KR20170050218A - Composition used in coating for dissipating heat, coating including the same and manufacturing method of the same - Google Patents

Composition used in coating for dissipating heat, coating including the same and manufacturing method of the same Download PDF

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KR20170050218A
KR20170050218A KR1020150151470A KR20150151470A KR20170050218A KR 20170050218 A KR20170050218 A KR 20170050218A KR 1020150151470 A KR1020150151470 A KR 1020150151470A KR 20150151470 A KR20150151470 A KR 20150151470A KR 20170050218 A KR20170050218 A KR 20170050218A
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parts
weight
coating
group
composition
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KR102039085B1 (en
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김문경
남궁명찬
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주식회사 하이원화이어
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    • C09D7/1216—
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Paints Or Removers (AREA)
  • Inorganic Chemistry (AREA)

Abstract

The present invention relates to the use of at least one of the first group materials consisting of SrCO 3 , BaCO 3 , BaTiO 3 , Eu 2 O 3 , GeO, La 2 O, Sr 4 Al 14 O 25 : Eu, dy, SrOAl 2 O 3 : Eu, A third group of materials consisting of Al 2 O 3 , Y 2 O 3 , C (graphite), MnO 2 , at least one of the second group materials consisting of AlN, BN, SiC and Si 3 N 4 The present invention also provides a composition for a heat radiation coating. At this time, the second group material is mixed with 40 to 80 parts by weight and the third group material is mixed with 10 to 40 parts by weight with respect to 100 parts by weight of the first group material. It is preferable that the second group material is 50 to 60 parts by weight based on 100 parts by weight of the first group material and the third group material is 20 to 30 parts by weight based on 100 parts by weight of the first group material.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a composition for a radiation coating, a radiation coating containing the composition, and a method for producing the composition.

The present invention relates to a composition for a heat-radiating coating, a heat-radiating coating containing the composition and a method of preparing the composition, and more particularly to a powdery composition used for forming a coating on a surface of a material for rapid cooling of the material, To a heat-dissipating coating containing the composition and to a process for producing the composition.

Electronic components used in computers, personal digital assistants, communication devices, and the like, generate heat while operating to process information. The heat released from the device adversely affects the function of the device, which not only causes malfunction or damage to the device, but also shortens the life of the product itself, so that the heat must be removed from the devices as quickly as possible. Furthermore, as computers, personal digital assistants, and communication devices become increasingly smaller and more versatile, electronic devices used are also becoming more versatile or integrated, making this heat problem more serious.

For example, in a light emitting diode (LED) device commonly used as a backlight unit of a liquid crystal display (LCD), the light efficiency is about 20 to 30%, and most of the energy used is emitted as thermal energy. Accordingly, if the heat generated from the printed circuit board (PCB) on which the light emitting diode is mounted can not be quickly radiated to the outside, the temperature of the backlight unit is raised to cause the light emitting diode itself to malfunction or become inoperable, The reliability can be lowered. In addition, due to a difference in temperature between inside and outside, thermal stress may be generated in the part or the case, which may cause deformation of the product or the case.

As a method for discharging heat generated from electronic devices to the outside, a heat sink is generally used, and the heat sink is made of a metal having a high thermal conductivity. The heat sink is generally of a three-dimensional shape having a plurality of projecting pins, but it is formed in a plate shape when it is made integral with the PCB. FIG. 1 shows a three-dimensional shape of a heat sink, and FIG. 2 shows a heat sink 100 formed on a bottom surface of the PCB and having a cooling fin 130.

A fan can be used to increase the thermal efficiency when the heat generated from the device is discharged to the outside by the heat radiating plate. However, the fan can not be used when noise and vibration occur and the product is required to be lightweight and slim . There has been an effort to improve the heat dissipation effect on the surface of the heat sink by applying a heat dissipation coating to solve this problem. For example, Korean Patent Nos. 1084687, 0972753, 1184443, 1129973, and 1374151 disclose liquid compositions for heat dissipation coatings for this purpose. These liquid compositions improve the cooling efficiency of the heat radiating plate by coating the material, for example, the surface of the heat radiating plate, and then removing the liquid phase by drying or the like to form a coating having a proper thickness. In a specific case, It can not be used for the purpose of cooling PCB itself by mixing with ink.

It is an object of the present invention to provide a heat dissipation coating that is coated on a material surface to rapidly cool the material and a material used to form the coating.

It is another object of the present invention to prepare the material in powder form for use in various forms and applications. For example, the material may be applied to the surface of the heat sink to improve the cooling efficiency of the heat sink, and may be applied to the surface of the article itself requiring cooling such as PCB to cool the article itself.

