KR20170142045A - Flash module and Mobile Device including the same - Google Patents

Abstract

The present invention relates to a light emitting module, a flash module, and a terminal including the same. The flash module according to an embodiment comprises: a plurality of light emitting chips which include a semiconductor layer, a phosphor layer disposed on one surface of the semiconductor layer, and a plurality of electrodes disposed on a surface opposite to the surface of the semiconductor layer; a light emitting module which includes an opaque molding unit surrounding the plurality of light emitting chips to expose the upper surface of the phosphor layer and the bottoms of the plurality of electrodes to the outside; a frame which is disposed on the light emitting module; and a lens unit which is disposed on the frame. A flash module according to an embodiment comprises: a light emitting module (100) which includes a flip-type first light emitting chip (121) and a flip-type second light emitting chip (122) having correlated but different color temperatures (CCT), and an opaque molding unit (132) surrounding the sides of the flip-type first light emitting chip (121) and the flip-type second light emitting chip (122); a frame (220) which is disposed on the light emitting module (100); and a lens unit (230) which is disposed on the frame. An electrode of the flip-type first electrode chip (121) or an electrode of the flip-type second light emitting chip (122) may be exposed to the bottom of the opaque molding unit (132).

Description

Flash module and mobile terminal including same

Embodiments relate to a light emitting module, a camera flash, and a terminal including the same.

Semiconductor devices including compounds such as GaN and AlGaN have many merits such as wide and easy bandgap energy, and can be used variously as light emitting devices, light receiving devices, and various diodes.

Particularly, a light emitting device such as a light emitting diode or a laser diode using a semiconductor material of Group 3-5 or 2-6 group semiconductors can be applied to various devices such as a red, Blue, and ultraviolet rays. By using fluorescent materials or combining colors, it is possible to realize a white light beam with high efficiency. Also, compared to conventional light sources such as fluorescent lamps and incandescent lamps, low power consumption, Speed, safety, and environmental friendliness.

In addition, when a light-receiving element such as a photodetector or a solar cell is manufactured using a semiconductor material of Group 3-5 or Group 2-6 compound semiconductor, development of a device material absorbs light of various wavelength regions to generate a photocurrent , It is possible to use light in various wavelength ranges from the gamma ray to the radio wave region. It also has advantages of fast response speed, safety, environmental friendliness and easy control of device materials, so it can be easily used for power control or microwave circuit or communication module.

Accordingly, a transmission module of the optical communication means, a light emitting diode backlight replacing a cold cathode fluorescent lamp (CCFL) constituting a backlight of an LCD (Liquid Crystal Display) display device, a white light emitting diode Lighting devices, automotive headlights, traffic lights, and gas and fire sensors. Further, applications can be extended to high frequency application circuits, other power control devices, and communication modules.

In recent years, the number of portable terminals with camera functions is increasing. In such a portable terminal, a camera flash is built in to provide the amount of light required when photographing a camera. In this regard, a light emitting module is employed as a light source of a camera flash. As such a light emitting module, the use of semiconductor devices such as a white LED (Light Emitting Diode) has been increasing.

Recently, in order to cope with the trend of technological development of such a mobile phone camera, there has been developed a technology for converting a camera of a mobile phone, for example, a mobile phone into a dual camera, ) Is also required to realize a wide angle to correspond to the field of view (FOV) of a camera. On the other hand, according to the related art, it is difficult to realize the angle of view (FOV) of the camera flash (Flash) at 90 degrees or more.

However, the slimness and the trend of the portable terminal continue with the demand of the industry requiring such a wide angle of view angle, and in the conventional camera flash module, since the flash lens needs to be maintained at a certain thickness or more, There is a problem in that it can not satisfy the slim trend demand while maintaining the wide angle.

In addition, there is a problem of reliability reduction due to high heat generation in a flash operation in a light emitting module of a camera flash of the prior art.

In addition, according to the related art, it is important that a uniform light distribution should be implemented in a camera imaging region even if a wide angle is implemented. In addition, it is difficult to realize a wide angle, and a problem of technical contradiction that a uniform light distribution can not be realized have.

Particularly, in the conventional lighting technology, a variety of emotional lighting using warm-white and cool-white light emitting modules is required. In the field of camera flash technology, I can not.

Further, according to the related art, as the process of attaching the flash lens to a separate terminal cover proceeds with the SMT (Surface Mounting Technology) process of the light emitting module package, the SMT tolerance and the tolerance when attaching the lens are increased, There is a problem that the alignment accuracy of the chip and the flash lens is lowered so that a uniform light distribution can not be realized.

Further, according to the camera flash of the related art, there is a problem that the coupling relation between the light emitting module and the frame is not robust and the mechanical reliability is deteriorated.

