layer AB10 is used, since there is no difference in shrinkage rate between the active material base layer AB10 and the active material plate AP10, the structural stability can be easily secured.

According to another embodiment, a sintered composite of an active material and a metal may be applied to the material of the active material base layer AB10 of FIG. An example thereof is shown in Fig.

Referring to FIG. 15, a sintered composite of an active material and a metal may be used as a material of the active material base layer (AB12). Hereinafter, the complex sintered body is referred to as "active material-metal composite sintered body &quot;. The active material may be a cathode active material. For example, the cathode active material may include a Li-containing oxide. The Li-containing oxide may be an oxide including Li and a transition metal. The Li-containing oxide may be, for example, LiMO ₂ (M = metal), where M may be any one of Co, Ni, Mn, or a combination of two or more. As a specific example, the LiMO ₂ may be LiCoO ₂ . The cathode active material may include a ceramic having an anode composition, and may be a polycrystal or a single crystal. However, the specific material of the cathode active material presented herein is exemplary, and other cathode active materials may be used. The metal contained in the active material base layer AB12, that is, the metal included in the active material-metal complex sintered body, may be, for example, Al, Cu, Ni, Co, Cr, W, Mo, Ag, And Pd. &Lt; / RTI &gt; The content of the metal in the active material-metal composite sintered body may be, for example, about 1 to 30 vol%. The active material-metal composite sintered body may include a plurality of active material grains and a plurality of metal grains, and the average size of the plurality of metal grains may be smaller than the average size of the plurality of active material grains. The plurality of metal grains may be provided at grain boundaries of the plurality of active material grains.

When the active material base layer AB12 includes the active material-metal composite sintered body, the active material base layer AB12 may have a high electrical conductivity. Therefore, it is possible to form a large number of active material plates AP10 on the active material base layer AB12 and to further increase the aspect ratio AR of the active material plate AP10 (i.e., the ratio of height to thickness) . In addition, since the active material base layer AB12 has a high electric conductivity, the active material base layer AB12 can have a high current density. As described above, in the case where the active material plate AP10 has a large aspect ratio AR and the current density of the active material base layer AB12 is high, the three-dimensional electrode structure of the present embodiment improves the energy density and the rate characteristic of the secondary battery Lt; / RTI &gt; In addition, since the electrical conductivity of the active material base layer AB12 is high, the thickness of the active material base layer AB12 can be easily secured to a predetermined level or higher, and thus, it can be more advantageous in securing the structural stability.

According to another embodiment, a sintered composite of an active material and a metal may be applied to at least one of the plurality of active material plates AP10 and AP10 ', the plurality of inner support layers NS10 and NS11, and the barrier rib WL10 . An example thereof is shown in Fig.

Referring to FIG. 16, an active material base layer AB12 may be provided on the current collector layer CL10. The active material base layer AB12 may include an active material-metal composite sintered body as described with reference to FIG. A plurality of active material plates AP12 and a plurality of inner supporting layers NS12 for supporting the active material plates AP12 may be provided on the active material base layer AB12. In addition, at least one partition wall WL12 may be further provided on the active material base layer AB12 to support the active material plate AP12 outside the plurality of active material plates AP12.

The active material plate AP12 may include a composite sintered body of an active material and a metal. The composite sintered body may be referred to as "active material-metal composite sintered body &quot;. The active material may be a cathode active material. For example, the cathode active material may include a Li-containing oxide, and the Li-containing oxide may be LiMO ₂ (M = metal). Here, M may be any one of Co, Ni, and Mn, or a combination of two or more thereof. The cathode active material may include ceramics having an anode composition, and may be polycrystalline or single crystal. The specific materials of the cathode active material shown here are illustrative, and other cathode active materials can be used. The metal contained in the active material plate AP12, that is, the metal included in the active material-metal composite sintered body, may be, for example, Al, Cu, Ni, Co, Cr, W, Mo, Ag, Pd. &Lt; / RTI &gt; The content of the metal in the active material-metal composite sintered body of the active material plate AP12 may be, for example, about 1 to 20 vol%. The active material-metal composite sintered body may include a plurality of active material grains and a plurality of metal grains, and the average size of the plurality of metal grains may be smaller than the average size of the plurality of active material grains. The plurality of metal grains may be provided at grain boundaries of the plurality of active material grains.

When the plurality of active material plates AP12 include the active material-metal composite sintered body and the active material base layer AB12 also includes the active material-metal composite sintered body, the metal content of the active material-metal complex sintered body of the active material plate AP12 %) May be less than the metal content (vol%) of the active material-metal complex sintered body of the active material base layer (AB12). Therefore, the volume fraction of the metal in the active material plate AP12 may be smaller than the volume fraction of the metal in the active material base layer AB12. In other words, the volume fraction of the active material in the active material plate AP12 may be larger than the volume fraction of the active material in the active material base layer AB12. Such an active material plate AP12 may be advantageous for improving energy density while having excellent electric conduction characteristics. The electrical conduction characteristics can be improved by the metal contained in the active material plate AP12 and the active material volume fraction of the active material plate AP12 is relatively large, which can be advantageous for improving the energy density. Meanwhile, the electrical conductivity of the active material-metal composite sintered body of the active material base layer AB12 may be higher than the electrical conductivity of the active material-metal composite sintered body of the active material plate AP12. By using the active material base layer AB12, it is possible to secure an excellent electric conduction characteristic for the plurality of active material plates AP12, and the height of the plurality of active material plates AP12 can be easily increased. In this regard, it may be advantageous to improve the energy density and the rate characteristic. Further, since the thickness of the active material base layer AB12 can be increased, it can be advantageous in securing structural stability. Although the case where the metal content of the active material plate AP12 is smaller than the metal content of the active material base layer AB12 and the case where the electrical conductivity of the active material base layer AB12 is higher than the electrical conductivity of the active material plate AP12 has been described, This is illustrative and may vary. In some cases, the metal content of the active material plate AP12 may be equal to or similar to the metal content of the active material base layer AB12, and the electrical conductivity of the active material base layer AB12 may be the same as or similar to the electrical conductivity of the active material plate AP12 May be the same or similar.

