KR20170063929A - Composition for forming copper film and method for producing copper film using same - Google Patents

Abstract

The present invention provides a composition for forming a copper film in a solution state which does not contain a solid phase such as fine particles, which is capable of obtaining a copper film having sufficient conductivity by being coated on a substrate and heated to less than 160 캜. 0.1 to 3.0 mol / kg of copper formate or a hydrate thereof, and 0.01 to 18.0 mol / kg of 4-aminopiperidine. After the composition for forming a copper film is applied on a substrate, the substrate coated with the composition for forming a copper film is heated to 200 DEG C or lower to form a copper film.

Description

Technical Field [0001] The present invention relates to a composition for forming a copper film and a method for producing a copper film using the same. BACKGROUND ART [0002]

The present invention relates to a composition for forming a copper film for forming a copper film on various substrates and a method for producing a copper film using the same.

A large number of techniques have been reported to form a conductive layer or wiring using copper as an electric conductor according to a coating thermal decomposition method (MOD method) or a fine particle dispersion application method which is a liquid process.

For example, Patent Documents 1 to 4 disclose a method in which a mixed solution containing copper hydroxide or copper oxide and polyhydric alcohol as essential components is applied to various substrates and heated at a temperature of 165 ° C or higher in a non-oxidizing atmosphere A method of producing a series of copper film-formed articles has been proposed. Copper formate is disclosed as an organic acid copper used in the liquid process, and diethanolamine and triethanolamine are disclosed as polyhydric alcohols.

Patent Document 5 proposes a metal paste containing an organic compound of silver microparticles and copper which can form a metal film having excellent solder heat resistance on a base electrode. Copper formate is disclosed as an organic compound of copper used in the above paste, and diethanolamine is disclosed as an amino compound that reacts with and forms a paste.

Patent Document 6 proposes a metal salt mixture for forming a metal pattern used in a circuit. Of the components constituting the mixture, copper formate is disclosed as a metal salt, and organic solvents such as diethanolamine, N-methyldiethanolamine, N-ethyldiethanolamine and morpholine are disclosed as organic components. Pyridine is disclosed as a metal ligand.

Patent Document 7 discloses a low-temperature-decomposable copper precursor composition containing 3-dialkylaminopropane-1,2-diol compound and copper formate which can be pyrolyzed at low temperatures after printing useful for forming wiring for electronics .

Patent Document 8 discloses a composition for forming a copper thin film containing copper formate and an alkanolamine useful for the liquid process described above. As the alkanolamine, monoethanolamine, diethanolamine, and triethanolamine are exemplified.

Japanese Patent Application Laid-Open No. 01-168865 Japanese Patent Application Laid-Open No. 01-168866 Japanese Patent Application Laid-Open No. 01-168867 Japanese Patent Application Laid-Open No. 01-168868 Japanese Patent Application Laid-Open No. 2007-35353 Japanese Laid-Open Patent Publication No. 2008-205430 Japanese Patent Application Laid-Open No. 2009-256218 Japanese Patent Application Laid-Open No. 2010-242118

In order to produce a minute wiring or film at low cost in a liquid process using a composition for forming a copper film, it is preferable that a composition satisfying the following requirements is provided. That is, a solution type that does not contain a solid phase such as fine particles, a type that imparts a copper film with excellent conductivity, a type that can be converted into a copper film at a low temperature, And it is desired that the film thickness obtained by one application is easy to control. Particularly, it is desired to form a copper film having excellent conductivity by heating to less than 160 캜. However, a composition for forming a copper film satisfying all of these requirements is not yet known.

Therefore, an object of the present invention is to provide a composition for forming a copper film which satisfies all of the above-mentioned requirements. More specifically, it is intended to provide a composition for forming a copper film in a solution state which does not contain a solid phase such as fine particles, which is capable of obtaining a copper film having sufficient conductivity by heating it to less than 160 캜 .

The inventors of the present invention have found that copper film forming compositions containing copper formate or its hydrate and 4-aminopiperidine in a specific ratio satisfy the above requirement , The present invention has been reached.

