KR20180014184A - Sealing device including quantum dots and method of manufacturing the same - Google Patents

Abstract

The invention disclosed herein is directed to a sealing apparatus comprising an array of cavities comprising at least one quantum dot and at least one LED that are in contact with each other. The sealing device may include first and second substrates that are sealed together to form a cavity, which extends about one or more cavities. A backlight, display device, illumination, and solid state lighting device including such a sealing device are also disclosed herein, and a method of manufacturing the sealing device is also disclosed.

Description

Sealing device including quantum dots and method of manufacturing the same

This application claims priority to U.S. Provisional Application No. 62/185118, filed June 26, 2015, under 35 U.S.C. §119, which is incorporated herein by reference in its entirety.

The present invention relates generally to a sealing device comprising a quantum dot and a display device comprising the sealing device, and more particularly to a device having a sealed cavity comprising a quantum dot in contact with an LED component.

Liquid crystal displays (LCDs) are commonly used in a variety of electronic devices such as cell phones, notebooks, electronic tablets, televisions, and computer monitors. Conventional LCD backlights typically include phosphor color converters such as light emitting diodes (LEDs) and yttrium aluminum garnet (YAG) phosphors. However, such an LCD may be limited in terms of brightness, contrast ratio, efficiency, and / or viewing angle compared to other display devices. For example, in order to compete with organic light emitting diode (OLED) technology, there is a demand for higher contrast ratio, color gamut and brightness in conventional LCDs, for example in the case of handheld devices, A balance of requirements is needed.

Quantum dots are emerging as an alternative to phosphors and may provide enhanced precision and / or narrow emission lines in some cases to improve the LCD color gamut. LCD displays utilizing quantum dots as color converters can include, for example, glass tubes, capillaries, or sheets comprising quantum dots such as QDEF, which can be disposed between an LCD panel and a light guide. Such a film or device can be filled with quantum dots such as green and red emitting quantum dots and sealed at both ends and / or peripheries. However, such enclosed devices can result in significant material waste and / or can be complex to produce. Also, such a device may lack a good path to dissipate the heat generated by the color conversion.

LEDs used in backlights containing phosphor color conversion elements often use a conformal coating in which the phosphor is suspended from silicon and placed in contact with an LED die. In such a configuration, the heat may escape from the LED package through the LED die itself. However, quantum dots are more sensitive to temperature than phosphors, and backlighting to date using quantum dot materials avoids direct contact between the quantum dot material and the LED die for this reason. In the case of a quantum dot of a sealed capillary or sheet, the heat escape path through the LED die can not be used because the quantum dot does not contact the LED die. Thus, the sealed package of quantum dots complicates thermal extraction and / or dissipation, so that heat generated by the quantum dot can limit the brightness of the backlight.

Accordingly, it would be desirable to provide a closed device for a display that can reduce material waste, thereby lowering the cost of the device, and / or dissipating the heat generated by the quantum dot more efficiently.

SUMMARY OF THE INVENTION The present invention provides, in various embodiments, a method of manufacturing a semiconductor device comprising: a first substrate having a first surface comprising an array of cavities; A second substrate; And at least one seal between the first substrate and the second substrate, wherein the seal extends around at least one cavity of the cavity arrangement, the at least one cavity And at least one quantum dot in contact with at least one LED component. Backlights and display devices including such sealing devices are also disclosed herein. A sealed illumination device is also disclosed herein, the device comprising: a first substrate having a first surface comprising at least one cavity; A second substrate; And at least one seal between the first substrate and the second substrate, wherein the at least one cavity includes at least one quantum dot in contact with the at least one LED component.

In certain embodiments, at least one of the first or second substrates may be selected from glass and alumina substrates. For example, the first substrate may comprise a glass substrate or an alumina substrate, and the second substrate may optionally comprise a glass substrate having a metallized pattern. Sealing between the first substrate and the second substrate may include laser welding or a laser frit seal. The sealed device may, in some embodiments, further comprise at least one heat sink.

A method of manufacturing the sealing apparatus is also disclosed, the method comprising: placing at least one quantum dot in at least one cavity of an array of cavities on a first surface of a first substrate; Contacting at least one quantum dot with at least one LED component; Contacting a second surface of a second substrate with a first surface of a first substrate; And forming a seal between the first substrate and the second substrate, wherein the seal extends around at least one cavity comprising at least one quantum dot in contact with the at least one LED component.

According to various embodiments, the step of contacting the at least one quantum dot with the at least one LED may comprise, for example, providing at least one cavity on the first surface of the first substrate with at least one LED structure on the second surface of the second substrate And aligning the element with the first and second surfaces. The step of contacting at least one quantum dot with the at least one LED may comprise, for example, forming a cavity comprising an LED component, for example a cavity comprising a metallized via contacted and / Lt; RTI ID = 0.0 > quantum dot. ≪ / RTI >

Additional features and advantages of the invention will be set forth in the description which follows, and in part will be apparent to those skilled in the art from a reading of the specification or by practice of the methods described herein, including the following detailed description, the claims and the accompanying drawings.

It is to be understood that both the foregoing general description and the following detailed description are exemplary, and are intended to provide an overview or framework for understanding various aspects of the invention and the nature and character of the claims. BRIEF DESCRIPTION OF THE DRAWINGS The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification. The drawings illustrate various embodiments of the present disclosure and, together with the description, serve to explain the principles and operation of the present disclosure.

The following detailed description is to be further understood when read in conjunction with the following drawings, wherein like reference numerals are used to refer to similar elements:
1 shows a cross section of a sealing device according to various embodiments of the invention.
Figure 2 shows a cross section of a sealing device according to a further embodiment of the invention.
3 shows a cross section of a sealing device according to another embodiment of the present invention.
4A-C show various steps of a method of manufacturing a sealing device according to an embodiment of the present invention.
5a-f show various steps of a method of manufacturing a sealing device according to a further embodiment of the present invention.
6a-b show front and rear exploded views of a sealing device according to various embodiments of the present invention.

Various embodiments of the present invention will now be described with reference to Figs. 1-6, which illustrate exemplary sealing devices and methods of making the sealing devices. The following general description is intended to provide an overview of the claimed device and method, various aspects of which will be discussed in more detail throughout this specification with reference to non-limiting embodiments, Lt; / RTI >

Device

The sealing apparatus disclosed herein includes a first substrate having a first surface including an array of cavities; A second substrate; And at least one seal between the first substrate and the second substrate, the seal extending around at least one cavity in the array of cavities, the at least one cavity including at least one LED component And at least one quantum dot that is in contact. Backlights and display devices including such enclosures are also disclosed herein.

A cross-sectional view of the first embodiment of the sealing device 100 is shown in Fig. The sealing apparatus 100 includes a first substrate 101 including a cavity arrangement 105, and a second substrate 103. At least one cavity 105 may comprise at least one quantum dot 107. The at least one cavity may also include at least one LED component, such as a die 109, that is in contact with the at least one quantum dot 107. As used herein, the term "contact" is intended to indicate a direct physical contact or interaction between two enumerated members, for example the quantum dot and LED components may physically interact with one another in the cavity have. For comparison, the quantum dots of a separate closed capillary or sheet (e.g., QDEF) can not interact directly with the LED die.