Embodiments provide a slim camera module and a terminal including the camera module while maintaining a wide angle.

Also, embodiments of the present invention provide a warm-white and cool-white integrated camera module capable of implementing emotional lighting in a camera flash technology area, and a terminal including the camera module.

Also, the embodiment is to provide a camera module and a terminal including the camera module, which are highly reliable due to a high heat dissipation effect when the flash module operates in a flash module.

In addition, embodiments of the present invention provide a camera module capable of realizing a uniform light distribution with high alignment accuracy between a light emitting chip and a flash lens, and a terminal including the camera module.

Also, an embodiment of the present invention is to provide a camera module having a strong coupling relation between a light emitting module and a frame and having improved mechanical reliability, and a terminal including the camera module.

The flash module of the embodiment includes a plurality of light emitting chips including a semiconductor layer, a phosphor layer disposed on one side of the semiconductor layer, and a plurality of electrodes disposed on a surface facing one side of the semiconductor layer, A light emitting module including an opaque molding part surrounding the plurality of light emitting chips so that a bottom surface of the plurality of electrodes is exposed to the outside; A frame disposed on the light emitting module; And a lens unit disposed on the frame.

The light emitting module includes a first barrier rib 111 and a second barrier rib 112 spaced apart from each other and a first flip-type light emitting chip 121 disposed between the first barrier rib 111 and the second barrier rib 112, And may include the flip-type second light emitting chip 122.

The flip-type first light emitting chip 121 and the flip-type second light emitting chip 122 may have different color temperatures (CCTs).

The flash module according to the embodiment has the flip-type first light-emitting chip 121, the flip-type second light-emitting chip 122 and the flip-type first light-emitting chip 121 and the flip-type second light- And a opaque molding part 132 surrounding a side of the light emitting module 100. The frame 220 is disposed on the light emitting module 100 and the lens part 230 is disposed on the frame. . ≪ / RTI >

An electrode of the flip-type first light emitting chip 121 or an electrode of the flip-type second light emitting chip 122 may be exposed to the bottom of the opaque molding part 132. [

The flash module according to the embodiment includes a first partition 111 and a second partition 112 spaced apart from each other and a first light emitting chip 121 disposed between the first partition 111 and the second partition 112, A light emitting module 100 including a first light emitting chip 122 and a second light emitting chip 122 and an opaque molding part 132 disposed between the first and second partitions 111 and 112, 100 disposed on the frame 220, and a lens unit 230 disposed on the frame.

A part of the first light emitting chip 121 or the second light emitting chip 122 may be exposed to the bottom surface of the opaque molding part 132.

The terminal according to the embodiment may include the flash module.

Embodiments can provide a super slim camera module and a terminal including the camera module while maintaining a wide angle.

In addition, the embodiment can provide a warm-white and cool-white integrated camera module capable of implementing emotional lighting in a camera flash technology area, and a terminal including the camera module.

In addition, the embodiment can provide a camera module excellent in reliability according to a high heat dissipation effect in a flash operation in a light emitting module and a terminal including the camera module

In addition, the embodiment can provide a camera module and a terminal including the camera module that can realize a uniform light distribution with high alignment accuracy between the light emitting chip and the flash lens.

In addition, the embodiment can provide a camera module and a terminal including the camera module in which the coupling relation between the light emitting module and the frame is robust and the mechanical reliability is improved.

1 is a perspective view of a flash module according to an embodiment.
2 is an exploded perspective view of a flash module according to an embodiment.
3 is a plan view of a flash module according to an embodiment.
4A is a first cross-sectional view of a flash module according to an embodiment.
4B is an enlarged cross-sectional view of the lens portion in the flash module according to the embodiment;
5 is a cross-sectional view of a light emitting module in a flash module according to an embodiment.
6 is a bottom view of a flash module according to an embodiment.
7 is a partial enlarged view of a bottom view of a flash module according to an embodiment.
8 is a second cross-sectional view of a flash module according to an embodiment.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments that can be specifically realized for solving the above problems will be described with reference to the accompanying drawings.

In describing an embodiment, when it is described as being formed "on or under" of each element, an upper or lower (on or under) Wherein both elements are in direct contact with each other or one or more other elements are indirectly formed between the two elements. Also, when expressed as "on or under", it may include not only an upward direction but also a downward direction with respect to one element.

The semiconductor device may include various electronic devices such as a light emitting device and a light receiving device. The light emitting device and the light receiving device may include the first conductivity type semiconductor layer, the active layer, and the second conductivity type semiconductor layer. The semiconductor device according to the embodiment may be a light emitting device. The light emitting device emits light by recombination of electrons and holes, and the wavelength of the light is determined by the energy band gap inherent to the material. Thus, the light emitted may vary depending on the composition of the material.

