KR20170120062A - Display apparatus and method of manufacturing the same - Google Patents

Abstract

One embodiment of the present invention is directed to a display device including a central region having at least a display region on a substrate and a peripheral region disposed in the periphery of the central region, Wherein the sealing inorganic film includes a main region and a shadow region connected to the main region, and the shadow region is larger than the main region And a side surface that is formed to be close to an edge of the substrate and has an inclined side surface.

Description

Display apparatus and manufacturing method thereof [0002]

Embodiments of the present invention relate to a display device and a method of manufacturing the same.

2. Description of the Related Art In recent years, the use of display devices has been diversified. Further, the thickness of the display device is thinned and the weight is light, and the range of use thereof is wide.

Particularly, the display device is being replaced by a thin, flat display device that can be carried.

On the other hand, the display device may have a display area on the substrate so that one or more visible light rays can be implemented on the user side, and a display device that implements the light may be formed in the display area.

A sealing film or a sealing member is formed on the display element so as to protect the display element from external foreign substances or the like.

However, the durability of the sealing member is weakened, and the display device can not be protected as desired, so that the durability and image quality characteristics of the display device are limited.

Particularly, the sealing member can not stably cover the display element and is peeled or damaged, thereby reducing the sealing characteristics of the sealing member, which in turn affects the durability and image quality characteristics of the display device.

Embodiments of the present invention provide a display device and a method of manufacturing the same.

One embodiment of the present invention is directed to a display device including a central region having at least a display region partitioned on a substrate and a peripheral region disposed in the periphery of the central region, A display area inorganic film formed so as to extend to one area of the display area inorganic film and a seal part formed on the display area inorganic film so as to cover the display area and being parallel to the edge of the display area inorganic film, A display device including an inorganic film is disclosed.

** In this embodiment, the sealing inorganic film may have a smaller size than the substrate so that the edge of the sealing inorganic film is spaced from the edge of the substrate.

In the present embodiment, the display area inorganic film may have a smaller size than the substrate so that the edge of the display area inorganic film is spaced apart from the edge of the substrate.

In this embodiment, at least one edge of the sealing inorganic film may be formed on the substrate by passing over one edge of the inorganic film of the display region.

In this embodiment, the sealing inorganic film includes a main region and a shadow region connected to the main region, and the shadow region may be formed closer to the edge of the substrate than the main region.

In the present embodiment, the main region is formed so as to deviate from the edge of the display area inorganic film, and the shadow region may be formed on the substrate.

In this embodiment, the edge of the main region is formed so as not to deviate from the edge of the display region inorganic film, and the shadow region can contact the side surface of the display region inorganic film.

In this embodiment, the shadow area may have inclined side surfaces.

In this embodiment, the sealing member may further include a spacing member formed to be spaced apart from the display area inorganic film, and the shadow area of the sealing inorganic film may not exceed the spacing member so as not to be closer to the edge of the substrate than the spacing member.

In the present embodiment, the shadow area can be in contact with the side surface of the spacer.

In this embodiment, the shadow area may be spaced apart from the side surface of the spacer.

In this embodiment, the spacing member may be formed of the same material as the display area inorganic film.

In this embodiment, a barrier layer disposed between the substrate and the display area inorganic film may be further included.

In this embodiment, at least one edge of the sealing inorganic film may be formed so as to deviate from one edge of the barrier layer.

In this embodiment, at least one edge of the barrier layer may be formed so as to deviate from one edge of the sealing inorganic film.

The shadow area of the sealing inorganic film does not exceed the spacing member so that the shadow area is closer to the edge of the substrate than the spacing member, May be formed on the barrier layer.

The shadow area of the sealing inorganic film does not exceed the spacing member so that the shadow area is closer to the edge of the substrate than the spacing member, May be formed of the same material as the barrier layer.

The display organic film may further include an encapsulating organic film disposed between the display area inorganic film and the encapsulating inorganic film so as to cover the display area in this embodiment.

In this embodiment, the encapsulating organic film may be formed to be smaller than the display area inorganic film.

In the present embodiment, the encapsulating organic film may be formed smaller than the encapsulating inorganic film.

In this embodiment, the sealing member may further include a blocking member disposed to be closer to the edge of the substrate than the sealing organic film.

In this embodiment, a plurality of blocking members may be provided.

In the present embodiment, the plurality of barrier members may have different heights from each other.

In the present embodiment, the encapsulating inorganic film may be formed by stacking a plurality of inorganic films.

The encapsulating organic film may be disposed between the plurality of inorganic films of the encapsulating inorganic film and formed to be smaller than the plurality of inorganic films.

In the present embodiment, the encapsulating organic film includes a plurality of organic films, and at least one organic film among the plurality of organic films may be formed between the inorganic film of the encapsulating inorganic film and the inorganic film of the display region.

In this embodiment, it may further comprise a functional layer disposed between the display area inorganic film and the sealing inorganic film.

In this embodiment, the functional layer may include a layer capable of controlling the refractive index of at least visible light.

The first passivation layer may be disposed between the functional layer and the encapsulating inorganic film.

The second protective layer may be formed on the encapsulating inorganic film and formed to be larger than the encapsulating inorganic film in this embodiment.

In this embodiment, the substrate may contain an organic matter.

In the present embodiment, the display region is formed with a thin film transistor which is electrically connected to at least one display element and the display element, and includes an active layer, a gate electrode, a source electrode, and a drain electrode, , A gate electrode, a source electrode, and a drain electrode.

In the present embodiment, the display area inorganic film may be at least one of a gate insulating film for insulating the active layer from the gate electrode, and an interlayer insulating film for insulating the source electrode and the drain electrode from the gate electrode.

In the present embodiment, the display element may include a first electrode, a second electrode, and an intermediate layer disposed between the first electrode and the second electrode and having an organic light emitting layer.

According to another aspect of the present invention, there is provided a method of manufacturing a display device including at least a central region having a display region on a substrate and a peripheral region disposed around the central region, Forming a display inorganic film so as to extend to a region of the display region in which the inorganic film of the display region is formed, and a sealing inorganic film which is located on the upper portion of the inorganic film and overlaps the edge of the display region inorganic film, The method comprising the steps of:

In this embodiment, the step of forming the encapsulating inorganic film may be performed using a deposition method.

In this embodiment, the step of forming the encapsulating inorganic film may be performed in the form of a pattern in which the encapsulating inorganic film is separated from at least one edge of the substrate by using a mask.

Other aspects, features, and advantages will become apparent from the following drawings, claims, and detailed description of the invention.

The display device and the manufacturing method thereof according to the embodiments of the present invention can provide a display device with improved durability.

1 is a plan view schematically showing a display device according to an embodiment of the present invention.
2 is a cross-sectional view taken along line II-II in FIG.
Figs. 3 to 11 are views showing a modification of Fig. 2. Fig.
12 is a plan view schematically showing a display device according to another embodiment of the present invention.
13 is a cross-sectional view taken along the line III-III in Fig.
Figs. 14 to 23 are views showing a modification of Fig. 13. Fig.
24 is a plan view schematically showing a display device according to another embodiment of the present invention.
25 is a cross-sectional view taken along the line IV-IV in Fig.
Figs. 26 to 28 are views showing a modification of Fig. 25. Fig.
29 is a plan view schematically showing a display device according to another embodiment of the present invention.
Fig. 30 is a cross-sectional view taken along line VA-VA and line VB-VB in Fig. 29;
31 is a plan view schematically showing a display device according to another embodiment of the present invention.
Fig. 32 is a cross-sectional view taken along lines VIA-VIA and VIB-VIB in Fig. 31;
33 is a plan view schematically showing a display device according to another embodiment of the present invention.
34 is a cross-sectional view taken along the line XA-XA and XB-XB in Fig. 33;

BRIEF DESCRIPTION OF THE DRAWINGS The present invention is capable of various modifications and various embodiments, and specific embodiments are illustrated in the drawings and described in detail in the detailed description. The effects and features of the present invention and methods of achieving them will be apparent with reference to the embodiments described in detail below with reference to the drawings. However, the present invention is not limited to the embodiments described below, but may be implemented in various forms.

In the following embodiments, the terms first, second, and the like are used for the purpose of distinguishing one element from another element, not the limitative meaning.

In the following examples, the singular forms "a", "an" and "the" include plural referents unless the context clearly dictates otherwise.

In the following embodiments, terms such as inclusive or possessive are intended to mean that a feature, or element, described in the specification is present, and does not preclude the possibility that one or more other features or elements may be added.

In the following embodiments, when a part of a film, an area, a component or the like is on or on another part, not only the case where the part is directly on the other part but also another film, area, And the like.

In the drawings, components may be exaggerated or reduced in size for convenience of explanation. For example, the size and thickness of each component shown in the drawings are arbitrarily shown for convenience of explanation, and thus the present invention is not necessarily limited to those shown in the drawings.

In the following embodiments, the x-axis, the y-axis, and the z-axis are not limited to three axes on the orthogonal coordinate system, and can be interpreted in a broad sense including the three axes. For example, the x-axis, y-axis, and z-axis may be orthogonal to each other, but may refer to different directions that are not orthogonal to each other.

If certain embodiments are otherwise feasible, the particular process sequence may be performed differently from the sequence described. For example, two processes that are described in succession may be performed substantially concurrently, and may be performed in the reverse order of the order described.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings, wherein like reference numerals refer to like or corresponding components throughout the drawings, and a duplicate description thereof will be omitted .

FIG. 1 is a plan view schematically showing a display device according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view taken along a line II-II in FIG.

Referring to FIGS. 1 and 2, a display device 1000 according to an embodiment of the present invention includes a substrate 101. On the substrate 101, a central area CA having a display area DA and a peripheral area PA arranged around the central area CA are defined.

On the substrate 101, a display area inorganic film 110 and an encapsulating inorganic film 120 are formed.

Each member will be described in detail.

The substrate 101 may include various materials. Specifically, the substrate 101 may be formed of glass, metal, organic material, or other material.

As an optional embodiment, the substrate 101 includes a substrate 101 of a flexible material. Here, the substrate 101 of flexible material refers to a substrate that is bent, bent, folded, or rolled into a flexible substrate. The substrate 101 of such a flexible material may be made of ultra-thin glass, metal, or plastic. For example, in the case of using plastic, the substrate 101 may be made of polyimide (PI), but this is merely an example, and various materials can be applied.

The display device 1000 may be formed in various ways. After a process is performed to include a plurality of display devices 1000 on a mother substrate, a plurality of display devices 1000 may be finally formed through a cutting process As an alternative embodiment, one display device 1000 may be formed on one mother substrate.

