KR20170140754A - display device - Google Patents

Abstract

A display device is disclosed. The present invention includes a substrate; and a plurality of pad terminals disposed on the substrate. Each of pad terminals has at least one lower conductive layer and an upper conductive layer disposed on the lower conductive layer. At least one elastic layer covering at least one region of the lower conductive layer is disposed between the lower conductive layer and the upper conductive layer. At least a part of the lower conductive layer and at least a part of the upper conductive layer may be electrically connected in a region where the elastic layer is not disposed. It is easy to connect a pad terminal and a driving terminal.

Description

Display device

The present invention relates to a display device.

Typically, the display device is a mobile device such as a smart phone, a laptop computer, a digital camera, a camcorder, a portable information terminal, a notebook, a tablet personal computer, or an electronic device such as a desktop computer, a television, an outdoor billboard, Can be used.

Recently, a slimmer display device is being released.

BACKGROUND OF THE INVENTION [0002] A flexible display device is easy to carry and can be applied to devices of various shapes. Among them, a flexible display device based on organic light emitting display technology is the most promising flexible display device.

The display device may be electrically connected to the pad terminal on the substrate and the driving terminal of the driving unit. Between the pad terminal and the driving terminal, an adhesive containing a conductive material for electrically connecting them may be interposed. However, when connecting the pad terminal and the driving terminal, a connection failure due to the conductive particles contained in the adhesive may occur.

Embodiments of the present invention provide a display device in which connection between a pad terminal and a driving terminal is smooth.

A display device according to an aspect of the present invention includes: a substrate; And a plurality of pad terminals disposed on the substrate, wherein each pad terminal of the plurality of pad terminals has at least one lower conductive layer and an upper conductive layer disposed on the lower conductive layer, At least one layer of elastic layer covering at least one region of the lower conductive layer is disposed between the lower conductive layer and the upper conductive layer, and at least a part of the lower conductive layer and at least a part of the upper conductive layer are arranged And can be electrically connected to each other in the non-region.

In one embodiment, the upper conductive layer extends over a region where the lower conductive layer is disposed and a region where the elastic layer is disposed, and at least one elastic layer has a curvature pattern at a portion where the upper conductive layer contacts .

In one embodiment, the elastic layer includes a plurality of laminated elastic layers, and the elastic layer of any one of the plurality of elastic layers may include a curvature pattern.

In one embodiment, the elastic layer may comprise an organic material.

In one embodiment, the elastic layer comprises: a first elastic layer disposed on the lower conductive layer; And at least one second resilient layer disposed on the first resilient layer and having the curvature pattern; And a third elastic layer disposed on the second elastic layer.

In one embodiment, the second elastic layer is plural, and each second elastic layer may be disposed on the first elastic layer.

In one embodiment, each second resilient layer may comprise a hemispherical or semi-ellipsoid shape.

In one embodiment, each second resilient layer has a curved cross-section and may include a stripe shape extending in one direction of the substrate.

In one embodiment, the second elastic layer disposed at the outermost one of the plurality of second elastic layers may cover one edge of the first elastic layer.

In one embodiment, the plurality of elastic layers selected from the first elastic layer, the second elastic layer, and the third elastic layer may be integrated.

In one embodiment, a thin film transistor having a semiconductor layer, a gate electrode, a source electrode, and a drain electrode, an organic light emitting element having a first electrode, a light emitting layer, and a second electrode, a touch including a plurality of touch electrodes, And a plurality of insulating films interposed between the electrodes, wherein the lower conductive layer and the upper conductive layer are disposed on the same layer as each selected one of the electrodes, May be disposed in the same layer as at least one of the insulating films selected from among the insulating films.

In one embodiment, the lower conductive layer comprises: a first conductive layer; And a second conductive layer disposed on the first conductive layer, wherein the first elastic layer extends on an upper surface of the second conductive layer, and between the first conductive layer and the second conductive layer, 1 conductive layer and a contact hole for exposing a portion of the first conductive layer, wherein the first conductive layer and the second conductive layer are electrically connected through the contact hole Can be connected.

In one embodiment, the lower conductive layer is spaced apart from the substrate, at least one of the lower conductive layers is connected to a wiring drawn from the active region of the substrate, And may be arranged on the lower conductive layer in an island shape.

In one embodiment, the lower conductive layer is disposed on the same layer as each of the selected ones of the gate electrode, the source electrode, the drain electrode, the first electrode, and the second electrode, The first elastic layer is disposed on the same layer as the first insulating layer covering the source electrode and the drain electrode, and the second elastic layer is disposed on the same layer as the first insulating layer covering the source electrode and the drain electrode, And the third elastic layer may be disposed on the same layer as the third insulating layer covering the touch electrode.

In one embodiment, the plurality of pad terminals are spaced apart on the substrate, and the elastic layer of one of the plurality of elastic layers may extend across the neighboring pad terminals.

In one embodiment, the extended resilient layer may extend over a distance between each lower conductive layer of the neighboring pad terminals and adjacent pad terminals.

In one embodiment, the extended elastic layer may extend in a direction crossing the extending direction of the upper conductive layer and the lower conductive layer.

In one embodiment, the extended resilient layer corresponds to a first resilient layer, the second resilient layer is disposed on a first resilient layer of each pad terminal, the third resilient layer comprises a first resilient layer, The second resilient layer, and the spacing between adjacent pad terminals.

In one embodiment, both ends of the first resilient layer protrude out of the edge of the upper conductive layer, and the upper conductive layer may not cover the protruding region of the first resilient layer.

In one embodiment, both ends of the first resilient layer are located inside the edge of the upper conductive layer, and both ends of the first resilient layer are covered by the upper conductive layer.

As described above, the display device of the present invention can reduce the connection resistance between the pad terminal and the driving terminal. Thus, connection reliability between the pad terminal and the driving terminal can be improved. It is needless to say that the effects of the present invention can be derived from the following description with reference to the drawings in addition to the above-mentioned contents.

