KR20170078363A

KR20170078363A - Laser cutting machine and method

Info

Publication number: KR20170078363A
Application number: KR1020150188810A
Authority: KR
Inventors: 문성욱
Original assignee: 문성욱
Priority date: 2015-12-29
Filing date: 2015-12-29
Publication date: 2017-07-07

Abstract

A laser cutting apparatus according to the present invention includes: a table on which a substrate to be cut is mounted; A laser unit for emitting a laser beam for cutting the substrate using at least one gas containing carbon dioxide; An optical unit for changing the diameter of the laser beam before the laser beam emitted from the laser unit reaches the substrate to be cut; A contamination prevention device for preventing the laser unit from being contaminated when cutting the substrate using the laser unit; And an impurity removing device for removing impurities generated when the substrate is cut by using the laser unit, wherein the laser beam emitted from the laser unit and irradiated to the substrate to be cut through the optical unit Diameter is less than 80 micrometer (um).
A laser cutting method according to the present invention includes a table on which a substrate to be cut is mounted, a laser unit for emitting a laser beam for cutting the substrate using at least one gas containing carbon dioxide, An optical unit for changing the diameter of the laser beam before reaching the substrate to be cut, a contamination prevention device for preventing the laser unit from being contaminated when the substrate is cut using the laser unit, A preparation step of preparing a laser cutting apparatus including an impurity removing device for removing impurities generated when the substrate is cut using the laser cutting apparatus; Disposing a substrate on the table; An emitting step of emitting the laser beam from the laser unit so that the diameter of the laser beam irradiated to the substrate to be cut through the optical unit becomes 80 micrometer or less; And a cleaning step of removing contaminants and impurities generated when the emitted laser beam is irradiated on the substrate.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a laser cutting apparatus,

The present invention relates to a laser cutting apparatus and a cutting method, and more particularly, to a laser cutting apparatus using at least one gas containing carbon dioxide, the laser cutting apparatus comprising a laser cutting apparatus And a cutting method.

Display panel manufacturing mainly produces display panels using glass (Liquid Crystal Display) and OLED (Organic Light Emitting Diodes). In recent years, demand for manufacturing display panels using flexible display panels using polymer films is increasing.

Like the LCD, the flexible display panel cuts the cells in the original plate and extracts each cell. As shown in the figure, there are corners on both sides of the pads of each cell. These corners cause problems such as peeling of the layer over time due to an external impact or the like, thereby causing damage to the product. Therefore, it is necessary to cut both edges of the pad portion of the flexible display panel cut into cells.

At present, edge cutting is performed by using a die cutting method using a mold and a laser using a laser cutting method. However, since the punch cutting method has a problem in quality such as pressing or crumbling of a film during cutting, have.

The laser cutting method currently uses a pico second laser having a wavelength of less than 1 micrometer and an average power of several tens of W, but the price of the laser cutting equipment is very high because of the high price of the laser In addition, since the absorption rate of laser light absorbed by the flexible display panel is low, it is necessary to perform several times of irradiation for full cutting, which causes a disadvantage that the cutting tact is relatively slow.

In addition, when cutting using a CO2 laser with a high absorption rate and a low cost in a flexible display panel, there is a quality deterioration problem due to a wide range of heat damage and black carbonation at the cutting level at the current level, In the case where the metal pattern is exposed, there is caused a problem of quality deterioration due to severe thermal damage to the metal pattern cutting portion.

In the prior art (U.S. Patent No. 6,991,695), a method of using laser radiation to cut or subdivide an optical film using a removable liner, in particular for supporting films and cut pieces, Lt; / RTI >

U.S. Patent No. 6,991,695

It is an object of the present invention to provide a laser cutting apparatus which uses at least one gas containing carbon dioxide to optimize the laser diameter and to provide a laser cutting apparatus and a cutting method including a contamination preventing and impurity processing apparatus, Compared to high-priced equipment using other materials, it is economical and produces high-quality laser cutting results compared to equipment using conventional carbon dioxide.

A laser cutting apparatus according to the present invention includes: a table on which a substrate to be cut is mounted; A laser unit for emitting a laser beam for cutting the substrate using at least one gas containing carbon dioxide; An optical unit for changing the diameter of the laser beam before the laser beam emitted from the laser unit reaches the substrate to be cut; A contamination prevention device for preventing the laser unit from being contaminated when cutting the substrate using the laser unit; And an impurity removing device for removing impurities generated when the substrate is cut by using the laser unit, wherein the laser beam emitted from the laser unit and irradiated to the substrate to be cut through the optical unit Diameter is less than 80 micrometer (um).

