KR20180002084U - Case of LED illuminating device and LED illuminating device having the same - Google Patents

Case of LED illuminating device and LED illuminating device having the same Download PDF

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Publication number
KR20180002084U
KR20180002084U KR2020160007618U KR20160007618U KR20180002084U KR 20180002084 U KR20180002084 U KR 20180002084U KR 2020160007618 U KR2020160007618 U KR 2020160007618U KR 20160007618 U KR20160007618 U KR 20160007618U KR 20180002084 U KR20180002084 U KR 20180002084U
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KR
South Korea
Prior art keywords
led
housing
bottom portion
led module
led lighting
Prior art date
Application number
KR2020160007618U
Other languages
Korean (ko)
Inventor
김영환
김민균
Original Assignee
(주)로그인디지탈
주식회사 디지탈조명
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주)로그인디지탈, 주식회사 디지탈조명 filed Critical (주)로그인디지탈
Priority to KR2020160007618U priority Critical patent/KR20180002084U/en
Publication of KR20180002084U publication Critical patent/KR20180002084U/en

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/237—Details of housings or cases, i.e. the parts between the light-generating element and the bases; Arrangement of components within housings or cases
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V15/00—Protecting lighting devices from damage
    • F21V15/01—Housings, e.g. material or assembling of housing parts
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/0055—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by screwing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

The present invention relates to an LED lighting apparatus case and an LED lighting apparatus having the LED lighting apparatus case, the LED lighting apparatus case for accommodating at least one LED module includes a housing having a cylindrical shape with one side opened, And a plurality of support portions protruding from the bottom portion inside the bottom portion to support the at least one LED module, wherein each of the support portions includes a bottom portion, a side wall portion extending from an edge of the bottom portion, There is provided an LED lighting device case having a fastening hole for screwing.

Description

FIELD OF THE INVENTION [0001] The present invention relates to a LED lighting device case and an LED lighting device having the LED lighting device case,

The present invention relates to an LED lighting device case and an LED lighting device having the LED lighting device case, and more particularly, to an LED lighting device having an LED lighting device case for improving heat dissipation characteristics and withstanding voltage characteristics.

In recent years, LED (Light Emitting Diode) has been widely used as an illumination device instead of a fluorescent lamp or an incandescent lamp. LEDs are in the spotlight because they have low power consumption, strong light intensity and do not emit harmful substances in the manufacturing process.

When such an LED lighting apparatus is used in a room, it is inserted and fixed in a certain case. For example, in an LED lighting apparatus, a plurality of LEDs are mounted on a circuit board, a circuit board is housed inside the case, and a power source device that supplies power to the circuit board may have a structure to be coupled to the case.

In general, an electronic device such as an LED lighting device is essentially required to control the power applied to an electrical load for stable operation of a load (i.e., a circuit element) because the input voltage is affected by external factors If the voltage fluctuates, an overload may be applied to the electric circuit, resulting in damage or malfunction of the electric circuit.

 On the other hand, for electronic devices such as LED lighting devices, there is a specification of withstand voltage (that is, insulation voltage) which is a basis for judging how much circuit elements can be protected from an external impact such as surge or lightning. The withstand voltage specification is a standard that must be met in all electronic equipment including various lighting equipment.

Particularly, semiconductor devices such as LEDs or driver ICs used in LED lighting devices are very vulnerable to such external shocks. Therefore, a lot of investment is made in additional protection circuit (circuit) and / or spatial design (mechanical) It is a reality. Also, in the case of a circuit board which is vulnerable to an external impact, a heat dissipation structure capable of efficiently treating heat is also a very important parameter.

However, at the same time, meeting the conditions such as the heat dissipation characteristics and the durability enhancement is limited by the present technical approach, and it is a reality that despite the cost to be overcome to overcome these limitations, it is practically not satisfactory.

SUMMARY OF THE INVENTION It is an object of the present invention to provide an LED lighting device case having improved withstand voltage characteristics and heat dissipation characteristics while reducing manufacturing costs, and an LED lighting device having the LED lighting device case.

