KR20170060247A - Semiconductor device - Google Patents
Semiconductor device Download PDFInfo
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- KR20170060247A KR20170060247A KR1020150164373A KR20150164373A KR20170060247A KR 20170060247 A KR20170060247 A KR 20170060247A KR 1020150164373 A KR1020150164373 A KR 1020150164373A KR 20150164373 A KR20150164373 A KR 20150164373A KR 20170060247 A KR20170060247 A KR 20170060247A
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- semiconductor device
- capacitor
- protrusion
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- H01L27/10855—
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- H01L21/28291—
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- H01L27/10867—
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- Thin Film Transistor (AREA)
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Abstract
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device, and more particularly, to a semiconductor device which improves a subthreshold slope (SS) characteristic of a transistor through coupling a transistor with a ferroelectric capacitor having a negative capacitance and can implement steep switching To a semiconductor device.
According to the present invention, A capacitor having a negative capacitance; And a connection portion for electrically connecting the transistor and the capacitor.
Description
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device, and more particularly, to a semiconductor device which improves a subthreshold slope (SS) characteristic of a transistor through coupling a transistor with a ferroelectric capacitor having a negative capacitance and can implement steep switching To a semiconductor device.
As interest in transparent optoelectronic devices has increased, research and development on transparent oxide semiconductors (TOS) is under way. Among various TOS, amorphous IZO (amorphous Indium Zinc Oxide) is attracting attention as an active layer material of a transparent thin film transistor. However, a thin film transistor using an oxide semiconductor material has a disadvantage that its driving voltage range is very wide and power consumption is high.
In general, it is known that when a transistor is miniaturized, the electrical characteristics of a transistor such as a threshold voltage and a subthreshold slope are deteriorated. It is also necessary to improve the subthreshold slope characteristic in order to lower the driving voltage of the transistor.
For example, Korean Patent Laid-Open No. 10-2015-0094783 entitled " Oxide for Semiconductor Layer of Thin Film Transistor and Sputtering Target and Thin Film Transistor " filed by Kobe Seiko Co., Ltd. and Samsung Display Co., (Patent Document 1) discloses an oxide for a thin film transistor capable of realizing high mobility and also excellent in stress resistance and a thin film transistor using the same.
However, in Korean Patent Laid-Open No. 10-2015-0094783, it is disadvantageous in that it is impossible to lower the driving voltage of the thin film transistor because it is evaluated that the subthreshold slope is less than 1 V / dec.
SUMMARY OF THE INVENTION It is an object of the present invention to provide a semiconductor device capable of improving the subthreshold slope characteristic of a transistor by connecting a ferroelectric capacitor having a negative capacitance to a transistor and implementing stiff switching.
According to an aspect of the present invention, A capacitor having a negative capacitance; And a connection part for electrically connecting the transistor and the capacitor.
In the semiconductor device according to the present invention, the capacitor may include a lower electrode having a protrusion; An insulating film disposed on a side surface of the protrusion; A ferroelectric layer disposed on the lower electrode except for the protrusions and the insulating film; An upper electrode disposed on the ferroelectric layer and positioned below the protrusion; And a conductive layer disposed on the upper electrode and applying a driving voltage to the upper electrode.
Further, in the semiconductor device according to the present invention, each of the lower electrode, the upper electrode, the conductive layer, and the connection portion may include a material selected from the group consisting of TiN, TaN, Pt, Au, have.
Further, in the semiconductor device according to the present invention, the insulating film may include a material selected from the group including SiO 2 , HfO 2 , Al 2 O 3, and high-k material.
In the semiconductor device according to the present invention, the ferroelectric layer may be formed of a material selected from the group consisting of P (VDF-TrFE) [poly (vinylidenefluoride-trifluoroethylene)], PZT (lead zirconate titanate) .
In the semiconductor device according to the present invention, the connection portion may connect the protrusion to the transistor.
In addition, in the semiconductor device according to the present invention, the transistor may include a thin film transistor.
In the semiconductor device according to the present invention, the transistor may include a back gate; A gate insulating film covering the back gate; A channel region disposed on the gate insulating film; And source and drain regions disposed on both sides of the channel region.
In addition, in the semiconductor device according to the present invention, each of the back gate, the source region, and the drain region may include a material selected from the group including TiN, TaN, Pt, Au, Al and polysilicon.
Further, in the semiconductor device according to the present invention, the gate insulating film may be formed from a group including SiO x , SiN x , Si 2 N 3 , HfO x and AlO x (where x is a real number greater than 0 and less than or equal to 4) And may include selected materials.