The light emitting chip of the embodiment may be a flip-type light emitting chip, but the embodiment is not limited thereto.

(Example)

FIG. 1 is a perspective view of a flash module 200 according to an embodiment, and FIG. 2 is an exploded perspective view of a flash module 200 according to an embodiment.

Referring to FIG. 2, the flash module 200 according to the embodiment may include a frame 220, a light emitting module 100, and a lens unit 230.

For example, the flash module 200 according to the embodiment includes a light emitting module 100, a frame 220 disposed on the light emitting module 100, and a lens unit 230 disposed on the frame can do.

Embodiments of the present invention provide a super slim light emitting module, a camera module, and a terminal including the super slim light module while maintaining a wide angle.

First, a camera module capable of maintaining a wide angle will be described with reference to FIGS. 4A and 4B.

4A is a first cross-sectional view of a flash module 200 according to an embodiment. The flash module 200 of the embodiment includes a light emitting module 100 including a first light emitting chip 121 and a second light emitting chip 122, A frame 220, and a lens unit 230. The first light emitting chip 121 and the second light emitting chip 122 of the embodiment may be flip-type light emitting chips, but the embodiment is not limited thereto.

4B is an enlarged cross-sectional view of the lens portion 230 in the flash module according to the embodiment.

The lens unit 230 mounted on the flash module 200 according to the embodiment includes a plurality of light diffusion patterns P1 and P2 to reflect light emitted from the first light emitting chip 121 and the second light emitting chip 122, (FOV) of a wide angle can be realized.

For example, when two light emitting chips such as the first light emitting chip 121 and the second light emitting chip 122 are provided in the light emitting module, the first light diffusion pattern P1, the second light diffusion pattern (P2), but is not limited thereto. When there are four light emitting chips, four light diffusion patterns may be provided.

According to the current technology of wide angle camera, the angle of view (FOV) of the flash module required in the industry is in a situation in which a wide angle of about 120 ° or more is required continuously as a dual camera is continuously developed. Further, Attributes must also be implemented at the same time.

According to the embodiment, the angle of view (FOV) of the camera flash can be realized up to 120 °, and it can be realized up to 135 °.

In addition, according to the embodiment, as the degree of agreement between the distribution of light emitted from the first light emitting chip 121 and the second light emitting chip 122 and the light diffusion pattern of the lens portion 230 increases, A uniform light distribution can be obtained.

For example, in the embodiment, the center of each light diffusion pattern and the center of each light emitting chip in the top view of the lens unit 230 can be matched. For example, in the embodiment, by controlling the light diffusion pattern of the lens part 230 and the alignment tolerance of the light emitting chip to be about 25 mu m or less, the directivity characteristics of the light emitted from the light emitting chip and the matching of the light diffusion pattern of the lens part The light distribution characteristic can be improved and a uniform light distribution can be obtained in addition to the implementation of the wide angle view angle (FOV).

Next, with reference to FIG. 4A, description will be made of a technical solution for a super slim light emitting module and a camera module.

In the prior art, the thickness of the flash module including the lens portion is about 2.5 mm or more, and it is difficult to reduce the thickness. This is because, in the prior art, after the SMT operation of the light emitting module on the package substrate, the lens is separately attached to the camera cover case, thereby limiting the thickness of the camera flash module.

In addition, according to the applicant's recent unpublished internal technology, the lens portion is formed as an injection molding structure in the frame, and the thickness of the camera flash module is minimized.

The flash module 200 according to the embodiment of the present invention can super slim the thickness T of the flash module to a thickness of about 1 mm or less beyond the technical limit. This is because the thickness T1 of the light emitting module is reduced in the flash module 200 and the light emitting module 100 is disposed inside the frame 220 and the lens unit 230 is disposed inside the frame 220 As shown in FIG.

That is, the thickness of the flash module 200 according to the embodiment may be the thickness T3 of the frame, and the thickness T of the flash module may be slimly reduced. For example, the thickness (T) of the flash module can be reduced to about 0.85 mm or less. In addition, the embodiment can achieve ultra slimming even when the thickness T of the flash module is about 0.65 mm or less.

The thickness T2 of the lens portion 230 can be controlled to be about 1/3 or less of the thickness T3 of the frame 220 in the embodiment. For example, the thickness T2 of the lens portion 230 can be controlled to be about 0.30 mm or less. The embodiment can control the thickness T2 of the lens portion 230 to about 0.20 mm or less.

In addition, the thickness T1 of the light emitting module 100 may be controlled to be about 1/3 or less of the thickness of the frame 220 in the embodiment. In particular, since the light emitting module 100 can be formed without a circuit board in the light emitting module 100 itself, the thickness T1 of the light emitting module 100 can be reduced. For example, the thickness T1 of the light emitting module 100 can be controlled to be about 0.30 mm or less. The embodiment can control the thickness T1 of the light emitting module 100 to be ultra slim to about 0.25 mm or less.

