JP2016079416A - Composition for copper film formation, and production method of copper film using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a composition for copper film formation in a liquid state not containing a solid phase such as fine particles, capable of obtaining a copper film having sufficient conductivity, by being coated on a substrate and heated below 160°C.SOLUTION: A composition for copper film formation contains 0.1-3.0 mol/kg copper formate or its hydrate, and 0.01-18.0 mol/kg 4-aminopiperidine. After coating the composition for copper film formation on the substrate, the substrate coated with the composition for copper film is heated at 200°C or lower, to thereby form a copper film.SELECTED DRAWING: None

Description

  The present invention relates to a copper film forming composition for forming a copper film on various substrates, and a method for producing a copper film using the composition.

  A number of techniques have been reported for forming a conductive layer or wiring using copper as an electrical conductor by a coating pyrolysis method (MOD method) or a fine particle dispersion coating method, which is a liquid process.

  For example, in Patent Documents 1 to 4, applying a mixed liquid containing copper hydroxide or organic acid copper and a polyhydric alcohol as essential components to various substrates and heating to a temperature of 165 ° C. or higher in a non-oxidizing atmosphere. A series of characteristic methods for producing copper film-formed articles have been proposed. And copper formate is disclosed as an organic acid copper used in the liquid process, and diethanolamine and triethanolamine are disclosed as polyhydric alcohols.

  Patent Document 5 proposes a metal paste containing silver fine particles and an organic compound of copper, which can form a metal film having excellent solder heat resistance on a base electrode. Copper formate is disclosed as an organic compound of copper used in the paste, and diethanolamine is disclosed as an amino compound that is reacted with the paste to form a paste.

  In patent document 6, it proposes about the metal salt mixture for metal pattern formation used for a circuit. And among the components constituting the mixture, copper formate is disclosed as a metal salt, and as organic components, diethanolamine, N-methyldiethanolamine, N-ethyldiethanolamine, morpholine, which are organic solvents, are disclosed, Pyridine is disclosed as a ligand.

  Patent Document 7 discloses a low-temperature-decomposable copper precursor containing copper formate that can be thermally decomposed at a low temperature after printing and a 3-dialkylaminopropane-1,2-diol compound, which is useful for the formation of wiring for electronics and the like. A composition is disclosed.

  Patent Document 8 discloses a copper thin film forming composition containing copper formate and alkanolamine useful for the liquid process described above. Examples of alkanolamines include monoethanolamine, diethanolamine, and triethanolamine.

JP-A-1-168865 JP-A-1-168866 JP-A-1-168867 Japanese Patent Laid-Open No. 1-168868 JP 2007-35353 A JP 2008-205430 A JP 2009-256218 A JP 2010-242118 A

  In order to produce fine wirings and films at low cost in a liquid process using a composition for forming a copper film, it is desirable to provide a composition that satisfies the following requirements. That is, it is a solution type that does not contain a solid phase such as fine particles, gives a copper film excellent in conductivity, can be converted into a copper film at low temperature, has good coating properties, and precipitates such as metallic copper It is desired that there is no generation and that the film thickness obtained by one application can be easily controlled. In particular, it is desired that a copper film having excellent conductivity can be formed by heating at less than 160 ° C. However, a composition for forming a copper film that sufficiently satisfies all of these requirements is not yet known.

  Accordingly, an object of the present invention is to provide a composition for forming a copper film that sufficiently satisfies all of the above requirements. More specifically, it is possible to obtain a copper film having sufficient conductivity by coating on a substrate and heating at less than 160 ° C. Forming a solution-like copper film containing no solid phase such as fine particles It is to provide a composition for use.

  As a result of repeated investigations in view of the above circumstances, the present inventors have found that a copper film-forming composition containing copper formate or a hydrate thereof and 4-aminopiperidine in a specific ratio satisfies the above required performance. The present invention has been found.

  That is, the present invention provides a copper film-forming composition comprising copper formate or a hydrate thereof 0.1 to 3.0 mol / kg and 4-aminopiperidine 0.01 to 18.0 mol / kg. I will provide a.