The substrate 101 is divided into a peripheral region PA and a central region CA. Concretely, the peripheral area PA is an area adjacent to the edge of the substrate 101, and the central area CA is an area inside the peripheral area PA.

The central area CA includes at least a display area DA.

At least one display element (not shown), for example, an organic light emitting diode (OLED), may be provided in the display area DA to display an image. Also, a plurality of pixels may be arranged in the display area DA.

A non-display area (not shown) may be formed around the display area DA. Specifically, a non-display area can be formed so as to surround the display area DA. As an alternative embodiment, the non-display area may be formed adjacent to a plurality of side surfaces of the display area DA. As another alternative embodiment, the non-display area may be formed adjacent to one side of the display area DA.

In another alternative embodiment, only the display area DA may be provided in the central area CA. That is, the non-display area may be formed only in the peripheral area PA.

A pad region may be formed in the non-display region, and a driver or a plurality of pad portions (not shown) may be disposed in the pad region.

The display area inorganic film 110 is formed on the substrate 101. The display area inorganic film 110 is formed on at least the display area DA. For example, the display area inorganic film 110 may be formed on a lower portion of a display element (not shown) or a display element (not shown) provided on a display element DA And may be formed adjacent to any one of the plurality of members.

The display area inorganic film 110 is formed in the display area DA and extends to one area of the peripheral area PA.

As an alternative embodiment, at least one edge of the edge of the display area inorganic film 110 may be spaced apart from the edge of the substrate 101. That is, one region of the upper surface of the substrate 101 can be exposed without being covered with the display region inorganic film 110 in the region corresponding to the region between the edge of the display region inorganic film 110 and the edge of the substrate 101 .

The display area inorganic film 110 can be formed using various inorganic materials.

As an alternative embodiment, the display area inorganic film 110 may comprise an oxide, a nitride or a nitrate. As a more specific example, the display area inorganic film 110 may contain silicon nitride (SiN _x ), silicon oxide (SiO ₂ ), or silicon oxynitride (SiO _x N _y ).

The peripheral area PA may be disposed adjacent to the edge of the substrate 101, and as an alternative, the peripheral area PA may be disposed adjacent to the entire edge of the substrate 101. [

The encapsulating inorganic film 120 is formed so as to cover the display area DA on the substrate 101 and is formed on the display area inorganic film 110. [ For example, the sealing inorganic film 120 is formed so as to cover a display element (not shown) provided in the display area DA. The encapsulating inorganic film 120 covers the display area DA and can block or reduce the penetration of foreign matter such as moisture or oxygen into the display area DA, for example, by covering the display element (not shown).

The encapsulating inorganic film 120 is formed on the display area inorganic film 110. At least one edge of the encapsulating inorganic film 120 is deviated from the edge of the display area inorganic film 110. That is, at least one edge of the sealing inorganic film 120 can be in contact with the upper surface of the substrate 101 after passing over one edge of the display region inorganic film 110.

As an alternative embodiment, all the edges of the sealing inorganic film 120 may be brought into contact with the upper surface of the substrate 101, away from the edge of the display area inorganic film 110.

The encapsulating inorganic film 120 can be formed using various inorganic materials.

As an alternative embodiment, the encapsulating inorganic film 120 may comprise an oxide, a nitride, or a nitrate. As a more specific example, the encapsulating inorganic film 120 may contain silicon nitride (SiN _x ), silicon oxide (SiO ₂ ), or silicon oxynitride (SiO _x N _y ).

Fig. 3 is a view showing a modification of Fig. 2. Fig. 3, the sealing inorganic film 120 is shown to include a main region 120a and a shadow region 120b. That is, when the encapsulating inorganic film 120 is formed, the encapsulating inorganic film 120 is formed by a deposition method using a mask (not shown), for example, through a space between the mask (not shown) and the substrate 101 A shadow region 120b may be formed. The shadow region 120b has a sloped side, and the sloped side may include a curved side as the case may be.

The deposition method may be various ones, for example, chemical vapor deposition.

The mask may be formed to have a pattern spaced apart from the edge of the substrate 101 when the sealing inorganic film 120 is formed.

The main region 120a of the encapsulating inorganic film 120 is formed on the display region inorganic film 110 and the main region 120a of the encapsulating inorganic film 120 is formed on the edge of the display region inorganic film 110 And can come in contact with the upper surface of the substrate 101. That is, the main region 120a of the encapsulating inorganic film 120 is a component corresponding to the encapsulating inorganic film 120 of FIGS.

The shadow region 120b of the encapsulating inorganic film 120 is connected to the edge of the main region 120a. The shadow region 120b is formed to be spaced apart from the edge of the display region inorganic film 110, As shown in FIG.

At least one edge of the encapsulating inorganic film 120 of the embodiment shown in Figs. 1 to 3 is also an optional embodiment in which all edges pass over the edge of the display area inorganic film 110 and are formed on the upper surface of the substrate 101 .

That is, the edge region of the sealing inorganic film 120 can be in contact with the upper surface of the substrate 101, thereby reducing or preventing the peeling of the sealing inorganic film 120 from the display area inorganic film 110 The sealing property of the sealing inorganic film 120 can be improved.

In an alternative embodiment, when the substrate 101 is formed of an organic material, for example, plastic, the sealing inorganic film 120 and the sealing inorganic film 120 are brought into contact with the upper surface of the substrate 101, 1000 can be effectively prevented from being peeled off from the substrate 101 during or during the manufacturing process of the sealing inorganic film 120. For example, during the manufacturing process of the display device 1000, the encapsulating inorganic film 120 may be shrunk and expanded to cause stress due to the high temperature or high humidity process. At this time, the substrate 101 including the organic material can relieve the stress of the sealing inorganic film 120.

The display device 1000 having flexibility to increase user's convenience such as bending or folding can be easily realized.

At least one edge of the substrate 101 and the edge of the sealing inorganic film 120 are spaced apart from each other so that the upper surface of the substrate 101 is positioned in the region adjacent to the edge of the substrate 101, An exposed area is formed without being covered. The exposed region on the substrate 101 can essentially prevent crack propagation during the cutting process for separation during the manufacturing process of the display device 1000. [ In addition, the flexibility of the display device 1000 can be improved, and convenience for the user can be increased.

Figs. 4 to 11 are views showing a modification of Fig. 2. Fig.

Referring to FIG. 4, a barrier layer 102 is formed on a substrate 101. The barrier layer 102 is disposed between the substrate 101 and the display region inorganic film 110. The barrier layer 102 may be formed using various inorganic materials, for example, an oxide, a nitride, or a nitride. As a more specific example, the barrier layer 102 may contain silicon nitride (SiN _x ), silicon oxide (SiO ₂ ), or silicon oxynitride (SiO _x N _y ).

The encapsulating inorganic film 120 is formed on the display area inorganic film 110. At least one edge of the sealing inorganic film 120 is out of the edge of the display area inorganic film 110 and the barrier layer 102. That is, at least one edge of the sealing inorganic film 120 can be in contact with the upper surface of the substrate 101, passing over the edge of the inorganic layer 110 and the edge of the barrier layer 102.

All of the edges of the encapsulating inorganic film 120 may be in contact with the upper surface of the substrate 101 away from the edge of the display area inorganic film 110 and the edge of the barrier layer 102 as an alternative embodiment.

As an alternative embodiment, the side surface of the display area inorganic film 110 and the side surface of the barrier layer 102 may be formed in parallel.

The barrier layer 102 may block foreign matter such as moisture or oxygen that penetrates through the substrate 101.

Referring to FIG. 5, an encapsulating organic film 140 is formed on the display area inorganic film 110. The encapsulating organic film 140 is disposed between the display area inorganic film 110 and the encapsulating inorganic film 120. [

The edge of the encapsulating organic film 140 does not deviate from the edge of the display region inorganic film 110. The encapsulating organic film 140 may be formed to be smaller than the display area inorganic film 110. The sealing organic film 140 may be spaced apart from the upper surface of the substrate 101.

As an alternative embodiment, the encapsulating organic film 140 may be formed smaller than the display area inorganic film 110 and the encapsulating inorganic film 120.

The encapsulating organic film 140 may be formed so as to cover at least the display area DA on the substrate 101 and cover a display element (not shown) provided in the display area DA, for example .

The encapsulating organic film 140 can block or reduce the penetration of foreign matter such as moisture or oxygen into the display area DA. In particular, the encapsulating organic film 140 can be used together with the encapsulating inorganic film 120 to improve the encapsulating property. Also, the encapsulating organic film 140 can easily form a flat surface.

The encapsulating organic film 140 may be formed using various organic materials, and may include, for example, a resin. As an alternative embodiment, the encapsulating organic film 140 may comprise an epoxy-based resin, an acrylic-based resin, or a polyimide-based resin.

Referring to Fig. 6, a blocking member 150 is further added to the structure shown in Fig. Specifically, the blocking member 150 is formed on the display area inorganic film 110 and disposed at least closer to the one edge of the substrate 101 than the encapsulating organic film 140. The sealant organic film 140 can be prevented from being overflowed in the direction of the edge of the substrate 101 when the sealant organic film 140 is formed.

The blocking member 150 may be disposed between the display area inorganic film 110 and the sealing inorganic film 120.

Only one blocking member 150 may be formed as shown in FIG. 6, and a plurality of blocking members 150 may be formed as shown in FIG.

7, when the blocking member 150 has the first blocking member 151 and the second blocking member 152 and the second blocking member 152 has a larger height than the first blocking member 151 . That is, the second blocking member 152 closer to the edge of the substrate 101 among the second blocking member 152 and the first blocking member 151 can be formed higher than the first blocking member 151, The first blocking member 151 primarily blocks the material of the sealing organic film 140 or the sealing organic film 140 from flowing abnormally when the sealing organic film 140 is formed, 2 blocking member 152 can be effectively blocked.

Although not shown, the blocking member 150 may have three or more blocking members (not shown), and the height thereof may be variously determined.

Referring to FIG. 8, the sealing inorganic film 120 includes a plurality of inorganic films, that is, a first inorganic film 121 and a second inorganic film 122. The first inorganic film 121 is formed on the display area inorganic film 110 and the second inorganic film 122 is formed on the first inorganic film 121. [

The first inorganic film 121 and the second inorganic film 122 are formed so as to cover the display area DA on the substrate 101 and are formed on the display area inorganic film 110. [ For example, the first inorganic film 121 and the second inorganic film 122 are formed so as to cover a display element (not shown) provided in the display area DA. The first inorganic film 121 and the second inorganic film 122 cover the display area DA and cover the display element (not shown), for example, to penetrate foreign matter such as moisture or oxygen into the display area DA Quot; can be blocked or reduced.

