KR20180007921A - Electronic device - Google Patents

Abstract

According to various embodiments of the present invention, an electronic device comprises: a first rigid substrate in which a first module having at least one function is installed; a second rigid substrate in which at least one second module is installed; a first flexible substrate for electrically connecting the first and second rigid substrates; a third rigid substrate in which at least one third module is installed; and a second flexible substrate for electrically connecting the second and third rigid substrates. The first and third rigid substrates are electrically connected through a third flexible substrate. The electronic device can be varied by embodiments.

Description

ELECTRONIC DEVICE

Various embodiments of the invention relate to an electronic device, for example, an electronic device that allows the ground area of a circuit board included within a microelectronic device to be extended.

Typically, an electronic device refers to a device that performs a specific function according to a program loaded from a home appliance to an electronic notebook, a portable multimedia player, a mobile communication terminal, a tablet PC, a video / audio device, a desktop / laptop computer, Device. For example, such electronic devices may output stored information as sound or video. As the degree of integration of electronic devices increases, ultra-high-speed and large-capacity wireless communications become popular, and various functions are currently being installed in one mobile communication terminal. For example, not only communication functions but also entertainment functions such as games, multimedia functions such as music / video playback, communication and security functions for mobile banking, and functions such as schedule management and electronic wallet are integrated into one electronic device It is.

In recent years, wearable electronic devices have been proposed which can be worn on the body to increase the portability and realize various functions.

For example, in addition to a Bluetooth module for connecting the earphone to the portable terminal, an antenna module, a memory for storing the sound source, and an HRM sensor for measuring biometric information such as a user's heart rate , A Mic for call, and an input device such as a button or a touch that can control an ear jack.

Electronic devices such as ear jacks are formed to be very small in size in order to be worn at specific positions in the body. The necessity of a structure capable of mounting various modules so as to realize various functions in an electronic device having a limited space Is emerging. For example, in a wearable electronic device such as an ear jack, not only a Bluetooth module for connecting to a portable terminal but also a memory capable of storing a sound source and biometric information such as a user's heart rate can be measured , An HRM sensor for making a call, a Mic for a call, an input device such as a button or a touch capable of controlling an ear jack, and a structure capable of minimizing the size of the ear jack.

Therefore, according to various embodiments of the present invention, there is provided an electronic device having a structure that allows electronic devices to be miniaturized and highly integrated.

According to various embodiments of the present invention, there is provided an electronic device for connecting a plurality of substrates having various functions integrated to a flexible substrate so that an ultra-small product having various functions can be designed.

Further, in the electronic device, the substrates and the flexible substrate connecting them are inevitably different in lamination structure, and it is difficult to sufficiently secure the ground region in the flexible substrate, so that the ground level of the entire internal circuit substrate is not constant , It is inevitable to have a weak structure in terms of antenna radiation performance or noise.

Thus, according to various embodiments of the present invention, a ground structure is formed through expansion of a flexible substrate in the structure of a circuit board to reinforce the ground connection between the substrate and the substrate, thereby sufficiently securing the ground region of the flexible substrate And it is an object of the present invention to provide an electronic device capable of maintaining a constant ground level of the entire circuit board and having a structure resistant to antenna radiation performance or noise through such a structure.

An electronic device according to various embodiments of the present invention,

A first rigid substrate on which at least one first module is mounted;

A second rigid substrate on which at least one second module is over-mounted;

A first flexible substrate for electrically connecting the first rigid substrate and the second rigid substrate;

A third rigid substrate on which at least one third module is over-mounted; And

And a second flexible substrate for electrically connecting the second rigid substrate and the third rigid substrate,

The first rigid substrate and the third rigid substrate may be electrically connected through the third flexible substrate.

In addition, an apparatus according to various embodiments of the present invention includes:

housing;

A substrate portion provided on the housing and including a plurality of rigid substrates stacked in the same direction; And

And a connection substrate portion including a plurality of flexible substrates electrically connected to one end and another end of the rigid substrates adjacent to each other to be bent,

One of the connection substrate portions may be formed as a connection substrate having a circulation connection structure electrically closed by connecting two substrates disposed on the outermost sides of the rigid substrates.

An electronic device according to various embodiments of the present invention allows a plurality of rigid substrates to be connected to each other through a flexible substrate and a plurality of substrates rigid by the bending of the flexible substrates are arranged in a stacked state in the housing There is a possibility that various functions can be concentrated on an electronic device which can be miniaturized.

In addition, the electronic device according to various embodiments of the present invention is characterized in that the laminated structure of the layers of the plurality of rigid substrates and the laminated structure of the layers of the flexible substrate connecting the substrates are different, It is possible to reinforce the ground connection between the plurality of rigid substrates and to maintain the level of the ground constant, and accordingly, the antenna radiation Performance can be improved, and a noise-resistant structure can be realized.