That is, the present invention provides a composition for forming a copper film containing 0.1 to 3.0 mol / kg of copper formate or a hydrate thereof and 0.01 to 18.0 mol / kg of 4-aminopiperidine.

The present invention also provides a method for manufacturing a copper film, comprising the steps of: applying the above composition for forming a copper film on a substrate; and forming a copper film having a step of forming a copper film by heating the above- ≪ / RTI >

According to the present invention, there is provided a composition for forming a copper film in a solution state which does not contain a solid phase such as fine particles, which is capable of obtaining a copper film having sufficient conductivity by applying it on a substrate and heating at a temperature of 200 ° C or less .

One of the characteristics of the composition for forming a copper film of the present invention is that copper formate is used as a precursor of the copper film. Copper formate used in the composition for forming a copper film of the present invention may be a non-aqueous or a hydrate. Concretely, copper (II) anhydrous formate, copper (II) formate dihydrate, copper (II) formate tetrahydrate and the like can be used. These copper formates may be mixed as they are, or may be mixed as an aqueous solution, an organic solvent solution, or an organic solvent suspension.

The content of copper formate in the composition for forming a copper film of the present invention may be suitably adjusted corresponding to the thickness of the copper film to be produced. The content of copper formate is 0.1 to 3.0 mol / kg, preferably 1.0 to 2.5 mol / kg. Here, " mol / kg " in the present invention indicates " amount (mol) of solute dissolved in 1 kg of solution ". For example, since the molecular weight of copper (II) formate is 153.58, 1.0 mole / kg is obtained when 153.58 g of copper formate is contained in 1 kg of the composition for forming a copper film of the present invention.

The composition for forming a copper film of the present invention contains 4-aminopiperidine as an essential component. As a result of the investigation, the present inventors have found that 4-aminopiperidine acts as a solubilizing agent for copper formate and copper hydrate formate. It has also been found that a copper film forming composition prepared by combining 4-aminopiperidine, copper formate and copper formate hydrate can be converted into a copper film by baking at 200 ° C or lower.

The content of 4-aminopiperidine in the composition for forming a copper film of the present invention is 0.01 to 18.0 mol / kg. If it is less than 0.01 mol / kg, the conductivity of the obtained copper film becomes insufficient. On the other hand, if it exceeds 18.0 mol / kg, the coatability is deteriorated and a uniform copper film can not be obtained. A more preferred range is 0.2 to 5.0 moles / kg. A more preferred range is 0.5 to 2.0 moles / kg.

The composition for forming a copper film of the present invention contains copper formate or a hydrate thereof and 4-aminopiperidine as an essential component. However, any component other than these essential components may be contained within a range that does not impair the effects of the present invention. Examples of optional components include organic solvents; An additive for increasing the thickness of the obtained copper film; An additive for imparting stability to a composition for forming a copper film, such as an antigelling agent and a stabilizer; An additive for improving the coatability of a composition for forming a copper film, such as an antifoaming agent, a thickener, a thixotropic agent, and a leveling agent; And a film forming auxiliary such as a combustion auxiliary agent and a crosslinking auxiliary agent.

The organic solvent may be any as long as it can stably dissolve the above copper formate or its hydrate and 4-aminopiperidine. The organic solvent may be a single composition or a mixture. Examples of the organic solvent that can be used in the composition for forming a copper film of the present invention include alcohol solvents, diol solvents, ketone solvents, ester solvents, ether solvents, aliphatic or alicyclic hydrocarbon solvents, aromatic hydrocarbon solvents, A hydrocarbon solvent having a cyano group, other solvents, and the like.

Examples of the alcoholic solvent include alcohols such as methanol, ethanol, propanol, isopropanol, 1-butanol, isobutanol, 2-butanol, Butanol, cyclohexanol, cyclohexanol, cyclohexanol, cyclohexanol, cyclohexanol, cyclohexanol, cyclohexanol, cyclohexanol, cyclohexanol, cyclohexanol, Propylene glycol monomethyl ether, propylene glycol monomethyl ether, propylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monophenyl ether, ethylene glycol monobutyl ether, ethylene glycol monomethyl ether, propylene glycol monomethyl ether, Monoethyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, dipropylene glycol monobutyl ether Ether, 2 (2-methoxyethoxy) ethanol, 2- (N, N- dimethylamino) ethanol, and the like, 3- (N, N- dimethylamino) propanol.

