KR20170064256A - Mems transducer with mesh type substrate, method of producing the transducer and condenser microphone using the same - Google Patents

Mems transducer with mesh type substrate, method of producing the transducer and condenser microphone using the same Download PDF

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Publication number
KR20170064256A
KR20170064256A KR1020150169797A KR20150169797A KR20170064256A KR 20170064256 A KR20170064256 A KR 20170064256A KR 1020150169797 A KR1020150169797 A KR 1020150169797A KR 20150169797 A KR20150169797 A KR 20150169797A KR 20170064256 A KR20170064256 A KR 20170064256A
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KR
South Korea
Prior art keywords
acoustic sensor
acoustic
mems
wafer
substrate
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Application number
KR1020150169797A
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Korean (ko)
Inventor
김용국
김진선
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주식회사 비에스이센서스
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Priority to KR1020150169797A priority Critical patent/KR20170064256A/en
Publication of KR20170064256A publication Critical patent/KR20170064256A/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
    • G01H17/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves, not provided for in the preceding groups
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0257—Microphones or microspeakers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/04—Optical MEMS
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/003—Mems transducers or their use

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • General Physics & Mathematics (AREA)
  • Micromachines (AREA)

Abstract

The present invention relates to a MEMS acoustic sensor and a MEMS acoustic sensor integrated with a mesh-type substrate, which can reduce the manufacturing cost by separating the mesh-type acoustic filter and the acoustic sensor at the wafer level, And a capacitive condenser microphone using the acoustic sensor.
The method of the present invention comprises the steps of: forming an acoustic filter with MEMS technology on an acoustic filter wafer of a silicon wafer; Forming an acoustic sensor with an MEMS technique on an acoustic sensor wafer made of a silicon wafer; Applying an adhesive to the acoustic filter wafer; Aligning and bonding the acoustic sensor wafer on the acoustic filter wafer; And dicing the glued wafer to complete an individual MEMS acoustic sensor integrated with the mesh-like substrate.
According to the present invention, a mesh-type acoustic filter is manufactured at a wafer level, and an acoustic sensor including a mesh-type acoustic filter is manufactured by aligning the acoustic filter with a wafer on which the acoustic sensor is manufactured, It is possible to prevent an increase in cost, and it is possible to reduce cost by reducing inspection time through inspection at a wafer level rather than a single component.

Description

Technical Field [0001] The present invention relates to a MEMS acoustic sensor integrated with a mesh-type substrate, a manufacturing method thereof, and a capacitive condenser microphone using the acoustic sensor. [0002]

[0001] The present invention relates to a MEMS acoustic sensor, and more particularly, to a MEMS acoustic sensor which can manufacture a mesh type acoustic filter and an acoustic sensor at a wafer level, align them together, separate them through a dicing process, A MEMS acoustic sensor integrated with a substrate, a manufacturing method thereof, and a capacitive condenser microphone using the acoustic sensor.

Generally, a capacitive microphone generates a voltage signal according to a distance change of a charging plate which applies a polarization voltage between two charging plates and vibrates by a negative pressure. The capacitive MEMS microphone chip is a capacitive microphone chip fabricated by MEMS technology. The capacitive MEMS microphone chip has a single chip structure in which a back plate and a diaphragm structure are stacked using a single substrate, a back chip, Are formed on different substrates, respectively, and bonded using a substrate bonding technique.

In the case of a single chip structure, it is advantageous to integrate a CMOS circuit with a low cost implementation using a semiconductor batch process. However, since the thickness of the back plate is limited due to lamination of thin films, the acoustic performance is lowered due to a low resonance frequency There is a problem.

There are sensitivity, stick, and stress relief as key features to consider when manufacturing MEMS microphone chips. Sensitivity is a function of how well the vibrating membrane vibrates in response to incoming sound pressure, determined by the flexibility of the membrane and the equilibrium of the static pressure. To increase the flexibility of the diaphragm, techniques such as a spring diaphragm or a diaphragm formed with corrugation grooves are used. In order to maintain the balance against static pressure and reduce the repulsive force against the vibration of the diaphragm, a large number of acoustic holes are formed in the back plate, so that the air flow between the air gap and the back chamber through the acoustic holes of the back plate is smooth . In addition, a vent hole is formed between the diaphragm and the back electrode plate to improve the sensitivity.