Accordingly, embodiments can provide a super slim light emitting module, a camera module, and a terminal including the same, while maintaining a wide angle of view.

3 is a top view of a flash module 200 according to an embodiment.

3, the frame 220 is formed on the outside of the linear direction I-I 'passing through the first light emitting chip 121 and the second light emitting chip 122 of the light emitting module 100, And a recess (R).

In the light emitting module 100 of the embodiment, the first light emitting chip 121 may emit a warm-white light and the second light emitting chip 122 may emit a cool-white light Can be emitted.

Accordingly, embodiments of the present invention can provide a warm-white and cool-white integrated camera module capable of implementing emotional lighting in a camera flash technology area, and a terminal including the camera module.

Meanwhile, in the embodiment, by including the recess R on the outside of the linear direction I-I 'passing through the first light emitting chip 121 and the second light emitting chip 122, for example, The first light emitting chip 121 or the second light emitting chip 122 can be identified by providing the recesses R on the side adjacent to the first light emitting chip 122 and the warm light emitting chip 121 or the second light emitting chip 122, cool-white) integrated camera module, it is easy to mount each light-emitting chip, and it is possible to easily control the operation of each light-emitting chip when the camera module is used later.

Thus, the mechanical coupling force can be improved when the flash module 200 is mounted on the terminal (not shown).

Hereinafter, the technical characteristics of the flash module 200 according to the embodiment will be described in more detail with reference to FIGS. 4A, 4B, and 5. FIG.

Referring to FIG. 4A, the flash module 200 of the embodiment may include a frame 220 disposed on the light emitting module 100, and a lens portion 230 disposed on the frame 220.

5, in the flash module 200 of the embodiment, the light emitting module 100 includes a first partition 111 and a second partition 112 spaced apart from each other, a first partition 111, A first light emitting chip 121 and a second light emitting chip 122 disposed between the first barrier rib 111 and the second barrier rib 112 and an opaque molding (Not shown).

The first barrier ribs 111 and the second barrier ribs 112 may be formed of a metal material. For example, the first and second barrier ribs 111 and 112 may be formed of copper (Cu), aluminum (Al), or the like, but the present invention is not limited thereto. The first barrier ribs 111 and the second barrier ribs 112 may be formed of a non-metallic material such as polyimide.

The first barrier rib 111 and the second barrier rib 112 may be formed in a manner that the first light emitting chip 121 and the second light emitting chip 122 are formed without a separate circuit board for the light emitting module itself And has a main function for forming the opaque molding part 132. In order to form such a light emitting module 100, a first partition 111 and a second partition 112 are formed on a predetermined foam tape (not shown), and a first light emitting chip 121, The light emitting module 100 may be formed by disposing the two light emitting chips 122 and injecting the opaque molding part 132 and then removing the foam tape. However, the manufacturing method is not limited thereto. The foam tape may be an adhesive to which a polyester film is adhered, but the present invention is not limited thereto.

The opaque molding part 132 may include a white mold, but is not limited thereto. For example, the opaque molding part 132 may be a white mold composition in which an oxide such as TiO ₂ is dispersed in silicone, but the present invention is not limited thereto.

In the embodiment, the opaque molding part 132 can prevent mixing of light emitted from the first light emitting chip 121 and the second light emitting chip 122, So that a uniform white color can be realized.

In the flash module 200 of the embodiment, a part of the first light emitting chip 121 or the second light emitting chip 122 may be exposed to the bottom of the opaque molding part 132.

For example, the first light emitting chip 121 may include a first phosphor layer 121d disposed on the top surface of the first semiconductor layer 121a, a first phosphor layer 121d disposed on the bottom surface of the first semiconductor layer 121a, Type electrode 121b and a first p-type electrode 121c. At this time, a part of the bottom surfaces of the first n-type electrode 121b and the first p-type electrode 121c may be exposed to the bottom surface of the opaque molding part 132.

The second light emitting chip 122 includes a second phosphor layer 122d disposed on the upper surface of the second semiconductor layer 122a and a second n-type electrode 122b disposed on the bottom surface of the second semiconductor layer 122a. 122b and a second p-type electrode 122c. At this time, a part of the bottom surfaces of the second n-type electrode 122b and the second p-type electrode 122c may be exposed to the bottom surface of the opaque molding part 132.

The first semiconductor layer 121a and the second semiconductor layer 122a may be formed of a compound semiconductor such as a semiconductor compound, for example, a Group III-V, a Group II-VI, or the like. The first semiconductor layer 121a and the second semiconductor layer 122a may be a light emitting structure layer including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer, but the present invention is not limited thereto. For example, when the first conductivity type semiconductor layer is an n-type semiconductor layer, the n-type dopant group may be doped. When the second conductivity type semiconductor layer is a p-type semiconductor layer, a p- have.

