KR20170106048A - Photosensitive resin composition and color filter using same - Google Patents

Abstract

The present invention provides a photosensitive resin composition which contains (A) quantum dots, (B) a binder resin, (C) a photopolymerizable monomer, (D) a photopolymerization initiator, (E) a diffusing agent, (F) a polymerization inhibitor; (G) a thiol-based additive, and (H) a solvent; and a color filter using the same. The photosensitive resin composition according to one embodiment of the present invention can solve the problem of the room temperature aging during the time when the composition is left at room temperature after processes of coating and pre-baking for producing a color filter.

Description

TECHNICAL FIELD [0001] The present invention relates to a photosensitive resin composition and a color filter using the same. BACKGROUND ART [0002]

The present invention relates to a photosensitive resin composition and a color filter manufactured using the same.

In general, a color filter applied to a display uses a photosensitive resin composition to form a desired pattern through an exposure process using a photomask, and a color filter is formed through a patterning process of dissolving and removing the non-visible portion through a development process. The material for the color filter is alkali-soluble and requires high sensitivity, adhesion to the substrate, chemical resistance, and heat resistance.

On the other hand, it is general to use coloring materials such as pigments or dyes as the coloring agent in the photosensitive resin composition used for color filter formation. They are used to competitively absorb the photopolymerization initiator and light energy in the photosensitive resin composition, There is a problem that the hardening rate is low and the reliability is lowered.

Accordingly, attempts have been made to develop a photosensitive resin composition capable of remarkably improving reliability such as chemical resistance, heat resistance and the like by using a coloring material that can replace the existing dye or pigment.

One embodiment of the present invention is to provide a photosensitive resin composition capable of solving problems at room temperature.

Another embodiment is to provide a color filter manufactured using the photosensitive resin composition and having excellent light conversion ratio.

One embodiment includes (A) a quantum dot; (B) a binder resin; (C) a photopolymerizable monomer; (D) a photopolymerization initiator; (E) a diffusing agent; (F) polymerization inhibitors; (G) a thiol-based additive, and (H) a solvent.

The polymerization inhibitor may be included in an amount of 0.3 part by weight to 0.8 part by weight based on 100 parts by weight of the thiol-based additive.

The polymerization inhibitor may include a hydroquinone compound, a catechol compound, or a combination thereof.

The polymerization inhibitor may be at least one selected from the group consisting of hydroquinone, methylhydroquinone, t-butylhydroquinone, 2,5-di- t -butylhydroquinone, 2,5-bis (1,1-dimethylbutyl) hydroquinone, (1,1,3,3-tetramethylbutyl) hydroquinone, catechol, t- butylcatechol, 4-methoxyphenol, pyrogallol, 2,6-di - t - butyl-4-methylphenol, 2-naphthol, tris (N-hydroxy-N-nitrosophenylaminato-O, O ') aluminum (Tris .

The quantum dot may be a quantum dot that absorbs light of 360 to 780 nm and emits fluorescence at 450 to 600 nm.

The binder resin may include an acrylic binder resin, a cadmium binder resin, or a combination thereof.

The diffusing agent may comprise barium sulphate, calcium carbonate, titanium dioxide, zirconia or combinations thereof.

The diffusing agent may be included in an amount of 0.5 wt% to 10 wt% based on the total amount of the photosensitive resin composition.

The thiol-based additive may include at least two functional groups represented by the following formula (1) at the terminal.

[Chemical Formula 1]

In Formula 1,

L ¹ and L ² each independently represents a single bond, a substituted or unsubstituted C1 to C20 alkylene group, a substituted or unsubstituted C3 to C20 cycloalkylene group, a substituted or unsubstituted C6 to C20 arylene group, Lt; RTI ID = 0.0 > C2-C20heteroarylene < / RTI >

The thiol-based additive may be included in an amount of 0.1% by weight to 10% by weight based on the total amount of the photosensitive resin composition.

The photosensitive resin composition preferably contains 1% by weight to 30% by weight of the quantum dot (A) in the total amount of the photosensitive resin composition; 1 to 30% by weight of the binder resin (B); 1 to 20% by weight of the (C) photopolymerizable monomer; 0.1 to 5% by weight of the photopolymerization initiator (D); 0.5% to 10% by weight of the (E) dispersing agent; 0.001 wt.% To 0.03 wt.% Of the (F) polymerization inhibitor; 0.1% by weight to 10% by weight of the (G) thiol-based additive and the balance of the solvent (H).

The photosensitive resin composition may include malonic acid; 3-amino-1,2-propanediol; Silane coupling agents; Leveling agents; Fluorine surfactants; Or a combination thereof.

Another embodiment provides a color filter manufactured using the photosensitive resin composition.

Other aspects of the present invention are included in the following detailed description.

The photosensitive resin composition according to one embodiment can solve the problem of time-temperature degradation occurring during the time of being left at room temperature after coating and pre-bake in the color filter process, and it is possible to improve the light efficiency of the quantum dot during and after the completion of the color filter process It is possible to improve the sensitivity and the pattern straightness of the color filter by achieving an excellent light conversion rate by minimizing deterioration.

1 is a pattern (optical) photograph of the photosensitive resin composition according to Example 1 immediately after coating and prebaking.
FIG. 2 is a pattern (optical) photograph of the photosensitive resin composition according to Example 1 after coating and prebaking and left at room temperature for 1 hour.
3 is a pattern (optical) photograph of the photosensitive resin composition according to Example 1 after coating and prebaking, and left at room temperature for 2 hours.
4 is a pattern (optical) photograph of the photosensitive resin composition according to Example 2 immediately after coating and prebaking.
5 is a pattern (optical) photograph of the photosensitive resin composition according to Example 2 after coating and prebaking and left at room temperature for 1 hour.
Fig. 6 is a pattern (optical) photograph of the photosensitive resin composition according to Example 2 after coating and prebaking, and left at room temperature for 2 hours.
7 is a pattern (optical) photograph of the photosensitive resin composition according to Example 3 immediately after coating and prebaking.
8 is a pattern (optical) photograph of the photosensitive resin composition according to Example 3 after coating and prebaking and left at room temperature for 1 hour.
FIG. 9 is a pattern (optical) photograph of the photosensitive resin composition according to Example 3 after coating and prebaking, and left at room temperature for 2 hours.
10 is a pattern (optical) photograph of the photosensitive resin composition according to Example 4 immediately after coating and prebaking.
11 is a pattern (optical) photograph of the photosensitive resin composition according to Example 4 after coating and prebaking, and left at room temperature for 1 hour.
12 is a pattern (optical) photograph of the photosensitive resin composition according to Example 4 coated and prebaked and left at room temperature for 2 hours.
13 is a pattern (optical) photograph immediately after coating and prebaking of the photosensitive resin composition according to Example 5. Fig.
14 is a pattern (optical) photograph of the photosensitive resin composition according to Example 5 after coating and prebaking, and left at room temperature for 1 hour.
15 is a pattern (optical) photograph of the photosensitive resin composition according to Example 5 after coating and prebaking, and left at room temperature for 2 hours.
16 is a pattern (optical) photograph of the photosensitive resin composition of Comparative Example 1 immediately after coating and prebaking.
17 is a photograph of a pattern immediately after post-baking of the photosensitive resin composition according to Example 1 by scanning electron microscope.
18 is a photograph of a pattern immediately after post-baking of the photosensitive resin composition according to Example 2 by scanning electron microscope.
19 is a photograph of a pattern immediately after post-baking of the photosensitive resin composition according to Example 3 by scanning electron microscope.
20 is a photograph of a pattern immediately after post-baking of the photosensitive resin composition according to Example 4 by scanning electron microscope.
21 is a photograph of a pattern immediately after the post-baking of the photosensitive resin composition according to Comparative Example 1 with a scanning electron microscope.