Meanwhile, since a resonance phenomenon occurs due to an acoustic hole that allows an external acoustic signal to be transmitted to the MEMS acoustic sensor, a MEMS microphone requires an acoustic filter for effectively controlling the resonance phenomenon. In addition, a foreign substance (e.g., dust, A physical filter capable of preventing the inflow of the electromagnetic waves is required.

Conventionally, the acoustic filter of a microphone is attached to an acoustic hole formed in a case using a nonwoven fabric, or a metal mesh acoustic filter is manufactured and attached to an acoustic hole of a case or a substrate. For example, Korean Patent No. 10-0971293 discloses a microphone having a sound hole, and a foreign matter inflow preventing member for preventing foreign matter such as dust from entering into the microphone through the sound hole.

KR 10-0971293 B1

The microphone requires an acoustic filter to prevent foreign substances from entering or to suppress resonance. When manufacturing an acoustic sensor including an acoustic filter in a MEMS microphone, the process becomes complicated, and the limitation on the volume volume of the acoustic filter design is limited There is a problem that the cost of the microphone increases due to an increase in inspection and process of the package parts when applied to the package process.

SUMMARY OF THE INVENTION The present invention has been made in order to solve the above problems, and it is an object of the present invention to provide a method of manufacturing a semiconductor device, in which a mesh type acoustic filter is manufactured at a wafer level, , It is possible to reduce the cost due to the additional packaging process and to reduce the inspection time by inspecting the wafer level rather than a single component, A MEMS acoustic sensor, a method of manufacturing the MEMS acoustic sensor, and a condenser microphone using the acoustic sensor.

According to an aspect of the present invention, there is provided a method of manufacturing a semiconductor device, comprising: forming an acoustic filter on an acoustic filter wafer made of a silicon wafer using MEMS technology; Forming an acoustic sensor with an MEMS technique on an acoustic sensor wafer made of a silicon wafer; Applying an adhesive to the acoustic filter wafer; Aligning and bonding the acoustic sensor wafer on the acoustic filter wafer; And dicing the glued wafer to complete an individual MEMS acoustic sensor integrated with the mesh-like substrate.

The individual MEMS acoustic sensor is provided with a mesh-type substrate, which is adhered or bonded to the back chamber side of the MEMS acoustic sensor, to prevent foreign substances such as water droplets from entering into the back chamber and to suppress resonance.

According to another aspect of the present invention, there is provided an apparatus comprising: an acoustic sensor substrate having a backing formed thereon; A diaphragm formed on the acoustic sensor substrate; A back plate opposed to the diaphragm; A spacer disposed between the diaphragm and the back plate to form an air gap; And an acoustic filter substrate formed with a plurality of through holes and adhered (or bonded) to the back chamber side of the acoustic sensor substrate.

According to another aspect of the present invention, there is provided a microphone assembly including: a cover case having a cylindrical shape; A MEMS acoustic sensor for converting the sound introduced through the acoustic hole into an electrical signal; An acoustic filter substrate formed with a plurality of through holes and bonded to a back chamber side of the MEMS acoustic sensor; A chamber case for mounting the MEMS acoustic sensor on one side of the upper side and forming a through hole for communicating with the back chamber to extend the back chamber; And a substrate having an opening hole through which the chamber case can penetrate and which is joined to the cover case.

According to the present invention, a mesh-type acoustic filter is manufactured at a wafer level, and an acoustic sensor including a mesh-type acoustic filter is manufactured by aligning the acoustic filter with a wafer on which the acoustic sensor is manufactured, It is possible to prevent an increase in cost, and it is possible to reduce cost by reducing inspection time through inspection at a wafer level rather than a single component.

That is, according to the present invention, a substrate including a mesh region constituted by a predetermined acoustic hole is formed in the rear chamber of the MEMS acoustic sensor, thereby preventing foreign matter, particularly solution, from flowing into the MEMS acoustic sensor, It is possible to suppress the resonance phenomenon and realize a wide band characteristic.