Meanwhile, the inner support layer NS12 and the partition wall WL12 may be made of the same or similar material as the active material plate AP12. Accordingly, the inner supporting layer NS12 and the partition wall WL12 may include an active material-metal composite sintered body. The active material-metal composite sintered body of the inner support layer NS12 and the partition wall WL12 may be the same as or similar to the active material-metal composite sintered body of the above-described active material plate AP12. Therefore, the metal content (vol%) of the active material-metal complex sintered body of the inner support layer NS12 and the partition wall WL12 may be smaller than the metal content (vol%) of the active material-metal composite sintered body of the active material base layer AB12. The electrical conductivity of the active material-metal composite sintered body of the active material base layer AB12 may be higher than the electrical conductivity of the active material-metal composite sintered body of the inner support layer NS12 and the partition wall WL12. The inner support layer NS12 and the partition wall WL12 can contribute to a battery reaction (for example, an anodic reaction) similar to the active material plate AP12 while supporting a plurality of active material plates AP12.

For reference, the active material base layer AB12 is basically referred to as an "active material base layer" in that it contains an active material, but this does not mean that the active material base layer AB12 is composed solely of an active material. The active material base layer AB12 may further include another material (ex, metal) including an active material. The same can be applied to the active material plate AP12.

17 is a view for explaining the constitution and characteristics of the sintered active material and the active material-metal composite sintered body. 17 is for the active material sintered body, and the right drawing is for the active material-metal composite sintered body.

17, the active material sintered body may be composed of a plurality of active material grains, and a grain boundary exists therebetween. Each active material grain may be a ceramic sintered body having an anode composition. Since the resistance (R _gb ) is high at the grain boundary, the electric conductivity may be low. The resistance (R _gb ) of the grain boundary can be higher than the resistance (R _g ) of the active material grain, whereby the resistance of the entire active material sintered body can be increased.

However, when the active material-metal composite sintered body is formed as shown in the right drawing of FIG. 17, the resistance (R _gb ) of the grain boundary can be lowered by the metal, and the electric conductivity can be increased. As a result, the electrical conductivity of the active material-metal composite sintered body may be significantly higher than the electrical conductivity of the active material sintered body.

17 shows a case where a plurality of metal grains are formed at or near the grain boundaries of a plurality of active material grains, and a plurality of metal grains maintain a relatively circular (spherical) grain shape, this is an example , The shape and size of the active material grains and the metal grains may be changed. For example, the metal grains may be deformed in the form of particles to substantially fill the grain boundary region between the active grain grains. An example thereof is shown in Fig.

18 is a view for explaining the configuration and characteristics of the active material-metal composite sintered body according to another embodiment.

18, the active material-metal composite sintered body according to the present embodiment may include a plurality of active material grains and a plurality of metal grains, and the metal grains may be provided so as to substantially fill the grain boundary region between the active material grains have. In this case, the resistance (R _gb ) at the grain boundary can be further lowered. Therefore, the electrical conductivity of the active material-metal composite sintered body can be further increased. The microstructure of the active material-metal composite sintered body can be variously changed depending on the type of metal, the kind of active material, sintering conditions and the like.

By applying the three-dimensional electrode structure according to various embodiments described above, a secondary battery having excellent performance can be realized. Hereinafter, a secondary battery to which the three-dimensional electrode structure is applied will be described.

19 is a view for explaining a method for manufacturing a secondary battery including a three-dimensional electrode structure according to an embodiment.

Referring to FIG. 19, a secondary battery can be manufactured by sequentially forming an electrolyte layer, a second active material, and a second current collector layer on the three-dimensional electrode structure ES1 according to one embodiment. The three-dimensional electrode structure ES1 may have various structures corresponding to or modified from the electrode structures described with reference to Figs. 1 and 6 to 18.

20 is a cross-sectional view illustrating a secondary battery including a three-dimensional electrode structure according to an embodiment.

Referring to FIG. 20, a first electrode structure E100 may be provided, and a second electrode structure E200 may be provided which is spaced apart from the first electrode structure E100. An electrolyte layer E150 may be provided between the first electrode structure E100 and the second electrode structure E200.

The first electrode structure E100 may correspond to the three-dimensional electrode structure described with reference to Figs. 1 and 6 to 18. For example, the first electrode structure E100 may include a first current collector layer CL10, a plurality of first active material plates AP10, and a plurality of internal support layers (not shown). A first internal conductive layer Cp10 may be provided in each of the first active material plates AP10. The first current collector layer CL10, the first active material plate AP10 and the first internal current collector layer Cp10 are formed on the current collector layer CL10, the active material plate AP10 and the internal current collector layer Cp10 . The first electrode structure E100 may be an anode structure. In this case, the first current collector layer CL10 and the first active material plate AP10 may be a cathode current collector layer and a cathode active material plate, respectively.

