KR20170126279A - High temperature substrate for manufacturing microstructure, microstructure and method for manufacturing thereof using the same - Google Patents

Abstract

The present invention relates to a high temperature substrate for manufacturing a microstructure which comprises a substrate for melting a solid for manufacturing a microstructure, wherein a temperature of the substrate is higher than a softening point of the solid; to the microstructure using the same; and a method for manufacturing the high temperature substrate.

Description

TECHNICAL FIELD [0001] The present invention relates to a high-temperature substrate for manufacturing a microstructure, a microstructure using the substrate, and a method of manufacturing the same. BACKGROUND OF THE INVENTION [0002]

The present invention relates to a high-temperature substrate for manufacturing a microstructure, a microstructure using the substrate, and a method of manufacturing the same.

Common hypodermic needles are a limiting factor in the use of blood sampling, diagnosis, and drug infusion in clinical practice, as many people develop phobias and pain during use and leave trauma. To solve this problem, micro needle is being proposed as an alternative.

Conventionally, in order to produce hollow micro-needles among micro needles, SU-8 sensitizer, which is an expensive polymer capable of being present in a viscous state while having excellent mechanical properties upon curing, There are limitations that require complicated manufacturing processes and difficult temperature control.

Thus, there is a need for a method for easily manufacturing micro needles, particularly hollow micro needles, without using a SU-8 photosensitive agent in a viscous state.

The present invention provides a substrate for melting a solid for fabricating a microstructure, wherein a temperature of the substrate is higher than a softening point of the solid material.

However, the technical problem to be solved by the present invention is not limited to the above-mentioned problems, and other matters not mentioned can be clearly understood by those skilled in the art from the following description.

The present invention provides a high-temperature substrate for manufacturing a microstructure, which comprises a substrate for melting a solid for manufacturing a microstructure, wherein the temperature of the substrate is higher than the softening point of the solid.

And at least one pillar integrally formed on the substrate.

The temperature of the substrate or pillars may be 100 ° C or higher.

The high temperature substrate may be disposed on a heating substrate.

In one embodiment of the present invention, there is provided a method of manufacturing a semiconductor device, comprising: (a) preparing the high-temperature substrate; (b) forming a solid on the lower substrate, and then placing the solids away from the hot substrate; (c) melting the solid through the substrate or pillar of the high temperature substrate; And (d) molding the molten solid material.

The temperature of the substrate or pillar of the high-temperature substrate may be 100 ° C or higher.

The high-temperature substrate may be arranged on a heating substrate.

The solid may have a weight average molecular weight of 5,000 to 500,000.

The softening point of the solid may be from 50 캜 to 150 캜.

The solid material may be selected from the group consisting of a styrenic polymer, an amide polymer, an ethylene polymer, an ester polymer, an acrylic polymer, an acetyl polymer, a Teflon polymer, a vinyl chloride polymer, a urethane polymer, a nylon polymer, a sulfone polymer, And the like.

The molding may be performed through extension and curing.

The effective length of the formed solids can be adjusted according to the extension rate.

The effective length of the shaped solids can be extended by immersing the upper end of the molded solid tip in a solvent for solubilization of the solids.

And cooling the substrate or the pillar of the high-temperature substrate to a temperature lower than the softening point of the solid after the molding.

(e) depositing a metal on the molded solid and then plating the metal; And (f) removing the molded solid.

In another embodiment of the present invention, microstructures prepared by the above method are provided.

The method of manufacturing a microstructure using a high-temperature substrate according to the present invention can induce the solidification of a solid material by melting the solid material through a substrate or a pillar of a high-temperature substrate having a temperature higher than the softening point of the solid material. Further, after the molten solid is formed, the microstructure having various shapes such as various effective lengths can be finally manufactured by cooling the temperature of the substrate or the pillars to a temperature lower than the softening point of the solid material.

According to the present invention, it is possible to mass-produce and reduce the production cost while securing the productivity, uniformity and quality of the microstructure.

