KR20180034077A - Photosensitive resin composition, cured film prepared therefrom, and electronic device incoporating the cured film - Google Patents

Abstract

The present invention relates to a photosensitive resin composition, a cured film prepared by curing the photosensitive resin composition, and an electronic device including the cured film. An objective of an embodiment of the present invention is to provide the photosensitive resin composition having excellent crack resistance, high heat resistance and high transmittance. The photosensitive resin composition of the present invention comprises a polysiloxane copolymer which is formed by hydrolyzing and condensing a compound represented by chemical formula 1, a compound represented by chemical formula 2, (R^1)_aSiR^2_(4-a), and a compound represented by chemical formula 3, R^3_3Si-Y^1-SiR^4_3. In chemical formulas, 1 to 3, X, Y, R^1 to R^4, and Y^1 are as defined in the specification.

Description

TECHNICAL FIELD [0001] The present invention relates to a photosensitive resin composition, a cured film formed therefrom, and an electronic device having the cured film. BACKGROUND OF THE INVENTION 1. Field of the Invention [0001]

The present invention relates to a photosensitive resin composition, a cured film formed therefrom, and an electronic device including the cured film.

In order to realize a more precise and high resolution in a liquid crystal display, an organic EL display, etc., the aperture ratio of a display device must be increased. To this end, a transparent flattening film is provided as a protective film on a TFT substrate to overlap the data line and the pixel electrode, There is a way to enable.

As a material for forming the organic insulating film for a TFT substrate, a material having high heat resistance, high transparency, crack resistance at high temperature, low dielectric constant, and chemical resistance is required. In order to secure the conduction between the TFT substrate electrode and the ITO electrode It is necessary to form hole patterns of about 50 mu m to several mu m.

Conventionally, a light-sensitive resin composition comprising a combination of a phenolic resin and a quinone diazide compound or a combination of an acrylic resin and a quinone diazide compound has been mainly used. However, these materials do not rapidly deteriorate in material properties at a high temperature of 200 DEG C or more, but decomposition starts slowly at 230 DEG C or higher, and the film thickness or the cracking phenomenon occurs, or the transparent film is colored And the transmittance is lowered.

In recent years, in order to improve the transparency and the functionality of the touch panel, a transparent electrode member made of ITO having high transparency and high conductivity has been used for a liquid crystal display or the like. However, . Along with this, the protective film or insulating film of the transparent electrode member is required to have heat resistance to high temperature treatment. However, since the acrylic resin is insufficient in heat resistance and chemical resistance, the cured film is colored due to the high temperature treatment of the substrate, the high-temperature film formation such as a transparent electrode or various kinds of etching solution treatment, There is a problem that the conductivity of the electrode is lowered. Therefore, it can not be used in a process of forming a film at a high temperature by using a device such as PE-CVD on the transparent film material.

Also in the organic EL device, cracks and decomposition products generated from the above materials have no adverse effect on the luminous efficiency and lifetime of the organic EL device, and therefore, they are not suitable for use. In addition, the acrylic material imparted with heat resistance may also crack at 300 DEG C or higher, otherwise the dielectric constant generally increases. As a result, the parasitic capacitance due to the insulating film becomes large due to the high dielectric constant, which causes power consumption to increase and a problem of image quality due to delay of the liquid crystal element driving signal. Even in the case of an insulating material having a high dielectric constant, for example, it is possible to reduce the capacitance by increasing the film thickness, but it is generally not preferable to form a uniform thick film and the amount of material used is also increased.

On the other hand, silsesquioxane is known as a material having high heat resistance and high transparency. In particular, a photosensitive composition comprising a silsesquioxane compound having an acrylic group added to a specific silsesquioxane, an unsaturated compound containing an unsaturated carboxylic acid and an epoxy group, and an acrylic copolymer obtained by copolymerizing an olefinically unsaturated compound and a quinone diazide compound Have been proposed. However, since these compounds also have a high content of organic compounds, they have a problem of heat resistance which is colored and yellow after being cured after being cured at a high temperature of 250 ° C. or higher and have a low permeability. Since the residual film ratio after development is low, a flat film is not formed or NMP the chemical resistance to a solvent such as pyrrolidone, tetramethylammonium hydroxide (TMAH) solution and 10% NaOH is also reduced.

As a system in which a quinone diazide compound is combined with a siloxane polymer in order to impart positive photosensitivity to the siloxane polymer, a material obtained by combining a siloxane polymer having a phenolic hydroxyl group at the terminal thereof with a quinone diazide compound, A material obtained by combining a siloxane polymer having a carboxyl group added thereto and a quinone diazide compound is known. However, since these materials contain a large amount of quinone diazide compound, or phenolic hydroxyl groups are present in the siloxane polymer, coloring of the coating film tends to occur during whitening or thermal curing, and cracking occurs at a high temperature of 300 ° C or higher And can not be used as a material with high transparency due to a decrease in transmittance. Further, since these materials have low transparency, there is also a problem that the sensitivity is low during pattern formation.

When a photosensitive composition made solely of a polysiloxane and a quinone diazide compound is thermally cured, crosslinking and high molecular weight are caused by dehydration condensation of a silanol group in the polysiloxane. In this thermosetting process, before the thermal curing of the pattern sufficiently progresses, it is melted by the low viscosity of the film due to the high temperature, and patterns such as holes and lines obtained after the development flow. As a result, cracks do not occur, but degradation of the pattern, which degrades the resolution, occurs and must be prevented.

In addition, a combination of a polysiloxane insoluble in a developing solution and a polysiloxane-based compound and a quinone diazide compound which are soluble is used to prevent "pattern sagging" in which patterns of holes and lines obtained after development collapse upon heating and curing, Based on the total weight of the composition. However, if a polysiloxane insoluble in a developing solution is used, it will dissolve after development, but re-adherence of residues or unstable water starting to melt may cause development pattern defects. In order to prevent pattern deterioration, it is necessary to sufficiently increase the molecular weight of the siloxane. As a result, the photosensitive material has low sensitivity and high reaction energy is required. Further, there is a drawback that the residual film ratio is not sufficient and the loss of the material is large.

One embodiment provides a photosensitive resin composition having excellent crack resistance, high heat resistance, and high permeability.

Another embodiment provides a cured film obtained by curing the photosensitive resin composition.

Another embodiment provides an electronic device comprising the cured film.

