KR20170051140A - optical integrated circuit package - Google Patents

Abstract

An optical integrated circuit package of the present invention includes: an optical integrated circuit including an optical integrated circuit board; an electric integrated circuit device located on the optical integrated circuit board; at least one optical element located on the optical integrated circuit board spaced apart from the electric integrated circuit element; an optical interface located on one side of the optical integrated circuit board; an electrical interface located on the other side of the optical integrated circuit board; and a sealing member for sealing the optical integrated circuit, the electric integrated circuit element, the optical element, the optical interface, and the electrical interface. The present invention minimizes the electronic device.

Description

An optical integrated circuit package

Technical aspects of the present invention relate to an optical integrated circuit package, and more particularly, to an optical integrated circuit package implemented in an optical integrated circuit board.

It is required that signal transmission be speeded up to cope with the demand for downsizing and speeding up of electronic devices. Since electric signals are transmitted through wirings such as copper wires and there is a limit to high speed, a signal transmission method using an optical signal is required. Accordingly, an optical integrated circuit package for transmitting an optical signal is required.

SUMMARY OF THE INVENTION An object of the present invention is to provide an optical integrated circuit package that can meet the demand for miniaturization and speeding up of electronic devices.

According to an aspect of the present invention, there is provided an optical integrated circuit package comprising: an optical integrated circuit including an optical integrated circuit board; An electric integrated circuit device located on the optical integrated circuit board; At least one optical element located on the optical integrated circuit board away from the electric integrated circuit element; An optical interface located at one side of the optical integrated circuit board; An electrical interface located on the other side of the optical integrated circuit board; And a sealing member sealing the optical integrated circuit, the electric integrated circuit element, the optical element, the optical interface, and the electrical interface.

In an embodiment of the technical concept of the present invention, the optical integrated circuit board may be a silicon semiconductor substrate. The optical integrated circuit board may be a III-V semiconductor substrate.

In one embodiment of the technical concept of the present invention, the optical integrated circuit may include a wiring pad formed on the optical integrated circuit board. The electrical interface may be electrically connected to the wiring pads.

In one embodiment of the technical concept of the present invention, the electrical interface may be composed of a flexible printed circuit board.

In one embodiment of the technical concept of the present invention, the optical integrated circuit may include an optical waveguide and an optical coupler formed on the optical integrated circuit board. The optical interface may be optically coupled to the optical waveguide through the optical coupler.

In one embodiment of the technical concept of the present invention, the optical element may include an all-optical conversion element, a photoelectric conversion element, or a light modulation element. The electro-optic conversion element may be formed inside the optical integrated circuit board.

In one embodiment of the technical concept of the present invention, the optical interface may be an optical fiber array or an optical fiber array including a plurality of optical fibers. The optical fiber may include an inclined cross section for changing a path of input / output light.

In an embodiment of the technical concept of the present invention, the optical interface may be composed of a receptacle connector and an alignment element.

In one embodiment of the technical concept of the present invention, a heat sink which is in contact with a lower portion of the optical integrated circuit board may be further provided. The sealing member can seal the heat sink while contacting both sides of the heat sink. The inside of the sealing member may be filled with an air layer, a nitrogen layer or a vacuum layer. The sealing member may be filled with a transparent material layer.

In one embodiment of the technical concept of the present invention, the optical integrated circuit is located in a base printed circuit board, the electrical interface is electrically connected to a wiring pad of the base printed circuit board, Can be located on the substrate.

An optical integrated circuit package according to an embodiment of the present invention includes an optical integrated circuit including an optical integrated circuit board; An electric integrated circuit device located on the optical integrated circuit board and electrically connected to a wiring line of the optical integrated circuit board; At least one optical element for processing an optical signal and an electrical signal in the optical integrated circuit; An optical interface located at one side of the optical integrated circuit board and optically connected to the optical integrated circuit and the optical element; An electrical interface located on the other side of the optical integrated circuit board and electrically connected to the electrical integrated circuit element and the optical element; And a sealing member sealing the optical integrated circuit, the electric integrated circuit element, the optical element, the optical interface, and the electrical interface.

In one embodiment of the technical concept of the present invention, the electrical interface may be electrically connected to a circuit wiring line of the optical integrated circuit board.

In one embodiment of the technical concept of the present invention, the optical interface may be optically connected to the optical waveguide of the optical integrated circuit board. The optical interface may be an optical fiber or an optical fiber array attached on the optical integrated circuit.

According to an embodiment of the present invention, the optical interface may include a receptacle connector for inserting a plug connector from the outside, and an aligning element for aligning light input and output through the receptacle connector. The alignment element may be a planar optical waveguide element. The alignment element may include an optical multiplexer and a demultiplexer.

In one embodiment of the technical concept of the present invention, the optical element may include an all-optical conversion element, a photoelectric conversion element, or a light modulation element. The optical interface may transmit an optical signal modulated by the optical modulation device to the outside or an externally modulated optical signal to the photoelectric conversion device. The electrical interface may transmit the electrical signal converted from the photoelectric conversion element to the outside or receive an external electrical signal to the electrical integrated circuit element.

In one embodiment of the technical concept of the present invention, a heat sink which is in contact with a lower portion of the optical integrated circuit board may be further provided.

An optical integrated circuit package according to an embodiment of the present invention includes an optical integrated circuit including an optical integrated circuit board; An electric integrated circuit device located on the optical integrated circuit board and electrically connected to a wiring line of the optical integrated circuit board; A first optical element integrated in the optical integrated circuit board to generate an optical signal; A second optical device positioned on the optical integrated circuit board to process an optical signal and an electrical signal; An optical interface located at one side of the optical integrated circuit board and optically connected to the optical integrated circuit, the first optical device and the second optical device; An electrical interface located on the other side of the optical integrated circuit board and electrically connected to the electrical integrated circuit, the first optical device, and the second optical device; And an encapsulating member sealing the optical integrated circuit, the electric integrated circuit element, the first optical element, the second optical element, the optical interface, and the electrical interface.

In an embodiment of the technical concept of the present invention, the optical integrated circuit board includes an optical waveguide and an optical coupler, and the first optical element is an all-optical conversion element optically aligned with the optical waveguide through the optical coupler Lt; / RTI >

In one embodiment of the technical concept of the present invention, the second optical element may include a light modulation element and a photoelectric conversion element.