The diameter of the laser beam emitted from the laser unit and irradiated to the substrate to be cut through the optical unit may be 40 to 50 micrometers (um).

The wavelength of the laser beam emitted from the laser unit may be 9.2 to 9.7 micrometers (um).

The average output of the laser beam emitted from the laser unit is 60 watts or less, and the laser oscillation can be a CW (continuous wave) laser or a pulsed laser.

The optical unit includes a lens, and the diameter of the laser beam emitted from the laser unit and incident on the lens included in the optical unit may be 15 to 25 millimeters (mm).

The optical unit may include a lens, and the focal length of the lens may be 80 millimeters (mm) or less.

And a gas storage device for supplying at least one gas containing the carbon dioxide gas to the laser unit to cut the substrate.

A laser cutting method according to the present invention includes a table on which a substrate to be cut is mounted, a laser unit for emitting a laser beam for cutting the substrate using at least one gas containing carbon dioxide, An optical unit for changing the diameter of the laser beam before reaching the substrate to be cut, a contamination prevention device for preventing the laser unit from being contaminated when the substrate is cut using the laser unit, A preparation step of preparing a laser cutting apparatus including an impurity removing device for removing impurities generated when the substrate is cut using the laser cutting apparatus; Disposing a substrate on the table; An emitting step of emitting the laser beam from the laser unit so that the diameter of the laser beam irradiated to the substrate to be cut through the optical unit becomes 80 micrometer or less; And a cleaning step of removing contaminants and impurities generated when the emitted laser beam is irradiated on the substrate.

In the emitting step, the diameter of the laser beam emitted from the laser unit and irradiated to the substrate to be cut through the optical unit may be 40 to 50 micrometers (um).

In the emitting step, the wavelength of the laser beam emitted from the laser unit may be 9.2 to 9.7 micrometers (um).

In the emitting step, the average output of the laser beam emitted from the laser unit is 60 watts or less, and the laser oscillation type may be a CW (continuous wave) laser or a pulse laser.

Wherein the laser cutting device further comprises a gas storage device for supplying at least one gas comprising the carbon dioxide gas to the laser unit for cutting the substrate, And a supply step of supplying at least one gas containing the carbon dioxide gas.

According to the laser cutting apparatus and cutting method of the present invention, it is possible to obtain a high quality laser cutting result as compared with a conventional apparatus using carbon dioxide, compared with a conventional apparatus using expensive carbon dioxide, as compared with a conventional apparatus using carbon dioxide.

1 is a schematic drawing of a laser cutting apparatus according to the present invention.
2 is a flowchart of a laser cutting method according to the present invention.
Fig. 3 is a photograph showing a comparison of quality results according to the kind and diameter of the laser beam irradiated to the substrate.
4 is a graph showing a light transmission absorption spectrum of a carbon dioxide laser beam according to the type of film.
FIG. 5 is a view showing a state where a laser cutting apparatus according to the present invention removes contaminants and impurities generated when a substrate is cut.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings, which will be readily apparent to those skilled in the art to which the present invention pertains. The present invention may be embodied in many different forms and is not limited to the embodiments described herein.

The drawings are schematic and illustrate that they are not drawn to scale. The relative dimensions and ratios of the parts in the figures are shown exaggerated or reduced in size for clarity and convenience in the figures, and any dimensions are merely illustrative and not restrictive. And to the same structure, element or component appearing in more than one drawing, the same reference numerals are used to denote similar features.

The embodiments of the present invention specifically illustrate ideal embodiments of the present invention. As a result, various variations of the illustration are expected. Thus, the embodiment is not limited to any particular form of the depicted area, but includes modifications of the form, for example, by manufacture.

1 is a schematic drawing of a laser cutting apparatus according to the present invention.

2 is a flowchart of a laser cutting method according to the present invention.

Fig. 3 is a photograph showing a comparison of quality results according to the kind and diameter of the laser beam irradiated to the substrate.

4 is a graph showing a light transmission absorption spectrum of a carbon dioxide laser beam according to the type of film.

FIG. 5 is a view showing a state where a laser cutting apparatus according to the present invention removes contaminants and impurities generated when a substrate is cut.

A laser cutting apparatus according to the present invention includes: a table on which a substrate to be cut is mounted; And a laser unit for emitting a laser beam for cutting the substrate by using at least one gas containing carbon dioxide, wherein the laser beam emitted from the laser unit and irradiated to the substrate to be cut through the optical unit Diameter is less than 80 micrometer (um). More preferably, the diameter of the laser beam emitted from the laser unit and irradiated to the substrate to be cut through the optical unit may be 40 to 50 micrometers (um).