According to an aspect of the present invention, there is provided an LED lighting apparatus case for accommodating at least one LED module, the LED lighting apparatus case including a housing having a cylindrical shape with one side opened, The housing comprises: a bottom portion; A side wall portion extending from an edge of the bottom portion; And a plurality of supports protruding from the bottom portion inside the bottom portion to support the at least one LED module, wherein each of the supports has a fastening hole for screwing with the LED module.

According to one embodiment, each of the supports comprises: a first portion in contact with the bottom portion; A second portion spaced from the bottom portion and supporting the LED module; And a third portion connecting the first portion and the second portion, wherein the fastening hole can penetrate the second portion.

According to one embodiment, the third portion may be inclined from the upper surface of the bottom portion.

According to one embodiment, the third portion may be perpendicular to the top surface of the bottom portion.

According to one embodiment, the second portion and the third portion may be convexly rounded arcuate in a direction away from the bottom portion.

According to one embodiment, the support portion may have a shape in which the bottom portion is recessed toward the open side.

According to an aspect of the present invention, there is provided an LED lighting device including: an LED module including at least one LED element; And a housing having an interior space in which the LED module is disposed, wherein the LED module is disposed on supports protruding from a bottom portion of the housing, each of the supports comprising: a first portion in contact with the bottom portion; A second portion spaced from the bottom portion and supporting the LED module; And a third portion connecting the first portion and the second portion.

According to one embodiment, the second portion may include a fastening groove for screwing with the LED module.

According to one embodiment, a gap region is defined between the bottom and the LED module, the height of the gap region being 1.0 mm to 10 mm.

According to one embodiment, the LED module includes an LED element and an LED circuit board on which the LED element is mounted, wherein the LED circuit board is formed of a metal base PCB (metal PCB), a composite epoxy materials (CEM) flame retardant composition base substrate.

According to embodiments of the present invention, as the LED module is disposed on the support portion protruding from the bottom portion of the housing, the bottom portion of the LED module and the housing can be spaced apart from each other by a predetermined distance or more. Thus, the capacitance between the two conductors (the bottom portion of the LED module and the housing) can be reduced, and as a result, the withstand voltage characteristic of the LED lighting device can be improved.

In addition, since the support portion can be formed by molding the bottom portion of the housing, the manufacturing process can be simplified, and it is not necessary to provide separate circuit elements for improving the withstand voltage characteristics, thereby reducing the manufacturing cost.

Furthermore, the LED circuit board can be used as a high heat dissipation substrate such as a metal base PCB (Metal PCB) in order to satisfy the required withstand voltage characteristics and to improve the heat radiation characteristics.

Consequently, it is possible to provide an LED lighting device with improved manufacturing cost while improving both withstanding voltage characteristics and heat dissipation characteristics.

1 is a schematic exploded perspective view for explaining a lighting apparatus case and a lighting apparatus having the lighting apparatus case according to an embodiment of the present invention.
2 is an enlarged view of a portion A in Fig.
FIG. 3A is a partial cross-sectional view showing a part of the housing of FIG. 1;
FIGS. 3B to 3D are partial cross-sectional views for explaining a modification of the housing of FIG.
Fig. 4A is a sectional view showing a part of Fig. 1 for explaining a state of engagement between the LED module and the housing. Fig.
4B and 4C are sectional views corresponding to FIG. 4A for explaining the coupling state of the LED module and the housing according to the comparative example.
5 to 7 are schematic exploded perspective views illustrating an LED lighting apparatus according to embodiments of the present invention.

The present invention is capable of various modifications and various embodiments, and specific embodiments are illustrated in the drawings and described in detail in the detailed description. It should be understood, however, that the intention is not to limit the invention to the particular embodiments, but to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. In the following description of the present invention, a detailed description of related arts will be omitted if it is determined that the gist of the present invention may be blurred.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In the present application, the terms "comprises" or "having" are used to specify that a feature, a number, a step, an operation, an element, a article, or a combination thereof, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

As used herein, the terms spatially relative, "below", "beneath", "lower", "above", "upper" May be used to easily describe one element or components as well as other components or components. Spatially relative terms should be understood to include, in addition to the orientation shown in the drawings, terms that include different orientations of the device during use or operation.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the like elements throughout. The description will be omitted.