According to various embodiments, the first and / or second substrate 101, 103 may be a glass substrate. The first and second glass substrates may include one or more of a soda-lime silicate, an aluminosilicate, an alkali-aluminosilicate, a borosilicate, an alkali-borosilicate -borosilicate, alkali-aluminoborosilicate, and other suitable glasses. Such a substrate may be chemically strengthened and / or thermally tempered in various embodiments. Non-limiting examples of suitable commercially available substrates include EAGLE XG, Lotus TM, Iris TM, Willow TM and Gorilla TM glasses from Corning Incorporated. Glass chemically reinforced by ion exchange may be suitable as a substrate in accordance with some non-limiting embodiments.

During the ion exchange process, ions in the glass sheet at or near the surface of the glass sheet can be exchanged for larger metal ions, for example from a salt bath. Bonding larger ions to the glass can strengthen the sheet by creating compressive stress in the near surface area. The corresponding tensile stresses can be induced in the central region of the glass sheet to balance compressive stresses.

For example, ion exchange may be performed by immersing the glass in a molten salt bath for a predetermined period of time. Exemplary salt bath include, but are not limited to, include _{KNO 3, LiNO 3, NaNO 3} , RbNO 3 , and combinations thereof. The temperature of the molten bath and the treatment time may vary. Those skilled in the art will be able to determine the time and temperature according to the desired application. As a non-limiting example, the temperature of the molten salt bath can be from about 400 ° C to about 800 ° C, such as from about 400 ° C to about 500 ° C, and the predetermined time can range from about 4 to about 24 hours, And a time combination is planned, but can be set to about 4 hours to about 10 hours. As a non-limiting example, the glass may be immersed in a KNO ₃ bath at about 450 ° C for about 6 hours to obtain a K-rich layer that imparts a surface compressive stress.

According to various embodiments, the first and / or second glass substrate may have a compressive stress greater than about 100 MPa and a depth of compressive stress layer (DOL) greater than about 10 microns. In another embodiment, the first and / or second glass substrate may have a compressive stress greater than about 500 MPa and a DOL greater than about 20 microns, or a compressive stress greater than about 700 MPa and a DOL greater than about 40 microns. In a non-limiting embodiment, the first and / or second substrate may be about 3 mm or less, such as about 0.1 mm to about 2.5 mm, about 0.3 mm to about 2 mm, about 0.5 mm to about 1.5 mm, And may have a thickness of from about 0.7 mm to about 1 mm, including all ranges and subranges therebetween.

The first and / or second substrate may be transparent or substantially transparent in various embodiments. As used herein, the term "transparent" means that a substrate about 1 mm thick has a transmittance greater than about 80% in the visible region of the spectrum (420-700 nm). For example, an exemplary transparent substrate may have a transmittance greater than about 85%, such as greater than about 90% or greater than about 95%, in the visible light range, including all ranges and subranges therebetween . In certain embodiments, an exemplary glass substrate has a transmittance greater than about 50%, e.g., greater than about 55%, in the ultraviolet (UV) region (200-410 nm), including all ranges and subranges therebetween, , Greater than about 60%, greater than about 65%, greater than about 70%, greater than about 75%, greater than about 80%, greater than about 85%, greater than about 90%, greater than about 95% And has a higher transmittance.

According to various embodiments, for example, in the case of a transparent first and / or second substrate, at least a portion of the first and / or second transparent substrate may be painted (e.g., painted. In some embodiments, the substrate may have a white or other reflective (e.g., reflective) surface around one or more cavities such that light in use in a display device can only propagate through the cavity portion of the encapsulation device And can be painted with ink. In certain embodiments, the first surface of the first substrate can be painted around the cavity opening before being sealed with the second substrate. Alternatively, the reflective film may be disposed on the first surface, such as between the first and second substrates, or in the case of a multi-layer first substrate (described in more detail below) And may be disposed between two layers. The reflective film may comprise any of the metals disclosed herein, such as, for example, aluminum, copper, gold and silver, and the like.

It should be understood that FIG. 1 shows cavity 105 with a substantially rounded, concave cross-section, although cavities may have any shape or size as desired for a given application. For example, the cavity may have a square, rectangular, semicircular or semi-elliptical cross-section or an irregular cross-section. Also, although cavities 105 are shown spaced apart in a substantially uniform manner, the spacing between cavities may be irregular or selected to match any desired LED array pattern or circuit pattern on a printed circuit board (PCB) Lt; / RTI >

For example, a typical LED array for a backlight device may have a range of about 5 mm to about 100 mm, including about 10 mm to about 90 mm, about 15 mm to about 80 mm, about 20 mm to about 75 mm, Having a length and / or width ranging from about 25 mm to about 70 mm, from about 30 mm to about 65 mm, from about 35 mm to about 60 mm, from about 40 mm to about 55 mm, or from about 45 mm to about 50 mm . The LEDs can be in the range of about 1 mm to about 20 mm, including about 2 mm to about 15 mm, about 3 mm to about 12 mm, about 4 mm to about 10 mm, About 5 mm to about 8 mm, or about 6 mm to about 7 mm. Of course, the size and spacing of the LED arrays may vary depending on, for example, the brightness and / or total power of the display. Thus, the size and spacing of the cavities may be varied to produce any LED array similarly having a desired size and / or spacing.

The cavity 105 on the first surface 111 of the first substrate 101 may have any given depth and may be suitably selected for the type and / or amount of quantum dots to be placed, for example, in the cavity . By way of non-limiting example, the cavity on the first surface may be less than about 1 mm, for example less than about 0.5 mm, including all ranges and subranges therebetween, such as in the range of about 0.01 mm to about 1 mm, Less than about 0.4 mm, less than about 0.3 mm, less than about 0.2, less than about 0.1 mm, less than about 0.05 mm, less than about 0.02 mm, or less than about 0.01 mm. The cavity arrangement may include cavities having the same or different depths, the same or different shapes, and / or the same or different sizes.

At least one cavity 105 of the cavity arrangement may comprise at least one quantum dot. The quantum dot may have various shapes and / or sizes depending on the desired wavelength of the emitted light. For example, as the size of the quantum dots decreases, the frequency of the emitted light may increase. For example, as the size of the quantum dots decreases, the color of the emitted light may change from red to blue. When irradiated with blue, ultraviolet or near ultraviolet light, the quantum dots can convert light into longer red, yellow, green or blue wavelengths. According to various embodiments, the quantum dot may be selected from red and green quantum dots emitting at the red and green wavelengths when irradiated with blue, ultraviolet or near ultraviolet radiation. For example, LED components can emit blue light (about 420-490 nm), ultraviolet light (about 200-410 nm) or near ultraviolet light (about 300-410 nm).