In one embodiment of the present invention, a heat sink is further provided in contact with the lower portion of the optical integrated circuit board, and the sealing member can seal the heat sink while contacting the both sides of the heat sink .

An optical integrated circuit package according to the technical idea of the present invention includes an optical integrated circuit board. An electrical integrated circuit located on the optical integrated circuit board, and an optical interface and an electrical interface implemented on the optical integrated circuit board.

Accordingly, the optical integrated circuit package of the technical idea of the present invention can mount various optical elements on an optical integrated circuit board, can easily perform optical and electrical connection with an external device, It can meet the demand for miniaturization and high speed.

1 is a sectional view of an optical integrated circuit package according to an embodiment of the technical idea of the present invention.
2 is a perspective view showing a connection relationship between an optical integrated circuit of the optical integrated circuit package of FIG. 1 and an optical interface and an electrical interface.
3 is a plan view for explaining an electrical and optical connection between an optical element and an electric integrated circuit element of the optical integrated circuit package of FIG.
Figs. 4 to 6 are plan views illustrating various embodiments of the optical waveguide of the optical integrated circuit package of Fig. 1. Fig.
7 is a cross-sectional view illustrating one embodiment of an optical coupler of the optical integrated circuit package of FIG.
8 is a view for explaining the principle of optical coupling through the optical coupler of FIG.
9 is a plan view illustrating an optical integrated circuit package according to an embodiment of the present invention.
FIG. 10 is a diagram for explaining signal flow of optical elements and electric integrated circuit elements located in the optical integrated circuit of FIG. 9; FIG.
11 is a cross-sectional view of an optical integrated circuit package according to an embodiment of the present invention.
12 is a cross-sectional view of an optical integrated circuit package according to an embodiment of the technical idea of the present invention.
13 is a perspective view showing an example of the alignment element of Figs. 11 and 12. Fig.
14 is a plan view for explaining an optical integrated circuit package according to an embodiment of the technical idea of the present invention.
15 is a sectional view for explaining an optical integrated circuit package according to an embodiment of the technical idea of the present invention
16 is a cross-sectional view illustrating an optical integrated circuit package according to an embodiment of the present invention.
17 is a view for explaining an optical integrated circuit system including an optical integrated circuit package according to an embodiment of the present invention.
18 is a view for explaining an optical integrated circuit system including an optical integrated circuit package according to an embodiment of the present invention.
19 is a view for explaining an optical integrated circuit system including an optical integrated circuit package according to an embodiment of the present invention.
20 is a view for explaining an optical integrated circuit system including an optical integrated circuit package according to an embodiment of the present invention.
21 is a block diagram illustrating a computer system including an optical integrated circuit package according to an embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

The embodiments of the present invention are described in order to more fully explain the present invention to those skilled in the art, and the following embodiments may be modified into various other forms, It is not limited to the embodiment. Rather, these embodiments are provided so that this disclosure will be more thorough and complete, and will fully convey the scope of the invention to those skilled in the art. In the drawings, the thickness and size of each layer are exaggerated for convenience and clarity of explanation.

It is to be understood that throughout the specification, when an element such as a film, an area, or a substrate is referred to as being "on", "connected to", or "coupled to" another element, May be interpreted as being "on", "connected", or "coupled" to another element, or there may be other elements intervening therebetween. On the other hand, when one element is referred to as being "directly on", "directly connected", or "directly coupled" to another element, it is interpreted that there are no other components intervening therebetween do. Like numbers refer to like elements.

Although the terms first, second, etc. are used herein to describe various elements, components, regions, layers and / or portions, these members, components, regions, layers and / It is obvious that no. These terms are only used to distinguish one member, component, region, layer or section from another region, layer or section. Thus, a first member, component, region, layer or section described below may refer to a second member, component, region, layer or section without departing from the teachings of the present invention.

Also, relative terms such as "top" or "above" and "under" or "below" can be used herein to describe the relationship of certain elements to other elements as illustrated in the Figures. Relative terms are intended to include different orientations of the device in addition to those depicted in the Figures. For example, in the figures the elements are turned over so that the elements depicted as being on the top surface of the other elements are oriented on the bottom surface of the other elements. Thus, the example "top" may include both "under" and "top" directions depending on the particular orientation of the figure. If the elements are oriented in different directions (rotated 90 degrees with respect to the other direction), the relative descriptions used herein can be interpreted accordingly.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms "a," "an," and "the" include singular forms unless the context clearly dictates otherwise. Also, " comprise "and / or" comprising "when used herein should be interpreted as specifying the presence of stated shapes, numbers, steps, operations, elements, elements, and / And does not preclude the presence or addition of one or more other features, integers, operations, elements, elements, and / or groups.

The following embodiments of the invention are described with reference to the drawings schematically illustrating ideal embodiments of the present invention. In the figures, for example, variations in the shape shown may be expected, depending on manufacturing techniques and / or tolerances. Accordingly, the embodiments of the present invention should not be construed as limited to the particular shapes of the regions shown herein, but should include, for example, changes in shape resulting from manufacturing.

The following embodiments of the present invention may be implemented by any one of them, and the following embodiments may be implemented by combining one or more of them. Therefore, the technical idea of the present invention is not limited to only one embodiment.

1 is a sectional view of an optical integrated circuit package according to an embodiment of the technical idea of the present invention.

Specifically, the optical integrated circuit package 1000 may include an optical integrated circuit 100 including the optical integrated circuit board 102. [ The optical integrated circuit 100 may be called an interposer. The optical integrated circuit board 102 may be composed of a silicon semiconductor substrate. The optical integrated circuit board 102 may be a III-V semiconductor substrate. An optical waveguide 104 and an optical coupler 106 may be formed on the optical integrated circuit board 102.

Although the optical waveguide 104 and the optical coupler 106 are illustrated as being formed inside the optical integrated circuit board 102 as shown in the sectional view of FIG. 1, the optical waveguide 104 and the optical coupler 106 are formed on the optical integrated circuit board 102). ≪ / RTI > The optical coupler 106 may be a vertical optical coupler. The optical waveguide 104 may be a passage through which light (or an optical signal) travels. The optical coupler 106 can couple the light traveling in the horizontal direction of the optical integrated circuit board 102 in the vertical direction.