In addition, in the semiconductor device according to the present invention, the channel region may include a material selected from the group consisting of indium gallium zinc oxide (IGZO), indium zinc oxide (IZO), and ZnO.
Further, in the semiconductor device according to the present invention, the connection portion may connect the protrusion and the back gate.
Further, in the semiconductor device according to the present invention, the transistor may include: a back gate; A gate insulating film covering the back gate; A channel region disposed on the gate insulating film; And source and drain regions disposed on both sides of the channel region.
Further, in the semiconductor device according to the present invention, the connection portion may connect the protrusion and the back gate.
In the semiconductor device according to the present invention, the transistor may be disposed in parallel with the capacitor.
The present invention also provides a semiconductor device comprising: a plurality of transistors; A capacitor having a negative capacitance; And a connection part electrically connecting the plurality of transistors and the capacitor.
In the semiconductor device according to the present invention, the connection portion may include a decoding portion for applying a voltage from the capacitor to at least one of the plurality of transistors.
Further, in the semiconductor device according to the present invention, the capacitor may include: a lower electrode having a protrusion; An insulating film disposed on a side surface of the protrusion; A ferroelectric layer disposed on the lower electrode except for the protrusions and the insulating film; An upper electrode disposed on the ferroelectric layer and positioned below the protrusion; And a conductive layer disposed on the upper electrode and applying a driving voltage to the upper electrode.
Further, in the semiconductor device according to the present invention, each of the lower electrode, the upper electrode, the conductive layer, and the connection portion may include a material selected from the group consisting of TiN, TaN, Pt, Au, have.
Further, in the semiconductor device according to the present invention, the insulating film may include a material selected from the group including SiO 2 , HfO 2 , Al 2 O 3, and high-k material.
In the semiconductor device according to the present invention, the ferroelectric layer may include a material selected from the group consisting of P (VDF-TrFE), PZT, and BTO.
Further, in the semiconductor device according to the present invention, the connection portion may connect the protrusion to the plurality of transistors.
Further, in the semiconductor device according to the present invention, each of the plurality of transistors may include a thin film transistor.
Further, in the semiconductor device according to the present invention, each of the plurality of transistors includes: a back gate; A gate insulating film covering the back gate; A channel region disposed on the gate insulating film; And source and drain regions disposed on both sides of the channel region.
In addition, in the semiconductor device according to the present invention, each of the back gate, the source region, and the drain region may include a material selected from the group including TiN, TaN, Pt, Au, Al and polysilicon.
Further, in the semiconductor device according to the present invention, the gate insulating film may be formed from a group including SiO x , SiN x , Si 2 N 3 , HfO x and AlO x (where x is a real number greater than 0 and less than or equal to 4) And may include selected materials.
Further, in the semiconductor device according to the present invention, the channel region may include a material selected from the group including IGZO, IZO, and ZnO.
Further, in the semiconductor device according to the present invention, the connection portion may connect the protrusion and the back gate of each of the plurality of transistors.
Further, in the semiconductor device according to the present invention, each of the plurality of transistors includes: a back gate; A gate insulating film covering the back gate; A channel region disposed on the gate insulating film; And source and drain regions disposed on both sides of the channel region.
Further, in the semiconductor device according to the present invention, the connection portion may connect the protrusion and the back gate of each of the plurality of transistors.
Further, in the semiconductor device according to the present invention, each of the plurality of transistors may be disposed in parallel with the capacitor.
According to the present invention, by connecting a ferroelectric capacitor having a negative capacitance to a transistor, the subthreshold slope characteristic of the transistor can be improved and the stiff switching can be realized.
Particularly, it can be manufactured by using a manufacturing process of an existing transistor, and low power operation of the semiconductor device is possible.
BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a diagram showing an exemplary configuration of a semiconductor device according to an embodiment of the present invention. Fig.
2 is a diagram showing an exemplary configuration of a capacitor in a semiconductor device according to an embodiment of the present invention;
3 is a diagram showing an exemplary configuration of a transistor in a semiconductor device according to an embodiment of the present invention;
4 is a graph showing a relationship between a gate voltage and a drain current in an experimental example of a semiconductor device according to an embodiment of the present invention.
5 is a graph showing a relationship between a gate voltage and an internal voltage in an experimental example of a semiconductor device according to an embodiment of the present invention.
6 is a view showing an exemplary configuration of a semiconductor device according to another embodiment of the present invention;
Hereinafter, embodiments of the semiconductor device of the present invention will be described more specifically with reference to the accompanying drawings.
1 is a diagram showing an exemplary configuration of a semiconductor device according to an embodiment of the present invention. In Fig. 1, the shape or ratio of each part may differ from the actual shape or ratio for the sake of explanation. Also, parts irrelevant to the features of the invention may be omitted. These matters are the same in the following drawings.