  The present invention also includes a step of applying the copper film forming composition on a substrate, and a step of heating the substrate coated with the copper film forming composition to 200 ° C. or lower to form a copper film. And a method for producing a copper film.

  According to the present invention, a solution-like copper containing no solid phase such as fine particles, which can be applied on a substrate and heated at a temperature of 200 ° C. or less to obtain a copper film having sufficient conductivity. A film forming composition is provided.

  One of the features of the composition for forming a copper film of the present invention is that copper formate is used as a precursor (precursor) of the copper film. The copper formate used in the composition for forming a copper film of the present invention may be a hydrate or a hydrate. Specifically, anhydrous copper formate (II), copper formate (II) dihydrate, copper formate (II) tetrahydrate and the like can be used. These copper formates may be mixed as they are, or may be mixed as an aqueous solution, an organic solvent solution, or an organic solvent suspension.

  What is necessary is just to adjust suitably content of the copper formate in the composition for copper film formation of this invention according to the thickness of the copper film to manufacture. The content of copper formate is 0.1 to 3.0 mol / kg, preferably 1.0 to 2.5 mol / kg. Here, “mol (mol) / kg” in the present invention represents “amount (mol) of solute dissolved in 1 kg of solution”. For example, since the molecular weight of copper (II) formate is 153.58, when 153.58 g of copper formate is contained in 1 kg of the composition for forming a copper film of the present invention, it is 1.0 mol / kg. .

  The composition for forming a copper film of the present invention contains 4-aminopiperidine as an essential component. As a result of the study, the present inventors have found that 4-aminopiperidine acts as a solubilizer for copper formate and copper formate hydrate. Moreover, it discovered that the composition for copper film formation prepared by combining 4-aminopiperidine, copper formate, and copper formate hydrate can be converted into a copper film by baking at 200 degrees C or less.

  The content of 4-aminopiperidine in the composition for forming a copper film of the present invention is 0.01 to 18.0 mol / kg. When the amount is less than 0.01 mol / kg, the conductivity of the obtained copper film becomes insufficient. On the other hand, when it exceeds 18.0 mol / kg, applicability deteriorates and a uniform copper film cannot be obtained. A more preferable range is 0.2 to 5.0 mol / kg. A more preferable range is 0.5 to 2.0 mol / kg.

  The composition for forming a copper film of the present invention contains copper formate or a hydrate thereof and 4-aminopiperidine as essential components. However, you may contain arbitrary components other than these essential components in the range which does not inhibit the effect of this invention. Optional components include: an organic solvent; an additive for increasing the film thickness of the obtained copper film; an additive for imparting stability to the composition for forming a copper film, such as an anti-gelling agent and a stabilizer; Examples include additives for improving the coating property of the composition for forming a copper film such as an antifoaming agent, a thickener, a thixotropic agent, and a leveling agent; and film forming aids such as a combustion aid and a crosslinking aid.

  The organic solvent may be any as long as it can stably dissolve the copper formate or the hydrate thereof and 4-aminopiperidine. The organic solvent may be a single composition or a mixture. Examples of organic solvents that can be used in the copper film forming composition of the present invention include alcohol solvents, diol solvents, ketone solvents, ester solvents, ether solvents, aliphatic or alicyclic hydrocarbons. Solvent, aromatic hydrocarbon solvent, hydrocarbon solvent having a cyano group, and other solvents.

  Examples of alcohol solvents include methanol, ethanol, propanol, isopropanol, 1-butanol, isobutanol, 2-butanol, tertiary butanol, pentanol, isopentanol, 2-pentanol, neopentanol, and third pen. Tanol, hexanol, 2-hexanol, heptanol, 2-heptanol, octanol, 2-ethylhexanol, 2-octanol, cyclopentanol, cyclohexanol, cycloheptanol, methylcyclopentanol, methylcyclohexanol, methylcycloheptanol, Benzyl alcohol, ethylene glycol monoacetate, ethylene glycol monoethyl ether, ethylene glycol monophenyl ether, ethylene glycol monobutyl ether Ethylene glycol monomethyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, dipropylene glycol monobutyl ether, 2- (2-methoxy Ethoxy) ethanol, 2- (N, N-dimethylamino) ethanol, 3- (N, N-dimethylamino) propanol and the like.

