KR20170099172A - Fingerprint sensor module and method formanufacturing the same - Google Patents

Fingerprint sensor module and method formanufacturing the same Download PDF

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Publication number
KR20170099172A
KR20170099172A KR1020160021205A KR20160021205A KR20170099172A KR 20170099172 A KR20170099172 A KR 20170099172A KR 1020160021205 A KR1020160021205 A KR 1020160021205A KR 20160021205 A KR20160021205 A KR 20160021205A KR 20170099172 A KR20170099172 A KR 20170099172A
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KR
South Korea
Prior art keywords
fingerprint sensor
adhesive layer
sensor module
cover layer
layer
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Application number
KR1020160021205A
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Korean (ko)
Inventor
박영문
손동남
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크루셜텍 (주)
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Priority to KR1020160021205A priority Critical patent/KR20170099172A/en
Publication of KR20170099172A publication Critical patent/KR20170099172A/en

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    • G06K9/0002—
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/117—Identification of persons
    • A61B5/1171—Identification of persons based on the shapes or appearances of their bodies or parts thereof
    • A61B5/1172—Identification of persons based on the shapes or appearances of their bodies or parts thereof using fingerprinting
    • G06K9/00053—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3142—Sealing arrangements between parts, e.g. adhesion promotors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H2231/00—Applications
    • H01H2231/022—Telephone handset

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  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
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Abstract

The present invention relates to a fingerprint sensor module and a manufacturing method thereof. The fingerprint sensor module according to an embodiment of the present invention comprises a main substrate, a fingerprint sensor, a molding part, a cover layer, and an adhesive layer. The adhesive layer covers a part of the side surface of the cover layer. The present invention provides the fingerprint sensor module capable of improving the durability of an outer appearance.

Description

FIELD OF THE INVENTION [0001] The present invention relates to a fingerprint sensor module,

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a fingerprint sensor module and a method of manufacturing the same, and more particularly, to a fingerprint sensor module capable of enhancing durability of an external appearance and a method of manufacturing the same.

Background of the Invention [0002] Recent interest in portable electronic devices including smartphones and tablet PCs has been actively researched and developed in the related technology fields.

In many cases, a portable electronic device incorporates a touch screen integrated with a display, which is a display device, as an input device for receiving a specific command from a user. In addition, portable electronic devices may be equipped with various function keys or soft keys as input devices other than a touch screen.

These function keys or soft keys may act as home keys, for example, to exit a running application and return to the home screen, or to return the user interface to a previous layer, And can operate as a menu key for calling up a write menu. These function keys or soft keys may be implemented as physical buttons. In addition, the function key or the soft key can be realized by a method of sensing the electrostatic capacity of the conductor, a method of sensing the electromagnetic wave of the electromagnetic pen, or a combined method in which both methods are implemented.

Meanwhile, as the use of portable electronic devices such as smart phones has rapidly expanded to services requiring security, there has been an increasing tendency to install fingerprint sensors in portable electronic devices. In one example, the fingerprint sensor may be implemented in a unitary fashion with a physical function key.

The fingerprint sensor is a sensor for detecting the fingerprint of a human being. The fingerprint sensor allows the user to register and authenticate through the fingerprint sensor, thereby protecting the data stored in the portable electronic device and preventing a security accident in advance.

Meanwhile, in order to mount a fingerprint sensor on various portable electronic devices, a fingerprint sensor is manufactured in the form of a module including peripheral parts and structures. In recent years, researches on the upgrading of the fingerprint sensor module have been carried out in accordance with the high-level strategy of portable electronic devices to meet the consumer's preference. As an example of this, a coating method using a coating material for coating has been used to enhance the sense of unity between the portable electronic device and the fingerprint sensor module.

1 is an exemplary view showing an example in which a conventional fingerprint sensor module is mounted on a portable electronic device.

As shown in FIG. 1, the conventional fingerprint sensor module 20 is integrated with the physical function key 10 and is mounted on the portable electronic device 30. Here, the conventional fingerprint sensor module 20 is directly exposed to the outside to form a part of the external appearance of the portable electronic device 30. In order to obtain a good appearance, a sense of unity between the fingerprint sensor module 20 and the portable electronic device 30 It is important to heighten.