One embodiment provides a photosensitive resin composition comprising a polysiloxane copolymer formed by hydrolysis and condensation of a compound represented by the following formula (1), a compound represented by the following formula (2), and a compound represented by the following formula (3)

 [Chemical Formula 1]

In Formula 1,

X is, independently of each other, a substituted or unsubstituted C1 to C10 alkylene group,

Y is each independently any one of a hydroxyl group, a carboxyl group, a substituted or unsubstituted C1 to C10 alkoxy group, a substituted or unsubstituted C1 to C10 alkoxysilyl group, an epoxy group, and a C1 to C6 ester group,

(2)

(R ¹ ) _a SiR ² _{4 -a}

In Formula 2,

R ¹ is selected from the group consisting of hydrogen, a hydroxyl group, a halogen, a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, a substituted or unsubstituted C6 to C30 aryl group, a substituted or unsubstituted C7 to C30 aryl Substituted or unsubstituted C1 to C30 heteroalkyl groups, substituted or unsubstituted C2 to C30 heterocycloalkyl groups, substituted or unsubstituted C1 to C30 heteroaryl groups, substituted or unsubstituted C2 to C30 alkenyl groups, substituted or unsubstituted C1 to C30 heteroalkyl groups, (C-O) -, wherein R is a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, a substituted or unsubstituted C1 to C30 alkynyl group, A substituted C6 to C30 aryl group, or a substituted or unsubstituted C7 to C30 arylalkyl group), or a combination thereof,

R ² is a C 1 to C 6 alkoxy group, a hydroxy group, a halogen, a carboxyl group,

a is 0? a < 4.

(3)

R ³ ₃ Si-Y ¹ -SiR ⁴ ₃

In Formula 3,

Y ¹ represents a single bond, oxygen, a substituted or unsubstituted C1 to C20 alkylene group, a substituted or unsubstituted C3 to C30 cycloalkylene group, a substituted or unsubstituted C6 to C30 arylene group, a substituted or unsubstituted C2 to C30 A substituted or unsubstituted C2 to C30 alkenylene group, a substituted or unsubstituted C2 to C20 alkynylene group, or a combination thereof,

R ³ and R ⁴ are each independently a C 1 to C 6 alkoxy group, a hydroxy group, a halogen, a carboxyl group, or a combination thereof.

In Formula 1, each X is independently a C1 to C3 alkylene group, and each Y may independently be a hydroxyl group, a C1 to C6 alkoxysilyl group, or an epoxy group.

The compound represented by Formula 1 may include a compound represented by one or more of the following Chemical Formulas 1-1 to 1-3:

[Formula 1-1]

[Formula 1-2]

[Formula 1-3]

In Formulas 1-1 to 1-3, n is an integer of 1 to 5.

In Formula 2, a may be 1.

In Formula 2, R ¹ may be a C ¹ to C 10 alkyl group, a C 6 to C 16 aryl group, or a combination thereof, and R ² may be a C 1 to C 6 alkoxy group, a hydroxy group, or a combination thereof.

In the formula 3, wherein Y ¹ is a C1 to C10 alkyl group, a C3 to C10 cycloalkyl group, a C6 to C12 arylene group, or a combination thereof, wherein R ³ and R ⁴ are, each independently, C1 to C6 alkoxy date .

The polysiloxane copolymer is hydrolyzed and condensed with 20 mol% or less of the compound represented by the formula (1), 70 to 95 mol% of the compound represented by the formula (2) and 20 mol% or less of the compound represented by the formula .

The polysiloxane copolymer is prepared by copolymerizing 1 mol% to 20 mol% of the compound represented by Formula 1, 75 mol% to 95 mol% of the compound represented by Formula 2, 1 mol% to 10 mol% Or a hydrolysis-condensation reaction.

Wherein the polysiloxane copolymer comprises 5 mol% to 15 mol% of the compound represented by Formula 1, 80 mol% to 90 mol% of the compound represented by Formula 2, and 5 mol% to 15 mol% Or a hydrolysis-condensation reaction.

The photosensitive resin composition may further include a diazonaphthoquinone derivative and a solvent.

In another embodiment, there is provided a cured film obtained by curing the photosensitive resin composition according to the above embodiment.

The cured film may have a light transmittance of 95% or more at a wavelength of 400 nm.

The crack-free thickness margin of the cured film may be 4.0 m or more.

According to another embodiment, there is provided an electronic device comprising the cured film.

The photosensitive resin composition according to one embodiment makes it possible to produce a cured film having high heat resistance and high permeability, particularly excellent in crack resistance at high temperature and capable of realizing high resolution.

The cured film can be usefully used for manufacturing a planarizing film for a thin film transistor (TFT) substrate, an interlayer insulating film for a semiconductor device, and the like.

Hereinafter, exemplary embodiments of the present invention will be described in detail so that those skilled in the art can easily carry out the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

Unless otherwise defined herein, "substituted" means that the hydrogen atom in the compound is a halogen atom (F, Br, Cl, or I), a hydroxy group, an alkoxy group, a nitro group, a cyano group, an amino group, A thio group, an ester group, a carboxyl group or a salt thereof, a sulfonic acid group or a salt thereof, a phosphoric acid or a salt thereof, a C1 to C20 alkyl group, a C2 to C20 alkenyl group, a C2 to C20 alkenyl group, a C2 to C20 alkenyl group, A C 1 to C 30 arylalkyl group, a C 7 to C 30 arylalkyl group, a C 1 to C 30 alkoxy group, a C 1 to C 20 heteroalkyl group, a C 3 to C 20 heteroarylalkyl group, a C 3 to C 30 cycloalkyl group, a C 3 to C 15 cycloalkenyl group, C6 to C15 cycloalkynyl groups, C3 to C30 heterocycloalkyl groups, and combinations thereof.

Also, unless otherwise defined herein, 'hetero' means containing at least one heteroatom selected from N, O, S, and P.

Unless otherwise specified herein, 'combination' means mixing or copolymerization.

Hereinafter, the photosensitive resin composition according to one embodiment will be described.

The photosensitive resin composition according to one embodiment includes a polysiloxane copolymer formed by hydrolysis and condensation of a compound represented by the following formula (1), a compound represented by the following formula (2), and a compound represented by the following formula (3)

[Chemical Formula 1]

X is, independently of each other, a substituted or unsubstituted C1 to C10 alkylene group,

Y is independently any one of a hydroxyl group, a carboxyl group, a substituted or unsubstituted C1 to C10 alkoxy group, a substituted or unsubstituted C1 to C10 alkoxysilyl group, an epoxy group, and a C1 to C6 ester group.