1 illustrates a high temperature substrate for fabricating microstructures according to various embodiments of the present invention.
2 is a flowchart illustrating a method of manufacturing a microstructure according to an embodiment of the present invention.
3 illustrates a method of fabricating a microstructure according to various embodiments of the present invention.
4 is a photograph showing solid type micro needles manufactured according to Example 1. Fig.

The present inventors have found that, even when a solid material having a high weight average molecular weight is used without using a SU-8 photosensitive agent in a viscous state as in the prior art, it is possible to induce the viscosity of the solid material from the melting process of the solid material through the high- And completed the present invention.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings, which will be readily apparent to those skilled in the art to which the present invention pertains. The present invention may be embodied in many different forms and is not limited to the embodiments described herein.

In the drawings, the thickness is enlarged to clearly represent the layers and regions. In the drawings, for the convenience of explanation, the thicknesses of some layers and regions are exaggerated.

Hereinafter, the formation of an arbitrary structure in the above-mentioned " upper (or lower) " means not only that an arbitrary structure is formed in contact with the upper (or lower) And the present invention is not limited to the configuration including any other configuration.

Hereinafter, the present invention will be described in detail.

High Temperature Substrate for Microstructure Production

The present invention provides a high-temperature substrate for manufacturing a microstructure, which comprises a substrate for melting a solid for manufacturing a microstructure, wherein the temperature of the substrate is higher than the softening point of the solid. And at least one pillar integrally formed on the substrate. In addition, the high temperature substrate for manufacturing the microstructure may be disposed on the heating substrate.

The microstructure can be manufactured by using the high-temperature substrate for manufacturing the microstructure.

1 illustrates a high temperature substrate for fabricating microstructures according to various embodiments of the present invention.

As shown in FIGS. 1 (a) and (b), a high-temperature substrate for manufacturing a microstructure according to an embodiment of the present invention includes a substrate 10 for melting a solid for manufacturing a microstructure, And the temperature is higher than the softening point of the solids. As shown in FIG. 1 (a), the high-temperature substrate for manufacturing the microstructure may be integrally formed on the heating substrate 20 for maintaining the high-temperature state, and as shown in FIG. 1 (b) The high temperature substrate for manufacturing the microstructure may be disposed separately on the heating substrate 20 for maintaining the high temperature state.

1 (c) to 1 (d), a high-temperature substrate for manufacturing a microstructure according to an embodiment of the present invention includes a substrate 10 for melting a solid material for manufacturing a microstructure, And at least one pillar (15), wherein the temperature of the pillar (15) is higher than the softening point of the solid. 1 (c), the high-temperature substrate for manufacturing the microstructure may be integrally formed on the heating substrate 20 to maintain the high-temperature state, and as shown in FIG. 1 (d) The high temperature substrate for manufacturing the microstructure may be disposed separately on the heating substrate 20 for maintaining the high temperature state.

First, a high-temperature substrate for fabricating a microstructure according to the present invention includes a substrate for melting a solid for fabricating a microstructure, wherein a temperature of the substrate is higher than a softening point of the solid. And at least one pillar integrally formed on the substrate.

As used herein, the term " substrate " is used not only as a substrate having a flat surface shape but also as a concept including a substrate having various surface shapes.

Preferably, the substrate is used for melting a solid for fabricating a microstructure. In order to manufacture a microstructure having a tip from a solid material using the substrate, the solid material is preferably partially formed on the lower substrate.

Also, in this specification, the term "pillar" is used not only as a substrate including a column as a synonym, but also a concept including a substrate including a protrusion in the broad sense.

The pillar may also be formed integrally on the substrate for melting the solid for manufacturing the microstructure. At this time, the pillars are integrally formed on the substrate, and a plurality of pillars may be formed at regular intervals.

In order to produce a microstructure having a tip from a solid material using the pillar, the solid material may be partially formed on the lower substrate so as to correspond to the pillar (including a corresponding region through contact with or contact with the pillar) Or may be formed as a whole.