In the prior art, the thickness of the flash module including the lens portion is about 2.5 mm or more, and it is difficult to reduce the thickness. This is because, in the prior art, after the SMT operation of the light emitting module on the package substrate, the lens is separately attached to the camera cover case to limit the thickness of the camera flash module.

In particular, in the prior art, the light emitting module has a limitation in reducing the thickness of the light emitting module itself, as the light emitting chip is SMTed on a predetermined substrate, for example, a PCB.

In addition, since the light emitting module occupies an extra thickness in addition to the thickness of the frame of the flash module in the prior art, there is a technical limitation in reducing the thickness of the entire flash module.

However, the flash module 200 according to the embodiment can dramatically overcome such a technical limitation and slim the thickness T of the flash module to a thickness of about 1 mm or less. This is because the thickness T1 of the light emitting module 100 in the flash module 200 is reduced and the light emitting module 100 is disposed inside the frame 220 and the lens unit 230 can be disposed.

The thickness T1 of the light emitting module 100 can be controlled to be about 1/3 or less of the thickness T3 of the frame 220 in the embodiment. Particularly, in the embodiment, since the light emitting module 100 can be formed without a circuit board in the light emitting module 100 itself, the thickness T1 of the light emitting module can be innovatively reduced. For example, the thickness T1 of the light emitting module 100 can be controlled to be about 0.30 mm or less. The embodiment can control the thickness T1 of the light emitting module 100 to be extremely slim up to about 0.25 mm or less.

Accordingly, the embodiment can provide a very slim light emitting module, a camera module, and a terminal including the same, while maintaining a wide-angle view angle.

Also, in the embodiment, the frame 220 may include a first frame 220a and a second frame 220b having mutually separated cross sections. The frame 220 may include a first support portion 222a and a second support portion 222b having mutually separated cross sections.

The frame 220 may be formed of a resin-based insulating material, for example, a resin material such as polyphthalamide (PPA), or a ceramic material. Further, the frame 220 may be formed of a thermosetting resin including silicon, epoxy resin, or plastic material, or a high heat-resistant, high-light-resistant material. The above silicon may include a white-based resin. Further, the frame 220 may be formed of W-EMC, W-Silicone, polycarbonate, or the like.

At this time, the light emitting module 100 may be disposed between the first frame 220a and the second frame 220b.

A predetermined adhesive material may be formed between the first barrier rib 111 and the first frame 220a of the light emitting module 100 and between the second barrier rib 112 and the second frame 220b, .

For example, white silicon may be applied between the first barrier rib 111 and the first frame 220a of the light emitting module 100 and between the second barrier rib 112 and the second frame 220b, But is not limited thereto.

Accordingly, since the light emitting module 100 is disposed inside the frame, the thickness of the light emitting module 100 itself may not cause the thickness of the entire flash module 200 to increase.

 The thickness of the flash module 200 according to the embodiment can be made to be the thickness T3 of the frame 220 so that the thickness T of the flash module can be slimly reduced. For example, the thickness T of the flash module can be reduced to about 0.85 mm or less. In addition, the thickness T of the flash module can be reduced to about 0.65 mm or less. Of course, if the thickness of the frame 220 itself is reduced, the thickness of the flash module can be further reduced.

Also, it is an object of the present invention to provide an integrated light emitting module, a camera module, and a terminal including the same, which considers emotional illumination in the camera flash technology field.

5, the first light emitting chip 121 includes a first phosphor layer 121d disposed on the top surface of the first semiconductor layer 121a, a first phosphor layer 121d disposed on the bottom surface of the first semiconductor layer 121a, and may include an n-type electrode 121b and a first p-type electrode 121c.

The second light emitting chip 122 includes a second phosphor layer 122d disposed on the upper surface of the second semiconductor layer 122a and a second n-type electrode 122b disposed on the bottom surface of the second semiconductor layer 122a. 122b and a second p-type electrode 122c.

At this time, the color temperature (CCT) of the first light emitting chip 121 and the color temperature (CCT) of the second light emitting chip 122 may be different from each other.

For example, the first light emitting chip 121 may emit a warm-white light and the second light emitting chip 122 may emit a cool-white light. For example, the first light emitting chip 121 may emit a warm-white light of about 3,000 K, and the second light emitting chip 122 may emit a cool-white light of about 5,000 K cool-white.

For example, when the first light emitting chip 121 of the embodiment is a blue light emitting chip, the relative proportion of the blue light can be lowered by increasing the proportion of the phosphor in the first phosphor 121d to realize warm-white. When the second light emitting chip 122 of the embodiment is a blue light emitting chip, the relative proportion of the blue light may be increased by lowering the ratio of the phosphor in the second phosphor 122d to achieve cool-white, but the present invention is not limited thereto.