(2)

(R ¹ ) _a SiR ² _{4 -a}

In Formula 2,

R ¹ is selected from the group consisting of hydrogen, a hydroxyl group, a halogen, a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, a substituted or unsubstituted C6 to C30 aryl group, a substituted or unsubstituted C7 to C30 aryl Substituted or unsubstituted C1 to C30 heteroalkyl groups, substituted or unsubstituted C2 to C30 heterocycloalkyl groups, substituted or unsubstituted C1 to C30 heteroaryl groups, substituted or unsubstituted C2 to C30 alkenyl groups, substituted or unsubstituted C1 to C30 heteroalkyl groups, (C-O) -, wherein R is a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, a substituted or unsubstituted C1 to C30 alkynyl group, A substituted C6 to C30 aryl group, or a substituted or unsubstituted C7 to C30 arylalkyl group), or a combination thereof,

R ² is a C 1 to C 6 alkoxy group, a hydroxy group, a halogen, a carboxyl group,

a is 0? a < 4.

(3)

R ³ ₃ Si-Y ¹ -SiR ⁴ ₃

In Formula 3,

Y ¹ represents a single bond, oxygen, a substituted or unsubstituted C1 to C20 alkylene group, a substituted or unsubstituted C3 to C30 cycloalkylene group, a substituted or unsubstituted C6 to C30 arylene group, a substituted or unsubstituted C2 to C30 A substituted or unsubstituted C2 to C30 alkenylene group, a substituted or unsubstituted C2 to C20 alkynylene group, or a combination thereof,

R ³ and R ⁴ are each independently a C 1 to C 6 alkoxy group, a hydroxy group, a halogen, a carboxyl group, or a combination thereof.

The polysiloxane obtained by the hydrolysis and condensation reaction of the silane compound represented by the general formula (2) is further subjected to further dehydration and condensation reaction of the terminal silanol group, resulting in further crosslinking and high molecular weight. Further, there is a limit to increase the film thickness due to a high probability of causing cracks on the surface after the heat curing process is performed at a high temperature.

The polysiloxane copolymer according to one embodiment includes the compound represented by Formula 1 and forms a carbosilane-siloxane copolymer obtained by hydrolyzing and condensing the silane compound represented by Formula 2 and Formula 3 together , The conventional problems as described above can be solved. That is, the photosensitive resin composition according to one embodiment is a high heat-resistant resin composition having a low thermal decomposition property upon curing at high temperature, and the crack resistance at high temperature is increased, and a cured film having high transparency and high resolution can be provided.

When the compound represented by Chemical Formula 1 is hydrolyzed and condensed together with the compound represented by Chemical Formula 2 and Chemical Formula 3, the photosensitive resin composition forms cross-linking between the polysiloxane copolymer to be produced, so that the terminal silane of the polysiloxane copolymer It is considered that the content of the polysiloxane copolymer can be reduced and the flexibility of the polysiloxane copolymer can be secured by securing a certain space due to the structure of the compound represented by the formula (1). The carbosilane compound represented by the above formula (3) also provides cross-linking between polysiloxane copolymers, and Y ¹ existing between two silicon atoms contains a single bond or a hydrocarbon group having various carbon atom numbers and structures, It can serve to impart additional flexibility within the polysiloxane copolymer. Accordingly, the photosensitive resin composition comprising the polysiloxane copolymer prepared by hydrolysis and condensation of the compounds represented by Chemical Formulas 1 to 3 has improved hardness at high temperatures and improved heat resistance at high temperatures, It can be manufactured as a cured film that realizes high resolution.

In one embodiment, X in the above formula (1) is independently a C1 to C3 alkylene group, and each Y may independently be a hydroxyl group, a substituted or unsubstituted C1 to C6 alkoxysilyl group or an epoxy group.

In one embodiment, the compound represented by Formula 1 may include at least one compound represented by Formula 1-1 or Formula 1-3:

[Formula 1-1]

[Formula 1-2]

[Formula 1-3]

In Formulas 1-1 to 1-3, n is an integer of 1 to 5.

In Formula 2, a may be 1.

In Formula 2, R ¹ may be a C ¹ to C 10 alkyl group, a C 6 to C 16 aryl group, or a combination thereof, and R ² may be a C 1 to C 6 alkoxy group, a hydroxy group, or a combination thereof.

In one embodiment, Y ¹ in Formula 3 is a C ¹ to C 10 alkylene group, a C 3 to C 10 cycloalkylene group, a C 6 to C 12 arylene group, or a combination thereof, and R ³ and R ⁴ are a C 1 to C 6 alkoxy group have.

The polysiloxane copolymer is obtained by subjecting 20 mol% or less of the compound represented by the formula 1, 70 mol% to 95 mol% of the compound represented by the formula 2, and 20 mol% or less of the compound represented by the formula 3 to hydrolysis and condensation .

For example, the polysiloxane copolymer may contain 1 mol% to 20 mol% of the compound represented by Formula 1, 75 mol% to 95 mol% of the compound represented by Formula 2, and 1 mol% To 10% by mole of the compound of formula (I).

In one embodiment, the polysiloxane copolymer comprises 5 mole% to 15 mole% of the compound represented by Formula 1, 80 to 90 mole% of the compound represented by Formula 2, 5 mole of the compound represented by Formula 3 % To 15 mol% based on the total weight of the composition.

The polysiloxane copolymer prepared by hydrolyzing and condensing the compounds represented by the above formulas (1) to (3) within the above range has a crack-generating thickness margin after curing of not less than 4.0 탆, for example, not less than 4.5 탆, Exhibit excellent properties.

The molecular weight of the polysiloxane copolymer formed by the hydrolysis condensation polymerization is preferably about 1,000 to about 500,000, for example, about 1,000 to 500,000 in terms of a polystyrene standard sample measured by Gel Permeation Chromatography (GPC) For example 1,000 to 50,000, for example 1,000 to 30,000, for example 1,000 to 20,000, for example 1,000 to 15,000, for example 1,000 to 10,000, for example 1,000 For example from 1,000 to 6,000, for example from 1,000 to 5,000, for example from 2,000 to 5,000.

When the weight average molecular weight of the polysiloxane copolymer is 1,000 or more, cracks do not occur on the surface during curing, and a preferable thickness of the cured film can be realized. When the weight average molecular weight is 500,000 or less, the surface planarization property can be improved while maintaining the viscosity required for coating.