The first surface 111 of the first substrate 101 and the second surface 113 of the second substrate 103 may be joined by sealing or welding 115. [ The seal 115 may extend around at least one of the cavities 105, thereby separating at least one cavity from the other cavities and creating one or more distinct sealing areas or pockets. According to various embodiments, the seal or weld 115 may be formed to have a thickness ranging from about 1 micron to about 100 microns, such as from about 5 microns to about 90 microns, from about 10 microns to about 80 microns, From about 20 microns to about 70 microns, from about 30 microns to about 60 microns, or from about 40 microns to about 50 microns. For example, a laser frit seal may have a width of from about 5 microns to about 20 microns, such as from about 10 microns to about 15 microns, including all ranges and subranges therebetween, Can have a width of about 5 microns, such as from about 0.1 microns to about 3 microns, from about 0.5 microns to about 2 microns, or from about 1 micron to less than about 1.5 microns.

The seal 115 may be formed directly between the first surface 111 and the second surface 113, in some embodiments. For example, the first and second surfaces may be in contact to form a sealing interface. A laser beam operating at a given wavelength may be directed at a sealing interface, for example, with a sealing interface, below the sealing interface, or above the sealing interface to form a seal between the two substrates. Exemplary laser sealing methods are disclosed in co-pending U.S. Patent Application No. 14 / 271,797, filed May 7, 2014, the entire contents of which are incorporated herein by reference.

In various non-limiting embodiments, the apparatus may include a sealing material or layer disposed between and connecting the first and second substrates (not shown). In these embodiments, the sealing material or layer may contact the first surface of the first substrate and the second surface of the second substrate. The sealing layer can be selected, for example, from glass compositions having an absorption and / or a relatively low glass transition temperature (Tg) greater than about 10% at the laser operating wavelength. The glass composition may comprise, for example, glass frit, glass powder and / or glass paste. According to various embodiments, the encapsulating layer may be formed from a variety of materials including, but not limited to, borate glasses, phosphate glass tellurite glasses and chalcogenide glasses, such as tin phosphate, tin fluorophosphates and tin fluoroborates, Lt; / RTI > Suitable sealing glasses are disclosed, for example, in U.S. Patent Application Publication No. 2014/0151742, which is incorporated herein by reference.

In general, suitable sealing layer materials can include low Tg glass and suitably reactive phosphorous or tin oxide. By way of non-limiting example, the sealing layer may include a subrange therebetween, such as in the range of from about 200 DEG C to about 400 DEG C, such as below about 400 DEG C, such as below about 350 DEG C, Or a glass having a Tg of about 200 DEG C or less. The glass may be present in various embodiments, including all ranges and subranges therebetween, such as greater than about 10%, greater than about 15%, greater than about 20%, greater than about 25%, such as greater than about 10% to about 50% , Greater than about 35%, greater than about 40%, greater than about 45%, or greater than about 50% (at room temperature). The thickness of the sealing layer may vary depending on the application and, in certain embodiments, including all ranges and subranges therebetween, such as less than about 5 microns, less than about 3 microns, less than about 2 microns, less than about 1 micron, Less than about 0.5 microns, or less than about 0.2 microns, from about 0.1 microns to about 10 microns.

If the device comprises a sealing layer, the sealing layer may be formed between the first and second substrates through the sealing layer. For example, a laser beam operating at a given wavelength may be directed at the sealing layer (or sealing interface) to form a seal or weld between the two substrates. Without being bound by theory, it is believed that the absorption of light from the laser beam by the sealing layer and the induced temporary absorption by the first and / or second substrate can cause localized heating and melting of both the sealing layer and the substrate . In some embodiments, the first and second substrates may be glass substrates, thus forming a glass-to-glass weld between the two substrates. Exemplary glass welding may be formed as described in co-pending U.S. Patent Application Serial No. 14 / 271,797, filed May 7, 2014, the entire contents of which are incorporated herein by reference.

The first surface 111 of the first substrate 101 may comprise an array of cavities 105 and the second surface 103 of the second substrate 103 May include a metallization pattern comprising an array of metal members 117 and the second surface includes a metallized, nonmetallized portion (not shown). In some embodiments, the LED die 109 may be attached to the second surface 113 of the second substrate 103 via metal member 117, for example, by wire bonds 119 . The metal member 117 may comprise any metal suitable for use in a display device, such as, for example, aluminum, copper, gold, silver, and the like.

1 illustrates an embodiment in which each cavity 105 includes quantum dots and LED components, it should be understood that this illustration is not limiting. Embodiments in which one or more cavities do not include quantum dots and / or LED components are also contemplated. Further, it is not necessary that each cavity contain the same number or quantum quantum dots, this quantity may vary from cavity to cavity, and some cavities may not contain quantum dots. Moreover, although the embodiment shown in FIG. 1 shows a seal 115 between each of the illustrated cavities 105, it is contemplated that, for example, in the case of cavities without a quantum dot, one or more cavities may not be sealed as desired It should be understood. Thus, it should be understood that the various cavities may be empty or free of quantum dots, and thus such void cavities are not properly or desirably sealed or sealed. In some embodiments, the seal may extend around a single cavity or group of arrays, such as two, three, four, five, ten, or more cavities, and the like. Alternatively, the seal may extend around the entire array of cavities.

Further, each cavity in the array of cavities may comprise the same or different types of quantum dots, e.g., quantum dots emitting different wavelengths. For example, in some embodiments, each cavity may include a quantum dot that emits both green and red wavelengths to produce a red-green-blue (RGB) spectrum in each cavity. However, according to another embodiment, it is possible for each cavity to contain only quantum dots emitting the same wavelength, for example a cavity containing only a green quantum dot, or a cavity containing only a red quantum dot. For example, for a given arrangement, about one-third of the cavity can be empty (although about one-third of the cavity can be filled with green quantum dots and about one-third of the cavity can be filled with red quantum dots) To release). Using this arrangement, the entire arrangement can produce RGB spectra, but it can provide dynamic dimming for each individual color. For example, for a portion of an image that does not contain green, it may block the green cavity immediately behind the corresponding portion of the image so that light is not emitted, thus removing green from that portion of the image. In the case of the RGB cavity, which includes both green and red phosphors, the cavity behind the image will still emit green light, and the display device will have to rely on liquid crystal switching to remove green from the image.

Of course, it should be understood that any ratio of cavities comprising any type, color, or quantity of quantum dots is possible and contemplated to fall within the scope of the present invention. It is within the ability of one skilled in the art to determine the type and amount of quantum dots to place in each cavity to achieve the desired display effect. Moreover, although the apparatus has been discussed in terms of red and green quantum dots for display devices, it is not limited thereto and may include other colors of red, orange, yellow, green, blue or visible spectrum (e.g., 400-700 nm) It should be understood that any type of quantum dot capable of emitting light of any wavelength may be used.

As discussed in more detail with reference to the methods disclosed herein, the sealing apparatus 100 may further include one or more heat sinks attached to the apparatus (not shown in FIG. 1). As used herein, the term "heat sink" is intended to represent any component capable of extracting or redirecting heat from at least one cavity, including the quantum dot and LED components. The heat sink can be constructed of, for example, metal, but can also be made of any material that is more thermally conductive than the first and / or second substrate. For example, a metal strip or rod may be positioned between the first and second substrates. This heat sink can be placed in contact with at least one metal member or lead and can perform the function of dissipating heat in the sealed cavity. Exemplary heat sinks may be selected from, for example, aluminum, copper, gold or metals including silver.