1 is a plan view showing a display device according to an embodiment of the present invention.
2 is a cross-sectional view of the display device of FIG.
3 is a cross-sectional view illustrating a display panel according to an embodiment of the present invention.
4 is a plan view showing the pad terminal of FIG.
5A is a cross-sectional view showing that a driving terminal is connected to a pad terminal cut along the line I-I in FIG.
FIG. 5B is a cross-sectional view illustrating a driving terminal connected to a pad terminal cut along the line II-II in FIG.
6 is a plan view showing a pad terminal according to another embodiment of the present invention.
FIG. 7A is a cross-sectional view showing that a driving terminal is connected to a pad terminal cut along the line I-I in FIG.
And FIG. 7B is a cross-sectional view illustrating that a driving terminal is connected to a pad terminal cut along the line II-II in FIG.
8 is a modification of the pad terminal of Fig.
Fig. 9A is a cross-sectional view showing that a driving terminal is connected to a pad terminal cut along the line I-I in Fig.
And FIG. 9B is a cross-sectional view showing that a driving terminal is connected to a pad terminal cut along the line II-II in FIG.
10 is a perspective view illustrating a plurality of pad terminals disposed on a substrate according to an embodiment of the present invention.
11 is a plan view showing a plurality of pad terminals in Fig.
12A is a cross-sectional view showing that a driving terminal is connected to pad terminals cut along the line I-I in FIG.
And FIG. 12B is a cross-sectional view illustrating that the driving terminals are connected to the pad terminals cut along the line II-II in FIG.
Figs. 13 and 14 are modifications of the pad terminals of Fig.
15 is a plan view showing a plurality of pad terminals according to another embodiment of the present invention.
16 is a plan view showing a plurality of pad terminals in Fig.
FIG. 17A is a cross-sectional view showing that the driving terminals are connected to the pad terminals cut along the line I-I in FIG.
And FIG. 17B is a cross-sectional view showing that the driving terminal is connected to the pad terminals shown in the cut along the line II-II in FIG.
Figs. 18 and 19 are modifications of the elastic layer of Fig. 5B.
20 is a modification of the display panel of Fig.
Figs. 21 and 22 are modification examples of the plurality of pad terminals in Fig.

BRIEF DESCRIPTION OF THE DRAWINGS The present invention is capable of various modifications and various embodiments, and specific embodiments are illustrated in the drawings and described in detail in the detailed description. The effects and features of the present invention and methods of achieving them will be apparent with reference to the embodiments described in detail below with reference to the drawings. However, the present invention is not limited to the embodiments described below, but may be implemented in various forms.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings, wherein like reference numerals refer to like or corresponding components throughout the drawings, and a duplicate description thereof will be omitted .

In the following embodiments, when various components such as layers, films, regions, plates, and the like are referred to as being " on " other components, . Also, for convenience of explanation, the components may be exaggerated or reduced in size. For example, the size and thickness of each component shown in the drawings are arbitrarily shown for convenience of explanation, and thus the present invention is not necessarily limited to those shown in the drawings.

In the following embodiments, the x-axis, the y-axis, and the z-axis are not limited to three axes on the orthogonal coordinate system, and can be interpreted in a broad sense including the three axes. For example, the x-axis, y-axis, and z-axis may be orthogonal to each other, but may refer to different directions that are not orthogonal to each other.

FIG. 1 is a plan view showing a display device 100 according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view of the display device 100 of FIG.

Referring to FIGS. 1 and 2, the display device 100 includes a display panel 110. In one embodiment, the display device 100 may be an organic light emitting display device (OLED). In another embodiment, the display device 100 may be a liquid crystal display (LCD), a field emission display (FED), or an electronic paper display (EDP) .

The display panel 110 includes a substrate 120 having a plurality of devices and a thin film encapsulation (TFE) 130 disposed on the substrate 120. A plurality of thin film transistors (TFT) and a plurality of light emitting elements connected to the thin film transistors may be disposed on the substrate 120. A functional film 140 such as a polarizing plate, a touch screen, and a cover window may be disposed on the thin film encapsulation layer 130.

An active area (AA) 111 for displaying an image and an inactive area (IAA) 112 extending outside the active area 111 may be disposed on the substrate 110.

The thin film encapsulation layer 130 may cover the active region 111.

The inactive region 112 surrounds the active region 111. A bending area BA capable of folding the display panel 110 in one direction and a pad area PA extending outward from the bending area BA are formed in the inactive area 112, .

The display panel 110 may be folded in one direction about a bending line BL which is a reference line disposed in the bending area BA.

The pad region PA may be disposed at one edge of the substrate 120. A plurality of pad terminals 150 may be disposed in the pad region PA. The plurality of pad terminals 150 may be spaced apart from each other in the X direction of the substrate 120. The pad terminal 150 may be connected to the wiring 200 extending from the active region 111.

The driving unit 160 may be electrically connected to the plurality of pad terminals 150. The driving unit 160 includes a driving circuit and may include a chip on plastic (COP). The driving unit 160 includes a flexible circuit board 170 on which circuit wiring patterns are formed, a driving IC 180 disposed on the substrate 111, and a driving IC 180 disposed on a lower portion of the driving IC 180. [ And a plurality of driving terminals 190 arranged. The flexible circuit board 170 and the driving IC 180 may be electrically connected to each other.

In another embodiment, the driving unit 160 may include a chip on film (COF). In still another embodiment, the driving unit 160 may include a chip on glass (COG).

The flexible circuit board 170 may be electrically connected to an external board.

The plurality of pad terminals 150 and the plurality of driving terminals 190 may be electrically connected. A plurality of pad terminals 150 and a plurality of driving terminals 190 corresponding to each other can be directly connected.

An adhesive such as an adhesive tape 210 may be disposed between the plurality of pad terminals 150 and the plurality of drive terminals 190. The adhesive tape 210 may provide an adhesive force between the plurality of pad terminals 150 and the plurality of driving terminals 190. The adhesive tape 210 may be interposed in the periphery of a region where the pad terminal 150 and the driving terminal 190 are connected to each other.

The display device 100 having the above structure can electrically connect the pad terminal 150 and the driving terminal 190 by using a pressing device such as a hot bar. In the present embodiment, the case where the pad terminal 150 and the driving terminal 190 are connected is described as an example, but the present invention is not limited to any structure as long as terminals provided in different component elements are directly connected to each other It is not.

In one embodiment, the pad terminals 150 may be disposed on the substrate 120 in a plurality of rows. For example, the pad terminals of the plurality of pad terminals 150 may be arranged in different rows in the Y direction of the substrate 120.

In one embodiment, the plurality of pad terminals 150 arranged in different columns may be staggered from each other. For example, each pad terminal of the plurality of pad terminals 150 may be arranged in a zigzag pattern.

In one embodiment, each pad terminal of the plurality of pad terminals 150 includes at least one lower conductive layer and an upper conductive layer disposed on the lower conductive layer.

3 is a cross-sectional view illustrating a display panel 300 according to an embodiment of the present invention. 4 is a plan view showing the pad terminal 400 of FIG. 3, and FIG. 5A illustrates that the driving terminal 580 is connected to the pad terminal 400 cut along the line I-I of FIG. 4 And FIG. 5B is a cross-sectional view showing that the driving terminal 580 is connected to the pad terminal 400 cut along the line II-II in FIG.