  Examples of the diol solvent include ethylene glycol, propylene glycol, 1,2-butanediol, 1,3-butanediol, 1,4-butanediol, 1,5-pentanediol, neopentyl glycol, and isoprene glycol (3 -Methyl-1,3-butanediol), 1,2-hexanediol, 1,6-hexanediol, 3-methyl-1,5-pentanediol, 1,2-octanediol, octanediol (2-ethyl- 1,3-hexanediol), 2-butyl-2-ethyl-1,3-propanediol, 2,5-dimethyl-2,5-hexanediol, 1,2-cyclohexanediol, 1,4-cyclohexanediol, Examples include 1,4-cyclohexanedimethanol.

  Examples of the ketone solvent include acetone, ethyl methyl ketone, methyl butyl ketone, methyl isobutyl ketone, ethyl butyl ketone, dipropyl ketone, diisobutyl ketone, methyl amyl ketone, cyclohexanone, and methylcyclohexanone.

  Examples of the ester solvent include methyl formate, ethyl formate, methyl acetate, ethyl acetate, isopropyl acetate, butyl acetate, isobutyl acetate, sec-butyl acetate, sec-butyl acetate, amyl acetate, isoamyl acetate, triamyl acetate, Phenyl acetate, methyl propionate, ethyl propionate, isopropyl propionate, butyl propionate, isobutyl propionate, butyl propionate, tert-butyl propionate, amyl propionate, isoamyl propionate, 3 amyl propionate, propionate Acid phenyl, methyl 2-ethylhexanoate, ethyl 2-ethylhexanoate, propyl 2-ethylhexanoate, isopropyl 2-ethylhexanoate, butyl 2-ethylhexanoate, methyl lactate, ethyl lactate, methyl methoxypropionate, ethyl Methyl xylpropionate, ethyl methoxypropionate, ethyl ethoxypropionate, ethylene glycol monomethyl ether acetate, diethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, ethylene glycol monopropyl ether acetate, ethylene glycol monoisopropyl ether acetate, ethylene glycol mono Butyl ether acetate, ethylene glycol mono secondary butyl ether acetate, ethylene glycol mono isobutyl ether acetate, ethylene glycol mono tertiary butyl ether acetate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, propylene glycol monopropylene Ether acetate, propylene glycol monoisopropyl ether acetate, propylene glycol monobutyl ether acetate, propylene glycol mono sec-butyl ether acetate, propylene glycol monoisobutyl ether acetate, propylene glycol mono-tert-butyl ether acetate, butylene glycol monomethyl ether acetate, butylene glycol monoethyl ether Acetate, Butylene glycol monopropyl ether acetate, Butylene glycol monoisopropyl ether acetate, Butylene glycol monobutyl ether acetate, Butylene glycol mono sec-butyl ether acetate, Butylene glycol monoisobutyl ether acetate, Butylene glycol mono tertiary Examples include butyl ether acetate, methyl acetoacetate, ethyl acetoacetate, methyl oxobutanoate, ethyl oxobutanoate, γ-lactone, and δ-lactone.

  Examples of the ether solvent include tetrahydrofuran, tetrahydropyran, morpholine, ethylene glycol dimethyl ether, diethylene glycol dimethyl ether, triethylene glycol dimethyl ether, dibutyl ether, diethyl ether, dioxane, and the like.

  Examples of the aliphatic or alicyclic hydrocarbon solvent include pentane, hexane, cyclohexane, methylcyclohexane, dimethylcyclohexane, ethylcyclohexane, heptane, octane, decalin, and solvent naphtha.

  Examples of the aromatic hydrocarbon solvent include benzene, toluene, ethylbenzene, xylene, mesitylene, diethylbenzene, cumene, isobutylbenzene, cymene, and tetralin.