The white fused alumina substrate may have a higher thermal conductivity (e.g., 25W / mK compared to 1W / mK) and / or reflective surface properties (e.g., no painting step compared to a clear glass substrate) Can exhibit certain advantages over glass substrates. The color of the white fused alumina can be controlled, for example, by varying the amount or type of contaminants and / or the firing conditions. Thus, white alumina may have additional cost advantages compared to standard alumina. According to various embodiments, the first substrate may comprise at least one alumina layer. For example, the alumina may be a tape cast to a first thickness, and the multiple layers may be laminated and fired to produce an alumina substrate having a second thickness (greater than the first thickness). In some embodiments, a single layer of alumina may have a thickness ranging from about 0.05 mm to about 0.3 mm, including from about 0.1 mm to about 0.2 mm, including all ranges and subranges therebetween. The alumina substrate may have a total thickness of from about 0.1 mm to about 3 mm, such as from about 0.2 mm to about 2.5 mm, from about 0.3 mm to about 2 mm, from about 0.4 mm to about 1.5 mm, from about 0.5 mm to about 1 mm, About 0.6 mm to about 0.9 mm, or about 0.7 mm to about 0.8 mm, and includes all ranges and subranges therebetween. In some embodiments, the alumina substrate may be composed of two or more layers such as two or more, three, four, five, six, seven, eight, nine or ten or more layers.

For example, a first substrate 201 comprised of alumina may include a plurality of cavities 205 that may be cut, punched, or otherwise provided to an alumina substrate. For example, the holes can be punched into one or more alumina layers, and the layer includes holes stacked with the underlying layer to create a substrate comprising one or more cavities. 2, the first substrate 201 includes three upper layers 201a of alumina punched with holes corresponding to the sidewalls of the cavity 205 and one of alumina corresponding to the bottom of the cavity 205 Of the lower layer 201b. Cavity 205 may include a metallized via 221 (vias) that may be provided, for example, in lower layer 201b, as discussed in more detail with respect to the method disclosed herein.

2 illustrates cavity 205 having a substantially square or rectangular cross-section, it should be understood that the cavity may have any shape or size as desired for a given application. For example, the cavity may have a square, round, convex, concave, semicircular or semi-elliptical cross-section or irregular cross-section. Also, although the cavities 205 are shown spaced apart in a substantially even manner, the spacing between the cavities may be irregular or selected to match any desired LED array pattern or circuit pattern on the printed circuit board (PCB) 231 Lt; / RTI >

The cavity 205 in the first substrate 201 may have any given depth and may be suitably selected for, for example, the type and / or amount of quantum dots to be placed in the cavity. As a non-limiting example, the cavity on the first surface may include less than about 1 mm, such as less than about 0.5 mm, less than about 0.4 mm, such as from about 0.01 mm to about 1 mm, including all ranges and subranges , Less than about 0.3 mm, less than about 0.2, less than about 0.1 mm, less than about 0.05 mm, less than about 0.02 mm, or less than about 0.01 mm. The arrangement of cavities may include cavities having the same or different depths, the same or different shapes, and / or the same or different sizes.

At least one cavity 205 in the array of cavities may include at least one quantum dot 207 and at least one LED die 209, as discussed with respect to FIG. The first and second substrates 201 and 203 may be joined by sealing or welding (not shown). The seal may extend around at least one of the cavities 205, thereby creating one or more distinct sealing areas or pockets. The sealing may be formed in a manner similar to that described above with reference to Fig. And may have similar properties, such as sealing width and / or type (e.g., laser welding or laser frit sealing).

2, the first surface substrate 201 may include an array of cavities 205, while the second substrate 203 may include one or more surfaces without cavities or patterns, e.g., For example, a flat or smooth surface. In some embodiments, the second substrate may comprise a glass substrate, which may be similar to the glass substrate described above with respect to FIG. Figure 2 illustrates an embodiment in which each cavity 205 includes a quantum dot and an LED die, but it should be understood that this description is not limiting. Embodiments in which one or more cavities do not include quantum dots and / or LED components are also contemplated. It is also possible that each cavity does not need to include the same number or quantum dots, this amount can vary from cavity to cavity, and in some cavities it does not include quantum dots. Also, for example, in the case of cavities without a quantum dot, it should be understood that one or more cavities may not be sealed as desired. Thus, the various cavities are empty or otherwise free of quantum dots, and such empty cavities are not sealed or sealed as appropriate or desired. In some embodiments, the seal may extend around a single cavity or group of arrays, such as two, three, four, five, ten, or more cavities, and the like. Alternatively, the seal may extend around the entire array of cavities.

As discussed in more detail with reference to methods disclosed herein, the sealing apparatus 200 may further include one or more heat sinks attached to the apparatus. 2, the heat sink 212 may be disposed on a second surface (not labeled) of the first substrate 201 and may be attached to the second surface (not labeled) of the first substrate 201, for example, via an adhesive layer 223 . The heat sink 225 may be made of a metallic material suitable for dissipating heat from a display device, such as, for example, aluminum, copper, silver or gold, in various embodiments. The adhesive layer may have thermal conductivity and may be selected, for example, from a conductive epoxy.

In some embodiments, the heat sink 212 may include one or more holes 227 (holes). Holes 227 may be aligned with cavities 205 and elastomeric ("zebra") connectors 229 may pass through the holes, for example through the metallized vias 221, Element 209, as shown in FIG. The connector 229 may, for example, serve to individually control each LED to obtain high resolution local dimming to improve image contrast. The LEDs 209 may be interconnected to a printed circuit board (PCB) 231, including circuitry for connecting respective LEDs to an LED controller (not shown), which eventually results in a display controller (not shown) Lt; / RTI > Of course, it is not necessary for each cavity 205 of the sealing device 200 to have a corresponding hole 227, for example, in the case of one or more cavities without quantum dots and / or LED components.

A sectional view of a third embodiment of the sealing device 300 is shown in Fig. The sealing device 300 includes a first substrate 301 and a second substrate 303 that include an array of cavities 305 (only one shown). At least one cavity 305 may include at least one quantum dot 307. The at least one cavity may also include at least one LED die 309 in contact with at least one quantum dot 307. According to various embodiments, the first and second substrates 301 and 303 may comprise glass and may have the same composition and / or thickness of the glass substrate described above for the first and / or second substrates 101 and 103, Or characteristics. In a particular embodiment, the first substrate 301 (not shown) may comprise a single layer having a plurality of cavities comprising at least one quantum dot 307.

Alternatively, as shown in FIG. 3, the first substrate 301 may include two or more layers such as an upper layer 301a and a lower layer 301b. In some embodiments, the lower layer 301b may comprise glass. The top layer 301a may comprise other materials such as, for example, glass or plastic or ceramic material. The top layer 301a may comprise, for example, a well plate comprising a plurality of holes. In the case of a first substrate 301 comprising two or more layers, the top layer 301a may comprise a plurality of holes and the layer comprising holes may be stacked with the bottom layer 301b to include one or more cavities The first substrate 301 can be formed.