Accordingly, in the conventional fingerprint sensor module 20, a coating material for coating is used to enhance the sense of unity. In recent years, in order to obtain a higher sense of unity, researches on using a glass material, Is actively proceeding. However, when the glass is used, the feeling of unity with the portable electronic device 30 increases, but cracks are generated in the glass when used in a process or in a real life, resulting in defects in the appearance of the product, There was a problem that could be.

In order to solve the above problems, the present invention provides a fingerprint sensor module capable of enhancing the durability of the external appearance.

According to an aspect of the present invention, there is provided a plasma display panel comprising: a main substrate; A fingerprint sensor mounted on the main board; A molding unit formed to cover the fingerprint sensor; A cover layer disposed on an upper surface of the molding part; And a bonding layer disposed between the molding part and the cover layer, wherein the adhesive layer is formed to surround a part of a side surface of the cover layer during curing.

According to an aspect of the present invention, there is provided a fingerprint sensor comprising: a) mounting a fingerprint sensor on a main board; b) forming a molding to cover the fingerprint sensor; c) applying an adhesive layer to the upper surface of the molding part; d) disposing a cover layer on the upper surface of the adhesive layer; And e) pressing and curing the adhesive layer so as to surround a part of the side surface of the cover layer.

The present invention protects the side of the cover layer during the manufacturing process, thereby enhancing the durability of the appearance of the fingerprint sensor module.

It should be understood that the effects of the present invention are not limited to the above effects and include all effects that can be deduced from the detailed description of the present invention or the configuration of the invention described in the claims.

1 is a diagram illustrating an example of a conventional portable electronic device.
2 is a cross-sectional view illustrating a fingerprint sensor module according to an embodiment of the present invention.
3 is a cross-sectional view illustrating a fingerprint sensor module according to another embodiment of the present invention.
4 is a cross-sectional view illustrating a fingerprint sensor module according to another embodiment of the present invention.
5 is a flowchart illustrating a method of manufacturing a fingerprint sensor module according to an embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. In order to clearly illustrate the present invention, parts not related to the description are omitted, and similar parts are denoted by like reference characters throughout the specification.

Throughout the specification, when a part is referred to as being "connected" to another part, it includes not only "directly connected" but also "indirectly connected" . Also, when an element is referred to as "comprising ", it means that it can include other elements, not excluding other elements unless specifically stated otherwise.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

2 is a cross-sectional view illustrating a fingerprint sensor module according to an embodiment of the present invention.

2, the fingerprint sensor module 1000 according to an embodiment of the present invention includes a main substrate 100, a fingerprint sensor 200, a molding portion 300, a cover layer 500, and an adhesive layer 400).

The main board 100 may be a printed circuit board (PCB) capable of mounting the fingerprint sensor 200 and transmitting electrical signal information.

The fingerprint sensor 200 can detect the difference between the height of the fingerprint and the height of the fingerprint.

Types of the fingerprint sensor 200 include a capacitive type, an optical type, an ultrasonic type, a heat sensing type, and a non-contact type. In this embodiment, a capacitive type is adopted.

In more detail, the fingerprint sensor 200 according to an exemplary embodiment of the present invention can detect the difference in capacitance according to the height of the peak of the fingerprint and transmit the sensed signal to a controller (not shown) So that the control unit can acquire the image of the fingerprint.

The molding unit 300 is a member that covers the fingerprint sensor 200, and can fix and protect the fingerprint sensor 200. In addition, the molding part can determine the overall shape of the fingerprint sensor module 1000.

The molding part 300 may be formed of any one of epoxy molding compound (EMC), ultraviolet (UV) molding, and ceramic molding.

Next, the cover layer 500 may be disposed on the molding part 300. The cover layer 500 may be disposed at the top of the fingerprint sensor module 1000. A fingerprint can be touched on the upper surface of the cover layer 500. Further, the cover layer 500 may be included in a part of the appearance of the portable electronic device by being exposed to the surface of the portable electronic device.

Therefore, it is preferable that the cover layer 500 is made of a material having a high durability and a low feeling of uncomfortableness with the cover glass of the portable electronic device.

For example, the cover layer 500 may include at least one of glass, sapphire, zirconium, and transparent resin. When the cover layer 500 is made of glass, various glass substrates such as a soda lime glass substrate, an alkali-free glass substrate, and a tempered glass substrate may be included. As the transparent resin, acrylic or the like may be included.