Examples of the diol solvent include ethylene glycol, propylene glycol, 1,2-butanediol, 1,3-butanediol, 1,4-butanediol, 1,5-pentanediol, neopentyl glycol, isoprene glycol 1,3-butanediol), 1,2-hexanediol, 1,6-hexanediol, 3-methyl-1,5-pentanediol, 1,2-octanediol, 2-ethyl-1,3-propanediol, 2,5-dimethyl-2,5-hexanediol, 1,2-cyclohexanediol, 1,4-cyclohexanediol, 1 , 4-cyclohexane dimethanol, and the like.

Examples of the ketone solvent include acetone, ethyl methyl ketone, methyl butyl ketone, methyl isobutyl ketone, ethyl butyl ketone, dipropyl ketone, diisobutyl ketone, methyl amyl ketone, cyclohexanone, methylcyclohexanone .

Examples of the ester solvents include methyl formate, ethyl formate, methyl acetate, ethyl acetate, isopropyl acetate, butyl acetate, isobutyl acetate, butyl butyl acetate, tert-butyl acetate, amyl acetate, isoamyl acetate, Tert-butyl amide, amyl propionate, isoamyl propionate, phenyl amide propionate, phenyl propionate, 2-amyl propionate, phenyl propionate, methyl propionate, ethyl propionate, isopropyl propionate, butyl propionate, isobutyl propionate, Ethylhexanoate, isopropyl 2-ethylhexanoate, butyl 2-ethylhexanoate, methyl lactate, methyl lactate, methyl methoxypropionate, methyl ethoxypropionate , Ethyl methoxypropionate, ethyl ethoxypropionate, ethylene glycol monomethyl ether acetate, diethylene glycol monomethyl ether acetate , Ethylene glycol monoethyl ether acetate, ethylene glycol monopropyl ether acetate, ethylene glycol monoisopropyl ether acetate, ethylene glycol monobutyl ether acetate, ethylene glycol mono isobutyl ether acetate, ethylene glycol monoisobutyl ether acetate, ethylene glycol mono Tert-butyl ether acetate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, propylene glycol monopropyl ether acetate, propylene glycol monoisopropyl ether acetate, propylene glycol monobutyl ether acetate, propylene glycol mono-2-butyl ether acetate , Propylene glycol monoisobutyl ether acetate, propylene glycol mono tertiary butyl ether acetate, butylene glycol monomethyl ether acetate Butylene glycol monoethyl ether acetate, butylene glycol monopropyl ether acetate, butylene glycol monoisopropyl ether acetate, butylene glycol monobutyl ether acetate, butylene glycol mono dibutyl ether acetate, butylene glycol monoisoprene Butyl ether acetate, butylene glycol mono tertiary butyl ether acetate, methyl acetate, ethyl acetate, methyl oxobutanoate, ethyl oxobutanoate,? -Lactone,? -Lactone and the like.

Examples of the ether solvents include tetrahydrofuran, tetrahydropyrane, morpholine, ethylene glycol dimethyl ether, diethylene glycol dimethyl ether, triethylene glycol dimethyl ether, dibutyl ether, diethyl ether, .

Examples of the aliphatic or alicyclic hydrocarbon-based solvent include pentane, hexane, cyclohexane, methylcyclohexane, dimethylcyclohexane, ethylcyclohexane, heptane, octane, decalin and solvent naphtha.

Examples of the aromatic hydrocarbon solvents include benzene, toluene, ethylbenzene, xylene, mesitylene, diethylbenzene, cumene, isobutylbenzene, cymene and tetraene.