In order to achieve the above object, the present invention provides a method of manufacturing a semiconductor device, comprising: forming a first electrode made of SrCO 3 , BaCO 3 , BaTiO 3 , Eu 2 O 3 , GeO, La 2 O, Sr 4 Al 14 O 25 : Eu, dy, SrOAl 2 O 3 : At least one of the Group 1 materials consisting of AlN, BN, SiC and Si 3 N 4 , at least one of the Group 3 materials consisting of Al 2 O 3 , Y 2 O 3 , C (graphite), MnO 2 , Or a mixture of two or more of them. At this time, the second group material is mixed with 40 to 80 parts by weight and the third group material is mixed with 10 to 40 parts by weight with respect to 100 parts by weight of the first group material. It is preferable that the second group material is 50 to 60 parts by weight based on 100 parts by weight of the first group material and the third group material is 20 to 30 parts by weight based on 100 parts by weight of the first group material. The size of the powder is preferably 0.05 to 10 mu m.

The present invention also provides a heat radiation coating formed by spraying a liquid composition composed of a gastric powder composition, an alcohol, an oily silica sol, and a resin onto a coating material and drying the composition. At this time, it is preferable that the alcohol is 5 to 30 parts by weight, the oil-based silica sol is 200 to 350 parts by weight, and the resin is 100 to 150 parts by weight based on 100 parts by weight of the above powder composition. It is preferable that the liquid composition is stirred at a temperature ranging from room temperature to 100 캜 before spraying, and then sprayed to a thickness of 1 to 50 탆 on the coating material.

The present invention also provides a heat radiation coating formed by coating a liquid composition composed of a gastric powder composition and a UV solution or PCB ink on a coating material. At this time, it is preferable that 200 to 2000 parts by weight of UV solution or PCB ink is used for 100 parts by weight of the above powder composition. This liquid composition can be used in place of the PCB ink or UV solution used in conventional processes for the manufacture of circuit boards, and the performance of the circuit board obtained using the liquid composition according to the present invention is the same as that of the conventional liquid composition, The heat dissipation is performed much faster than the area coated with the conventional PCB ink or UV solution, so that the PCB itself is rapidly cooled. It is more preferable that the UV solution or the PCB ink is 400 to 700 parts by weight based on 100 parts by weight of the powder composition.

The present invention also provides a method for efficiently producing a gastric powder composition. The method comprises the steps of mixing and pulverizing selected materials of the second group and alcohol in the same weight ratio, mixing the material selected in the first group and the material selected in the third group with respect to 100 parts by weight of the first group material, To 80 parts by weight, and the third group material is mixed and pulverized at 10 to 40 parts by weight, and removing the alcohol to obtain a powder. The milling is done by means of a ball mill.

1 is a photograph showing a known three-dimensional heat sink.
2 is a photograph showing a heat sink having a cooling fin formed on the bottom of the PCB.
3 is a photograph showing a heat sink used in an embodiment of the present invention.
4 is a photograph showing the LED used in the embodiment of the present invention.
5 is a photograph showing the closed box used in the embodiment of the present invention.
FIG. 6 is a photograph showing that a heat radiation plate coated with the liquid composition according to the present invention and an uncoated heat radiation plate are temperature-connected to the LED, respectively, in the sealed box shown in FIG.
7 and 8 are photographs showing the first measurement position and the second measurement position in the temperature measurement according to FIG.
9 is a photograph showing a circuit board on which a composition according to the present invention is applied.

Hereinafter, the present invention will be described in more detail with reference to examples.

The inventors of the present invention discovered various characteristics of the inorganic oxide compound constituting the pigment when the thermal energy was applied, that is, the heat dissipation property, while performing various experiments based on photoluminescent pigment. Accordingly, the present applicants have filed a patent (Patent No. 2015-0021976) containing this compound as a heat radiation coating composition that rapidly cools the material by coating the surface of the material. However, since these compounds are very expensive, the heat radiation coating composition obtained therefrom also has a problem of high cost. In addition, these compounds exhibit heat radiation characteristics at relatively low temperatures, for example, at 50 캜, but when the temperature exceeds this range, the heat radiation effect is reduced. That is, it has been found that there is a restriction in use depending on the temperature range of the material surface to which the heat radiation coating is applied.

The inventors of the present invention have continued to search for a new material which can be used for forming a low cost and good heat radiation coating and which can be used over a wide surface temperature range of a coating material and can be used in various forms. .

After various experiments, the applicant are SrCO 3, BaCO 3, BaTiO 3 , Eu 2 O 3, GeO, La 2 O, Sr 4 Al 14 O 25: Eu, dy, SrOAl 2 O 3: the first consisting of Eu At least one of the second group of materials consisting of AlN, BN, SiC, Si 3 N 4 , Al 2 O 3 , Y 2 O 3 , C (graphite), MnO 2 It has been found that a composition in the form of a powder comprising at least one of the above materials can be used as a raw material for a heat radiation coating. The composition of the powder is preferably 40 to 80 parts by weight of the second group material and 10 to 40 parts by weight of the third group material per 100 parts by weight of the first group material. Particularly, it is more preferable that the second group material is 50 to 60 parts by weight based on 100 parts by weight of the first group material, and the third group material is 20 to 30 parts by weight based on 100 parts by weight of the first group material.