  Examples of the hydrocarbon solvent having a cyano group include 1-cyanopropane, 1-cyanobutane, 1-cyanohexane, cyanocyclohexane, cyanobenzene, 1,3-dicyanopropane, 1,4-dicyanobutane, 1,6-dicyanohexane. 1,4-dicyanocyclohexane, 1,4-dicyanobenzene and the like.

  Examples of other solvents include N-methyl-2-pyrrolidone, dimethyl sulfoxide, and dimethylformamide.

  In the present invention, among the above organic solvents, alcohol-based solvents, diol-based solvents, and ester-based solvents are inexpensive and exhibit sufficient solubility in solutes, and further include silicon substrates, metal substrates, and ceramic substrates. It is preferable because it exhibits good coating properties as a coating solvent for various substrates such as glass substrates and resin substrates. Of these, alcohol solvents are particularly preferred because of their high solubility in solutes.

  Content of said organic solvent in the composition for copper film formation of this invention is not specifically limited, If it adjusts suitably according to the thickness of the copper film to form and the manufacturing method of a copper film Good. For example, when a copper film is produced by a coating method, 0.01 mass of the organic solvent is used with respect to 100 mass parts of copper formate (even in the case of copper formate hydrate, converted to copper formate, the same shall apply hereinafter). It is preferable to use parts to 5,000 parts by mass. When the amount of the organic solvent is less than 0.01 parts by mass, there may be a problem that the resulting copper film is cracked or has poor applicability. Moreover, since the copper film obtained becomes thin, so that the ratio of an organic solvent increases, it is preferable not to exceed 5,000 mass parts from the surface of productivity. More specifically, when producing a copper film by a spin coat method, it is preferable to use 20 mass parts-1,000 mass parts of organic solvents with respect to 100 mass parts of copper formate. Moreover, when manufacturing a copper film by a screen printing method, it is preferable to use 0.01 mass part-20 mass parts of organic solvents with respect to 100 mass parts of copper formate.

  As an additive for increasing the film thickness of the obtained copper film, for example, copper acetate or a hydrate thereof can be used. By adding such an additive, the copper concentration in the composition for forming a copper film can be increased, and a thick copper film can be obtained. For example, when copper acetate or a hydrate thereof is used as the additive, the content of copper acetate or the hydrate is not particularly limited, and depends on the thickness of the copper film to be formed. And adjust as appropriate. The concentration ratio of copper formate or hydrate thereof and copper acetate or hydrate thereof is not particularly limited, but 40% by mass or more of all copper in the copper film forming composition is copper formate. It is preferable to be due to the addition of. The content of copper acetate or hydrate thereof is preferably in the range of 0.1 to 2.0 mol / kg when copper formate or hydrate thereof is 1 mol / kg. More preferably, it is in the range of -1.5 mol / kg. Moreover, it is especially preferable that the ratio of the concentration (mol / kg) of copper formate and copper acetate is about 1: 1 because a copper film having excellent electrical characteristics can be obtained.

  As additives for imparting stability to the composition for forming a copper film, piperidine, 1-aminopiperidine, N-ethylpiperidine, N-methylpiperidine, 2-methylpiperidine, 3-methylpiperidine, 4-methylpiperidine Nitrogen-containing heterocyclic compounds other than 4-aminopiperidine represented by 2,6-dimethylpiperidine, 3,5-dimethylpiperidine, etc .; represented by diethanolamine, N-methyldiethanolamine, N-ethyldiethanolamine, N-aminopropyldiethanolamine And diol compounds having one or more amino groups represented by 3-dimethylamino-1,2-propanediol. The addition of N-methyldiethanolamine as a stabilizer is particularly preferable because the effect of suppressing the generation of precipitates such as metallic copper is enhanced.