The first inorganic film 121 and the second inorganic film 122 are formed on the inorganic film 110 of the display area. At least one edge of the first inorganic film 121 and the second inorganic film 122 is deviated from the edge of the display region inorganic film 110. That is, at least one edge of the first inorganic film 121 and the second inorganic film 122 can be in contact with the upper surface of the substrate 101, passing over one edge of the display area inorganic film 110.

All of the edges of the first inorganic film 121 and the second inorganic film 122 may be in contact with the upper surface of the substrate 101 while leaving the edge of the display area inorganic film 110 as an alternative embodiment.

As an alternative embodiment, the side surfaces of the first inorganic film 121 and the second inorganic film 122 may be formed in parallel.

The first inorganic film 121 and the second inorganic film 122 may be formed using various inorganic materials and may be formed by using at least one of the materials forming the sealing inorganic film 120 mentioned in the above- . The first inorganic film 121 and the second inorganic film 122 can be formed using the same material or different materials.

Although not shown in FIG. 8, the sealing inorganic film 120 may include three or more inorganic films.

9, the sealing inorganic film 120 includes a plurality of inorganic films, that is, a first inorganic film 121 and a second inorganic film 122, and the first inorganic film 121 and the second inorganic film 122, An encapsulating organic film 140 is disposed between the inorganic film 122 and a blocking member 150 blocking the overflow of the encapsulating organic film 140 is formed on the display area inorganic film 110. [

The sealing characteristic can be improved through the structure in which the sealing organic film 140 is disposed between the first inorganic film 121 and the second inorganic film 122. [

10, the encapsulating inorganic film 120 includes a plurality of inorganic films, that is, a first inorganic film 121 and a second inorganic film 122, and the encapsulating organic film 140 includes a plurality of organic films, that is, And includes a first organic film 141 and a second organic film 142.

The first organic film 141 is disposed between the display region inorganic film 110 and the first inorganic film 121 and the second organic film 141 is provided between the first inorganic film 121 and the second inorganic film 122. [ A membrane 142 is disposed.

The first organic film 141 and the second organic film 142 of the encapsulating organic film 140 may be formed to be smaller than the encapsulating inorganic film 120. The edges of the first organic film 141 and the second organic film 142 are arranged to be farther from the edge of the substrate 101 than the edges of the first inorganic film 121 and the second inorganic film 122 .

As an alternative embodiment, the second organic layer 142 may be formed to be larger than the first organic layer 141. That is, the edge of the second organic film 142 may be formed closer to the edge of the substrate 101.

A blocking member 150 is formed on the upper portion of the display area inorganic film 110 and includes a first blocking member 151 and a second blocking member 152. It is possible to prevent the first organic film 141 and the second organic film 142 from flowing over the first blocking member 151 and the second blocking member 152. Particularly, the height of the second blocking member 152 is greater than the height of the first blocking member 151 so that the first organic film 141 and the second organic film 142 are primarily blocked by the first blocking member 151, The height of the second blocking member 152 adjacent to the edge of the substrate 101 is greater than the height of the first blocking member 151 so that the first organic film 141 And the second organic film 142 from flowing over the edge of the substrate 101 can be blocked.

Referring to FIG. 11, the functional layer 160, the first passivation layer 170, and the second passivation layer 180 are included. For the sake of convenience of explanation, the differences from FIG. 10 will be mainly described.

The second blocking member 152 of the blocking member 150 also includes a first layer 152a and a second layer 152b. As an example, as another alternative embodiment, the second blocking member 152 may be a single layer as shown in Fig.

The functional layer 160 may include a capping layer 161 and a cover layer 162. The capping layer 161 is formed to protect the uppermost layer of the display element (not shown) formed in the display area DA and to control the refractive index of the visible light realized in the display element (not shown) Can be improved. The cover layer 162 is also formed on the capping layer 161 to protect the capping layer 161 and the display element (not shown) and to control the refractive index of the visible light embodied in the display element So that the light efficiency can be improved. The cover layer 162 may contain, for example, LiF.

The first passivation layer 170 is formed on the functional layer 160 and is formed under the first organic film 141. The first passivation layer 170 may comprise an inorganic material such as an oxide or a nitride. As an alternative embodiment, the first passivation layer 170 may comprise aluminum oxide, for example Al2O3.

As an alternative embodiment, the first passivation layer 170 may be formed larger than the functional layer 160 and formed smaller than the first organic layer 141. As another alternative embodiment, the first passivation layer 170 may be formed larger than the first and second organic layers 141 and 142

The second passivation layer 180 may be formed on the second inorganic film 122 and may include an inorganic material such as an oxide or nitride. As an alternative embodiment, the second passivation layer 180 may comprise aluminum oxide, for example Al2O3.

The second passivation layer 180 may be formed to be larger than the encapsulating inorganic film 120 and may be formed to cover the encapsulating inorganic film 120 so that the edge of the second passivation layer 180 contacts the substrate 101, As shown in Fig. At this time, the edge of the second passivation layer 180 is separated from the edge of the substrate 101, so that one region of the upper surface of the substrate 101 can be exposed without being covered with the second passivation layer 180.

The problem of peeling of the sealing inorganic film 120 can be effectively reduced or blocked through the second passivation layer 180.

4 to 11, the structure in which the sealing inorganic film 120 includes the main region 120a and the shadow region 120b as shown in Fig. 3 may be applied to Figs. 4 to 11 .

FIG. 12 is a plan view schematically showing a display device according to another embodiment of the present invention, and FIG. 13 is a sectional view taken along the line III-III in FIG.

Referring to FIGS. 12 and 13, a display device 2000 according to an embodiment of the present invention includes a substrate 201. FIG. A central area CA having a display area DA and a peripheral area PA arranged around the center area CA are defined on the substrate 201. [

On the substrate 201, a display area inorganic film 210 and an encapsulating inorganic film 220 are formed.

Each member will be described in detail.

The substrate 201 may include various materials. Specifically, the substrate 201 may be formed of glass, metal, organic material, or the like.

As an optional embodiment, the substrate 201 comprises a substrate 201 of flexible material. Here, the substrate 201 of flexible material refers to a substrate that is bent, bent, folded, or rolled into a flexible substrate. The flexible substrate 201 may be made of ultra-thin glass, metal, or plastic. For example, when plastic is used, the substrate 201 may be made of polyimide (PI), but this is merely an example, and various materials can be applied.

The display device 2000 can be formed in various ways. After a process is performed to include a plurality of display devices 2000 on a mother substrate, a plurality of display devices 2000 can be finally formed through a cutting process As an alternative embodiment, one display device 2000 may be formed on one mother substrate.

The substrate 201 is divided into a peripheral region PA and a central region CA. Concretely, the peripheral area PA is an area adjacent to the edge of the substrate 201, and the central area CA is an area inside the peripheral area PA.

The central area CA includes at least a display area DA.

At least one display element (not shown), for example, an organic light emitting diode (OLED), may be provided in the display area DA to display an image. Also, a plurality of pixels may be arranged in the display area DA.

A non-display area (not shown) may be formed around the display area DA. Specifically, a non-display area can be formed so as to surround the display area DA. As an alternative embodiment, the non-display area may be formed adjacent to a plurality of side surfaces of the display area DA. As another alternative embodiment, the non-display area may be formed adjacent to one side of the display area DA.

In another alternative embodiment, only the display area DA may be provided in the central area CA. That is, the non-display area may be formed only in the peripheral area PA.

A pad region may be formed in the non-display region, and a driver or a plurality of pad portions (not shown) may be disposed in the pad region.

The display area inorganic film 210 is formed on the substrate 201. [ The display area inorganic film 210 is formed at least on the display area DA. For example, the display area inorganic film 210 may be formed on a lower portion of a display element (not shown) or on a display element (not shown) provided in a display area DA And may be formed adjacent to any one of the plurality of members.

The display area inorganic film 210 is formed in the display area DA and extends to one area of the peripheral area PA.

As an alternative embodiment, at least one edge of the edge of the display area inorganic film 210 may be spaced apart from the edge of the substrate 201. That is, one region of the upper surface of the substrate 201 may be exposed without being covered with the display region inorganic film 210 in the region corresponding to the region between the edge of the display region inorganic film 210 and the edge of the substrate 201 .

The display region inorganic film 210 can be formed using various inorganic materials.

As an alternative embodiment, the display area inorganic film 210 may comprise an oxide, a nitride or a nitrate. As a more specific example, the display area inorganic film 210 may contain silicon nitride (SiN _x ), silicon oxide (SiO ₂ ), or silicon oxynitride (SiO _x N _y ).

The peripheral area PA may be disposed adjacent to the edge of the substrate 201, and as an alternative, the peripheral area PA may be disposed adjacent to the entire edge of the substrate 201. [

The encapsulating inorganic film 220 is formed so as to cover the display area DA on the substrate 201 and is formed on the display area inorganic film 210. [ For example, the sealing inorganic film 220 is formed so as to cover a display element (not shown) provided in the display area DA. The sealing inorganic film 220 covers or covers the display area DA and can block or reduce the penetration of foreign substances such as moisture or oxygen into the display area DA by covering the display element (not shown).

The encapsulating inorganic film 220 is formed on the display area inorganic film 210. At least one edge of the sealing inorganic film 220 is formed in parallel with the edge of the display region inorganic film 210. That is, at least one side of the sealing inorganic film 220 may be formed in parallel with one side of the display region inorganic film 210.

As an alternative embodiment, all edges of the encapsulating inorganic film 220 may be formed in parallel with the edges of the display area inorganic film 210.

The encapsulating inorganic film 220 can be formed using various inorganic materials.

As an alternative embodiment, the encapsulant inorganic film 220 may comprise an oxide, a nitride, or a nitrate. As a more specific example, the encapsulating inorganic film 220 may contain silicon nitride (SiN _x ), silicon oxide (SiO ₂ ), or silicon oxynitride (SiO _x N _y ).

14 is a view showing a modification of Fig. 14, the sealing inorganic film 220 is shown to include a main region 220a and a shadow region 220b. That is, when the encapsulating inorganic film 220 is formed, the encapsulating inorganic film 220 is formed by a deposition method using a mask (not shown), for example, through a space between the mask (not shown) A shadow region 220b may be formed. The shadow region 220b has a sloped side, and the sloped side may include a curved surface as the case may be. The shadow region 220b is formed in contact with the side surface of the display area inorganic film 210 and in contact with the upper surface of the substrate 201. [

The main region 220a of the encapsulating inorganic film 220 is formed on the display region inorganic film 210 and the main region 220a of the encapsulating inorganic film 220 is formed on the edge of the display region inorganic film 210 It coincides without departing. That is, the main region 220a of the encapsulating inorganic film 220 is a component corresponding to the encapsulating inorganic film 220 of FIGS.

