KR20170061593A - Ultra thin pocket type of keyboard device - Google Patents

Abstract

Various embodiments of the present invention relate to an ultra-thin pocket type keyboard device, which aims to realize an innovative thickness and weight by using a nano-piezoelectric material, and also to form a circuit pattern of a folded-back bending area in a soft, thin and elastic urethane film, And an object of the present invention is to provide an ultrashort pocket type keyboard device capable of improving the reliability of a bending region by implementing a printing, sintering and / or jetting of a pole nano conductive material on a base material such as cloth or fiber.
To this end, the present invention provides a method for embossing a first layer comprising a plurality of embossed keys arranged therein; A second layer in which actuator bumps formed in a protruding shape at a position corresponding to the embossing key are arranged under the first layer; A third layer having an upper nano silver circuit pattern formed to extract an Y-coordinate input signal out of the key matrix in the lower part of the second layer; And a fourth layer having a lower nano silver circuit pattern formed to extract an X-coordinate input signal of the key matrix below the third layer, wherein the first layer to the fourth layer are arranged in a direction perpendicular to the longitudinal direction Disclosed is an ultra-slim pocket-type keyboard device further comprising a foldable common foldable region.

Description

[0001] ULTRA THIN POCKET TYPE OF KEYBOARD DEVICE [0002]

Various embodiments of the present invention are directed to ultra-thin pocket keyboard devices.

With the recent development of smart devices, various input devices are being developed. Space gesture recognition, and pupil recognition. However, the most familiar and widely used input device is still a keyboard.

In particular, the tablet market is being reorganized as a tablet (Phablet) and a large 12-inch tablet or more, and the productivity of smart devices is increasing due to the improvement of the performance of the smart devices. .

In the future, the demand for portable keyboards will increase due to the increase in tablet and large-size tablet market in the future. Foldable (or foldable) keyboards are excellent in portability considering portability, Limiting the weight to less than 10mm / 100g globally was limited.

The above-described information disclosed in the background of the present invention is only for improving the understanding of the background of the present invention, and thus may include information not constituting the prior art.

SUMMARY OF THE INVENTION It is an object of the present invention to provide an ultra-thin pocket type keyboard device. That is, a problem to be solved by the present invention is to realize a novel thickness and weight by using a nano-piezoelectric material, and to provide a circuit pattern of a folded-up region in a flexible, thin and elastic urethane film, ) Type nano conductive material by printing, sintering, and / or jetting, thereby improving the reliability of the bending region.

An ultra slim pocket type keyboard apparatus according to various embodiments of the present invention includes a first layer in which a plurality of embossing keys are arranged; A second layer in which actuator bumps formed in a protruding shape at a position corresponding to the embossing key are arranged under the first layer; A third layer having an upper nano silver circuit pattern formed to extract an Y-coordinate input signal out of the key matrix in the lower part of the second layer; And a fourth layer having a lower nano silver circuit pattern formed to extract an X-coordinate input signal of the key matrix below the third layer, wherein the first layer to the fourth layer are arranged in a direction perpendicular to the longitudinal direction And may further include a common foldable region that can be folded.

The upper nano silver circuit pattern and the lower nano silver circuit pattern may be bent through the bending area and the upper nano silver circuit pattern and the lower nano silver circuit pattern may be formed of nano silver conductive material.

The third layer may further include an upper substrate on which the upper nano silver circuit pattern is formed, and the fourth layer may further include a lower substrate on which the lower nano silver circuit pattern is formed.

The upper and lower substrates may comprise a urethane film, sheath or fiber.

The upper nano silver circuit pattern and the lower nano silver circuit pattern may be prepared by preparing a nanosilver slurry containing an acidic solution and nanosilver particles of 1 nm to 20 nm dispersed in the acidic solution, And a lower substrate, respectively, and sintering the printed nanosilver slurry at a temperature of 90 ° C to 130 ° C.

The printing can be performed by an inkjet method, a screen method, a gravure method, a flexo method or an offset method.

The upper nano silver circuit pattern and the lower nano silver circuit pattern may have a thickness and a width of 0.1 mu m to 100 mu m, respectively.

