KR20170094744A - 집적 회로 및 상기 집적 회로의 제조를 위한 컴퓨터 구현 방법 - Google Patents
집적 회로 및 상기 집적 회로의 제조를 위한 컴퓨터 구현 방법 Download PDFInfo
- Publication number
- KR20170094744A KR20170094744A KR1020160100122A KR20160100122A KR20170094744A KR 20170094744 A KR20170094744 A KR 20170094744A KR 1020160100122 A KR1020160100122 A KR 1020160100122A KR 20160100122 A KR20160100122 A KR 20160100122A KR 20170094744 A KR20170094744 A KR 20170094744A
- Authority
- KR
- South Korea
- Prior art keywords
- air gap
- integrated circuit
- timing
- conductive pattern
- routing
- Prior art date
Links
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Images
Classifications
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- G06F17/5068—
-
- G06F17/5072—
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
- H01L21/7682—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing the dielectric comprising air gaps
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- G06F2217/40—
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15/420,514 US9991249B2 (en) | 2016-02-11 | 2017-01-31 | Integrated circuit and computer-implemented method of manufacturing the same |
| TW106104007A TWI718245B (zh) | 2016-02-11 | 2017-02-08 | 積體電路、製造其的電腦實施方法以及定義其的標準元件 |
| CN201710070632.9A CN107066681B (zh) | 2016-02-11 | 2017-02-09 | 集成电路和制造集成电路的计算机实现方法 |
| US15/981,408 US10418354B2 (en) | 2016-02-11 | 2018-05-16 | Integrated circuit and computer-implemented method of manufacturing the same |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20160015820 | 2016-02-11 | ||
| KR1020160015820 | 2016-02-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20170094744A true KR20170094744A (ko) | 2017-08-21 |
Family
ID=59757519
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020160100122A KR20170094744A (ko) | 2016-02-11 | 2016-08-05 | 집적 회로 및 상기 집적 회로의 제조를 위한 컴퓨터 구현 방법 |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR20170094744A (zh) |
| TW (1) | TWI718245B (zh) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20200057297A (ko) * | 2018-11-16 | 2020-05-26 | 삼성전자주식회사 | 반도체 장치의 제조 방법 및 레이아웃 디자인 시스템 |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI714039B (zh) * | 2019-03-27 | 2020-12-21 | 創意電子股份有限公司 | 時序模型、時序模型建立方法、與相關的頂層分析方法 |
| US11069695B2 (en) * | 2019-05-31 | 2021-07-20 | Taiwan Semiconductor Manufacturing Company, Ltd. | Floating gate test structure for embedded memory device |
| DE102020100001B4 (de) | 2019-05-31 | 2022-05-25 | Taiwan Semiconductor Manufacturing Co. Ltd. | Integrierter Schaltkreis mit einer Mehrzahl von Speicherprüfstrukturen und Verfahren zu dessen Herstellung sowie Speicherprüfstruktur einer eingebetteten Speichervorrichtung |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008103610A (ja) * | 2006-10-20 | 2008-05-01 | Matsushita Electric Ind Co Ltd | 半導体集積回路の配線構造およびその設計方法と設計装置 |
| US8375347B2 (en) * | 2009-05-12 | 2013-02-12 | Taiwan Semiconductor Manufacturing Company, Ltd. | Driven metal critical dimension (CD) biasing |
| US8765595B2 (en) * | 2012-01-06 | 2014-07-01 | International Business Machines Corporation | Thick on-chip high-performance wiring structures |
| US8603889B2 (en) * | 2012-03-30 | 2013-12-10 | International Business Machines Corporation | Integrated circuit structure having air-gap trench isolation and related design structure |
| KR102033496B1 (ko) * | 2013-07-12 | 2019-10-17 | 에스케이하이닉스 주식회사 | 에어갭을 구비한 반도체장치 및 그 제조 방법 |
| US9231074B2 (en) * | 2013-07-19 | 2016-01-05 | Globalfoundries Inc. | Bipolar junction transistors with an air gap in the shallow trench isolation |
| KR102143501B1 (ko) * | 2013-12-05 | 2020-08-11 | 삼성전자 주식회사 | 레이아웃 디자인 시스템 및 이를 이용하여 제조한 반도체 장치 |
| KR102247918B1 (ko) * | 2014-04-07 | 2021-05-06 | 삼성전자주식회사 | 반도체 장치 및 이의 제조 방법 |
-
2016
- 2016-08-05 KR KR1020160100122A patent/KR20170094744A/ko active IP Right Grant
-
2017
- 2017-02-08 TW TW106104007A patent/TWI718245B/zh active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20200057297A (ko) * | 2018-11-16 | 2020-05-26 | 삼성전자주식회사 | 반도체 장치의 제조 방법 및 레이아웃 디자인 시스템 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI718245B (zh) | 2021-02-11 |
| TW201826155A (zh) | 2018-07-16 |
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