DE202013009386U1 - Semiconductor lighting device - Google Patents

Abstract

A semiconductor light-emitting device (1; 21), comprising - a housing (2, 3) composed of a first housing part (2) and a second housing part (3), - an electronics (14, 24) accommodated in the housing (2, 3) and At least one light source module (13) having at least one semiconductor light source arranged on a substrate, the electronics (14, 24) being attached to the first housing part (2), the first housing part (2) having an at least inside elevation (10 23), to which the at least one light source module (13) is attached, and - the second housing part (3) has at least one housing opening (20) opposite the elevation (10;

Description

The invention relates to a semiconductor luminescent device which has a housing composed of a first housing part and a second housing part, an electronics accommodated in the housing and at least one LED module having at least one semiconductor light source arranged on a substrate. The invention is particularly applicable to motor vehicles, in particular as or with a headlight.

In order to spread LED systems even further, they must be downsized, since in many applications only a limited space is available. In addition, there is often the need to provide a variety of electrical, mechanical, optical and thermal interfaces that drive up costs. In particular, the cost of a cooling of an LED system represents a major obstacle to the further spread of LED applications in the mass market, z. B. as a replacement of halogen lamps by LED systems. In today's systems, powerful heat sinks (eg heat sinks) are geometrically complicated in design space.

LED strings with n> = 1 series-connected LED chips are known. The LED chips are usually applied either on a metal core board or on a flexible board, which in turn are applied to a heat sink. The electronics are usually housed in a separate housing (and thus spatially separated) and connected to the light sources via one or more wiring harnesses. In case of failure of the light function usually the entire lamp must be replaced, since only the electronics is accessible. Replaceable standard modules are not available on the market.

Furthermore, today's LED systems are generally complex, in relation to the respective application and require a costly and time-consuming development. It is the object of the present invention to at least partially overcome the disadvantages of the prior art.

This object is achieved according to the features of the independent claims. Preferred embodiments are in particular the dependent claims.

The object is achieved by a semiconductor luminescent device comprising a housing composed of a first housing part and a second housing part, an electronics accommodated in the housing and at least one light source module having at least one semiconductor light source arranged on a substrate, the electronics being attached to the first housing part is, the first housing part has an at least inside elevation, on which the at least one light source module is mounted and the second housing part has at least one elevation of the opposite housing opening.

This semiconductor light-emitting device has the advantage that, by providing the elevation, a very low heat resistance for dissipating heat can be achieved from the at least one light source module arranged thereon. This in turn is a use z. B. smaller heat sink and / or low power fan possible. Since the thermal paths of the light source module and the electronics are initially disconnected, special high-temperature components can be dispensed with in the electronics, because heating of the electronics by the generally warmer semiconductor light sources does not occur. The housing also provides standardized interfaces to the environment, eg. As a thermal, electrical and / or lighting interface, while the light source module and the electronics can be easily replaced modular.

The semiconductor luminescent device may also be referred to as a light generator or "light engine". This may serve in particular as a light generator or light generating unit for a luminaire. For this purpose, the luminaire may, in particular, have one or more optics for beam shaping of the light emitted by the semiconductor luminous device, eg. As reflectors, screens and / or lenses.

A referencing to a downstream optics of the lamp may, for. B. via mounting tabs, in particular over three or more mounting tabs, which lie with the light source module on a plane or are in any fixed relation to it.

The light source module may also have one or more electrical or electronic components in addition to the at least one semiconductor light source on the substrate, for. As resistors, coils, capacitors, etc. Alternatively may be present on the light source module except the at least one semiconductor light source, no electrical or electronic component.

The semiconductor luminescent device may have one or more elevations, each having one or more light source modules attached thereto. Each collection may be associated with its own housing opening, or a housing opening may be associated with several surveys.

The substrate, which may also be referred to as a submount, may be for example Ceramics exist, for. B. AlN. It is a development to achieve a particularly low thermal resistance between the substrate and the survey that the substrate is soldered to the survey.