An electrolyte layer E150 covering a plurality of first active material plates AP10 may be provided on the first current collector layer CL10. The electrolyte layer E150 may have a serpentine shape along the shape of the plurality of first active material plates AP10. The electrolyte layer E150 may comprise a solid electrolyte. For example, the electrolyte layer (E150) is _{Li 3 PO 4, Li 3 PO} 4 - x N x, LiBO 2 -x N x, Li 3 PO 4 N x, LiBO 2 N x, Li 4 SiO 4 -Li 3 PO 4 , Li ₄ SiO ₄ -Li ₃ VO _4, and the like. Further, the electrolyte layer E150 may include a polymer (polymer) electrolyte. In addition, the material and shape of the electrolyte layer (E150) can be variously changed.

The second electrode structure E200 may include a second collector layer CL20. The second current collector layer CL20 may be disposed opposite to the first current collector layer CL10. The second electrode structure E200 may include a second active material member AP20 electrically connected to the second current collector layer CL20. The second active material member AP20 may have a structure extending between the plurality of first active material plates AP10 while electrically contacting the second current collector layer CL20. The portion extending between the plurality of first active material plates AP10 in the second active material member AP20 may have a plate shape. Therefore, the portion extending between the plurality of first active material plates AP10 in the second active material member AP20 may be referred to as a "plurality of second active material plates ". In this case, the plurality of first active material plates AP10 and the plurality of second active material plates may be alternately arranged. An electrolyte layer E150 may be provided between the first active material plate AP10 and the second active material member AP20. The second electrode structure E200 may be a negative electrode structure. In this case, the second current collector layer CL20 may be a negative electrode collector layer, and the second active material member AP20 may include a negative electrode active material. The negative electrode active material may include, for example, Li metal, or may include a carbon-based material, a silicon-based material, or an oxide. The negative electrode collector layer may include at least one of a conductive material composed of Cu, Au, Pt, Ag, Zn, Al, Mg, Ti, Fe, Co, Ni, Ge, In and Pd. However, the specific materials of the negative electrode active material layer and the negative electrode collector layer are illustrative and may vary. Although only four first active material plates AP10 are shown in FIG. 20, this is only an example, and the number of the first active material plates AP10 may vary.

The secondary battery structure described with reference to Fig. 20 is one battery cell (or a unit cell), and a stacked secondary battery can be constructed by stacking a plurality of the battery cells. An example thereof is shown in Fig.

FIG. 21 is a cross-sectional view illustrating a stacked type secondary battery including a three-dimensional electrode structure according to another embodiment.

Referring to FIG. 21, a plurality of battery cells (C1, C2, C3) equivalent to the battery cells described with reference to FIG. 20 are stacked to form a stacked secondary battery. Here, the case where the plurality of battery cells C1, C2, and C3 includes the first battery cell C1, the second battery cell C2, and the third battery cell C3 is shown, It can be different. The first battery cell C1 may have the same structure as the structure of FIG. The second battery cell C2 has the same structure as that of FIG. 20, but may have a reversed structure upside down. The third battery cell C3 may have the same structure as that of FIG. Therefore, it can be said that the plurality of battery cells (C1, C2, C3) are stacked so that current collectors of the same polarity come into contact with each other (face each other). In other words, the positive collector layer of the first battery cell C1 is referred to as a first positive electrode collector layer CL10-1, the negative collector layer is referred to as a first negative collector layer CL20-1, When the positive electrode collector layer of the battery cell C2 is referred to as a second positive electrode collector layer CL10-2 and the negative electrode collector layer is referred to as a second negative collector layer CL20-2, CL20-1) and the second negative electrode collector layer (CL20-2) are brought into contact with each other (facing each other). When the positive electrode collector layer of the second battery cell C3 is referred to as a third positive electrode collector layer CL10-3 and the negative electrode collector layer is referred to as a third negative electrode collector layer CL20-3, The collector layer CL10-2 and the third anode collector layer CL10-3 may be arranged so as to face each other. Therefore, the odd-numbered battery cells C1 and C3 and the even-numbered battery cells C2 may have an inverse structure with respect to each other. The anode current collector layers CL10-1, CL10-2 and CL10-3 can be electrically connected to each other and the cathode current collector layers CL20-1, CL20-2 and CL20-3 can be electrically connected to each other. have. Further, the two current collector layers ex, CL20-1 and CL20-2, which are in contact with each other, may be composed of one integrated layer. In this manner, when a stacked secondary battery is constructed by stacking a plurality of battery cells (C1, C2, C3), the battery capacity per unit area can be greatly increased.

21 shows a case where stacking is performed while changing the direction (vertical direction) of a plurality of battery cells. However, according to another embodiment, stacking can be performed without changing the direction (vertical direction) of the plurality of battery cells. In other words, a plurality of battery cells having the same structure and direction as those of the battery cell of Fig. 20 can be stacked in one direction. In this case, an insulating layer may be provided between the adjacent two battery cells so that the collector layers having different polarities are not in contact with each other.

Although the first electrode structure E100 in the structure of FIGS. 20 and 21 is shown and described as having the structure of the three-dimensional electrode structure as described with reference to FIG. 1, 18 as described with reference to FIG. Further, the specific structure of the second electrode structure E200 shown and described in Figs. 20 and 21 is an exemplary one, which can be variously modified. The deformation structure of the second electrode structure E200 will be described by way of example with reference to Figs. 22 and 23. Fig.