As shown in FIG. 3, the first substrate 301 may include one upper layer 301 comprising a hole punched or cut plastic corresponding to a sidewall of the cavity 305. Of course, different numbers, arrangements, and materials for the top and bottom layers may be used as desired. According to some embodiments, the first substrate 301 may include at least one layer comprising a glass sheet having a well plate superimposed on a cutout provided therein, the well plate being substantially a glass sheet (See Figs. 6A-B).

In some embodiments, to increase the amount of light propagating from the encapsulation device toward the observer and / or to prevent cross-talk between the cavities, a white plastic top layer 301a (or overlapping well plate ). ≪ / RTI > When one of the quantum dots of a cavity is excited to produce light having one wavelength and the converted light is converted by another quantum dot to light having another longer wavelength (for example, light emitted from a green quantum dot Can be converted to longer wavelengths by adjacent red quantum dots), crosstalk can occur. A transparent first substrate 301, including transparent top and bottom layers 301a, 301b, may also be used in some embodiments. In this case, the substrate or one or more layers of the substrate may be painted around the cavity (e.g., with white or reflective ink) and / or the reflective layer may be included in the sealing device.

The first substrate 301 may include a plurality of metalized vias 301 that may be provided in the bottom layer 301 adjacent to each LED die 309, for example, as discussed in greater detail with respect to the methods disclosed herein. Lt; RTI ID = 0.0 > 321 < / RTI > The metallized via 321 may have any desired diameter and be spaced at any given pitch. For example, the diameter of a single metallized via may range from about 20 microns to about 200 microns, such as from about 40 microns to about 180 microns, from about 60 microns to about 160 microns, including all ranges and subranges therebetween Microns, from about 80 microns to about 140 microns, or from about 100 microns to about 120 microns. The plurality of metallized vias 321 may include, in some embodiments, one or more discrete groups (shown in one group) of vias disposed adjacent to the LED die 309. Each discrete group may include, for example, two or more vias, such as 2 to 40 vials, 5 to 30 vials, 10 to 25 vials or 15 to 20 vials, including all ranges and subranges therebetween. It can include dog buyers.

The pitch between the metallized vias 321 in the group may range, for example, from about 40 microns to about 300 microns, from about 75 microns to about 250 microns, from about 100 microns to about 100 microns, including all ranges and subranges therebetween 200 microns, or from about 120 microns to about 150 microns. Each group of metallized vias is spaced a distance corresponding to the LED die spacing of the device, e.g., from about 1 mm to about 20 mm, such as from about 2 mm to about 15 mm, from about 3 mm to about 15 mm, from about 12 mm, from about 4 mm to about 10 mm, About 5 mm to about 8 mm, or about 6 mm to about 7 mm, including all ranges and subranges therebetween. Of course, the size and spacing of the metallized vias can be varied to match any desired LED array.

The LED die 309 may be bonded to the first substrate 301, for example, by a conductive epoxy. In some embodiments, the conductive film 333 may be provided on the first substrate 301. 3, the reflection film 333 may be provided on the surface of the first substrate 301, for example, on the surface of the lower layer 301b in contact with the upper layer 301a. The reflective film may be selected from any of the metals disclosed herein, such as aluminum, copper, silver, gold, and the like. The first and second substrates 301 and 303 may be joined by sealing or welding (not shown). The LED die 309 may be bonded to the first substrate 301 by a metal wire 319. The seal may extend around at least one of the cavities 305 thereby creating one or more distinct seal areas or pockets. In some embodiments, the seal may extend around a common group of arrangements such as two or more cavities, three or more cavities, four or more cavities, five or more cavities, ten or more cavities, and the like. Alternatively, the seal may extend around the entire array of cavities. The sealing may be formed in a manner similar to that described above with reference to Fig. And may have similar properties, such as sealing width and / or type (e.g., laser welding or laser frit sealing).

Although Figure 3 illustrates a cavity including a quantum dot and an LED die, it should be understood that it is not so limited. Embodiments in which one or more cavities do not include quantum dots and / or LED components are also contemplated. Moreover, it is not necessary that each cavity contain the same number or quantity of quantum dots, this amount may vary from cavity to cavity, and some cavities may not contain quantum dots. It should also be understood that one or more cavities may not be sealed as desired, for example, in the case of cavities without a quantum dot. Thus, the various cavities may be empty or free of quantum dots, and such empty cavities may not be sealed or sealed as appropriate or desired.

As described in more detail with reference to the methods disclosed herein, the sealing device 300 may further mount one or more heat sinks attached to the apparatus. 3, the heat sink 325 may be disposed on a second surface (not labeled) of the first substrate 301 and may be attached, for example, via an adhesive layer 323. The heat sink 325 may, in various embodiments, include a metal suitable for dissipating heat from a display device, such as aluminum, copper, silver, or gold, for example. The adhesive layer 323 may be thermally conductive, and may be selected, for example, from a conductive epoxy. The heat sink may further include one or more features 335, such as, for example, fins that can increase the dissipation of thermal energy, e.g., through ambient air flow (indicated by arrow A). The sealing device 300 may also be connected to a printed circuit board (PCB) 331, for example, through a heat sink 325, as in the previously disclosed embodiment. A printed circuit (not shown) may be provided on the second surface of the first substrate to connect each LED to an LED controller (not shown), which is eventually driven by a display controller (not shown) .

The first and second substrates, in various embodiments, may be sealed together as disclosed herein to provide sealing or welding around one or more of the cavities. In certain embodiments, the seal or weld may be a hermetic seal and form, for example, one or more air-tight and / or waterproof pockets in the device. For example, at least one cavity comprising at least one quantum dot is such that the cavity is impermeable or substantially impermeable to water, moisture, air, and / or other contaminants. A method of non-limiting example, the airtight seal is less than about ^{10 -2 cm 3 / m 2 /} day ( for ^{example, 10 -3 / cm 3 / m} 2 / day below) to limit the evaporation of oxygen, about 10 ^- to ² g / m ² / day (e.g., about 10 ^-3, 10 ^-4, 10 ^-5, or 10 ^-6 g / m ² / day below) may be configured to limit the evaporation of water. In various embodiments, the hermetic seal may prevent contact of water, moisture, and / or air with components that are substantially protected by the hermetic seal.

In certain embodiments, the first and second substrates may be selected such that the coefficient of thermal expansion (CTE) of the substrate is substantially equal. For example, the CTE of the second substrate may be within about 20%, such as within about 15%, within about 10%, within about 5%, within about 4%, within about 3%, within about 2% , Or about 1% of the first substrate CTE. According to various embodiments, the CTE of the first substrate is substantially the same as the second substrate CTE.