1 is a schematic exploded perspective view for explaining a lighting apparatus case and a lighting apparatus having the lighting apparatus case according to an embodiment of the present invention. 2 is an enlarged view of a portion A in Fig. FIG. 3A is a partial cross-sectional view showing a part of the housing of FIG. 1; FIGS. 3B to 3D are partial cross-sectional views for explaining a modification of the housing of FIG.

1, 2 and 3A, an LED lighting device 1 according to an embodiment of the present invention may include an LED module 10, a ballast 20, and an LED lighting device case 30 . The LED lighting device case 30 may have an interior space for accommodating the LED module 10 and the ballast 20 and the LED module 10 and the ballast 20 may be disposed in the LED lighting device case 30 and / Can be fixed.

In detail, the LED module 10 may include the LED device 12 and the LED circuit board 14 on which the LED device 12 is mounted. The plurality of LED elements 12 may be provided, and the plurality of LED elements 12 may be two-dimensionally arranged to form a plurality of rows and columns. The LED circuit board 14 may have a generally rectangular flat plate shape. However, the embodiments of the present invention are not limited thereto. According to the concept of the present invention, the LED circuit board 14 may be a metal base PCB, a composite epoxy materials (CEM) base substrate, or a flame retardant composition (FR) base substrate. The metal base PCB may comprise a metallic material (eg, gold, silver, aluminum, and / or copper) and an insulating material (eg, T-PREG). A CEM (composite epoxy materials) base substrate may comprise, for example, a CEM-1 PCB or a CEM-3 PCB. The FR base substrate may comprise, for example, FR-1 PCB or FR-4 PCB. However, the embodiments of the present invention are not limited thereto. The LED circuit board 14 may include a plurality of first fastening holes 16 and may be fastened by fastening screws 18 passing through the first fastening holes 16 to support portions 36 of the housing 31 ). ≪ / RTI >

Although not shown, the LED module 10 may further include a controller (not shown) that stores driving information of the LED element 12 and / or a protection resistor (not shown) that is electrically connected to the LED element 12 have. In this example, two LED modules 10 are shown as being provided in the LED lighting apparatus case 30, but the embodiments of the present invention are not limited thereto. The LED module 10 may be provided in a single number or in three or more.

The LED lighting apparatus case 30 may include a housing 31 having a tubular shape with one side opened and a cover (not shown) covering an open side of the housing 31. The housing 31 may include a bottom portion 32, a side wall portion 34, and a support portion 36. In one example, the bottom portion 32 may have a generally rectangular planar shape (e.g., rectangular or square). As another example, the planar shape of the bottom portion 32 can be variously modified into a circular shape or a polygonal shape. The bottom portion 32 may include a plurality of through holes 33a. A part of the plurality of through holes 33a may be used as a fastening hole for fixing the housing 31 to the ceiling or the wall surface.

The side wall portion 34 may extend substantially perpendicularly from the edge of the bottom portion 32. For example, the sidewall portion 34 may have a cylindrical shape with a top and a bottom open. The bottom portion 32 and the side wall portion 34 can define the internal space of the LED lighting device case 30. [

The support 36 may be located inside the bottom 32 and may be configured to protrude from the bottom 32 to support and / or fix the LED module 10. For example, the support 36 includes a first portion P1 in contact with the bottom portion 32, a second portion P2 spaced from the bottom portion 32, and a first portion P1 and a second portion P2, And a third portion P3 connecting the first portion P3 and the second portion P3. The second portion P2 may include a second fastening hole 37 for screwing the LED module 10 and the support portion 36 and may be substantially parallel to the upper surface of the bottom portion 32. [ Here, the upper surface of the bottom portion 32 may be defined as one surface of the bottom portion 32 facing the LED circuit board 14. [