The upper nanosilver circuit pattern and the lower nanosilver circuit pattern are supplied with a plurality of silver powders having a powder particle diameter ranging from 1 to 50 mu m from a silver powder supply unit and transfer the silver powder using a transfer gas, Impinging and breaking the silver powder onto the upper substrate and the lower substrate in the process chamber at a rate of 100 to 500 m / s to form a plurality of first nanosilver particles having a circuit pattern first particle size range, A circuit pattern in which a plurality of second nanosilver grains having a circuit pattern second particle diameter range larger than the particle diameter range is mixed is formed, wherein the first nanosilver particle has a first circuit particle diameter range of 1 nm to 900 nm, The second nanosilver particles have a second particle size range of 900 nm to 10 mu m and the number of the first nanosilver particles is one peak in the first particle size range, The number of silver particles can make one peak in the second particle size range.

The lower case is further coupled to the lower portion of the fourth layer, and the fan spring hinge can be further coupled between the bending region and the lower case.

A touch pad may further be coupled to a lower surface of the lower case.

The ultrathin pocket type keyboard device may be a wearable device that can be worn on the body.

Wherein the upper nano silver circuit pattern and the lower nano silver circuit pattern are prepared by preparing a silver paste containing nano silver particles, a urethane resin, a solution, a dispersant and an additive, printing the silver paste on the upper substrate and the lower substrate, And the sintered silver paste is sintered at a temperature of 90 ° C to 130 ° C for 10 minutes to 60 minutes.

The silver paste may further include micro silver particles.

The silver paste may be printed by a polyester mesh having a size of 350 mesh to 500 mesh.

Various embodiments of the present invention provide an ultra-thin pocket keyboard device. In other words, various embodiments of the present invention can be realized by using an nano-piezoelectric material to realize innovative thickness and weight, and also to form a circuit pattern of a folded-back bending region on a substrate such as a soft, thin and elastic urethane film, An ultra-slim pocket-type keyboard device capable of greatly improving the reliability of a bending region by realizing printing, sintering and / or jetting of a nano-conductive material.

In other words, the various embodiments of the present invention can significantly reduce the thickness / weight and / or weight of the foldable keyboard using a nano-piezoelectric material, and the thickness of the keytop at the time of unfolding is approximately 2.4 mm The present invention provides an ultra-slim pocket-type keyboard device that is small, foldable and has a thickness of less than about 5 mm.

In addition, various embodiments of the present invention provide a foldable ultra-thin pocket keyboard device, which greatly improves the reliability of the folded bending area. In particular, the number of times that the circuit pattern in the bending area can be broken is about 10,000 times in the related art, but increases to about 100,000 times in the embodiment of the present invention.

In addition, various embodiments of the present invention allow the printing technology of the nano-electroconductive material to be applied to various industrial devices, in addition to the keyboard, at the same time as reducing the price and doubling the reliability. Further, various embodiments of the present invention allow polar nano conductive materials to be printed on a cloth or a fiber instead of a flexible urethane film, so that they can be applied to various wearable circuits and switching circuits.

On the other hand, various embodiments of the present invention allow the outer case to be naturally unfolded when the keyboard is unfolded, by blending a composite material of urethane and rubber, which is bent and resilient, or by using a mechanical fan spring hinge.

1 is a schematic exploded perspective view showing an ultra slim pocket type keyboard device according to various embodiments of the present invention.
FIG. 2A is a view showing various aspects of an ultra slim pocket type keyboard device according to various embodiments of the present invention, and FIG. 2B is an enlarged sectional view of a region 2b in FIG. 2A.
3A is a diagram illustrating a bending region of an ultra slim pocket type keyboard device according to various embodiments of the present invention, and FIG. 3B is a photograph showing a pole silver nano silver conductive material and a common silver conductive material used in various embodiments of the present invention .
4A and 4B are photographs showing a folded state and a folded state of the touch pad of the ultra slim pocket type keyboard device according to various embodiments of the present invention.
5 is a flowchart showing an example of a method for forming a pole nano silver pattern in an ultra slim pocket type keyboard apparatus according to various embodiments of the present invention.
6 is a flowchart showing an example of a method for forming a pole nano silver pattern in an ultra slim pocket type keyboard apparatus according to various embodiments of the present invention.
7A and 7B are graphs showing the distribution of silver powder before and after shredding / colliding in the method shown in FIG.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

The embodiments of the present invention are described in order to more fully explain the present invention to those skilled in the art, and the following embodiments may be modified into various other forms, It is not limited to the embodiment. Rather, these embodiments are provided so that this disclosure will be more faithful and complete, and will fully convey the scope of the invention to those skilled in the art.