1 is a block diagram illustrating an electronic device according to various embodiments of the present invention.
2 is a diagram illustrating an electronic device according to various embodiments of the present invention.
3 is a diagram illustrating an internal structure of an electronic device according to various embodiments of the present invention.
4 is a view showing a substrate portion and a connection substrate portion in an electronic device according to various embodiments of the present invention.
5 is a view showing another side of a substrate portion and a connecting substrate portion in an electronic device according to various embodiments of the present invention.
6 is a diagram schematically illustrating stacking of layers of a substrate portion and layers of a connection substrate portion in an electronic device according to various embodiments of the present invention.
7 is a view showing a structure in which a substrate portion and a connecting substrate portion are arranged in a housing in an electronic device according to various embodiments of the present invention.
8 is a view schematically showing a structure in which a substrate portion and a connecting substrate portion are arranged in a housing in an electronic device according to various embodiments of the present invention.
9 is a view schematically showing a connection structure between a substrate portion and a connection substrate portion in an electronic device according to various embodiments of the present invention.
10 is a view showing a connection structure between a third rigid substrate and a third flexible substrate in an electronic device according to various embodiments of the present invention.
11 is another view of an electronic device in an electronic device according to various embodiments of the present invention.
12 is a view showing a process of forming a third flexible substrate in an electronic device according to various embodiments of the present invention.
13 is a view illustrating a process of assembling a substrate portion and a connection substrate portion to a housing in an electronic device according to various embodiments of the present invention.

Hereinafter, various embodiments of the present document will be described with reference to the accompanying drawings. It is to be understood that the embodiments and terminologies used herein are not intended to limit the invention to the particular embodiments described, but to include various modifications, equivalents, and / or alternatives of the embodiments. In connection with the description of the drawings, like reference numerals may be used for similar components. The singular expressions may include plural expressions unless the context clearly dictates otherwise. In this document, the expressions "A or B" or "at least one of A and / or B" and the like may include all possible combinations of the items listed together. Expressions such as "first", "second", "first" or "second" may be used to qualify the components, regardless of order or importance, and to distinguish one component from another And does not limit the constituent elements. When it is mentioned that some (e.g., first) component is "(functionally or communicatively) connected" or "connected" to another (second) component, May be connected directly to the component, or may be connected through another component (e.g., a third component).

In this document, the term " configured to (or configured) to "as used herein is intended to encompass all types of hardware, software, Quot ;, "made to do "," made to do ", or "designed to" In some situations, the expression "a device configured to" may mean that the device can "do " with other devices or components. For example, a processor configured (or configured) to perform the phrases "A, B, and C" may be implemented by executing one or more software programs stored in a memory device or a dedicated processor (e.g., an embedded processor) , And a general purpose processor (e.g., a CPU or an application processor) capable of performing the corresponding operations.

Electronic devices in accordance with various embodiments of the present document may be used in various applications such as, for example, smart phones, tablet PCs, mobile phones, videophones, electronic book readers, desktop PCs, laptop PCs, netbook computers, workstations, a portable multimedia player, an MP3 player, a medical device, a camera, or a wearable device. Wearable devices may be of the type of accessories (eg, watches, rings, bracelets, braces, necklaces, glasses, contact lenses or head-mounted-devices (HMD) (E.g., a skin pad or tattoo), or a bio-implantable circuit. In some embodiments, the electronic device may be, for example, a television, a digital video disk (Such as Samsung HomeSync ^TM , Apple TV ^TM , or Google TV ^TM ), which are used in home appliances such as home appliances, audio, refrigerators, air conditioners, vacuum cleaners, ovens, microwave ovens, washing machines, air cleaners, set top boxes, home automation control panels, , A game console (e.g., Xbox ^TM , PlayStation ^TM ), an electronic dictionary, an electronic key, a camcorder, or an electronic photo frame.

In an alternative embodiment, the electronic device may be any of a variety of medical devices (e.g., various portable medical measurement devices such as a blood glucose meter, a heart rate meter, a blood pressure meter, or a body temperature meter), magnetic resonance angiography (MRA) A navigation system, a global navigation satellite system (GNSS), an event data recorder (EDR), a flight data recorder (FDR), an automobile infotainment device, a marine electronic equipment (For example, marine navigation systems, gyro compasses, etc.), avionics, security devices, head units for vehicles, industrial or domestic robots, drones, ATMs at financial institutions, of at least one of the following types of devices: a light bulb, a fire detector, a fire alarm, a thermostat, a streetlight, a toaster, a fitness device, a hot water tank, a heater, a boiler, . According to some embodiments, the electronic device may be a piece of furniture, a building / structure or part of an automobile, an electronic board, an electronic signature receiving device, a projector, or various measuring devices (e.g., Gas, or radio wave measuring instruments, etc.). In various embodiments, the electronic device is flexible or may be a combination of two or more of the various devices described above. The electronic device according to the embodiment of the present document is not limited to the above-described devices. In this document, the term user may refer to a person using an electronic device or a device using an electronic device (e.g., an artificial intelligence electronic device).

1 is a block diagram illustrating an electronic device 20 in accordance with various embodiments of the present invention.

The electronic device 20 includes one or more processors (e.g., AP) 21, a communication module 22, a subscriber identity module 22g, a memory 23, a sensor module 24, an input device 25, a display 26, an interface 27, an audio module 28, a camera module 29a, a power management module 29d, a battery 29e, an indicator 29b, and a motor 29c. The processor 21 may control a plurality of hardware or software components connected to the processor 21, for example, by driving an operating system or an application program, and may perform various data processing and operations. The processor 21 may be implemented with, for example, a system on chip (SoC). According to one embodiment, the processor 21 may further comprise a graphics processing unit (GPU) and / or an image signal processor. The processor 21 may include at least some of the components shown in FIG. 1 (e.g., a cellular module 22a). Processor 21 may load and process instructions or data received from at least one of the other components (e.g., non-volatile memory) into volatile memory and store the resulting data in non-volatile memory.