According to one embodiment, the support portion 36 may be formed such that a part of the bottom portion 32 is recessed toward one open side of the housing 31. For example, the support portion 36 may be formed by molding the bottom portion 32. For example, a press-molding process or the like can be used for the molding of the bottom portion 32. 3A, the support portion 36 and the bottom portion 32 may be connected to each other to form an integral body, and a groove 33b may be defined under the support portion 36. [

According to another embodiment, the support 36 may be formed and attached to the upper surface of the bottom portion 32. For example, a method such as welding can be used for fixing the support portion 36. [ Accordingly, as shown in Fig. 3D, a void space may be defined between the bottom portion 32 and the support portion 36. [

 The LED module 10 is disposed on the second portion P2 of the support portion 36 so as to emit light on one open side of the housing 31 and is connected to the first fastening hole 16 of the LED circuit board 14 And a fastening screw 18 passing through the second fastening hole 37 of the support portion 36. [ The fastening screw 18 may be, for example, a bolt or a screw, but the embodiments of the present invention are not limited thereto.

According to the embodiments, the plurality of supports 36 can support one LED module 10. [ In this example, four support portions 36 arranged to support the corner portions of the LED module 10 and one support portion 36 arranged to support the central portion of the LED module 10 are shown, The embodiments of the invention are not limited thereto. The number and position of the supports 36 for supporting one LED module 10 can be variously modified. The bottom portion 32, the side wall portion 34, and the support portion 36 of the housing 31 may be made of the same material. For example, the bottom portion 32, the side wall portion 34, and the support portion 36 may be made of a metal material (e.g., iron) to effectively emit heat generated in the LED module 10. The cover (not shown) may include a light-transmitting plate capable of diffusing and transmitting light emitted from the LED module 10.

The shape of the support portion 36 described above can be variously implemented. For example, as shown in FIG. 3B, the second portion P2 and the third portion P3 may be convexly rounded toward the LED module 10. As another example, the third portion P3 may be substantially perpendicular to the top surface of the bottom portion 32, as shown in Fig. 3C.

The ballast 20 can be directly coupled to and fixed to the bottom portion 32 of the housing 31. [ In one example, the ballast 20 may be disposed between the two LED modules 10. As another example, unlike what is shown, the ballast 20 may be disposed on one side of either of the two LED modules 10. The pair of LED modules 10 may be electrically connected to each other through a connection cable (not shown), and the ballast 20 may be connected to any one of the pair of LED modules 10. [ The ballast 20 can convert external AC power to DC power and supply it to the LED modules 10.

Fig. 4A is a sectional view showing a part of Fig. 1 for explaining a state of engagement between the LED module and the housing. Fig. 4B and 4C are sectional views corresponding to FIG. 4A for explaining the coupling state of the LED module and the housing according to the comparative example.

4A, the LED module 10 is disposed on the second portion P2 of the support portion 36 so that a gap region (not shown) is formed between the LED module 10 and the bottom portion 32 of the housing 31 GR) can be defined. The gap region GR may have a height h defined by the distance between the LED module 10 and the bottom portion 32 of the housing 31. The height h of the gap region GR may have a size required to satisfy the withstand voltage specification of the LED lighting apparatus 1. [ For example, the height h of the gap region GR may be at least 1 mm or more. Preferably, the height h of the gap region GR may be between 1 mm and 10 mm.

In general, the withstand voltage characteristic of an LED lighting device can be influenced by the capacitance between the LED module and the LED lighting device case (i.e., the housing) to which the LED module is coupled. 4B, when the LED module 10 is directly coupled to the bottom portion 32 of the housing 31, the distance between the LED module 10 and the bottom portion 32 becomes very small (In other words, the effective contact area between the LED module 10 and the housing 31 can be increased). In this case, the distance between the two conductors (i.e., the LED module 10 and the bottom portion 32) is reduced as shown in the following equation (1), and the capacitance C between the two conductors can be increased. Accordingly, as shown in the following equation (2), the capacitance reactance X c between the two conductors may become small and the leakage capacitance may become large, and as a result, the withstand voltage characteristic of the LED lighting apparatus may deteriorate. That is, the LED illumination device of FIG. 4B may be vulnerable to an external impact.