In the following drawings, thickness and size of each layer are exaggerated for convenience and clarity of description, and the same reference numerals denote the same elements in the drawings. As used herein, the term "and / or" includes any and all combinations of one or more of the listed items. In the present specification, the term " connected "means not only the case where the A member and the B member are directly connected but also the case where the C member is interposed between the A member and the B member and the A member and the B member are indirectly connected do.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms "a," "an," and "the" include singular forms unless the context clearly dictates otherwise. Also, " comprise, " and / or "comprising, " when used in this specification, are intended to be interchangeable with the said forms, numbers, steps, operations, elements, elements and / And does not preclude the presence or addition of one or more other features, integers, operations, elements, elements, and / or groups.

Although the terms first, second, etc. are used herein to describe various elements, components, regions, layers and / or portions, these members, components, regions, layers and / It is obvious that no. These terms are only used to distinguish one member, component, region, layer or section from another region, layer or section. Thus, a first member, component, region, layer or section described below may refer to a second member, component, region, layer or section without departing from the teachings of the present invention.

It is to be understood that the terms related to space such as "beneath," "below," "lower," "above, But may be utilized for an easy understanding of other elements or features. Terms related to such a space are for easy understanding of the present invention depending on various process states or use conditions of the present invention, and are not intended to limit the present invention. For example, if an element or feature of the drawing is inverted, the element or feature described as "lower" or "below" will be "upper" or "above." Thus, "lower" is a concept encompassing "upper" or "lower ".

In addition, the X and Y coordinates described herein refer to coordinates that are approximately perpendicular / perpendicular or 90 degrees to each other, and the X coordinates may be arranged in the horizontal direction, for example, and the Y coordinates may be arranged in the vertical direction have. In addition, the nano unit described herein means 1 nm to 999 nm, and the microunit can mean 1 to 999 탆.

1 is a schematic exploded perspective view showing an ultra slim pocket type keyboard device 100 according to various embodiments of the present invention.

1, an ultra-slim pocket-type keyboard apparatus 100 according to an embodiment of the present invention may include, for example and without limitation, a first layer 110 (Key Top Layer) A second layer 120 (Actuator Bump (Top Side)), a third layer 130 (Nano Silver Pattern + FSR + Film (Top Side)), a fourth layer 140 (Bottom Side), a fifth layer 150 (bottom layer), a sixth layer 160 (Pan Spring Hinge), a seventh layer 170 (Touch PAD) And a layer 180 (Bottom Case).

The first layer 110 (Key Top Layer) may include an embossing key 111 arranged in the X direction and the Y direction for improving the reliability of the key top and the key recognition capability. The embossing key 111 may be formed of, for example, but not limited to, an ultraviolet curable resin or a thermosetting / thermoplastic resin.

The second layer 120 is positioned at a lower portion of the first layer 110. The second layer 120 may be arranged in the form of a protrusion at the top The actuator bump 121 may include a plurality of actuators. Here, the actuator bump 121 may be formed in a region corresponding to the embossing key 111.

The third layer 130 (Nano Silver Pattern + FSR + Film (Top Side)) is located below the second layer 120. The third layer 130 receives an input signal of the Y coordinate among the components of the key metrics, And extracts the current change of the FSR 133 (Force Sensing Resistor or Nano-Piezoelectric Sensor) between the X coordinate and the Y coordinate as a key input signal at the time of key input. The third layer 130 may include an upper nano silver circuit pattern 132 in particular.

Here, the FSR 133 may mean, for example, a polymer urethane film whose resistance decreases as the force applied to the surface increases, although it is not limited. Compared with conductive rubber, there is little electrical hysteresis and the price is low. In addition, compared with Piezo Film, the FSR is inexpensive and has little influence on vibration and heat.

The fourth layer 140 (Nano Silver Pattern + Film (Bottom Side)) is positioned below the third layer 130, and receives the input signal of the X coordinate among the configurations of the key metrics . The fourth layer 140 may include a lower nano silver circuit pattern 141 and the lower nano silver circuit pattern 141 may lower the resistance value and may improve bending / refraction / bending reliability when folded. .

The fifth layer 150 is positioned below the fourth layer 140 to maintain the flatness of the patterned pattern printed circuit board PCB, And may include an epoxy urethane film to maintain the repulsive force of the input load.

