KR20170069605A - Fixing method using a welding of the housing and pcb, and electronic control device thereof - Google Patents

Fixing method using a welding of the housing and pcb, and electronic control device thereof Download PDF

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Publication number
KR20170069605A
KR20170069605A KR1020150177022A KR20150177022A KR20170069605A KR 20170069605 A KR20170069605 A KR 20170069605A KR 1020150177022 A KR1020150177022 A KR 1020150177022A KR 20150177022 A KR20150177022 A KR 20150177022A KR 20170069605 A KR20170069605 A KR 20170069605A
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KR
South Korea
Prior art keywords
welding
pcb
housing
base material
slide guide
Prior art date
Application number
KR1020150177022A
Other languages
Korean (ko)
Inventor
석만호
문형준
Original Assignee
현대오트론 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Priority to KR1020150177022A priority Critical patent/KR20170069605A/en
Publication of KR20170069605A publication Critical patent/KR20170069605A/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/003—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having an integrally preformed housing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/12—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating the heat being generated by friction; Friction welding
    • B23K20/122—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating the heat being generated by friction; Friction welding using a non-consumable tool, e.g. friction stir welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0047—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB
    • H05K5/006—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB characterized by features for holding the PCB within the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0069—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having connector relating features for connecting the connector pins with the PCB or for mounting the connector body with the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1401—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means
    • H05K7/1402—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The present invention relates to a fixing method and an electronic control device using welding between a housing and a PCB (printed circuit board), comprising the steps of fixing a heat-transferable welding base material to both sides of a PCB, Inserting the PCB into the housing through a slide guide formed on the PCB; assembling the welding base material formed on the PCB so as to be in close contact with a lower portion of the slide guide; And fixing the housing and the PCB by welding to the slide guide.

Description

TECHNICAL FIELD [0001] The present invention relates to a fixing method using welding of a housing and a printed circuit board, and an electronic control device using the same. [0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a fixing method using welding of a housing and a printed circuit board, and an electronic control apparatus using the same, and more particularly to a fixing method in which a welding base material is fixed to a PCB, And an electronic control device using the same.

An electronic control unit (ECU) for electronically controlling various devices of a vehicle collects information from the components installed in each part of the vehicle and performs various electronic controls according to the collected information.

The electronic control device includes a case (housing) composed of an upper cover and a lower base, a PCB (Printed Circuit Board) housed in the case, and a PCB And a connector to be coupled.

In manufacturing the electronic control unit, the case covers the PCB and covers the PCB, and the case is assembled together. Particularly, the connector interposed between the cover and the base forms a sealing structure with the cover side and the base side. Such an electronic control unit requires a predetermined sealing structure capable of preventing moisture and foreign substances from entering into the inside of the electronic control unit because it has a high degree of integrated control circuit means, A sealing structure for protecting a PCB and the like inside a method of assembling a cover and a base together with a connector in a state of inserting a sealing material is mainly applied.

On the other hand, the electronic control device can be assembled in a slide form. At this time, it is difficult to apply a thermal glue for close contact with the housing when the PCB is slid and assembled into the one piece housing. Since the PCB is in close contact with the housing in the form of a slide, the applied heat-dissipating adhesive may not be fully adhered to the housing. Accordingly, a portion of the PCB where the heat-insulating adhesive is not applied may deteriorate the heat radiating performance through the housing.

Therefore, in the case of the electronic control device assembled in such a slide form, stable contact of the heat dissipating part is very important for effective heat dissipation of the PCB, and stable and accurate contact technology of the housing and the PCB is required.

A heat dissipation from a control unit of US 8885343, which is a prior art document, discloses a method of inserting a thermally conductive glue through a hole designed in advance in a housing of an electronic control device assembled in a slide form, . However, the prior art document is intended to fill an air gap or space between the heat dissipation element and the heat dissipation area, and there is no improvement in the contact stability and fixing force between the PCB and the housing, and there is a problem that the mechanical bonding strength is lowered.

US Patent No. 8885343 (disclosed on August 25, 2011)

SUMMARY OF THE INVENTION The present invention has been devised to solve the problems described above, and it is an object of the present invention to provide a housing and a printed circuit board, which can achieve an accurate heat dissipation performance by improving the mechanical bonding strength between the PCB and the housing, A fixing method using welding and an electronic control device using the same.