Hereinafter, embodiments of the present invention will be described in detail. However, it should be understood that the present invention is not limited thereto, and the present invention is only defined by the scope of the following claims.

Unless otherwise specified herein, "alkyl group" means a C1 to C20 alkyl group, "alkenyl group" means a C2 to C20 alkenyl group, "cycloalkenyl group" means a C3 to C20 cycloalkenyl group Quot; means a C3 to C20 heterocycloalkenyl group, "an aryl group" means a C6 to C20 aryl group, an "arylalkyl group" means a C6 to C20 arylalkyl group, Refers to a C 1 to C 20 alkylene group, "arylene group" refers to a C6 to C20 arylene group, "alkylarylene group" refers to a C6 to C20 alkylarylene group, "heteroarylene group" refers to a C3 to C20 hetero Quot; means an arylene group, and the "alkoxysilylene group" means a C1 to C20 alkoxysilylene group.

Unless otherwise specified herein, "substituted" means that at least one hydrogen atom is replaced by a halogen atom (F, Cl, Br, I), a hydroxy group, a C1 to C20 alkoxy group, a nitro group, a cyano group, An ester group, an ether group, a carboxyl group or a salt thereof, a sulfonic acid group or a salt thereof, a phosphoric acid or a salt thereof, a C1-C10 alkyl group, a C1- A C2 to C20 alkenyl group, a C2 to C20 alkynyl group, a C6 to C20 aryl group, a C3 to C20 cycloalkyl group, a C3 to C20 cycloalkenyl group, a C3 to C20 cycloalkynyl group, a C2 to C20 heterocycloalkyl group, a C2 to C20 heterocycloalkyl group, To C20 heterocycloalkenyl groups, C2 to C20 heterocycloalkynyl groups, C3 to C20 heteroaryl groups, or combinations thereof.

Also, unless otherwise specified herein, "hetero" means that at least one heteroatom of N, O, S, and P is included in the formula.

&Quot; (Meth) acrylic acid "refers to both" acrylic acid "and" methacrylic acid " "It means both are possible.

"Combination" as used herein, unless otherwise specified, means mixing or copolymerization.

Unless otherwise defined in the chemical formulas in this specification, when no chemical bond is drawn at the position where the chemical bond should be drawn, it means that the hydrogen atom is bonded at the above position.

In the present specification, the cadmium resin means a resin in which at least one functional group selected from the group consisting of the following formulas (3-1) to (3-11) is contained in the main backbone of the resin.

Also, unless otherwise specified herein, "*" means the same or different atom or moiety connected to the formula.

The photosensitive resin composition according to one embodiment comprises (A) a quantum dot; (B) a binder resin; (C) a photopolymerizable monomer; (D) a photopolymerization initiator; (E) a diffusing agent; (F) polymerization inhibitors; (G) a thiol-based additive and (H) a solvent.

In general, the photosensitive resin composition uses a pigment or a dye as a colorant, but the photosensitive resin composition according to one embodiment uses a quantum dot instead of a pigment or a dye, further includes a diffusing agent for effective light diffusion, In addition to the thiol-based additives. The color filter type self-luminescent LCD manufactured using the photosensitive resin composition having such a configuration can improve the color reproduction ratio and luminance in the conventional LCD.

Each component will be described in detail below.

(A) Qdot

The quantum dot may absorb light in a wavelength range of 360 nm to 780 nm, for example, a wavelength range of 400 nm to 780 nm, and emit fluorescence in a wavelength range of 450 nm to 600 nm, for example, 500 nm to 550 nm. That is, the photo-conversion material may have a maximum fluorescence emission wavelength (fluorescence? _Em ) of 450 nm to 650 nm, for example, 500 nm to 550 nm.

For example, the quantum dot may be a green quantum dot. The green quantum dot may have an average particle diameter of 5 nm to 10 nm.

The quantum dot may be included in an amount of 1 wt% to 30 wt%, for example, 5 wt% to 20 wt% based on the total amount of the photosensitive resin composition according to one embodiment. When the quantum dots are included within the above ranges, it is possible to prevent the development of the light conversion characteristic inherent to the quantum dots and the decrease in the light conversion efficiency.

The quantum dot may be contained in an amount of 10% by weight to 60% by weight based on the total solid content of the photosensitive resin composition.

The quantum dot may have a full width at half maximum (FWHM) of 20 nm to 100 nm, for example, 20 nm to 50 nm. When the quantum dots have a half width of the above range, the color purity is high when used as a color filter material as the color purity is high.

The quantum dot may be an organic material, an inorganic material, or a hybrid of an organic material and an inorganic material.

The quantum dot may comprise a core and a shell surrounding the core. The core and the shell may each independently comprise a core, a core / shell, a core / a first shell / a second shell, , Alloys, alloys / shells, and the like, but the present invention is not limited thereto.

For example, the core may include at least one material selected from the group consisting of CdS, CdSe, CdTe, ZnS, ZnSe, ZnTe, HgS, HgSe, HgTe, GaN, GaP, GaAs, InP, InAs and alloys thereof , But is not limited thereto. The shell surrounding the core may include at least one material selected from the group consisting of CdSe, ZnSe, ZnS, ZnTe, CdTe, PbS, TiO, SrSe, HgSe and alloys thereof.

The structure of the quantum dots is not particularly limited. However, in the case of quantum dots of the core / shell, core / first shell / second shell or alloy / shell structure, the size (average particle size) of the entire quantum dots including the shell is 1 nm to 15 nm For example, 5 nm to 10 nm.

In order to improve stability and dispersibility of the quantum dots, the organic material may be stabilized by replacing the organic material on the surface of the shell. The organic material may be selected from the group consisting of thiol, amine, phosphine oxide, acryl based, Si based, and the like, but not always limited thereto.

