KR20170060259A - Method of making LED taillights for vehicle - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a rear composite for a vehicle, and more particularly, to a method of manufacturing a rear composite for a vehicle, , And can be used to block infrared detection by minimizing heat generation by using an LED chip.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a rear composite for a vehicle, and more particularly, to a method of manufacturing a rear composite for a vehicle, , And can be used to block infrared detection by minimizing heat generation by using an LED chip.

Generally, the vehicle is provided with a headlight for ensuring a forward view at night, and a rear for identifying the vehicle at night and signaling a car following the braking of the vehicle, which is also referred to as a tail light.

As a related art related to the rear light, there is a taillight of a vehicle proposed in the Utility Model Registration No. 20-1997-0006283.

The utility model includes a case body having a half circle with a reflecting mirror formed thereon, a bulb provided at a central portion of the case body, and a lens fitted to the back surface of the case body, And a auxiliary filter having a flat portion and a concave portion for diffusing light between the lens and the case main body and having a yellow or red hue is provided. The service life is shortened, maintenance is required from time to time, condensation occurs due to the moisture remaining in the case body, and short-circuit is likely to occur. In the case of use in a military vehicle, There is a very weak problem.

To overcome such disadvantages, there is a rear taillight using a sulfur / red two-color LED device proposed in the registration utility model No. 20-0403331 as a conventional taillight.

In the utility model, a plurality of 3-terminal 2-color LEDs capable of representing yellow / red 2-color LEDs and 3-terminal 2-color LEDs connected in series to realize bidirectional serial connection of 3-terminal 2-color LEDs An LED vehicle tail lamp that can express two colors by connecting the (-) terminal of the LED connected to both ends of the color LED to the relay is proposed, and the yellow / red two LEDs are contacted by using the relay, However, there is a fear that the operation of the relay may not be smooth due to the vibration of the vehicle, and the life of the relay switch itself is also shortened when the vibration is repeated, so that maintenance is also needed from time to time.

Accordingly, the present invention is intended to provide a vehicle rear composite compound which prevents the breakage of frequent vibration and shocks by making the structures including the case solid and eliminating gaps when the components are combined, and at the same time, And a method for producing the same.

In addition, in the case of military vehicles, unpaved roads are frequently operated along with ordinary roads, and therefore, they are often operated at extreme temperatures. Even in such a case, they can withstand impact and vibration. Which is capable of intercepting a rear portion of a vehicle.

A manufacturing method of a rear composite for a vehicle according to the present invention is characterized by comprising a component preparing step of preparing a case, a back plate, a circuit board, a reflector, a lens, a filter and a cover, and a component joining step of joining the prepared components.

The manufacturing method of the rear composite according to the present invention makes the structures including the case robust and eliminates gaps when the components are coupled, thereby preventing breakage even in frequent vibration and impact, and also preventing intrusion of water or impurities In the case of military vehicles, unpaved roads are frequently operated along with ordinary roads, and many of them operate at extreme temperatures. In such a case, they can withstand impact and vibration. There is a remarkable effect that the occurrence of infrared rays can be blocked by minimizing the occurrence.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view of a vehicle rear composite vehicle produced by the present invention; Fig.
Figs. 2 and 3 illustrate an exploded view of a rear composite for a vehicle produced by the present invention
Fig. 4 is a partial schematic view of a vehicle rear composite vehicle produced by the present invention
Fig. 5 is a block diagram of a manufacturing process of a rear composite according to the present invention
Fig. 6 is a view showing a process for producing a part of the present invention

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a rear composite for a vehicle, and more particularly, to a method of manufacturing a rear composite for a vehicle, , And can be used to block infrared detection by minimizing heat generation by using an LED chip.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS First, an embodiment of a vehicle rear composite vehicle produced by the present invention will be described in detail with reference to the accompanying drawings.

Fig. 1 is a perspective view of a rear composite of the present invention produced by the present invention. Fig. 2 and Fig. 3 are sectional views of a rear composite etc. produced by the present invention. Fig. The back composite type vehicle according to the present invention includes a case 10 having an empty interior and a back plate 11 coupled to the case 10 and to which electric wires are fastened, A circuit board 14 coupled to the back plate 11 and having a plurality of LED chips 15 mounted thereon, and a plurality of LEDs 15 mounted on one side of the circuit board 14, A lens 18 disposed at one side of the reflector 17 for diffusing light emitted from the LED chip 15 and a lens 18 for reflecting the light emitted from the LED chip 15; And a cover (20) fixed to the case (10) It is characterized.