When a plurality of pillars are integrally formed on the substrate, a plurality of spots of the solid material can be melted through the plurality of pillars. Therefore, a plurality of microstructures can be finally manufactured, and an array-type microstructure can be manufactured, which enables the mass production of microstructures.

The pillar may have various shapes such as a cylinder, a polygonal column, a truncated cone, a polygonal prism, a cone, a polygonal pyramid, a hemispherical shape, and the like.

Also, in the present specification, the term " melting of a solid substance " means that a solid substance is deformed by heating and is used as a concept including both softening and melting of the solid substance.

The substrate or the pillars can maintain a high temperature state such that the solids for manufacturing the microstructure can be melted through the heating substrate. The temperature of the substrate or the pillars is preferably higher than the softening point of the solid material. Specifically, More preferably 100 deg. C or higher, and more preferably 100 deg. C to 200 deg. C, but is not limited thereto.

For example, when a polystyrene having a softening point of 123 to 128 ° C is used as a solid for producing a microstructure, the temperature of the substrate or the pillar may be about 130 ° C or more, which is a temperature higher than the softening point of the solid.

In addition, the high temperature substrate for manufacturing a microstructure according to the present invention may be disposed on a heating substrate.

The heating substrate is used for supporting the high-temperature substrate and maintaining the high-temperature substrate. The heating substrate may be formed integrally with the high-temperature substrate, or may be disposed separately from the high-temperature substrate.

Specifically, the heating substrate may have various surface shapes, and the heating substrate may be a hot plate including various heating means such as hot wire.

Method of manufacturing microstructure

(A) preparing the high temperature substrate; (b) forming a solid on the lower substrate, and then placing the solids away from the hot substrate; (c) melting the solid through the substrate or pillar of the high temperature substrate; And (d) molding the molten solid material. At this time, the manufactured microstructure is a solid type microstructure.

(E) depositing a metal on the shaped solid and then plating the metal; And (f) removing the molded solid. At this time, the manufactured microstructure is a hollow microstructure.

2 and 3 illustrate a method of fabricating a microstructure according to an embodiment of the present invention.

As shown in FIGS. 2 and 3, the method for fabricating a microstructure according to an embodiment of the present invention includes the steps of: (a) preparing the high-temperature substrate; (Step (b) of forming a solid on the lower substrate and then disposing the solids so as to face the high-temperature substrate; Melting the solid material through the substrate or the pillar of the high-temperature substrate (step (c)); And a step (d) of molding the molten solids, optionally, a step of depositing a metal on the molded solid and then plating (step (e)); And removing the molded solid (step (f)). At this time, the microstructures prepared according to steps (a) to (d) are solid microstructures, and the microstructures prepared according to steps (a) to (f) are hollow microstructures.

3 (a), when the high-temperature substrate includes a substrate for melting a solid for fabricating a microstructure, the solid material in the step (b) is partially formed on the lower substrate (a)], a microstructure having a tip portion from the solid material can be produced.

3 (b) and 3 (c), when the high-temperature substrate includes a substrate and a pillar for melting a solid for fabricating a microstructure, the solid material in the step (b) (Refer to FIG. 3 (c)), or a part of the solid part is formed so as to correspond to the pillar (including the corresponding area through contact or non-contact with the pillar) Microstructures can be produced.

3 (a) to 3 (c), in the method of manufacturing a microstructure according to an embodiment of the present invention, the step of molding the molten solid material (step (d) And extruding the solid material from the high-temperature substrate and separating the solid material from the high-temperature substrate, and immersing the upper end of the separated solid material tip in a solvent for dissolving solids.

First, a method of manufacturing a microstructure according to the present invention includes a step of preparing the high-temperature substrate (step (a)).

The high-temperature substrate is used for producing a microstructure, and includes a substrate for melting a solid for producing a microstructure, wherein the temperature of the substrate is higher than the softening point of the solid.