1 is a flowchart showing a procedure for manufacturing a condenser microphone using a MEMS acoustic sensor integrated with a mesh-type substrate according to the present invention,
FIG. 2 is a view showing a manufacturing process of a MEMS acoustic sensor integrated with a mesh-type substrate according to the present invention,
3 is a side sectional view of a MEMS acoustic sensor integrated with a mesh-type substrate manufactured according to the present invention,
FIG. 4 is a drawing of a single-piece mesh type acoustic filter and a single-piece acoustic sensor used in the present invention,
5 is a view showing an example of picking up a MEMS acoustic sensor manufactured according to the present invention,
6 is a side sectional view of a condenser microphone using a MEMS acoustic sensor integrated with a mesh-type substrate manufactured according to the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, features, and advantages of the present invention will become more apparent from the following detailed description of the present invention when taken in conjunction with the accompanying drawings. The following examples are merely illustrative of the present invention and are not intended to limit the scope of the present invention.

FIG. 1 is a flow chart showing a procedure for manufacturing a condenser microphone using a MEMS acoustic sensor integrated with a mesh-type substrate according to the present invention, FIG. 2 is a view illustrating a process of manufacturing a MEMS acoustic sensor integrated with a mesh- And FIG. 3 is a side cross-sectional view of a MEMS acoustic sensor integrated with a mesh-type substrate manufactured according to the present invention. FIG. 4 shows an example of a single-piece mesh type acoustic filter and a single-piece acoustic sensor used in the present invention, and FIG. 5 illustrates an example of picking up a MEMS acoustic sensor manufactured according to the present invention.

A procedure for manufacturing a condenser microphone using a MEMS acoustic sensor integrated with a mesh-type substrate according to the present invention is as follows. As shown in FIG. 1, the acoustic filter 20 is formed on an acoustic filter substrate 21 made of a silicon wafer A step S2 of forming an acoustic sensor 10 on an acoustic sensor substrate 11 made of a silicon wafer; a step S3 of applying an adhesive 24 to the acoustic filter wafer; (S4) aligning and bonding the acoustic sensor wafers, dicing the bonded or bonded wafer to complete (S5) individual MEMS acoustic sensors 10 'integrated with the mesh-like substrate, (S6) mounting and mounting the ROIC chip 60 (S7), bonding the case 44 to the PCB substrate 30 (step S6), mounting the sensor 10 'on the PCB substrate 30 (Step S8) of completing the condenser microphone assembly by packaging It is.

1, in step S1 of forming an acoustic filter 20 on an acoustic filter substrate 21 made of a silicon wafer, a plurality of through holes 22 are formed on a silicon wafer by MEMS technology to form an acoustic filter 20 ). The through holes 22 may be formed through etching or silicon etching using a lithography technique.

In the step S2 of forming the acoustic sensor 10 on the acoustic sensor substrate 11 made of a silicon wafer, a pair of the diaphragm 12 and the backplate 13 is formed on the silicon wafer with a spacer therebetween by the MEMS technique, Thereby manufacturing the sensor 10. Techniques for fabricating the acoustic sensor 10 using MEMS technology can be made using known techniques in general and will not be described in further detail.

Then, in step S3 of applying the adhesive 24 to the acoustic filter wafer 21, the adhesive 24 for adhering the acoustic sensor wafer 11 is applied to the area where the through holes of the acoustic filter wafer 21 are not formed Lt; / RTI > At this time, the applied adhesive line also forms a dicing line for guiding the dicing, so it must be applied in place.

2 (a) and 2 (b), in the step S4 of aligning the acoustic sensor wafer 11 on the acoustic filter wafer 21 and bonding (or bonding) the acoustic sensor wafer 11 to the acoustic filter wafer 21, (Or bonding) the acoustic sensor wafers 11 by aligning them with the adhesive of the acoustic sensor wafers 11.

In step S5 of dicing the subsequently bonded (or bonded) wafer, the individual bonded MEMS acoustic sensors 10 'integrated with the mesh-like substrate as shown in FIG. 2 (c) ).

3, the completed individual MEMS acoustic sensor 10 'includes an acoustic sensor substrate 11 on which a backslash 16 is formed, a diaphragm 12 formed on the acoustic sensor substrate 11, A back plate 13 opposed to the diaphragm 12 and a spacer 14 disposed between the diaphragm 12 and the back plate 13 to form an air gap and a plurality of through holes 22 are formed And an acoustic filter substrate 21 adhered (or bonded) to the back chamber side of the acoustic sensor substrate 11.