And may have the same or similar configuration as the communication module 22. The communication module 22 may include, for example, a cellular module 22a, a WiFi module 22b, a Bluetooth module 22c, a GNSS module 22d, an NFC module 22e and an RF module 22f have. The cellular module 22a may provide voice calls, video calls, text services, or Internet services, for example, over a communication network. According to one embodiment, the cellular module 22a may utilize a subscriber identity module (e.g., a SIM card) 22g to perform the identification and authentication of the electronic device 20 within the communication network. According to one embodiment, the cellular module 22a may perform at least some of the functions that the processor 21 may provide. According to one embodiment, the cellular module 22a may comprise a communications processor (CP). At least some (e.g., two or more) of the cellular module 22a, the WiFi module 22b, the Bluetooth module 22c, the GNSS module 22d, or the NFC module 22e, according to some embodiments, (IC) or an IC package. The RF module 22f can transmit and receive a communication signal (e.g., an RF signal), for example. The RF module 22f may include, for example, a transceiver, a power amplifier module (PAM), a frequency filter, a low noise amplifier (LNA), or an antenna. According to another embodiment, at least one of the cellular module 22a, the WiFi module 22b, the Bluetooth module 22c, the GNSS module 22d or the NFC module 22e transmits and receives an RF signal through a separate RF module . The subscriber identity module 22g may include, for example, a card or an embedded SIM containing a subscriber identity module and may include unique identification information (e.g., ICCID) or subscriber information (e.g., IMSI (international mobile subscriber identity).

The memory 23 may include, for example, an internal memory 23a or an external memory 23b. The built-in memory 23a may be a nonvolatile memory such as a nonvolatile memory such as an OTPROM (one time programmable ROM), a PROM, an EPROM, an EEPROM, a mask ROM, a flash ROM , A flash memory, a hard drive, or a solid state drive (SSD). The external memory 23b may be a flash drive, for example, a compact flash (CF) ), Micro-SD, Mini-SD, extreme digital (xD), multi-media card (MMC) or memory stick, etc. The external memory 23b is connected to the electronic device 20, Or may be physically connected.

The sensor module 24 may, for example, measure a physical quantity or sense the operating state of the electronic device 20 to convert the measured or sensed information into an electrical signal. The sensor module 24 includes a gesture sensor 24a, a gyro sensor 24b, an air pressure sensor 24c, a magnetic sensor 24d, an acceleration sensor 24e, a grip sensor 24f, 24g, a color sensor 24h (e.g., an RGB (red, green, blue) sensor), a biosensor 24i, a temperature / humidity sensor 24j, a luminance sensor 24k, ) Sensors 24l. Additionally or alternatively, the sensor module 24 may be, for example, an e-nose sensor, an electromyograph (EMG) sensor, an electroencephalogram (EEG) sensor, an electrocardiogram (ECG) An infrared (IR) sensor, an iris sensor, and / or a fingerprint sensor. The sensor module 24 may further include a control circuit for controlling at least one or more sensors belonging thereto. In some embodiments, the electronic device 20 further includes a processor configured to control the sensor module 24, either as part of the processor 21 or separately, so that while the processor 21 is in a sleep state, The sensor module 24 can be controlled.

The input device 25 may include, for example, a touch panel 25a, a (digital) pen sensor 25b, a key 25c, or an ultrasonic input device 25d. As the touch panel 25a, for example, at least one of an electrostatic type, a pressure sensitive type, an infrared type, and an ultrasonic type can be used. Further, the touch panel 25a may further include a control circuit. The touch panel 25a further includes a tactile layer to provide a tactile response to the user. The (digital) pen sensor 25b may be part of, for example, a touch panel or may include a separate recognition sheet. The key 25c may include, for example, a physical button, an optical key, or a keypad. The ultrasonic wave input device 25d can sense the ultrasonic wave generated by the input tool through the microphone (e.g., the microphone 28d) and confirm the data corresponding to the ultrasonic wave detected.

The display 26 may include a panel 26a, a hologram device 26b, a projector 26c, and / or control circuitry for controlling them. The panel 26a may be embodied, for example, flexibly, transparently, or wearably. The panel 26a may be composed of a touch panel 25a and one or more modules. According to one embodiment, the panel 26a may comprise a pressure sensor (or force sensor) capable of measuring the intensity of the pressure on the user's touch. The pressure sensor may be integrated with the touch panel 25a or may be implemented by one or more sensors separate from the touch panel 25a. The hologram device 26b can display a stereoscopic image in the air using the interference of light. The projector 26c can display an image by projecting light onto the screen. The screen may, for example, be located inside or outside the electronic device 20. [ The interface 27 may include, for example, an HDMI 27a, a USB 27b, an optical interface 27c, or a D-sub (D-subminiature) 27d. Additionally or alternatively, the interface 27 may include, for example, a mobile high-definition link (MHL) interface, an SD card / multi-media card (MMC) interface, or an infrared data association have.

The audio module 28 can, for example, bidirectionally convert sound and electrical signals. The audio module 28 can process sound information input or output through, for example, a speaker 28a, a receiver 28b, an earphone 28c, a microphone 28d, or the like. The camera module 29a is, for example, a device capable of capturing a still image and a moving image. According to an embodiment, the camera module 29a includes at least one image sensor (e.g., a front sensor or a rear sensor), a lens, an image signal processor , Or flash (e.g., an LED or xenon lamp, etc.). The power management module 29d can manage the power of the electronic device 20, for example. According to one embodiment, the power management module 29d may include a power management integrated circuit (PMIC), a charging IC, or a battery or fuel gauge. The PMIC may have a wired and / or wireless charging scheme. The wireless charging scheme may include, for example, a magnetic resonance scheme, a magnetic induction scheme, or an electromagnetic wave scheme, and may further include an additional circuit for wireless charging, for example, a coil loop, a resonant circuit, have. The battery gauge can measure, for example, the remaining amount of the battery 29e, the voltage during charging, the current, or the temperature. The battery 29e may include, for example, a rechargeable battery and / or a solar cell.