Referring to FIG. 1, a semiconductor device according to the present invention includes a
The
The
The
The
2 is a diagram showing an exemplary configuration of a capacitor in a semiconductor device according to an embodiment of the present invention, and is a diagram showing a cross-sectional view of a capacitor.
2, the
The
The
The
The insulating
The insulating
The
The
The
The
The
The
Referring to FIGS. 1 and 2, the
3 is a diagram showing an exemplary configuration of a transistor in a semiconductor device according to an embodiment of the present invention, showing a cross-sectional view of a transistor.
The
Referring to FIG. 3, a thin film transistor in the form of a
Referring to FIG. 3, the
Back
The
Referring to FIGS. 1 and 3, the
The
The
A
Hereinafter, experimental results using a semiconductor device according to an embodiment of the present invention will be described in detail.
Particularly, in order to experimentally verify the influence of the
As the
P (VDF 0.75 -TrFE 0.25 ) was dissolved in methyl ethyl ketone (MEK) solvent to have 1.4 wt% (weight percent), and the solution was spin-coated while rotating the TiN substrate at 3000 rpm Respectively. Then annealed at < RTI ID = 0.0 > 150 C < / RTI > The upper electrode was then deposited using gold. The upper electrode was patterned using a shadow mask having a diameter of 0.2 mm.
As the
Then, the
4 is a graph showing a relationship between a gate voltage and a drain current in an experimental example of a semiconductor device according to an embodiment of the present invention.
4, the gate of the
Referring to FIG. 4, when the gate voltage is -7.5 V, the subthreshold slope (SS) value is about 342 mV / dec, when the gate voltage is not connected to the
As a result of the experiment, it was confirmed that the characteristics of the
5 is a graph showing a relationship between a gate voltage and an internal voltage in an experimental example of a semiconductor device according to an embodiment of the present invention. FIG. 5 shows the relationship between the gate voltage and the internal voltage when connected to a capacitor having a negative capacitance.
Referring to FIG. 5, it was observed that the internal voltage instantaneously rises when the gate voltage is -17.5 V, that is, when the drain current rapidly increases in FIG. For conventional MOSFETs, the internal voltage gain is less than one due to the voltage drop in the gate stack. However, in the experimental example of the semiconductor device according to the embodiment of the present invention, it is confirmed that the internal voltage gain is measured to be greater than 1 by the influence of the capacitor having the negative capacitance.
6 is a diagram showing an exemplary configuration of a semiconductor device according to another embodiment of the present invention.
Referring to FIG. 6, a semiconductor device according to another embodiment of the present invention includes a
6, a semiconductor device according to another embodiment of the present invention has a structure in which a plurality of
In the semiconductor device according to another embodiment of the present invention with reference to FIG. 6, the
2) of the
The
That is, the decoding unit selects at least a part of the plurality of
According to the present invention described above, the subthreshold slope characteristic of the transistor can be improved and the stiff switching can be realized by connecting the ferroelectric capacitor having a negative capacitance to the transistor.
Although the present invention has been described in detail, it should be understood that the present invention is not limited thereto. Those skilled in the art will appreciate that various modifications may be made without departing from the essential characteristics of the present invention. Will be possible.
Therefore, the embodiments disclosed in the present specification are intended to illustrate rather than limit the present invention, and the scope and spirit of the present invention are not limited by these embodiments. The scope of the present invention should be construed according to the following claims, and all the techniques within the scope of equivalents should be construed as being included in the scope of the present invention.
According to the present invention, by connecting a ferroelectric capacitor having a negative capacitance to a transistor, the subthreshold slope characteristic of the transistor can be improved and the stiff switching can be realized.
Particularly, it can be manufactured by using a manufacturing process of an existing transistor, and low power operation of the semiconductor device is possible.
100: Capacitor 110: Lower electrode
115: protrusion 130: insulating film
150: ferroelectric layer 170: upper electrode
190: conductive layer 200: transistor
210: back gate 230: gate insulating film
250: channel region 270: source region
290: drain region 300:
Claims (31)
A capacitor having a negative capacitance; And
A connection part electrically connecting the transistor and the capacitor,
.
The capacitor
A lower electrode having a protrusion;
An insulating film disposed on a side surface of the protrusion;
A ferroelectric layer disposed on the lower electrode except for the protrusions and the insulating film;
An upper electrode disposed on the ferroelectric layer and positioned below the protrusion; And
A conductive layer disposed on the upper electrode and applying a driving voltage to the upper electrode,
The semiconductor device comprising: a semiconductor substrate;
Wherein each of the lower electrode, the upper electrode, the conductive layer, and the connection portion comprises a material selected from the group consisting of TiN, TaN, Pt, Au, Al, and polysilicon.