The case 10 may be made of a synthetic resin. However, if the case 10 is installed in a military vehicle, the case 10 may be used to operate a non- Since strong impact can be applied by running on the road, it is preferable to use die casting method by using aluminum alloy which can withstand shock and vibration.

A back plate 11 is coupled to the case 10. The back plate 11 fixes the circuit board 14 and the heat sink 22 and assembles parts such as the cover 20. [ And has a plate shape using synthetic resin.

In the shown back plate 11, a seating groove 13 is formed at one side, and a heat sink 22, which will be described later, is inserted into the back groove.

A circuit board 14 on which a plurality of LED chips 15 are mounted is coupled to one side of the back plate 11. The circuit board 14 has an LED chip mounted on a PCB substrate in an SMD manner.

A reflecting mirror 17 is provided on one side of the circuit board 14. The reflecting mirror 17 has a plurality of light transmitting holes 17a for allowing light to pass through the reflecting mirror 17 at regular intervals and is made of a translucent material And collects light emitted from the LED chip 15 and emits the light to the outside.

A lens 18 is provided at one side of the reflector 17 to determine the color and brightness of the LED chip 15 and the color of the LED chip 15 It plays a role to make red light appear when light emitted.

A cover 20 is formed at one side of the lens 18 and the cover 20 is fixed to the case 10 to fix the lens 18 and other components.

The rear composite produced by the present invention is preferably installed in a military vehicle rather than a general vehicle. In the case of a military vehicle, a rear service tail, a red service stop, Red Blackout Tail and Amber Blackout Stop should be displayed.

In other words, a commercial tail lamp is in a state displaying a red color like a general vehicle, a stop lamp is a red color such as a commercial tail lamp and is a red color having a higher luminance, and a light control indicator lamp has a minimum visible distance And so on. For this purpose, it is indicated in red, etc., and stoppage of lighting control is stopped in yellow to avoid enemy observation.

To this end, a filter 19 for expressing an equalization control stop light and an indicator of an equalization control is coupled to one side of the back plate 11 of the vehicle rear composite vehicle produced by the present invention.

That is, the filter 19 is a translucent synthetic resin having a white color, and transmits light emitted from the LED chip 15 to the outside. The LED chip 15 mounted on the circuit board 14 is connected to the backplate 11, And a cutout 16 is formed on the circuit board 14 at a position corresponding to the partition plate 12. The cutout 16 is formed at a position corresponding to the partition plate 12 on the circuit board 14. [

That is, the partition plate 12 is divided into the LED chip 15a for commercial tail lamp and stop, the LED chip 15b, 15c for displaying the lighting control indicator, And the circuit board 14 is formed in a position corresponding to the shape of the partition plate 12 so that the circuit board 14 and the back plate 11 are connected to each other It can be firmly fixed, and even if shock or vibration is applied, the combined position does not deviate.

The heat sink 22 is coupled to the seating groove 13 of the back plate 11 to rapidly cool the heat generated in the circuit board 14. [ That is, the heat dissipation plate 22 is coupled to the seating groove 13 in a state in which the heat dissipation plate 22 is in contact with a component such as a transistor or a diode formed on the circuit board 14, .

The electric wire 30 is connected to the back plate 11 as a connection jack 31 so that water or impurities can be introduced into the case 10, So that it is prevented from penetrating into the electric wire 30.

That is, the portion where the electric wire 30 and the case 10 are connected is a portion where the electric wire 30 is peeled off. Therefore, if water or impurities penetrate into this portion, a short circuit may occur. It is possible to prevent a short circuit or the like from being broken by providing a connection jack 31 made by using the above-

In addition, the circuit board 14 may be coated with transparent epoxy on one side or both sides of the circuit board 14 after the LED chip 15 is mounted, thereby preventing the LED chip 15 from being short-circuited.

That is, in the case of a rear lamp used in a vehicle, water, impurities or moisture may be infiltrated into the rear lamp according to the use environment. Particularly, when the temperature of the circuit board 14 is suddenly lowered due to exposure to air, Condensation may occur on the circuit board 14 due to the moisture. In this case, since the LED chip 15 mounted on the circuit board 14 may be damaged by a short circuit or the like, the epoxy may be applied to one side or both sides of the circuit board 14 to form the circuit board 14 Is prevented from being in contact with air, thereby preventing a short circuit.

In addition, an MLCC (multilayer ceramic capacitor) may be installed on one side of the circuit board 14 in order to cut off electromagnetic waves.