3, an individual MEMS acoustic sensor 10 'integrated with the mesh-type substrate has a structure in which an acoustic filter substrate 10, which is a mesh-type substrate, is bonded or bonded to the back chamber 16 side of the MEMS acoustic sensor 10, Thereby preventing foreign matter such as water droplets from flowing into the back chamber 16 and suppressing the resonance phenomenon. The mesh type acoustic filter 10 has a plurality of through holes formed in the silicon substrate 11 to form a mesh shape and a plurality of through holes 13a are formed in the back plate 13. [ The back plate 13 is opposed to the diaphragm 12 serving as a movable electrode and functions as a fixed electrode.

4, the individual MEMS acoustic sensor 10 'may be manufactured by separately applying the adhesive layer 24 to the individual mesh-type acoustic filters 20 and then attaching the individual acoustic sensors 10 However, since the workability is deteriorated, it is preferable to carry out the step of dicing after bonding (or bonding) at the wafer level as shown in Fig. 2 for mass production.

In step S6 of picking up the individual MEMS acoustic sensor 10 'and mounting it on the PCB 30, the individual MEMS acoustic element 10' is picked up using the pickup tool 70 as shown in FIG. And mounted on the acoustic hole 30a to which the adhesive 32 of the PCB substrate 30 is applied. Although not shown in the figure, when the acoustic holes into which the external sound is input are formed in the cover case 44, the individual MEMS acoustic elements 10 'are picked up using the pick-up tool 70 and connected to the connection terminals of the PCB substrate 30 I will implement it.

In step S7 of mounting and wiring the ROIC chip 60, the ROIC chip 60 is mounted on the PCB substrate 30 on which the MEMS acoustic sensor 10 is mounted, and then the MEMS acoustic sensor 10 and the ROIC chip 60 are connected by wiring. In the packaging step S8, the case 44 is bonded to the PCB substrate 30 to complete the condenser microphone assembly.

6 is an example of a condenser microphone assembly using a MEMS acoustic sensor integrated with a mesh-type substrate manufactured according to the present invention.

As shown in FIG. 6, the condenser microphone assembly manufactured according to the embodiment of the present invention includes a cover case 44 having a tubular shape with one side opened and an acoustic signal input / An acoustic filter substrate 20 formed with a plurality of through holes 22 and bonded to the back chamber 16 side of the acoustic sensor 10, a MEMS acoustic sensor 10, A readout integrated circuit (ROIC) 60 for amplifying an electrical signal of the ROIC chip 60 mounted on one side of the back chamber 16 (ROM), an ROIC chip 60 mounted on one side of the upper side, and an acoustic sensor 10 mounted on the other side. The chamber case 42 has a through hole 42a for communicating with the cover case 44 and has an opening hole through which the chamber case 42 can be inserted, 30). The MEMS microphone assembly according to an embodiment of the present invention is configured such that the connection terminal 52 on the side of the user board 50 contacts the connection pad 34 of the board 30 and is mounted on the user board 50.

Referring to Fig. 6, the cover case 44 is in the shape of a rectangular tube made of a metal, and the open end thereof is bonded to the substrate 30. The acoustic sensor 10 has a pair of diaphragm 12 and back plate 13 formed on the silicon wafer 11 by MEMS technology and is provided vertically above the through hole 42a formed in the upper surface of the chamber case 42 The ROIC 60 is mounted on the acoustic filter substrate 10 and converts the vibration due to the negative pressure introduced from the outside through the acoustic hole 50a into an electrical signal. And is connected to the acoustic sensor 10 by a wire to amplify the electrical signal of the acoustic sensor 10 and then outputs the signal to the connection terminal 32 through the substrate 30. [

The chamber case 42 has a cylindrical shape in which a through hole 42a communicating with the back chamber 16 of the acoustic sensor 10 is formed and an open end thereof is joined to the user board 50. [ Such a chamber case 42 is joined to the user board 50 to expand the back chamber space 16. [ The substrate 30 has an opening hole through which the chamber case 42 is inserted, and various patterns such as the connection pad 34 and the conductive layer are formed.