The temperature of the substrate or pillar of the high-temperature substrate may be 100 ° C or higher, and the high-temperature substrate may be arranged on the heating substrate.

The details of the constitution of the high-temperature substrate are as described above in " High-temperature substrate for manufacturing microstructure ".

Next, a method of manufacturing a microstructure according to the present invention includes a step (b) of forming a solid material on a lower substrate and disposing the solid material so as to face the high-temperature substrate.

The lower substrate is used for finally fabricating a microstructure and is used for supporting the fabricated microstructure. Specifically, the lower substrate may support the microstructure directly on the substrate without forming the second pillar, and may be formed of a cylinder, a prism, a truncated cone, a cone, a polygonal pyramid, , Hemispherical shape, and the like, thereby supporting the microstructure and controlling the degree of delivery when the microstructure is penetrated into the skin.

At this time, the lower substrate may have various surface shapes, and may be formed of various materials such as metal and polymer materials.

The solid material is formed on the lower substrate in whole or in part by various methods known in the art, such as coating, and the solid material is a concept distinct from conventional viscous compositions. The solids content is preferably 70% or more, more preferably 90% or more, in a state where moisture is evaporated, but is not limited thereto. The solids can be used to solve the problems due to the difficulty in controlling the viscosity of the conventional viscous compositions by maintaining the solid content in the above range, thereby ensuring the productivity, uniformity and quality of the microstructure.

The solid material may have a high weight average molecular weight and a weight average molecular weight of 5,000 to 500,000, but is not limited thereto. Specifically, the softening point of the solid material is preferably 50 to 150 ° C, but is not limited thereto. Specifically, the solid material may be selected from the group consisting of a styrenic polymer, an amide polymer, an ethylene polymer, an ester polymer, an acrylic polymer, an acetyl polymer, a Teflon polymer, a vinyl chloride polymer, a urethane polymer, a nylon polymer, Based polymer, but it is not limited thereto. In particular, such a polymer material has an advantage over a conventional SU-8 photosensitive material in that it has a cost advantage, and thus it has an advantage that a production cost of a microstructure can be reduced.

The solid material is disposed to face the high-temperature substrate, and the corresponding region through contact or non-contact with the pillars on the high-temperature substrate is referred to as a solid spot.

Next, a method of manufacturing a microstructure according to the present invention includes a step (c) of melting the solid material on the substrate or pillar of the high-temperature substrate.

In order to melt the solid material through the substrate or pillar of the high-temperature substrate, the substrate or pillar and the solid material may be brought into contact with or contacted with the high-temperature substrate. Specifically, the spot of the solid material corresponding to the substrate or the pillar can be melted in the high-temperature substrate to induce the viscosity of the spot of the solid material.

The substrate or pillar of the high-temperature substrate may be maintained at a high-temperature state such that the solid for manufacturing the microstructure can be melted by the heating substrate. The temperature of the substrate or the pillar of the high-temperature substrate is preferably higher than the softening point of the solid, Specifically, the temperature of the substrate or the pillar of the high-temperature substrate is more preferably 100 ° C to 150 ° C, but is not limited thereto.

For example, when polystyrene having a softening point of 123 to 128 ° C is used as a solid for manufacturing a microstructure, the temperature of the substrate or pillars of the high-temperature substrate may be about 130 ° C or more, which is a temperature higher than the softening point of the solid.

Next, a method of manufacturing a microstructure according to the present invention includes a step (d) of molding the molten solid material.

The molding is for producing a microstructure from the molten solid, and may be carried out by various known methods such as molding, extrusion, blowing, suction, centrifugal force, and magnetic field application.

Preferably, the shaping can be carried out through extension and curing. The molded solid can then be separated from the hot substrate.

By adjusting the speed of the extension, the effective length of the formed solid can be adjusted, but the extension speed is preferably 5 mm / s to 15 mm / s, but is not limited thereto.

The effective length of the formed solids can be adjusted according to the extension rate. The longer the extension speed, the longer the effective length of the molded solid (microstructure), and the slower the extension speed, the shorter the effective length of the formed solid (microstructure).