The sixth layer 160 is positioned below the fifth layer 150. The sixth layer 160 includes a fan spring 161 for automatically opening the keyboard device 100 when the keyboard device 100 is opened, ), Which may include circular or elliptical embossing. Particularly, the fan spring 161 of the sixth layer 160 is installed in a region corresponding to the bending area 190 so that the keyboard device 100 can be flexibly folded or unfolded.

 The seventh layer 170 (Touch PAD) includes a touch pad 171 (Touch PAD) which is positioned below the sixth layer 160 and can be used on the rear surface (or / and front surface) of the keyboard device 100 And can be activated / deactivated automatically by recognizing when the keyboard is closed and opened.

The eighth layer 180 (bottom case) is disposed under the seventh layer 170 and is made of urethane, rubber, and / or the like, which can maintain proper tensile strength (elasticity) Lt; / RTI > Of course, the seventh layer 170 may be exposed through the eighth layer 180 to the outside.

As described above, the ultra-slim pocket type keyboard device 100 according to various embodiments of the present invention uses a piezoelectric urethane film and has a remarkably thin film thickness and a light weight compared to a general foldable keyboard.

In addition, the ultra-slim pocket-type keyboard apparatus 100 according to the embodiment of the present invention has a structure in which the thickness of the key top when unfolded is less than about 2.4 mm, and the thickness when folded is less than about 5 mm, .

In consideration of the fact that the internal circuit pattern should not be broken when folded and the number of times of bending / bending / bending (reliability) is very important, the ultra slim pocket type keyboard device 100 according to the embodiment of the present invention, The outer case can be blended with a synthetic material of urethane and rubber which maintains the bending elasticity so that the keyboard can be unfolded naturally when the keyboard device 100 is unfolded.

FIG. 2A is a view showing various aspects of an ultra slim pocket-type keyboard device 100 according to various embodiments of the present invention, and FIG. 2B is an enlarged cross-sectional view of a region 2b in FIG.

2A, an ultra slim pocket keyboard device 100 according to an embodiment of the present invention includes a linear bending region 190 that can be folded in a direction substantially perpendicular to the longitudinal direction. The first layer 110, the second layer 120, the third layer 130, the fourth layer 140, the fifth layer 150, and the eighth layer 180, Which may be referred to as a common bending area 190. The bending area < RTI ID = 0.0 > 190 < / RTI > In Fig. 2A, the dotted line indicated from the top to the bottom is the area corresponding to the bending area 190. Fig.

The pocket-type keyboard device 100 according to the embodiment of the present invention includes a magnet 9 for maintaining a folded state at one side (an approximately left region in FIG. 2A), and an LED (not shown) 10, and a micro USB jack 11 to which a micro USB device is coupled.

Reference numeral 13 denotes a left side view of the keyboard device 100. Reference numeral 14 denotes a plan view of the keyboard device 100. Reference numeral 15 denotes a front view of the keyboard device 100, Reference numeral 16 denotes a rear view of the keyboard device 100. Reference numeral 17 denotes a right side view of the keyboard device 100, and Fig. 18 denotes a bottom view of the keyboard device 100. Fig.

In addition, it can be seen that a touch pad 171 exposed to the outside through the eighth layer 180 is installed on the bottom surface of the ultra slim pocket type keyboard device 100.

2B, the ultra-slim pocket-type keyboard apparatus 100 according to the embodiment of the present invention includes a top cover case 1, a semiconductor and circuit components 2 (left side in FIG. 2B) ), And a printed circuit board 30 made of an epoxy material.

In addition, the ultra-slim pocket-type keyboard device 100 according to the embodiment of the present invention includes a first layer 110, a second layer 120, a third layer (not shown) 130, a fourth layer 140, a fifth layer 150, and an eighth layer 180 may be sequentially formed.

In particular, the first layer 110 may include an ultraviolet / thermal curable (or plastic) embossing key 111 (top layer), and the second layer 120 may include an active bump 121. The third layer 130 may include an upper substrate 131, an upper nano silver circuit pattern 132 and an FSR 133 sequentially from the upper side to the lower side. The fourth layer 140 may include, And the lower nano silver circuit pattern 141 and the lower substrate 142 sequentially in the lower direction. In addition, the fifth layer 150 may include an epoxy layer, and the eighth layer 180 may include a lower case.