The shadow region 220b of the sealing inorganic film 220 is connected to the edge of the main region 220a and the shadow region 220b is separated from the edge of the substrate 201. [

At least one edge of the encapsulating inorganic film 220 of the embodiment shown in Figs. 12-14 is also optionally formed with all the edges aligned with the edge of the display area inorganic film 210.

The edge of the sealing inorganic film 220 may be peeled off from the display area inorganic film 210 to block or reduce the sealing property of the sealing inorganic film 220 from being weakened and removed. The shadow area 220b is formed not on the upper surface of the display area inorganic film 210 but on the side surface of the display area inorganic film 210 and the upper surface of the substrate 201 It is possible to reduce or prevent the shadow region 220b from peeling off from the display region inorganic film 210. [

In an alternative embodiment, when the substrate 201 is formed of an organic material, for example, plastic, the shadow area 220b of the sealing inorganic film 220 and the sealing inorganic film 220 is brought into contact with the upper surface of the substrate 201 , Thereby effectively reducing the peeling of the sealing inorganic film 220 from the substrate 201 during or during the manufacturing process of the display device 2000. For example, during the manufacturing process of the display device 2000, a high temperature or high humidity process is performed, and the encapsulating inorganic film 220 may contract and expand, resulting in stress. At this time, the substrate 201 including the organic material can relieve the stress of the sealing inorganic film 220.

The display device 2000 having flexibility to increase user's convenience such as bending or folding can be easily realized.

At least one edge of the substrate 201 and the edge of the sealing inorganic film 220 are spaced apart from each other and an upper surface of the substrate 201 is formed in an area adjacent to the edge of the substrate 201, An exposed area is formed without being covered. The exposed region on the substrate 201 can essentially prevent crack propagation during a cutting process for separation during the manufacturing process of the display device 2000. [ In addition, the flexibility of the display device 2000 can be improved, and convenience for the user can be increased.

15 is a view showing a modification of Fig.

Referring to FIG. 15, a barrier layer 202 is formed on a substrate 201. The barrier layer 202 is disposed between the substrate 201 and the display area inorganic film 210. The barrier layer 202 may be formed using various inorganic materials, for example, an oxide, a nitride, or a nitride. As a more specific example, the barrier layer 202 may contain silicon nitride (SiN _x ), silicon oxide (SiO ₂ ), or silicon oxynitride (SiO _x N _y ).

The barrier layer 202 may be formed to be larger than the display area inorganic film 210. The barrier layer 202 may be formed to be spaced apart from the edge of the substrate 201, i.e., smaller than the substrate 201.

The encapsulating inorganic film 220 is formed on the display area inorganic film 210. The barrier layer 202 may be formed larger than the encapsulating inorganic film 220.

As shown in FIG. 16 as an alternative embodiment, the sealing inorganic film 220 may include a main region 220a and a shadow region 220b. The main region 220a of the encapsulating inorganic film 220 is formed on the display region inorganic film 210 and the main region 220a of the encapsulating inorganic film 220 is formed on the edge of the display region inorganic film 210 It coincides without departing.

The shadow region 220b of the sealing inorganic film 220 is connected to the edge of the main region 220a and the shadow region 220b can contact the side surface of the display region inorganic film 210 and the upper surface of the barrier layer 202 have.

The barrier layer 202 may block foreign substances such as moisture or oxygen that penetrate through the substrate 201.

Figs. 17 to 23 are views showing other modifications of Fig.

Referring to FIG. 5, an encapsulating organic film 240 is formed on the display area inorganic film 210. The encapsulating organic film 240 is disposed between the display area inorganic film 210 and the encapsulating inorganic film 220.

The edges of the encapsulating organic film 240 do not deviate from the edges of the display area inorganic film 210. The encapsulating organic film 240 may be formed to be smaller than the display area inorganic film 210. The sealing organic film 240 may be spaced apart from the upper surface of the substrate 201.

As an alternative embodiment, the encapsulating organic film 240 may be formed smaller than the display area inorganic film 210 and the encapsulating inorganic film 220.

The encapsulating organic film 240 may be formed so as to cover at least the display area DA on the substrate 201 and cover the display element (not shown) provided in the display area DA, for example .

The encapsulating organic film 240 can block or reduce the penetration of foreign matter such as moisture or oxygen into the display area DA. In particular, the encapsulating organic film 240 can be used together with the encapsulating inorganic film 220 to improve the sealing property. Further, the encapsulating organic film 240 can easily form a flat surface.

The encapsulating organic film 240 may be formed using various organic materials, and may include, for example, a resin. As an alternative embodiment, the encapsulating organic film 240 may comprise an epoxy-based resin, an acrylic-based resin, or a polyimide-based resin.

Referring to Fig. 18, a blocking member 250 is further added to the structure shown in Fig. Specifically, the blocking member 250 is formed on the display area inorganic film 210 and disposed at least closer to the one edge of the substrate 201 than the encapsulating organic film 240. The sealant organic film 240 or the encapsulating organic film 240 may be prevented from overflowing toward the edge of the substrate 201 when the encapsulating organic film 240 is formed.

The blocking member 250 may be disposed between the display area inorganic film 210 and the sealing inorganic film 220.

Only one blocking member 250 may be formed as shown in Fig. 18, and a plurality of blocking members 250 may be formed as shown in Fig.

19, when the blocking member 250 has the first blocking member 251 and the second blocking member 252 and the second blocking member 252 has a larger height than the first blocking member 251 . That is, the second blocking member 252 closer to the edge of the substrate 201 among the second blocking member 252 and the first blocking member 251 can be formed higher than the first blocking member 251, The first blocking member 251 primarily blocks the material of the sealing organic film 240 or the sealing organic film 240 from flowing abnormally when the sealing organic film 240 is formed, 2 blocking member 252 can be effectively blocked.

Although not shown, the blocking member 250 may have three or more blocking members (not shown), and the height thereof may be variously determined.

Referring to FIG. 20, the sealing inorganic film 220 includes a plurality of inorganic films, that is, a first inorganic film 221 and a second inorganic film 222. The first inorganic film 221 is formed on the display area inorganic film 210 and the second inorganic film 222 is formed on the first inorganic film 221.

The first inorganic film 221 and the second inorganic film 222 are formed so as to cover the display area DA on the substrate 201 and are formed on the display area inorganic film 210. [ For example, the first inorganic film 221 and the second inorganic film 222 are formed so as to cover a display element (not shown) provided in the display area DA. The first inorganic film 221 and the second inorganic film 222 cover the display area DA and cover the display element (not shown), for example, to penetrate foreign matter such as moisture or oxygen into the display area DA Quot; can be blocked or reduced.

The first inorganic film 221 and the second inorganic film 222 are formed on the display region inorganic film 210. At least one edge of the first inorganic film 221 and the second inorganic film 222 is formed in parallel with the edge of the display region inorganic film 210. [

As an alternative embodiment, the side surfaces of the first inorganic film 221 and the second inorganic film 222 may be formed in parallel.

The edges of the first inorganic film 221 and the second inorganic film 222 may be aligned with the edge of the display area inorganic film 210 as an alternative embodiment.

The first inorganic film 221 and the second inorganic film 222 may be formed using various inorganic materials and may be formed by using at least one of the materials forming the sealing inorganic film 220 mentioned in the above- . The first inorganic film 221 and the second inorganic film 222 can be formed using the same material or different materials.

Although not shown in FIG. 20, the encapsulating inorganic film 220 may include three or more inorganic films.

21, the sealing inorganic film 220 includes a plurality of inorganic films, that is, a first inorganic film 221 and a second inorganic film 222, The sealing organic film 240 is disposed between the inorganic film 210 and the blocking member 250 that blocks the sealing organic film 240 from overflowing.

The sealing characteristic can be improved through the structure in which the encapsulating organic film 240 is disposed between the first inorganic film 221 and the second inorganic film 222.

22, the encapsulating inorganic film 220 includes a plurality of inorganic films, that is, a first inorganic film 221 and a second inorganic film 222, and the encapsulating organic film 240 includes a plurality of organic films, that is, And includes a first organic film 241 and a second organic film 242.

A first organic film 241 is disposed between the display region inorganic film 210 and the first inorganic film 221 and a second organic film 241 is provided between the first inorganic film 221 and the second inorganic film 222. [ A film 242 is disposed.

As an alternative embodiment, the second organic layer 242 may be formed larger than the first organic layer 241.

A blocking member 250 is formed on the upper portion of the display area inorganic film 210 and includes a first blocking member 251 and a second blocking member 252. It is possible to prevent the first organic film 241 and the second organic film 242 from overflowing through the first blocking member 251 and the second blocking member 252.

Referring to FIG. 23, the functional layer 260, the first passivation layer 270, and the second passivation layer 280 are included. For convenience of explanation, the differences from FIG. 22 will be mainly described.

The second blocking member 252 of the blocking member 250 also includes a first layer 252a and a second layer 252b. As an example, as another alternative embodiment, the second blocking member 252 may also be a single layer.

The functional layer 260 may include a capping layer 261 and a cover layer 262. The capping layer 261 is formed to protect the uppermost layer of the display element (not shown) formed in the display area DA and to control the refractive index of the visible light realized in the display element (not shown) Can be improved. The cover layer 262 is also formed on the capping layer 261 to protect the capping layer 261 and the display element (not shown) and to control the refractive index of the visible light embodied in the display element (not shown) So that the light efficiency can be improved. The cover layer 262 may contain, for example, LiF.

The first passivation layer 270 is formed on the functional layer 260 and is formed under the first organic film 241. The first passivation layer 270 may include an inorganic material such as an oxide or a nitride. As an alternative embodiment, the first passivation layer 270 may comprise aluminum oxide, for example Al2O3.

As an alternative embodiment, the first passivation layer 270 may be formed to be larger than the functional layer 260 and smaller than the first organic layer 241. As another alternative embodiment, the first passivation layer 270 may be formed larger than the first organic layer 241 and the second organic layer 242

The second passivation layer 280 may be formed on the second inorganic film 222 and may include an inorganic material such as an oxide or nitride. As an alternative embodiment, the second passivation layer 280 may comprise aluminum oxide, for example Al2O3.

The second passivation layer 280 may be formed to be larger than the sealing inorganic film 220 and may be formed so as to cover the sealing inorganic film 220 so that the edge of the second passivation layer 270 is formed on the substrate 201, As shown in Fig. At this time, the edge of the second passivation layer 270 is separated from the edge of the substrate 201, so that one region of the upper surface of the substrate 201 can be exposed without being covered with the second passivation layer 280.