In one embodiment, instead of a luminescent material having a cadmium-based core, quantum yield is somewhat low, but environmentally friendly (Shell-second shell type quantum dots) having a structure of InP / ZnSe / ZnS (core / first shell / second shell) are used, but the present invention is not limited thereto.

For the dispersion stability of the quantum dot, the photosensitive resin composition according to one embodiment may further include a dispersant. The dispersant helps the quantum dots to be uniformly dispersed in the photosensitive resin composition, and both nonionic, anionic and cationic dispersants can be used. Specific examples thereof include polyalkylene glycols or esters thereof, polyoxyalkylene, polyhydric alcohol ester alkylene oxide adducts, alcohol alkylene oxide adducts, sulfonic acid esters, sulfonic acid salts, carboxylic acid esters, carboxylic acid salts, alkylamide alkylene oxides Adducts, alkylamines, and the like, which may be used alone or in admixture of two or more. The dispersant may be used in an amount of 0.1% by weight to 100% by weight, for example, 10% by weight to 20% by weight, based on the solid content of the quantum dot.

(B) binder resin

The binder resin may include an acrylic binder resin, a cadmium binder resin, or a combination thereof.

The acrylic binder resin is a copolymer of a first ethylenically unsaturated monomer and a second ethylenically unsaturated monomer copolymerizable with the first ethylenically unsaturated monomer, and may be a resin containing at least one acrylic repeating unit.

The first ethylenically unsaturated monomer is an ethylenically unsaturated monomer containing at least one carboxyl group, and specific examples thereof include acrylic acid, methacrylic acid, maleic acid, itaconic acid, fumaric acid, or a combination thereof.

The first ethylenically unsaturated monomer may be included in an amount of 5% by weight to 50% by weight, for example, 10% by weight to 40% by weight based on the total amount of the acrylic binder resin.

The second ethylenically unsaturated monomer may be an aromatic vinyl compound such as styrene,? -Methylstyrene, vinyltoluene, or vinylbenzyl methyl ether; (Meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, benzyl (meth) acrylate, Unsaturated carboxylic acid ester compounds such as cyclohexyl (meth) acrylate and phenyl (meth) acrylate; Unsaturated carboxylic acid aminoalkyl ester compounds such as 2-aminoethyl (meth) acrylate and 2-dimethylaminoethyl (meth) acrylate; Carboxylic acid vinyl ester compounds such as vinyl acetate and vinyl benzoate; Unsaturated carboxylic acid glycidyl ester compounds such as glycidyl (meth) acrylate; A vinyl cyanide compound such as (meth) acrylonitrile; Unsaturated amide compounds such as (meth) acrylamide; These may be used singly or in combination of two or more.

Specific examples of the acrylic binder resin include polybenzyl methacrylate, (meth) acrylic acid / benzyl methacrylate copolymer, (meth) acrylic acid / benzyl methacrylate / styrene copolymer, (meth) acrylic acid / benzyl methacrylate / 2-hydroxyethyl methacrylate copolymer, and (meth) acrylic acid / benzyl methacrylate / styrene / 2-hydroxyethyl methacrylate copolymer, but not limited thereto, Or more may be used in combination.

The weight average molecular weight of the acrylic binder resin may be from 5,000 g / mol to 15,000 g / mol. 　 When the weight average molecular weight of the acrylic binder resin is within the above range, it has good adhesion with the substrate, good physical and chemical properties, and good viscosity.

The acid value of the acrylic binder resin may be 80 mgKOH / g to 130 mgKOH / g. When the acid value of the acrylic binder resin is within the above range, the resolution of the pixel pattern is excellent.

The cadmium binder resin may include a repeating unit represented by the following general formula (3).

(3)

In Formula 3,

R ¹¹ and R ¹² are each independently a hydrogen atom or a substituted or unsubstituted (meth) acryloyloxy group,

R ¹³ and R ¹⁴ are each independently a hydrogen atom, a halogen atom or a substituted or unsubstituted C1 to C20 alkyl group,

Z ¹ is a single bond, O, CO, SO ₂ , CR ¹⁷ R ¹⁸ , SiR ¹⁹ R ²⁰ (wherein R ¹⁷ to R ²⁰ are each independently a hydrogen atom or a substituted or unsubstituted C1 to C20 alkyl group) Is any one of the linking groups represented by formulas (3-1) to (3-11)

[Formula 3-1]

[Formula 3-2]

[Formula 3-3]

[Chemical Formula 3-4]

[Formula 3-5]

(In the above Formula 3-5,

R ^a is a hydrogen atom, an ethyl group, C ₂ H ₄ Cl, C ₂ H ₄ OH, CH ₂ CH = CH ₂ or a phenyl group.

[Chemical Formula 3-6]

[Chemical Formula 3-7]

[Chemical Formula 3-8]

[Chemical Formula 3-9]

[Chemical Formula 3-10]

[Formula 3-11]

Z ² is an acid anhydride residue,

t1 and t2 are each independently an integer of 0 to 4;

The weight average molecular weight of the cationic binder resin may be from 500 g / mol to 50,000 g / mol, such as from 1,000 g / mol to 30,000 g / mol. When the weight average molecular weight of the cationic binder resin is within the above range, pattern formation is good without residue during the production of the photosensitive organic film, no loss of film thickness during development, and good patterns can be obtained.

The cadmium binder resin may include a functional group represented by the following formula (4) in at least one of the two terminals.

[Chemical Formula 4]

In Formula 4,

Z ³ may be represented by the following formulas (4-1) to (4-7).

[Formula 4-1]

(Wherein R ^b and R ^c are each independently a hydrogen atom, a substituted or unsubstituted C1 to C20 alkyl group, an ester group or an ether group).

[Formula 4-2]

[Formula 4-3]

[Formula 4-4]

[Formula 4-5]

Wherein R ^d is O, S, NH, a substituted or unsubstituted C1 to C20 alkylene group, a C1 to C20 alkylamine group, or a C2 to C20 alkenylamine group.

[Formula 4-6]

[Formula 4-7]

Examples of the cationic binder resin include fluorene-containing compounds such as 9,9-bis (4-oxiranylmethoxyphenyl) fluorene; Benzene tetracarboxylic acid dianhydride, naphthalene tetracarboxylic acid dianhydride, biphenyl tetracarboxylic dianhydride, benzophenonetetracarboxylic dianhydride, pyromellitic dianhydride, cyclobutanetetracarboxylic dianhydride, Anhydride compounds such as lyrenetetracarboxylic acid dianhydride, tetrahydrofuran tetracarboxylic acid dianhydride, and tetrahydrophthalic anhydride; Glycol compounds such as ethylene glycol, propylene glycol, and polyethylene glycol; Alcohol compounds such as methanol, ethanol, propanol, n-butanol, cyclohexanol and benzyl alcohol; Propylene glycol methyl ethyl acetate, and N-methyl pyrrolidone; Phosphorus compounds such as triphenylphosphine; And an amine or an ammonium salt compound such as tetramethylammonium chloride, tetraethylammonium bromide, benzyldiethylamine, triethylamine, tributylamine, benzyltriethylammonium chloride, or the like.