Referring to FIGS. 3, 4, 5A and 5B, the display panel 300 includes a substrate 301 and a thin film encapsulation layer 317. In one embodiment, the display panel 300 may be an organic light emitting display.

A pad area PA provided in the display area DA and the inactive area IAA provided in the active area AA may be disposed on the substrate 301. [

The substrate 301 may be a flexible glass substrate, a flexible polymer substrate, a rigid glass substrate, or a rigid polymer substrate. The substrate 301 may be transparent, translucent, or opaque.

A barrier layer 302 may be disposed on the substrate 301. The barrier film 302 may cover the upper surface of the substrate 301. The barrier film 302 may be an organic film or an inorganic film. The barrier film 302 may be a single film or a multilayer film.

At least one thin film transistor (TFT) may be disposed in the display area DA. In one embodiment, the number of the thin film transistors (TFTs) is not limited to one.

A semiconductor layer 303 may be disposed on the barrier layer 302. The semiconductor layer 303 includes a source region 304 and a drain region 305 which are arranged by doping N-type impurity ions or P-type impurity ions. The source region 304 and the drain region 305 may be a channel region 306 in which no impurity is doped. The semiconductor layer 303 may be an organic semiconductor, an inorganic semiconductor, or amorphous silicon. In another embodiment, the semiconductor layer 303 may be an oxide semiconductor.

A gate insulating layer 307 may be deposited on the semiconductor layer 303. The gate insulating film 307 may be an organic film or an inorganic film. The gate insulating film 307 may be a single film or a multilayer film.

A gate electrode 308 may be disposed on the gate insulating layer 307. The gate electrode 308 may be formed of a conductive metal material. For example, the gate electrode 308 includes molybdenum (Mo), aluminum (Al), copper (Cu), and titanium (Ti). The gate electrode 308 may be a single film or a multilayer film.

An interlayer insulating film 309 may be disposed on the gate electrode 308. The interlayer insulating film 309 may be an organic film or an inorganic film.

A source electrode 310 and a drain electrode 311 may be disposed on the interlayer insulating layer 309. A part of the gate insulating film 307 and a part of the interlayer insulating film 309 are removed to form a contact hole and the source electrode 310 is electrically connected to the source region 304 through the contact hole, The drain electrode 311 may be electrically connected to the region 305.

The source electrode 310 and the drain electrode 311 may be formed of a metal material having excellent conductivity. For example, the source electrode 310 and the drain electrode 311 include molybdenum (Mo), aluminum (Al), copper (Cu), and titanium (Ti). The source electrode 310 and the drain electrode 311 may be a single film or a multilayer film. For example, the source electrode 310 and the drain electrode 311 may be formed of a stacked structure of titanium (Ti) / aluminum (Al) / titanium (Ti).

A protective layer 312 may be disposed on the source electrode 310 and the drain electrode 311. The protective film 312 may be an organic film or an inorganic film. The protective film 312 may be a passivation film or a planarizing film. Either the passivation film or the planarizing film may be omitted.

The thin film transistor (TFT) may be electrically connected to an organic light emitting display device (OLED).

The organic light emitting diode OLED may be disposed on the passivation layer 312. The organic light emitting diode OLED includes a first electrode 313, an intermediate layer 314, and a second electrode 315.

The first electrode 313 functions as an anode, and may be various conductive materials. The first electrode 313 includes a transparent electrode or a reflective electrode. For example, when the first electrode 313 is used as a transparent electrode, the first electrode 313 includes a transparent conductive film. When the first electrode 313 is used as a reflective electrode, the first electrode 313 includes a reflective film and a transparent conductive film disposed on the reflective film. In one embodiment, the first electrode 313 may have a stacked structure of ITO / Ag / ITO.

A pixel defining layer 316 may be disposed on the protective layer 312. The pixel defining layer 316 may cover a portion of the first electrode 313. The pixel defining layer 316 defines the emission region of each subpixel by surrounding the edges of the first electrode 313. The first electrode 313 may be patterned for each subpixel. The pixel defining layer 316 may be an organic layer or an inorganic layer. The pixel defining layer 316 may be a single film or a multilayer film.

The intermediate layer 314 may be disposed on the first electrode 313 in a region exposed by etching a part of the pixel defining layer 316. The intermediate layer 314 may be formed by a deposition process.

The intermediate layer 314 may include an organic light emitting layer.

As another alternative, the intermediate layer 314 may include an emissive layer, and may include a hole injection layer (HIL), a hole transport layer (HTL), and an electron transport layer layer, an electron injection layer (ETL), and an electron injection layer (EIL).

In an exemplary embodiment, the intermediate layer 314 includes an organic light emitting layer, and may further include various other functional layers.

The second electrode 315 may be disposed on the intermediate layer 314.

The second electrode 315 may function as a cathode. The second electrode 315 includes a transparent electrode or a reflective electrode. For example, when the second electrode 315 is used as a transparent electrode, the second electrode 315 includes a metal film and a transparent conductive film disposed on the metal film. When the second electrode 315 is used as a reflective electrode, the second electrode 315 includes a metal film.

In one embodiment, a plurality of sub-pixels may be formed on the substrate 301. For example, red, green, blue, or white colors may be implemented for each subpixel. However, the present disclosure is not limited thereto.

The thin film encapsulation layer 317 may cover the organic light emitting diode OLED.

The thin film encapsulation layer 317 may be formed by alternately stacking the inorganic films 318 and 319 and the organic film 320. For example, the first inorganic film 318, the organic film 320, and the second inorganic film 319 may be sequentially stacked on the organic light emitting device OLED. The laminated structure of the inorganic film and the organic film included in the thin film encapsulation layer 317 may be variously modified.

A touch screen 325 may be provided on the thin film encapsulation layer 317. In one embodiment, the touch screen 325 may be a touch screen of an electrostatic capacitive type. A base layer 321 may be disposed on the thin film encapsulation layer 317. In another embodiment, the base layer 321 may be omitted.

A plurality of touch electrodes 322 may be disposed on the base layer 321. The touch electrode 322 may have a structure in which titanium (Ti) / aluminum (Al) / titanium (Ti) are stacked. The touch electrode 322 may be covered with the insulating films 323 and 324 for the touch electrode. The insulating films 323 and 324 for a touch electrode may be an organic film or an inorganic film. In one embodiment, the touch screen 325 is not limited to any one structure as long as it includes a plurality of touch electrodes 322 and at least one insulating layer 323 and 324.

A plurality of pad terminals 400 electrically connected to the driving terminal 580 may be disposed in the pad region PA. Each pad terminal of the pad terminal 400 may be spaced apart in the first direction (x direction) of the substrate 301.