An electronic integrated circuit device (EICD) 200 may be located on the optical integrated circuit board 102. The electric integrated circuit device 200 can be attached to the optical integrated circuit board 102 using the adhesive layer 202. [ The connection pad 204 of the electric integrated circuit device 200 may be electrically connected to the first wiring pad 108 formed on a part of the optical integrated circuit board 102.

At least one optical device 300 may be installed on the optical integrated circuit board 102 apart from the electrical integrated circuit device 200. The optical element 300 may be attached to the optical integrated circuit board 102 using an adhesive layer 302. The optical element 300 may include an all-optical conversion element, a photoelectric conversion element, or a light modulation element. The optical element 300 of FIG. 1 may include an electro-optic conversion element 310, for example, a laser diode element. The light (or optical signal) generated in the electro-optical converting element 310 can be transmitted to the optical waveguide 104 through the optical coupler 106.

An optical interface 400 may be installed on one side of the optical integrated circuit board 102. The optical interface 400 may be adhered to the optical integrated circuit board 102 using an adhesive layer 402. The optical interface 400 may be optically coupled to the optical integrated circuit board 102. The optical interface 400 may be optically coupled to the optical waveguide 104 via the optical coupler 106. [

The optical interface 400 may be composed of one optical fiber 404. The optical fiber 404 may be protected by a protective layer 406. The optical interface 400 may be an optical fiber array including a plurality of optical fibers as described later. The optical fiber 404 may include an inclined section 408 that changes the path of the input and output light as indicated by the arrows.

An electrical interface 500 may be provided on the other side of the optical integrated circuit board 102. The electrical interface 500 may be electrically connected to the second wiring pads 110 formed on the optical integrated circuit board 102. The electrical interface 500 may comprise a flexible printed circuit board 502. The first connection pad 504 formed on one side of the flexible printed circuit board 502 may be electrically connected to the second wiring pad 110. [

The first wiring pads 108 and the second wiring pads 110 may or may not be electrically connected to each other through circuit wiring lines (not shown). The second connection pad 506 formed on the other side of the flexible printed circuit board 502 may be connected to an external base printed circuit board. The second connection pad 506 may be electrically connected to the second wiring pad 110. An electrical signal through the second connection pad 506 may be transmitted to the second wiring pad 110 through the flexible printed circuit board 502.

If necessary, a heat sink 700 that is in contact with the optical integrated circuit board 102 may be provided under the optical integrated circuit board 102. The heat sink 700 may serve to discharge heat generated in the optical integrated circuit 100 to the outside.

The optical integrated circuit package 1000 includes a sealing member 600 sealing the optical integrated circuit 100, the electric integrated circuit element 200, the optical element 300, the optical interface 400, and the electric interface 500 . In one embodiment, the interior of the sealing member 600 may be filled with an air layer, a nitrogen layer, or a vacuum layer. In one embodiment, the sealing member 600 may be filled with a layer of transparent material. When the heat sink 700 is provided, the sealing member 600 can seal the heat sink 700 while contacting both sides of the heat sink 700. [

As described above, the optical integrated circuit package 1000 includes the optical integrated circuit board 102. An electrical integrated circuit device 200 positioned on the optical integrated circuit substrate 102 and an optical interface 400 and an electrical interface 500 formed on the optical integrated circuit substrate 102. [

Accordingly, the optical integrated circuit package 1000 can mount various optical elements on the optical integrated circuit board 102, can easily perform optical and electrical connection with external devices, 400) to meet the demand for downsizing and speeding up of the electronic device. In addition, the optical integrated circuit package 1000 improves the optical and electrical connection between the optical integrated circuit board 102 and the optical interface 400 and the electrical interface 500, thereby improving the quality of signal transmission.

2 is a perspective view showing a connection relationship between an optical integrated circuit of the optical integrated circuit package of FIG. 1 and an optical interface and an electrical interface.

Specifically, the optical interface 400 may be installed on one side of the optical integrated circuit board 102 constituting the optical integrated circuit 100. A plurality of optical couplers 106 may be formed on the optical integrated circuit board 102. The optical interface 400 may be an optical fiber array 408 including a plurality of optical fibers 404. The optical fiber array 408 may be protected by a protective layer 406.

Accordingly, the optical fiber array 408 can be optically coupled to the optical couplers 106. [ In other words, the optical fiber array 408 and the optical couplers 106 can communicate light (or optical signals) with each other.

An electrical interface 500 may be provided on the other side of the optical integrated circuit board 102. The electrical interface 500 may comprise a flexible printed circuit board. A plurality of second wiring pads 110 may be formed on the other side of the optical integrated circuit board 102.

First connection pads 504 and second connection pads 506 may be provided on one side and the other side of the flexible printed circuit board 502, respectively. The first connection pads 504 may be electrically connected to the second wiring pads 110. The second connection pads 506 may be connected to an external base printed circuit board. The base printed circuit board may be a circuit board of an application module (or an application). The first connection pads 504 and the second connection pads 506 may be electrically connected through an interface wiring line (not shown).

Accordingly, the electrical interface 500 can be electrically connected to the optical integrated circuit board 102. In other words, an electrical signal through the second connection pad 506 of the electrical interface 500 can be transmitted to the second wiring pad 110 through the flexible printed circuit board 502.

3 is a plan view for explaining an electrical and optical connection between an optical element and an electric integrated circuit element of the optical integrated circuit package of FIG.

Specifically, as described above, the optical integrated circuit package 1000 includes the optical integrated circuit 100, the electric integrated circuit elements 200 and the optical elements 300, the electric interface 500, the optical interface 400, (700).

An electric signal transmitted through the interface wiring line 503 of the electrical interface 500 can be received by the electric integrated circuit element 200 and the optical element 300 through the circuit wiring line 103. [ When the optical element 300 is an all-optical converting element, for example, a laser diode element, the optical signal generated in the optical element 300 is transmitted through the optical waveguide 104 to the optical fiber array 408 or the optical fiber 404, respectively.

On the other hand, an optical signal received through the optical fiber array 408 or the optical fiber 404 constituting the optical interface 400 from outside is received by the optical element 300, for example, the photoelectric conversion element through the optical waveguide 104 . The photoelectric conversion element may be a photodiode element. The electric signal converted in the optical element 300 can be transmitted to the outside through the interface wiring line 503 of the electric interface 500 through the electric integrated circuit element 200. [

Figs. 4 to 6 are plan views illustrating various embodiments of the optical waveguide of the optical integrated circuit package of Fig. 1. Fig.