The second electrode structure E210 of FIG. 22 may include a second collector layer CL20 and a second active material member AP21 electrically connected to the second collector layer CL20. The second active material member AP21 is in contact with the second current collector layer CL20 and has a plate shape and a plate shape extending from the plate shape to fill a space between the plurality of first active material plates AP10 Lt; / RTI &gt; In the structure of FIG. 20, if the second active material member AP20 partially fills the space between the plurality of first active material plates AP10, the second active material member AP21 may be filled with a plurality of (Or most of) the space between the two active material plates (AP10).

The second electrode structure E220 of FIG. 23 may include a second current collector layer CL20 and a plurality of second active material plates AP22 electrically connected to the second current collector layer CL20. The plurality of second active material plates AP22 may be "negative active material plates ". Each of the second active material plates AP22 may further include a second internal current-collecting layer Cp22 therein. And the second internal current-collecting layer Cp22 may be in electrical contact with the second current-collector layer CL20. The second internal current-collecting layer Cp22 may be formed of a conductor such as a metal. Although not shown, depending on the case, a predetermined second base layer may be further provided between the second current collector layer CL20 and the plurality of second active material plates AP22. The second base layer may include a second active material, for example, an anode active material, and may further include another material.

22 and 23, the remaining structure except for the configuration of the second electrode structures E210 and E220 may be the same as or similar to those described with reference to Fig.

In some cases, the second active material members AP20 and AP21 and the second current collector layer CL20 may be formed as one integral element in FIGS. 20 and 22. FIG. In other words, a part of the second active material members AP20 and AP21 may be used as a current collector, and in this case, a separate second current collector layer CL20 may not be formed.

24 is a plan view for explaining the influence of stress that may occur in an electrode structure during operation of a secondary battery including a three-dimensional electrode structure according to an embodiment.

Referring to FIG. 24, the left drawing shows the initial state of charging, and the right side shows the state of charging end. Referring to the left drawing, a plurality of first active material plates AP13 may be provided, and a plurality of inner support layers NS13 may be provided therebetween. Further, an electrolyte layer E13 and a second active material member AP23 may be provided. An electrolyte layer E13 may be provided between the first active material plate AP13 and the second active material member AP23. A plurality of inner support layers NS13 may be arranged as described with reference to Figs. 7 and 8. Fig. At the end of charging, as shown in the right drawing, the volume of the second active material member AP23 may increase, which may cause stress. In the right drawing, a portion indicated by a dotted circle indicates a stress occurrence region. In the structure according to the embodiment, the stress-generating regions are arranged so as to be spaced apart from each other in the Y-axis direction, and are not continuously arranged in the X-axis direction. Therefore, it is possible to suppress or prevent problems such as non-uniformity of reaction due to stress and reduction in life span.

25 is a plan view for explaining the influence of stress that may occur in an electrode structure during operation of a secondary battery including a three-dimensional electrode structure according to a comparative example.

Referring to FIG. 25, the left drawing shows the initial state of charging, and the right side shows the state of charging end. A plurality of first active material plates AP14, a plurality of inner support layers NS14, an electrolyte layer E14 and a second active material member AP24 are provided. The plurality of inner support layers NS14 are arranged so as to overlap in the X-axis direction, unlike those described with reference to Figs. At the end of charging, as the volume of the second active material member AP24 increases as shown in the right drawing, stress may occur. Since the stress-generating regions indicated by dotted circles are disposed adjacent to each other in the X-axis direction, the stress can not be mitigated and stress-related problems may occur. Problems such as structural defects (cracks and the like), non-uniformity of reaction and reduction in the life span may occur.

FIGS. 26A to 26M are views for explaining a method of manufacturing a three-dimensional electrode structure according to an embodiment.

Referring to FIG. 26A, an active material sheet 100 may be formed from an active material slurry 10 after manufacturing an active material slurry 10. For example, the active material sheet 100 can be formed from the active material slurry 10 by using a tape-casting method.

The active material slurry 10 can be produced by mixing an active material (powder), a binder, a dispersing agent, a plasticizer or the like with a solvent. At this time, a pulverizer such as a ball mill or a mixing apparatus can be used. Here, the active material may be a cathode active material, and the cathode active material may include a Li-containing oxide. The Li-containing oxide may be an oxide including Li and a transition metal. The Li-containing oxide may be, for example, LiMO ₂ (M = metal), where M may be any one of Co, Ni, Mn, or a combination of two or more. As a specific example, the LiMO ₂ may be LiCoO ₂ . However, the specific material of the cathode active material presented here is exemplary and other cathode active materials can be used.

The active material slurry 10 can be processed into a sheet form using a molding apparatus such as a tape-casting apparatus. In this case, the active material slurry 10 can be coated on the moving belt MB1 with a uniform thickness by using a doctor blade or the like, and the active material slurry 10 coated on the conveyance belt MB1 ) (That is, by evaporating the solvent), the active material sheet 100 can be formed.

FIG. 26B shows the active material sheet 100 formed by the method of FIG. 26A. The active material sheet 100 may have a thickness of, for example, about 1 to 100 mu m, but is not limited thereto.