Each pad terminal 400 includes at least one lower conductive layer 410 and an upper conductive layer 420 disposed on the lower conductive layer 410. The elastic layer 500 may be disposed between the lower conductive layer 410 and the upper conductive layer 420. The elastic layer 500 may cover at least one region of the lower conductive layer 410. In one embodiment, at least a portion of the lower conductive layer 410 and at least a portion of the upper conductive layer 420 may be electrically connected in a region where the elastic layer 500 is not disposed.

Specifically, the first insulating layer 331 may be disposed on the substrate 301 in the pad region PA. The first insulating layer 331 may be disposed on the same layer as the barrier layer 302. The first insulating layer 331 may be formed of the same material in the same process as the barrier layer 302.

A second insulating layer 332 may be disposed on the first insulating layer 331. The second insulating layer 331 may be disposed on the same layer as the gate insulating layer 307. The second insulating layer 332 may be formed of the same material in the same process as the gate insulating layer 307.

A lower conductive layer 410 provided on the pad terminal 400 may be disposed on the second insulating layer 332. The lower conductive layer 410 includes a first conductive layer 430 and a second conductive layer 440 disposed on the first conductive layer 430.

The first conductive layer 430 may be electrically connected to the wiring 326 drawn out from the display area DA. The first conductive layer 430 may be disposed on the same layer as the gate electrode 308. The first conductive layer 430 may be formed of the same material as the gate electrode 308. Each of the first conductive layers 430 may be spaced apart in the first direction (x direction) of the substrate 301.

An insulating layer 333 may be disposed on the first conductive layer 430. The insulating layer 333 may be disposed on the same layer as the interlayer insulating layer 309. The insulating layer 333 may be formed of the same material in the same process as the interlayer insulating layer 309. In one embodiment, the insulating layer 333 may function as a resilient layer to be described later. In one embodiment, the insulating layer 333 may include an organic material.

The insulating layer 333 may cover at least a part of the first conductive layer 430. A part of the insulating layer 333 may be removed on the first conductive layer 430 to form a contact hole 333a. The upper surface of the first conductive layer 430 may be exposed to the outside in a region where the contact hole 333a is formed.

A second conductive layer 440 may be disposed on the first conductive layer 430. The second conductive layer 440 may be disposed on the first conductive layer 430 in an island shape. In another embodiment, the second conductive layer 440 may be electrically connected to the wiring 326 drawn from the display area DA.

The second conductive layer 440 may be disposed on the same layer as the source electrode 310 and the drain electrode 311. The second conductive layer 440 may be formed of the same material in the same process as the source electrode 310 and the drain electrode 311. In one embodiment, the second conductive layer 440 may have a structure in which titanium (Ti) / aluminum (Al) / titanium (Ti) are stacked. The structure of the second conductive layer 440 may be various embodiments. The second conductive layer 440 may be electrically connected to the first conductive layer 430 through the contact hole 333a.

In one embodiment, the lower conductive layer 410 has a structure in which a first conductive layer 430 and a second conductive layer 440 are stacked. However, the lower conductive layer 410 can be modified in various ways. For example, the lower conductive layer 410 may be disposed as a single layer, or may be disposed as three or more conductive layers.

The lower conductive layer 410 may include not only the gate electrode 303, the source electrode 310 and the drain electrode 311 but also the first electrode 313 provided in the organic light emitting diode OLED, , And the second electrode 315, respectively.

The elastic layer 500 may be disposed on the second conductive layer 440. The elastic layer 500 may cover at least one region of the second conductive layer 440. The elastic layer 500 may have a structure in which a plurality of elastic layers 510 to 530 are laminated. The elastic layer 520 of at least one of the plurality of elastic layers 510 to 530 may include a curvature pattern.

Specifically, the elastic layer 500 includes a first elastic layer 510 as a first layer, a second elastic layer 520 as a second layer disposed on the first elastic layer 510, Layer 520 and a third elastic layer 530, which is a third layer.

The first elastic layer 510 may be disposed directly on the top surface of the second conductive layer 440. The first elastic layer 510 may be a flat surface. The first elastic layer 510 may be disposed on the same layer as the protective layer 312 covering the source electrode 310 and the drain electrode 311. The first elastic layer 510 may be formed of the same material in the same process as the protective layer 312. The first elastic layer 510 may include an organic material.

The second elastic layer 520 may be disposed on the first elastic layer 510. The second elastic layer 520 may include a curvature pattern at a portion where the upper conductive layer 420 contacts. The second elastic layer 520 may be plural. Each of the second elastic layers 520 may be disposed on the first elastic layer 510 so as to be spaced apart from each other. Each second resilient layer 520 may comprise a hemispherical or semi-ellipsoidal shape. In another embodiment, the second elastic layer 520 is not limited to any shape as long as it has a curvature pattern.

The second elastic layer 520 may be disposed on the same layer as the pixel defining layer 316 defining the sub-pixel region. The second elastic layer 520 may be formed of the same material in the same process as the pixel defining layer 315. The second elastic layer 520 may include an organic material.

The third elastic layer 530 may be disposed on the second elastic layer 520. In one embodiment, the third elastic layer 530 may cover the upper surface of the first elastic layer 510 and the upper surface of the second elastic layer 520. In another embodiment, the third elastic layer 530 may cover only the outer surface of the second elastic layer 520.

The third elastic layer 530 may be disposed on the same layer as any one of the insulating films 323 and 324 for the touch electrode covering the touch electrode 322. The third elastic layer 530 may be formed of the same material in the same process as the insulating films 323 and 324 for the touch electrodes. The third elastic layer 530 may include an organic material.

In one embodiment, if the elastic layer 500 has a curvature pattern and includes a single layer of elastic layers spaced apart from each other, the laminate structure of the elastic layer 500 can be variously modified .

The upper conductive layer 420 may extend to a region where the lower conductive layer 410 is disposed and a region where the elastic layer 500 is disposed. Specifically, the upper conductive layer 420 extends over a region of the second conductive layer 440 of FIG. 5A and a region of the elastic layer 500 covering the second conductive layer 440 of FIG. 5B .

The size of the upper conductive layer 420 may be larger than that of the lower conductive layer 410. The upper conductive layer 420 may be sized to cover the lower conductive layer 410. The upper conductive layer 420 may be disposed on the lower conductive layer 410 in an island shape. The upper conductive layer 420 may be disposed on the same layer as the touch electrode 322. The upper conductive layer 420 may be formed of the same material in the same process as the touch electrode 322.

At least a portion of the upper conductive layer 420 may be electrically connected to at least a portion of the lower conductive layer 410 in a region where the elastic layer 500 is not disposed. In this way, the lower conductive layer 410 and the upper conductive layer 420 are not electrically connected over the entire region, but may be electrically connected in a region where the elastic layer 500 is not present.