Embodiments can provide an integrated light emitting module, a camera module, and a terminal including the same, which can emit light through warm-white and cool-white light emission in a camera flash technology area.

In the embodiment, the first phosphor 121d or the second phosphor 122d may be a yellow phosphor, but the present invention is not limited thereto. For example, the yellow phosphor may be, but not limited to, YAG.

In addition, in the embodiment, the first phosphor 121d or the second phosphor 122d may be a composite phosphor of a red phosphor and a green phosphor. For example, the red phosphor compound-based phosphor, for example, (Ca, Sr) S: Eu ^{2 +,} or nitride based, for example, CaAlSiN _3: Eu ^{2 +} phosphor can include, but is not limited thereto. The green phosphor is (Y, Gd, Lu, Tb ) 3 (Al, Ga) 5 O 12: Ce, (Mg, Ca, Sr, Ba) 2 SiO 4: Eu, (Ca, Sr) 3 SiO 5: Eu , (La, Ca) ₃ Si ₆ N 11: Ce, α-SiAlON: Eu, and β-SiAlON: Eu.

In the embodiment, the horizontal width of the phosphor layer is larger than the horizontal width of the epi-semiconductor layer of the light emitting chip, so that the light emitted from the light emitting chip is emitted through the phosphor layer, thereby achieving uniform white light emission.

For example, in the embodiment, the horizontal width W1 of the first semiconductor layer 121a of the first light emitting chip 121 is larger than the horizontal width W1 of the first phosphor layer 121d of the first light emitting chip 121 The light emitted from the light emitting chip may be emitted through the phosphor layer even though the light partially passes through the opaque molding part 132, thereby achieving uniform white light emission.

In the flash module of the embodiment, the light emitting module 100 may include a first diffusion layer 134 on the first light emitting chip 121 and the second light emitting chip 122. In the embodiment, the light extraction efficiency can be improved by the light diffusion by the first diffusion layer 134. The first diffusion layer 134 may be formed by mixing SiO ₂ or TiO ₂ with a resin, but the present invention is not limited thereto.

Also, it is an object of the present invention to provide a light emitting module, a camera module, and a terminal including the light emitting module, the camera module, and the terminal including the light emitting module.

Also, it is a technical object of the present invention to provide a camera module and a terminal including the camera module in which the coupling relation between the light emitting module and the frame is robust and the mechanical reliability is improved.

The first frame 220a of the flash module according to the embodiment includes a first support portion 222a and a first inner protrusion portion 223a disposed on the first support portion 222a And the second frame 220b may include a second support portion 222b and a second inner protrusion portion 223b disposed on the second support portion 222b.

At this time, the first partition 111 and the second partition 112 of the light emitting module 100 are in contact with the inner surface of the first support portion 222a and the inner surface of the second support portion 222b, Since the coupling between the module 100 and the frame 220 is strengthened to improve the mechanical reliability and the heat is transferred in the direction of the frame 220 through the first partition 111 and the second partition 112 The thermal efficiency can be increased.

The first partition wall 111 and the second partition wall 112 of the light emitting module 100 may be formed on the bottom surface of the first inner protruding portion 223a and the bottom surface of the second inner protruding portion 223b, The coupling efficiency between the light emitting module 100 and the frame 220 can be improved and mechanical reliability can be improved and the heat radiation efficiency can be increased through the first and second barrier ribs 111 and 112.

The first partition wall 111 and the second partition wall 112 are adhered to the bottom surface of the first inner protruding portion 223a and the bottom surface of the second inner protruding portion 223b by a predetermined metallic or non- But is not limited thereto.

Also, it is a technical object of the present invention to provide a camera module and a terminal including the camera module, which can realize uniform light distribution by increasing the alignment accuracy of the light emitting chip and the flash lens.

In order to solve such a problem, in the flash module of the embodiment, the first frame 220a includes a third inner protruding portion 224a disposed on the first inner protruding portion 223a and a third inner protruding portion 224b disposed on the third inner protruding portion 224a And a first outer protrusion 226a disposed on the first outer protrusion 226a.

The second frame 220b includes a fourth inner protrusion 224b disposed on the second inner protrusion 223b and a second outer protrusion 226b disposed on the fourth inner protrusion 224b can do.

At this time, the lens unit 230 is arranged to be in contact with the third inner protrusion 224a and the fourth inner protrusion 224b to increase the alignment accuracy of the light emitting chip and the flash lens, thereby realizing a uniform light distribution have.

For example, according to the embodiment, the higher the agreement between the distribution of light emitted from the first light emitting chip 121 and the second light emitting chip 122 and the light diffusion pattern of the lens portion 230, (FOV) and a uniform light distribution can be obtained.