The indicator 29b may indicate a particular state of the electronic device 20 or a portion thereof (e.g., processor 21), e.g., a boot state, a message state, or a state of charge. The motor 29c can convert an electrical signal into a mechanical vibration, and can generate vibration, haptic effect, or the like. Electronic device 20 is, for example, DMB Mobile TV-enabled devices capable of handling media data in accordance with standards such as (digital multimedia broadcasting), DVB (digital video broadcasting), or MediaFLO (mediaFlo ^TM) (for example, : GPU). Each of the components described in this document may be composed of one or more components, and the name of the component may be changed according to the type of the electronic device. In various embodiments, an electronic device (e.g., electronic device 20) may be configured such that some components are omitted, further components are included, or some of the components are combined to form a single entity, The functions of the preceding components can be performed in the same manner.

2 is a diagram illustrating an electronic device according to various embodiments of the present invention.

3 is a diagram illustrating an internal structure of an electronic device according to various embodiments of the present invention.

2 and 3, an electronic device 100 according to various embodiments of the present invention may include a housing 110, a rigid substrate portion 120, and a flexible connection substrate portion 130 And the substrate unit 120 may be electrically connected to each other by the connection substrate unit 130 so as to have a closed loop connection structure.

The housing 110 according to one embodiment includes a first surface 110a and a second surface 110b in a direction different from the first surface 110a and a first surface 110a and a second surface 110b, And a third surface 110c between the first surface 110a and the second surface 110b. An inner space along the third surface 110c may be formed between the first surface 110a and the second surface 110b. A power supply device such as a battery may be mounted in the inner space. In an embodiment of the present invention, the first surface 110a may be the bottom surface of the housing 110, the second surface 110b may be the top surface of the housing 110, (Not shown). The upper surface of the housing 110 is disposed between the second rigid substrate 122 and the third rigid substrate 123 which are disposed on the upper surface side of the housing 110 and the third rigid substrate 123 2 rigid substrate 122. In this case, the support housing 111 may be provided with a plurality of protrusions.

4 is a view showing a substrate portion and a connection substrate portion in an electronic device according to various embodiments of the present invention. Figure 5 is a view showing the substrate portion and the other side of the connecting substrate portion in an electronic device according to various embodiments of the present invention.

4 and 5, the substrate unit 120 according to various embodiments of the present invention includes a plurality of rigid substrates 121 to 123 provided in the housing 110 and stacked in the same direction . The rigid substrates 121-123 according to one embodiment of the present invention are stacked in the same direction. However, the present invention is not limited thereto, and a structure in which the substrates are stacked with a predetermined gap therebetween Any form or shape that is stacked can be changed. But may have a structure in which they are not parallel but are stacked so that they are inclined to each other at a predetermined angle.

The substrate unit 120 according to one embodiment may include a first rigid substrate 121, a second rigid substrate 122, and a third rigid substrate 123. The first rigid substrate 121 and the third rigid substrate 123 may be disposed at the outermost portion of the housing 110, for example, at the lowermost portion and the uppermost portion of the housing 110.

The first rigid substrate 121 is disposed on the first surface 110a of the housing 110, and at least one first module 121a may be mounted. A first flexible substrate 131 is connected to one side of the first rigid substrate 121 and connected to the second rigid substrate 122. A third flexible substrate 133 May be connected to the third rigid substrate 123 to be connected thereto.

The second rigid substrate 122 is disposed adjacent to the first rigid substrate 121 and is disposed between the first rigid substrate 121 and the third rigid substrate 123 to be described later, One end of the second rigid substrate 122 and the other end of the second rigid substrate 122 may be electrically connected to the third rigid substrate 123 and the third rigid substrate 123, respectively. The second rigid substrate 122 may be stacked on the second surface 110b of the housing 110 and the module 121a mounted on the first rigid substrate 121 may be stacked on the second rigid substrate 122 At least one module 122a having a function can be mounted. A first flexible substrate 131 is connected to the tile side of the second rigid substrate 122 and connected to the first rigid substrate 121. A second rigid substrate 122 is provided on one side of the second rigid substrate 122, And may be connected to the third rigid substrate 123.

The third rigid substrate 123 may be located farthest from the first rigid substrate 121 and may be disposed adjacent to the second rigid substrate 122 and may be stacked on the second rigid substrate 122 . At least one module 123a having different functions from the modules 121a and 122a provided in the first rigid substrate 121 and the second rigid substrate 122 may be mounted on the third rigid substrate 123 . The third rigid substrate 123 may be connected to the second rigid substrate 122 and the second flexible substrate 132 to be connected to the second rigid substrate 122 on the tile side of the third rigid substrate 123, A ground connection pad 123b to which the third flexible board 133 can be connected may be provided at a predetermined position of the third flexible board 133. [ When the substrates 121 - 123 adjacent to each other are bent by the substrates 131 - 133 and arranged in a face-to-face laminated structure, the third flexible substrate (not shown) provided on the first rigid substrate 121 133 may be bent so as to be electrically connected to a ground connection pad 123b provided on the third rigid substrate 123.