According to a first aspect of the present invention, there is provided a method of fixing using a welding of a housing and a PCB (printed circuit board), the method comprising the steps of fixing a thermally conductive welding base material to both sides of the PCB, Inserting the PCB into the housing through a slide guide; assembling the welding base material formed on the PCB so as to be in close contact with a lower portion of the slide guide; And fixing the housing and the PCB by welding to the slide guide.

Alternatively, the welding base material may be made of a heat-conductive metal or a nonmetal, and the welding base material may be fixed on the PCB using a thermally conductive adhesive. The slide guide includes at least one joint formed on each of the joints, The joint may be composed of at least one point or line-shaped hole. As an embodiment, in the assembling step, the welding base material formed in a plane may be brought into close contact with the lower portion of the slide guide, and a part of the welding base material may be exposed through the bonding portion. In another embodiment, the step of assembling may be embodied such that a part or the whole of the welding base material is formed in a shape corresponding to the joining part and is fitted into the hole. Further, the fixing step may be performed by welding the joining part by heating or pressurization. For example, the slide guide and the welding preform may be welded with frictional heat using friction stir welding (FSW).

According to a second aspect of the present invention, there is provided an electronic control apparatus using welding between a housing and a PCB (printed circuit board), comprising: a housing including a housing body; a slide guide formed on both sides; And a connector inserted into the housing in the form of a slide, wherein the PCB is mounted on both sides of the PCB so that a thermally conductive welding base material is fixed before being inserted into the housing.

The present invention can improve the mechanical bonding strength by performing mechanical bonding through welding between the PCB and the housing when assembling a slide type electronic control device. Such bonding provides an advantage that the heat conductivity is relatively increased, and the heat radiation effect can be maximized.

1 is a structural view of an electronic control device according to the prior art.
2 is a cross-sectional view of one side of an electronic control unit according to an embodiment of the present invention.
3 is a cross-sectional view illustrating a welding process of the electronic control apparatus according to the first embodiment of the present invention.
4 shows an external configuration of an electronic control apparatus according to the first embodiment of the present invention.
5 is a cross-sectional view illustrating a welding process of the electronic control device according to the second embodiment of the present invention.
6 shows an external configuration of an electronic control apparatus according to a second embodiment of the present invention.
7 is a cross-sectional view illustrating a welding process of the electronic control apparatus according to the third embodiment of the present invention.
8 shows an external configuration of an electronic control apparatus according to a third embodiment of the present invention.
Like reference numbers in the several drawings indicate like elements.

The following detailed description of the invention refers to the accompanying drawings, which illustrate, by way of illustration, specific embodiments in which the invention may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the invention. It should be understood that the various embodiments of the present invention are different, but need not be mutually exclusive. For example, certain features, structures, and characteristics described herein may be implemented in other embodiments without departing from the spirit and scope of the invention in connection with an embodiment. It is also to be understood that the position or arrangement of the individual components within each disclosed embodiment may be varied without departing from the spirit and scope of the invention. The following detailed description is, therefore, not to be taken in a limiting sense, and the scope of the present invention is to be limited only by the appended claims, along with the full scope of equivalents to which such claims are entitled, if properly explained. In the drawings, like reference numerals refer to the same or similar functions throughout the several views.

1 is a structural view of an electronic control device according to the prior art. An electronic control unit for a vehicle is composed of elements for controlling electric parts of each part of a vehicle and includes a housing 100 and a connector 200. Generally, the electronic control device is implemented such that a connector 200 including a PCB (Printed Circuit Board) 240 is inserted and slidably inserted through the opening of the one-piece housing 100 .

The housing 100 includes a housing body 110 at the center and a slide guide 120 formed at both sides of the housing body 110. The connector 200 includes a connector 210, a cover 220, a connector 230 connected to the connector 210, and a PCB 240. The PCB 240 may have a heating element on one side or a heat sink on the lower side and may be connected to the connector 210 through a connector pin 230.

The PCB 240 is inserted into the opening of the housing body 110 and is positioned inside the housing body 110 and the opening of the housing body 110 is engaged with the cover engaging portion 220. In order to discharge heat generated from the heat generating element or the heat dissipating plate located in the PCB 240 to the atmosphere, it is necessary to stably contact the housing with the electronic control device. The present invention provides a fixing method that improves the adhesion and the heat dissipating structure, An electronic control device is proposed. Hereinafter, embodiments of the electronic control apparatus according to the present invention will be described with reference to Figs. 2 to 8. Fig.