In general, the bending region formed of FPCB (Flexible PCB) has a limitation of bending / refraction / bending reliability (a time when circuit patterns are broken) about 10,000 times. However, as in the embodiment of the present invention, The ultra slim pocket type keyboard apparatus 100 including the circuit patterns 132 and 141 can ensure bending / bending / bending reliability of about 100,000 times or more.

Thus, the ultra-slim pocket-type keyboard device 100 according to the present invention can integrate the bending area 190 and the nano-silver circuit patterns 132 and 141 by integrating the reliability of the nano-silver circuit pattern, ) Can be improved at the same time.

3a is a view of a bend area 190 of an ultra slim pocket keyboard device 100 according to various embodiments of the present invention and FIG. It is a photograph showing ashes.

3A, an ultra-slim pocket-type keyboard apparatus 100 according to an embodiment of the present invention includes a first layer 110, a second layer 120, a third layer 130, a fourth layer 140, And a bending region 190 having a linear shape in a direction substantially perpendicular to the longitudinal direction of the eighth layer 180 may be formed. The bending area 190 may be formed at about the middle of the longitudinal direction of the keyboard device 100, but the present invention does not limit the position of the bending area 190. The bending area 190 may be formed in an approximately 1/3 area or a 2/3 area in the longitudinal direction, for example.

On the other hand, a plurality of upper nano silver circuit patterns 132 are formed in the third layer 130 in a substantially longitudinal direction, for example, but not limited to, the upper nano silver circuit patterns 132, Region 190. In this way,

A plurality of lower nano silver circuit patterns 141 are formed in the fourth layer 140 in, for example, but not limited to, substantially the width direction. The plurality of lower nano silver circuit patterns 141 are bent Region 190. In this way,

Since the upper nano silver circuit pattern 132 and / or the lower nano silver circuit pattern 141 are formed of nano silver as a main material, they are excellent in ductility and adhesive strength without deteriorating the electrical conductivity, Peeling, peeling, peeling, and the like do not occur. Particularly, the upper nano silver circuit pattern 132 and / or the lower nano silver circuit pattern 141 are formed only in the area corresponding to the bending area 190, and the other area is a general low cost kappa or aluminum circuit pattern .

As shown in Fig. 3b, a pole nano silver material (e.g., 1 nm to 20 nm in size, left side view) is shown in comparison to a regular silver material (e.g., 1 袖 m to 100 袖 m in size, Its size is much smaller and has a near spherical characteristic. Generally, silver is known to have a melting point of about 961 DEG C, and flake silver powder is also known to start to melt at about 550 to 650 DEG C.

However, when the size of the silver powder is reduced to about 100 nm or less, it melts at about 150 ° C or less. Even 2 nm silver particles have their melting point down to room temperature.

As the size of the silver powder becomes nano-sized, the melting point is drastically lowered. This is thought to be due to the increase of the heat transfer area and the number of surface atoms and the increase of reactivity as the particle size becomes nano-sized.

As described above, in the embodiment of the present invention, the upper substrate 131 and / or the lower substrate 142 (for example, the upper substrate 131 and the lower substrate 142) are formed by using a nano-sized silver powder at a low temperature by printing, sintering, It is understood that the nano-silver circuit patterns 132 and 1141 can be formed on the urethane film, the coating, the fiber, and the like, respectively. Here, the base urethane film may mean, for example, a plastic substrate such as PET (polyethylene terephthalate), PI (polyimide), or PAN (polyacrylonitrile).

4A and 4B are photographs showing the touch pad 171 in the folded state and the folded state of the ultra slim pocket type keyboard device 100 according to various embodiments of the present invention.

As shown in FIG. 4A, an ultra slim pocket keyboard device 100 according to an embodiment of the present invention has a thickness of about 5 mm in the folded state and has a weight of less than about 100 g. 4B, since the touch pad 171 is positioned on the front / rear surface in the folded state, the ultrasonic pocket type keyboard device 100 according to the embodiment of the present invention is positioned in the folded state, You can do various input work such as computer and smart phone.

5 is a flowchart illustrating an example of a method for forming a pole nano silver pattern in an ultra slim pocket keyboard device 100 according to various embodiments of the present invention.

5, the upper nano silver circuit pattern 132 formed on the third layer 130 and the lower nano silver circuit pattern 141 formed on the fourth layer 140 are formed in the nano silver slurry preparation step S1, , A printing step (S2), and a sintering step (S3).