The photosensitive resin composition according to one embodiment may further include a diazonaphthoquinone derivative. The photosensitive resin composition containing the diazonaphthoquinone derivative forms a positive type in which the exposed portion is removed by the developer. The diazonaphthoquinone derivative is a compound having a naphthoquinone diazide sulfonic acid ester-bonded to a compound having a phenolic hydroxyl group and is not particularly limited, but may be a compound obtained by esterification with a compound having at least one phenolic hydroxyl group.

As the naphthoquinone diazide sulfonic acid, 4-naphthoquinone diazide sulfonic acid or 5-naphthoquinone diazide sulfonic acid can be used. The 4-naphthoquinone diazide sulfonic acid ester compound is suitable for i-line exposure because it has absorption in the i-line (wavelength 365 nm) region. In addition, the 5-naphthoquinonediazide sulfonic acid ester compound is suitable for exposure at a wide wavelength because absorption is present in a wide wavelength range. Therefore, the 4-naphthoquinone diazide sulfonic acid ester compound and the 5-naphthoquinone diazide sulfonic acid ester compound can be selected depending on the wavelength to be exposed, and for example, 4-naphthoquinone diazide sulfonic acid ester compound and 5 -Naphthoquinone diazide sulfonic acid ester compound may be mixed and used.

Specific examples of the compound having a phenolic hydroxyl group include the following compounds (all available from Honshu Chemical Industry Co., Ltd.).

The amount of the diazonaphthoquinone derivative added is not particularly limited. For example, 0.1 to 15 parts by weight, for example, 1 to 10 parts by weight, based on 100 parts by weight of the polysiloxane copolymer may be used. When the addition amount of the diazonaphthoquinone derivative is less than 0.1 part by weight, the dissolution contrast between the exposed portion and the unexposed portion is too low to have practically no photosensitivity. Further, 1 part by weight or more is preferable in order to obtain better dissolution contrast. When the addition amount of the diazonaphthoquinone derivative is more than 15 parts by weight, the compatibility of the siloxane compound and the diazonaphthoquinone derivative is deteriorated, resulting in whitening of the coating film, or coloring due to decomposition of the quinone diazide compound , The colorless transparency of the cured film deteriorates. Further, in order to obtain a film having a higher transparency, the diazonaphthoquinone derivative is preferably used in an amount of 10 parts by weight or less.

The photosensitive resin composition according to this embodiment includes a solvent.

The usable solvent is not particularly limited, but preferably a compound having an alcoholic hydroxyl group and / or a cyclic compound having a carbonyl group is used. When these solvents are used, the siloxane compound and the quinone diazide compound dissolve uniformly, so that the film is not whitened at the time of coating after application, and high transparency can be achieved.

The compound having an alcoholic hydroxyl group is not particularly limited, but preferably a compound having a boiling point of 110 to 250 DEG C at atmospheric pressure can be used. If the boiling point is higher than 250 ° C, the amount of the residual solvent in the film becomes large, and the film shrinkage ratio upon curing becomes large, and good flatness can not be obtained. If the boiling point is lower than 110 ° C, the film becomes too dry during coating, resulting in roughness of the film surface.

Specific examples of the compound having an alcoholic hydroxyl group include acetol, 3-hydroxy-3-methyl-2-butanone, 4-hydroxy- Propylene glycol monomethyl ether, propylene glycol mono-n-propyl ether, propylene glycol mono n-butyl ether, propylene glycol monomethyl ether, Butyl ether, propylene glycol mono t-butyl ether, 3-methoxy-1-butanol and 3-methyl-3-methoxy-1-butanol. Of these, compounds having a carbonyl group are particularly preferable, and diacetone alcohol is particularly preferably used. These compounds having an alcoholic hydroxyl group may be used alone or in combination of two or more.

The cyclic compound having a carbonyl group is not particularly limited, but preferably a compound having a boiling point of 150 ° C to 250 ° C at atmospheric pressure can be used. If the boiling point is higher than 250 占 폚, the amount of the residual solvent in the film becomes large, so that the film shrinks during curing and the good elasticity can not be obtained. If the boiling point is lower than 150 ° C, the film becomes too dry during the coating, resulting in a rough film surface and poor coatability.

Specific examples of the cyclic compound having a carbonyl group include? -Butylolactone,? -Valerolactone,? -Valerolactone, propylene carbonate, N-methylpyrrolidone, cyclohexanone and cycloheptanone . Of these, especially? -Butyrolactone can be preferably used. These cyclic compounds having a carbonyl group may be used singly or in combination of two or more kinds.

The compound having an alcoholic hydroxyl group and the cyclic compound having a carbonyl group may be used alone or in combination. The weight ratio of the compound having an alcoholic hydroxyl group to the cyclic compound having a carbonyl group is preferably about 99 to 50: 1 to 50, or, for example, 97 to 60: 3 / RTI &gt; When the amount of the compound having an alcoholic hydroxyl group is more than 99% by weight (the cyclic compound having a carbonyl group is less than 1% by weight), the compatibility of the polysiloxane copolymer with the quinone diazide compound becomes poor and the cured film becomes whitened, have. When the amount of the compound having an alcoholic hydroxyl group is less than 50% by weight (more than 50% by weight of the cyclic compound having a carbonyl group), the condensation reaction of unreacted silanol groups in the polysiloxane copolymer tends to occur, resulting in poor storage stability.

The photosensitive resin composition according to this embodiment may further contain other solvents as long as the effect of the present invention is not impaired. Examples of other solvents include ethyl acetate, n-propyl acetate, isopropyl acetate, n-butyl acetate, isobutyl acetate, propylene glycol monomethyl ether acetate, 3-methoxy- Butyl acetate, and the like; ketones such as methyl isobutyl ketone, diisopropyl ketone, diisobutyl ketone and acetyl acetone; ketones such as diethyl ether, diisopropyl ether, di-n-butyl ether, diphenyl ether And the like.

The amount of the solvent to be added is not particularly limited, but is preferably in the range of 100 to 1,000 parts by weight based on 100 parts by weight of the polysiloxane copolymer. Alternatively, the solvent may be contained so that the solids content is 10 to 50% by weight based on the total weight of the photosensitive resin composition. The solid content means a composition component excluding the solvent in the resin composition of the present invention.

The photosensitive resin composition according to the above embodiments may further contain additional components commonly used in the photosensitive resin composition, for example, a silane coupling agent, a surfactant, and the like, if necessary.