2 is a cross-sectional view of one side of an electronic control unit according to an embodiment of the present invention. The housing 100 includes a housing body 110 and slide guides 120 on both sides thereof. Figure 2 is a sectional view of the right slide guide 120 in a state where the PCB 240 is inserted.

The PCB 240 of the connector 200 is assembled so that the welding base material 250 is fixed on the PCB using a thermally conductive adhesive before assembling the housing and the welding base material 250 is closely attached to the bonding portion formed on the slide guide when the housing is assembled. The welding base material 250 is formed on both left and right sides of the PCB 240 to have a predetermined width and thickness. For example, the welding base material 250 may be formed in the same size and shape as the joining portion so as to fit into the joining portion formed in the slide guide 120, or may be formed in the same size and shape as the slide guide 120. Also, the welding base material 250 may be composed of a weldable and heat-conductive metal or non-metal.

As shown, when the PCB 240 is completely inserted into the housing 100, the welding base material 250 is positioned under the slide guide 120. [ The present invention is characterized in that welding is performed to the joint portion 260 for stable close contact between the housing 100 and the PCB 240 and the PCB 240 can be completely tightly fixed to the housing through welding of various methods . Further, no voids are generated through the welding base material 250, and the heat radiation performance can be maximized through stable close contact.

Hereinafter, with reference to FIGS. 3 to 8, a method of implementing the electronic control apparatus of the present invention will be described in detail with reference to FIGS.

FIG. 3 is a cross-sectional view illustrating a welding process of the electronic control apparatus according to the first embodiment of the present invention, and FIG. 4 illustrates an external configuration according to the welding process of FIG. 3 (a) is a side cross-sectional view of the housing 100 and the PCB 340 assembled together, and FIG. 3 (b) is a cross-sectional view of the welding member 330. FIG. Fig. 4 (a) shows an assembled state corresponding to Fig. 3 (a), and Fig. 4 (b) shows a welded state corresponding to Fig. 3 (b).

The housing 100 may include a housing body 310 and slide guides 320 on both sides of the housing body and may include a joint 330 on the slide guide 320 ) Reference). The housing body 310 represents a midsection cover in which the PCB 340 of the connector 200 is inserted into the housing to operate a circuit or elements operating on the PCB 340. [ The slide guide 320 guides the PCB 340 to be positioned at an accurate position when inserting the PCB 340 into the housing, and assists in stable adherence of the PCB 340. The slide guide 320 may be narrower in width than the housing body 310 in order to fix the PCB 340. The PCB 340 may not be positioned on the bottom surface of the housing for heat dissipation, As shown in FIG.

The slide guide 320 of the present invention may include a joining portion 330. The joining portion 330 is a welding portion formed on the slide guide 320 to implement the fixing method of the present invention, and may be implemented as one or more dots or a line-shaped hole as shown in FIG. 3 (a) So that the welding base material 350 is exposed. Referring to FIG. 4 (a), the joint 330 is formed in a straight line, but it is not limited thereto and may be embodied as one or more points, lines, or planes, and may be formed as a straight line or a curve.

The PCB 340 may be assembled such that the welding base material 350 is fixed to the upper end of the slide guide 320 of the housing 100 by fixing the welding base material 350 with a thermally conductive adhesive before assembling. The welding base material 350 may be formed to be equal to or shorter than the width of the slide guide 320, and may be made of a weldable and heat-conductive metal and a non-metal. The welding base material 350 may be realized in one or more points or lines in the same manner as the bonding portion 330.

When the PCB 340 of the present invention is inserted and assembled into the housing and the welding base material 350 is brought into close contact with the slide guide 320, welding can be performed on the bonding portion 330. The welding portion 360 enhances the mechanical bonding strength of the welding base material 350 and the lower portion of the slide guide 320 by heating or pressurizing the bonding portion 330 so that stable adhesion can be achieved. For example, the welding part 360 can be realized by melting the welding base material 350 by heating to perform mechanical bonding, and various welding methods such as an electron beam and a laser can be introduced. As another example, a method of welding a new metallic or non-metallic material to increase the bonding strength can be performed.