The problem of peeling of the sealing inorganic film 220 through the second protective layer 280 can be effectively reduced or prevented.

17 to 23, the structure in which the sealing inorganic film 220 includes the main region 220a and the shadow region 220b as shown in Fig. 14 or Fig. 16 is applied to Figs. 17 to 23 You may.

FIG. 24 is a plan view schematically showing a display device according to another embodiment of the present invention, and FIG. 25 is a cross-sectional view taken along the line IV-IV of FIG. Figs. 26 to 28 are views showing a modification of Fig. 25. Fig.

Referring to FIGS. 24 and 25, a display device 3000 according to an embodiment of the present invention includes a substrate 301. A central area CA having a display area DA and a peripheral area PA disposed around the central area CA are defined on the substrate 301. [

On the substrate 301, a display area inorganic film 310 and an encapsulating inorganic film 320 are formed.

Each member will be described in detail.

The substrate 301 may include various materials. Specifically, the substrate 301 may be formed of glass, metal, organic material, or other material.

As an optional embodiment, the substrate 301 includes a substrate 301 of a flexible material. Here, the substrate 301 of flexible material refers to a substrate that is bent, bent, folded, or rolled into a flexible substrate. The flexible substrate 301 may be made of ultra-thin glass, metal, or plastic. For example, in the case of using plastic, the substrate 301 may be made of polyimide (PI), but this is an example and various materials can be applied.

The display device 3000 may be formed in various ways. After a process is performed to include a plurality of display devices 3000 on a mother substrate, a plurality of display devices 3000 may be finally formed through a cutting process As an alternative embodiment, one display device 3000 may be formed on one mother substrate.

The substrate 301 is divided into a peripheral region PA and a central region CA. Specifically, the peripheral area PA is an area adjacent to the edge of the substrate 301, and the central area CA is an area inside the peripheral area PA.

The central area CA includes at least a display area DA.

At least one display element (not shown), for example, an organic light emitting diode (OLED), may be provided in the display area DA to display an image. Also, a plurality of pixels may be arranged in the display area DA.

A non-display area (not shown) may be formed around the display area DA. Specifically, a non-display area can be formed so as to surround the display area DA. As an alternative embodiment, the non-display area may be formed adjacent to a plurality of side surfaces of the display area DA. As another alternative embodiment, the non-display area may be formed adjacent to one side of the display area DA.

In another alternative embodiment, only the display area DA may be provided in the central area CA. That is, the non-display area may be formed only in the peripheral area PA.

A pad region may be formed in the non-display region, and a driver or a plurality of pad portions (not shown) may be disposed in the pad region.

The display area inorganic film 310 is formed on the substrate 301. The display area inorganic film 310 is formed on at least the display area DA. For example, the display area inorganic film 310 may be formed on a lower portion of a display element (not shown) or on a display element (not shown) provided in a display area DA And may be formed adjacent to any one of the plurality of members.

** The display area inorganic film 310 is formed in the display area DA and extends to one area of the peripheral area PA.

As an alternative embodiment, at least one edge of the edge of the display area inorganic film 310 may be spaced apart from the edge of the substrate 301. That is, one region of the upper surface of the substrate 301 can be exposed without being covered with the display region inorganic film 310 in the region corresponding to the region between the edge of the display region inorganic film 310 and the edge of the substrate 301 .

The display area inorganic film 310 can be formed using various inorganic materials.

As an alternative embodiment, the display area inorganic film 310 may comprise an oxide, a nitride or a nitrate. As a more specific example, the display area inorganic film 310 may contain silicon nitride (SiN _x ), silicon oxide (SiO ₂ ), or silicon oxynitride (SiO _x N _y ).

The spacing member 310a is formed so as to be spaced apart from the display area inorganic film 310. [ The spacing member 310a may be disposed closer to the edge of the substrate 301 than at least one edge of the display area inorganic film 310. [

As an alternative embodiment, the spacing member 310a may be spaced apart from the edge of the substrate 301.

Alternatively, the spacing member 310a may be formed of the same material as that of the display area inorganic film 310, and may be formed at the same time when the display area inorganic film 310 is formed.

The peripheral area PA may be disposed adjacent to the edge of the substrate 301, and as an alternative, the peripheral area PA may be disposed adjacent to the entire edge of the substrate 301. [

The encapsulating inorganic film 320 is formed so as to cover the display area DA on the substrate 301 and is formed on the display area inorganic film 310. [ For example, the sealing inorganic film 320 is formed so as to cover a display element (not shown) provided in the display area DA. The encapsulating inorganic film 320 covers or covers the display area DA and can block or reduce the penetration of foreign matter such as moisture or oxygen into the display area DA by covering the display element (not shown).

The encapsulating inorganic film 320 is formed on the display area inorganic film 310. At least one edge of the sealing inorganic film 320 is out of the edge of the display area inorganic film 310. That is, at least one edge of the sealing inorganic film 320 may be in contact with the upper surface of the substrate 301 after passing over one edge of the display area inorganic film 310.

All the edges of the sealing inorganic film 320 may be in contact with the upper surface of the substrate 301 while leaving the edge of the display area inorganic film 310 as an alternative embodiment.

Specifically, the sealing inorganic film 320 includes a main region 320a and a shadow region 320b. That is, when the encapsulating inorganic film 320 is formed, a spaced space between the mask (not shown) and the substrate 301 is formed by a deposition method using a mask (not shown) The shadow region 320b may be formed.

The shadow region 320b is disposed at least between the display area inorganic film 310 and the spacing member 310a. The shadow area 320b is formed so as not to exceed the spacing member 310a. That is, as shown in Fig. 25, the shadow area 320b may contact the side surface of the spacing member 310a, and as another example, the shadow area 320b may be spaced from the side surface of the spacing member 310a.

The encapsulating inorganic film 320 may be formed using various inorganic materials.

As an alternative embodiment, the encapsulating inorganic film 320 may comprise an oxide, a nitride, or a nitrate. As a more specific example, the sealing inorganic film 320 may contain silicon nitride (SiN _x ), silicon oxide (SiO ₂ ), or silicon oxynitride (SiO _x N _y ).

The edge area of the sealing inorganic film 320, that is, the shadow area 320b can be brought into contact with the upper surface of the substrate 301 and also with the side surface of the display area inorganic film 310, May be peeled off from the display area inorganic film 310 to block or reduce the sealing property of the sealing inorganic film 320 from being weakened and removed.

The display device 3000 having flexibility to increase the convenience of the user such as bending or folding can be easily realized.

At least one edge of the substrate 301 and the edge of the sealing inorganic film 320 are spaced apart from each other and an upper surface of the substrate 301 is formed in a region adjacent to the edge of the substrate 301, An exposed area is formed without being covered. The exposed region on the substrate 301 can essentially prevent crack propagation during the cutting process for separation during the manufacturing process of the display device 3000. [ In addition, the flexibility of the display device 3000 can be improved and the user's convenience can be increased.

Figs. 26 to 28 are views showing a modification of Fig. 25. Fig.

Referring to FIG. 26, a barrier layer 302 is formed on a substrate 301. The barrier layer 302 is disposed between the substrate 301 and the display area inorganic film 310. The barrier layer 302 may be formed using various inorganic materials, for example, an oxide, a nitride, or a nitride. As a more specific example, the barrier layer 302 may contain silicon nitride (SiN _x ), silicon oxide (SiO ₂ ), or silicon oxynitride (SiO _x N _y ).

The spacing member 310a is formed on the barrier layer 302. [

The encapsulating inorganic film 320 is formed on the display area inorganic film 310. The shadow region 320b of the sealing inorganic film 320 is disposed at least between the display area inorganic film 310 and the spacing member 310a. The shadow region 320b may be in contact with the top surface of the barrier layer 302.

The shadow area 320b is formed so as not to exceed the spacing member 310a.

The barrier layer 302 may block foreign substances such as moisture or oxygen that penetrate through the substrate 301.

Referring to Fig. 27, in the embodiment of Fig. 27, the spacing member 302a is formed on the substrate 301 and is arranged so as to be spaced apart from the barrier layer 302. [

Alternatively, the spacer 302a may be formed of the same material as the barrier layer 302 and may be formed at the same time when the barrier layer 302 is formed.

The encapsulating inorganic film 320 is formed on the display area inorganic film 310. In addition, the shadow region 320b of the sealing inorganic film 320 is formed so as not to exceed at least the spacing member 302a. The shadow region 320b may be in contact with the side surface of the barrier layer 302 and the side surface of the display region inorganic film 310 as an alternative embodiment.

Although the shadow region 320b is shown as being spaced apart from the spacing member 302b in Fig. 27, the shadow region 320b may be in contact with the side surface of the spacing member 302b as an alternative embodiment.

28, a plurality of spacing members, that is, a first spacing member 302a and a second spacing member 310a may be formed on the substrate 301. [

25 to 28, the structures of the encapsulating organic film, the blocking member and the like of the above-described embodiments, that is, the constitution of the encapsulating organic film, functional layer, blocking member and protective layer shown in Figs. 5 to 11 are shown in Fig. 25 It goes without saying that the present invention can be applied to FIGS.

FIG. 29 is a plan view schematically showing a display device according to another embodiment of the present invention, and FIG. 30 is a sectional view taken along line VA-VA and line VB-VB in FIG.

29 and 30, a display device 4000 according to the present embodiment includes a substrate 401. [ On the substrate 401, a central area CA having a display area DA and a peripheral area PA arranged around the central area CA are defined.

On the substrate 401, a display area inorganic film 410 and an encapsulating inorganic film 420 are formed.

Each member will be described in detail.

The substrate 401 may include various materials. Specifically, the substrate 401 may be formed of glass, metal, organic material, or other material.

As an alternative embodiment, the substrate 401 includes a substrate 401 of a flexible material. Here, the flexible substrate 401 refers to a substrate that is bent, bent, folded, or rolled into a flexible substrate. The flexible substrate 401 may be made of ultra-thin glass, metal, or plastic. For example, in the case of using plastic, the substrate 401 may be made of polyimide (PI), but this is an example and various materials can be applied.

The display device 4000 can be formed in various ways. After a process is performed to include a plurality of display devices 4000 on a mother substrate, a plurality of display devices 4000 can be finally formed through a cutting process As an alternative embodiment, one display device 4000 may be formed on one mother substrate.

The substrate 401 is divided into a peripheral region PA and a central region CA. Concretely, the peripheral area PA is an area adjacent to the edge of the substrate 401, and the central area CA is an area inside the peripheral area PA.

The central area CA includes at least a display area DA.

At least one display element OD is arranged in the display area DA so that an image is displayed. The display element OD may be various kinds of elements, for example, an organic light emitting device (OLED).