In one embodiment, a portion of the top conductive layer 520 is directly connected to an exposed region of the bottom conductive layer 410, and another portion of the top conductive layer 520 has a curvature pattern The second elastic layer 520 may be disposed on the second elastic layer 520.

The driving terminal 580 may be electrically connected to the pad terminal 400 having the above-described structure. Specifically, a circuit pattern 561 may be disposed under the driving IC 560. The insulating film 562 may cover a part of the circuit pattern 561. The driving terminal 580 may be electrically connected to the circuit pattern 561. The driving terminal 580 includes bumps. The driving terminal 580 may be formed of gold (Au), copper (Cu), indium (In), solder, copper-nickel (Cu-Ni)

An adhesive tape 570 may be interposed between the pad terminal 400 and the driving terminal 580. The adhesive tape 570 may be a non-conductive film (NCF). The adhesive tape 570 may be interposed around the area where the pad terminal 400 and the driving terminal 580 are connected to each other.

When a predetermined heat and pressure are applied to the upper portion of the driving IC 560 using a pressure device such as a hot bar, the pad terminal 400 and the driving terminal 580 can be connected. The upper conductive layer 420 may be the uppermost layer of the pad terminal 400 contacting the driving terminal 580. The elastic layer 500 may be disposed directly below the upper conductive layer 420.

When the driving terminal 580 is pressed against the upper conductive layer 420, the driving terminal 580 is electrically connected to the upper conductive layer 420 corresponding to a region where the lower conductive layer 410 and the upper conductive layer 420 are connected 420 and the upper conductive layer 420 corresponding to a region where the lower conductive layer 410 and the upper conductive layer 420 are spaced apart from each other with the elastic layer 500 interposed therebetween do. Accordingly, the pad terminal 400 and the driving terminal 580 can be connected. In one embodiment, the pad terminals 400 and the driving terminals 580 may be in surface contact with each other.

After the bonding, the adhesive tape 570 expands due to moisture absorption, so that interface delamination between the pad terminal 400 and the driving terminal 580 corresponding to each other can occur. The upper conductive layer 420 may include an organic material under the upper conductive layer 420 and an elasticity having a predetermined curvature pattern may be formed in a region where the lower conductive layer 410 and the upper conductive layer 420 are not connected. Layer 500 may be disposed.

A certain pressure is applied to the upper conductive layer 420 by the elasticity of the elastic layer 500 having a plurality of curvature patterns toward the driving terminal 580 so that the upper conductive layer 420 contacts the driving terminal 580. [ 580 can be maintained.

The elastic layer 500 elastically supports the upper conductive layer 420 even if the adhesive tape 570 is expanded due to moisture absorption so that the connection between the pad terminal 400 and the driving terminal 580 Can be robust.

The lower conductive layer 410 and the upper conductive layer 420 may include a gate electrode 303, a source electrode 310, a drain electrode 311, a first electrode 313, a second electrode 315, and the touch electrode 322, respectively.

The elastic layer 500 includes an organic material and includes at least a selected one of an interlayer insulating film 309, a protective film 312, a pixel defining film 316, and insulating films for a touch electrode 323 and 324 And may be disposed in the same layer as one insulating film.

Meanwhile, the elastic layer 500 disposed between the lower conductive layer 410 and the upper conductive layer 420 may be variously modified.

For example, referring to FIGS. 6, 7A, and 7B, the elastic layer 600 may be disposed on the lower conductive layer 410. The elastic layer 600 includes a first elastic layer 610, a second elastic layer 620 disposed on the first elastic layer 610, and a third elastic layer 620 disposed on the second elastic layer 620. [ Layer 630. < / RTI >

The first elastic layer 610 may be disposed directly on the upper surface of the second conductive layer 440. The first elastic layer 610 may be a flat surface. The first elastic layer 610 may be disposed on the same layer as the protective layer 312 covering the source electrode 310 and the drain electrode. The first elastic layer 610 may include an organic material.

The second elastic layer 620 may be disposed on the first elastic layer 610. The second elastic layer 620 may include a curvature pattern at a portion where the upper conductive layer 420 contacts. The second elastic layer 620 may be plural. Each of the second elastic layers 620 may be disposed on the first elastic layer 510 so as to be spaced apart from each other. Each second elastic layer 620 may include a stripe shape extending in a second direction (y direction) of the substrate 301. Each second resilient layer 620 may have a curved cross-section. The second elastic layer 620 may be disposed on the same layer as the pixel defining layer 316 defining the sub-pixel region. The second elastic layer 620 may include an organic material.

The third elastic layer 630 may be disposed on the second elastic layer 620. In one embodiment, the third elastic layer 630 may cover the surface of the first elastic layer 610 and the surface of the second elastic layer 620. In another embodiment, the third elastic layer 560 may cover only the outer surface of the second elastic layer 20. The third elastic layer 630 may be disposed on the same layer as any one of the insulating films 323 and 324 for the touch electrode covering the touch electrode 322. The third elastic layer 630 may include an organic material.

In one embodiment, if the elastic layer 600 has a curvature pattern and includes at least one layer of elastic layers spaced apart from each other, the laminate structure of the elastic layer 600 may have various deformations It can be possible.

The upper conductive layer 420 may extend to a region where the lower conductive layer 410 is disposed and a region where the elastic layer 600 is disposed. Specifically, the upper conductive layer 420 extends over a region of the second conductive layer 440 of FIG. 7A and a region where the elastic layer 600 covering the second conductive layer 440 of FIG. 5B is disposed .

Referring to FIGS. 8, 9A, and 9B, which are modifications of FIG. 6, a resilient layer 800 may be disposed on the lower conductive layer 410. The elastic layer 800 includes a first elastic layer 810, a second elastic layer 820 disposed on the first elastic layer 810, and a third elastic layer 820 disposed on the second elastic layer 820, Layer 830,

The first elastic layer 810 may be disposed directly on the upper surface of the second conductive layer 440. The first elastic layer 810 may include an organic material.

The second elastic layer 820 may be disposed on the first elastic layer 810. The second elastic layer 820 may include a curvature pattern at a portion where the upper conductive layer 420 contacts. The second elastic layer 820 spaced apart by a predetermined distance may include a stripe shape extending in the second direction (y direction) of the substrate 301. Each second resilient layer 820 may have a curved cross-section. 6, the second elastic layer 821 disposed at the outermost portion may cover one edge of the first elastic layer 810. The second elastic layer 820 may include an organic material.