Preferably, the at least one semiconductor light source comprises at least one light-emitting diode. If several LEDs are present, they can be lit in the same color or in different colors. A color can be monochrome (eg red, green, blue, etc.) or multichrome (eg, white). The light emitted by the at least one light-emitting diode can also be an infrared light (IR LED) or an ultraviolet light (UV LED). Several light emitting diodes can produce a mixed light; z. B. a white mixed light. The at least one light-emitting diode may contain at least one wavelength-converting phosphor (conversion LED). The phosphor may alternatively or additionally be arranged remotely from the light-emitting diode ("remote phosphor"). The at least one light-emitting diode can be in the form of at least one individually housed light-emitting diode or in the form of at least one LED chip. Several LED chips can be mounted on a common substrate ("submount"). The LED chips and / or the LED strands can be electrically connected in series and / or in parallel and / or individually. The at least one light emitting diode may be equipped with at least one own and / or common optics for beam guidance, z. At least one Fresnel lens, collimator, and so on. Instead of or in addition to inorganic light emitting diodes, z. Based on InGaN or AlInGaP, organic LEDs (OLEDs, eg polymer OLEDs) can generally also be used. Alternatively, the at least one semiconductor light source z. B. have at least one diode laser. The at least one diode laser may be followed by a wavelength-converting phosphor, z. B. in a LARP ("Laser Activated Remote Phosphor") - arrangement.

It is particularly preferred that the light source module is a so-called "chip-on-board" module or "COB module" in which LED chips are applied directly to the substrate, in particular by means of a surface mounting technique, SMT. It is particularly preferred that all applied to the substrate components (LED chips, possibly electrical components, etc.) surface mount devices (SMDs, "Surface Mounted Devices") are, since they can then be applied in a joint step, eg. B. by means of a reflow oven.

The semiconductor light sources may be connected in series and / or in parallel. In particular, several series-connected semiconductor light sources ("strands") may be energized independently of each other. The strands may be electrically connected in parallel. Several strands may be arranged side by side on a common bump or on a common substrate.

The semiconductor light sources disposed on a substrate or on a bump may be similar (eg, in terms of their color, their binning, etc.) or may be different, e.g. B. have different white spectra, etc.

The light source module may also have at least one shutter and / or at least one sensor. The at least one sensor may in particular be a temperature sensor, a brightness sensor and / or a color sensor. The temperature sensor may be such. B. be implemented by means of an applied on the substrate NTC resistor.

By the survey opposite housing opening a light emission outside of the housing is made possible.

The first housing part, the second housing part and / or the elevation may be made to inexpensively provide a high thermal conductivity of metal, preferably of aluminum or magnesium.

The first housing part and / or the second housing part can be produced for example by die casting or extrusion.

The elevation may be formed as a solid body for effective heat dissipation from the light source module.

The housing may not be potential-free, but z. B. are at a cathode potential. However, it would be possible to produce a potential separation by means of suitable measures (for example by means of an electrically non-conductive heat pad between the elevation and the housing). The housing may be as well as floating.

It is an embodiment that the survey is passed without contact through a recess in a circuit board of the electronics. This results in the possibility of a variable positioning of the survey in the housing, z. B. centrally or eccentrically with respect to a housing opening having side. The fundamentally arbitrary position of the elevation and thus of the semiconductor module leads to a very flexible concept that is suitable for a large number of applications (eg, automotive, construction machines, trucks, etc.). In addition, a very simple electrical connection without cable is possible. The recess may be, for example, a hole or a laterally open recess in the circuit board of the electronics.

It is a further development that the electronics has electrical and / or electronic components for operating the at least one light source module, that is, a driver electronics or assumes the function of a ballast.

It is still a development that the circuit board of the electronics z. B. is a FR4 or FR5 board or a metal core board.

Power components of the electronics can be connected to the housing for improved heat dissipation, for example via cooling domes in the housing and / or by means of heat pads or thermal compound.

It is still an embodiment that the survey is an integral part of the first housing part. It has therefore been produced together with the remaining area of the first housing part. This may facilitate production, in particular in the case of elevations which are not undercut. Also, a thermal resistance of the light source module to an outer wall of the first housing part is thereby kept particularly small.

It is an alternative embodiment that the survey is a separately manufactured, connected to the first housing part component. This allows the use of more complex, possibly multi-piece, surveys.

It is a further embodiment that light emitted by the light source module falls through the housing opening to the outside. The associated light source module is located in particular within the housing. Such a configuration allows a particularly compact and insensitive design.

It is yet another embodiment that the survey projects into or through the housing opening and the light source module is arranged outside the housing. This allows a more varied alignment of the at least one light source module as well as avoiding possible shadowing of light by the second housing part. In particular, for this embodiment, an elongated survey is preferred, for. B. has an elongated cylindrical ("finger-shaped" or pin-shaped) basic shape.

It is also an embodiment that the survey projects into the housing opening and flush with an outer side of the second housing part.