Also, a plurality of pixels may be disposed in the display area DA, and at least one of the display devices OD may be disposed in each pixel.

A non-display area (not shown) may be formed around the display area DA. Specifically, a non-display area can be formed so as to surround the display area DA. As an alternative embodiment, the non-display area may be formed adjacent to a plurality of side surfaces of the display area DA. As another alternative embodiment, the non-display area may be formed adjacent to one side of the display area DA.

In another alternative embodiment, only the display area DA may be provided in the central area CA. That is, the non-display area may be formed only in the peripheral area PA.

A pad region may be formed in the non-display region, and a driver or a plurality of pad portions (not shown) may be disposed in the pad region.

A barrier layer 402 is formed on the substrate 401. The barrier layer 402 is formed on the display area DA and extended to be disposed in the peripheral area PA. As an alternative embodiment, the barrier layer 402 may be omitted.

A thin film transistor may be formed on the display area DA on the barrier layer 402. [ The thin film transistor formed on the display area DA functions as a part of a circuit for driving the display element OD. However, the thin film transistor can also be formed on the non-display region.

Hereinafter, a case in which a thin film transistor is a top gate type in which an active layer 405, a gate electrode GE, a source electrode 406, and a drain electrode 407 are sequentially formed is shown.

However, the present embodiment is not limited thereto, and various types of thin film transistors (TFT) such as a bottom gate type may be employed.

An active layer 405 (active layer) is formed on the barrier layer 402. The active layer 405 includes a semiconductor material and may include, for example, amorphous silicon or poly crystalline silicon. However, the present embodiment is not limited to this, and the active layer 405 may contain various materials. As an alternative embodiment, the active layer 405 may contain an organic semiconductor material.

As another alternative embodiment, the active layer 405 may contain an oxide semiconductor material. For example, the active layer 405 may be a Group 12, 13, or Group 14 metal such as zinc (Zn), indium (In), gallium (Ga), tin (Sn), cadmium (Cd), germanium (Ge), or hafnium ≪ / RTI > elements and combinations thereof.

A gate insulating layer 411 is formed on the active layer 405. The gate insulating film 411 may be formed of a multilayer or single layer of a film made of an inorganic material such as silicon oxide and / or silicon nitride. The gate insulating film 411 serves to insulate the active layer 405 from the gate electrode GE.

The gate insulating film 411 may be formed as a film of the display area inorganic film 410 to extend not only to the display area DA but also to a part of the peripheral area PA.

The gate electrode GE is formed on the gate insulating film 411. The gate electrode GE may be connected to a gate line (not shown) for applying an on / off signal to the thin film transistor.

The gate electrode GE may be formed of a low resistance metal material and may be formed of a conductive material including molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti) .

An interlayer insulating film 412 is formed on the gate electrode GE. The interlayer insulating film 412 isolates the source electrode 406 and the drain electrode 407 from the gate electrode GE.

As an alternative embodiment, the interlayer insulating film 412 may be formed as a film of the display area inorganic film 410 to extend not only to the display area DA but also to a part of the peripheral area PA.

That is, the gate insulating film 411 and the interlayer insulating film 412, which are the display area inorganic film 410, may be formed on the barrier layer 402 in the peripheral region PA.

The interlayer insulating film 412 may be formed of a multilayer or single layer of a film made of an inorganic material. For example, an inorganic material may be a metal oxide or a metal nitride, specifically, an inorganic material is silicon oxide (SiO _2), silicon nitride (SiNx), silicon oxynitride (SiON), aluminum oxide (Al ₂ O _3), titanium oxide ( TiO ₂ ), tantalum oxide (Ta ₂ O ₅ ), hafnium oxide (HfO ₂ ), or zinc oxide (ZrO ₂ ).

A source electrode 406 and a drain electrode 407 are formed on the interlayer insulating film 412. The source electrode 406 and the drain electrode 407 can be formed as a single layer or a multilayer using a material having good conductivity.

A source electrode 406 and a drain electrode 407 are formed in contact with the region of the active layer 405.

A passivation film 408 is formed on the source electrode 406 and the drain electrode 407 so as to cover the thin film transistor.

The passivation film 408 eliminates a step caused by the thin film transistor and makes the top surface flat, thereby preventing defects from occurring in the display device OD such as the organic light emitting device OLED due to the bottom unevenness. The passivation film 408 may be formed of a single layer or a multi-layered film made of an organic material. The organic material may be a general general purpose polymer such as polymethylmethacrylate (PMMA) or Polystylene (PS), a polymer derivative having a phenol group, an acrylic polymer, an imide polymer, an arylether polymer, an amide polymer, a fluorine polymer, Polymers, vinyl alcohol polymers, blends thereof, and the like. The passivation film 408 may also be formed of a composite laminate of an inorganic insulating film and an organic insulating film.

And a display element OD is formed on the passivation film 408. [ The display element OD is electrically connected to the thin film transistor.

The display element OD includes a first electrode FE, a second electrode SE, and an intermediate layer IM interposed between both electrodes.

The first electrode FE is electrically connected to either the source electrode 406 or the drain electrode 407 and may be connected to the drain electrode 407 as shown in FIG.

The first electrode FE may have various shapes, for example, patterned in an island shape.

The first electrode FE may be formed of various materials. That is, the first electrode FE may be formed of indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In2O3) And a transparent conductive oxide such as indium gallium oxide (IGO), aluminum zinc oxide (AZO), and the like. In addition, the first electrode FE may include a metal having a high reflectance such as silver (Ag).

The intermediate layer (IM) includes an organic light emitting layer, and the organic light emitting layer may be a low molecular organic material or a polymer organic material. As an alternative embodiment, the intermediate layer IM may further include at least one selected from the group consisting of a hole injection layer, a hole transporting layer, an electron transporting layer and an electron injecting layer together with an organic light emitting layer.

On the other hand, the organic light emitting layer may be formed separately for each organic light emitting device. In this case, red, green, and blue light can be emitted individually for each organic light emitting element. However, the present invention is not limited to this, and the organic light emitting layer may be formed in common throughout the organic light emitting element. For example, a plurality of organic light emitting layers emitting red, green, and blue light may be vertically stacked or mixed to form white light. Of course, the combination of colors for emitting white light is not limited to the above. In this case, a color conversion layer or a color filter for converting the emitted white light into a predetermined color may be separately provided.

The second electrode SE may be formed of various conductive materials. For example, the second electrode SE may contain lithium (Li), calcium (Ca), lithium fluoride (LiF), aluminum (Al), magnesium (Mg) May be formed of at least one single layer or multiple layers, and may include alloy materials containing at least two of the above materials.

The pixel defining layer PDL is formed on the passivation film 408 and the pixel defining layer PDL is formed so as not to cover the predetermined region of the first electrode FE and then covered with the pixel defining layer PDL The intermediate layer IM is formed on the region of the first electrode FE and the second electrode SE is formed on the intermediate layer IM.

The pixel defining layer (PDL) may be formed by a method such as spin coating with one or more organic insulating materials selected from the group consisting of polyimide, polyamide, acrylic resin, benzocyclobutene, and phenol resin.

Although not shown on the second electrode SE, a functional layer (not shown) and a first protective layer (not shown) shown in FIG. 11 may be further formed as an alternative embodiment. The detailed description of the functional layer and the first protective layer is the same as that of the above-described embodiment, and thus a detailed description thereof will be omitted.

The gate insulating film 411 and the interlayer insulating film 412 of the display area inorganic film 410 can be formed using various inorganic materials.

As an alternative embodiment, the display area inorganic film 410 may comprise an oxide, a nitride or a nitrate. As a more specific example, the display area inorganic film 410 may contain silicon nitride (SiN _x ), silicon oxide (SiO ₂ ), or silicon oxynitride (SiO _x N _y ).

The peripheral area PA may be disposed adjacent to the edge of the substrate 401, and as an alternative, the peripheral area PA may be disposed adjacent to the entire edge of the substrate 401. [

The sealing inorganic film 420 is formed so as to cover the display area DA on the substrate 401. That is, the sealing inorganic film 420 is formed on the second electrode SE of the display element OD. The encapsulating inorganic film 420 covers or covers the display area DA and can block or reduce the penetration of foreign substances such as moisture or oxygen into the display device OD by covering the display device OD, for example.

In the peripheral region PA, the encapsulating inorganic film 420 is formed on the display region inorganic film 410. At least one edge of the sealing inorganic film 420 is out of the edge of the display area inorganic film 410. That is, at least one edge of the sealing inorganic film 420 may be in contact with the upper surface of the substrate 401 after passing over one edge of the display area inorganic film 410.

As an alternative embodiment, all the edges of the sealing inorganic film 420 can be brought into contact with the upper surface of the substrate 401 while leaving the edge of the display area inorganic film 410.

The encapsulating inorganic film 420 can be formed using various inorganic materials.

As an alternative embodiment, the encapsulating inorganic film 420 may comprise an oxide, a nitride or a nitrate. As a more specific example, the encapsulating inorganic film 420 may contain silicon nitride (SiN _x ), silicon oxide (SiO ₂ ), or silicon oxynitride (SiO _x N _y ).

Although not shown, as an alternative embodiment, the encapsulating inorganic film 420 may include a main region (not shown) and a shadow region (not shown). That is, the structure of FIG. 3 can be applied to this embodiment.

As an alternative embodiment, all the edges of the sealing inorganic film 420 are formed on the upper surface of the substrate 401, passing over the edge of the display area inorganic film 410.

That is, the edge region of the encapsulating inorganic film 420 can be in contact with the upper surface of the substrate 401, thereby reducing or preventing the peeling of the edge of the encapsulating inorganic film 420 from the display area inorganic film 410 The sealing property of the sealing inorganic film 420 can be improved.

In an alternative embodiment, when the substrate 401 is formed of an organic material, for example, plastic, the sealing inorganic film 420 and the sealing inorganic film 420 are brought into contact with the upper surface of the substrate 401, It is possible to effectively reduce the peeling of the encapsulating inorganic film 420 from the substrate 401 during or during the manufacturing process of the substrate 401. For example, during the manufacturing process of the display device 4000, the encapsulating inorganic film 420 is shrunk and expanded to cause stress due to the high temperature or high humidity process. At this time, the substrate 401 including the organic material can relieve the stress of the sealing inorganic film 420.

Accordingly, the display device 4000 having flexibility to increase user's convenience such as bending or folding can be easily realized.

At least one edge of the substrate 401 and the edge of the sealing inorganic film 420 are spaced apart from each other and an upper surface of the substrate 401 is formed in an area adjacent to the edge of the substrate 401, An exposed area is formed without being covered. The exposed region on the substrate 401 allows the crack propagation to be originally cut off during the cutting process for separation during the manufacturing process of the display device 4000. In addition, the flexibility of the display device 4000 can be improved and the user's convenience can be increased.