The third elastic layer 830 may be disposed on the second elastic layer 820. In one embodiment, the third resilient layer 830 may cover the surface of the first resilient layer 810 and the surface of the second resilient layer 820 as well. In another embodiment, the third elastic layer 830 may cover only the outer surface of the second elastic layer 820. The third elastic layer 830 may include an organic material.

In one embodiment, if the resilient layer 800 has a curvature pattern and includes at least one layer of resilient layers spaced apart from one another, the resilient layer 800 may have a variety of configurations, It can be possible.

The upper conductive layer 420 may extend to a region where the lower conductive layer 410 is disposed and a region where the elastic layer 800 is disposed. Specifically, the upper conductive layer 420 extends over a region of the second conductive layer 440 of FIG. 9A and a region where the elastic layer 800 covering the second conductive layer 440 of FIG. 9B is disposed .

In one embodiment, the shape of the resilient layer and the laminated structure of the resilient layer can be variously modified.

Referring to FIG. 18, the elastic layer 1800 may be disposed on the lower conductive layer 410. The elastic layers 1800 may have a two-layer structure, while the elastic layers 1800 may have a three-layer structure. Specifically, the elastic layer 1800 includes a first elastic layer 1810 having a predetermined curvature pattern and a second elastic layer 1820 disposed on the first elastic layer 1810. The first elastic layer 1810 according to this embodiment can integrally form the first elastic layer 510 of FIG. 5B and the second elastic layer 520 having a predetermined curvature pattern by using one mask . The shape of the first elastic layer 1810 may include a hemisphere or a semi-ellipsoid shape.

In another embodiment, the first resilient layer 1810 includes a stripe shape extending in a second direction (y direction) of the substrate 301, and each curvature pattern may have a curved cross section.

The first elastic layer 1810 may be disposed on the same layer as the protective film 312 covering the source electrode 310 and the drain electrode 311 or may be disposed on the same layer as the pixel defining film 316 defining the sub- However, the first elastic layer 1810 is not limited to any one as long as it includes an organic material.

The second elastic layer 1820 may cover the first elastic layer 1810. The second resilient layer 1820 may be disposed on the same layer as any one of the insulating films for the touch electrode 323 324 covering the touch electrode 322. The second resilient layer 1820 may be formed of an organic ≪ / RTI >

Referring to FIG. 19, a single layer of elastic layer 1900 may be disposed on the lower conductive layer 410. Specifically, the elastic layer 1900 is a single layer structure having a predetermined curvature pattern. In the elastic layer 1900 according to the present embodiment, two or more elastic layers can be integrally formed using one mask. The elastic layer 1900 is not limited to any particular structure as long as it has a predetermined curvature pattern.

The elastic layer 1900 includes a protective layer 312 covering the source electrode 310 and the drain electrode 311 formed on the substrate 301, a pixel defining layer 316 defining a sub pixel region, And may be disposed on the same layer as any one of the insulating films 323 and 324 for the touch electrode covering the electrodes 322. [ The elastic layer 1900 may include an organic material.

The lower conductive layer 410, the upper conductive layer 420, and the elastic layer may be formed of a conductive material including an electrode disposed in the display area DA and an insulating material for insulating the conductive material Various modifications may be possible.

Referring to FIG. 20, a first conductive portion 327 may be disposed on the TFT. The first conductive portion 327 may form a source electrode, a drain electrode, or a data line. The first conductive part 327 may be connected to the semiconductor layer 303 through a contact hole formed in the gate insulating film 307 and the interlayer insulating film 309.

The first conductive portion 327 may be formed of one selected from the group consisting of Al, Pt, Pd, Ag, Mg, Au, Ni, May be formed as a single layer or multiple layers of at least one material selected from the group consisting of Ir, Cr, Li, Ca, Mo, Ti, W and Cu. have. In one embodiment, the first conductive part 327 may be a laminated structure of titanium (Ti) / aluminum (Al) / titanium (Ti).

A first protective layer 328 may be disposed on the first conductive portion 327. The first passivation layer 328 may be an organic insulating layer. The first protective film 328 may be a passivation film or a planarizing film. The first protective layer 328 may cover the first conductive portion 327. An inorganic insulating layer (not shown) may be further formed between the first conductive part 327 and the first protective film 328 to prevent oxidation of the first conductive part 327.

A second conductive portion 329 may be disposed on the first protective layer 328. The second conductive part 329 may be connected to the first conductive part 327 through a contact hole formed in the first protective film 328. The second conductive portion 329 may reduce the generation of parasitic capacitance between the gate electrode 308 and the first electrode 313. [ The second conductive portion 329 may be substantially the same material as the first conductive portion 327.

The second protective layer 330 may be disposed on the second conductive portion 329. The second passivation layer 330 may be an organic insulating layer. The second protective layer 330 may cover the second conductive portion 329. An inorganic insulating layer (not shown) may be further formed between the second conductive portion 329 and the second protective layer 330.

An organic light emitting diode (OLED) may be disposed on the second passivation layer 330. The organic light emitting diode OLED includes a first electrode 313 corresponding to a pixel electrode, an intermediate layer 314 including an organic light emitting layer, and a second electrode 315 corresponding to a counter electrode. The first electrode 313 may be connected to the second conductive portion 329 through a contact hole formed in the second protective layer 330. The first conductive portion 327 and the second conductive portion 329 may be an intermediate connection layer for connecting the semiconductor layer 303 and the first electrode 315. The organic light emitting diode OLED may be electrically connected to the thin film transistor TFT by the first conductive portion 327 and the second conductive portion 329.

In this embodiment, the first conductive layer 430 may be disposed on the same layer as the gate electrode 308. The first conductive layer 430 may be formed of the same material as the gate electrode 308.

The second conductive layer 440 disposed on the first conductive layer 430 may be disposed on the same layer as the first conductive portion 327. The second conductive layer 440 may be formed of the same material as the first conductive portion 327. The second conductive layer 440 may have a structure in which titanium (Ti) / aluminum (Al) / titanium (Ti) are stacked.

The elastic layer 2010 may be disposed on the second conductive layer 440. The elastic layer 2010 includes a first elastic layer 2011 which is a first layer and a second elastic layer 2012 which is disposed on the first elastic layer 2011 and which is a second layer.

The first elastic layer 2011 may be disposed on the same layer as the first protective layer 328 covering the first conductive portion 327. The first elastic layer 2011 may be formed of the same material in the same process as the first protective layer 328. The first elastic layer 2011 may include an organic material.

The second elastic layer 2012 may include a predetermined curvature pattern at a portion where the upper conductive layer 420 contacts. The second elastic layer 2012 is not limited to any shape as long as it has a curvature pattern.