By way of example and not limitation, the CTE of the first and / or second substrate may be, for example, from about 0.5 x ^10-6 / to about 15 x ^10-6 / C , such as about 1 x 10 ^-6 / ℃ at about 14 x 10 ^-6 / ℃, about 2 x 10 ^-6 in / ℃ about 13 x 10 ^-6 / ℃, about 3 x 10 ^-6 / ℃ about 12 x 10 ^-6 / ℃, about 4 x 10 ^-6 in / ℃ about 11 x 10 ^-6 / ℃, at about 5 x 10 ^-6 / ℃ at about 10 x 10 ^-6 / ℃, about 6 x 10 ^-6 / ℃ About 9 x ^10-6 / C, or about 7 x ^10-6 / C to about 8 x ^10-6 / C. In a particular embodiment, the first and / or second substrate, including all ranges and sub-ranges therebetween, from about 8 x 10 ^-6 / ℃ about 10 x 10 ^-6 / ℃, for example, 8.5 in and glass having a CTE range of about 9.5 x 10 < ^-6 > / DEG C at x10 < ^-6 > / DEG C. According to a non-limiting embodiment, the glass substrate is a Corning® Gorilla® glass having a CTE range of from about 7.5 to about 8.5 × 10 ^-6 / ° C., or a CTE range of from about 3 to about 4 × 10 ^-6 / ° C. With Corning® EAGLE XG®, Lotus ^™ , or Willow® glass. In other embodiments, the first and / or second substrates may be deposited at a temperature of about 0.5 x ^10-6 / ° C to about 3 x ^10-6 / ° C, such as about 1 x ^10-6 / in ^-6 / ℃ may include from about 2.5 x 10 ^-6 / ℃, or alumina at about 1.5 x 10 ^-6 / ℃ with a CTE in the range of about 2 x 10 ^-6 / ℃.

The sealing device disclosed herein may include an array of sealed cavities that may be spaced as desired, at least a portion of which may include at least one quantum dot. Such an arrangement may make it possible to provide optical components for a backlight device such as an LCD device and may allow the quantum dots and LEDs to be located at desired locations < RTI ID = 0.0 > Can be provided separately. The arrangements disclosed herein can also provide high dynamic range, high contrast (from local dimming), high color gamut (from quantum dot color conversion) and / or high luminance (heat from the color converter through the LED die to the heat sink From the provision of dissipation path).

According to a particular aspect, the total thickness of the sealing device may be less than about 6 mm, such as less than about 5 mm, less than about 4 mm, less than about 3 mm, less than about 2 mm, less than about 1.5 mm, including all ranges and subranges therebetween Less than about 1 mm, less than about 0.5 mm. For example, the thickness of the sealing device may range from about 0.3 mm to about 3 mm, from about 0.5 mm to about 2.5 mm, or from about 1 mm to about 2 mm, including all ranges and subranges therebetween.

 Although the embodiment shown in Figs. 1-3 considers cavities and one-dimensional (e.g., single row) dimensions of the LEDs, the sealing devices disclosed herein may also include a two-dimensional array (e.g., one or more columns and / Lt; RTI ID = 0.0 > a < / RTI > The height and length dimensions of the sealing device may thus vary as desired to suit the selected display. For example, the one or more encapsulation devices may include a display of any size, including, for example, all ranges and subranges therebetween, from about 5 mm to about 1.5 m, such as from about 1 cm to about 1 m, And may be arranged or arranged together in one or more directions to accommodate a display of any size having a length and / or width ranging from about 500 cm, about 25 cm to about 250 cm, or from about 50 cm to about 100 cm. In a particular embodiment, the two or more encapsulating devices are arranged in three or more directions in one or more directions to produce an array of LEDs having a desired size. Or more devices, such as a single LED array.

The sealing device disclosed herein may include various additional components, including, but not limited to, backlights or backlit displays such as LEDs. Exemplary LCD devices include a variety of displays, such as a reflector, a light guide, a diffuser, one or more prismatic films, a reflective polarizer, one or more linear polarisers, a thin film transistor (TFT) array, a printed circuit board And may further include conventional components.

The sealing device disclosed herein can also be used as a lighting device, such as a lighting device and a solid state lighting application. For example, a sealing device having a quantum dot in contact with at least one LED die can be used for general illumination, such as to mimic the broadband output of the sun. Such an illumination device may comprise quantum dots of various sizes emitting at various wavelengths, for example wavelengths in the 400-700 nm range. In certain embodiments, the sealed illumination device includes at least two different quantum dots (e.g., emitting different wavelengths) of different sizes, such as at least three, at least four, at least five, or more different quantum dots . According to various embodiments, the sealing device may comprise a mixture of quantum dots emitting color widely scans the visible spectrum, such as red, orange, yellow, green, and blue wavelengths. The sealed illumination device may comprise a single cavity or cavity arrangement (similar to the sealing device described above). In the case of multiple cavities, each cavity may comprise the same or different quantum dots, for example, each cavity may comprise the same mixture of quantum dots, or the cavities may comprise different mixtures of quantum dots, Lt; RTI ID = 0.0 > a < / RTI > type of quantum dot.

Way

Disclosed herein is a method of fabricating a sealing apparatus, the method comprising: disposing at least one quantum dot in at least one cavity of an array of cavities on a first surface of a first substrate; Contacting at least one quantum dot with at least one LED component; Contacting the first surface of the first substrate with the second surface of the second substrate; And forming a seal between the first substrate and the second substrate, wherein the seal extending around the at least one cavity includes at least one quantum dot in contact with the at least one LED component.

4A-C show various steps in a method of manufacturing a sealing device according to a particular embodiment of the present invention, such as the sealing device shown in Fig. For example, FIG. 4A shows a top view of a first substrate 401 comprising an array of cavities 405. FIG. As noted above, the illustrated cavity arrangement is not intended to be limited by the claims, either by common number, arrangement, type, size, etc. Although FIG. 4A shows cavity 405 as having a substantially circular surface area, the cavity may have a given shape or size, as desired for a given field. For example, the cavity may have a rectangular, rectangular, or elliptical surface area, or an irregular surface area, and the like.

Sealing material 437a, such as glass frit or paste, may be optionally disposed around each cavity. At least one quantum dot 407 may be disposed in at least one cavity 405 of the array. Figure 4A shows scattered quantum dots 407 between the various exemplary cavities; However, all cavities or different cavities may be filled with various quantum dots, as desired for a particular application. According to various embodiments, the quantum dot 407 material may be disposed in cavity 405 in an inert environment. Suitable methods of placing the quantum dot 407 can include, for example, microprinting methods such as ink jet printing, screen printing, and micro contact printing.

According to various embodiments, the first substrate 401 may comprise a uniform piece or a multiple assembled or attached piece. For example, as shown in FIG. 4A, the first substrate may include a stationary sheet 401a that may be substantially flat or may have a cavity arrangement (unlabeled). A singulated (individual) substrate 401b including individual cavities 405 may be disposed in cavities or on the surface of the fastening sheet 401a to form cavities of the desired pattern. In such an embodiment, cavities 405 may be arranged at substantially the same pitch as the LED die. The unified substrate 401b can be prepared, for example, by providing cavities in a substrate sheet (e.g., a glass sheet) by pressing or some other suitable method. The individual substrate 401b can be cut from the sheet to produce any desired shape and / or dimension. Alternatively, the substrate 401b including the sealing material 437a around the cavity 405 may be fired as a sheet before, after, and / or after being placed in the cavity of the stationary sheet 401a.