In the embodiment, the center of each light diffusion pattern and the center of each light emitting chip in the top view of the lens unit 230 can be matched. For example, in the embodiment, by controlling the light diffusion pattern of the lens part 230 and the alignment tolerance of the light emitting chip to be about 25 mu m or less, the directivity characteristics of the light emitted from the light emitting chip and the matching of the light diffusion pattern of the lens part The light distribution characteristic can be improved and a uniform light distribution can be obtained in addition to the implementation of the wide angle view angle (FOV).

In an embodiment, the lens portion 230 may include a lens support portion 234 and a light diffusion portion 232. The lens unit 230 may be made of a plastic material such as an acrylic plastic material. Examples of the lens unit 230 include polymethyl methacrylate (PMMA). Such PMMA is advantageous in that it is superior in transparency to glass and easy to process and form.

The lens unit 230 may function as a lens such as a light extracting lens or a light diffusing lens and is a member for changing a directivity characteristic of light emitted from the light emitting chip and is not particularly limited, Or more and 1.7 or less can be used.

The lens part 230 of the embodiment may be formed of a transparent resin material such as polycarbonate (PC) or epoxy resin (EP), transparent glass, sapphire, EMC or Silicone, but is not limited thereto.

For example, the lens support portion 234 may be formed of a transparent resin such as polycarbonate (PC) or epoxy resin (EP), and the light diffusion portion 232 may be formed of glass or sapphire It is not.

The height of the upper surface of the lens unit 230 may be equal to or less than the height of the upper surface of the frame 220. [ Accordingly, since the thickness of the flash module 200 does not increase by the lens unit 230 itself in the entire thickness of the flash module 200, a very slim flash module can be realized.

Also, in the embodiment, the light emitting module 100 and the lens unit 230 may be spaced apart by a predetermined distance D.

For example, in the embodiment, the optical gap D between the first light emitting chip 121 and the second light emitting chip 122 and the lens unit 230 is precisely controlled to obtain a slim Flash modules can be implemented. For example, in the embodiment, the optical gap D between the first light emitting chip 121 and the second light emitting chip 122 and the lens unit 230 is precisely controlled to about 0.2 to 0.5 mm A slim flash module can be realized with a wide angle of view.

FIG. 6 is a bottom view of a flash module according to an embodiment, and FIG. 7 is an enlarged view of a portion (F) of a bottom view of a flash module according to an embodiment.

6, in the flash module 200 of the embodiment, a part of the first light emitting chip 121 or the second light emitting chip 122 is formed on the bottom surface of the opaque molding part 132 Lt; / RTI >

For example, some of the bottom surfaces of the first n-type electrode 121b and the first p-type electrode 121c of the first light emitting chip 121 may be exposed to the bottom of the opaque molding part 132 have.

A part of each of the bottom surfaces of the second n-type electrode 122b and the second p-type electrode 122c of the second light emitting chip 122 may be exposed to the bottom surface of the opaque molding part 132 .

Accordingly, since the light emitting module 100 can be formed without the circuit board in the light emitting module 100 itself, the thickness T1 of the light emitting module 100 can be innovatively reduced. For example, the thickness T1 of the light emitting module 100 can be controlled to be about 0.30 mm or less. The embodiment can control the thickness T1 of the light emitting module 100 to be extremely slim up to about 0.25 mm or less.

Accordingly, the embodiment can provide a super slim light emitting module, a camera module, and a terminal including the super slim light emitting module while maintaining a wide angle of view angle.

7, the second light emitting chip 122 of the embodiment includes the n-type pad electrode 122bn and the p-type pad electrode 122cp, so that the carrier injection efficiency in the second light emitting chip 122 itself And improve electrical and mechanical contact performance with a power terminal portion (not shown) of a terminal (not shown).

For example, the second light emitting chip 122 of the embodiment has a predetermined mesa etching area M, and the n-type semiconductor layer (not shown) electrically connecting the second n-type electrode 122b and the n- The p-type pad electrode 122cp disposed on the pad electrode 122bn and the second p-type electrode 122c improves the carrier injection efficiency in the second light emitting chip 122 itself, It is possible to improve the electrical and mechanical contact performance with the RF terminal portion (not shown) of the case.

8 is a second cross-sectional view 202 of a flash module according to an embodiment, which may employ the technical features of the previously described embodiments.

The second diffusion layer 134b in the flash module of the embodiment shown in FIG. 8 is disposed on the upper surface of the first light emitting chip 121 and the second light emitting chip 122, It is possible to improve the bonding force between the first partition wall 111 and the second partition wall 112 and the bottom surface of the first inner protrusion portion 223a and the second inner protrusion portion 223b by not being disposed on the second partition wall 112. [ .