Figure utm00001
(One)

Where C is the capacitance,? Is the dielectric constant of the dielectric, A is the area of the electrode, and d is the electrode spacing.

Figure utm00002
(2)

Where X c is the capacitance reactance, f is the frequency, and C is the capacitance.

However, according to the embodiments of the present invention, the LED module 10 and the bottom portion 32 of the housing 31 are arranged in the gap 31, as the LED module 10 is disposed on the support portion 36 of the housing 31, Can be spaced apart from each other by the height h of the region GR. Thus, the distance between the two conductors (i.e., the LED module 10 and the bottom portion 32) can be increased and the capacitance can be reduced (the effective contact area between the LED module 10 and the housing 31 is . In addition, even if the LED circuit board 14 is used as a metal PCB for high heat dissipation characteristics, an increase in capacitance due to an increase in the effective permittivity is caused by an increase in the separation distance between the LED module 10 and the housing 31 Can be compensated for by the capacitance reduction according to the capacitance. As a result, it is possible to provide the LED lighting apparatus 1 in which the withstand voltage characteristic and the heat radiation characteristic are both improved.

4C, a rubber bumper 38 is interposed between the LED module 10 and the bottom portion 32 of the housing 31 to connect the LED module 10 to the bottom portion of the housing 31 It is possible to consider screwing them on the base 32. However, in this case, the manufacturing process may become complicated and the cost may increase. In the case of the present invention, since the supporting portion 36 is formed through the molding process using the press-molding process or the like, the manufacturing process can be simplified, and it is not necessary to provide a separate circuit element for improving the withstand voltage characteristic, The cost can be reduced.

5 to 7 are schematic exploded perspective views illustrating an LED lighting apparatus according to embodiments of the present invention. In order to simplify the explanation, the difference from the LED lighting apparatus 1 will be mainly described.

Referring to FIG. 5, the LED lighting device 2 may include an LED module 10, a ballast (not shown), and an LED lighting device case 30. The LED lighting apparatus case 30 may include a housing 31 having a rectangular parallelepiped shape with one side opened and a cover (not shown) covering one open side of the housing 31. The LED module 10 may be provided in a single unit and disposed and fixed on the supports 36 of the housing 31. The stabilizer (not shown) may be directly coupled to the bottom portion 32 of the housing 31 at one side of the LED module 10. Other configurations may be the same as described with reference to the LED lighting apparatus 1 and similar.

Referring to FIG. 6, the LED lighting device 3 may include an LED module 10, a ballast (not shown), and an LED lighting device case 30. The LED lighting device case 30 may include a housing 31 having a cylindrical shape with one side opened and a cover (not shown) covering an open side of the housing 31. The LED module 10 may be provided in a single unit and disposed and fixed on the supports 36 of the housing 31. The LED module 10 may include an LED circuit board 14 and a plurality of LED elements 12 mounted on the LED circuit board 14. [ In this example, the LED circuit board 14 may have a generally circular planar shape. The stabilizer (not shown) may be directly coupled to the bottom portion 32 of the housing 31 at one side of the LED module 10. Other configurations may be the same as described with reference to the LED lighting apparatus 1 and similar.

Referring to FIG. 7, the LED lighting device 4 may include an LED module 10, a ballast (not shown), and an LED lighting device case 30. The LED lighting device case 30 may include a housing 31 having a cylindrical shape with one side opened and a cover (not shown) covering an open side of the housing 31. In this example, two LED modules 10 can be arranged and fixed on the supports 36 of the housing 31. [ Each of the LED modules 10 may include an LED circuit board 14 having a semicircular planar shape and a plurality of LED elements 12 mounted on the LED circuit board 14. [ The stabilizer (not shown) may be directly coupled to the bottom 32 of the housing 31 between one side of the LED module 10 or a pair of LED modules 10. Other configurations may be the same as described with reference to the LED lighting apparatus 1 and similar.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is evident that many alternatives, modifications and variations will be apparent to those skilled in the art. It will be understood. It is therefore to be understood that the above-described embodiments are illustrative and not restrictive in every respect.