When the binder resin is a cadmium-based binder resin, the photosensitive resin composition containing the binder resin is excellent in developability, is excellent in sensitivity upon photo-curing, and is excellent in fine pattern formation.

The binder resin may be contained in an amount of 1% by weight to 30% by weight, for example, 3% by weight to 20% by weight based on the total amount of the photosensitive resin composition. When the binder resin is contained within the above range, excellent sensitivity, developability, resolution, and straightness of the pattern can be obtained.

(C) Photopolymerization  Monomer

The photopolymerizable monomer may be a monofunctional or polyfunctional ester of (meth) acrylic acid having at least one ethylenically unsaturated double bond.

Since the photopolymerizable monomer has the ethylenically unsaturated double bond, sufficient polymerization is caused during exposure in the pattern formation step, whereby a pattern having excellent heat resistance, light resistance and chemical resistance can be formed.

Specific examples of the photopolymerizable monomer include ethylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, triethylene glycol di (meth) acrylate, propylene glycol di (meth) acrylate, neopentyl glycol Acrylate such as di (meth) acrylate, 1,4-butanediol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, bisphenol A di (meth) acrylate, pentaerythritol di (Meth) acrylate, pentaerythritol tetra (meth) acrylate, pentaerythritol tetra (meth) acrylate, pentaerythritol hexa (meth) acrylate, dipentaerythritol di Acrylate, dipentaerythritol penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, bisphenol A epoxy (meth) acrylate, ethylene glycol There may be mentioned furnace methyl ether (meth) acrylate, trimethylolpropane tri (meth) acrylate, tris (meth) acryloyloxyethyl phosphate, novolak epoxy (meth) acrylate, and the like.

A commercially available product of the photopolymerizable monomer is exemplified as follows. The (meth) acrylic acid is one example of a polyfunctional ester, such as doah Gosei Kagaku Kogyo's (primary)社Aronix M-101 ^®, the same M-111 ^®, the same M-114 ^®; KAYARAD TC-110S ^® and TC-120S ^{® from} Nihon Kayaku Co., Ltd.; Osaka yukki the like Kagaku Kogyo (main)社of ^{V-158 ®, V-2311} ®. The (meth) acrylic acid ester of a transfer function of an example, the doah Gosei cultivating the T (weeks)社of Aronix M-210 ^®, copper or the like M-240 ^®, the same M-6200 ^®; KAYARAD HDDA ^® , HX-220 ^® and R-604 ^{® from} Nihon Kayaku Corporation; Osaka yukki the like Kagaku Kogyo Co., Ltd. of ^{社V-260 ®, V-} 312 ®, V-335 HP ®. Examples of the tri-functional ester of (meth) acrylic acid, doah Gosei Kagaku Kogyo (Note)社of Aronix M-309 ^®, the same M-400 ^®, the same M-405 ^®, the same M-450 ^®, Dong M -7100 ^® , copper M-8030 ^® , copper M-8060 ^® and the like; Nippon Kayaku (Note)社of KAYARAD TMPTA ^®, copper DPCA-20 ^{®, ®} copper -30, -60 ^® copper, copper ^® -120 and the like; Osaka yukki Kayaku high (primary)社of V-295 ^®, copper ^® -300, -360 ^® copper, copper -GPT ^®, copper -3PA ^®, and the like copper -400 ^®. These products may be used alone or in combination of two or more.

The photopolymerizable monomer may be treated with an acid anhydride to give better developing properties.

The photopolymerizable monomer may be contained in an amount of 1 wt% to 20 wt%, for example, 3 wt% to 15 wt% with respect to the total amount of the photosensitive resin composition. When the photopolymerizable monomer is contained within the above range, the pattern is formed with sufficient curing during exposure in the step of pattern formation, so that the reliability is excellent, and the heat resistance, light resistance, chemical resistance, resolution and adhesion of the pattern are also excellent.

(D) Light curing Initiator

The photopolymerization initiator may be, for example, an acetophenone-based compound, a benzophenone-based compound, a thioxanthone-based compound, a benzoin-based compound, a triazine-based compound or an oxime-based compound as an initiator generally used in a photosensitive resin composition .

Examples of the acetophenone-based compound include 2,2'-diethoxyacetophenone, 2,2'-dibutoxyacetophenone, 2-hydroxy-2-methylpropiophenone, pt-butyltrichloroacetophenone, dichloro-4-phenoxyacetophenone, 2-methyl-1- (4- (methylthio) phenyl) -2-morpholinopropanone, p-butyldichloroacetophenone, 1-one, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butan-1-one.

Examples of the benzophenone compound include benzophenone, benzoyl benzoic acid, methyl benzoyl benzoate, 4-phenylbenzophenone, hydroxybenzophenone, acrylated benzophenone, 4,4'-bis (dimethylamino) benzophenone, '-Bis (diethylamino) benzophenone, 4,4'-dimethylaminobenzophenone, 4,4'-dichlorobenzophenone, and 3,3'-dimethyl-2-methoxybenzophenone.

Examples of the thioxanthone compound include thioxanthone, 2-methylthioxanthone, isopropylthioxanthone, 2,4-diethylthioxanthone, 2,4-diisopropylthioxanthone, 2- Chlorothioxanthone and the like.

Examples of the benzoin compound include benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, and benzyl dimethyl ketal.

Examples of the triazine-based compound include 2,4,6-trichloro-s-triazine, 2-phenyl-4,6-bis (trichloromethyl) -Dimethoxystyryl) -4,6-bis (trichloromethyl) -s-triazine, 2- (4'-methoxynaphthyl) -4,6-bis (trichloromethyl) (Trichloromethyl) -s-triazine, 2- (p-tolyl) -4,6-bis (trichloromethyl) (Trichloromethyl) -6-styryl-s-triazine, 2- (naphtho-1-yl) - 4,6-bis (trichloromethyl) -s-triazine, 2- (4-methoxynaphthol-1-yl) -Bis (trichloromethyl) -6- (4-methoxystyryl) -s-triazine, and the like. .

Examples of the oxime compounds include O-acyloxime compounds, 2- (O-benzoyloxime) -1- [4- (phenylthio) phenyl] -1,2-octanedione, 1- -1- [9-ethyl-6- (2-methylbenzoyl) -9H-carbazol-3-yl] ethanone, O-ethoxycarbonyl-a-oxyamino-1-phenylpropan- Can be used. Specific examples of the O-acyloxime-based compound include 1,2-octanedione, 2-dimethylamino-2- (4-methylbenzyl) -1- (4-morpholin- 2-oxime-O-benzoate, 1- (4-phenylsulfanylphenyl) -octane-1,2-dione -1-one oxime-O-acetate, 1- (4-phenylsulfanylphenyl) -butan-1-one oxime- O-acetate, and the like.