In other words, since a military vehicle can be exposed to electromagnetic waves due to detection devices such as an enemy radar, a MLCC (Multilayer Ceramic Capacitor) is installed at the output portion of the LED power source to remove noise from the output terminal, . ≪ / RTI >

Further, a gasket (21) is provided between the case (10) and the back plate (11) to prevent moisture or foreign matter from penetrating into the composite lamp.

FIG. 6 is a process flow diagram for manufacturing a part of the present invention. FIG. 6 is a view illustrating a process for manufacturing a rear composite according to the present invention. (S 10) for preparing the circuit board 14, the reflector 17, the lens 18, the filter 19 and the cover 20, and a component assembling step S 20 ).

The part to be prepared in the component preparation step S 10 includes a hemispherical case 10 in which the inside is hollow, a back plate 11 coupled to the case 10 and to which electric wires are fastened, A circuit board 14 coupled to the LED chip 15 and mounted on the circuit board 14 and having a plurality of LED chips 15 mounted thereon; A lens 18 disposed on one side of the reflecting mirror 17 for diffusing light emitted from the LED chip 15 and a reflecting mirror 17 for emitting light to the outside of the back plate 11, And a cover 20 for fixing the lens 18 and being coupled to the case 10. The filter 19 is a filter for displaying an illumination control stop light and an illumination control indicator.

As described above, when the case 10 is installed in a military vehicle, the case 10 may be subjected to a strong impact by running on unpaved roads or rough roads for operations. Therefore, an aluminum alloy having strength sufficient to withstand shock and vibration is used Die casting method is preferable, and if the outer surface and dimensions of the produced product are poor, a separate cutting process may be performed.

It is preferable that the back plate 11, the circuit board 14, the reflector 17, the lens 18, the filter 19 and the cover 20 are made of a synthetic resin material. It is preferable that the cover 20 is injected with a colorant of a dark color for the camouflage.

Referring to FIG. 6, the circuit board 14 prepared in the component preparation step S 10 includes a printed circuit board fabricating step (S 140) of fabricating a printed circuit board, And a wire connecting step (S143) for connecting the molten wire to the circuit board. The wire connecting step (S141) includes the steps of: A heat shrinking tube cutting and inserting step (S 144) for cutting the heat shrinking tube to fit the length of the electric wire and inserting the cut heat shrinking tube into the melted electric wire, and a heat shrinking tube And a heat shrinking step (S 145).

First, the printed circuit board manufacturing step (S 140) is a step of making a PCB substrate after designing a circuit to be manufactured. The component mounting step (S 141) is a step of mounting an LED chip, a transistor, , The substrate shown is a substrate mounted in the SMD type.

Next, the wire cutting and stripping step (S 142) is a step of cutting the coated wire to an appropriate length and removing the cover, which is conventionally used. It is a matter of course that a stripping process is unnecessary when the uncoated wire is used, S 143) is a step of connecting the melted wires to a circuit board by a method such as soldering. In the cutting and inserting step (S 144) of the heat-shrinkable tube, a tube which is shrunk when heat is applied is used to sandwich the entire melted wire And the heat shrinking step (S 145) is a step of applying appropriate heat to the heat-shrinkable tube sandwiched by the melted cable to completely close the heat-shrinkable tube and the electric wire.

The reason for using such a heat-shrinkable tube is to prevent the coating from being peeled off due to vibration and impact of the vehicle when a conventional wire is used and to prevent a short-circuit when the cover is peeled off.

After the heat shrinking step (S 145) is completed, the circuit board (14) is subjected to a coating layer forming step (S 146) for applying an epoxy, so that the circuit board (14) itself including the LED chip Thereby preventing a short circuit. That is, the coating layer coated with the epoxy prevents the circuit board 14 from coming into contact with air, thereby preventing a short circuit of components mounted on the circuit board. The epoxy can be used as a main component and the hardener can be mixed with epoxy , The mixing ratio is 80 to 120 weight ratio of the curing agent to 100 weight ratio of the epoxy, and the epoxy coating layer can be formed by natural drying for about 2 to 3 hours.

When the amount of the curing agent is less than 80 parts by weight based on 100 parts by weight of the epoxy, there is a fear that the curing time becomes long and the epoxy layer flows down, and the thickness of the coating layer is not uniformly formed. On the contrary, The strength of the coating layer may be relatively lowered, and if the use time after the curing is elapsed, the peeling phenomenon with the circuit board due to the vibration or impact of the vehicle may be severe, It is preferable to mix them at a ratio.