In addition, an anti-foaming coating may be formed on the upper surface of the cover layer 500. The AF coating reduces image blurring due to surface contamination of the upper surface of the cover layer 500, thereby enabling the fingerprint sensor 200 to acquire a clearer fingerprint image.

Next, an adhesive layer 400 may be disposed between the cover layer 500 and the molding part 300.

The adhesive layer 400 may connect between the cover layer 500 and the molding part 300 and may have transparency or color depending on the apparent requirements of the portable electronic device.

Next, a defoaming process may be performed to remove bubbles in the adhesive layer 400. The fingerprint sensor module 1000 may receive pressure from the outside of the fingerprint sensor module 1000 toward the inside of the fingerprint sensor module 1000 during a defoaming process .

That is, the adhesive layer 400 may receive pressure from the cover layer 500 located on the top of the adhesive layer 400 and the molding part 300 located below the adhesive layer 400. At this time, the shape of the adhesive layer 400 may be changed to cover a part of the side surface of the cover layer 500 when the adhesive layer 400 is pressed.

In more detail, the adhesive layer 400 may be pushed laterally between the covering layer 500 and the molding part 300 when pressed. The adhesive layer 400 pushed out may cover a part of the side surface of the cover layer 500 due to the capillary phenomenon.

On the other hand, the adhesive layer 400 pushed out may cover not only the cover layer 500 but also a part of the side surface of the molding part 300. In order to prevent such a phenomenon, it is possible to guide the adhesive layer 400 to cover the side surface of the cover layer 500 by applying the cover layer 500 having a smaller area than the molding part 300.

The adhesive layer 400 is preferably made of a material that can change its shape when pressed. That is, the adhesive layer 400 may be made of a material having a relatively low density as compared with the cover layer 500 and the molding part 300, and may preferably be made of a UV epoxy resin.

As a result, since the adhesive layer 400 covers a part of the side surface of the cover layer 500, the impact applied to the cover layer 500 from the outside is alleviated, and the durability of the cover layer 500 is increased have.

3 is a cross-sectional view illustrating a fingerprint sensor module 1000 according to another embodiment of the present invention. The fingerprint sensor module 1000 of FIG. 3 is substantially the same as the fingerprint sensor module 1000 of FIG. 2 except that the color layer 600 is located between the molding part 300 and the adhesive layer 400. Therefore, in the following embodiments, the description of the configuration overlapping with the embodiment of FIG. 2 will be omitted.

The color layer 600 may be positioned between the molding part 300 and the adhesive layer 400 as shown in FIG. In addition, the color layer 600 can realize color according to requirements of a portable electronic device.

4 is a cross-sectional view illustrating a fingerprint sensor module 1000 according to another embodiment of the present invention. The fingerprint sensor module 1000 of FIG. 4 is substantially the same as the fingerprint sensor module 1000 of FIG. 2 except that the color layer 600 is located on the lower surface of the cover layer 500. Therefore, in the following embodiments, the description of the configuration overlapping with the embodiment of FIG. 2 will be omitted.

The color layer 600 may be located on the lower surface of the cover layer 500 as shown in FIG. In addition, the color layer 600 can realize color according to requirements of a portable electronic device.

In other words, there is a difference in that the arrangement of the color layers 600 is different between the embodiment of FIG. 2, FIG. 3, and FIG.

Hereinafter, a method of manufacturing the fingerprint sensor module 1000 will be described.

5 is a flowchart illustrating a method of manufacturing the fingerprint sensor module 1000 according to an embodiment of the present invention.

5, the method of fabricating the fingerprint sensor module 1000 according to the present invention may include mounting the fingerprint sensor 200 on the main substrate 100 (S510).

The main board 100 can mount the fingerprint sensor 200 and can transmit electric signal information. The main board 100 may be a printed circuit board (PCB).

The manufacturing method of the fingerprint sensor module 1000 according to the present invention may include fixing the fingerprint sensor 200 to the molding part 300 (S520).

The molding unit 300 is a member that covers the fingerprint sensor 200 and can fix and protect the fingerprint sensor.

The method of fabricating the fingerprint sensor module 1000 according to the present invention may include applying the adhesive layer 400 to the upper surface of the molding unit 300 (S530).

The adhesive layer 400 may connect between the cover layer 500 and the molding part 300 and may have transparency or color depending on the apparent requirements of the portable electronic device.