Referring to FIG. 26C, the internal current collector layer 105 may be formed by applying or printing an internal current collector paste or a slurry on one surface of the active material sheet 100. The current collector layer 105 may be deposited by a physical vapor deposition (PVD) method such as sputtering or evaporation. Then, another active material sheet 100 may be laminated on the internal current collector layer 105. It can be said that the two active layer sheets 100 and the inner current collector layer 105 provided therebetween form one unit structure 110.

A sacrificial layer sheet 120, such as that shown in Figure 26D, may be formed from a sacrificial layer slurry using a method similar to that described with reference to Figures 26A and 26B. The sacrificial layer slurry may be prepared by mixing a sacrificial layer material, a binder, a dispersant, a plasticizer, and the like with a solvent. Here, as the sacrificial layer material, for example, a carbon-based material such as graphite may be used. Alternatively, Li-containing oxide, Li-containing carbonate, or Li-containing chloride may be used as the sacrificial layer material. The Li-containing oxide may include, for example, Li ₂ CoSiO ₄ , and the Li-containing carbonate may include, for example, Li ₂ CO ₃ and the Li-containing chloride may be LiCl And the like. However, the sacrificial layer material is not limited to the above, and various other materials may be used.

The sacrificial layer sheet 120 of Fig. 26D may have a thickness of, for example, about 1 to 100 mu m, but is not limited thereto. Further, a carrier film (FL1) may be provided on one side of the sacrificial layer sheet (120). The carrier film FL1 may be attached to one side of the sacrificial layer sheet 120 in the tape-casting process of Fig. 26A.

Referring to FIG. 26E, at least one via hole H1 may be formed in the sacrificial layer sheet 120 using a predetermined method. For example, at least one via hole H1 may be formed in the carrier film FL1 and the sacrificial layer sheet 120 below the carrier film FL1 by using a laser drilling process using the laser LS1, that is, a laser drilling process have. The via hole H1 may have a line shape. For example, the via hole H1 may be a line-shaped hole having a width of about 5 to 100 mu m or about 5 to 50 mu m. The via hole H1 may be formed in regions other than both ends of the sacrificial layer sheet 120 (both ends of the H1 in the longitudinal direction 120).

Then, after filling the inner layer material (130 in FIG. 26F) in the via hole H1, the carrier film FL1 can be removed. The result is shown in Fig. 26f.

Referring to FIG. 26F, the inner layer material 130 may be filled in the via hole H 1 of the sacrificial layer sheet 120. For example, the inner layer material 130 may include an active material having the same composition or composition as the active material of the active material sheet 100 of FIG. 26B. The inner layer material 130 may be a high viscosity paste containing the active material. The viscosity of the paste may be greater than about 5000 cps or greater than about 10000 cps. The paste may comprise, for example, LiMO ₂ (M = metal), where M may be any one of Co, Ni, Mn or a combination of two or more. Since the paste has a high viscosity, the via hole H1 can be easily filled using the paste. Although the sacrificial layer sheet 120 is shown here to include two rows of inner layer materials 130, the number of formed inner layer materials 130 (i.e., corresponding to the number of via holes) .

Referring to FIG. 26G, the unit structure 110 shown in FIG. 26C and the sacrificial layer sheet 120 having the inner layer material 130 shown in FIG. 26F can be alternately repeatedly laminated. The unit structure 110 may include two active layer sheets 100 and an internal current collector layer 105 provided therebetween. A plurality of unit structures 110 may be stacked with the sacrificial layer sheet 120 interposed therebetween. The position and / or number of formation of the inner layer material 130 included in the first sacrificial layer sheet 120-1 in the stacking direction is greater than that of the inner layer material 130 included in the second sacrificial layer sheet 120-2 Position and / or formation number. The position and number of formation of the inner layer material 130 included in the plurality of sacrificial layer sheets 120 can be appropriately controlled.

FIG. 26H shows the laminated structure 1100 formed through the lamination process of FIG. 26G. The laminated structure 1100 can be pressurized to a predetermined pressure at a predetermined temperature. For example, the pressing process can be performed in the vicinity of the glass transition temperature (Tg) of the binder material contained in the active material sheet 100. As a specific example, the pressing process may be performed at a temperature of about 80 to 100 DEG C at a pressure of about 3000 to 10000 psi. The pressurizing process may include, for example, a WIP (warm isostatic pressing) process.

Next, the inner layer material 130 may be exposed by removing a portion of both ends of the laminated structure 1100. [ That is, both ends of the laminated structure 1100 are removed in a direction parallel to the extended direction (line direction) of the inner layer material 130, and the ends of the inner layer material 130 are exposed to the side of the laminated structure 1100 .

Referring to FIG. 26I, the barrier rib layers 210 may be attached to both side surfaces of the laminated structure 1100. The partition wall layer 210 may include a partition sheet 200. The septum sheet 200 may be formed from a partition wall slurry and the method of forming the septum sheet 200 may be similar to the method of forming the active material sheet 100 in Figures 26A and 26B. The partition sheet 200 may be made of the same or similar material as the active material sheet 100. The partition wall layer 210 may have a laminated structure including an internal current collector layer 205 between two partition sheets 200. The structure of the barrier rib layer 210 may be similar to the unit structure 110 described with reference to FIG. 26C. For example, the barrier rib layers 210 may be attached to both sides of the laminated structure 1100 using a WIP (warm isostatic pressing) process or the like. The laminated structure having the partition wall layer 210 on both sides thereof is denoted by reference numeral 1110.