The second elastic layer 2012 may be disposed on the same layer as the second protective layer 330 covering the second conductive portion 329. The second elastic layer 2012 may be formed of the same material in the same process as the second protective layer 330. The second elastic layer 2012 may include an organic material. Although not shown, it is needless to say that an organic insulating layer may be further formed on the second elastic layer 2012.

The upper conductive layer 420 may be disposed on the same layer as the touch electrode 322. The upper conductive layer 420 may be formed of the same material in the same process as the touch electrode 322.

The lower conductive layer 410 and the upper conductive layer 420 may be disposed in the same layer as the conductive material including the plurality of electrodes disposed in the display region, The insulating material may be disposed in the same layer as the selected insulating material.

On the other hand, the driving terminal 580 can be connected to the pad terminal 400 by a predetermined pressing force. During the pressing process, when the pressing force is increased in the area where the corresponding pad terminal 400 and the driving terminal 580 are connected, a part of the elastic layer 500, 600, 800, 1800, 1900, 2010, It can be broken. In order to disperse the pressing force applied to the connected region, the elastic layer of one layer provided on the elastic layer 500, 600, 800, 1800, 1900, 2010 of the laminated structure extends over the neighboring pad terminal 400 .

FIG. 10 is a perspective view illustrating a plurality of pad terminals 400 disposed on a substrate 301 according to an embodiment of the present invention, FIG. 11 is a plan view showing a plurality of pad terminals 400 of FIG. 10 12A is a sectional view showing that the driving terminal 580 is connected to the pad terminal 400 shown cut along the line I-I in FIG. 11, and FIG. 12B is a cross-sectional view taken along the line II- Sectional view showing that the driving terminal 580 is connected to the pad terminal 400 shown in the figure.

Referring to FIGS. 10, 11, 12A, and 12B, a plurality of pad terminals 400 may be disposed in a pad region of the substrate 301. Each pad terminal 400 includes a lower conductive layer 410 and an upper conductive layer 420 disposed on the lower conductive layer 410. In one embodiment, a plurality of pad terminals 400 may be spaced apart on the substrate 301.

The elastic layer 1100 may be disposed between the lower conductive layer 410 and the upper conductive layer 420. The elastic layer 1100 includes a first elastic layer 1110, a second elastic layer 1120 disposed on the first elastic layer 1110, and a third elastic layer 1120 disposed on the second elastic layer 1120, Layer 1130, as shown in FIG.

One elastic layer provided in the elastic layer 1100 of the multilayer structure may extend between pad terminals 400 adjacent to each other in the first direction (x direction) of the substrate 301. Specifically, the first resilient layer 1110 may extend over an interval d between the second conductive layer 440 and the neighboring pad terminals 400 of the adjacent pad terminals 400.

The first elastic layer 1110 may extend in a first direction (x direction) intersecting the second direction (y direction) in which the upper conductive layer 410 and the lower conductive layer 410 extend. The first elastic layer 1110 may have a stripe shape and a flat surface. Both ends 1111 of the first elastic layer 1110 may protrude to the outside of the edge of the upper conductive layer 420 in the first direction (x direction). The first elastic layer 1110 may include an organic material.

The second resilient layer 1120 may be disposed in a corresponding region on the first resilient layer 1110 of each pad terminal 400. The second elastic layer 1120 may include a curvature pattern at a portion where the upper conductive layer 520 contacts. The second resilient layer 1120 may be spaced apart from the pad terminals 400. In another embodiment, the second resilient layer 1120 may be integral with the first resilient layer 1110. The second elastic layer 1120 may include an organic material.

The third elastic layer 1130 may be disposed on the second elastic layer 1120. In one embodiment, the third elastic layer 1130 may cover the surface of the first elastic layer 1110 and the surface of the second elastic layer 1120. In another embodiment, the third elastic layer 1130 may cover only the outer surface of the second elastic layer 1120. The third elastic layer 1130 may include an organic material.

Each upper conductive layer 420 may extend to a region where each lower conductive layer 410 is disposed and a region where the elastic layer 1100 is disposed. Each upper conductive layer 420 may extend over a region of the second conductive layer 440 of Figure 12A and a region of the elastic layer 1110 covering the second conductive layer 440 of Figure 12B have. At this time, each upper conductive layer 420 is located on the first elastic layer 1110 and may not cover the protruding end 1111 of the first elastic layer 1110.

Since the elastic layer 1110 having the first elastic layer 1110 extends over the neighboring pad terminal 400 so that the pressure is dispersed even when a predetermined pressing force is applied, It is possible to prevent a side portion of the battery pack 10 from being damaged.

In the present embodiment, the first elastic layer 1110 extends over two adjacent pad terminals 400, but the number of the pad terminals 400 is not limited thereto. 13, the resilient layer 1300 may extend over three or more pad terminals 400, or the resilient layer 1400 may extend between two neighboring pad terminals 400 (as shown in FIG. 14) 400 and neighboring three pad terminals 400 or the elastic layer 2100 may extend over a single pad terminal 400 as shown in FIG.

In another embodiment, as shown in Fig. 22, the end 2201 of the elastic layer 2200 may be inclined at a gentle angle. As described above, the elastic layer 2200 is not limited to any one as long as a predetermined curvature pattern is formed on a part of the outer surface of the elastic layer 2200.

In one embodiment, a flow space for the flow of the molten adhesive material of the adhesive tape 570 may be required between the adjacent plurality of elastic layers 1100, 1300, 1400, 2100, 2200.

FIG. 15 is a perspective view showing a plurality of pad terminals 400 disposed on a substrate 301 according to another embodiment of the present invention, FIG. 16 is a plan view showing a plurality of pad terminals 400 of FIG. 15 17A is a sectional view showing that the driving terminal 580 is connected to the pad terminal 400 cut along the line I-I in FIG. 16, and FIG. 17B is a cross-sectional view taken along the line II- Sectional view showing that the driving terminal 580 is connected to the pad terminal 400 shown in the figure.

Referring to FIGS. 15, 16, 17A and 17B, a plurality of pad terminals 400 may be disposed in a pad region of the substrate 301. Each pad terminal 400 includes a lower conductive layer 410 and an upper conductive layer 420 disposed on the lower conductive layer 410. In one embodiment, a plurality of pad terminals 400 may be spaced apart on the substrate 301.

The elastic layer 1600 may be disposed between the lower conductive layer 410 and the upper conductive layer 420. The elastic layer 1600 includes a first elastic layer 1610, a second elastic layer 1620 disposed on the first elastic layer 1610, and a third elastic layer 1620 disposed on the second elastic layer 1620. [ Layer 1630. In one embodiment,

The first resilient layer 1610 is spaced apart from the second conductive layer 440 and adjacent pad terminals 400 of the pad terminals 400 adjacent to each other in the first direction (x direction) d. < / RTI > The first elastic layer 1610 may have a stripe shape and a flat surface. 11, both ends 1611 of the first resilient layer 1610 may be positioned inside the edge of the upper conductive layer 420 in the first direction (x direction). The first elastic layer 1610 may include an organic material.