The silane coupling agent is added in order to improve the adhesion between the cured film to be formed and the substrate. As the known silane coupling agent, a functional silane compound having a reactive substituent can be used. Examples of the reactive substituent include a carboxyl group, a methacryloyl group, an isocyanate group, and an epoxy group.

Specific examples of the silane-based coupling agent include trimethoxysilylbenzoic acid,? -Methacryloxypropyltrimethoxysilane, vinyltriacetoxysilane, vinyltrimethoxysilane,? -Isocyanatopropyltriethoxysilane,? -Glycidoxypropyltrimethoxysilane,? -Glycidoxypropyltriethoxysilane, and? - (3,4-epoxycyclohexyl) ethyltrimethoxysilane, and preferably at least one selected from the group consisting of Gamma -glycidoxypropyltriethoxysilane and / or gamma -glycidoxypropyltrimethoxysilane having an epoxy group can be used in view of adhesion between the residual film ratio and the substrate, but the present invention is not limited thereto Do not.

The silane coupling agent may be contained in the range of 0.01 to 10 parts by weight, for example, in the range of 0.1 to 5 parts by weight based on 100 parts by weight (based on the solid content) of the polysiloxane copolymer in the photosensitive composition. When the content of the silane coupling agent is 0.01 parts by weight or more, the adhesion to the substrate is improved. When the amount is 10 parts by weight or less, the thermal stability is improved at a high temperature, and the occurrence of unevenness after development can be prevented.

The photosensitive resin composition according to one embodiment may further include a surfactant to improve the application performance. Examples of such surfactants include fluorine surfactants, silicone surfactants, nonionic surfactants, and other surfactants.

Examples of the surfactant include FZ2122 (Dow Corning Toray Corporation), BM-1000, BM-1100 (manufactured by BM CHEMIE), Megafac F142D, Copper F172, Copper F173, Copper F183 S-113, S-131 (manufactured by Sumitomo 3M Limited), Florad FC-135, FC-170C, FC-430 and FC-431 , S-141, S-145, S-382, SC-101, SC-102, SC-103, SC-104, SC-105 and SC-106 (Asahi Garasu Co., SH-193, SZ-6032, SF-8428, DC-57, DC (available from Shin-Aichi Kasei Kogyo Co., Ltd.) -190 (manufactured by Toray Silicone Co., Ltd.); Polyoxyethylene alkyl ethers such as polyoxyethylene lauryl ether, polyoxyethylene stearyl ether and polyoxyethylene oleyl ether, polyoxyethylene aryl ethers such as polyoxyethylene octylphenyl ether and polyoxyethylene nonylphenyl ether , Polyoxyethylene dialkyl esters such as polyoxyethylene dilaurate and polyoxyethylene distearate, and other nonionic surfactants; (Manufactured by Shin-Etsu Chemical Co., Ltd.) or (meth) acrylic acid-based copolymer polyflow No. 57,95 (manufactured by Kyoeisha Chemical Co., Ltd.) And can be used in parallel.

The surfactant may be used in an amount of 0.05 to 10 parts by weight, for example, in an amount of 0.1 to 5 parts by weight based on 100 parts by weight (based on the solids content) of the polysiloxane copolymer. When the content of the surfactant is 0.05 parts by weight or more, the coatability is improved and cracks are not generated on the coated surface, and when the content is 10 parts by weight or less, it is advantageous in terms of cost.

In addition to the above components, the photosensitive resin composition according to one embodiment may further include additional components that are conventionally used in the thermosetting resin composition and / or the photosensitive resin composition, if necessary. For example, the photosensitive resin composition according to the above embodiment may contain additives such as a dissolution accelerator, a dissolution inhibitor, a surface active agent, a stabilizer, and an antifoaming agent, if necessary.

In particular, the dissolution enhancer can improve the sensitivity. As the solubility promoting agent, a compound having a phenolic hydroxyl group or an N-hydroxydicarboximide compound is preferably used. As a specific example, a compound having a phenolic hydroxyl group used in a quinone diazide compound can be mentioned.

Hereinafter, a method of forming a cured film using the photosensitive resin composition according to the above embodiment will be described.

The photosensitive resin composition according to this embodiment is coated on a base substrate by a known method such as spinner, dipping, or slit, and is prebaked by a heating device such as a hot plate or oven. The prebaking is carried out at a temperature in the range of 50 to 150 캜 for 30 seconds to 10 minutes, and the film thickness after prebaking can be set to 0.1 탆 to 5 탆.

After pre-baking, an ultraviolet visible light exposure apparatus such as a stepper, a mirror projection mask aligner (MPA), and a parallel light mask aligner (PLA) was used to measure the exposure amount at a wavelength band of 200 nm to 450 nm at 10 mJ / cm 2 to 500 mJ / As shown in FIG.

After exposure, the exposed portion is dissolved by development to obtain a positive pattern. As the developing method, it is preferable to immerse the developing solution for 5 seconds to 10 minutes by a method such as shower, dipping, paddle, or the like. As the developer, a known alkali developer can be used. Specific examples thereof include inorganic alkalis such as hydroxides, carbonates, phosphates, silicates and borates of alkali metals, amines such as 2-diethylaminoethanol, monoethanolamine and diethanolamine, quaternary ammonium salts such as tetramethylammonium hydroxide and choline Or an aqueous solution containing one or more of these.

After development, it is preferable to rinse with water. If necessary, drying baking may be performed in a range of 50 ° C to 150 ° C by a heating apparatus such as a hot plate or an oven.

Then, it is preferable to perform the bleaching exposure. By carrying out the bleaching exposure, the unreacted quinonediazide compound remaining in the film is photodegraded, so that the optical transparency of the film can be further improved. As a bleaching exposure method, an entire surface is exposed to an exposure dose of about 100 J / m ² to about 20,000 J / m ² (equivalent to a wavelength of 365 nm in terms of exposure dose) using an ultraviolet exposure apparatus such as PLA.

If necessary, the film subjected to the bleaching exposure may be subjected to a soft bake in a range of 50 ° C to 150 ° C by a heating apparatus such as a hot plate or an oven, and then heated at 150 ° C to 450 ° C by a heating apparatus such as a hot plate, For example, post-bake for 10 minutes to 5 hours to prepare a desired cured film.

As described above, the above-mentioned cured film has improved crack resistance according to the thickness after high-temperature curing and has a light transmittance at a wavelength of 400 nm of not less than 90%, for example, not less than 95%, for example, not less than 97% High heat resistance, and high permeability. Therefore, the cured film can be effectively used for a display element, a semiconductor element, or an optical waveguide material.