The connection substrate unit 130 may include a plurality of flexible substrates 131-133 and may be provided to electrically connect one end of the rigid substrates 121-123 to the other end. The rigid substrates 121-123, which will be described later, are manufactured such that they are disposed adjacent to each other at the ends of each other to be electrically connected to each other. When the rigid substrates 121-123 are mounted on the housing 110, So that the connection substrate unit 130 can be flexibly and bandably installed.

6 is a diagram schematically illustrating stacking of layers of a substrate portion and layers of a connection substrate portion in an electronic device according to various embodiments of the present invention.

Referring to FIG. 6, the substrate portion 120 and the connection substrate portion 130 may have a structure in which they are stacked with at least two layers. In addition, the connection substrate unit 130 must be flexible to be bendable, and the substrate unit 120 may be rigidly mounted so that various modules may be mounted and electrically connected. Accordingly, the number of stacked layers 139 of the connection substrate portion 130 can be reduced compared with the number of stacked layers 129 of the substrate portion 120. For example, when the rigid substrates 121-124 are stacked in three layers 129, the connection substrate unit 130 may have a structure in which two layers 139 are stacked, The rigid substrates 121-124 according to an embodiment of the present invention may be stacked with six layers 129. The connection substrate 130 may be formed of two layers 139 It is possible to illustrate the structure having a laminated structure.

7 is a view showing a structure in which a substrate portion and a connecting substrate portion are arranged in a housing in an electronic device according to various embodiments of the present invention. 8 is a view schematically showing a structure in which a substrate portion and a connecting substrate portion are arranged in a housing in an electronic device according to various embodiments of the present invention. 9 is a view schematically showing a connection structure between a substrate portion and a connection substrate portion in an electronic device according to various embodiments of the present invention.

7 to 9, at least one flexible substrate (referred to as a 'third flexible substrate 133') among the connection substrate units 130 including a plurality of connection substrates is a substrate May be provided so as to have an electrical connection structure in the form of a closed loop by electrically connecting the electrodes 121-123. For example, two rigid substrates, in one embodiment, the first rigid substrate 121 and the third rigid substrate 123 are electrically connected to each other at the outermost sides of the rigid substrates 121-123 And may be provided so as to have a circulating connection structure of a closed loop shape.

The connection substrate unit 130 according to one embodiment may include a first flexible substrate 131, a second flexible substrate 132, and a third flexible substrate 133.

The first flexible substrate 131 may be provided between the first rigid substrate 121 and the second rigid substrate 122 adjacent to the first rigid substrate 121 to electrically connect the first rigid substrate 121 and the second rigid substrate 122 . The first flexible substrate 131 may be electrically connected to one side of the first rigid substrate 121 and the tile side of the second rigid substrate 122. The first flexible substrate 131 can be flexibly provided so as to be able to bend. The first rigid substrate 121 and the second rigid substrate 122 are arranged such that the first rigid substrate 121 and the second rigid substrate 122 are disposed adjacent to each other through the first flexible substrate 131, The first flexible substrate 131 is bent so that the first rigid substrate 121, the first flexible substrate 131 and the second rigid substrate 122 are '⊂' Quot; shape.

The second flexible substrate 132 may be provided between the second rigid substrate 122 and the third rigid substrate 123 adjacent to the second rigid substrate 122 so as to electrically connect the second rigid substrate 122 and the third rigid substrate 123 . The second flexible substrate 132 may be electrically connected to one side of the second rigid substrate 122 and the tile side of the third rigid substrate 123. The second flexible substrate 132 may be flexibly provided so as to be capable of bending. The second rigid substrate 122 and the third rigid substrate 123 face each other while the second rigid substrate 122 and the third rigid substrate 123 are disposed adjacent to each other via the second flexible substrate 132, The second flexible substrate 132 is bent so that the second rigid substrate 122, the second flexible substrate 132 and the third rigid substrate 123 are in a "⊃" shape As shown in FIG.

The third flexible substrate 133 is provided to electrically connect substrates that are not adjacent to each other. In one embodiment of the present invention, when the substrates 121 to 123 are stacked on each other in a face- 110 and the substrate positioned on the lowermost side may be directly connected to each other. For example, the third flexible substrate 133 may be provided to electrically connect the first rigid substrate 121 and the third substrate. The third flexible substrate 133 can be flexibly provided so that the third flexible substrate 133 can be bent when the first rigid substrate 121 and the third rigid substrate 123 stacked on the surface facing each other are connected.

In one embodiment, the first end of the third flexible substrate 133 may be fabricated to be connected to the tile side of the first rigid substrate 121, and the first rigid substrate 121, the first flexible substrate 131, The second rigid substrate 122, the second flexible substrate 132 and the third rigid substrate 123 are bent at the tile side of the first rigid substrate 121 in the state of being arranged in the form of " The second end of the third flexible substrate 133 may be electrically connected to the ground connection pad 123b provided at a predetermined position of the substrate 123. [

10 is a view showing a connection structure between a third rigid substrate and a third flexible substrate in an electronic device according to various embodiments of the present invention.

Referring to FIG. 10, a connection terminal 133a may be provided at the end of the third flexible substrate 133 so as to be electrically connected to the ground connection pad 123b. The connection terminal 133a may be formed with an opening 133b which is recessed to the inside of the connection terminal 133a. Further, a coupling supporting portion 133c which is extended in a direction perpendicular to the longitudinal direction of the third flexible substrate 133 can be further formed around the opening 133b. That is, the coupling support 133c (see FIGS. 4 and 5) may be formed in the shape of a "T" around the opening 133b. That is, when the connection terminal 133a is placed on the ground connection pad 123b, the connection support portion 133c is pressed, so that no damage is caused to the ground connection pad or the connection terminal 133a. It is possible to work in a state in which the coupling support portion 133c is pressed, thereby increasing the ease of electrical coupling.