Referring to FIG. 26J, the laminated structure 1110 can be divided into a plurality of first laminated structures 1000 by cutting the laminated structure 1110 to a desired size (thickness) using a predetermined cutting member CT1. Although a single first laminated structure 1000 is shown here, by repeating the cutting process, a plurality of first laminated structures 1000 can be obtained. This can be referred to as a dicing process for the laminated structure 1110. The cutting process may be performed in a direction parallel to the stacking direction. As the cutting member CT1, a blade cutter, a wire saw, or the like can be used.

Referring to FIG. 26K, the current collector layer 300 may be formed on one side of the cut first laminated structure 1000. The current collector layer 300 may include at least one of a conductive material composed of Cu, Au, Pt, Ag, Zn, Al, Mg, Ti, Fe, Co, Ni, Ge, . The current collector layer 300 may be a metal layer, but may be a layer composed of a conductive material other than a metal. The current collector layer 300 may be formed by depositing a conductor such as a metal on one surface of the first stacked structure 1000 or the current collector layer 300 may be formed by a printing method, The entire layer 300 can be formed. In addition, a WIP (warm isostatic pressing) process may be used to form the current collector layer 300.

Referring to FIG. 261, a burn-out or melt-out process for the sacrificial layer sheet 120 (FIG. 26K) can be performed, and the first stack structure 1000 A sintering process can be performed. Reference numeral 1000a denotes a sintered first laminated structure. Reference numerals 110a, 130a, and 210a denote a sintered unit structure, a sintered inner layer material (hereinafter, an inner supporting layer), and a sintered partition wall layer, respectively. The sintered unit structure 110a may include a sintered inner collector layer 105a between two sintered active material sheets 100a and the sintered partition wall layer 210a may include two sintered partition sheets 200a (A current-carrying layer in the partition wall) 205a that is sintered between the inner and outer layers. The sintering process may be referred to as a so-called co-firing process.

First, the first stacked structure 1000 is heated to a suitable first temperature (for example, about 500 ° C or lower) and held for an appropriate period of time to remove the binder material therein, For example, about 500 to 800 DEG C) and held for an appropriate time to burn-out the sacrificial layer sheet (120 in FIG. 26K). Next, the sintered first laminated structure 1000a can be formed by raising the temperature of the active material contained in the first laminated structure 1000 to a sintering temperature (for example, about 800 to 1200 占 폚) and holding it for a predetermined time.

Depending on the material of the sacrificial layer sheet 120 (Figure 26K), the sacrificial layer sheet 120 may be burned-out or melt-out, It can be different. For example, if the sacrificial layer sheet 120 is formed of a carbon-based material, it can be removed by a burn-out process, and if the sacrificial layer sheet 120 is formed of Li ₂ CO ₃ , LiCl, It can be removed by a melt-out process. In some cases, the temperature may be raised directly to the sintering temperature of the active material without the step of maintaining the intermediate temperature, and burn-out (or melt-out) and sintering may be simultaneously carried out.

Referring to FIG. 26M, a washing process may be performed on the sintered first laminated structure 1000a and the current collector layer 300. FIG. This allows the removal of residual material (i.e., residue) after burn-out or melt-out. The cleaning process can be performed, for example, using water or deionized water. The structure of FIG. 26M may correspond to the three-dimensional electrode structure described with reference to FIGS. 1, 6, and the like.

The manufacturing method described with reference to Figs. 26A to 26M can be variously changed. For example, after the process of burn-out (or melt-out) and sintering is first performed on the cut first laminated structure 1000 obtained in the process of FIG. 26J, May be performed. In addition, the sacrificial layer sheet 120 may be removed using a predetermined etching solution. Further, an active material base layer may be further formed between the first stacked structure 1000 and the current collector layer 300. Here, the active material base layer may correspond to the active material base layers AB10 and AB12 described with reference to FIGS. The active material base layer AB12 including the active material-metal composite sintered body can be formed from an active material-metal composite slurry (or paste), and the active material-metal composite slurry (or paste) A binder, a dispersing agent, a plasticizer, and the like may be mixed with a solvent. In addition, one active layer sheet 100 may be used in place of the unit structure 110 of the laminated structure of FIG. 26C, and one partition sheet 200 may be used in place of the partition wall layer 210 of the laminated structure of FIG. have. In this case, the active material plate AP10 'and the partition wall WL10' described with reference to FIG. 10 may be formed. Also, instead of the active material sheet 100 and the partition sheet 200, an active material-metal composite sheet can be used. In this case, the active material plate AP12 and the partition wall WL12 formed of the active material-metal complex sintered body as described with reference to FIG. 16 may be formed. Further, an internal supporting layer (NS12 in FIG. 16) composed of the active material-metal composite sintered body can be formed using a similar method. Various other method variations may be possible.

Depending on the material of the sacrificial layer sheet 120 of Figure 26k, the sacrificial layer sheet 120 may be burned out or melted-out in the sintering step of Figure 26l, The sacrificial layer sheet 120 can be removed. For example, the sacrificial layer sheet 120 may be removed using a selective etching method. This will be described with reference to Figs. 27A to 27C.

Referring to Fig. 27A, after the sintering process, the sacrificial layer sheet 121a can be left without being removed. The rest of the configuration may be the same as or similar to that of FIG.