Specifically, the optical waveguide 104 of FIG. 1 may include optical waveguides 104a, 104b, and 104c in FIGS. 4 to 6, Y is the depth direction and X is the width direction.

4, the optical waveguide 104a may include a core layer 1004a arranged in a slab shape in a one-dimensional plane on the lower cladding layer 1002a and the lower cladding layer 1002a, An air layer may be used as the upper cladding layer, but is not limited thereto. In this case, since the refractive index changes only in the depth direction Z, the optical signal passing through the optical waveguide 104a is refracted in the depth direction Z only. 4, the optical signal inputted from one side can be outputted to the other side.

5, the optical waveguide 104b may include a core layer 1004b disposed in a channel shape in a lower cladding layer 1002b and a lower cladding layer 1002b, and an air layer may be used as an upper cladding layer But is not limited thereto. In this case, the refractive index changes in the depth direction Z and the width direction X of the channel. 5, the optical signal inputted from one side can be outputted to the other side.

Referring to FIG. 6, the optical waveguide 104c may include a core layer 1004c disposed in a channel type branching from the lower cladding layer 1002c and the lower cladding layer 1002c, But it is not limited thereto. 6, the optical signal inputted from one side is outputted to the other side, and the optical waveguide 104c can be branched into two optical signals inputted.

7 is a cross-sectional view illustrating one embodiment of an optical coupler of the optical integrated circuit package of FIG.

Specifically, the optical coupler 106 may be a grating coupler. The optical coupler 106 can be realized by forming gratings, that is, gratings G1 and G2 at one end of the optical waveguide. The optical coupler 106 can transmit and receive light by using the characteristic of diffracting light while meeting the gratings G1 and G2 and can filter light by adjusting the intervals of the gratings G1 and G2.

The size of the grating formed on the optical coupler 106, that is, the grating period can be determined by the width w of the incident light and the wavenumber vector (k-vector). Accordingly, by forming a grating suitable for the optical coupler 106, the incident light can be optically coupled to the optical coupler 106 with high optical coupling efficiency.

8 is a view for explaining the principle of optical coupling through the optical coupler of FIG.

Specifically, the optical coupling condition using the optical coupler 106 of FIG. 7 will be described below. First, in order to optically couple the incident light to the optical coupler 106 with a high optical coupling efficiency, the phases must agree with each other. Such a phase matching condition is expressed by Equation (1) below.

[Equation 1]

? v =? 0 +? 2? /?

Where v is an integer, [Lambda] represents the period of the grating, [beta] v represents the phase of the v-th mode, and [beta] represents the phase of the fundamental mode.

The guiding condition, which is a condition for the incident light to be confined to the waveguide, is expressed by Equation (2) below.

&Quot; (2) "

? m =? n3sin? m = (2? /? n3) sin? m

Here, m is an integer,? Represents a wavelength of the m-th mode light, and? Is a reciprocal of a wavelength as a wave number. Further,? M is the refractive index condition value of the mth mode light, and? M is the incident angle of the mth mode light. 8, w denotes the width of the incident light, n1 denotes the refractive index of the lower cladding layer, n2 denotes the refractive index of the core layer, and n3 denotes the refractive index of the outer or upper cladding layer. In order for the incident light to be guided to the waveguide, the relation of κn3 <αm <κn2 must be satisfied.

9 is a plan view illustrating an optical integrated circuit package according to an embodiment of the present invention.

Specifically, the optical integrated circuit package 1100 of Fig. 9 may be the same as the optical integrated circuit package 1000 of Figs. 1 to 8 except for the optical elements 300-1 and 300-2. The optical integrated circuit package 1100 of Fig. 9 is for explaining the electrical and optical connection between the optical devices 300-1 and 300-2 and the electric integrated circuit device 200. [ In FIG. 9, the same reference numerals as those in FIGS. 1 to 8 denote the same members, and a duplicate description will be simply described or omitted.

The optical integrated circuit package 1100 includes the optical integrated circuit 100, the electrical integrated circuit elements 200, the optical elements 300-1 and 300-2, the electrical interface 500, the optical interface 400, and the heat sink 700). The optical elements 300-1 and 300-2 can be classified into a first optical element 300-1 and a second optical element 300-2 for convenience.

The first optical device 300-1 may be an all-optical converter (LD), for example, a laser diode device capable of generating light (or optical signal). The second optical element 300-2 may include an optical modulator element (MOD) 320 and a photoelectric conversion element (PD) 330 capable of processing an optical signal and an electrical signal. The photoelectric conversion element 330 may be a photodiode element.

The electric signal transmitted through the interface wiring line 503 of the electric interface 500 is transmitted to the electric integrated circuit element 200, the electro-optical conversion element 310 and the optical modulator element 320 through the circuit wiring line 335 . The all-optical converting element 310 may generate an optical signal and be transmitted to the optical modulator element 320.

The optical modulator device 320 modulates an optical signal according to an electrical signal transmitted through the circuit wiring line 335 and transmits the modulated optical signal to the optical interface 400 through the optical waveguide 104. The modulated optical signal can be transmitted to the outside through the optical fiber array 408 of the optical interface 400 or the optical fiber 404. The electric integrated circuit element 200 can control the electro-optical conversion element 310 through the circuit wiring line 335 as needed.

The optical signal received through the optical fiber array 408 or the optical fiber 404 constituting the optical interface 400 from the outside can be received by the photoelectric conversion element 330 through the optical waveguide 340. The photoelectric conversion element 330 can convert the optical signal into an electric signal and transmit the electric signal to the electric interface 500 through the electric integrated circuit element 200 and the circuit wiring line 335. [ The electrical signal can be transmitted to the outside via the interface wiring line 503 of the electrical interface 500. [

Thus, the optical integrated circuit package 1100 can be used in an optical transceiver that transmits or receives an optical signal. In addition, the optical integrated circuit package 1100 includes a plurality of optical elements 300-1 and 300-2 to facilitate optical and electrical connection with an external device, and includes an optical interface 400, It is possible to meet the demand for downsizing and speeding up of the apparatus.

FIG. 10 is a diagram for explaining signal flow of optical elements and electric integrated circuit elements located in the optical integrated circuit of FIG. 9; FIG.