The component coupling step S 20 includes a step of coupling the heat sink 22 to the seating groove 13 of the back plate 11. The waterproof packing is inserted into the electric wire hole formed in the back plate, The back plate is fixed as a bolt, and the electric wire connected to the circuit board 14 is inserted into the electric wire hole.

That is, when the heat sink 22 is directly fixed to the PCB substrate, a load may be applied to the PCB substrate to deform the heat sink 22. The heat sink 22 is fixed to the seat groove 13 of the back plate 11 using bolts, It is preferable that the substrate is fixed in close contact with the heat sink.

A compound is applied to the outer surface of the transistor mounted on the circuit board 14 to increase the heat transfer rate and then the heat sink 22 and the circuit board 14 ) Can be tightly bonded to increase the heat radiation efficiency.

The compound is also referred to as a heat dissipation compound or a silicon compound, and is a substance used to rapidly transfer the heat of an electronic component to a heat sink.

In addition, a plurality of electric wire holes are formed on the back plate so that electric wires connected to the PCB substrate can pass through. By inserting the waterproof packing into the electric wire holes and passing the electric wires through the waterproof packing, water or impurities penetrate through the electric wire holes Can be prevented.

As a result, the method of manufacturing a rear composite for a vehicle according to the present invention makes it possible to prevent the breakage of frequent vibration and shocks by making the structures including the case robust and eliminating gaps in joining parts, and at the same time, In the case of military vehicles, unpaved roads are frequently operated along with ordinary roads. In many cases, they operate at extreme temperatures. In such a case, they can withstand shock and vibration, and use LED chips Thereby minimizing the generation of heat and thereby preventing infrared detection.

10. Case 10a. Power election entrance
11. Back plate 12. Compartment plate 13. Seat groove
14. circuit board 15. LED chip 16. cutout
17. Reflector 17a. Flood hole
18. Lens 19. Filter
20. Cover 21. Gasket 22. Heat sink

Claims (7)

In a method of manufacturing a rear composite for a vehicle and the like,
A component preparing step S 10 for preparing the case 10, the back plate 11, the circuit board 14, the reflector 17, the lens 18, the filter 19 and the cover 20, (S 20) for joining the components to each other.
The method according to claim 1,
The parts to be prepared in the component preparation step S 10 include a hemispherical case 10 in which an interior is hollow, a back plate 11 coupled to the case 10 and to which electric wires are fastened, A plurality of LED chips 15 mounted on the circuit board 14 and arranged on one side of the circuit board 14 so as to divide the light emitted from the LED chip 15 at regular intervals, A lens 18 installed at one side of the reflector 17 for diffusing light emitted from the LED chip 15 and a reflector 17 connected to one side of the backplate 11, And a cover (20) for fixing the lens (18) and engaging with the case (10). The method as claimed in claim 1, wherein the filter (19)
The method according to claim 1,
The back plate 11, the circuit board 14, the reflector 17, the lens 18, the filter 19 and the cover 20 are made of a synthetic resin material Wherein the preform is formed by injection molding.
The method according to claim 1,
The circuit board 14 prepared in the component preparation step S 10 includes a printed circuit board fabricating step S 140 for fabricating a printed circuit board, a component for mounting an LED chip, a transistor, and a diode on the fabricated printed circuit board A step S 141 of cutting and cutting the wire in accordance with the length, a step S 142 of cutting and removing the wire, a step S 143 of connecting the stripped wire to the circuit board, A heat shrinking step (S144) of inserting the cut heat-shrinkable tube into the electric wire having been cut and cut to fit the length of the heat-shrinkable tube, and a heat shrinking step (S145) of heating and shrinking the heat- Wherein the rear composite composite is formed of a synthetic resin.
The method according to claim 1,
The component assembling step S 20 includes a process of joining the heat sink 22 to the seating groove 13 of the back plate 11, the waterproof packing is inserted into the electric wire hole formed in the back plate, And the electric wire connected to the circuit board (14) is inserted in the electric wire hole.
The method according to claim 1,
The component joining step S 20 is a step of bonding the circuit board 14 and the heat radiating plate 22 in close contact with each other to apply a compound to the outer surface of the transistor mounted on the circuit board 14 in order to increase the heat transfer rate, (22) and the transistor of the circuit board (14) are brought into tight contact with each other to increase the heat radiation efficiency.
3. The method of claim 2,
After the heat shrinking step (S145) is completed, the circuit board (14) is subjected to an epoxy application step (S146) for applying epoxy to block the circuit board (14) itself including the LED chip from coming into contact with air, Of the rear composite body (2).

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