The photopolymerization initiator may be a carbazole compound, a diketone compound, a sulfonium borate compound, a diazo compound, an imidazole compound, or a nonimidazole compound in addition to the above compounds.

The photopolymerization initiator may be used in combination with a photosensitizer that generates a chemical reaction by absorbing light to be in an excited state and transferring its energy.

Examples of the photosensitizer include tetraethylene glycol bis-3-mercaptopropionate, pentaerythritol tetrakis-3-mercaptopropionate, dipentaerythritol tetrakis-3-mercaptopropionate and the like .

The photopolymerization initiator may be contained in an amount of 0.1 wt% to 5 wt%, for example, 0.1 wt% to 3 wt% with respect to the total amount of the photosensitive resin composition. When the photopolymerization initiator is contained within the above range, the photopolymerization initiator sufficiently undergoes curing during exposure in the pattern formation step, thereby obtaining excellent reliability, and is excellent in heat resistance, light resistance, chemical resistance, resolution and adhesion of the pattern, .

(E) Diffuser  (or Diffuser  Dispersion)

The photosensitive resin composition according to one embodiment includes a diffusing agent. For example, the photosensitive resin composition according to one embodiment may further include a dispersant dispersion in which the dispersant is dispersed. As the dispersion liquid in which the diffusion agent is dispersed, any organic solvent such as PGMEA can be used without any particular limitation.

For example, the diffusing material may include barium sulfate (BaSO _4), calcium carbonate (CaCO _3), titanium dioxide (TiO _2), zirconia (ZrO _2), or a combination thereof.

The diffusing agent reflects light that is not absorbed by the light conversion material described above, and allows the light conversion material to absorb the reflected light again. That is, the diffusing agent increases the amount of light absorbed by the photo-conversion material, thereby increasing the photo-conversion efficiency of the photosensitive resin composition.

The dispersing agent may have an average particle diameter (D ₅₀ ) of 150 nm to 250 nm, and more specifically, 180 nm to 230 nm. When the average particle diameter of the diffusing agent is within the above range, it is possible to have a better light diffusing effect and increase the light conversion efficiency.

The dispersing agent, specifically, the dispersant solid content may be included in an amount of 0.5% by weight to 10% by weight, for example, 1% by weight to 8% by weight based on the total amount of the photosensitive resin composition. When the amount of the dispersing agent is less than 0.5% by weight based on the total amount of the photosensitive resin composition, it is difficult to expect the effect of improving the light conversion efficiency by using the dispersing agent. When the dispersing agent is contained in an amount exceeding 10% by weight, The pattern characteristic of the film is lowered, and the light conversion efficiency may also be lowered. That is, the dispersion liquid may include 2.5 wt% to 50 wt%, for example, 5 wt% to 40 wt% of the total amount of the photosensitive resin composition.

(F) polymerization inhibitor

The photosensitive resin composition according to one embodiment includes a polymerization inhibitor.

In general, after coating liquids of a photosensitive resin composition for a color filter and pre-baking them, radicals are generated by the heat-activated photopolymerization initiator in the pre-baking step, and the radicals react with the photopolymerizable monomers and thiol The crosslinking reaction between the additives of the system proceeds, and the curing is gradually caused.

After the pre-baking step, the composition that has undergone the pre-baking step before the exposure step is allowed to stand at room temperature, and the time to stand at the normal temperature is about one hour. However, the developing time generally becomes longer than 30 seconds after the room temperature leaving time exceeds 30 minutes, and when the room temperature leaving time exceeds 1 hour, the unexposed phenomenon may occur and pattern formation may become impossible. In addition, if the developability is greatly lowered due to the hardening of the non-exposed portion, a problem of sensitivity deterioration occurs.

However, the photosensitive resin composition according to one embodiment includes the polymerization inhibitor described above, and the polymerization inhibitor inhibits the crosslinking reaction between the photopolymerizable monomer and the thiol additive, thereby solving the problem of the aging at room temperature without changing the developing time. That is, when the photosensitive resin composition according to one embodiment is used, a uniform pattern can be formed without changing the developing time even if it is left at room temperature for 2 hours or more after coating and prebaking the composition.

The polymerization inhibitor may be contained in an amount of 0.3 to 0.8 parts by weight, for example, 0.3 to 0.6 parts by weight based on 100 parts by weight of the thiol-based additive. If the polymerization inhibitor is contained in an amount of less than 0.3 part by weight based on 100 parts by weight of the thiol additive, the problems at a room temperature can not be solved. If the polymerization inhibitor is contained in an amount exceeding 0.8 parts by weight, patterning becomes impossible or surface peeling may occur have.

The polymerization inhibitor may include a hydroquinone compound, a catechol compound, or a combination thereof. For example, the polymerization inhibitor may be at least one selected from the group consisting of hydroquinone, methylhydroquinone, t-butylhydroquinone, 2,5-di- t -butylhydroquinone, 2,5-bis (1,1-dimethylbutyl) hydroquinone, Di- t -butyl-4-methyl (meth) acrylate, bis (1,1,3,3-tetramethylbutyl) hydroquinone, catechol, Phenol, 2-naphthol, tris (N-hydroxy-N-nitrosophenylaminato-O, O ') aluminum (Tris But is not limited thereto.

The polymerization inhibitor may be included in an amount of 0.001 to 0.03% by weight, for example, 0.01 to 0.019% by weight based on the total weight of the photosensitive resin composition. When the polymerization inhibitor is contained within the above range, the problem of the decrease in the room temperature can be solved, and the decrease in sensitivity and the surface peeling phenomenon can be prevented.

(G) Thiol system  additive

In order to improve the stability and dispersibility of the quantum dot, the photosensitive resin composition according to one embodiment may further include a thiol-based additive.

The thiol-based additive is substituted on the surface of the shell of the quantum dots to improve the dispersion stability of the quantum dots with respect to the solvent and stabilize the quantum dots.

The thiol-based additive may have 2 to 10, for example 2 to 4, thiol groups (-SH) at the terminal thereof depending on its structure.

For example, the thiol-based additive may include at least two functional groups represented by the following formula (1) at the terminal.

[Chemical Formula 1]

In Formula 1,

L ¹ and L ² each independently represents a single bond, a substituted or unsubstituted C1 to C20 alkylene group, a substituted or unsubstituted C3 to C20 cycloalkylene group, a substituted or unsubstituted C6 to C20 arylene group, Lt; RTI ID = 0.0 > C2-C20heteroarylene < / RTI >

For example, the thiol-based additive may be represented by the following general formula (2).