The photosensitive resin composition comprising a polysiloxane copolymer, a diazonaphthoquinone derivative, and a solvent according to an embodiment is prepared by hydrolytic condensation polymerization in which the compounds represented by Chemical Formulas 1 to 3 are contained in an appropriate amount, High light transmittance and crack margin are exhibited, and the cured film produced therefrom can have high heat resistance, high transparency, and high temperature crack resistance.

Therefore, the cured film can be used as a protective film or an insulating film such as a planarizing film for a thin film transistor (TFT) substrate such as a liquid crystal display element or an organic EL display element, a touch panel sensor element, an interlayer insulating film of a semiconductor element, a planarizing film for a solid- A lens array pattern, or a core or clad material of an optical waveguide such as an optical semiconductor device.

According to another embodiment, there is provided an electronic device comprising the cured film.

The sperm unit may be a liquid crystal display element, an organic EL element, a semiconductor device, a solid-state image pickup element, or the like including the cured film as a flattening film of a TFT substrate, but is not limited thereto.

Hereinafter, embodiments of the present invention will be described in detail with reference to examples. The following examples are for illustrative purposes only and are not intended to limit the scope of the invention.

( Example )

Synthetic example  1 to 5, and Comparative Synthetic Example  One: Polysiloxane  Copolymer production

Synthetic example  One: Polysiloxane  Preparation of Copolymer

In a 500 ml three-necked flask, 5.85 g (0.05 mol) of a compound represented by the following formula 1-4, 79.95 g (0.90 mol) of phenyltrimethoxysilane, and 7.94 g mol) and 203.59 g of PGMEA, and while stirring at room temperature, an aqueous nitric acid solution containing 50 ppm of nitric acid was added to 26.16 g of water over 10 minutes. Thereafter, the flask was immersed in an oil bath at 25 DEG C and stirred for 60 minutes, and then the oil bath was heated to 110 DEG C over 60 minutes. From this, the polysiloxane copolymer was obtained by heating and stirring (internal temperature: 100 to 110 ° C) for 2 hours. A total of 48.79 g of the byproducts, methanol and water, were spilled out of the reactants.

The solids concentration of the obtained polysiloxane copolymer solution was 40% by weight.

The molecular weight (in terms of polystyrene) of the obtained polysiloxane copolymer solution was a weight average molecular weight (Mw) = 3,270

 [Formula 1-4]

Synthetic example  2: Polysiloxane  Preparation of Copolymer

(0.05 mol), 77.90 g (0.90 mol) of phenyltrimethoxysilane and 7.74 g (0.05 mol) of 1,2-bistriethoxysilylethane were added to a 500-ml three-necked flask. mol) and 198.37 g of PGMEA, and while stirring at room temperature, an aqueous nitric acid solution containing 50 ppm of nitric acid was added to 25.46 g of water over 10 minutes. Thereafter, the flask was immersed in an oil bath at 25 DEG C and stirred for 60 minutes, and then the oil bath was heated to 110 DEG C over 60 minutes. From this, the polysiloxane copolymer was obtained by heating and stirring (internal temperature: 100 to 110 ° C) for 2 hours. A total of 47.53 g of the byproduct methanol and water were spilled out of the reaction product.

The solids concentration of the obtained polysiloxane copolymer solution was 40% by weight.

The molecular weight (in terms of polystyrene) of the obtained polysiloxane copolymer solution had a weight average molecular weight (Mw) = 3,750.

[Formula 1-5]

Synthesis Example 3: Preparation of polysiloxane copolymer

(0.05 mol), phenyl trimethoxysilane 78.43 (0.90 mol), and 1,2-bistriethoxysilylethane 7.79 g (0.05 mol) were added to a 500-ml three-necked flask. ) And 204.40 g of PGMEA, and while stirring at room temperature, an aqueous nitric acid solution containing 50 ppm of nitric acid was added to 25.66 g of water over 10 minutes. Thereafter, the flask was immersed in an oil bath at 25 DEG C and stirred for 60 minutes, and then the oil bath was heated to 110 DEG C over 60 minutes. From this, the polysiloxane copolymer was obtained by heating and stirring (internal temperature: 100 to 110 ° C) for 2 hours. A total of 47.86 g of the byproducts, methanol and water, were spilled out of the reaction product.

The solids concentration of the obtained polysiloxane copolymer solution was 40% by weight.

The molecular weight (in terms of polystyrene) of the obtained polysiloxane copolymer solution had a weight average molecular weight (Mw) = 3,950

 [Chemical Formula 1-6]

Synthesis Example 4: Preparation of polysiloxane copolymer

In a 500 ml three-necked flask, 11.44 g (0.10 mol) of the compound represented by the above formula 1-4, 73.82 g (0.85 mol) of phenyltrimethoxysilane, and 7.77 g (0.05 mol) of 1,2-bistriethoxysilylethane ) And 203.70 g of PGMEA, and while stirring at room temperature, an aqueous nitric acid solution containing 50 ppm of nitric acid was added to 25.57 g of water over 10 minutes. Thereafter, the flask was immersed in an oil bath at 25 DEG C and stirred for 60 minutes, and then the oil bath was heated to 110 DEG C over 60 minutes. From this, the polysiloxane copolymer was obtained by heating and stirring (internal temperature: 100 to 110 ° C) for 2 hours. A total of 49.54 g of the byproducts, methanol and water, were spilled out of the reactants.

The solids concentration of the obtained polysiloxane copolymer solution was 40% by weight.

The molecular weight (in terms of polystyrene) of the obtained polysiloxane copolymer solution had a weight average molecular weight (Mw) = 3,565.

Synthesis Example 5: Preparation of polysiloxane copolymer

(0.15 mol), phenyltrimethoxysilane (69.00 g, 0.80 mol) and 1,2-bistriethoxysilylethane (7.71 g, 0.05 mol) were added to a 500-ml three- mol) and 202.31 g of PGMEA, and while stirring at room temperature, an aqueous nitric acid solution containing 50 ppm of nitric acid was added to 25.4 g of water over 10 minutes. Thereafter, the flask was immersed in an oil bath at 25 DEG C and stirred for 60 minutes, and then the oil bath was heated to 110 DEG C over 60 minutes. From this, the polysiloxane copolymer was obtained by heating and stirring (internal temperature: 100 to 110 ° C) for 2 hours. A total of 51.03 g of the byproducts, methanol and water, were spilled out of the reactants.

The solids concentration of the obtained polysiloxane copolymer solution was 40% by weight.