Examples of the hydrocarbon solvent having a cyano group include 1-cyanopropane, 1-cyanobutane, 1-cyanoohexane, cyanocyclohexane, cyanobenzene, 1,3-dicyanopropane, , 1,6-dicyanohexane, 1,4-dicyanocyclohexane, and 1,4-dicyanobenzene.

Examples of other solvents include N-methyl-2-pyrrolidone, dimethylsulfoxide, and dimethylformamide.

In the present invention, among the above-mentioned organic solvents, alcoholic solvents, diol-based solvents and ester-based solvents are inexpensive and exhibit sufficient solubility to solutes, and also silicon substrates, metal gases, ceramics gases, It exhibits good application properties as a coating solvent for various gases such as gas, resin gas and the like. Among them, an alcoholic solvent is particularly preferable because it has high solubility in a solute.

The content of the organic solvent in the composition for forming a copper film of the present invention is not particularly limited and may be appropriately adjusted depending on the thickness of the copper film to be formed and the manufacturing method of the copper film. For example, when a copper film is produced according to a coating method, 0.01 part by mass to 5,000 parts by mass of an organic solvent is used with respect to 100 parts by mass of copper formate (in terms of copper formate, even in the case of copper formate) . If the amount of the organic solvent is less than 0.01 part by mass, cracks may be generated in the obtained copper film, or the coating property may be deteriorated. Further, since the copper film obtained becomes thinner as the proportion of the organic solvent increases, it is preferable that the copper film does not exceed 5,000 parts by mass from the viewpoint of productivity. More specifically, when a copper film is produced according to the spin coating method, it is preferable to use 20 parts by mass to 1,000 parts by mass of an organic solvent with respect to 100 parts by mass of copper formate. When a copper film is produced according to the screen printing method, it is preferable to use 0.01 to 20 parts by mass of an organic solvent with respect to 100 parts by mass of copper formate.

As an additive for increasing the thickness of the obtained copper film, for example, copper acetate or a hydrate thereof can be used. By adding such an additive, the copper concentration in the composition for forming a copper film can be increased and a copper film with a thicker film thickness can be obtained. For example, in the case of using copper acetate or its hydrate as the additive, the content of copper acetate or its hydrate is not particularly limited and may be suitably adjusted corresponding to the thickness of the copper film to be formed. The concentration ratio of copper formate or its hydrate to copper acetate or its hydrate is not particularly limited, but preferably 40 mass% or more of all copper in the composition for forming a copper film is added by adding copper formate. The content of copper acetate or its hydrate is preferably in the range of 0.1 to 2.0 mol / kg, more preferably in the range of 0.5 to 1.5 mol / kg when the amount of copper formate or its hydrate is 1 mol / kg . Further, the ratio of copper formate to copper acetate (mol / kg) is about 1: 1, which is particularly preferable because a copper film excellent in electric characteristics is obtained.

Examples of the additive for imparting stability to the copper film forming composition include piperidine, 1-aminopiperidine, N-ethylpiperidine, N-methylpiperidine, 2-methylpiperidine, Nitrogenous heterocyclic compounds other than 4-aminopiperidine represented by peridine, 4-methylpiperidine, 2,6-dimethylpiperidine, 3,5-dimethylpiperidine and the like; Alkanolamines such as diethanolamine, N-methyldiethanolamine, N-ethyldiethanolamine and N-aminopropyldiethanolamine; And diol compounds having at least one amino group represented by 3-dimethylamino-1,2-propanediol. The addition of N-methyldiethanolamine as a stabilizer is particularly preferable because it enhances the effect of suppressing the generation of precipitates such as metallic copper.

Next, a method for producing the copper film of the present invention will be described. The method for producing a copper film of the present invention includes a step (coating step) of applying the composition for forming a copper film of the present invention described above to a substrate (a coating step), a step of heating the substrate coated with the composition for forming a copper film, (Film forming process) for forming a film. The drying step may be further provided in which the gas is kept at 50 DEG C or more and less than 100 DEG C and the low boiling point component such as an organic solvent is volatilized before the film forming step corresponding to the necessity. Further, after the film forming step, the substrate may be further maintained at 100 ° C or more and 200 ° C or less to improve the conductivity of the copper film.