  Next, the manufacturing method of the copper film of this invention is demonstrated. The method for producing a copper film of the present invention comprises a step of applying the composition for forming a copper film of the present invention described above on a substrate (coating step), and a substrate coated with the composition for forming a copper film in 200 steps. And a step (film formation step) of forming a copper film by heating to a temperature not higher than ° C. Before the film forming step, if necessary, the substrate may be kept at 50 ° C. or higher and lower than 100 ° C. to further dry the low boiling point component such as an organic solvent. Moreover, you may further have the annealing process which hold | maintains a base | substrate at 100 degreeC or more and 200 degrees C or less, and improves the electroconductivity of a copper film after a film-forming process.

  Even if the temperature at which the substrate coated with the composition for forming a copper film is heated in the film forming step is less than 160 ° C., a copper film having sufficient conductivity can be produced. When heating at less than 160 ° C., the copper film can be produced with less energy, which is advantageous in terms of cost. Moreover, even if the temperature which heats the base | substrate with which the composition for copper film formation was applied is 120 degrees C or less, the copper film which has sufficient electroconductivity can be manufactured. When heating at 120 ° C. or lower, a copper film can be produced with less energy. Furthermore, even when a resin substrate represented by polyethylene terephthalate resin or the like is used as the substrate, it is preferable because a copper film can be formed without degrading the substrate.

  As the coating method in the above coating process, spin coating method, dip method, spray coating method, mist coating method, flow coating method, curtain coating method, roll coating method, knife coating method, bar coating method, slit coating method, screen Examples thereof include a printing method, a gravure printing method, an offset printing method, an ink jet method, and a brush coating.

  Moreover, in order to obtain a required film thickness, a plurality of steps from the above coating step to an arbitrary step can be repeated. For example, all the steps from the coating step to the film forming step may be repeated a plurality of times, or the coating step and the drying step may be repeated a plurality of times.

  Examples of the substrate that can be used in the method for producing a copper film of the present invention include resin, paper, metal, and glass. More specifically, low density polyethylene resin, high density polyethylene resin, ABS resin (acrylonitrile-butadiene-styrene copolymer), acrylic resin, styrene resin, vinyl chloride resin, polyester resin (polyethylene terephthalate, polytrimethylene terephthalate, Resin base materials such as polybutylene terephthalate, polyethylene naphthalate, polybutylene naphthalate), polyacetal resin, cellulose derivatives; uncoated printing paper, finely coated printing paper, coated printing paper (art paper, coated paper), special Printing paper, copy paper (PPC paper), unbleached wrapping paper (both kraft paper for heavy bags, both kraft paper), bleached wrapping paper (bleached kraft paper, pure white roll paper), coated balls, chipboard cardboard, etc. Paper base material; Metal base material such as copper plate, iron plate, aluminum plate; Soda Las, borosilicate glass, silica glass, glass substrate such as quartz glass, alumina, sapphire, zirconia, titania, yttrium oxide, ITO (indium tin oxide) and the like.

  The atmosphere of the drying step, the film forming step, and the annealing step is usually either a reducing gas atmosphere or an inert gas atmosphere. A reducing gas atmosphere can provide a copper film with more excellent conductivity. The reducing gas includes hydrogen, and the inert gas includes helium, nitrogen, and argon. The inert gas may be used as a diluent gas for the reducing gas. In each step, plasma; laser; discharge lamp such as xenon lamp, mercury lamp, mercury xenon lamp, xenon flash lamp, argon flash lamp, deuterium lamp, etc .; Good.

  The copper film formed by the copper film manufacturing method of the present invention can be used as a wiring or an electrode of an electronic device represented by a touch panel, a liquid crystal display element, an organic EL element, or the like. For example, an electronic device such as a liquid crystal display element or an organic EL element having such a touch panel is provided by configuring a touch panel using the copper film formed by the copper film manufacturing method of the present invention as a lead wiring. be able to.

  Hereinafter, the present invention will be described in more detail with reference to examples. However, the present invention is not limited by the following examples.