The molecular weight (in terms of polystyrene) of the obtained polysiloxane copolymer solution had a weight average molecular weight (Mw) = 3,730.

Comparative Synthesis Example 1: Production of polysiloxane compound

Into a 500 ml three-necked flask, 83.64 g (0.95 mol) of phenyltrimethoxysilane, 7.87 g (0.05 mol) of 1,2-bistriethoxysilylethane and 206.49 g of PGMEA were added and while stirring at room temperature, 25.92 g Nitric acid aqueous solution in which 50 ppm of nitric acid was dissolved was added over 10 minutes. Thereafter, the flask was immersed in an oil bath at 25 DEG C and stirred for 60 minutes, and then the oil bath was heated to 110 DEG C over 60 minutes. From this, the polysiloxane copolymer was obtained by heating and stirring (internal temperature: 100 to 110 ° C) for 2 hours. A total of 46.49 g of methanol and water as a by-product were spilled out of the reaction product.

The solids concentration of the obtained polysiloxane copolymer solution was 40% by weight.

The molecular weight (in terms of polystyrene) of the obtained polysiloxane copolymer solution had a weight average molecular weight (Mw) = 3,560.

The reactants and their contents for preparing the polysiloxane copolymers prepared according to Synthesis Examples 1 to 5 and Comparative Synthesis Example 1 and the molecular weights of the polysiloxane copolymer solutions are shown in Table 1 below.

Formula 1-4
(mole%) 1-5
(mole%) 1-6
(mole%) (2)
(mole%) (3)
(mole%) Molecular Weight Synthesis Example 1 5 0 0 90 5 3,270 Synthesis Example 2 0 5 0 90 5 3,750 Synthesis Example 3 0 0 5 90 5 3,950 Synthesis Example 4 10 0 0 85 5 3,565 Synthesis Example 5 15 0 0 80 5 3,730 Comparative Synthesis Example 1 0 0 0 95 5 3,560

Example  And evaluation: Photosensitive resin composition and Cured film  Manufacturing and Evaluation

Each of the polysiloxane copolymers prepared in Synthesis Examples 1 to 5 and Comparative Synthesis Example 1 was mixed with a solvent and stirred to prepare a homogeneous solution, and then filtered with a filter of 0.2 탆 to obtain a photosensitive To prepare a resin composition.

Each of the photosensitive resin compositions according to the above-described Examples and Comparative Examples was spin-coated on a 10 x 10 layer using a spin coater (Mikasa Corporation), and a hot plate (SCW-636 manufactured by Dainippon Screen Mfg. Co., Ltd.) Prebaked at 140 DEG C for 120 seconds to adjust the film thickness to 2.7 mu m, respectively. Thereafter, firing and curing were carried out at 380 ° C to measure the transmittance and observe the shape of the film surface. Then, a hardening cycle is performed in the thermal shock chamber to check for cracks.

The above measurements were carried out in the following manner and the results are shown in Table 2 below:

(1) Confirmation of crack occurrence and generation of cracks Thickness margin measurement

A specimen is prepared on a 10 x 10 glass substrate so that the thickness after curing is 2.5 0.1 mu m. After curing, the surface of the specimen was observed with an optical microscope to determine whether cracks were generated or not, and the maximum thickness of the crack-free film was measured.

(2) Measurement of light transmittance

First, the light transmittance of the glass substrate alone was measured using MultiSpec-1500 (trade name, product of SHIMADZU Corporation), and this ultraviolet visible absorption spectrum was set as a reference. Subsequently, a cured film of the composition was formed on the glass substrate (pattern exposure was not carried out), and this sample was measured with a single beam to determine the light transmittance at a wavelength of 400 nm per 1 mu m, .

The production of the photosensitive resin composition according to each of the examples and the comparative examples, the cured film produced therefrom, and characteristics of the cured film will be described below.

Example  One: Cured film  Manufacturing and Evaluation

The polysiloxane copolymer obtained in Synthesis Example 1 was mixed with a solvent containing PGMEA and GBL under yellow light to prepare a homogeneous solution, which was then filtered through a 0.20 탆 filter to prepare Resin Composition 1.

The composition 1 was spin-coated on a 10 × 10 10 layer using a spin coater (Mikasa Corporation), and then applied using a hot plate (SCW-636, manufactured by Dainippon Screen Mfg. Co., Ltd.) Lt; 0 &gt; C for 120 seconds to adjust the film thickness to 2.7 mu m. Thereafter, plastic curing at 380 占 폚 was carried out. As a result, it was possible to obtain a cured film having a good light-transmitting property with a light transmittance of 97% and a good shape at a rounded corner, and a crack-generated thickness margin of 4.7 占 퐉 and improved crack resistance at high temperatures .

Example  2: Cured film  Manufacturing and Evaluation

A resin composition was prepared in the same manner as in Example 1, except that 100 parts by weight of the polysiloxane copolymer obtained in Synthesis Example 2 was used, and a cured film was prepared by the same method.

As a result of curing, it was possible to obtain a cured film having a light transmittance of 97%, a crack-generated thickness margin of 4.8 mu m, improved crack resistance at high temperature, and improved light transmittance.

Example  3: Cured film  Manufacturing and Evaluation

A resin composition was prepared in the same manner as in Example 1 except that 100 parts by weight of the polysiloxane copolymer obtained in Synthesis Example 3 was used and a cured film was prepared in the same manner.

As a result of the curing, it was possible to obtain a cured film having a permeability of 98%, a crack-generated thickness margin of 4.7 mu m, improved crack resistance at high temperature, and improved light transmittance.

Example  4: Cured film  Manufacturing and Evaluation

A resin composition was prepared in the same manner as in Example 1, except that 100 parts by weight of the polysiloxane copolymer obtained in Synthesis Example 4 was used, and a cured film was prepared by the same method.

As a result of the curing, it was possible to obtain a cured film having a permeability of 98% and a crack-generated thickness margin of 5.0 占 퐉, which was improved in crack resistance at high temperatures and in light transmittance.

Example  5: Cured film  Manufacturing and Evaluation

A resin composition was prepared in the same manner as in Example 1, except that 100 parts by weight of the polysiloxane copolymer obtained in Synthesis Example 5 was used, and a cured film was prepared by the same method.

As a result of the curing, it was possible to obtain a cured film having a permeability of 98% and a crack-generated thickness margin of 5.2 mu m, improved crack resistance at high temperature and improved light transmittance.