Although not shown, the modification of Figs. 5 to 11 can be selectively applied to this embodiment as well.

5, an encapsulating organic film (not shown) can be formed on the display element OD in the display area DA and extended so that the encapsulating organic film (inorganic film) The display area inorganic film 410 and the sealing inorganic film 420 in the display area.

In addition, the present embodiment may further include a blocking member (not shown) shown in Fig. 6, and may include a plurality of blocking members (not shown) as shown in Fig.

In addition, as shown in Fig. 8, the encapsulating inorganic film 420 may include a plurality of inorganic films.

9, the encapsulating inorganic film 420 includes a plurality of inorganic films, and an encapsulating organic film (not shown) is disposed between a plurality of adjacent inorganic films, and an encapsulating organic film (not shown) A blocking member (not shown) for blocking overflowing is formed on the upper portion of the display area inorganic film 410.

10, the encapsulating inorganic film 420 includes a plurality of inorganic films and may further include an encapsulating organic film (not shown). One or more blocking members (not shown) can block the overflow of the encapsulating organic film (not shown).

11, it may further include a functional layer (not shown), a first protective layer (not shown) and a second protective layer (not shown).

12 to 28, that is, a structure in which at least one edge of the encapsulating inorganic film 420 is formed in parallel with at least one edge of the display area inorganic film 410, It is also possible to selectively apply the structure including the main region and the shadow region and the structure including the spacing member.

FIG. 31 is a plan view schematically showing a display device according to another embodiment of the present invention, and FIG. 32 is a cross-sectional view taken along lines VIA-VIA and VIB-VIB of FIG.

Referring to FIGS. 31 and 32, a display device 5000 according to the present embodiment includes a substrate 501. A central area CA having a display area DA and a peripheral area PA disposed around the center area CA are defined on the substrate 501. [

The display device 5000 of the present embodiment differs from the display device 4000 of the embodiment described above in the structure of the buffer layer 503, the sealing inorganic film 520, the sealing organic film 540 and the blocking member 550 . For convenience of explanation, these different points will be mainly described.

A barrier layer 502 is formed on the substrate 501. A buffer layer 503 is formed on the barrier layer 502. The buffer layer 503 may provide a flat surface on the upper portion of the substrate 501 and may primarily block foreign substances or moisture penetrating through the substrate 501. The buffer layer 503 is not an essential component and can be omitted.

A thin film transistor can be formed on the display area DA on the buffer layer 503. [ The thin film transistor formed on the display area DA functions as a part of a circuit for driving the display element OD. However, the thin film transistor can also be formed on the non-display region.

The thin film transistor includes an active layer 505, a gate electrode GE, a source electrode 506, and a drain electrode 507.

The active layer 505 is formed on the buffer layer 503. A gate insulating film 511 is formed on the active layer 505. The gate insulating film 511 may be formed as a film of the display region inorganic film 510 to extend not only to the display region DA but also to a part of the peripheral region PA.

The gate electrode GE is formed on the gate insulating film 511. An interlayer insulating film 512 is formed on the gate electrode GE. The interlayer insulating film 512 isolates the source electrode 506 and the drain electrode 507 from the gate electrode GE.

As an alternative embodiment, the interlayer insulating film 512 may be formed as a film of the display area inorganic film 510 to extend not only to the display area DA but also to a part of the peripheral area PA.

That is, the gate insulating film 511 and the interlayer insulating film 512, which are the display area inorganic film 510, may be formed on the barrier layer 502 in the peripheral region PA.

A source electrode 506 and a drain electrode 507 are formed on the interlayer insulating film 512. The source electrode 506 and the drain electrode 507 can be formed as a single layer or a multilayer using a material having a good conductivity.

The source electrode 506 and the drain electrode 507 are formed so as to be in contact with the region of the active layer 505.

A passivation film 508 is formed on the source electrode 506 and the drain electrode 507 so as to cover the thin film transistor.

And a display element OD is formed on the passivation film 508. [ The display element OD is electrically connected to the thin film transistor.

The display element OD includes a first electrode FE, a second electrode SE, and an intermediate layer IM interposed between both electrodes.

The pixel defining layer PDL is formed on the passivation film 508 and the pixel defining layer PDL is formed so as not to cover the predetermined region of the first electrode FE and then covered with the pixel defining layer PDL The intermediate layer IM is formed on the region of the first electrode FE and the second electrode SE is formed on the intermediate layer IM.

Although not shown on the second electrode SE, a functional layer (not shown) and a first protective layer (not shown) shown in FIG. 11 may be further formed as an alternative embodiment. The detailed description of the functional layer and the first protective layer is the same as that of the above-described embodiment, and thus a detailed description thereof will be omitted.

The gate insulating film 511 and the interlayer insulating film 512 of the display area inorganic film 510 can be formed using various inorganic materials.

The sealing inorganic film 520 is formed so as to cover the display area DA on the substrate 501. The encapsulating inorganic film 520 includes a first inorganic film 521 and a second inorganic film 522.

The encapsulating organic film 540 includes a plurality of organic films, that is, a first organic film 541 and a second organic film 542.

A first organic film 541 is disposed between the second electrode SE of the display element OD and the first inorganic film 521 and the first organic film 521 and the second inorganic film 522 The second organic film 542 is disposed.

As an alternative embodiment, the second organic layer 542 may be formed to be larger than the first organic layer 541.

A blocking member 550 is formed on the upper portion of the display area inorganic film 510, that is, on the interlayer insulating film 512 as an optional embodiment, and has a first blocking member 551 and a second blocking member 552. The first organic film 541 and the second organic film 542 can be prevented from overflowing through the first blocking member 551 and the second blocking member 552.

The second blocking member 552 has a first layer 552a and a second layer 552b.

The blocking member 550 may be formed of various materials. As an alternative embodiment, the first layer 552a of the first blocking member 551 and the second blocking member 552 may be formed of the same material and may be formed of the same material as, for example, the passivation film 508 have.

As an alternative embodiment, the second layer 552b of the second blocking member 552 may be formed of the same material as the pixel defining layer (PDL).

At least one edge of the sealing inorganic film 520 is out of the edge of the display area inorganic film 510. That is, at least one edge of the sealing inorganic film 520 may be in contact with the upper surface of the substrate 501 after passing over one edge of the display area inorganic film 510.

As an alternative embodiment, all the edges of the sealing inorganic film 520 may come off the edge of the display area inorganic film 510 and contact the upper surface of the substrate 501.

The encapsulating inorganic film 520 may be formed using various inorganic materials.

As an alternative embodiment, the encapsulant inorganic film 520 may comprise an oxide, a nitride, or a nitrate. As a more specific example, the encapsulating inorganic film 520 may contain silicon nitride (SiN _x ), silicon oxide (SiO ₂ ), or silicon oxynitride (SiO _x N _y ).

Although not shown, as an alternative embodiment, the encapsulating inorganic film 520 may include a main region (not shown) and a shadow region (not shown). That is, the structure of FIG. 3 can be applied to this embodiment.

As an alternative embodiment, all the edges of the sealing inorganic film 520 are formed on the upper surface of the substrate 501, passing over the edge of the display area inorganic film 510.

12 to 28, that is, a structure in which at least one edge of the sealing inorganic film 520 is formed in parallel with at least one edge of the display region inorganic film 510, a structure in which the sealing inorganic film 520 may further include a structure including a main region and a shadow region, and a structure including a spacing member.

Fig. 33 is a plan view schematically showing a display device according to another embodiment of the present invention, and Fig. 34 is a cross-sectional view taken along the line XA-XA and XB-XB in Fig.

Referring to Figs. 33 and 34, the display device 6000 according to the present embodiment includes a substrate 601. Fig. A central area CA having a display area DA and a peripheral area PA disposed around the center area CA are defined on the substrate 601. [

For the sake of convenience of description, differences from the above-described embodiments will be mainly described.

A barrier layer 602 is formed on the substrate 601. A buffer layer 603 is formed on the barrier layer 602. Since the buffer layer 603 is not an essential component, it can be omitted.

A thin film transistor may be formed on the display area DA on the buffer layer 603. [ The thin film transistor formed on the display area DA functions as a part of a circuit for driving the display element OD. However, the thin film transistor can also be formed on the non-display region.

The thin film transistor includes an active layer 605, a gate electrode GE, a source electrode 606, and a drain electrode 607.

The first circuit member PCU1 may be formed in the peripheral area PA or, in an optional embodiment, in the non-display area. The first circuit member PCU1 may have various shapes and may include a circuit active layer CA, a circuit gate electrode CG, a circuit source electrode CS and a circuit drain electrode CD as optional embodiments .

The first circuit member PCU1 can transfer the electrical signal to the display element OD for driving the display element OD, and can convert electrical signals.

An active layer 605 and a circuit active layer (CA) are formed on the buffer layer 603. A gate insulating film 611 is formed on the active layer 605 and the circuit active layer CA.

The gate electrode GE is formed on the gate insulating film 611. In addition, the circuit gate electrode CG is formed on the gate insulating film 611.

An interlayer insulating film 612 is formed on the gate electrode GE and the circuit gate electrode CG. As an alternative embodiment, the interlayer insulating film 612 may be formed as a film of the display area inorganic film 610 so as to extend not only to the display area DA but also to a part of the peripheral area PA.

That is, the gate insulating film 611 and the interlayer insulating film 612, which are the display area inorganic films 610, may be formed on the barrier layer 602 in the peripheral region PA. The buffer layer 603 described above may also extend to reach the barrier layer 602.

A source electrode 606 and a drain electrode 607 are formed on the interlayer insulating film 612. Further, a circuit source electrode CS and a drain electrode 607 are formed on the interlayer insulating film 612.

The second circuit member PCU2 may be disposed on the interlayer insulating film 612 as an alternative embodiment. The second circuit member PCU2 can transfer the electrical signal to the display element OD for driving the display element OD, and can convert electrical signals.

A passivation film 608 is formed on the source electrode 606 and the drain electrode 607 so as to cover the thin film transistor. The passivation film 608 may also be formed to cover the first circuit member PCU1.

And a display element OD is formed on the passivation film 608. The display element OD is electrically connected to the thin film transistor. That is, as shown in FIG. 34, the display element OD may be electrically connected to the drain electrode 607.

The display element OD includes a first electrode FE, a second electrode SE, and an intermediate layer IM interposed between both electrodes.

The pixel defining layer PDL is formed on the passivation film 608 and the pixel defining layer PDL is formed so as not to cover the predetermined region of the first electrode FE and then covered with the pixel defining layer PDL The intermediate layer IM is formed on the region of the first electrode FE and the second electrode SE is formed on the intermediate layer IM.