It is also an embodiment that the elevation protrudes through the housing opening and the light source module is angled aligned to a normal direction of the housing opening.

It is also an embodiment that the survey is pin-shaped and the light source module is arranged on a side surface of the survey outside of the housing. In particular, this makes it possible to align the light source module at right angles to the normal direction of the housing opening.

It is still an embodiment that the elevation is shaped like a truncated pyramid and the light source module is arranged on a (smaller) top surface. The pyramidal stump-like elevation may merge with its (larger) base in a bottom of the first housing part. Due to their large volume, such a survey allows a particularly effective heat dissipation from an attached light source module and is also easy to manufacture. Alternatively, however, other forms are possible, for. B. a cuboid, cylindrical or frusto-conical elevation.

It is yet another embodiment that the housing opening is arched by a translucent cover. This can protect the light source module associated with this housing opening, both when it is in the housing and when it is outside the housing.

The cover may also serve as optics and has at least one beam-forming property.

It is also a further embodiment that the cover seals the housing opening, in particular hermetically seals, which thereby reliably prevents penetration of protection, dust or moisture into the housing as well as to the light source module. The interior can be filled with an inert gas, for example nitrogen.

It is also a further embodiment that the housing has a dense interior. For this purpose, other possibly existing openings in the housing are sealed accordingly, for. B. a sealed by a connector element opening ("interface opening"). Also may be present for a seal between the first housing part and the second housing part.

It is a general development that the housing has at least one interface opening for receiving an interface element, for. B. a connector element (socket, plug, etc.) has.

It is also a further embodiment that the housing has a cuboid basic shape, which facilitates use of conventional component shapes, for. B. of printed circuit boards. However, the housing may also have any other suitable basic shape, in particular a low basic shape, for. B. a disc-shaped basic shape.

It is still an embodiment that an outside portion of the first housing part is provided as a thermal interface. This sub-area may thus be especially provided and arranged to be in thermal contact with a heat sink, for. B. a cooling system. The subregion may in particular be a bottom of the housing or of the first bottom part, which in particular faces away from the housing side of the second housing part, which has at least one housing opening.

The cooling system may in particular have or be a heat sink, but may additionally or alternatively also have a cooling fan and / or a heat pipe ("heat pipe"), etc. A cooling system, z. As a heat pipe, can protrude into the interior of the survey and dissipate the heat generated at the LED chips directly.

It is also an embodiment that the semiconductor luminescent device is a vehicle lighting device. It may in particular be installed as a light generator in a vehicle lamp, z. B. in a headlight. The object is consequently also achieved by a luminaire, in particular a vehicle headlamp, with a semiconductor luminescent device as described above.

The above-described characteristics, features, and advantages of this invention, as well as the manner in which they will be achieved, will become clearer and more clearly understood in connection with the following schematic description of exemplary embodiments which will be described in detail in conjunction with the drawings. In this case, the same or equivalent elements may be provided with the same reference numerals for clarity.

1 shows an oblique view of an exploded view of a semiconductor light emitting device according to a first embodiment with a board of electronics, on which a connector element is arranged;

2 shows an oblique view of a first housing part of a semiconductor light emitting device according to a second embodiment;

3 shows an oblique view of an exploded view of the semiconductor light emitting device according to the first embodiment with the board on which now electrical and / or electronic components are arranged;

4 shows an oblique view of an exploded view of the semiconductor light emitting device according to the first embodiment with the board on which now both the connector element and the electrical and / or electronic components are arranged;

5 shows the semiconductor light emitting device according to the first embodiment 4 from an opposite side;

6 shows the semiconductor light emitting device according to the first embodiment in a view obliquely from below;

7 shows an oblique view of the semiconductor light emitting device according to the first embodiment in the assembled state; and

8th shows a sectional view in an oblique view of a section of the semiconductor light emitting device according to the first embodiment in the assembled state.

1 shows an exploded view of a semiconductor light emitting device in an oblique view 1 , The semiconductor light device 1 has a trough-shaped first housing part 2 and a second, shallow trough-shaped second housing part 3 on. The housing parts 2 . 3 consist of aluminum or magnesium, with the first housing part 2 z. B. may be made by die casting and the second housing part 3 z. B. may be made by deep drawing.

Both housing parts 2 . 3 form a housing with a flat cuboid basic shape. The two housing parts 2 . 3 are about respective case edges 4 respectively. 5 put on each other and on the corner screws 6 screwed together. On an inside 7 a floor area 8th of the first housing part 2 is rectangular pedestal 9 placed on the a truncated pyramidal elevation 10 is placed with its base.