FIG. 3 shows a comparison of quality of edge cutting results of a substrate using a carbon dioxide laser beam, a picosecond infrared laser beam, and a femtosecond infrared laser beam. As shown in FIG. 3, when the diameter of the carbon dioxide laser beam irradiated on the substrate to be cut is 123 micrometers, the length of the carbonized upper portion is 64 micrometers (μm), the length of the sloped portion is 49 micrometers Meter (um).

These results show that a picosecond infrared laser with a length of 35 micrometers (μm) in width at the top and 30 micrometers (μm) in length of the sloped section (laser beam irradiated to the substrate has a diameter of 10 micrometers (Pico second IR Laser), a femtosecond infrared laser having a width of 19 micrometers (μm) in length at the top and 9 micrometers (um) in length of the sloped portion (the diameter of the laser beam irradiated on the substrate (Femtosecond IR Laser, 4 micrometer (um)).

Therefore, in cutting the substrate by using the carbon dioxide laser beam, it is necessary to change the configuration of the conventional carbon dioxide laser unit in order to reduce the length of the carbonization at the upper portion and the length of the sloped portion to improve the quality. To this end, it has been found that it is most effective to configure the carbon dioxide laser beam to have a diameter of 80 micrometers (um) or less as a result of various changes in the configuration of the carbon dioxide laser unit. Among them, it is most preferable to configure the diameter of the carbon dioxide laser beam irradiated on the substrate to be 40 to 50 micrometers (um). In FIG. 3, the result of the laser beam having a diameter of 41 micrometers . As shown in the picture, in this configuration, the length of the carbonized upper portion was 27 micrometers (μm) in length, and the length of the sloped portion was 9 micrometers (um).

The apparatus further includes an optical unit for changing the diameter of the laser beam before the laser beam emitted from the laser unit reaches the substrate to be cut. The optical unit includes a lens. By changing the diameter of the laser beam emitted from the laser unit using a lens, the diameter of the laser beam irradiated on the substrate to be finally cut is adjusted to a desired value in the present invention, . It is preferable that the optical unit has three to four lenses.

Further, in this configuration, a more efficient result value can be obtained by changing the wavelength of the laser beam irradiated to the substrate, and preferably, the wavelength of the laser beam emitted from the laser unit is set to 9.2 to 9.7 micrometers (um) . Most preferably, it has a wavelength range of 9.27 to 9.3 micrometers (um).

FIG. 4 is a graph showing a light transmission absorption spectrum of a carbon dioxide laser beam according to the kind of a film. When a substrate is cut using the laser cutting apparatus according to the present invention, a PET (PolyEthylene Terephthalate) film or a PI And shows a better effect in the state of being bonded together on the substrate. As shown in the graph, it is preferable that the wavelength of the carbon dioxide laser beam of PET (PolyEthylene Terephthalate) film or PI (Polyimide) film is 9.2 to 9.7 micrometer (um), most preferably 9.27 micrometer It was possible to obtain good results. The high light transmittance in such a specific range indicates that the cutting quality is improved accordingly.

The average output of the laser beam emitted from the laser unit is 60 watts or less, and the laser oscillation can be a CW (continuous wave) laser or a pulsed laser. At this time, in the case of a pulsed laser, it is preferable to use a pulse repetition frequency of 20 KHz or more.

Preferably, the optical unit includes a lens, and the diameter of the laser beam emitted from the laser unit and incident on the lens included in the optical unit is preferably 15 to 25 millimeters (mm) The distance may be less than 80 millimeters (mm).

The laser cutting apparatus according to the present invention includes a contamination prevention device for preventing the laser unit from being contaminated when the substrate is cut by using the laser unit, and a cleaning device for removing impurities generated when cutting the substrate using the laser unit And an impurity removing device for removing impurities.

This is not an incidental device that can simply be added to a laser cutting apparatus. As the diameter of the carbon dioxide laser beam irradiated on the substrate is adjusted to be small as in the present invention, the contamination degree of the laser unit due to contaminants and the amount of impurities generated are increased. That is, the size of the diameter of the carbon dioxide laser beam irradiated to the substrate, the contamination prevention device, and the impurity removal device must be interlocked together so that the effect can be exhibited.

FIG. 5 is a view showing a state where the laser cutting apparatus according to the present invention removes contaminants and impurities generated when the substrate is cut. Here, as an example of the contamination prevention apparatus, an air curtain and an air blower Lt; / RTI > In addition, suction was introduced as a device for removing impurities. By providing such a contamination prevention device, it is possible to prevent the optical unit from being contaminated by impurities or foreign substances such as fumes or particles generated when the laser beam is irradiated to the substrate through the optical unit, In addition, the impurities and foreign substances generated are directed in the direction of the impurity removing device, and the impurities and foreign substances are absorbed by a suction or the like device so that the surroundings can be cleaned up.