(2)

In Formula 2,

L ¹ and L ² each independently represents a single bond, a substituted or unsubstituted C1 to C20 alkylene group, a substituted or unsubstituted C3 to C20 cycloalkylene group, a substituted or unsubstituted C6 to C20 arylene group, Lt; / RTI > is a C2 to C20 heteroarylene group,

u1 and u2 are each independently an integer of 0 or 1;

For example, in the above formulas (1) and (2), L ¹ and L ² may each independently be a single bond or a substituted or unsubstituted C1 to C20 alkylene group.

Specific examples of the thiol-based additive include pentaerythritol tetrakis (3-mercaptopropionate) represented by the following formula (2a), trimethylolpropane tris (3-mercaptopropionate) represented by the following formula 3-mercaptopropionate), pentaerythritol tetrakis (mercaptoacetate) represented by the following formula 2c, pentaerythritol tetrakis (mercaptoacetate) represented by the following formula 2c, trimethylolpropane tris (mercaptoacetate) (2-mercaptoacetate) represented by the following formula (2e), Glycol di-3-mercaptopropionate represented by the following formula (2e), and combinations thereof. One can be said.

(2a)

(2b)

[Chemical Formula 2c]

(2d)

[Formula 2e]

The thiol-based additive may be included in an amount of 0.1 wt% to 10 wt%, for example, 0.1 wt% to 5 wt% with respect to the total amount of the photosensitive resin composition. When the thiol-based additive is contained within the above range, the stability of the photoconversion substance such as a quantum dot can be improved. Further, the thiol group in the component reacts with the acrylic group of the resin or monomer to form a covalent bond, It can also have an effect.

(H) Solvent

The solvent is compatible with a solvent having compatibility with the quantum dots and compatibility with the binder resin, the photopolymerizable monomer, the photopolymerization initiator, the diffusing agent, the thiol additive, the polymerization inhibitor, Can be used.

Examples of the solvent compatible with the quantum dots include alkanes (R-H) such as pentane, hexane, heptane and the like; Aromatic hydrocarbons (Ar-H) such as toluene and xylene; Ethers (R-O-R) such as diisobutyl ether, diisobutyl ether, ethylene glycol dimethyl ether and the like; Alkyl halides (R-X) such as chloroform, trichloromethane and the like; Cycloalkanes such as cyclopropane, cyclobutane, cyclopentane, cyclohexane and the like, but the present invention is not limited thereto.

Examples of the solvent having compatibility with the binder resin, the photopolymerizable monomer, the photopolymerization initiator, the diffusing agent, the polymerization inhibitor, the thiol additive and other additives include alcohols such as methanol and ethanol; Ethers such as dichloroethyl ether, n-butyl ether, diisobutyl ether, methylphenyl ether and tetrahydrofuran; Glycol ethers such as ethylene glycol monomethyl ether and ethylene glycol monoethyl ether; Cellosolve acetates such as methyl cellosolve acetate, ethyl cellosolve acetate and diethyl cellosolve acetate; Carbitols such as methylethylcarbitol, diethylcarbitol, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol dimethyl ether, diethylene glycol methyl ethyl ether and diethylene glycol diethyl ether; Propylene glycol alkyl ether acetates such as propylene glycol methyl ether acetate and propylene glycol propyl ether acetate; Aromatic hydrocarbons such as toluene and xylene; Ketones such as methyl ethyl ketone, cyclohexanone, 4-hydroxy-4-methyl-2-pentanone, methyl-n-propyl ketone, methyl- ; Saturated aliphatic monocarboxylic acid alkyl esters such as ethyl acetate, n-butyl acetate and isobutyl acetate; Lactic acid esters such as methyl lactate and ethyl lactate; Oxyacetic acid alkyl esters such as methyl oxyacetate, ethyl oxyacetate and butyl oxyacetate; Alkoxyacetic acid alkyl esters such as methyl methoxyacetate, ethyl methoxyacetate, butyl methoxyacetate, methyl ethoxyacetate, and ethyl ethoxyacetate; 3-oxypropionic acid alkyl esters such as methyl 3-oxypropionate and ethyl 3-oxypropionate; 3-alkoxypropionic acid alkyl esters such as methyl 3-methoxypropionate, ethyl 3-methoxypropionate, ethyl 3-ethoxypropionate and methyl 3-ethoxypropionate; 2-oxypropionic acid alkyl esters such as methyl 2-oxypropionate, ethyl 2-oxypropionate and propyl 2-oxypropionate; 2-alkoxypropionic acid alkyl esters such as methyl 2-methoxypropionate, ethyl 2-methoxypropionate, ethyl 2-ethoxypropionate and methyl 2-ethoxypropionate; 2-methylpropionic acid esters such as methyl 2-oxy-2-methylpropionate and ethyl 2-oxy-2-methylpropionate, methyl 2-methoxy- Monooximonocarboxylic acid alkyl esters of 2-alkoxy-2-methylpropionic acid alkyls such as ethyl methyl propionate; Esters such as ethyl 2-hydroxypropionate, ethyl 2-hydroxy-2-methylpropionate, ethyl hydroxyacetate and methyl 2-hydroxy-3-methylbutanoate; Ketone acid esters such as ethyl pyruvate, and the like, and also include N-methylformamide, N, N-dimethylformamide, N-methylformanilide, N-methylacetamide, N, N-dimethylacetamide , N-methylpyrrolidone, dimethylsulfoxide, benzyl ethyl ether, dihexyl ether, acetylacetone, isophorone, caproic acid, caprylic acid, 1-octanol, 1-nonanol, benzyl alcohol, benzyl acetate, And high boiling solvents such as ethyl acetate, diethyl oxalate, diethyl maleate,? -Butyrolactone, ethylene carbonate, propylene carbonate, and phenyl cellosolve acetate.

Among them, glycol ethers such as ethylene glycol monoethyl ether and the like are preferably used in consideration of compatibility and reactivity; Ethylene glycol alkyl ether acetates such as ethyl cellosolve acetate; Esters such as ethyl 2-hydroxypropionate; Carbitols such as diethylene glycol monomethyl ether; Propylene glycol alkyl ether acetates such as propylene glycol monomethyl ether acetate and propylene glycol propyl ether acetate can be used.

The content of the solvent compatible with the binder resin, the photopolymerizable monomer, the photopolymerization initiator, the diffusing agent, the polymerization inhibitor, the thiol additive, and other additives is preferably at least one times the content of the solvent having compatibility with the quantum dot To 3 times, for example 1 to 2 times. In this case, there is an advantageous effect in controlling developability according to an alkali developing solution.

The solvent may be contained in an amount of 30% by weight to 80% by weight, for example, 40% by weight to 75% by weight, based on the total amount of the photosensitive resin composition. When the solvent is contained within the above range, the photosensitive resin composition has an appropriate viscosity, and thus the processability in the production of the photosensitive organic film is excellent.