When the PCB 340 and the housing 100 are mechanically brought into close contact with each other through welding, an excellent heat dissipation performance can be achieved by improving the bonding strength and the thermal conductivity beyond the effect of filling the empty space between the PCB and the housing.

5 is a cross-sectional view illustrating a welding process of the electronic control device according to the second embodiment of the present invention, and FIG. 6 shows an external configuration of the electronic control device according to the second embodiment of the present invention. 6 (a) shows an assembled state corresponding to FIG. 5 (a), and FIG. 6 (b) shows a welded state corresponding to FIG. 5 (b). The second embodiment differs from the first embodiment in that the welding base material is formed in a protruding shape so as to facilitate welding.

As described above, the housing 100 includes the housing body 510 and the slide guide 520 on both left and right sides of the housing body, and may include the joint portion 530 on the slide guide 520 5 (a)). The housing body 510 covers the central portion where the PCB 540 of the connector 200 is inserted into the housing to operate circuits or elements operating on the PCB 540 and the slide guide 520 is mounted on the PCB 540, To guide the PCB 540 in a stable position. In order to fix the PCB 540, the slide guide 520 may be narrower in width than the housing body 310, and the PCB 340 may not be positioned on the bottom surface of the housing for heat radiation, As shown in FIG.

Also, as in the first embodiment, the slide guide 520 of the present invention may include a bonding portion 530. The joining portion 530 is a welding portion formed on the slide guide 520 to implement the fixing method of the present invention. The joining portion 530 may include at least one point or line-shaped hole as shown in Figs. 5 and 6 (a) So that the welding base material 550 is exposed. Referring to FIG. 6A, the junction 330 is implemented as a straight line, but the present invention is not limited thereto. The junction 330 may be embodied as one or more points, lines, or planes, and may be formed as a straight line or a curve.

The PCB 540 can be assembled such that the welding base material 550 is fixed to the upper end of the slide guide 520 of the housing 100 by fixing the welding base material 550 with a thermally conductive adhesive before assembling. The welding base material 550 may be formed to be equal to or shorter than the width of the slide guide 520, and may be formed of a weldable and heat-conductive metal and a non-metal. In particular, in the second embodiment, the welding base material 550 may be formed in at least one point or line shape in the same manner as the joining portion 530, but may be formed so as to protrude into the joining portion 530 (a)). That is, the welding base material 550 has a protruding shape to be adhered to the hole-shaped bonding portion 530, and is embodied to fit into the bonding portion 530 at the time of assembly. The welding base material 550 having such a protruding shape is advantageous in that it is easily weldable because of its good weldability, and further, the joining of the housing and the PCB is facilitated.

When the PCB 540 of the present invention is inserted and assembled into the housing, the welding base material 550 protruding from the bonding portion 530 is brought into close contact with the slide guide 520, and the bonding portion 530 can be welded. The welding portion 560 improves the mechanical bonding strength between the welding base material 350 and the slide guide 520 protruded through the bonding portion 530 through heating or pressing so that the bonding can be stably performed. For example, the welding portion 560 may be formed so as to melt the welding base material 550 protruded through heating to mechanically join the sliding guide 520 side.

7 is a cross-sectional view illustrating a welding process of the electronic control apparatus according to the third embodiment of the present invention. 8 shows an external configuration of an electronic control apparatus according to a third embodiment of the present invention. Fig. 8 (a) shows an assembled state corresponding to Fig. 7 (a), and Fig. 8 (b) shows a welded state corresponding to Fig. 7 (b). The third embodiment is characterized in that the welding base material and the housing are joined without a hole in the joining portion.

The PCB 740 of the connector 200 is inserted into the housing through the slide guide 720 and the slide guide 720 guides the PCB 740 to be positioned at the correct position when inserting the PCB 740 into the housing, (740).

Unlike the first and second embodiments, the third embodiment does not include a separate joint. That is, it is assembled so as to be in close contact with the lower portion of the slide guide 720 in a state in which the welding base material 750 is not exposed, without including a hole-shaped joint portion on the slide guide 720.