Specifically, an electric integrated circuit device 200, an electro-optic conversion device 310, an LD, and an optical modulator device (MOD) 320 may be installed in the optical integrated circuit 100. As described above, the electric integrated circuit device 200, the electro-optic conversion device 310, the LD, and the optical modulator device (MOD) 320 may be attached on the optical integrated circuit board.

The electrical integrated circuit device 200 may generate the transmission electrical signals VD based on the transmitted transmission data MI. The optical modulator element 320 can modulate the optical signal LI received from the electro-optic conversion element 310 according to the transmitted electrical signals VD to generate a modulated optical signal LM. The modulated optical signal LM may be transmitted to an external device or a base printed circuit board or the like.

11 is a cross-sectional view of an optical integrated circuit package according to an embodiment of the present invention.

Specifically, the optical integrated circuit package 1200 may be the same as the optical integrated circuit package 1000 of FIGS. 1 to 8 except for the optical interface 400-1. In Fig. 11, the same reference numerals as those in Figs. 1 to 8 denote the same members, and a duplicate description will be simply described or omitted for convenience.

The optical integrated circuit package 1200 includes the optical integrated circuit 100, the electric integrated circuit element 200, the optical element 300, the electrical interface 500, the optical interface 400-1, and the heat sink 700 can do.

The optical interface 400-1 can be adhered to the optical integrated circuit board 102 using the adhesive layer 402. [ The optical interface 400-1 may include a receptacle connector 414, a lens 412, and an alignment element 410. The lens 412 can be selectively installed.

The receptacle connector 414 may be located on the alignment element 410. The receptacle connector 414 can be inserted with a plug connector (not shown) from the outside so as to transmit the optical signal. The alignment element 410 can align the light entering and exiting through the receptacle connector 414. The alignment element 410 may be a planar optical waveguide element. The alignment device 410 may include an optical waveguide having a refractive index similar to that of the core layer of the optical fiber. The alignment device 410 may include an inclined cross-section 408 that changes the path of the input / output light. The alignment device 410 may be provided with an optical multiplexer and a demultiplexer as described later.

The light (or optical signal) transmitted through the receptacle connector 414 can be transmitted to the optical coupler 106 through the lens 412 and the alignment device 410 as shown by the arrows. Accordingly, the optical interface 400-1 can be optically connected to the optical waveguide 104 through the optical coupler 106. [ The optical interface 400-1 may be optically connected to the optical integrated circuit board 102. [

12 is a cross-sectional view of an optical integrated circuit package according to an embodiment of the technical idea of the present invention.

Specifically, the optical integrated circuit package 1300 may be the same as the optical integrated circuit package 1000 of FIGS. 1 to 8 except for the optical interface 400-2. In FIG. 12, the same reference numerals as those in FIGS. 1 to 8 denote the same members, and a duplicate description will be simply described or omitted.

The optical integrated circuit package 1300 includes the optical integrated circuit 100, the electric integrated circuit element 200, the optical element 300, the electrical interface 500, the optical interface 400-2, and the heat sink 700 can do.

The optical interface 400-2 can be adhered to the optical integrated circuit board 102 using the adhesive layer 402. [ The optical interface 400-1 may include a receptacle connector 414-1, and an alignment element 410-1.

The receptacle connector 414-1 may be located at one side of the alignment element 410-1. When the receptacle connector 414-1 is not positioned on the alignment element 410 as shown in FIG. 11, the package height can be lowered and the light alignment can be facilitated.

The receptacle connector 414-1 can be inserted with a plug connector from the outside so as to transmit an optical signal. The alignment element 410-1 can align the light input / output through the receptacle connector 414. The alignment element 410-1 may be a planar optical waveguide element. The alignment device 410-1 may include an inclined cross-section 408 that changes the path of input / output light.

The light (or optical signal) transmitted through the receptacle connector 414-1 can be transmitted to the optical coupler 106 through the alignment device 410-1 as shown by the arrows. Accordingly, the optical interface 400-2 can be optically connected to the optical waveguide 104 through the optical coupler 106. [ The optical interface 400-2 may be optically connected to the optical integrated circuit board 102. [

13 is a perspective view showing an example of the alignment element of Figs. 11 and 12. Fig.

Specifically, the alignment devices 410 and 410-1 can be constituted by planar optical waveguide devices as described above. The alignment devices 410 and 410-1 may include a lower cladding layer 431, a plurality of alignment optical waveguides 433, an upper cladding layer 435, and leads 437 and lid. The alignment devices 410 and 410-1 may be made of a transparent material in a wavelength band of 1300 nm to 1600 nm, such as silicon nitride and silicon oxide. The optical waveguides of the alignment elements 410 and 410-1 may have a refractive index similar to that of the core layer of the optical fiber.

The alignment elements 410 and 410-1 may be referred to as alignment chips. The alignment optical waveguide 433 may be implemented on the lower cladding layer 431. [ The leads 437 may or may not be formed as needed.

The receptacle connector 414 may be positioned on the alignment device 410 as shown in FIG. The receptacle connector 414-1 may be positioned at one side of the alignment device 410-1 as shown in FIG.

As described above, the optical signal transmitted through the receptacle connector 414-1 can be transmitted through the alignment optical waveguide 435 to the optical waveguide formed on the optical integrated circuit board.

14 is a plan view for explaining an optical integrated circuit package according to an embodiment of the technical idea of the present invention.

Specifically, the optical integrated circuit package 1400 may be the same as the optical integrated circuit package 1100 of FIG. 9, except for the optical interface 400-2. The optical integrated circuit package 1400 is for explaining the electrical and optical connections between the optical devices 300-1 and 300-2 and the electric integrated circuit device 200. [

The optical integrated circuit package 1400 is for explaining an optical connection using the optical interface 400-2 of FIG. In FIG. 14, the same reference numerals as those in FIG. 9 denote the same members, and a redundant description will be simply described or omitted.

The optical integrated circuit package 1400 includes the optical integrated circuit 100, the electric integrated circuit elements 200, the optical elements 300-1 and 300-2, the electrical interface 500, the optical interface 400-2, Sink 700 as shown in FIG. The optical elements 300-1 and 300-2 can be classified into a first optical element 300-1 and a second optical element 300-2 for convenience.