Further, the adhesive layer 400 can be variously applied as long as it has an adhesive force, and may be preferably composed of a UV epoxy resin.

The method of fabricating the fingerprint sensor module 1000 according to the present invention may include disposing the cover layer 500 on the upper surface of the adhesive layer 400 (S540).

The cover layer 500 may be disposed on the top of the fingerprint sensor module 1000, and the fingerprint may be touched on the top surface of the cover layer 500.

The method of manufacturing the fingerprint sensor module 1000 according to the present invention may include pressing and curing the adhesive layer 400 so as to surround a part of the side surface of the cover layer 500 (S550).

Bubbles may be generated in the adhesive layer 400 in the process of bonding the adhesive layer 400 between the cover layer 500 and the molding part 300.

Accordingly, the defoaming process may be performed to remove the air bubbles in the adhesive layer 400. The fingerprint sensor module 1000 may receive pressure from the outside of the fingerprint sensor module 1000 toward the inside during the defoaming process.

The adhesive layer 400 may receive pressure from the cover layer 500 located on the top of the adhesive layer 400 and the molding portion 300 located below the adhesive layer 400.

That is, the adhesive layer 400 may be shaped to cover a part of the side surface of the cover layer 500 when pressed.

In more detail, the adhesive layer 400 may be pushed laterally between the covering layer 500 and the molding part 300 when pressed. The adhesive layer 400 pushed out may cover a part of the side surface of the cover layer 500 due to the capillary phenomenon.

On the other hand, the adhesive layer 400 pushed out may cover not only the cover layer 500 but also a part of the side surface of the molding part 300. In order to prevent such a phenomenon, it is possible to guide the adhesive layer 400 to cover the side surface of the cover layer 500 by applying the cover layer 500 having a smaller area than the molding part 300.

The adhesive layer 400 is preferably made of a material that can change its shape when pressed. That is, the adhesive layer 400 may be made of a material having a relatively low density as compared with the cover layer 500 and the molding part 300, and may preferably be made of a UV epoxy resin.

As a result, since the adhesive layer 400 covers a part of the side surface of the cover layer 500, the impact applied to the cover layer 500 from the outside is alleviated, and the durability of the cover layer 500 is increased It is.

After the defoaming process, the curing process may proceed sequentially. For example, when the adhesive layer 400 is made of UV epoxy, the adhesive layer 400 may be irradiated with UV of a specific wavelength toward the adhesive layer 400 to form the adhesive layer 400 ) Can be cured.

The foregoing description of the present invention has been presented for purposes of illustration and description,

It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive. For example, each component described as a single entity may be distributed and implemented, and components described as being distributed may also be implemented in a combined form.

The scope of the present invention is defined by the appended claims,

It is intended that all changes and modifications derived from the meaning and scope of the range and equivalents thereof be included within the scope of the present invention.

10: Function keys
20: Conventional fingerprint sensor module
30: Portable electronic devices
100: main substrate
200: fingerprint sensor
300: Molding part
400: adhesive layer
500: cover layer
600: color layer
1000: Fingerprint sensor module

Claims (2)

A main board;
A fingerprint sensor mounted on the main board;
A molding unit formed to cover the fingerprint sensor;
A cover layer disposed on an upper surface of the molding part; And,
And an adhesive layer disposed between the molding part and the cover layer,
Wherein the adhesive layer is formed so as to surround a part of a side end surface of the cover layer during curing. a) mounting a fingerprint sensor on a main board;
b) forming a molding to cover the fingerprint sensor;
c) applying an adhesive layer to the upper surface of the molding part;
d) disposing a cover layer on the upper surface of the adhesive layer; And,
and e) pressing and curing the adhesive layer so as to surround a part of a side end surface of the cover layer.
KR1020160021205A 2016-02-23 2016-02-23 Fingerprint sensor module and method formanufacturing the same KR20170099172A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020160021205A KR20170099172A (en) 2016-02-23 2016-02-23 Fingerprint sensor module and method formanufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020160021205A KR20170099172A (en) 2016-02-23 2016-02-23 Fingerprint sensor module and method formanufacturing the same

Publications (1)

Publication Number Publication Date
KR20170099172A true KR20170099172A (en) 2017-08-31

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Country Status (1)

Country Link
KR (1) KR20170099172A (en)

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