In the nanosilver slurry preparation step S1, for example, an acidic solution such as, but not limited to, neodecanoic acid having a relatively low decomposition temperature and an acidic solution, such as about 1 nm to 20 nm Lt; RTI ID = 0.0 > nanosilver < / RTI > Here, when oleic acid is used as the acidic solution, the melting point for the nanosilver particles of the above-mentioned size is increased up to about 250 DEG C, so that in the sintering step, the upper and lower substrates 131, 142 ) Is deformed.

In the printing step S2, the nanosilver slurry is printed and dried on the upper substrate 131 of the third layer 130 and the lower substrate 142 of the fourth layer 140, respectively. Here, the printed pattern is the same as the upper nano silver circuit pattern 132 and the lower nano silver circuit pattern 141 described above.

For example, and not by way of limitation, printing may be performed by an inkjet method, a screen method, a gravure method, a flexo method, or an offset method. Each of these printing methods has a different resolution and / or thickness that can be formed, and is appropriately selected in consideration of the thickness and width of a circuit pattern to be formed.

In the sintering step S3, the nanosilver slurry printed in the above-described manner is sintered at a temperature of 90 ° C. to 130 ° C. to form an upper nano silver circuit pattern 132 on the upper substrate 131, 142 to form the lower nano silver circuit pattern 141. [

Here, although the upper nano silver circuit pattern 132 and the lower nano silver circuit pattern 141 are formed at the same stage, they are merely examples, and it is natural that they can be formed in separate independent steps. This feature can be applied to the forming method described in Fig. 6 as well.

The above-described sintering step may be performed by a rapid thermal processing apparatus using a general infrared heater, but a method using a flash lamp may be used to minimize the thermal shock of the upper substrate 131 and the lower substrate 142. The flash lamp (e. G., A xenon flash lamp) emits energy sufficient to sinter the nanosilver slurry in one shot with an irradiation time of several microseconds, especially at this time the upper substrate 131 and the lower substrate < The thermal shock to the upper substrate 131 and the lower substrate 142 is minimized so that various types of the upper substrate 131 and the lower substrate 142 can be used.

On the other hand, the upper nano silver circuit pattern 132 and the lower nano silver circuit pattern 141 may be formed to have a thickness and width of about 0.1 to 100 m, respectively. If the thickness and width are less than about 0.1 占 퐉, there is a danger of disconnection in the bending region 190, and the electrical resistance is relatively large, and the battery consumption rate may be large. Also, if the thickness and width are larger than about 100 mu m, the printing and sintering time may be long and the yield of production may be lowered.

In addition, the upper and lower nanosilver circuit patterns 141 fabricated in the above-described manner have an electrical conductivity of about 2 to 4 x 10 ⁴ S / cm, which is a conductivity of bulk silver (6.21 x 10 ⁵ S / cm) But it is sufficient to be used in a conventional circuit pattern as a result of the deposited silver urethane film.

The upper nano silver circuit pattern 132 formed on the third layer 130 and the lower nano silver circuit pattern 141 formed on the fourth layer 140 are formed of nano silver particles (powder), urethane resin, solution, (Silver paste (slurry) preparation step S1) and a silver paste are printed on the upper substrate 131 and the lower substrate 142 respectively (printing step S2) (Sintering step (S3)) by sintering the printed silver paste at a temperature of 90 ° C to 130 ° C for 10 minutes to 60 minutes. Here, most of the processing conditions are similar to those described above. For example, the solution may be an acidic solution such as neodecanoic acid having a relatively low decomposition temperature, and the upper substrate 131 and the lower substrate 142 may be a urethane film, Lt; / RTI >

On the other hand, the silver paste may further include micro silver particles (powder). That is, the silver paste may include nanosilver particles of approximately 1 nm to 999 nm in size and micros silver particles of approximately 1 to 50 μm in size. In addition, the nano silver particles may be 70 wt% to 90 wt% and the micro silver particles may be 10 wt% to 30 wt% with respect to the total content. The upper nano silver circuit pattern 132 formed on the third layer 130 and the lower nano silver circuit pattern 141 formed on the fourth layer 140 by such process conditions are not limited to, And may have a hardness of 2H to 3H. By using the nano unit and the micro silver particles, the packing density is improved and the bending property is improved, so that the silver circuit pattern is not easily cracked or broken even when the substrate (film) is stretched.