<Composition for forming copper film>
[Examples 1-7]
The compounds shown in Table 1 were blended so as to have numerical values in parentheses (mol / kg, mass%) to obtain compositions 1 to 7 for forming a copper film. In addition, the density | concentration of each compound described in Table 1 is the quantity in 1 kg of the manufactured composition for copper film formation (hereinafter, the same). The remainder was ethanol.

[Comparative Examples 1-4]
Comparative compounds 1 to 4 were obtained by blending the compounds shown in Table 2 so as to obtain the concentration (mol / kg, mass%) in parentheses. The remainder was ethanol.

<Manufacture of copper film>
[Examples 8 to 21]
A copper thin film was produced by a coating method using compositions 1 to 7 for forming a copper film. Specifically, first, each copper film forming composition was cast on various substrates described in Table 3. Then, each copper film formation composition was apply | coated by the spin coat method on the conditions of 500 second for 5 seconds, and 2,000 rpm for 20 seconds. Subsequently, it dried in air | atmosphere for 30 second at 100 degreeC using the hotplate. The substrate after drying was heated (main firing step) for 20 minutes at a predetermined temperature shown in Table 3 under an argon atmosphere using an infrared heating furnace (RTP-6 (trade name): ULVAC-RIKO). A thin film was obtained. The argon flow conditions during the main baking step are 300 mL / min, and the rate of temperature increase is 100 ° C./30 seconds when the main baking temperature is 100 ° C. and 120 ° C./30 seconds when the main baking temperature is 120 ° C. When it was 150 ° C., it was set to 150 ° C./30 seconds.
In addition, the glass substrate (Eagle XG (brand name): Corning company make) for liquid crystal screens was used for the glass substrate. Moreover, Cosmo Shine A4100 (trade name) (manufactured by Toyobo Co., Ltd., film thickness: 100 μm) was used for the PET substrate.

[Comparative Examples 5 to 8]
Comparative compositions 1 to 4 were used, respectively, and copper thin films were produced by a coating method. Specifically, first, each copper film forming composition was cast on a PET substrate (Cosmo Shine A4100 (trade name): manufactured by Toyobo Co., Ltd., film thickness: 100 μm). Then, each copper film formation composition was apply | coated by the spin coat method on the conditions of 500 second for 5 seconds, and 2,000 rpm for 20 seconds. Subsequently, it dried in air | atmosphere for 30 second at 100 degreeC using the hotplate. The substrate after drying was heated (main firing step) for 20 minutes at a predetermined temperature shown in Table 3 under an argon atmosphere using an infrared heating furnace (RTP-6 (trade name): ULVAC-RIKO). A thin film was obtained. In addition, the flow conditions of argon at the time of this baking process were 300 mL / min, and the temperature increase rate was 120 degreeC / 30 second.

<Evaluation>
[Measurement of resistivity]
Using a resistivity meter (Loresta GP (trade name): manufactured by Mitsubishi Chemical Analytech Co., Ltd.), the specific resistance of each copper thin film formed on the substrates manufactured in Examples 8 to 21 and Comparative Examples 5 to 8 was measured. . Table 3 shows the measured specific resistance values.

  As shown in Table 3, in Comparative Examples 5-8, although it baked at 120 degreeC, the copper thin film which shows electroconductivity was not able to be formed. On the other hand, in Examples 8 to 21, it was confirmed that a copper thin film having good electrical characteristics was formed even when baked at a temperature of 150 ° C. or less than 150 ° C. In particular, in Examples 9, 10, 12, 13, 15, and 17 to 21, it was confirmed that a copper thin film having good electrical characteristics was formed even when baked at a temperature of 120 ° C. or lower. From the above, it was confirmed that if the copper film forming compositions of Examples 1 to 7 were used, it was possible to form a copper film with good electrical characteristics even when fired at a low temperature of less than 160 ° C.

Claims (2)

Copper formate or its hydrate 0.1-3.0 mol / kg,
The composition for copper film formation containing 4-amino piperidine 0.01-18.0 mol / kg. Applying the composition for forming a copper film according to claim 1 on a substrate;
A step of heating the substrate coated with the composition for forming a copper film to 200 ° C. or less to form a copper film.