The assessment 10 comes with the first housing part 2 z. B. by means of a screw 11 screwed. The assessment 10 is a solid aluminum body. On a deck surface 12 the survey 10 is a light source module 13 attached, in particular soldered. The light source module 13 has a substrate with a plurality of LED chips arranged thereon (not shown) and is therefore designed as a CoB module. Light source module 13 can then also be called an LED module.

Between the case edges 4 respectively. 5 becomes a circuit board 14 inserted, which has a rectangular recess 15 for the spaced or contactless or gap-prone implementation of the survey 10 having. At a bottom 16 the board 14 there is a connector element in the form of a socket 17 , which in a corresponding lateral opening (interface opening 18 ) of the first housing part 2 fits.

At the lateral edge of the first housing part 2 also go outside three vertically projecting retaining tabs 19 for fastening the housing 2 . 3 off, z. B. by means of a screw.

The second housing part 3 has one opposite the survey 10 arranged housing opening 20 in which the survey 10 in particular slitable is insertable.

2 shows an oblique view of a first housing part 22 a semiconductor luminescent device 21 according to a second embodiment. The assessment 23 now has a cuboid basic shape with rounded longitudinal edges and is an integral part of the first housing part 22 (and not made separately). The first housing part 22 like alternative to the first housing part 2 be used.

3 shows an oblique view of another exploded view of the semiconductor luminescent device 1 , The board 14 is now with electrical and / or electronic components 24 equipped, which for operating the at least one light source module 13 or the LED chips arranged thereon are provided.

Little heat developing components 24 are exemplary here at one of the housing opening 20 facing front or top 25 the board 14 arranged, a more heat-developing power device, for. B. a power semiconductor, 24a however, at the back or bottom 16 the board 14 , The socket 17 is not shown.

4 shows an exploded view of the semiconductor luminescent device in an oblique view 1 with the elements 1 and 3 , For, in particular hermetic, sealing the interior of the housing 2 . 3 has the interface opening 18 on its outside edge a seal 26 on. At the socket 17 is also a circumferential sealing plate 27 for attachment to the seal 26 available. Another circumferential seal 28 is on the edge of the case 5 attached to a possible gap between the first housing part 2 and the second housing part 3 to avoid.

For sealing the housing opening 20 is a cover 29 present, which one on the underside with a circumferential seal 30 provided annular support plate 31 having. A central opening in the platen 31 is of a dome-like translucent section 32 covered. The cover 29 is about screws 33 with the front 34 of the second housing part 3 screwed.

5 shows the semiconductor luminescent device 1 according to the first embodiment 4 from obliquely above from an opposite side, which the interface opening 18 turned away.

6 shows the semiconductor luminescent device 1 in a view from diagonally below.

7 shows an oblique view of the semiconductor luminescent device 1 in the assembled state. The retaining tabs 19 serve for the positioning of the light source module 13 ,

8th shows as a sectional view in an oblique view a section of the semiconductor luminescent device 1 in the assembled state. The comparatively high heat generating power modules 24a the electronics 14 . 24 are opposite one from the inside 7 of the floor area 8th of the first housing part 2 in the interior 35 protruding stage 36 arranged. Between the stage 36 and the service modules 24a is a thermally well conductive pillow ("heat pad") 37 introduced to provide improved thermal connection to the stage 36 to reach.

In an operation of the semiconductor luminescent device 1 , z. As in a vehicle headlight, heat the LED chips of the light source module 13 as well as - albeit only to a small extent - the components 24 the electronics. The light source module 13 and the board 14 or the components arranged thereon 24 , especially 24a , are through the floor or floor area 8th of the first housing part 2 far apart and thus only slightly thermally coupled. Consequently, heat is transferred over the elevation 10 effectively from the light source module 13 dissipated without the components 24 the electronics continue to heat up. To the light source module 13 and the board 14 or the components arranged thereon 24 . 24a To further decouple thermally, the ground area likes 8th be connected to a cooling system or heat sink (not shown) or be provided in other words as a thermal interface to a cooling system o. Ä.

Although the invention has been further illustrated and described in detail by the illustrated embodiments, the invention is not so limited and other variations can be derived therefrom by those skilled in the art without departing from the scope of the invention.