Moreover, since the urethane film as the upper substrate / lower substrate has a porous surface, the adhesion and adhesion with the silver circuit pattern are remarkably excellent, so that even when the upper substrate / lower substrate is stretched, the silver circuit pattern is not easily cracked or broken , And is suitable for a wafer device.

Also, the silver paste can be printed on the upper substrate 131 and the lower substrate 142 made of urethane material by a polyester mesh having a size of about 350 mesh to 500 mesh.

In addition, the FSR 133 (e.g., carbon paste) can also be formed by screen printing, which is formed in the upper nano silver circuit pattern 132 by a mesh having a size of about 200 mesh to 300 mesh . The reason why the mesh of relatively low mesh is used in printing the FSR 133 is that the FSR 133 must be printed relatively thick to ensure the quality reliability of the FSR. This FSR 133 has a hardness of approximately 3H.

6 is a flowchart illustrating an example of a method for forming a pole nano silver pattern in an ultra slim pocket keyboard device 100 according to various embodiments of the present invention. 7A and 7B are graphs showing the distribution of silver powder before and after shredding / colliding in the method shown in FIG.

6, the upper nano silver circuit pattern 132 formed on the third layer 130 and the lower nano silver circuit pattern 141 formed on the fourth layer 140 are connected to the silver powder supply step S21 A silver powder transfer step S22, a silver powder collision / crushing step S23, and a silver circuit pattern formation step S24.

In the silver powder supplying step (S21) and the silver powder supplying step (S22), a plurality of silver powder having a powder particle size range of about 1 to 50 mu m is supplied from the silver powder supplying part, and silver powder is transferred do. Here, the transport gas may be, for example, but not limited to, helium, nitrogen, argon, oxygen, and air. Also, as shown in FIG. 7A, the silver powder may have a normal distribution characteristic with one peak in number.

In the silver powder collision / crushing step S23 and the silver circuit pattern formation step S24, the silver powder transferred as described above is applied to the upper substrate 131 and the lower substrate 142 in the process chamber at a rate of about 100 to 500 m / and a plurality of second nano silver particles having a circuit pattern second particle size range larger than the circuit pattern first particle size range, and a plurality of second nano silver particles having a circuit pattern second particle size range larger than the circuit pattern first particle size range Thereby forming a circuit pattern in a mixed form. That is, in the embodiment of the present invention, by filling the first nanosilver particles having a relatively small diameter with the first nanosilver particles between the second nanosilver particles having a relatively large second particle size range, The porosity of the pattern is as small as about 0.01% to 0.1%. This is similar to the principle of small porosity by sand filling between gravels.

In addition, in general, it has hitherto been known that when a silver powder is collided / crushed with a plastic substrate, the plastic substrate is etched without being deposited. However, when the powder size and the powder speed are used as in the embodiment of the present invention, The inventors have found that a coating layer of a certain thickness is formed or deposited. This is similar to the principle of gradually forming layers as some lumps of snow remain while some of the snow clusters collide / shatter on the walls and disappear as if the snow lumps are thrown on the wall.

Also, because the process chamber can be in a low vacuum or a non-vacuum state, a circuit pattern can be formed at a low cost, and the temperature of the transfer gas and the process chamber can be room temperature (approximately 10 ° C to 30 ° C) , It is possible to form a silver circuit pattern similar to a bulk state directly on the surface of the upper substrate 131 or the lower substrate 142 having a relatively low melting point such as a urethane film, a cloth or cloth in the embodiment of the present invention.

On the other hand, the first nanosilver particle may have a first particle size range of about 1 nm to 900 nm, and the second nanosilver particle may have a second particle size range of 900 nm to 10 μm. Also, the number of the first nanosilver particles may be one peak in the first particle size range, and the number of the second nanosilver particles may be one peak in the second particle size range. That is, as shown in FIG. 7B, the number of first nanosilver grains is larger than the number of second nanosilver grains in number, and has a normal distribution characteristic with one peak, and the number of second nanosilver grains is Is less than the number of 1-nano silver particles and has a normal distribution characteristic with one peak. Accordingly, since the first particles having a small size and a large number are mixed between the second particles having a large size and a small number of particles, a circuit pattern having a significantly small porosity (having a large electrical conductivity) is realized.

Thus, embodiments of the present invention provide nanosilver circuit patterns using nanosilver powders / particles that can be printed / sintered, sprayed and / or deposited at low temperatures to provide high electrical conductivity and ductility, It is possible to provide an ultrathin pocket type keyboard device 100 having excellent reliability in the bending area 190. [

It is to be understood that the present invention is not limited to the above-described embodiment, and that various changes and modifications may be made without departing from the scope of the present invention as defined in the appended claims. It will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention.