When the connection terminal 133a is placed on the ground connection pad 123b, a space is generated by the opening 133b in the ground connection pad 123b, and the reliability of the electrical connection state during the electrical connection assembly process, . As described above, the connection terminal 133a and the ground connection pad 123b may be fixed while being electrically connected through soldering.

The substrate portion 120 and the connection substrate portion 130 of the present invention are manufactured on the same surface and the substrates 121-123 are bonded to each other in accordance with the banding of the connection substrate portion 130 during assembly so as to be mounted on the housing 110 And can be stacked in a face-to-face manner. For example, the substrate portion 120 and the connection substrate portion 130 are bonded to the first rigid substrate 121, the first flexible substrate 131, the second rigid substrate 122, the second flexible substrate 132, The substrate 123 and the third flexible substrate 133 in that order. In this state, the first rigid substrate 121 is disposed on the first surface 110a, which is the lowermost surface of the housing 110, and the second rigid substrate 122 is disposed on the second surface 110b of the housing 110 And the first flexible substrate 131 is bent on the third surface 110c of the housing 110 while being connected to one side of the first rigid substrate 121 and the tile side of the second rigid substrate 122 . The third rigid substrate 123 may be spaced apart from the second rigid substrate 122 and stacked on the surface of the second rigid substrate 122. Thus, the second flexible substrate 132 may be bent while being connected to one side of the second rigid substrate 122 and the tile side of the third rigid substrate 123. A predetermined portion of the first rigid substrate 121 disposed on the first side 110a of the housing 110 and a third rigid substrate 123 disposed on the uppermost side of the housing 110, The first flexible substrate 131, the second rigid substrate 122, the second flexible substrate 132, and the third flexible substrate 133 are electrically connected to each other through the third flexible substrate 133, ), The third rigid substrate 123, and the third flexible substrate 133 may have a closed loop structure in the form of a closed loop.

11 is another view of an electronic device in an electronic device according to various embodiments of the present invention.

Referring to FIG. 11, the third flexible substrate 133 may further include a fourth rigid substrate 124 having a sensing sensor. The fourth rigid substrate 124 may be further provided between the third rigid substrate 123 and the first rigid substrate 121 and the fourth rigid substrate 124 may be further provided between the third rigid substrate 123 and the first rigid substrate 121 through the fourth flexible substrate 134 3 rigid substrate 123 and the third flexible substrate 133 may be provided to electrically connect the fourth rigid substrate 124 and the first rigid substrate 121. [ The fourth rigid substrate 124 may be positioned on the third surface 110c of the housing 110. [

The first flexible substrate 131 and the second flexible substrate 132 and the third flexible substrate 133 are located on the side surfaces of the third surface 110c of the housing 110 and the support housing 111, 113, 114 capable of fixing the first flexible substrate 131, the second flexible substrate 132, and the third flexible substrate 133 to the third surface 110c of the housing 110 .

The fixing portions 112, 113 and 114 may include a fixing surface 112 and a first seating portion 113 and a second seating portion 114 (see also FIG. 8).

The fixing surface 112 is a component provided to fix the third flexible substrate 133 to the third surface 110c of the housing 110. [ The fixing surface 112 is provided to fix a sensing sensor provided at a predetermined position of the third flexible substrate 133 so that the third flexible substrate 133 can be fixed to the third surface 110c of the housing 110 have. The fixing surface 112 may protrude obliquely from the third surface 110c of the housing 110 toward the first surface 110a. When the sensing sensor is mounted on the inclined fixing surface 112, the sensing sensor is obliquely attached to the third surface 110c of the housing 110 so that when the user inserts the electronic device 100, particularly an ear jack, When mounted, the detection sensor can be in contact with the inner side of the user's ear so that it can detect whether or not the ear jack is attached. In the present invention, the fixing surface 112 is disposed on the third surface 110c and is inclined in the direction toward the first surface 110a. However, the present invention is not limited to this shape or structure. For example, the position, shape, structure, etc. of the fixing surface 112 may be changed or modified depending on whether the electronic device 100 is worn on the part of the user's body.

The first seating part 113 is formed by bending a first flexible substrate 131 connected to one side of the first rigid substrate 121 and the tile side of the second rigid substrate 122 to the third surface 110c of the housing 110 As shown in FIG. The first seating part 113 may be configured to fix the first flexible substrate 131 such as a space in which the first flexible substrate 131 is seated on the third surface 110c of the housing 110 And may be provided to form a latching ring protruding to face each other. For example, on the third surface 110c of the housing 110. [ The first seating part may be made of an adhesive material between the first flexible substrate 131 and the third surface 110c of the housing 110. [

The second seating part 114 is formed by bending a second flexible substrate 132 connected to one side of the second rigid substrate 122 and the tile side of the third rigid substrate 123 to the third surface 110c of the housing 110 As shown in FIG. Specifically, the second seating portion 114 may be provided as a third surface 110c of the support housing 111. [ The second seating portion faces each other while forming a structure for fixing the second flexible substrate 132, for example, a space where the second flexible substrate 132 is seated from the third surface 110c of the support housing 111 May be provided to form a protruding latching ring. For example, on the third surface 110c of the support housing 111 in a [] shape. The second seating portion 114 may be an adhesive member between the second flexible substrate 132 and the third surface 110c of the support housing 111. [

12 is a view showing a process of forming a third flexible substrate in an electronic device according to various embodiments of the present invention. 13 is a view illustrating a process of assembling a substrate portion and a connection substrate portion to a housing in an electronic device according to various embodiments of the present invention.