At this time, it is preferable that the cutting speed of the substrate is 300 mm / s to 1000 mm / s. At the time of cutting, the substrate can be fixed and the laser beam can be moved and cut, or the laser beam can be fixed and the substrate can be cut while moving.

And a gas storage device for supplying at least one gas containing the carbon dioxide gas to the laser unit to cut the substrate. The gas supply apparatus basically includes carbon dioxide as a substrate cutting apparatus and a cutting method using a laser beam using carbon dioxide. A laser beam can be formed using only a single gas of carbon dioxide. If necessary, a gas such as oxygen or nitrogen can be mixed to form a laser beam.

As described above, the laser cutting method according to the present invention operates in the same manner as laser cutting performed in the laser cutting apparatus, and therefore, description thereof is omitted.

10: Table 20: Laser unit
30: Optical unit 40: Pollution prevention device
50: Impurity removing device

Claims

A table on which a substrate to be cut is mounted;
A laser unit for emitting a laser beam for cutting the substrate using at least one gas containing carbon dioxide;
An optical unit for changing the diameter of the laser beam before the laser beam emitted from the laser unit reaches the substrate to be cut;
A contamination prevention device for preventing the laser unit from being contaminated when cutting the substrate using the laser unit; And
And an impurity removing device for removing impurities generated when the substrate is cut by using the laser unit,
Wherein a diameter of the laser beam emitted from the laser unit and irradiated to the substrate to be cut through the optical unit is 80 micrometers or less.

The method according to claim 1,
Wherein a diameter of the laser beam emitted from the laser unit and irradiated to the substrate to be cut through the optical unit is 40 to 50 micrometers (um).

The method according to claim 1,
Wherein the wavelength of the laser beam emitted from the laser unit is 9.2 to 9.7 micrometers (um).

The method according to claim 1,
Wherein the average output of the laser beam emitted from the laser unit is 60 watts or less and the laser oscillation type is a CW (continuous wave) laser or a pulse laser.

The method according to claim 1,
The optical unit comprising a lens,
Wherein the diameter of the laser beam emitted from the laser unit and incident on the lens included in the optical unit is 15 to 25 millimeters (mm).

The method according to claim 1,
The optical unit comprising a lens,
Wherein the focal length of the lens is 80 millimeters (mm) or less.

The method according to claim 1,
To cut the substrate,
Further comprising a gas storage device for supplying the laser unit with at least one gas containing the carbon dioxide gas.

A table on which a substrate to be cut is mounted, a laser unit for emitting a laser beam for cutting the substrate using at least one gas containing carbon dioxide, a laser beam emitted from the laser unit reaching the substrate to be cut An optical unit for changing the diameter of the laser beam before the laser beam is irradiated, a contamination prevention device for preventing the laser unit from being contaminated when the substrate is cut by using the laser unit, A preparation step of preparing a laser cutting apparatus including an impurity removing device for removing generated impurities;
Disposing a substrate on the table;
An emitting step of emitting the laser beam from the laser unit so that the diameter of the laser beam irradiated to the substrate to be cut through the optical unit becomes 80 micrometer or less; And
And a cleaning step of removing contaminants and impurities generated when the emitted laser beam is irradiated on the substrate.

9. The method of claim 8,
In the emerging step,
Wherein the diameter of the laser beam emitted from the laser unit and irradiated to the substrate to be cut through the optical unit is 40 to 50 micrometers (um).

9. The method of claim 8,
In the emerging step,
Wherein the wavelength of the laser beam emitted from the laser unit is 9.2 to 9.7 micrometers (um).

9. The method of claim 8,
In the emerging step,
Wherein an average output of the laser beam emitted from the laser unit is 60 watts or less, and the laser oscillation mode is a CW (continuous wave) laser or a pulse laser.

9. The method of claim 8,
The optical unit comprising a lens,
Wherein the diameter of the laser beam emitted from the laser unit and incident on the lens included in the optical unit is 15 to 25 millimeters (mm).

9. The method of claim 8,
The optical unit comprising a lens,
Wherein the focal length of the lens is 80 millimeters (mm) or less.

9. The method of claim 8,
The laser cutting apparatus further comprises a gas storage device for supplying at least one gas containing the carbon dioxide gas to the laser unit for cutting the substrate,
Further comprising the step of supplying at least one gas containing the carbon dioxide gas to the laser unit in the gas storage device after the positioning step.