Embodiments can provide a super slim camera module and a terminal including the camera module while maintaining a wide angle.

In addition, the embodiment can provide a warm-white and cool-white integrated camera module capable of implementing emotional lighting in a camera flash technology area, and a terminal including the camera module.

In addition, the embodiment can provide a camera module excellent in reliability according to a high heat dissipation effect in a flash operation in a light emitting module and a terminal including the camera module

In addition, the embodiment can provide a camera module and a terminal including the camera module that can realize a uniform light distribution with high alignment accuracy between the light emitting chip and the flash lens.

In addition, the embodiment can provide a camera module and a terminal including the camera module in which the coupling relation between the light emitting module and the frame is robust and the mechanical reliability is improved.

The flash module according to the embodiment may be employed in a terminal. The terminal may include a cellular phone, a smart phone, a tablet PC, a notebook, a PDA (Personal Digital Assistant), and the like, but is not limited thereto.

The features, structures, effects and the like described in the embodiments are included in at least one embodiment and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects and the like illustrated in the embodiments can be combined and modified by other persons skilled in the art to which the embodiments belong. Accordingly, the contents of such combinations and modifications should be construed as being included in the scope of the embodiments.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention. It can be seen that the modification and application of branches are possible. For example, each component specifically shown in the embodiments can be modified and implemented. It is to be understood that the present invention may be embodied in many other specific forms without departing from the spirit or essential characteristics thereof.

Claims (13)

A plurality of light emitting chips including a semiconductor layer, a phosphor layer disposed on one surface of the semiconductor layer, and a plurality of electrodes arranged on a surface of the semiconductor layer facing the one surface,
A light emitting module including an opaque molding part surrounding the plurality of light emitting chips so that an upper surface of the phosphor layer and a bottom surface of the plurality of electrodes are exposed to the outside;
A frame disposed on the light emitting module; And
And a lens portion disposed on the frame. The method according to claim 1,
The light emitting module includes:
Type first light emitting chip and the flip-type second light emitting chip disposed between the first bank and the second bank, the first bank and the second bank being spaced apart from each other,
Wherein the flip-type first light-emitting chip and the flip-type second light-emitting chip have different color temperatures (CCT).
A first light emitting chip and a second light emitting chip disposed between the first bank and the second bank, and a second light emitting chip disposed between the first bank and the second bank, A light emitting module including a light emitting portion,
A frame disposed on the light emitting module,
And a lens portion disposed on the frame,
Wherein the first light emitting chip and the second light emitting chip are flip-type light emitting chips,
And a part of the flip-type first light-emitting chip or the flip-type second light-emitting chip is exposed to the bottom surface of the opaque molding part.
4. The method according to any one of claims 2 to 3,
The flip-type first light-
A first phosphor layer disposed on an upper surface of the first semiconductor layer,
And a first n-type electrode and a first p-type electrode disposed on a bottom surface of the first semiconductor layer,
And at least a part of the bottom surfaces of each of the first n-type electrode and the first p-type electrode is exposed to the bottom surface of the opaque molding part.
5. The method of claim 4,
The frame includes:
A first frame and a second frame having mutually separated cross sections,
Wherein the light emitting module is disposed between the first frame and the second frame.
6. The method of claim 5,
Wherein the first frame includes a first support portion and a first inner protrusion portion disposed on the first support portion,
The second frame includes a second support portion and a second inner protrusion disposed on the second support portion,
Wherein the first partition and the second partition of the light emitting module contact the inner surface of the first support portion and the inner surface of the second support portion.
The method according to claim 6,
Wherein the first barrier rib and the second barrier rib of the light-
And a bottom surface of the first inner protrusion and a bottom surface of the second inner protrusion.
8. The method of claim 7,
Wherein the first frame includes a third inner protruding portion disposed on the first inner protruding portion and a first outer protruding portion disposed on the third inner protruding portion,
The second frame includes a fourth inner protrusion disposed on the second inner protrusion and a second outer protrusion disposed on the fourth inner protrusion,
And the lens portion is in contact with the third inner protrusion and the fourth inner protrusion.
4. The method according to any one of claims 1 to 3,
The height of the upper surface of the lens portion
The height of the top surface of the frame.
4. The method according to any one of claims 1 to 3,
The frame
And a predetermined recess on the outer side in the linear direction passing through the flip-type first light emitting chip and the flip-type second light emitting chip.
4. The method according to any one of claims 1 to 3,
And a diffusion layer (134) on the flip-type first light-emitting chip and the flip-type second light-emitting chip.
12. The method of claim 11,
The diffusion layer
Type first light emitting chip and the flip-type second light emitting chip,
And is not disposed on the first bank and the second bank.
A terminal comprising the flash module of any one of claims 1 to 3.

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