(I) Other additives

The photosensitive resin composition according to one embodiment includes malonic acid; 3-amino-1,2-propanediol; Silane coupling agents; Leveling agents; Fluorine surfactants; Or a combination thereof.

For example, the photosensitive resin composition may further include a silane-based coupling agent having a reactive substituent such as a vinyl group, a carboxyl group, a methacryloxy group, an isocyanate group or an epoxy group in order to improve adhesion with a substrate or the like.

Examples of the silane-based coupling agent include trimethoxysilylbenzoic acid,? -Methacryloxypropyltrimethoxysilane, vinyltriacetoxysilane, vinyltrimethoxysilane,? -Isocyanate propyltriethoxysilane,? -Glycine (3,4-epoxycyclohexyl) ethyltrimethoxysilane, etc. These may be used singly or in combination of two or more.

The silane coupling agent may be included in an amount of 0.01 to 10 parts by weight based on 100 parts by weight of the photosensitive resin composition. When the silane coupling agent is contained within the above range, the adhesion and storage stability are excellent.

The above-mentioned photosensitive resin composition may further contain a surfactant such as a fluorine-based surfactant for the purpose of improving coatability and preventing defect formation, if necessary.

The fluorine is a surfactant, the ^{BM Chemie社BM-1000 ®,} BM-1100 ® , and the like; Mechacup F 142D ^® , copper F 172 ^® , copper F 173 ^® , copper F 183 ^® and the like manufactured by Dainippon Ink & Chemicals Incorporated; Sumitomo M. (Note)社Pro rod FC-135 ^®, the same FC-170C ^®, copper FC-430 ^®, the same FC-431 ^®, and the like; Asahi Grass Co., Saffron S-112 ^® of社, such S-113 ^®, the same S-131 ^®, the same S-141 ^®, the same S-145 ^®, and the like; Toray silicone (Note)社SH-28PA ^{®, ®} -190 copper, copper ^{-193 ®, SZ-6032 ®,} SF-8428 ® , and the like; Fluorinated surfactants commercially available under the names F-482, F-484, F-478 and F-554 of DIC Co., Ltd. can be used.

The fluorine-based surfactant may be used in an amount of 0.001 part by weight to 5 parts by weight based on 100 parts by weight of the photosensitive resin composition. When the fluorosurfactant is contained within the above range, coating uniformity is ensured, no staining occurs, and wettability to the glass substrate is excellent.

In addition, a certain amount of other additives such as an antioxidant, a stabilizer and the like may be further added to the above photosensitive resin composition within a range that does not impair the physical properties.

Another embodiment provides a color filter manufactured using the above-described photosensitive resin composition. A method of manufacturing the color filter is as follows.

(1) Coating and Film Formation Step

The above-mentioned photosensitive resin composition is coated on a predetermined pretreated substrate by a method such as spin or slit coat method, roll coating method, screen printing method, applicator method or the like to a desired thickness, for example, After coating, the solvent is removed by heating at a temperature of about 90 캜 to 120 캜 for 1 minute to 10 minutes to form a coating film.

(2) Exposure step

In order to form a pattern necessary for the obtained coating film, a mask of a predetermined type is interposed therebetween and then an active line of 200 to 500 nm is irradiated. As the light source used for the irradiation, a low pressure mercury lamp, a high pressure mercury lamp, an ultra high pressure mercury lamp, a metal halide lamp, an argon gas laser, and the like can be used.

The exposure dose varies depending on the kind of each component of the photosensitive resin composition, the blending amount, and the dried film thickness. For example, when a high pressure mercury lamp is used, the exposure dose is 500 mJ / cm ² (By a 365 nm sensor).

(3) Development step

Following the above exposure step, an unnecessary portion is dissolved and removed by using an alkaline aqueous solution as a developing solution, so that only the exposed portion is left to form an image pattern.

(4) Post-treatment step

The image pattern obtained by the above-described development can be cured by heating again or by active ray irradiation or the like in order to obtain a pattern excellent in terms of heat resistance, light resistance, adhesion, crack resistance, chemical resistance, high strength and storage stability.

By using the above-mentioned photosensitive resin composition, reliability and fairness such as excellent chemical resistance can be obtained even in a low temperature process.

Hereinafter, preferred embodiments of the present invention will be described. However, the following examples are only a preferred embodiment of the present invention, and the present invention is not limited by the following examples.

(Preparation of photosensitive resin composition)

Example  1 to Example  5 and Comparative Example  One

The photosensitive resin compositions according to Examples 1 to 5 and Comparative Example 1 were prepared with the compositions shown in the following Table 1 by using the following components.

Specifically, a photopolymerization initiator was dissolved in a solvent, followed by sufficient stirring at room temperature for 1 hour. Then, the photopolymerizable monomer, the acrylic binder resin and the quantum dots were charged and stirred again at room temperature for 1 hour. The polymerization inhibitor was added thereto, and the mixture was stirred at room temperature for 30 minutes. Then, a dispersing agent and a thiol-based additive were added and mixed thoroughly for about 1 hour. Thereafter, the mixture was filtered three times to remove impurities, thereby preparing a photosensitive resin composition.

(A) Qdot

InP / ZnSe / ZnS quantum dots (fluorescence? _Em = 542 nm, FWHM = 37 nm, Green QD, Hansol Chemical Co.)

(B) Binder resin

 Acrylic binder resin (SM-CRB-400H, SM Co., Ltd.)

(C) Photopolymerization  Monomer

 Dipentaerythritol hexaacrylate (DPHA, Nippon Kayaku)

(D) Light curing Initiator

 Oxime initiator (PBG-305, Tronyl)

(E) Diffuser  Dispersion

Titanium dioxide dispersion (TiO ₂ solid content 20 wt% in PGMEA, average particle diameter: 200 nm, DITO TECHNOLOGY Co., Ltd.)