1, 2, 3, 4: LED lighting device
10: LED module
20: Ballast
30: LED lighting case
31: Housing
32:
34:
36: Support

Claims (5)

An LED lighting device case for accommodating at least one LED module,
And a housing having a tubular shape whose one surface is open,
Said housing comprising:
Bottom;
A side wall portion extending from an edge of the bottom portion; And
And a plurality of supports projecting from the bottom inside the bottom to support the at least one LED module,
Each of the supports having a fastening hole for threaded engagement with the LED module. The method according to claim 1,
And the support portion is formed by recessing the bottom portion toward the open side. An LED module including at least one LED element, and an LED circuit board on which the at least one LED element is mounted; And
And a housing having an inner space in which the LED module is disposed,
Wherein the LED circuit board is disposed on supports formed by recessing a bottom portion of the housing,
And a gap region is formed between the bottom portion and the LED circuit board. The method of claim 3,
And the height of the gap region is 1 mm to 10 mm. The method of claim 3,
Wherein the LED circuit board comprises a metal base PCB, a composite epoxy materials base (CEM) substrate, or a flame retardant composition (FR) base substrate.
KR2020160007618U 2016-12-28 2016-12-28 Case of LED illuminating device and LED illuminating device having the same KR20180002084U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102574734B1 (en) 2022-12-29 2023-09-06 주식회사 바이더엠 Led lighting apparatus with improved led discoloration prevention and maintenance function

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JP2005302789A (en) * 2004-04-06 2005-10-27 Funai Electric Co Ltd Mounting structure of printed circuit board
US20080019128A1 (en) * 2006-07-19 2008-01-24 Dj Auto Components Corp. LED lamp
JP2010135639A (en) * 2008-12-05 2010-06-17 Sanyo Electric Co Ltd Support structure for printed circuit board
KR20110000435U (en) * 2009-07-08 2011-01-14 송봉관 Connection structure of LED lighting have sensor
KR101149784B1 (en) * 2011-02-28 2012-06-08 주식회사 진우씨스템 A duct type led lighting apparatus
CN202791719U (en) * 2012-08-13 2013-03-13 惠州市世和上品照明有限公司 Novel light-emitting diode (LED) integrated lamp panel
KR20130075012A (en) * 2011-12-27 2013-07-05 (주)효성조명 Enhancement radiation of heat led lights
KR20160004409U (en) * 2015-06-15 2016-12-23 주낙형 Lighting equipment

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005302789A (en) * 2004-04-06 2005-10-27 Funai Electric Co Ltd Mounting structure of printed circuit board
US20080019128A1 (en) * 2006-07-19 2008-01-24 Dj Auto Components Corp. LED lamp
JP2010135639A (en) * 2008-12-05 2010-06-17 Sanyo Electric Co Ltd Support structure for printed circuit board
KR20110000435U (en) * 2009-07-08 2011-01-14 송봉관 Connection structure of LED lighting have sensor
KR101149784B1 (en) * 2011-02-28 2012-06-08 주식회사 진우씨스템 A duct type led lighting apparatus
KR20130075012A (en) * 2011-12-27 2013-07-05 (주)효성조명 Enhancement radiation of heat led lights
CN202791719U (en) * 2012-08-13 2013-03-13 惠州市世和上品照明有限公司 Novel light-emitting diode (LED) integrated lamp panel
KR20160004409U (en) * 2015-06-15 2016-12-23 주낙형 Lighting equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102574734B1 (en) 2022-12-29 2023-09-06 주식회사 바이더엠 Led lighting apparatus with improved led discoloration prevention and maintenance function

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