The second resilient layer 1620 may be disposed in a corresponding region on the first resilient layer 1610 of each pad terminal 400. The second elastic layer 1620 may include a curvature pattern at a portion where the upper conductive layer 520 contacts. The second elastic layer 1620 may be spaced apart from each other on the pad terminals 400. In another embodiment, the second resilient layer 1620 may be integral with the first resilient layer 1610. The second elastic layer 1620 may include an organic material.

The third elastic layer 1630 may be disposed on the second elastic layer 1620. In one embodiment, the third elastic layer 1630 may cover the surface of the first elastic layer 1610 and the surface of the second elastic layer 1620. In another embodiment, the third elastic layer 1630 may cover only the outer surface of the second elastic layer 1620. The third elastic layer 1630 may include an organic material.

Each upper conductive layer 420 may extend to a region where each lower conductive layer 410 is disposed and a region where the elastic layer 1600 is disposed. Each upper conductive layer 420 may extend over a region of the second conductive layer 440 of Figure 17A and a region of the elastic layer 1600 covering the second conductive layer 440 of Figure 17B have. At this time, each upper conductive layer 420 may cover the end portion 1611 of the first elastic layer 1610.

As described above, the elastic layer 1600 including the first elastic layer 1610 extends over the neighboring pad terminals 400, so that the side of the elastic layer 1600 due to the pressing force is prevented from being damaged can do.

300 ... display panel 301 ... substrate
333 ... insulating film 400 ... pad terminal
410 ... lower conductive layer 420 ... upper conductive layer
430 ... first conductive layer 440 ... second conductive layer
500 ... elastic layer 510 ... first elastic layer
520 ... second elastic layer 530 ... third elastic layer
560 ... driving IC 570 ... adhesive tape
580 ... driving terminal

Claims (20)

Board; And
And a plurality of pad terminals disposed on the substrate,
Each pad terminal of the plurality of pad terminals has at least one lower conductive layer and an upper conductive layer disposed on the lower conductive layer,
Wherein at least one elastic layer is disposed between the lower conductive layer and the upper conductive layer to cover at least one region of the lower conductive layer and at least a portion of the lower conductive layer and / A display device electrically connected in an unplaced area. The method according to claim 1,
Wherein the upper conductive layer extends over a region where the lower conductive layer is disposed and a region where the elastic layer is disposed,
Wherein the at least one elastic layer includes a curvature pattern at a portion where the upper conductive layer contacts. 3. The method of claim 2,
Wherein the elastic layer comprises a plurality of laminated elastic layers,
Wherein the elastic layer of any one of the plurality of elastic layers comprises a curvature pattern. The method of claim 3,
Wherein the elastic layer comprises an organic material. The method of claim 3,
The elastic layer
A first elastic layer disposed on the lower conductive layer; And
At least one second resilient layer disposed on the first resilient layer and having the curvature pattern; And
And a third elastic layer disposed on the second elastic layer. 6. The method of claim 5,
Wherein the second elastic layer is plural and each second elastic layer is disposed on the first elastic layer. The method according to claim 6,
Wherein each second elastic layer comprises a hemispherical or semi-ellipsoidal shape. The method according to claim 6,
Each second elastic layer having a curved cross section and including a stripe shape extending in one direction of the substrate. 8. The method of claim 7,
And the second elastic layer disposed at the outermost one of the plurality of second elastic layers covers one edge of the first elastic layer. 6. The method of claim 5,
And a plurality of elastic layers selected from the first elastic layer, the second elastic layer and the third elastic layer are integrated. 6. The method of claim 5,
A thin film transistor having a semiconductor layer, a gate electrode, a source electrode, and a drain electrode, an organic light emitting element having a first electrode, a light emitting layer, and a second electrode, a touch screen having a plurality of touch electrodes, A plurality of insulating films sandwiched between the insulating films,
Wherein the lower conductive layer and the upper conductive layer are disposed on the same layer as each selected one of the electrodes, and the elastic layer is disposed on the same layer as at least one insulating film selected from the plurality of insulating films. 12. The method of claim 11,
Wherein the lower conductive layer comprises:
A first conductive layer; And
And a second conductive layer disposed on the first conductive layer,
Wherein the first elastic layer extends on an upper surface of the second conductive layer,
A fourth elastic layer covering at least a portion of the first conductive layer and having a contact hole exposing a portion of the first conductive layer is disposed between the first conductive layer and the second conductive layer,
Wherein the first conductive layer and the second conductive layer are electrically connected through the contact hole. 13. The method of claim 12,
Wherein the lower conductive layer is spaced apart from the substrate and at least one of the lower conductive layers is connected to the wiring drawn out from the active area of the substrate,
And the upper conductive layer is disposed in an island shape on the lower conductive layer. 12. The method of claim 11,
Wherein the lower conductive layer is disposed on the same layer as the selected one of the gate electrode, the source electrode, the drain electrode, the first electrode, and the second electrode, the upper conductive layer is disposed on the same layer as the touch electrode,
The first elastic layer is disposed on the same layer as the first insulating layer covering the source electrode and the drain electrode and the second elastic layer is disposed on the same layer as the second insulating layer defining the sub- And the third elastic layer is disposed in the same layer as the third insulating film covering the touch electrode. 6. The method of claim 5,
A plurality of pad terminals are disposed on the substrate so as to be spaced apart from each other,
And the elastic layer of any one of the plurality of elastic layers extends across the neighboring pad terminals. 16. The method of claim 15,
Wherein the elongate elastic layer extends over an interval between each lower conductive layer of the neighboring pad terminals and adjacent pad terminals. 17. The method of claim 16,
Wherein the elongated elastic layer extends in a direction crossing the extending direction of the upper conductive layer and the lower conductive layer. 17. The method of claim 16,
Wherein the extended elastic layer corresponds to the first elastic layer,
The second resilient layer is disposed on the first resilient layer of each pad terminal,
Wherein the third elastic layer extends over an interval between the first elastic layer, the second elastic layer, and the adjacent pad terminals. 17. The method of claim 16,
Wherein both ends of the first resilient layer are protruded outside the edge of the upper conductive layer and the upper conductive layer is not covered with the protruding region of the first resilient layer. 17. The method of claim 16,
Wherein both ends of the first resilient layer are located inside the edge of the upper conductive layer, and both ends of the first resilient layer are covered by the upper conductive layer.

Images