It is possible to produce a copper film having sufficient conductivity even when the temperature at which the gas coated with the composition for forming a copper film is heated is lower than 160 캜 in the film forming step. When heating to less than 160 캜, the copper film can be produced with less energy, which is advantageous in terms of cost. Further, even if the temperature at which the gas coated with the composition for forming a copper film is heated is 120 캜 or less, a copper film having sufficient conductivity can be produced. When heating to 120 DEG C or less, a copper film can be produced with less energy. Further, even when a gas made of a resin such as polyethylene terephthalate resin is used as a base, a copper film can be formed without deteriorating the gas, which is preferable.

Examples of the application method in the coating step include a spin coating method, a dip method, a spray coating method, a mist coating method, a flow coating method, a curtain coating method, a roll coating method, a knife coating method, A coating method, a screen printing method, a gravure printing method, an offset printing method, an ink jet method, and a brush method.

Further, in order to obtain a necessary film thickness, a plurality of steps from the coating step to an arbitrary step can be repeated. For example, all the steps of the film formation step may be repeated a plurality of times from the application step, or the application step and the drying step may be repeated a plurality of times.

Examples of the substrate usable in the method for producing a copper film of the present invention include resin, paper, metal, glass and the like. More specifically, it is possible to use a low density polyethylene resin, a high density polyethylene resin, an ABS resin (acrylonitrile-butadiene-styrene copolymer), an acrylic resin, a styrene resin, a vinyl chloride resin, a polyester resin (polyethylene terephthalate, , Polybutylene terephthalate, polyethylene naphthalate, polybutylene naphthalate), a polyacetal resin, and a cellulose derivative; Unprinted printing paper, fine paper printing paper, pottery printing paper (art paper, coated paper), special printing paper, copy paper (PPC paper), unbleached wrapping paper Paper substrates such as unglazed shipping sacks kraft paper and machine glazed poster paper), bleached wrapping paper (bleached grafted, pure white roll paper), coated balls, and chip ball corrugated paper; Metal substrates such as a copper plate, an iron plate and an aluminum plate; Glass substrates such as soda glass, borosilicate glass, silica glass, and quartz glass; Alumina; Sapphire; Zirconium oxide; Titanium dioxide; Yttrium oxide; ITO (indium tin oxide), and the like.

The atmosphere in the drying step, the film forming step, and the annealing step is usually one of a reducing gas atmosphere and an inert gas atmosphere. The copper film having better conductivity can be obtained in the reducing gas atmosphere. Examples of the reducing gas include hydrogen, and examples of the inert gas include helium, nitrogen, and argon. The inert gas may be used as a diluent gas of the reducing gas. Further, plasma in each process; laser; Discharge lamps such as a xenon lamp, a mercury lamp, a mercury xenon lamp, a xenon flash lamp, an argon flash lamp, and a deuterium lamp; Energy other than heat such as various kinds of radiation may be applied or irradiated.

The copper film formed according to the method for producing a copper film of the present invention can be used as a wiring or an electrode of an electronic device represented by a touch panel, a liquid crystal display element, an organic EL element, or the like. For example, an electronic device such as a liquid crystal display device and an organic EL device provided with such a touch panel can be provided by constituting a touch panel using a copper film formed according to the copper film manufacturing method of the present invention as a lead wiring.

[Example]

Hereinafter, the present invention will be described in more detail by way of examples. However, the present invention is not limited to the following embodiments and the like.

≪ Copper film forming composition >

[Examples 1 to 7]

The compounds shown in Table 1 were compounded so as to have respective concentrations (mol / kg, mass%) in the brackets to obtain Copper Film Forming Compositions 1 to 7. The concentration of each compound shown in Table 1 is the amount in 1 kg of the composition for forming a copper film (hereinafter the same applies). The remainder was all ethanol.

* 1 4-Amino-2,2,6,6-tetramethylpiperidine

* 2 2-Methylaminopyridine

[Comparative Examples 1 to 4]

Comparative compounds 1 to 4 were obtained by compounding the compounds shown in Table 2 so as to have the respective concentrations (mol / kg, mass%) in the parentheses. In addition, the residue was all ethanol.