Further, the diameter of the tip end lower end portion of the molded solid can be adjusted according to the toughening area. The larger the viscous area, the larger the diameter of the lower end of the formed solid (microstructure) becomes, and the lower the diameter of the lower end of the formed solid (microstructure) becomes smaller as the viscous area becomes narrower.

And cooling the substrate or the pillar of the high-temperature substrate to a temperature lower than the softening point of the solid material after the molding, so that the microstructure having various shapes such as various effective lengths can be finally manufactured.

For example, when polystyrene having a softening point of 123 to 128 ° C is used as a solid for manufacturing a microstructure, the temperature of the substrate or the pillar of the high-temperature substrate may be cooled to about 120 ° C or lower, which is lower than the softening point of the solid.

The effective length of the shaped solids can be extended by immersing the upper end of the molded solid tip in a solvent for solubilization of the solids.

The solvent for dissolving the solids may be any solvent capable of dissolving the solids. For example, when the solids are polystyrene, acetone may be used as a solvent for dissolving the solids.

Alternatively, the method for fabricating a microstructure according to the present invention may include the steps of: (a) depositing a metal on the molded solid and then plating the metal; And removing the molded solid (step (f)).

The metal for plating is a bio-applicable metal. It has no toxicity or carcinogenicity, has no human rejection reaction, has good mechanical properties such as tensile strength, elastic modulus and abrasion resistance, and has corrosion resistance Any metal known in the art can be used as the metal. Specifically, the metal for plating is preferably at least one selected from the group consisting of stainless steel, aluminum, chromium, nickel, gold, silver, copper, titanium, cobalt and alloys thereof, but is not limited thereto.

By adjusting the plating thickness, various shapes and mechanical properties of the hollow micro-needles to be finally produced can be controlled.

In addition, through the removal of the molded solid, a hollow microstructure can be finally produced, which can be dissolved, burned, or physically removed using an organic solvent.

Thereafter, in order to form voids in the tip portion of the hollow microstructure to be finally produced, it may further include cutting the upper end portion.

Microstructure

The present invention can be manufactured by the above method or can be manufactured using the high temperature substrate.

The microstructure may be used as a micro-blade, a micro-knife, a micro-fiber, a micro-spike, a micro-probe, a microbarb, a microarray or a microelectrode.

The microstructures manufactured by the above method or manufactured using the high-temperature substrate may have various shapes such as various effective lengths. At this time, the effective length of the microstructure can be controlled by an elongation rate during molding or immersion of the solvent after molding, and the diameter of the lower end of the tip portion of the microstructure can be adjusted according to the tackifying area.

The term " effective length " in this specification means a vertical length from the upper end of the tip to the surface of the third substrate, and may be 100 to 10,000 m, 200 to 10,000 m, 300 to 8,000 m or 500 to 5,000 m.

The term " tip of the tip portion " in the present specification means one end portion of the tip portion having the smallest diameter, and may be 1 to 500 탆, 2 to 300 탆 or 5 to 100 탆 in diameter. The term " lower end of the tip portion " in the present specification means one end portion of the tip portion having the largest diameter, and may be 50 to 1,000 탆.

As described above, the method of manufacturing a microstructure using the high-temperature substrate according to the present invention can induce the solidification of the solid material by melting the solid material through the substrate or the pillar of the high-temperature substrate having a temperature higher than the softening point of the solid material. Further, after the molten solid is formed, the microstructure having various shapes such as various effective lengths can be finally manufactured by cooling the temperature of the substrate or the pillars to a temperature lower than the softening point of the solid material.

According to the present invention, it is possible to mass-produce and reduce the production cost while securing the productivity, uniformity and quality of the microstructure.

Hereinafter, preferred embodiments of the present invention will be described in order to facilitate understanding of the present invention. However, the following examples are provided only for the purpose of easier understanding of the present invention, and the present invention is not limited by the following examples.