As shown in FIG. 6, the microphone assembly according to the present invention is mounted on the user board 50, and when the external sound is input through the acoustic hole 50a of the user board 50, the MEMS acoustic sensor 10, The electrostatic capacitance of the frame 12 and the back plate 13 is changed and converted into an electrical signal. At this time, the microphone assembly according to the present invention can suppress the resonance phenomenon due to the acoustic holes 50a by the mesh-type acoustic filter substrate 20, and prevent foreign substances (e.g., dust, solution, etc.) can do. In addition, the back chamber 16 is greatly expanded by the chamber case 42, so that a back stream is not generated when the diaphragm 12 is vibrated, so that the vibration is smoothly performed, and thus sound quality can be greatly improved.

When the driving voltage is applied to the electrodes from the reading integrated circuit (ROIC), the distance between the back plate and the diaphragm is changed due to the diaphragm being vibrated by the eepressure introduced from the outside, This change is transferred to the readout integrated circuit (ROIC) and detected as a microphone signal.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims.

10: MEMS acoustic sensor 11: acoustic sensor substrate
12: diaphragm 13: back plate
14: spacer 16: back chamber
20: MEMS acoustic filter 21: acoustic filter substrate
22: through hole 24: adhesive layer
30: substrate 30a: through-hole
32: adhesive 34: connection pad
42: chamber case 52: connection terminal
42a: through hole 44: cover case
46; Welding Point 48: Adhesive
50: user board 50a: acoustic hole

Claims (7)

Forming an acoustic filter on an acoustic filter wafer of a silicon wafer with MEMS technology;
Forming an acoustic sensor with an MEMS technique on an acoustic sensor wafer made of a silicon wafer;
Applying an adhesive to the acoustic filter wafer;
Aligning and bonding the acoustic sensor wafer on the acoustic filter wafer; And
And dicing the bonded wafer to complete a discrete MEMS acoustic sensor integrated with the mesh-like substrate. The method of claim 1, wherein the individual MEMS acoustic sensors
A MEMS acoustic sensor according to any one of claims 1 to 3, wherein an acoustic filter substrate, which is a mesh type substrate, is bonded or bonded to the back chamber side of the MEMS acoustic sensor to prevent foreign substances such as water droplets from entering into the back chamber, Wherein the MEMS acoustic sensor has a plurality of MEMS sensors. The method of claim 1, wherein applying the adhesive
Wherein the adhesive layer is applied to a region of the acoustic filter wafer where the through holes are not formed, the applied adhesive line serving as a dicing line for guiding dicing, a MEMS acoustic sensor integrated with the mesh type substrate . An acoustic sensor substrate having a backing formed thereon;
A diaphragm formed on the acoustic sensor substrate;
A back plate opposed to the diaphragm;
A spacer disposed between the diaphragm and the back plate to form an air gap; And
A MEMS acoustic sensor integrated with a mesh-type substrate having a plurality of through-holes formed therein and including an acoustic filter substrate bonded (or bonded) to a back chamber side of the acoustic sensor substrate. 5. The apparatus of claim 4, wherein the acoustic sensor substrate and the acoustic filter substrate
Wherein the MEMS acoustic sensor is made of a silicon wafer and is separated into individual elements by dicing. A tubular cover case having one side open;
A MEMS acoustic sensor for converting the sound introduced through the acoustic hole into an electrical signal;
An acoustic filter substrate formed with a plurality of through holes and bonded to a back chamber side of the MEMS acoustic sensor;
A chamber case for mounting the MEMS acoustic sensor on one side of the upper side and forming a through hole for communicating with the back chamber to extend the back chamber; And
And a substrate which has an opening hole through which the chamber case can penetrate and which is joined to the cover case. The capacitive condenser microphone according to claim 1, The MEMS acoustic sensor as claimed in claim 6, wherein the MEMS acoustic sensor and the acoustic filter substrate
Wherein the MEMS acoustic sensor is attached to the mesh type substrate at a wafer level and inspected at a wafer level.
KR1020150169797A 2015-12-01 2015-12-01 Mems transducer with mesh type substrate, method of producing the transducer and condenser microphone using the same KR20170064256A (en)

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KR1020150169797A KR20170064256A (en) 2015-12-01 2015-12-01 Mems transducer with mesh type substrate, method of producing the transducer and condenser microphone using the same

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KR1020150169797A KR20170064256A (en) 2015-12-01 2015-12-01 Mems transducer with mesh type substrate, method of producing the transducer and condenser microphone using the same

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