When the PCB 740 of the present invention is inserted and assembled into the housing, welding can be performed to the area of the slide guide 720. (For example, a hole) is not formed in the slide guide 720. When the electrode can not pass through the lower portion of the welding portion 760, the welding is performed by a welding method such as friction stir welding (FSW) . Here, friction stir welding is a solid-state welding in which friction heat is used to weld by reverse flow in the material. Therefore, compared to fusion welding such as arc welding, laser welding, and electron beam welding, no blowholes or cracks are generated, Respectively. That is, frictional heat is generated to achieve the mechanical bonding between the welding base material 750 and the housing, so that the PCB 740 can stably come into close contact with the housing.

In the case of performing the welding according to the third embodiment, there is no need to form a separate joint portion in the housing 100, and an existing housing device can be produced as it is, and the welding base material 750 is not exposed to the outside Problems such as abrasion or corrosion of the joint can be prevented.

As described above, the present invention introduces various welding methods as described in the first to third embodiments, realizes stable adhesion between the housing and the PCB, effectively improves the mechanical bonding strength, and improves the thermal conductivity thereof The heat radiation effect can be maximized.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments.

In addition, although specific terms are used herein, they are used for the purpose of describing the present invention only and are not used to limit the scope of the present invention described in the claims or the claims. Therefore, the scope of the present invention should not be limited to the above-described embodiments, but should be determined by the equivalents of the claims of the present invention as well as the claims of the following.

100: housing 200: connector
110: housing body 120: slide guide
210: connector portion 220: cover-
230: Connector pin 230: PCB

Claims (15)

As a fixing method using welding between a housing and a PCB (printed circuit board)
Fixing a thermally conductive welding base material to both sides of the PCB;
Inserting the PCB into the housing through slide guides formed on both sides of the housing body;
Assembling the welding base material formed on the PCB so as to be in close contact with a lower portion of the slide guide; And
And welding the slide guide to secure the housing and the PCB. The method according to claim 1,
Wherein the welding base material is made of a heat-conductive metal or a nonmetal. The method according to claim 1,
Wherein the welding base material is fixed on the PCB using a thermally conductive adhesive. The method according to claim 1,
Wherein the slide guide includes at least one joint formed on each of the slide guides,
Characterized in that the joint comprises at least one point or line-shaped hole. 5. The method of claim 4,
Wherein the step of assembling is such that the weld base material formed in a plane is brought into close contact with the lower portion of the slide guide, and a part of the weld base material is exposed through the joint portion. 5. The method of claim 4,
Wherein the step of assembling is implemented such that a part or the whole of the welding base material is formed in a shape corresponding to the joining part and is fitted into the hole. The method according to claim 5 or 6,
Wherein the fixing step comprises joining the joining part by performing welding using heating or pressurization. The method according to claim 1,
Wherein the fixing step comprises welding the slide guide and the welding base material with frictional heat using friction stir welding (FSW). An electronic control device using welding between a housing and a PCB (printed circuit board)
A housing including a housing body, a slide guide formed on both sides of the housing body, and a joint portion formed on the slide guide, respectively; And
A connector including a PCB inserted into the housing in a slide form,
Wherein the PCB is implemented such that a thermally conductive welding base material is secured to both sides of the PCB prior to insertion into the housing. 10. The method of claim 9,
Wherein the joint portion is formed of at least one point or line-shaped hole. 11. The method of claim 10,
Wherein the welding base material is formed in a plane so as to be in close contact with the lower portion of the slide guide, and is exposed through the joining portion. 11. The method of claim 10,
Wherein the welding base material is formed such that a part or the whole of the welding base material corresponds to the joining portion and is fitted into the hole. 10. The method of claim 9,
Wherein the welding base material is a heat-conductive metal or a nonmetal. 14. The method according to any one of claims 9 to 13,
Further comprising a welding portion for performing welding by heating or pressing the joining portion. 15. The method of claim 14,
Wherein said welding comprises friction stir welding (FSW).
KR1020150177022A 2015-12-11 2015-12-11 Fixing method using a welding of the housing and pcb, and electronic control device thereof KR20170069605A (en)

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KR1020150177022A KR20170069605A (en) 2015-12-11 2015-12-11 Fixing method using a welding of the housing and pcb, and electronic control device thereof

Applications Claiming Priority (1)

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KR1020150177022A KR20170069605A (en) 2015-12-11 2015-12-11 Fixing method using a welding of the housing and pcb, and electronic control device thereof

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KR20170069605A true KR20170069605A (en) 2017-06-21

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