KR20180030490A - 반도체 소자용 지지 기판을 제조하는 방법 - Google Patents
반도체 소자용 지지 기판을 제조하는 방법 Download PDFInfo
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- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
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- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
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- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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Abstract
Description
도 2는 본 개시에 따른 반도체 소자용 지지 기판의 일 예 및 이를 제조하는 방법의 일 예를 나타내는 도면,
도 3은 본 개시에 따른 반도체 소자용 지지 기판을 제조하는 방법의 또 다른 일 예를 나타내는 도면,
도 4는 본 개시에 따라 반도체 장치를 제조하는 방법이 일 예를 나타내는 도면,
도 5는 본 개시에 따른 반도체 장치를 제조하는 방법의 또 다른 일 예를 나타내는 도면,
도 6은 본 개시에 따른 반도체 장치를 제조하는 방법의 또 다른 일 예를 나타내는 도면.
Claims (12)
- 반도체 소자용 지지 기판을 제조하는 방법에 있어서,
제1 면 및 제2 면에 대향하는 제2 면을 가지는 제1 기판을 준비하는 단계;
제1 면으로부터 제2 면 측을 향하는 홈을 형성하는 단계;
홈에 인서트를 삽입 및 고정시켜 제1 기판을 관통하는 통로를 형성하는 단계;로서, 통로는 방열 통로 및 전기 통로 중 적어도 하나로 기능하는, 통로를 형성하는 단계;를 포함하는 것을 특징으로 하는 반도체 소자용 지지 기판을 제조하는 방법. - 청구항 1에 있어서,
인서트는 고정 물질에 의해 홈에 고정되는 것을 특징으로 하는 반도체 소자용 지지 기판을 제조하는 방법. - 청구항 1에 있어서,
인서트의 삽입에 앞서, 제1 면 측에서 고정 물질을 형성하는 단계;를 포함하는 것을 특징으로 하는 반도체 소자용 지지 기판을 제조하는 방법. - 청구항 3에 있어서,
고정 물질은 접합성을 가지는 금속을 포함하는 것을 특징으로 하는 반도체 소자용 지지 기판을 제조하는 방법. - 청구항 1에 있어서,
인서트의 삽입에 앞서, 홈에 고반사성 물질을 형성하는 단계;를 포함하는 것을 특징으로 하는 반도체 소자용 지지 기판을 제조하는 방법. - 청구항 1에 있어서,
인서트는 고체상 와이어로부터 컷트된 막대 형상을 가지는 것을 특징으로 하는 반도체 소자용 지지 기판을 제조하는 방법. - 청구항 1에 있어서,
인서트는 액체상의 연속적으로 이어진 와이어 형태로 홈에 삽입되는 것을 특징으로 하는 반도체 소자용 지지 기판을 제조하는 방법. - 청구항 1에 있어서,
인서트는 홈에 파우더를 삽입한 후, 열처리를 통해 형성되는 것을 특징으로 하는 반도체 소자용 지지 기판을 제조하는 방법. - 청구항 1에 있어서,
인서트 삽입 후, 제1 면 및 제2 면 중의 적어도 하나가 연마되는 것을 특징으로 하는 반도체 소자용 지지 기판을 제조하는 방법. - 청구항 1에 있어서,
인서트의 삽입 및 고정 후, 제2 면이 연마되는 것을 특징으로 하는 반도체 소자용 지지 기핀을 제조하는 방법. - 청구항 1에 있어서,
인서트의 삽입에 앞서, 인서트가 고정 물질과 함께 제1 면 위에 놓여지는 것을 특징으로 하는 반도체 소자용 지지 기판을 제조하는 방법. - 청구항 1 내지 청구항 11 중의 어느 한 항에 있어서,
제1 기판은 전기절연성 물질로 이루어지는 것을 특징으로 하는 반도체 소자용 지지 기판을 제조하는 방법.
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Cited By (1)
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JP2020021856A (ja) * | 2018-08-02 | 2020-02-06 | 日亜化学工業株式会社 | 発光装置の製造方法及び発光装置 |
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