12 and 13, a process of manufacturing the substrate unit 120 and the connection substrate unit 130 and a process of assembling the assembled substrate unit 120 and the connection substrate unit 130 to the housing 110 will be described. .

The substrate portion 120 and the connection substrate portion 130 of the embodiment of the present invention are formed on the third rigid substrate 123, the second flexible substrate 132, the second rigid substrate 122, the second flexible substrate 132 ), The first rigid substrate 121, and the third flexible substrate 133 in this order. Further, in the manufacturing process, the third flexible substrate 133 is formed of the extension substrate 136. [ Specifically, the extended substrate 136 is extended from the third flexible substrate 133 connected to the tile side of the first rigid substrate 121, the elliptical hole 135 formed at the center side, and the third flexible substrate 133 And may be formed as an extension portion 134. The third flexible substrate 133 is connected to the tile side of the first rigid substrate 121 by cutting the center portion of the hole 135 in the extended substrate 136 formed as described above, The connection terminal 133a having the opening 133b of the connection terminal 133a can be formed.

As described above, the third rigid substrate 123, the second flexible substrate 132, the second rigid substrate 122, the second flexible substrate 132, the first rigid substrate 121, the third flexible substrate 133, The substrate portions 120 and the substrates 131-133 formed in a row may be assembled in the housing 110 that implements the microelectronic device 100 in an 'e' shape.

The first rigid substrate 121 may be disposed on the first surface 110a of the housing 110 (S1). The first flexible substrate 131 may be fixed to the first seating part 113 formed on the third surface 110c of the housing 110 in accordance with the bending of the first flexible substrate 131 (S11).

The second rigid substrate 122 may be disposed on the second surface 110b of the housing 110 between the housing 110 and the support housing 111 (S2). The second flexible substrate 132 is bent to the third face 110c of the housing 110 and concretely the second seating portion 114 formed on the side face of the supporting housing 111 according to the bending of the second flexible substrate 132 (S12). The third rigid substrate 123 may be disposed on the upper surface of the support housing 111 so as to be spaced apart from the second rigid substrate 122 by a second surface 110b of the housing 110 ).

In this state, the first rigid substrate 121 disposed on the first surface 110a of the housing 110 and the third rigid substrate 123 disposed on the upper surface of the housing 110, specifically, the support housing 111, Is connected via the third flexible substrate 133 (S13). That is, the third flexible substrate 133 connected to the other side of the first rigid substrate 121 is bent to connect the connection terminal 133a of the third flexible substrate 133 to the ground connection pad (not shown) of the third rigid substrate 123 123b. The fourth rigid substrate 124 having the detection sensor is provided at a predetermined position of the third flexible substrate 133 so that the fourth rigid substrate 124 can be fixed to the fixing surface 112 (S13).

The opening 133b of the connection terminal 133a can be seated in a predetermined position of the ground connection pad 123b through a coupling support portion 133c protruding from the periphery of the connection terminal 133a. The third rigid substrate 123 may be electrically connected to the first rigid substrate 121 by soldering while the connection terminal 133a is placed on the ground connection pad 123b. Therefore, the substrate portion 120 and the connection substrate portion 130 of the present invention can be assembled to have a circulating connection structure in a closed loop shape. That is, the first rigid substrate 121 is connected to the third rigid substrate 123 through the first flexible substrate 131 and the third flexible substrate 133, and the second rigid substrate 122 is connected to the first flexible substrate The third rigid substrate 123 is connected to the second flexible substrate 132 and the third rigid substrate 123 through the first flexible substrate 131 and the second flexible substrate 132, And may have a closed loop electrical connection structure connected to the first rigid substrate 121 and the second rigid substrate 122 through the flexible substrate 133 and electrically connected to each other.

As described above, the electronic device 100 according to various embodiments of the present invention may be described as an ear jack, for example. As the various functions are integrated in the ear jack, the rigid boards 121-123 on which the various functions are mounted are electrically connected through the flexible flexible boards 131-133 so that the plurality of boards The substrates 121-123 can be stacked on each other, and the substrates 121-123 having various functions can be mounted in a narrow space.

In addition, the flexible substrates 131-133 have a smaller number of layers than the rigid substrates 121-123, so that the ground area is insufficient and the entire substrate members (the substrate part 120 and the connection substrate part The noise level of the modules 121a, 122a, and 123a, which may be mounted on the substrate portions 120, and the antenna radiation performance may be deteriorated due to the unevenness of the ground level of the antennas 130, 130, Since the substrates 121-123 and the substrates 131-133 are connected to each other in the form of a closed loop so that the first rigid substrate 121 and the third rigid substrate 121 are electrically connected to each other through the third flexible substrate 133, Since the ground region can be expanded and reinforced by electrically connecting the substrate 123, the entire ground level of the substrate member can be kept constant, thereby stabilizing the antenna radiation performance and facilitating the discharge of noise. Have a structure It will be possible.

For example, when the antenna radiation performance and reception sensitivity according to presence or absence of the third flexible substrate 133 are measured in the same electronic device 100, for example, the same ear jack, the measurement can be performed as shown in Table 1 below. Therefore, it can be seen that the third flexible substrate improves the overall average radiated power (TRP) performance and the total isotropic sensitivity (TIP) of the antenna.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments.