Comparative Example  One: Cured film  Manufacturing and Evaluation

A resin composition was prepared in the same manner as in Example 1, except that 100 parts by weight of the polysiloxane copolymer compound obtained in Comparative Synthesis Example 1 was used, and a cured film was prepared in the same manner.

As a result of the curing, no cracking was observed at a thickness of 2.5 탆 after curing, but a margin of crack-generated thickness of 3.7 탆 was obtained, and a margin of 97% compared to Examples was obtained, and a light transmittance of 97% was obtained.

Composition Crack occurrence Yes / No
(Thickness after curing) Crack
Thick margin
(μm) Light transmittance
(%) 2.5 μm Example 1 Synthesis Example 1 radish 4.7 97 Example 2 Synthesis Example 2 radish 4.8 97 Example 3 Synthesis Example 3 radish 4.7 98 Example 4 Synthesis Example 4 radish 5.0 98 Example 5 Synthesis Example 5 radish 5.2 98 Comparative Example 1 Comparative Synthesis Example 1 U 3.7 97

As can be seen from the above Table 2, according to one embodiment, the compound represented by the formula (1), the compound represented by the formula (2) and the compound represented by the formula (3) When the photosensitive resin composition was cured to 380 占 폚, no cracks were generated at all, and a crack margin thickness of 4.5 占 퐉 or more was exhibited. Further, a cured film having a high transmittance at a light transmittance of 97% was obtained.

On the other hand, when the photosensitive resin composition according to Comparative Synthesis Example 1 was used, it was confirmed that the crack-generated thickness margin was 3.7 탆 and the crack resistance was low to 380 캜.

As a result, it can be seen that the photosensitive resin composition according to one embodiment can produce a cured film having a high cracking margin of 4.5 μm or more and a high light transmittance without causing cracking at a high temperature of 350 ° C. or more.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, And falls within the scope of the present invention.

Claims (14)

1. A photosensitive resin composition comprising a polysiloxane copolymer formed by hydrolysis and condensation of a compound represented by the following formula (1), a compound represented by the following formula (2), and a compound represented by the following formula (3)
[Chemical Formula 1]

In Formula 1,
X is, independently of each other, a substituted or unsubstituted C1 to C10 alkylene group,
Y is each independently any one of a hydroxyl group, a carboxyl group, a substituted or unsubstituted C1 to C10 alkoxy group, a substituted or unsubstituted C1 to C10 alkoxysilyl group, an epoxy group, and a C1 to C6 ester group,
(2)
(R ¹ ) _a SiR ² _{4 -a}
In Formula 2,
R ¹ is selected from the group consisting of hydrogen, a hydroxyl group, a halogen, a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, a substituted or unsubstituted C6 to C30 aryl group, a substituted or unsubstituted C7 to C30 aryl Substituted or unsubstituted C1 to C30 heteroalkyl groups, substituted or unsubstituted C2 to C30 heterocycloalkyl groups, substituted or unsubstituted C1 to C30 heteroaryl groups, substituted or unsubstituted C2 to C30 alkenyl groups, substituted or unsubstituted C1 to C30 heteroalkyl groups, (C-O) -, wherein R is a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, a substituted or unsubstituted C1 to C30 alkynyl group, A substituted C6 to C30 aryl group, or a substituted or unsubstituted C7 to C30 arylalkyl group), or a combination thereof,
R ² is a C 1 to C 6 alkoxy group, a hydroxy group, a halogen, a carboxyl group,
a is 0? a < 4.
(3)
R ³ ₃ Si-Y ¹ -SiR ⁴ ₃
In Formula 3,
Y ¹ represents a single bond, oxygen, a substituted or unsubstituted C1 to C20 alkylene group, a substituted or unsubstituted C3 to C30 cycloalkylene group, a substituted or unsubstituted C6 to C30 arylene group, a substituted or unsubstituted C2 to C30 A substituted or unsubstituted C2 to C30 alkenylene group, a substituted or unsubstituted C2 to C20 alkynylene group, or a combination thereof,
R ³ and R ⁴ are each independently a C 1 to C 6 alkoxy group, a hydroxy group, a halogen, a carboxyl group, or a combination thereof. The method of claim 1,
X in the above formula (1) are each independently a C1 to C3 alkylene group and each Y is independently a hydroxyl group, a C1 to C6 alkoxysilyl group, or an epoxy group. The method of claim 1,
Wherein the compound represented by the formula (1) comprises at least one of compounds represented by the following formulas (1-1) to (1-3):
[Formula 1-1]

[Formula 1-2]

[Formula 1-3]

In Formulas 1-1 to 1-3, n is an integer of 1 to 5. The method of claim 1,
Wherein a in Formula 2 is 1. The method of claim 1,
Wherein R ¹ in Formula 2 is a C ¹ to C 10 alkyl group, a C 6 to C 16 aryl group, or a combination thereof, and R ² is a C 1 to C 6 alkoxy group, a hydroxy group, or a combination thereof. The method of claim 1,
Y ¹ in the formula (3) is C1 to C10 alkyl group, a C3 to C10 cycloalkyl group, a C6 to C12 arylene group, or a combination thereof, wherein R ³ and R ⁴ are, each independently, C1 to C6 alkoxy group photosensitive Resin composition. The method of claim 1,
The polysiloxane copolymer is hydrolyzed and condensed with 20 mol% or less of the compound represented by the formula (1), 70 to 95 mol% of the compound represented by the formula (2) and 20 mol% or less of the compound represented by the formula By weight of the photosensitive resin composition. The method of claim 1,
The polysiloxane copolymer is prepared by copolymerizing 1 mol% to 20 mol% of the compound represented by Formula 1, 75 mol% to 95 mol% of the compound represented by Formula 2, 1 mol% to 10 mol% Is subjected to hydrolysis and condensation reaction. The method of claim 1,
Wherein the polysiloxane copolymer comprises 5 mol% to 15 mol% of the compound represented by Formula 1, 80 mol% to 90 mol% of the compound represented by Formula 2, and 5 mol% to 15 mol% Is subjected to hydrolysis and condensation reaction. The method of claim 1,
A diazonaphthoquinone derivative, and a solvent. A cured film obtained by curing the photosensitive resin composition of any one of claims 1 to 10. 12. The method of claim 11,
Wherein the cured film has a light transmittance of 95% or more at a wavelength of 400 nm. 12. The method of claim 11,
The cured film has a crack-free thickness margin of 4.0 m or more. An electronic device comprising a cured film according to claim 11.