(F) polymerization inhibitor

 Methyl hydroquinone (TOKYO CHEMICAL)

(G) Thiol system  additive

 Glycol di-3-mercaptopropionate (BRUNO BOCK)

(H) Solvent

 (H-1) Propylene glycol monomethyl ether acetate (PGMEA)

 (H-2) Ethylene glycol dimethyl ether (EDM)

(Unit: wt%) Example 1 Example 2 Example 3 Example 4 Example 5 Comparative Example 1 (A) Quantum dot 13.6 13.6 13.6 13.6 13.6 13.6 (B) binder resin 6.4 6.4 6.4 6.4 6.4 6.4 (C) a photopolymerizable monomer 3.3 3.3 3.3 3.3 3.3 3.3 (D) a photopolymerization initiator 0.2 0.2 0.2 0.2 0.2 0.2 (E) Diffusing agent dispersion 20 20 20 20 20 20 (F) polymerization inhibitor 0.012 0.016 0.004 0.006 0.020 - (G) Thiol-based additives 3 3 3 3 3 3 (H) Solvent (H-1) 26.744 26.742 26.748 26.747 26.740 26.75 (H-2) 26.744 26.742 26.748 26.747 26.740 26.75

Evaluation 1: BP (Break Point) evaluation

3 ml of each of the photosensitive resin compositions according to Examples 1 to 5 and Comparative Example 1 was taken out and coated on a glass substrate to a thickness of 5.0 탆 using a spin coater (Mikasa, Opticoat MS-A150) baked at 100 ° C for 2 minutes and then irradiated with ultraviolet rays at a power of 60 mJ / cm ² using an exposure machine (Ushio, ghi broadband) And a primary coating film was formed. Subsequently, development (or development after 1 hour or development after 2 hours) was carried out using an aqueous solution of potassium hydroxide (KOH) at a developing temperature of 25 ° C and a concentration of 0.043% using a developing machine (SVS, SSP-200). Thereafter, hard-baking was performed in a convection oven at 180 DEG C for 30 minutes to obtain a patterned photosensitive organic film. The developing time (BP) measured using the developing device is shown in Table 2 below.

BP (seconds) BP Time from formation of primary coating to development 0 hours 1 hours 2 hours Example 1 22 22 22 0 Example 2 22 22 22 0 Example 3 22 26 33 11 Example 4 22 23 25 3 Example 5 22 22 22 0 Comparative Example 1 26 - - Unfinished

From Table 2, it can be seen that the photosensitive resin composition according to Comparative Example 1 containing no polymerization inhibitor does not undergo development immediately after the formation of the primary coating, unlike the photosensitive resin compositions according to Examples 1 to 5, , It can be confirmed that development can not be carried out if left at room temperature (25 ° C) for a certain time.

It can also be seen from Examples 3 and 4 that when the content of the polymerization inhibitor is too small, the longer the holding time at room temperature after the formation of the primary coating film is, the lower the developability is.

Evaluation 2: Sensitivity and pattern straightness evaluation

3 ml of each of the photosensitive resin compositions according to Examples 1 to 5 and Comparative Example 1 was taken out and coated on a glass substrate to a thickness of 5.0 탆 using a spin coater (Mikasa, Opticoat MS-A150) baked at 100 ° C for 2 minutes and then irradiated with ultraviolet rays at a power of 60 mJ / cm ² using an exposure machine (Ushio, ghi broadband) And a primary coating film was formed. Subsequently, the resultant was developed with a developing solution (SVS, SSP-200) at a developing temperature of 25 ° C in a potassium hydroxide (KOH) aqueous solution having a concentration of 0.043%, and then patterned. 51, HOYA) and a scanning electron microscope (VEGA2SBH, TESCAN) to evaluate sensitivity and pattern immediacy. Optical microscope and scanning electron microscope photographs are shown in Figs. 1 to 21. Fig.

1 to 21, the photosensitive resin composition according to Comparative Example 1 containing no polymerization inhibitor had poor sensitivity and pattern straightness, unlike the photosensitive resin compositions according to Examples 1 to 5 containing a polymerization inhibitor can confirm. Particularly, when the content of the polymerization inhibitor is too large, the degree of deterioration of the pattern straightness due to the decrease in sensitivity becomes worse as the time for leaving the primary coating at room temperature after forming the primary coating becomes longer, and surface peeling occurs in a part.

It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present invention as defined by the following claims. As will be understood by those skilled in the art. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive.

Claims (13)

(A) quantum dots;
(B) a binder resin;
(C) a photopolymerizable monomer;
(D) a photopolymerization initiator;
(E) a diffusing agent;
(F) polymerization inhibitors;
(G) a thiol-based additive and
(H) Solvent
.
The method according to claim 1,
Wherein the polymerization inhibitor is contained in an amount of 0.3 to 0.8 parts by weight based on 100 parts by weight of the thiol-based additive.
The method according to claim 1,
The polymerization inhibitor includes a hydroquinone compound, a catechol compound, or a combination thereof.
The method of claim 3,
The polymerization inhibitor may be at least one selected from the group consisting of hydroquinone, methylhydroquinone, t-butylhydroquinone, 2,5-di- t -butylhydroquinone, 2,5-bis (1,1-dimethylbutyl) hydroquinone, (1,1,3,3-tetramethylbutyl) hydroquinone, catechol, t- butylcatechol, 4-methoxyphenol, pyrogallol, 2,6-di - t - butyl-4-methylphenol, 2-naphthol, tris (N-hydroxy-N-nitrosophenylaminato-O, O ') aluminum (Tris Sensitive resin composition.
The method according to claim 1,
Wherein the quantum dot is a quantum dot that absorbs light of 360 to 780 nm and emits fluorescence at 450 to 600 nm.
The method according to claim 1,
Wherein the binder resin comprises an acrylic binder resin, a carcass binder resin or a combination thereof.
The method according to claim 1,
Wherein the diffusing agent comprises barium sulfate, calcium carbonate, titanium dioxide, zirconia or a combination thereof.
The method according to claim 1,
Wherein the diffusing agent is contained in an amount of 0.5% by weight to 10% by weight based on the total amount of the photosensitive resin composition.
The method according to claim 1,
Wherein the thiol-based additive has at least two functional groups represented by the following formula (1)
[Chemical Formula 1]

In Formula 1,
L ¹ and L ² each independently represents a single bond, a substituted or unsubstituted C1 to C20 alkylene group, a substituted or unsubstituted C3 to C20 cycloalkylene group, a substituted or unsubstituted C6 to C20 arylene group, Lt; RTI ID = 0.0 > C2-C20heteroarylene < / RTI >
The method according to claim 1,
Wherein the thiol-based additive is contained in an amount of 0.1% by weight to 10% by weight based on the total amount of the photosensitive resin composition.
The method according to claim 1,
The photosensitive resin composition preferably contains, relative to the total amount of the photosensitive resin composition,
1 to 30% by weight of the quantum dot (A);
1 to 30% by weight of the binder resin (B);
1 to 20% by weight of the (C) photopolymerizable monomer;
0.1 to 5% by weight of the photopolymerization initiator (D);
0.5% to 10% by weight of the (E) dispersing agent;
0.001 wt.% To 0.03 wt.% Of the (F) polymerization inhibitor;
0.1 to 10% by weight of the (G) thiol-based additive and
The amount of the residual solvent (H)
.
The method according to claim 1,
The photosensitive resin composition may include malonic acid; 3-amino-1,2-propanediol; Silane coupling agents; Leveling agents; Fluorine surfactants; Or a combination thereof.
A color filter produced by using the photosensitive resin composition of any one of claims 1 to 12.

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