100: electronic device 110: housing
120: substrate part 121: first rigid substrate
122: second rigid substrate 123: third rigid substrate
130: connection substrate part 131: first flexible substrate
132: second flexible substrate 133: third flexible substrate

Claims (21)

A first rigid substrate on which a first module having at least one function is mounted;
A second rigid substrate on which at least one second module is over-mounted;
A first flexible substrate for electrically connecting the first rigid substrate and the second rigid substrate;
A third rigid substrate on which at least one third module is over-mounted; And
And a second flexible substrate for electrically connecting the second rigid substrate and the third rigid substrate,
Wherein the first rigid substrate and the third rigid substrate are electrically connected through a third flexible substrate.
The method according to claim 1,
Wherein the first end of the third flexible substrate is electrically connected to the first rigid substrate and the second end of the third flexible substrate is electrically connected to the third rigid substrate.
3. The method of claim 2,
The electronic device further includes a fourth rigid substrate and a fourth flexible substrate,
The third flexible substrate electrically connects the third rigid substrate and the fourth rigid substrate,
And the fourth flexible substrate electrically connects the first substrate and the fourth rigid substrate.
The method of claim 3,
And the fourth rigid substrate includes a detection sensor.
The electronic device according to claim 3,
And a housing having a first surface and a second surface in a direction different from the first surface and a third surface between the first surface and the second surface,
Wherein the first rigid substrate is disposed on the first surface of the housing,
The second rigid substrate is disposed on the second surface of the housing,
And the third rigid substrate is disposed spaced upward from the second rigid substrate to a second surface of the housing.
6. The method of claim 5,
And the fixing surface to which the fourth rigid substrate is fixed is further formed on the third surface of the housing.
The method according to claim 6,
And the fixing surface is protruded from the third surface in an inclined direction toward the first surface.
6. The method of claim 5,
And a support housing is further provided in a space separated from the second rigid substrate and the third rigid substrate.
9. The method of claim 8,
The first flexible substrate is disposed on the third surface of the housing,
The second flexible substrate is disposed on a side surface of the support housing,
And the third flexible substrate is disposed on a third side of the housing.
10. The method of claim 9,
A first seating portion for fixing the first flexible substrate is provided on the third surface of the housing,
And a second seating portion for fixing the second flexible substrate is further provided on a side surface of the support housing.
The method according to claim 1,
And the third rigid substrate is provided with a ground connection pad electrically connected to the third flexible substrate.
12. The method of claim 11,
And a connection terminal electrically connected to the ground connection pad is provided at an end of the third flexible substrate.
13. The method of claim 12,
And the connection terminal includes an opening formed concavely inward of the connection terminal.
14. The method of claim 13,
And the ground connection pad and the connection terminal are electrically connected by soldering.
15. The method of claim 14,
And an engaging support portion protruding in a direction perpendicular to the third flexible substrate is formed around the opening.
6. The method of claim 5,
Wherein the first rigid substrate, the first flexible substrate, the second rigid substrate, the second flexible substrate, and the third rigid substrate are formed in an "e" shape in the housing, Wherein the third rigid substrate disposed on the uppermost surface and the first rigid substrate disposed on the lower surface of the housing have a closed loop electrical connection structure.
The method according to claim 1,
Wherein the first rigid substrate, the second rigid substrate, and the third rigid substrate have a structure in which a plurality of layers are stacked,
Wherein the first flexible substrate, the second flexible substrate, and the third flexible substrate have a structure in which a plurality of layers are stacked,
Wherein the number of layers of the first rigid substrate, the second rigid substrate, and the third rigid substrate is greater than the number of layers of the first flexible substrate, the second flexible substrate, and the third flexible substrate.
housing;
A substrate portion provided on the housing and including a plurality of rigid substrates stacked in the same direction; And
And a connection substrate portion including a plurality of flexible substrates for electrically connecting one end and the other end of the rigid substrates adjacent to each other and bending the substrate,
Wherein one of the connection substrate portions is formed as a connection substrate having an electrically closed loop-shaped circulation connection structure by connecting two substrates arranged outermost in the rigid substrates.
19. The method of claim 18,
The housing having a first surface and a second surface in a direction different from the first surface and a third surface between the first surface and the second surface,
The substrate portion includes:
A first rigid substrate disposed on the first surface and on which at least one first module is mounted; a second rigid substrate adjacent to the first rigid substrate and stacked on the second surface, And a third rigid substrate adjacent to the second rigid substrate and stacked on the upper side of the second rigid substrate and stacked with at least one third module,
The connection substrate portion,
A first flexible substrate which is provided between the first rigid substrate and the second rigid substrate and is capable of bending, and which is located on the third surface of the housing and electrically connects the first rigid substrate and the second rigid substrate; ,
A second flexible substrate which is provided between the second rigid substrate and the third rigid substrate so as to be able to bend and electrically connects the second rigid substrate and the third rigid substrate,
And a third flexible substrate positioned on the third surface of the housing and connecting the first rigid substrate and the third rigid substrate.
20. The method of claim 19,
The third rigid substrate is provided with a ground connection pad electrically connected to the third flexible substrate,
And a connection terminal electrically connected to the ground connection pad is provided at an end of the third flexible substrate.
21. The method of claim 20,
Wherein the connection terminal includes an opening formed concavely inward of the connection terminal,
And the ground connection pad and the connection terminal are electrically connected by soldering.

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