Generally, "on", "an", etc. may be taken to mean a singular or a plurality, in particular in the sense of "at least one" or "one or more", etc., as long as this is not explicitly excluded, e.g. B. by the expression "exactly one", etc.

Also, a number may include exactly the specified number as well as a usual tolerance range, as long as this is not explicitly excluded.

LIST OF REFERENCE NUMBERS

1

Semiconductor lighting device

2

first housing part

3

second housing part

4

housing edge

5

housing edge

6

screw

7

inside

8th

Floor area of the first housing part

9

base

10

survey

11

screw

12

Top surface of the survey

13

Light source module

14

circuit board

15

recess

16

Bottom of the board

17

Rifle

18

Interface opening of the first housing part

19

holding pocket

20

Housing opening of the second housing part

21

Semiconductor lighting device

22

first housing part

23

survey

24

electrical and / or electronic component

24a

Power semiconductor

25

Top of the board

26

poetry

27

circumferential sealing plate

28

circumferential sealing plate

29

cover

30

poetry

31

platen

32

translucent section

33

screw

34

Front of the second housing part

35

inner space

36

step

37

heat Packs

Claims (15)

Semiconductor lighting device ( 1 ; 21 ), comprising - a first housing part ( 2 ) and a second housing part ( 3 ) assembled housing ( 2 . 3 ), - one in the housing ( 2 . 3 ) electronics ( 14 . 24 ) and - at least one light source module ( 13 ), which has at least one semiconductor light source arranged on a substrate, - the electronics ( 14 . 24 ) on the first housing part ( 2 ), - the first housing part ( 2 ) an at least inside elevation ( 10 ; 23 ), at which the at least one light source module ( 13 ) is mounted and - the second housing part ( 3 ) at least one survey ( 10 ; 23 ) opposite housing opening ( 20 ) having. Semiconductor lighting device ( 1 ; 21 ) according to claim 1, wherein the survey ( 10 ) contactlessly through a recess ( 15 ) in a printed circuit board ( 14 ) of the electronics is passed. Semiconductor lighting device ( 21 ) according to one of claims 1 or 2, wherein the survey ( 23 ) an integral part of the first housing part ( 2 ). Semiconductor lighting device ( 1 ) according to one of claims 1 or 2, wherein the survey ( 10 ) a separately manufactured, with the first housing part ( 2 ) is connected component. Semiconductor lighting device ( 1 ) according to one of the preceding claims, wherein of the light source module ( 13 ) radiated light through the housing opening ( 20 ) falls outside. Semiconductor lighting device ( 1 ; 21 ) according to any one of claims 1 to 4, wherein the survey ( 10 ; 23 ) in or through the housing opening ( 20 ) and the light source module ( 13 ) outside the housing ( 2 . 3 ) is arranged. Semiconductor lighting device ( 1 ; 21 ) according to claim 6, wherein the survey ( 10 ; 23 ) in the housing opening ( 20 ) protrudes and flush with an outside of the second housing part ( 3 ) completes. Semiconductor lighting device ( 1 ; 23 ) according to claim 6, wherein the survey ( 10 ) through the housing opening ( 20 ) and the light source module ( 13 ) angled to a normal direction of the housing opening ( 20 ) is aligned. Semiconductor lighting device ( 1 ; 23 ) according to claim 8, wherein the survey ( 10 ) is shaped pin-shaped and the light source module ( 13 ) at a Side surface of the survey ( 10 ) outside the housing ( 2 . 3 ) is arranged. Semiconductor lighting device ( 1 ) according to one of claims 1 to 8, wherein the survey ( 10 ) is truncated pyramid-shaped and the light source module ( 13 ) on a top surface ( 12 ) of the survey ( 10 ) is arranged. Semiconductor lighting device ( 1 ; 21 ) according to one of the preceding claims, wherein the housing opening ( 20 ) from a translucent cover ( 29 ) is arched over. Semiconductor lighting device ( 1 ; 21 ) according to one of the preceding claims, wherein the housing ( 2 . 3 ) a dense interior ( 35 ) having. Semiconductor lighting device ( 1 ; 21 ) according to one of the preceding claims, wherein the housing ( 2 . 3 ) has a cuboid basic shape. Semiconductor lighting device ( 1 ; 21 ) according to one of the preceding claims, wherein an outside portion ( 8th ) of the first housing part ( 2 ) is provided as a thermal interface. Semiconductor lighting device ( 1 ; 21 ) according to one of the preceding claims, wherein the semiconductor luminescent device is a vehicle lighting device.

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