[ Example ]

Example  One

A substrate having a width of 4 cm and a length of 4 cm formed on a hot plate and formed of a plurality of aluminum material pillars (130 ° C or higher) (pillar diameter: 250 μm, pillar height: 3 mm, pillar spacing: 2 mm) Was prepared. On the other hand, a solid material of polystyrene polymer (Mw = 35,000) (softening point = 123 ~ 128 ° C) was entirely coated on a glass substrate, and the solid material was arranged to face the high temperature substrate. Thereafter, the solids were contacted with the pillars of the hot substrate for about 2 seconds to melt the corresponding solids spots to induce toughening of the solids. Thereafter, the molten solid was cured while extending at a low temperature of 120 DEG C or lower at a speed of about 10 mm / s, and then molded by separation. A solid type micro needle array was finally prepared on a glass substrate by extending the effective length of the molded solid by immersing the upper end of the tip of the molded solid in an acetone solvent (effective length = about 2455 to 3508 mm, (tip) diameter = about 83 to 87 mu m, and the diameter of the lower end of the tip portion = 200 to 300 mu m) (see Fig. 4).

It will be understood by those skilled in the art that the foregoing description of the present invention is for illustrative purposes only and that those of ordinary skill in the art can readily understand that various changes and modifications may be made without departing from the spirit or essential characteristics of the present invention. will be. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive.

Claims (16)

And a substrate for melting the solid for manufacturing the microstructure,
Characterized in that the temperature of the substrate is higher than the softening point of the solid
High temperature substrates for manufacturing microstructures.
The method according to claim 1,
Further comprising at least one pillar integrally formed on the substrate
High temperature substrates for manufacturing microstructures.
3. The method according to claim 1 or 2,
The temperature of the substrate or pillar is 100 DEG C or higher
High temperature substrates for manufacturing microstructures.
The method according to claim 1,
The high temperature substrate is disposed on a heating substrate
High temperature substrates for manufacturing microstructures.
(a) preparing a high-temperature substrate according to claim 1 or 2;
(b) forming a solid on the lower substrate, and then placing the solids away from the hot substrate;
(c) melting the solid through the substrate or pillar of the high temperature substrate; And
(d) molding said molten solids.
A method of manufacturing a microstructure.
6. The method of claim 5,
Wherein the temperature of the substrate or pillar of the high-temperature substrate is 100 占 폚 or higher
A method of manufacturing a microstructure.
6. The method of claim 5,
Wherein the high-temperature substrate is prepared and arranged on a heating substrate
A method of manufacturing a microstructure.
6. The method of claim 5,
The solid has a weight average molecular weight of 5,000 to 500,000
A method of manufacturing a microstructure.
6. The method of claim 5,
The softening point of the solid is from 50 캜 to 150 캜
A method of manufacturing a microstructure.
6. The method of claim 5,
The solid material may be selected from the group consisting of a styrenic polymer, an amide polymer, an ethylene polymer, an ester polymer, an acrylic polymer, an acetyl polymer, a Teflon polymer, a vinyl chloride polymer, a urethane polymer, a nylon polymer, a sulfone polymer, Comprising at least one member selected from the group consisting of
A method of manufacturing a microstructure.
6. The method of claim 5,
The molding is carried out by extension and curing.
A method of manufacturing a microstructure.
12. The method of claim 11,
The effective length of the shaped solids is controlled according to the extension rate
A method of manufacturing a microstructure.
6. The method of claim 5,
The effective length of the shaped solids extends through the process of immersing the upper end of the molded solid tip in a solvent for solid solubilization
A method of manufacturing a microstructure.
6. The method of claim 5,
Further comprising cooling the substrate or pillar of the high temperature substrate to a temperature below the softening point of the solid after the molding
A method of manufacturing a microstructure.
6. The method of claim 5,
(e) depositing a metal on the molded solid and then plating the metal; And
(f) removing the molded solids
A method of manufacturing a microstructure.
A microstructure produced by the method of claim 5.

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