The first optical device 300-1 may be an all-optical converter (LD), for example, a laser diode device capable of generating light (or optical signal). The second optical element 300-2 may include an optical modulator element (MOD) 320 and a photoelectric conversion element (PD) 330 capable of processing an optical signal and an electrical signal. The photoelectric conversion element 330 may be a photodiode element.

The electric signal transmitted through the interface wiring line 503 of the electric interface 500 is transmitted to the electric integrated circuit element 200, the electro-optical conversion element 310 and the optical modulator element 320 through the circuit wiring line 335 . The all-optical converting element 310 may generate an optical signal and be transmitted to the optical modulator element 320.

The optical modulator device 320 modulates an optical signal according to an electric signal transmitted through the circuit wiring line 335 and transmits the modulated optical signal to the optical interface 400-2 through the optical waveguide 104. [ The modulated optical signal can be transmitted to the outside through the alignment element 410-1 of the optical interface 400-2 and the receptacle connector 414-1. The electric integrated circuit element 200 can control the electro-optical conversion element 310 through the circuit wiring line 335 as needed.

The optical signal received through the receptacle connector 414-1 and alignment element 410-1 constituting the optical interface 400 from outside is received by the photoelectric conversion element 330 through the optical waveguide 340 . The photoelectric conversion element 330 can convert the optical signal into an electric signal and transmit the electric signal to the electric interface 500 through the electric integrated circuit element 200 and the circuit wiring line 335. [ The electrical signal can be transmitted to the outside via the interface wiring line 503 of the electrical interface 500. [

15 is a cross-sectional view illustrating an optical integrated circuit package according to an embodiment of the present invention.

Specifically, the optical integrated circuit package 1500 may be the same as the optical integrated circuit package 1000 of FIG. 1 except for the optical elements 310-1 and 300. FIG. In FIG. 15, the same reference numerals as those in FIG. 1 denote the same members, and a redundant description will be simply described or omitted.

The optical integrated circuit package 1500 includes the optical integrated circuit 100, the electric integrated circuit elements 200, the optical elements 310-1 and 300, the electrical interface 500, the optical interface 400, and the heat sink 700. [ . &Lt; / RTI &gt;

At least one optical device (OD) 300 may be installed in the optical integrated circuit board 102. The optical elements 310-1 and 300 may include an electro-optic conversion element 310, for example, a laser diode element. The light (or optical signal) generated in the electro-optic conversion element 310-1 can be transmitted to the optical waveguide 104 through the optical coupler 106. [

When the optical elements 310-1 and 300 are formed in the optical integrated circuit board 102 as described above, the optical alignment between the optical waveguide 104 and the optical elements 310-1 and 300 can be facilitated, The optical element formation region and the electric integrated circuit element formation region can be secured on the integrated circuit substrate 102. [

16 is a cross-sectional view illustrating an optical integrated circuit package according to an embodiment of the present invention.

Specifically, the optical integrated circuit package 1600 may be identical except that it further includes a base printed circuit board 710 as compared to the optical integrated circuit package 1000 of FIG. In FIG. 16, the same reference numerals as those in FIG. 1 denote the same members, and a duplicate description will be simply described or omitted.

The optical integrated circuit package 1600 may further include a base printed circuit board 710. The base printed circuit board 710 may be a circuit board of an application module (or an application device). The optical integrated circuit 100 may be located within the base printed circuit board 710. The second connection pad 506 of the electrical interface 500 may be electrically connected to the wiring pads 720 of the base printed circuit board 710. The optical interface 400 may be located on the base printed circuit board 700.

Thus, the optical integrated circuit package 1600 can be mounted on the base printed circuit board 710, and various optical elements and electric elements can be mounted on the base circuit board 710 to be modularized.

17 is a view for explaining an optical integrated circuit system including an optical integrated circuit package according to an embodiment of the present invention.

Specifically, FIG. 15 may be provided to illustrate an optical integrated circuit system 1700 including the optical integrated circuit packages 1200, 1300, 1400 of FIGS. 11-14. The optical integrated circuit system 1700 includes a plurality of electrical integrated circuit elements (EICD, 200_1 to 200_n), a plurality of optical modulator elements (MOD, 320_1 to 320_n), a plurality of photoelectric conversion elements (PDs 330_1 to 330_n) Alignment elements 410 and 410-1, and receptacle connectors 414 and 414-1.

The alignment devices 410 and 410-1 may include an optical signal multiplexer 461 and an optical signal demultiplexer 464 (DEMUX). For the sake of convenience in the optical integrated circuit system 1700, all-optical conversion elements are not shown.

The plurality of optical modulator elements MOD_3_1_1 to 320_n are connected to transmission optical signals modulated based on the transmission electrical signals MI_1 to MI_n received from the plurality of electrical integrated circuit elements (EICD, 200_1 to 200_n) (LT_1 to LT_n), respectively. At this time, each of the modulated transmission optical signals LT_1 to LT_n may be an optical signal having different wavelengths.

The optical signal multiplexer 461 included in the alignment devices 410 and 410-1 generates the multiplexed optical signal using the modulated transmission optical signals LT_1 to LT_n and the receptacle connectors 414, 414-1 to the external device or the base printed circuit board.

The multiplexed optical signal transmitted from the external device via the receptacle connectors 414 and 414-1 may be provided to the optical signal demultiplexer 464 (DEMUX) included in the alignment devices 410 and 410-1. The optical signal demultiplexer 464 can demultiplex the multiplexed optical signals received from the receptacle connectors 414 and 414-1 into modulated reception optical signals LR_1 to LR_n. At this time, each of the modulated reception optical signals LR_1 to LR_n may be an optical signal having different wavelengths.

The plurality of photoelectric conversion elements PD 330_1 to 330_n respectively generate the modulated received electrical signals MO_1 to MO_n on the basis of the modulated optical signals LR_1 to LR_n, Device (EICD, 200_1 to 200_n).

18 is a view for explaining an optical integrated circuit system including an optical integrated circuit package according to an embodiment of the present invention.

Specifically, the optical integrated circuit system 2000 includes a central processing unit (CPU) 2002 capable of communicating with at least one memory module 2008 via the connection system 2013. [ Memory module 2008 may be, for example, a dual in-line memory module (DIMM). The DIMM may be a DRAM module. Memory module 2008 may include a plurality of discrete memory circuits 2020, e.g., DRAM memory circuits.