Referring to Fig. 27B, the sacrificial layer sheet (121a in Fig. 27A) can be removed using a selective etching process. For example, when the sacrificial layer sheet (121a) comprises a Li- containing oxides such as Li ₂ CoSiO _4, by using an etching solution such as hydrofluoric acid (HF) solution, it is possible to remove the sacrificial layer sheet (121a). At this time, the hydrofluoric acid solution may be a solution in which HF is added to water in a concentration of 0.5 vol% to 20 vol%. However, the material of the sacrificial layer sheet 121a and the type of the etching solution shown here are exemplary and can be variously changed.

Referring to FIG. 27C, a washing process may be performed on the three-dimensional structure from which the sacrificial layer sheet 121a has been removed. The cleaning process can be performed, for example, using water or deionized water.

Hereinafter, with reference to Figs. 28A to 28C, a method of forming an electrode structure including an internal current collector layer (i.e., a current-carrying layer in the support layer) Cn11 in the internal support layer NS11 of Fig. 13 will be briefly described .

Referring to FIG. 28A, an inner layer material 131 may be formed in the via hole H1 of the sacrificial layer sheet 120 using a method similar to that of FIGS. 26D to 26F. Reference numeral FL1 denotes a carrier film. At this time, the inner layer material 131 may be deposited by physical vapor deposition (PVD) or may be formed by other methods.

Referring to FIG. 28B, a second via hole H2 may be formed in the inner layer material 131. FIG. The second via hole H2 may have a width smaller than that of the via hole (hereinafter referred to as the first via hole) H1. The second via hole H2 may have a line shape extending from the center of the first via hole H1 when viewed from above.

Referring to FIG. 28C, the inner collector layer 135 may be formed by filling an inner collector paste in the second via hole H2. The internal current collector layer 135 may include at least one of a conductive material composed of Cu, Au, Pt, Ag, Zn, Al, Mg, Ti, Fe, Co, Ni, Ge, have. The internal current collector layer 135 may be formed by a method other than a filling method using a paste. Thereafter, after removing the carrier film FL1, the sacrificial layer sheet 120 is applied to the lamination step of FIG. 26G to form a laminated structure, and a three-dimensional electrode structure is manufactured through a dicing and sintering process . An inner supporting layer (NS11 in FIG. 13) can be formed from the inner layer material 131 and a conducting layer (Cn11 in FIG. 13) in the supporting layer can be formed from the inner collector layer 135. The method of Figs. 28A to 28C is merely an example, and the method of forming the electrode structure including the current-carrying layer (Cn11 in Fig. 13) in the internal supporting layer (NS11 in Fig. 13) may be variously changed.

The method described with reference to Figs. 26A to 26M, Figs. 27A to 27C, and 28A to 28C, or various methods modified therefrom, A structure can be manufactured. Then, a secondary battery including the three-dimensional electrode structure may be manufactured. For example, as described with reference to Fig. 19, the secondary battery can be manufactured by sequentially forming the electrolyte layer, the second active material and the second current collector layer on the produced three-dimensional electrode structure ES1. The three-dimensional electrode structure ES1 may have various structures corresponding to or modified from the electrode structures described with reference to Figs. 1 and 6 to 18. The manufactured secondary battery may have a structure as described in FIGS. 20 to 23 or various structures modified therefrom.

The secondary battery including the three-dimensional electrode structure according to various embodiments described above can be applied to various electronic devices. The electronic device may include a mobile device and a wearable device. The mobile device may include, for example, a mobile phone (smart phone), and the wearable device may include, for example, a smart watch or a smart band. However, the application field of the secondary battery is not limited to a mobile phone, a smart watch, and the like, and can be variously changed. Further, the present invention can be applied to various electronic devices other than a mobile device or a wearable device. The present invention can be applied to all fields to which an existing secondary battery is applied. Since the three-dimensional electrode structure according to the embodiment of the present invention has high energy density, excellent rate characteristics, stability, and durability, an electronic device having excellent power performance can be realized by applying the three-dimensional electrode structure.

While many have been described in detail above, they should not be construed as limiting the scope of the invention, but rather as examples of specific embodiments. For example, those skilled in the art will appreciate that the configurations of the three-dimensional electrode structure described with reference to FIGS. 1 and 6 to 18 and the secondary battery described with reference to FIGS. 19 to 23 are variously modified It can be seen that The forming direction of the active material plate AP10 with respect to the current collector layer CL10 and the forming direction of the partition wall WL10 or internal supporting layer NS10 with respect to the current collector layer CL10 and the active material plate AP10 vary And the shape of the active material plate AP10, the partition wall WL10, and the inner support layer NS10 may be variously changed. It will be understood that the method of manufacturing a three-dimensional electrode structure and the method of manufacturing a secondary battery according to the present invention described with reference to FIGS. 26A to 26M, 27A to 27C, and 28A to 28C can be variously changed . In addition, it will be appreciated that the application field of the three-dimensional electrode structure according to the embodiments may be variously changed. Therefore, the scope of the invention is not to be determined by the illustrated embodiment but should be determined by the technical idea described in the claims.