In various embodiments, a portion of the first substrate 401 can be painted in the area near the cavity, such as, for example, around the circumference of the cavity. For example, in the case of a transparent first substrate 401 (such as a glass substrate), various portions of the substrate may be painted with white or other reflective ink. In the case of the unified substrate 401b, the sides of each substrate can be painted. The painting may be performed, for example, to increase the amount of light propagating from the sealing device toward the LCD panel (e.g., toward the observer) and / or to avoid cross-talk between the cavities.

4B shows a top view of the second substrate 403 of the example. The second surface 413 may comprise, for example, a metallized pattern. The LED die 409 may be attached to the metal member 417 to form an array, e.g., via wire bonding. Of course, it is to be understood that any metallized pattern may be provided on the second surface 413 of the second substrate 403, although FIG. 4B illustrates an embodiment of a particular example. Moreover, any number of LED dies 409 may be provided on the second surface 413 in any desired pattern.

4c, a first substrate (e.g., a unified substrate 401b) that includes an array of cavities 405 is brought into contact with a second surface (unlabeled) comprising an array of LED dies 409 The first and second substrates (unlabeled) may be contacted. In a particular embodiment, the substrate may be aligned such that at least one cavity 405 includes at least one quantum dot 407 and at least one LED die 409. Thus, the contacted substrate may be sealed around, for example, at least one cavity 405 that includes at least one quantum dot 407 and at least one LED die 409. For example, in the case of a unified substrate 401b, each substrate may be sealed to a second substrate to form an array of sealed cavities. Sealing may be performed, for example, through laser welding or laser frit sealing as described above to form the sealing device 400. [ For example, the laser may be directed at a sealing interface that includes a sealing material to bond the first and second substrates together, or on a sealing interface, or laser welding may be formed of a member of a sealing material. Thus, seal 437b may include laser welding or laser frit sealing. In the case of a frit seal, the seal 437b may correspond to the pattern of the sealing material 437a (see Fig. 4A). In some embodiments, the sealing method can be selected according to the CTE of the substrate, for example, laser welding can be used on a substrate having a high CTE (e.g., greater than about 3 x 10 < ^-6 > / DEG C) Seals may be suitable for substrates with low CTE (e.g., less than about 3 x 10 < ^-6 > / DEG C), but any substrate and seal combinations are possible and considered.

In accordance with various embodiments, the sealing substrate may be provided with any suitable means for creating any pattern, such as a square, rectangle, circle, ellipse, or any other suitable pattern or shape, for sealing the one or more cavities of the apparatus, (Or the substrate may be transferred to the laser) along a substrate using a predetermined path. The transfer rate at which the laser beam (or substrate) travels along the interface may vary depending on the application and may depend, for example, on the configuration of the first and second substrates and / or the focus component and / , Frequency, and / or wavelength. In a particular embodiment, the laser is irradiated at a dose of about 1 mm / s to about 1000 mm / s, such as about 10 mm / s to about 500 mm / s, or about 50 mm / s For example, greater than about 100 mm / s, greater than about 200 mm / s, greater than about 300 mm / s, greater than about 400 mm / s, greater than about 500 mm / s And can have a transmission speed greater than about 600 mm / s.

According to various embodiments disclosed herein, the laser wavelength, pulse duration, repetition rate, average power, focusing conditions, and other related variables produce sufficient energy to weld the first and second substrates together, either directly or in the manner of a sealing material , It can be changed. It is within the ability of one of ordinary skill in the art to modify these variables as a requirement for the desired field. In various embodiments, the laser fluence (or intensity) is below the damage limit of the first and / or second substrate, e.g., the laser operates under conditions sufficient to weld the substrates together, It is not powerful. In a particular embodiment, the laser beam can operate at a transmission rate equal to or less than the diameter of the laser beam at the sealing interface and the repetition rate of the laser beam.

The method disclosed herein may further comprise the step of attaching one or more heat sinks 425 to the sealing device 400. For example, a metal strip may be disposed in contact with one or more metal members 417 to dissipate heat from the sealed cavity 405. 4C, the seal 437b may extend around the cavity 405, which includes at least one quantum dot 407 and at least one LED die 409. As shown in Fig. In some embodiments, metal member 417 may extend under seal 437b at least in part so that the seal is internal and external to sealed cavity 405. In various embodiments, metal member 417 may include one or more holes 439 (five shown) along a sealing interface to provide an integrated seal over metal member 417. Of course, in other embodiments, metal member 417 may include more or fewer holes, or holes 439 may be absent.

Figures 5a-d show various steps in a method of manufacturing a sealing device according to a further embodiment of the present invention, such as the sealing device shown in Figure 2. For example, FIG. 5A shows a top view of a lower layer 501b of a first substrate including via holes 521 (via holes). 5B shows a top view of an upper layer 501a in which a plurality of holes 541 are punched. One or more upper layers 501a may be laminated to the lower layer 501b and assembled to form a first substrate 501 comprising a plurality of cavities 505 as shown in Figure 5c. Thus, the assembled layers 501a and 501b may be fired to produce the first substrate 501. [ In some embodiments, the via hole 521 may be filled with a conductive paste (not shown) prior to firing.

At least one LED component 509 may be secured to the cavity 505, for example, by bonding the die to the lower layer 501b and wire bonding to one or more metallization via holes 521. [ As noted above, the illustrated cavity arrangement is not intended to be limited to the claims, either through common numbers, arrangements, types, sizes, etc. Figures 5c-e show cavity 505 with a substantially rectangular surface area, but the cavity may have any given shape or size, as desired for a given field. For example, the cavity may have a rectangular, circular, or elliptical surface area, or an irregular surface area, and the like. At least one quantum dot 507 may be disposed in at least one cavity 505 in the array. Figure 5d shows scattered quantum dots 507 between the various exemplary cavities; However, it should be understood that all cavities or different cavities may be filled with quantum dots as desired for a particular field.

5E is a plan view of the encapsulated substrate 500 when viewing the second substrate 503 in an upper portion. In the illustrated embodiment, the second substrate 503 is substantially transparent (e.g., a glass substrate) and the first substrate 501 can be seen in this view. Figure 5f shows an inverted view of a sealed substrate 500, viewed from below, a second substrate (unlabeled). In the illustrated embodiment, a metal substrate 525 (heat sink) is provided on a second surface (not labeled) of the first substrate 501. The first substrate 501 and the metallized vias 521 can be seen through the holes 527 of the metal substrate 525. As shown in the non-limiting embodiment, the first substrate 501 is not transparent (e.g., a white alumina substrate), and the second substrate 503 is not shown in this figure.