100; Ultra slim pocket keyboard device
110; A first layer 111; Embossing key
120; A second layer 121; Actuator bump
130; A third layer 131; Upper substrate
132; Upper nano silver circuit pattern
133; FSR 140; Fourth layer
141; Lower nano silver circuit pattern
142; A lower substrate 150; The fifth layer
160; A sixth layer 161; Fan spring
170; A seventh layer 171; Touchpad
180; An eighth layer 190; Bending area

Claims (14)

A first layer in which a plurality of embossing keys are arranged;
A second layer in which actuator bumps formed in a protruding shape at a position corresponding to the embossing key are arranged under the first layer;
A third layer having an upper nano silver circuit pattern formed to extract an Y-coordinate input signal out of the key matrix in the lower part of the second layer; And
And a fourth layer having a lower nano silver circuit pattern formed to extract an X-coordinate input signal of the key matrix below the third layer,
Wherein the first layer to the fourth layer further include a common bending region foldable in a direction perpendicular to the longitudinal direction. The method according to claim 1,
The upper nano silver circuit pattern and the lower nano silver circuit pattern may be bent through the bending area,
Wherein the upper nano silver circuit pattern and the lower nano silver circuit pattern are formed of a nano silver conductive material. The method of claim 3,
Wherein the third layer further comprises an upper substrate on which the upper nano silver circuit pattern is formed,
Wherein the fourth layer further comprises a lower substrate on which the lower nano silver circuit pattern is formed. The method of claim 3,
Wherein the upper substrate and the lower substrate comprise a urethane film, sheath or fiber. The method of claim 3,
The upper nano silver circuit pattern and the lower nano silver circuit pattern
An acidic solution and a nanosilver slurry containing nanosilver particles of 1 nm to 20 nm dispersed in the acidic solution were prepared,
The nano silver slurry is printed on the upper substrate and the lower substrate, respectively,
Wherein the printed nanosilver slurry is sintered at a temperature of 90 ° C to 130 ° C. 6. The method of claim 5,
Wherein the printing is performed by an inkjet method, a screen method, a gravure method, a flexo method, or an offset method. The method according to claim 1,
Wherein the upper nano silver circuit pattern and the lower nano silver circuit pattern have a thickness and a width of 0.1 mu m to 100 mu m, respectively. The method of claim 3,
The upper nano silver circuit pattern and the lower nano silver circuit pattern
A plurality of silver powders having a powder particle size range of 1 to 50 mu m are supplied from a silver powder supply unit, the silver powder is transferred using a transfer gas,
Impinging and transferring the transferred silver powder onto the upper substrate and the lower substrate in the process chamber at a speed of 100 to 500 m / s to form a plurality of first nanosilver particles having a circuit pattern first particle size range, Forming a circuit pattern in which a plurality of second nano silver particles having a circuit pattern second particle diameter range larger than the first particle diameter range are mixed,
Wherein the first nanosilver particle has a circuit pattern first particle diameter range of 1 nm to 900 nm and the second nanosilver particle circuit pattern has a second particle diameter range of 900 nm to 10 탆,
Wherein the number of the first nanosilver grains is one peak in the first diameter range and the number of the second nanosilver grains is one peak in the second diameter range. The method according to claim 1,
Wherein a lower case is further coupled to a lower portion of the fourth layer, and a fan spring hinge is further coupled between the bent region and the lower case. 10. The method of claim 9,
And a touch pad is further coupled to the lower surface of the lower case. The method according to claim 1,
Wherein the ultra-slim pocket type keyboard device is a wearable device that can be worn on the body. The method of claim 3,
The upper nano silver circuit pattern and the lower nano silver circuit pattern
A silver paste containing nanosilver particles, a urethane resin, a solution, a dispersant and an additive was prepared,
The silver paste is printed on the upper substrate and the lower substrate, respectively,
Wherein the printed silver paste is sintered at a temperature of 90 ° C to 130 ° C for 10 minutes to 60 minutes. 13. The method of claim 12,
Wherein the silver paste further comprises micro silver particles. 13. The method of claim 12,
Wherein the silver paste is printed by a polyester mesh having a size of from 350 mesh to 500 mesh.

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