Description of the Related Art [0002]
AB10, AB12: active material base layer AP10, AP12: active material plate
AP20, AP21: second active material member CL10: current collector layer
CL20: second current collecting layer Cp10: internal current collecting layer
Cp22: second internal current-collecting layer Cw10:
Cn11: current-carrying layers NS10 to NS12 in the supporting layer, NS15: internal supporting layer
WL10, WL12: partition wall E100: first electrode structure
E150: electrolyte layer E200, E210, E220: second electrode structure

Claims (24)

A collector layer;
A plurality of plates electrically connected to the current collector layer and protruding from the current collector layer and including an active material; And
And a plurality of inner supporting layers provided between the plurality of plates,
Wherein the plurality of plates includes at least first, second and third plates,
At least one inner supporting layer provided between the first and second plates and at least one inner supporting layer provided between the second and third plates may be formed as three-dimensional electrodes disposed at different positions in the longitudinal direction of the second plate, Structure. The method according to claim 1,
Wherein the plurality of inner supporting layers include a first inner supporting layer provided between the first and second plates and a second inner supporting layer provided between the second and third plates,
Wherein an inner supporting layer is not present at a position corresponding to the first inner supporting layer in a region between the second and third plates. 3. The method of claim 2,
Wherein the plurality of inner support layers further comprise a third inner support layer spaced apart from the first inner support layer between the first and second plates,
The second inner support layer is located between the first and third inner support layers in the longitudinal direction of the second plate,
Wherein a separate inner support layer is not present between the first and third inner support layers between the first and second plates. The method according to claim 1,
Wherein the plurality of plates further comprise a fourth plate,
At least one inner support layer provided between the third and fourth plates is disposed at a position corresponding to each other in the longitudinal direction of the plurality of plates and at least one inner support layer provided between the first and second plates,
Wherein a straight line connecting the center of the first inner supporting layer provided between the first and second plates and the center of the fourth inner supporting layer provided between the third and fourth plates has a three- Electrode structure. The method according to claim 1,
Wherein the plurality of plates further comprise a fourth plate,
At least one inner support layer provided between the third and fourth plates is shifted and arranged in the longitudinal direction of the plurality of plates with respect to at least one inner support layer provided between the first and second plates ,
Wherein a straight line connecting the center of the first inner support layer provided between the first and second plates and the center of the fourth inner support layer provided between the third and fourth plates is a three- Electrode structure. 6. The method of claim 5,
Wherein a straight line connecting the center of the first inner supporting layer and the center of the fourth inner supporting layer is inclined by? With respect to the first plate, wherein? Satisfies 70??? <90. The method according to claim 1,
Wherein the plurality of inner support layers are arranged to form a plurality of rows,
Wherein at least 50% of the inner supporting layers existing in the n-th column among the plurality of columns do not overlap in a lateral direction perpendicular to the row with the inner supporting layers existing in the (n + 1) -th column. The method according to claim 1,
Wherein the plurality of inner support layers are arranged to form a plurality of rows,
Wherein at least 50% of the inner supporting layers existing in the n-th column among the plurality of columns do not overlap in the lateral direction perpendicular to the column with the inner supporting layers existing in the (n + 2) -th column. The method according to claim 1,
Wherein each of the plurality of plates has a thickness of 5 to 100 占 퐉. The method according to claim 1,
Wherein each of the plurality of plates has a length of 3 to 30 mm and / or a height of 50 to 1000 탆. The method according to claim 1,
Wherein the plurality of plates are arranged at intervals of 1 to 100 占 퐉. The method according to claim 1,
Wherein each of the plurality of inner supporting layers has a thickness of 5 to 50 占 퐉. The method according to claim 1,
The three-dimensional electrode structure according to claim 1, wherein the plurality of inner supporting layers are formed at intervals of 100 to 1000 占 퐉 in the longitudinal direction of the plurality of plates. The method according to claim 1,
Wherein the plurality of plates include a cathode active material,
Wherein the three-dimensional electrode structure is an anode structure. The method according to claim 1,
Wherein each of the plurality of plates includes an inner current collector layer disposed therein, and the inner current collector layer is electrically connected to the current collector layer. The method according to claim 1,
Wherein the plurality of inner supporting layers include an active material having the same composition as the plurality of plates or an active material having a different composition, or a non-active material. The method according to claim 1,
Wherein each of the plurality of inner supporting layers includes an inner current collector layer disposed therein, and the inner current collector layer is electrically connected to the current collector layer. The method according to claim 1,
Further comprising at least one partition provided on the current collector layer and disposed perpendicularly to the plurality of plates to support the plurality of plates,
And the at least one partition wall is provided to support them at the outside of the plurality of plates. The method according to claim 1,
And a base layer including an active material between the current collector layer and the plurality of plates. 20. The method of claim 19,
Wherein the base layer includes an active material-metal composite sintered body,
Wherein the active material-metal composite sintered body comprises at least one metal selected from the group consisting of Al, Cu, Ni, Co, Cr, W, Mo, Ag, Au, Pt and Pd,
A three-dimensional electrode structure having a metal content of 1 to 30 vol% in the active material-metal composite sintered body. A first electrode structure;
A second electrode structure disposed apart from the first electrode structure; And
And an electrolyte disposed between the first electrode structure and the second electrode structure,
Wherein the first electrode structure comprises the three-dimensional electrode structure according to any one of claims 1 to 20. 22. The method of claim 21,
Wherein the first electrode structure is an anode structure,
And the second electrode structure is a negative electrode structure. 22. The method of claim 21,
Wherein the first electrode structure includes a plurality of first plates including a first active material and the second electrode structure includes a plurality of second plates including a second active material,
The plurality of first plates and the plurality of second plates are alternately arranged. 22. The method of claim 21,
Wherein the first electrode structure, the electrolyte and the second electrode structure constitute a battery cell, and a plurality of the battery cells are stacked.

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