6A-6B show an exploded front to rear view of a sealing device according to a particular embodiment of the invention, such as, for example, the sealing device shown in Fig. The first substrate 601 may include an upper layer 601a and a lower layer 601b. The top layer 601a may include an overlapped well plate 651 while the bottom layer 601b may include a reflective coating 653 on the surface in contact with the top layer 601a. Quantum dots (not shown) may be disposed in at least one cavity 605 and disposed in contact with at least one LED die 609 on the bottom layer 601b. A sealing material 637a, such as glass frit or paste, may be selectively disposed around each cavity. The sealing can be performed, for example, by the above-described laser welding or laser frit sealing to form the sealing apparatus 600. As shown in Figures 6A-6B, sealing may extend, in some embodiments, around the entire array of cavities, such as various seals around a group of cavities or individual seals around individual cavities. Of course, it should be understood that other sealing patterns may be used.

Zebra connectors (or any other suitable connector) may be disposed in contact with the LED die 609 and may include means for individually controlling each LED to obtain high resolution local dimming to improve image contrast As well. The heat sink 625 may be bonded to the sealing device 600 through an adhesive layer (not shown). Furthermore, the PCB 631 may be provided that the LED die 609 is interconnected via the printed circuit 655. The printed circuit may be constructed or arranged using any conventionally known material, such as copper paste or any other conductive metal.

It is to be understood that the various disclosed embodiments may include the specific features, elements, or steps described in connection with the specific embodiments. Also, while a particular feature, element, or step has been described with respect to one specific embodiment, it is to be understood that the various features, elements, or steps may be interchanged or combined with alternative embodiments in various non-illustrated combinations or permutations.

As used herein, the terms "the", "one", or "one" shall be understood to mean "at least one" and should not be limited to "only one" unless expressly contrary do. Thus, for example, reference to "cavity " includes such" cavity "or instances having two or more" cavities " unless the context clearly indicates otherwise. Similarly, "plurality" or "array" refers to two or more, and "array of cavities" or "plurality of cavities "

Ranges may be expressed herein from " about "one particular value and / or" about " When such a range is expressed, the example includes from one particular value and / or to another specific value. Similarly, when a value is expressed as an approximation, it can be understood that by using the premise of "about ", the particular value forms another aspect. It will be further understood that each endpoint of the range is significant in relation to the other endpoint, and independently of the other endpoints.

All values recited herein should be interpreted as including "about " unless otherwise stated. It should be understood, however, that each recited number is precisely considered, regardless of whether it is represented by "about" its value. Thus, the terms "dimensions less than 10 mm" and "dimensions less than about 10 mm" all include embodiments of "dimensions less than 10 mm"

Unless expressly stated otherwise, any method described herein should not be interpreted as requiring that the steps be performed in any particular order. Thus, if the method claim does not imply an order in which the step should actually follow, or if it is not otherwise stated in the claims or the description that the steps should be limited in a particular order, the order is deduced.

While various features, elements, or steps of a particular embodiment may be disclosed using transitional phrases " comprises ", it should be understood that the phrase " consisting essentially of " Alternative embodiments are implied. Thus, for example, an implied alternative embodiment for a method involving A + B + C includes embodiments where the embodiment and method consisting of A + B + C consists essentially of A + B + C.

It will be apparent to those skilled in the art that various changes and modifications can be made herein without departing from the spirit and scope of the invention. As modifications, subcombinations, and variations of the disclosed embodiments, including the spirit and scope of the disclosure, may occur to those skilled in the art, the disclosure should be interpreted as including all things within the scope of the appended claims and their equivalents.

Claims (27)

A first substrate having a first surface comprising a cavity arrangement;
A second substrate; And
At least one seal between the first substrate and the second substrate,
Wherein the seal extends around at least one cavity of the array of cavities,
Wherein said at least one cavity comprises at least one quantum dot in contact with at least one LED component. The method according to claim 1,
Wherein at least one of the first or second substrate comprises glass. The method of claim 2,
Wherein the second substrate is a glass substrate comprising a metallized pattern. The method of claim 3,
Wherein the at least one LED element is attached to the metallized pattern. The method according to claim 1,
Wherein the first substrate comprises at least one layer of alumina or glass. The method of claim 5,
Wherein the at least one cavity comprises at least one metallized via. The method of claim 6,
Wherein the at least one LED component is attached to at least one metallized via. The method according to claim 1,
Wherein the at least one seal is selected from laser welding and laser frit seals. The method according to claim 1,
Wherein the at least one seal extends around a single cavity of the array of cavities, around a group of two or more cavities of the array of cavities, or around an array of the entire cavity. The method according to claim 1,
Further comprising at least one heat sink. The method of claim 10,
Wherein the at least one heat sink is attached to the first or second substrate by a thermally conductive adhesive. The method of claim 10,
Wherein said at least one heat sink comprises at least one metal strip disposed on a first surface of said first substrate. The method of claim 10,
Wherein the at least one heat sink comprises a metal substrate disposed on a second surface of the first substrate, the metal substrate optionally including one or more holes. The method according to claim 1,
Wherein the backlight comprises the sealing device. The method according to claim 1,
Wherein the display device comprises the sealing device. A first substrate having a first surface comprising at least one cavity;
A second substrate; And
At least one seal between the first substrate and the second substrate,
Wherein the seal extends around at least one cavity,
Wherein said at least one cavity comprises at least one quantum dot in contact with at least one LED component. 18. The method of claim 16,
Wherein the at least one quantum dot emits light at a wavelength in the range of about 400 nm to about 700 nm. 18. The method of claim 16,
Wherein the at least one cavity comprises two or more quantum dots of different sizes. 18. The method of claim 16,
Wherein the first substrate comprises a single cavity or an array of cavities. 18. The method of claim 16,
Wherein the at least one seal extends around a single cavity, around a group of two or more cavities, or around an array of cavities. 18. The method of claim 16,
Wherein the solid state illumination device comprises the sealing device. A method for manufacturing a sealing device,
Disposing at least one quantum dot in at least one cavity of the array of cavities on the first surface of the first substrate;
Contacting the at least one quantum dot with at least one LED component;
Contacting a second surface of a second substrate with a first surface of the first substrate; And
Forming a seal between the first substrate and the second substrate,
Wherein the seal extends around at least one cavity, the at least one cavity including at least one quantum dot in contact with the at least one LED component. 23. The method of claim 22,
Wherein the at least one LED component is attached to a second surface of the second substrate and wherein the first and second surfaces comprise at least one quantum dot and at least one LED component, Wherein the sealing member is brought into contact with the sealing member. 23. The method of claim 22,
Wherein the at least one LED element is disposed in at least one cavity of a cavity arrangement on a first surface of the first substrate and wherein the at least one quantum dot comprises at least one cavity Wherein the sealing member is disposed in the sealing member. 23. The method of claim 22,
Wherein at least one of the first or second substrate is a glass substrate and the step of forming a seal between the first and second substrates comprises laser welding or laser frit sealing. 23. The method of claim 22,
Wherein the at least one seal extends around a single cavity of the array of cavities, around a group of two or more cavities of the array of cavities, or around the entire array of cavities. 23. The method of claim 22,
Further comprising attaching at least one heat sink to the first or second surface of the first substrate.

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