In this embodiment, the CPU 2002 and the memory module 2008 generate or process electric signals. The connection system 2013 may include an optical communication channel 2012, for example, an optical fiber, for transferring an optical signal between the CPU 2002 and the memory module 2008.

Since the CPU 2002 and the memory module 2008 use electrical signals, electro-optical conversion is required to convert the electrical signals of the CPU 2002 and the memory module 2008 into optical signals for transmission on the optical communication channel. Further, the photoelectric conversion is required to convert the optical signal on the optical communication channel 2012 to the CPU 2002 and the memory module 2008 into electric signals for processing.

The connection system 2013 may include optical integrated circuit packages 2004, 2006 on both sides of the optical communication channel 2012 according to an embodiment of the technical idea of the present invention. The optical communication channel 2012 may be an optical interface of the optical integrated circuit package of the technical concept of the present invention.

The CPU 2002 can transmit and receive an electric signal to and from the optical integrated circuit package 2004 via the electric bus 2010. [ The memory module 2008 transmits and receives electric signals to and from the optical integrated circuit package 2006 via the electric bus 2014. The optical integrated circuit packages 2004 and 2006 can transmit and receive optical signals to each other. The electric buses 2010 and 2014 may be the electrical interface of the optical integrated circuit package of the technical concept of the present invention.

The optical integrated circuit package 2004 may include a photoelectric conversion element 2016 and an electro-optic conversion element 2017. The optical integrated circuit package 2006 may include a photoelectric conversion element 2018 and an electro-optic conversion element 2019. All-light conversion elements 2017 and 2019 can transmit optical signals toward the optical communication channel 2012, for example, an optical fiber. The photoelectric conversion elements 2016 and 2018 can receive optical signals from the optical communication channel 2012. [

19 is a view for explaining an optical integrated circuit system including an optical integrated circuit package according to an embodiment of the present invention.

Specifically, the optical integrated circuit system 2050 includes a CPU 2052 that is capable of communicating with at least one memory module 2058 via a connection system 2063. Memory module 2058 may be, for example, a dual in-line memory module (DIMM). The memory module 2058 may be, for example, a DRAM module. Memory module 2058 may include a plurality of discrete memory circuits 2070, e.g., DRAM memory circuits.

In this embodiment, the CPU 2052 and the memory module 2058 can generate and process electric signals and optical signals. In the embodiment of FIG. 19, the optical integrated circuit packages 2076 and 2082 of the technical concept of the present invention are implemented in the CPU 2052 and the memory module 2058.

The CPU 2052 may include an optical integrated circuit package 2076 and the memory module 2058 may include an optical integrated circuit package 2082. [ The optical integrated circuit package 2076 may include a photoelectric conversion element 2077 and an all-optical conversion element 2079. The optical integrated circuit package 2082 may include a photoelectric conversion element 2083 and an all-optical conversion element 2081.

The CPU 2052 includes an electrical circuit 2078 and communicates with the electrical integrated circuit package 2076 and electrical signals from the optoelectronic integrated circuit package 2076 via the electrical bus 2080. Memory circuitry 2070 in the memory module 2058 and communicates with the electrical signals from the opto-integrated circuit package 2082 and toward the opto-integrated circuit package 2082 via the electrical bus 2084. [ The electrical buses 2080 and 2084 may be electrical interfaces of the opto-integrated circuit package of the technical concept of the present invention.

The connection system 2063 includes an optical communication channel 2062 and the optical communication channel 2062 carries an optical signal between the CPU 2052 and the memory module 2058. The optical communication channel 2062 may be, for example, an optical fiber. The optical communication channel 2062 may be an optical interface of the optical integrated circuit package of the technical concept of the present invention.

The CPU 2052 may include an optical connector 2072. The optical connector may be a receptacle connector of the technical concept of the present invention. The optical signal is transmitted from the optical integrated circuit package 2076 to the optical communication channel 2062 through the optical connector 2072. [ Also, the optical signal is transmitted from the optical communication channel 2062 side through the optical connector 2072 to the optical integrated circuit package 2076.

The memory module 2058 includes an optical connector 2074. The optical signal is transmitted from the optical integrated circuit package 2082 to the optical communication channel 2062 through the optical connector 2074. [ Optical signals may also be transmitted from the optical communication channel 2062 side to the opto-integrated circuit package 2082 through the optical connector 2074.

20 is a view for explaining an optical integrated circuit system including an optical integrated circuit package according to an embodiment of the present invention.

Specifically, the optical integrated circuit system 2100 may include a CPU 2102 that is capable of communicating with at least one memory module 2108 via an access system 2113. Memory module 2108 may be, for example, a dual in-line memory module (DIMM). The memory module 2108 may be a DRAM module. Memory module 2108 may include a plurality of discrete memory circuits 2120, e.g., DRAM memory elements.

In this embodiment, the CPU 2102 and the memory module 2108 can generate and process electric signals and optical signals. In the embodiment of FIG. 20, the optical integrated circuit packages 2115 and 2121 of the present invention are implemented in the CPU 2102 and the individual memory elements 2120.

The optical integrated circuit package 2115 may include a photoelectric conversion element 2116 and an all-optical conversion element 2117. The optical integrated circuit package 2121 may include a photoelectric conversion element 2123 and an all-optical conversion element 2126.

The CPU 2102 includes an optical integrated circuit package 2115 and each of the memory circuits 2120 can include an optical integrated circuit package 2121. [ The CPU 2102 includes an electrical circuit 2128 and communicates with the electrical integrated circuit package 2115 via the electrical bus 2130 and with electrical signals from the optoelectronic integrated circuit package 2115.

Each memory circuit 2120 includes an electrical circuit 2127 and communicates with the electrical signals from the opto-integrated circuit package 2121 and toward the opto-integrated circuit package 2121 via the electrical bus 2125. The electrical buses 2125 and 2130 may be electrical interfaces of the opto-integrated circuit package of the present invention.

The wiring system 2113 includes an optical communication channel 2112 and the optical communication channel 2112 carries an optical signal between the CPU 2102 and the memory module 2108. The optical communication channel 2112 may be, for example, an optical fiber. The optical communication channel 2112 may be an optical interface of the optical integrated circuit package of the technical concept of the present invention. The CPU 2102 includes an optical connector 2122.