Although not shown on the second electrode SE, a functional layer (not shown) and a first protective layer (not shown) shown in FIG. 11 may be further formed as an alternative embodiment. The detailed description of the functional layer and the first protective layer is the same as that of the above-described embodiment, and thus a detailed description thereof will be omitted.

The gate insulating film 611 and the interlayer insulating film 612 of the display area inorganic film 610 can be formed using various inorganic materials.

The sealing inorganic film 620 is formed so as to cover the display area DA on the substrate 601. [ The encapsulating inorganic film 620 includes a first inorganic film 621 and a second inorganic film 622.

A functional layer 660 is formed on the display element OD. The functional layer 660 may include a capping layer 661 and a cover layer 662. The capping layer 661 can protect the second electrode SE which is the uppermost layer of the display device OD formed in the display area DA and can control the refractive index of the visible light realized in the display device OD So that the light efficiency can be improved. The cover layer 662 is formed on the capping layer 661 and is formed to protect the capping layer 661 and the display element OD and to control the refractive index of visible light realized in the display element OD So that the light efficiency can be improved. The cover layer 662 may contain, for example, LiF.

The capping layer 661 may be formed to be larger than the display element OD so as to cover the display element OD. As an alternative embodiment, the cover layer 662 may be smaller than the capping layer 661.

The first passivation layer 670 is formed on the functional layer 660 and may include an inorganic material such as an oxide or a nitride. As an alternative embodiment, the first passivation layer 670 may comprise aluminum oxide, for example Al2O3.

As an alternative embodiment, the first passivation layer 670 may be formed to be larger than the functional layer 660 and formed smaller than the first organic layer 641, which will be described later. As another alternative embodiment, the first passivation layer 670 may be formed larger than the first organic layer 641 and the second organic layer 642

The encapsulating organic film 640 includes a plurality of organic films, that is, a first organic film 641 and a second organic film 642.

The first organic film 641 is disposed between the first protective layer 670 of the display element OD and the first inorganic film 621 and the first inorganic film 621 and the second inorganic film 622, The second organic film 642 is disposed between the first organic film 641 and the second organic film 642.

As an alternative embodiment, the second organic layer 642 may be formed larger than the first organic layer 641.

The blocking member 650 is formed on the upper portion of the display area inorganic film 610, that is, on the interlayer insulating film 612 as an optional embodiment and the first blocking member 651, the second blocking member 652, (653). The first organic film 641 and the second organic film 642 can be prevented from flowing over the first blocking member 651, the second blocking member 652 and the third blocking member 653. [

The second blocking member 652 has a first layer 652a and a second layer 652b. The third blocking member 653 includes a first layer 652a, a second layer 652b, and a third layer 653c.

The blocking member 650 may be formed of various materials. As an alternative embodiment, the first blocking member 651 may be formed of the same material as the passivation film 608 or the pixel defining layer (PDL). The first layer 652a and the second layer 652b of the second blocking member 652 may be formed of the same material as the passivation film 608 and the pixel defining layer PDL.

The first layer 653a, the second layer 653b and the third layer 653c of the third blocking member 653 may be formed of at least one of the passivation film 608 and the pixel defining film (PDL) It can be formed of the same material as any one.

As an alternative embodiment, the conductive member MUP may be disposed under the third blocking member 653, that is, under the first layer 653a.

At least one edge of the sealing inorganic film 620 is out of the edge of the display area inorganic film 610. That is, at least one edge of the sealing inorganic film 620 can pass over one edge of the display area inorganic film 610 and be in contact with the upper surface of the substrate 601.

As an alternative embodiment, all the edges of the sealing inorganic film 620 can be brought into contact with the upper surface of the substrate 601 off the edge of the display area inorganic film 610.

The encapsulating inorganic film 620 can be formed using various inorganic materials.

As an alternative embodiment, the encapsulating inorganic film 620 may comprise an oxide, a nitride or a nitrate. As a more specific example, the encapsulating inorganic film 620 may contain silicon nitride (SiN _x ), silicon oxide (SiO ₂ ), or silicon oxynitride (SiO _x N _y ).

Although not shown, as an alternative embodiment, the encapsulating inorganic film 620 may include a main region (not shown) and a shadow region (not shown). That is, the structure of FIG. 3 can be applied to this embodiment.

As an alternative embodiment, all the edges of the sealing inorganic film 620 are formed on the upper surface of the substrate 601 beyond the edge of the display area inorganic film 610. [

12 to 28, that is, a structure in which at least one edge of the sealing inorganic film 620 is formed in parallel with at least one edge of the display region inorganic film 610, 620 may be selectively applied to a structure including a main region and a shadow region and further including spacing members.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the exemplary embodiments, and that various changes and modifications may be made therein without departing from the scope of the present invention. Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims.

101, 201, 301, 401, 501, 601, 601:
110, 210, 310, 410, 510, 610: display area inorganic film
120, 220, 320, 420, 520, 620: encapsulating inorganic film
1000, 2000, 3000, 4000, 5000, 6000: Display device

Claims (29)

A display device including a central region having at least a display region on a substrate and a peripheral region arranged around the center region,
A display region inorganic film located on the display region and extending to at least one region of the peripheral region;
An encapsulating inorganic film located on the display area inorganic film; And
And a barrier layer disposed between the substrate and the display area inorganic film,
Wherein the sealing inorganic film includes a main region and a shadow region connected to the main region,
Wherein the shadow region has a sloped side and is positioned closer to an edge of the substrate than the main region
Wherein at least one edge of the barrier layer is located outside the one edge of the display inorganic film,
And the one edge of the barrier layer is positioned so as to deviate from one edge of the main region and the shadow region of the sealing inorganic film. The method according to claim 1,
Wherein the sealing inorganic film has a smaller size than the substrate so that an edge of the sealing inorganic film is spaced apart from an edge of the substrate. The method according to claim 1,
Wherein the display area inorganic film has a smaller size than the substrate so that an edge of the display area inorganic film is spaced apart from an edge of the substrate. The method according to claim 1,
Wherein at least one edge of the sealing inorganic film is formed on the substrate by passing over one edge of the inorganic film of the display region. The method according to claim 1,
And an encapsulating organic film disposed between the display area inorganic film and the encapsulating inorganic film so as to cover the display area. 6. The method of claim 5,
Wherein the encapsulation organic film is formed to be smaller than the display area inorganic film. 6. The method of claim 5,
Wherein the encapsulating organic film is formed to be smaller than the encapsulating inorganic film. 6. The method of claim 5,
And a blocking member formed to be closer to an edge of the substrate than the encapsulating organic film. 9. The method of claim 8,
Wherein the plurality of blocking members are provided. 10. The method of claim 9,
Wherein the plurality of blocking members are different in height from each other. The method according to claim 1,
Wherein the encapsulating inorganic film is formed in a laminated form of a plurality of inorganic films. 12. The method of claim 11,
Further comprising an encapsulating organic film disposed to cover the display area,
Wherein the encapsulating organic film is disposed between a plurality of inorganic films of the encapsulating inorganic film and formed to be smaller than the plurality of inorganic films. 13. The method of claim 12,
Wherein the encapsulating organic film has a plurality of organic films,
Wherein at least one organic film among the plurality of organic films is formed between an inorganic film of the encapsulating inorganic film and the inorganic film of the display region. The method according to claim 1,
And a functional layer disposed between the display area inorganic film and the sealing inorganic film. 15. The method of claim 14,
Wherein the functional layer has a layer capable of controlling a refractive index with respect to at least visible light. 15. The method of claim 14,
And a first protective layer disposed between the functional layer and the encapsulating inorganic film. The method according to claim 1,
And a second protective layer formed on the encapsulating inorganic film and formed larger than the encapsulating inorganic film. The method according to claim 1,
Wherein the substrate contains an organic substance. The method according to claim 1,
In the display area,
At least one display element; And
A thin film transistor which is electrically connected to the display element and has an active layer, a gate electrode, a source electrode and a drain electrode is formed,
Wherein the display region inorganic film is a layer in contact with at least one of the active layer, the gate electrode, the source electrode, and the drain electrode. 20. The method of claim 19,
The display area inorganic film may be formed,
A gate insulating film for insulating the active layer from the gate electrode, and an interlayer insulating film for insulating the source electrode and the drain electrode from the gate electrode. 20. The method of claim 19,
Wherein the display element includes a first electrode, a second electrode, and an intermediate layer disposed between the first electrode and the second electrode and having an organic light emitting layer. The method according to claim 1,
And at least one blocking member positioned on the display area inorganic film,
Wherein the sealing inorganic film is located on the blocking member. 23. The method of claim 22,
Wherein the sealing inorganic film comprises a plurality of inorganic films,
Wherein at least one of the plurality of inorganic films of the encapsulating inorganic film covers the at least one blocking member. 23. The method of claim 22,
Wherein the sealing inorganic film comprises a plurality of inorganic films,
Wherein at least one of the plurality of inorganic films of the encapsulating inorganic film covers the at least one blocking member. 23. The method of claim 22,
Wherein the display region includes a plurality of pixels and at least one display element,
A passivation film covering a conductive member provided on the display element, and a pixel defining layer defining the pixel,
Wherein the at least one blocking member comprises the same material as the passivation film or the pixel defining layer. 26. The method of claim 25,
Wherein the at least one blocking member comprises a blocking member having a plurality of layers,
Wherein one layer of the blocking member having the plurality of layers includes the same material as the passivation film and the other layer of the blocking member having the plurality of layers includes the same material as the pixel defining layer Device. A method of manufacturing a display device including a substrate having a central region having at least a display region and a peripheral region disposed around the central region,
Forming a display area inorganic film on the display area and extending to at least one area of the peripheral area;
Forming an encapsulating inorganic film covering the display area and having an edge located above the display area inorganic film and passing over an edge of the display area inorganic film,
Further comprising the step of forming a barrier layer positioned between the substrate and the display area inorganic film,
Wherein the sealing inorganic film includes a main region and a shadow region connected to the main region,
Wherein the shadow region has a sloped side and is positioned closer to an edge of the substrate than the main region
Wherein at least one edge of the barrier layer is located outside the one edge of the display inorganic film,
And the one edge of the barrier layer is positioned to be out of one edge of the main region and the shadow region of the sealing inorganic film. 28. The method of claim 27,
Wherein the encapsulating inorganic film is formed using a deposition method. 28. The method of claim 27,
Wherein the step of forming the encapsulating inorganic film is performed using a mask so that the encapsulating inorganic film is spaced apart from at least one edge of the substrate.

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