* 1 4-Amino-2,2,6,6-tetramethylpiperidine

* 2 2-Methylaminopyridine

* 3 4- (Aminomethyl) piperidine

* 4 4-Amino-1-methylpiperidine

≪ Preparation of copper film &

[Examples 8 to 21]

Copper film forming compositions 1 to 7 were each used to prepare a copper thin film by a coating method. Specifically, first, each composition for forming a copper film was cast on various substrates described in Table 3. Thereafter, the copper film forming composition was applied by spin coating at 500 rpm for 5 seconds and at 2,000 rpm for 20 seconds. Next, it was dried at 100 캜 for 30 seconds in the atmosphere using a hot plate. The substrate after drying was heated for 20 minutes at a predetermined temperature shown in Table 3 under an argon atmosphere using an infrared ray heating furnace (RTP-6 (trade name): ULVAC RIKO, Inc.) ) To obtain a copper thin film. The flow rate of argon during the firing process is set to 300 mL / min. The rate of temperature rise is 100 DEG C / 30 seconds when the firing temperature is 100 DEG C, 120 DEG C / 30 seconds when the firing temperature is 120 DEG C, 150 DEG C / 30 seconds in the case of 150 DEG C, respectively.

For the glass substrate, a glass substrate for liquid crystal display (Eagle XG (trade name) manufactured by Corning) was used. Further, Cosmo Shine A4100 (trade name) (manufactured by Toyobo Co., Ltd., film thickness 100 μm) was used for the PET substrate.

[Comparative Examples 5 to 8]

Using the comparative compositions 1 to 4, a copper thin film was prepared by a coating method. Specifically, each copper film forming composition was first cast on a PET substrate (Cosmo Shine A4100 (trade name): Toyobo Co., Ltd., film thickness: 100 m). Thereafter, the copper film forming composition was applied by spin coating at 500 rpm for 5 seconds and at 2,000 rpm for 20 seconds. Next, it was dried in the air at 100 캜 for 30 seconds using a hot plate. The substrate after drying was heated (main baking step) for 20 minutes at a predetermined temperature shown in Table 3 under an argon atmosphere using an infrared heating furnace (RTP-6 (trade name): Alkarco Corp.) to obtain a copper thin film. The flow condition of argon during the firing process was 300 mL / min, and the temperature increase rate was 120 DEG C / 30 seconds.

<Evaluation>

[Measurement of resistivity]

(Manufactured by Mitsubishi Chemical Analytech Co., Ltd.) was used as a resistivity meter (Loresta GP (trade name): manufactured by Mitsubishi Chemical Analytech Co., Ltd.) and formed on the substrate prepared in Examples 8 to 21 and Comparative Examples 5 to 8 The specific resistance of each copper film was measured. The measured values of resistivity are shown in Table 3.

※ 1 did not show conductivity.

As shown in Table 3, in Comparative Examples 5 to 8, firing was performed at 120 占 폚, but a copper thin film exhibiting conductivity could not be formed. On the other hand, in Examples 8 to 21, it was confirmed that a copper thin film having good electrical characteristics was formed even when baked at a temperature of less than 150 ° C. In particular, it was confirmed that in Examples 9, 10, 12, 13, 15, and 17 to 21, a copper thin film having good electrical characteristics was formed even when baked at a temperature of 120 ° C or lower. From the above, it was confirmed that when the composition for forming a copper film of Examples 1 to 7 was used, a copper film having good electrical characteristics could be formed even when baking was performed at a low temperature of less than 160 캜.

Claims (2)

0.1 to 3.0 mol / kg of copper formate or its hydrate,
And 0.01 to 18.0 mol / kg of 4-aminopiperidine. A process for producing a copper film, comprising the steps of: applying the composition for forming a copper film according to claim 1 onto a substrate;
Forming a copper film by heating the gas applied with the composition for forming a copper film to 200 캜 or lower.