The semiconductor device and the insulating film comprises a material selected from the group consisting of SiO 2, HfO 2, Al 2 O 3 and a high-k material.
Wherein the ferroelectric layer comprises a material selected from the group consisting of P (VDF-TrFE) [poly (vinylidenefluoride-trifluoroethylene)], PZT (lead zirconate titanate), BTO (barium titanate).
And the connection portion connects the protrusion and the transistor.
Wherein the transistor comprises a thin film transistor.
The transistor comprising:
Back gate;
A gate insulating film covering the back gate;
A channel region disposed on the gate insulating film; And
A source region and a drain region disposed on both sides of the channel region,
The semiconductor device comprising: a semiconductor substrate;
Wherein each of the back gate, the source region, and the drain region comprises a material selected from the group consisting of TiN, TaN, Pt, Au, Al, and polysilicon.
Wherein the gate insulating film comprises a material selected from the group consisting of SiO x , SiN x , Si 2 N 3 , HfO x, and AlO x (where x is greater than 0 and less than or equal to 4 real numbers) .
Wherein the channel region comprises a material selected from the group consisting of Indium Gallium Zinc Oxide (IGZO), IZO (Indium Zinc Oxide), and ZnO.
And the connecting portion connects the protrusion and the back gate.
The transistor comprising:
Back gate;
A gate insulating film covering the back gate;
A channel region disposed on the gate insulating film; And
A source region and a drain region disposed on both sides of the channel region,
The semiconductor device comprising: a semiconductor substrate;
And the connecting portion connects the protrusion and the back gate.
And the transistor is disposed in parallel with the capacitor.
A capacitor having a negative capacitance; And
And a connection portion electrically connecting the plurality of transistors and the capacitor,
.
And the connection portion includes a decoding portion for applying a voltage from the capacitor to at least one of the plurality of transistors.
The capacitor
A lower electrode having a protrusion;
An insulating film disposed on a side surface of the protrusion;
A ferroelectric layer disposed on the lower electrode except for the protrusions and the insulating film;
An upper electrode disposed on the ferroelectric layer and positioned below the protrusion; And
A conductive layer disposed on the upper electrode and applying a driving voltage to the upper electrode,
The semiconductor device comprising: a semiconductor substrate;
Wherein each of the lower electrode, the upper electrode, the conductive layer, and the connection portion comprises a material selected from the group consisting of TiN, TaN, Pt, Au, Al, and polysilicon.
The semiconductor device and the insulating film comprises a material selected from the group consisting of SiO 2, HfO 2, Al 2 O 3 and a high-k material.
Wherein the ferroelectric layer includes a material selected from the group consisting of P (VDF-TrFE), PZT, and BTO.
And the connection portion connects the protrusion and the plurality of transistors.
And each of the plurality of transistors includes a thin film transistor.
Wherein each of the plurality of transistors includes:
Back gate;
A gate insulating film covering the back gate;
A channel region disposed on the gate insulating film; And
A source region and a drain region disposed on both sides of the channel region,
The semiconductor device comprising: a semiconductor substrate;
Wherein each of the back gate, the source region, and the drain region comprises a material selected from the group consisting of TiN, TaN, Pt, Au, Al, and polysilicon.
Wherein the gate insulating film comprises a material selected from the group consisting of SiO x , SiN x , Si 2 N 3 , HfO x, and AlO x (where x is greater than 0 and less than or equal to 4 real numbers) .
Wherein the channel region comprises a material selected from the group consisting of IGZO, IZO, and ZnO.
And the connecting portion connects the protrusion and the back gate of each of the plurality of transistors.
Wherein each of the plurality of transistors includes:
Back gate;
A gate insulating film covering the back gate;
A channel region disposed on the gate insulating film; And
A source region and a drain region disposed on both sides of the channel region,
The semiconductor device comprising: a semiconductor substrate;
And the connecting portion connects the protrusion and the back gate of each of the plurality of transistors.
And each of the plurality of transistors is disposed in parallel with the capacitor.
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USD970750S1 (en) * | 2020-02-26 | 2022-11-22 | Sus Co., Ltd. | Smoking booth |
USD971439S1 (en) * | 2020-02-26 | 2022-11-29 | Sus Co., Ltd. | Smoking booth |
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USD970750S1 (en) * | 2020-02-26 | 2022-11-22 | Sus Co., Ltd. | Smoking booth |
USD971439S1 (en) * | 2020-02-26 | 2022-11-29 | Sus Co., Ltd. | Smoking booth |
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