The optical signal is transmitted from the optical integrated circuit package 2115 to the optical communication channel 2112 through the optical connector 2122. [ In addition, the optical signal is transmitted from the optical communication channel 2112 side to the optical integrated circuit package 21115 through the optical connector 2122. [

The memory module 2108 includes an optical connector 2124. The optical signal is transmitted from the optical integrated circuit package 2121 to the optical communication channel 2112 through the optical connector 2124 and the optical bus 2134. [ Also, the optical signal is transmitted from the optical communication channel 2112 side through the optical connector 2124 to the optical integrated circuit package 2121.

21 is a block diagram illustrating a computer system including an optical integrated circuit package according to an embodiment of the present invention.

In particular, computer system 2200 may include any type of signal processing system, display system, communication system, or other system in which signals may be transmitted optically.

Computer system 2200 may include a processor 2210 that is capable of communicating with other elements by optical bus 2250. [ The processor 2210 may include an optical integrated circuit package 2202 according to the technical concept of the present invention.

Semiconductor memory device 2220 is coupled to optical bus 2250. The semiconductor memory device 2220 may include an optical integrated circuit package according to the present invention. Accordingly, semiconductor memory device 2220 can communicate with other elements by optical bus 2250. Power supply 2240 can communicate with other elements via optical bus 2250. The user interface 2230 may provide input / output to and from the user.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims. will be. It is to be understood that the above-described embodiments are illustrative and non-restrictive in every respect. The true scope of the present invention should be determined by the technical idea of the appended claims.

The present invention relates to an optical integrated circuit package and a method of manufacturing the same, and more particularly, to an optical integrated circuit package, Fiber, 500: electrical interface, 502: flexible printed circuit board, 600: sealing member, 700: heat sink,

Claims (20)

An optical integrated circuit including an optical integrated circuit board;
An electric integrated circuit device located on the optical integrated circuit board;
At least one optical element located on the optical integrated circuit board away from the electric integrated circuit element;
An optical interface located at one side of the optical integrated circuit board;
An electrical interface located on the other side of the optical integrated circuit board; And
And an encapsulating member sealing the optical integrated circuit, the electric integrated circuit element, the optical element, the optical interface, and the electrical interface. The optical integrated circuit package according to claim 1, wherein the optical integrated circuit board is composed of a silicon semiconductor substrate or a III-V semiconductor substrate. The package according to claim 1, wherein the optical integrated circuit includes a wiring pad formed on the optical integrated circuit board, and the electrical interface is electrically connected to the wiring pad. The optical integrated circuit package of claim 1, wherein the electrical interface comprises a flexible printed circuit board. The optical integrated circuit according to claim 1, wherein the optical integrated circuit includes an optical waveguide and an optical coupler formed on the optical integrated circuit board, and the optical interface is optically connected to the optical waveguide through the optical coupler Integrated circuit package. The optical integrated circuit package according to claim 1, wherein the optical element includes an all-optical conversion element, a photoelectric conversion element, or a light modulation element. The optical integrated circuit package according to claim 6, wherein the electro-optic conversion element is formed inside the optical integrated circuit board. 2. The optical integrated circuit package according to claim 1, wherein the optical interface is an optical fiber array including one optical fiber or a plurality of optical fibers, and the optical fiber includes an inclined cross- . The optical integrated circuit package of claim 1, wherein the optical interface comprises a receptacle connector and an alignment element. The optical integrated circuit package according to claim 1, further comprising a heat sink which is in contact with a lower portion of the optical integrated circuit board, and the sealing member seals the heat sink in contact with both sides of the heat sink . The package according to claim 1, wherein the inside of the sealing member is filled with an air layer, a nitrogen layer, a vacuum layer, or a transparent material layer. The integrated circuit of claim 1, wherein the optical integrated circuit is located in a base printed circuit board, the electrical interface is electrically connected to a wiring pad of the base printed circuit board, and the optical interface is located on the base printed circuit board Characterized in that the optical integrated circuit package. An optical integrated circuit including an optical integrated circuit board;
An electric integrated circuit device located on the optical integrated circuit board and electrically connected to a wiring line of the optical integrated circuit board;
At least one optical element for processing an optical signal and an electrical signal in the optical integrated circuit;
An optical interface located at one side of the optical integrated circuit board and optically connected to the optical integrated circuit and the optical element;
An electrical interface located on the other side of the optical integrated circuit board and electrically connected to the electrical integrated circuit element and the optical element; And
And an encapsulating member sealing the optical integrated circuit, the electric integrated circuit element, the optical element, the optical interface, and the electrical interface. 14. The optical integrated circuit board according to claim 13, wherein the electrical interface is electrically connected to a circuit wiring line of the optical integrated circuit board, and the optical interface is optically connected to an optical waveguide of the optical integrated circuit board. Circuit package. The optical integrated circuit package according to claim 13, wherein the optical interface includes a receptacle connector for inserting a plug connector from the outside and an alignment element for aligning light input and output through the receptacle connector. 16. The package of claim 15, wherein the alignment element is a planar optical waveguide element. 14. The method of claim 13, wherein the optical element comprises an all-optical conversion element, a photoelectric conversion element or a light modulation element, wherein the optical interface transmits the optical signal modulated in the optical modulation element to the outside, Is received by the photoelectric conversion element, and the electric interface transmits the electric signal converted by the photoelectric conversion element to the outside or receives an external electric signal by the electric integrated circuit element. An optical integrated circuit including an optical integrated circuit board;
An electric integrated circuit device located on the optical integrated circuit board and electrically connected to a wiring line of the optical integrated circuit board;
A first optical element integrated in the optical integrated circuit board to generate an optical signal;
A second optical device positioned on the optical integrated circuit board to process an optical signal and an electrical signal;
An optical interface located at one side of the optical integrated circuit board and optically connected to the optical integrated circuit, the first optical device and the second optical device;
An electrical interface located on the other side of the optical integrated circuit board and electrically connected to the electrical integrated circuit, the first optical device, and the second optical device; And
And an encapsulation member sealing the optical integrated circuit, the electric integrated circuit element, the first optical element, the second optical element, the optical interface, and the electrical interface. 19. The optical module as claimed in claim 18, wherein the optical integrated circuit board includes an optical waveguide and an optical coupler, and the first optical device is an all-optical converter that is optically aligned with the optical waveguide through the optical coupler Optical integrated circuit package. 19. The package according to claim 18, wherein the second optical element includes a light modulation element and a photoelectric conversion element.

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