On the other hand, the size of the powder is preferably 0.05 to 10 mu m. If the size of the powder is less than 0.05 탆, it is too expensive to be pulverized. If the size exceeds 10 탆, it becomes difficult to obtain a uniform dispersion. Therefore, it is preferable to use the range of 0.05 to 10 탆 in order to obtain an appropriate dispersion.

Next, the preparation method of the above powder composition will be described.

First, the substance selected in the second group and the alcohol are mixed and pulverized. Since the materials belonging to the second group are harder than the materials belonging to the other groups, they are preferentially pulverized, and at this stage, it is preferable to pulverize them to about 10 to 15 탆. When the hard material is first pulverized and then the remaining materials are pulverized, the pulverization efficiency of the relatively soft material is increased and the constituent materials are well mixed in the pulverization process. Group 2 materials and alcohol are mixed at the same weight ratio. There is no limitation on the type of alcohol used, and for example, IPA (isopropyl alcohol) can be used. Alcohols are used because they do not react with raw materials, facilitate pulverization, and are easy to control the particle size within a desired range. There is no limitation on the kind of the pulverizer, and a ball mill usually used in the present invention is used.

Next, the material selected from the first group and the material selected from the third group are added to the second group material pulverized in the ball mill as described above in an amount of 40 to 80 parts by weight per 100 parts by weight of the first group material, The third group material is mixed so as to be 10 to 40 parts by weight and pulverized together. At this stage, there is no problem in crushing even if no additional alcohol is added.

Finally, the powdery composition according to the present invention is obtained by removing the remaining volatile components, that is, the alcohol, by naturally drying or heating the pulverized product by mixing in a predetermined ratio. The particle size of the finally obtained powder composition is preferably 0.05 to 10 mu m.

The present invention also provides a heat radiation coating formed by spraying a liquid composition composed of a gastric powder composition, an alcohol, an oily silica sol, and a resin onto a coating material and drying the composition. At this time, it is preferable that the alcohol is 5 to 30 parts by weight, the oil-based silica sol is 200 to 350 parts by weight, and the resin is 100 to 150 parts by weight based on 100 parts by weight of the above powder composition. It is preferable that this liquid composition is sufficiently stirred at a temperature range of room temperature to 100 ° C before spraying, and then sprayed to a coating material at a thickness of 1 to 50 μm.

Hereinafter, embodiments of the present invention will be described.

30 g of SrCO 3 were mixed with isopropyl alcohol of the same weight and then milled with a ball mill to a particle size of about 10 to 15 μm. After that, 20 g of SiC and 5 g of Al 2 O 3 were added and milled for about 9 hours by a ball mill, and the volatile components were removed by heating the pulverized mixture. The size of the obtained powder was about 1 to 3 占 퐉. 5 g of isopropyl alcohol, 44 g of oily silica sol, and 26 g of resin were mixed with 11 g of the mixed powder composition and stirred well to obtain a liquid composition for coating.

As shown in FIG. 3, the liquid composition thus obtained was spray-coated on the surface of a heat-radiating plate (aluminum material, 18 cooling fins) of 150 mm x 150 mm by spraying to about 15 to 30 μm. And dried at 80 DEG C for about 1 hour to obtain a final heat radiation coating. No other sheathing was applied to the other heat sinks for comparison experiments. Figs. 4 and 5 show a COB type 30W capacity LED (1.05A, 35V) and a 5 mm thick polycarbonate sealing box used in the experiment for this embodiment. As shown in FIG. 6, the heat dissipation performance of the heat dissipation plate and the heat dissipation plate not coated with the coating according to the present invention is measured by placing the heat dissipation plate coated with the heat dissipation coating and the heat dissipation plate uncoated in the sealed box, The temperature of both heat sinks was measured. The temperature is measured at two locations, as shown in Figures 7 and 8, using a zero-point corrected contact thermometer, position 1 (the temperature measured directly at the side of the LED emitter and labeled T1) and position 2 And the temperature measured at the edge portion is denoted by T2). 6 is a 1-channel contact type thermometer (YOKOGAWA, model TX10), and the right side is a 1-channel contact type thermometer (FLUKE, Inc., Model 87V). On the other hand, a DC connector (MINWELL, model LPC-60-1050) was used to supply a constant current of 1.05A and a power supply of 35V to the LED. The temperatures measured for one hour are shown in Table 1 below.


Time (minutes)              Uncoated SrCO 3 coating       T1 (° C)      T2 (占 폚)       T1 (° C)      T2 (占 폚)      10       68.0      55.3       60.7      48.3      20       83.2      66.6       73.2      57.4      30       90.7      72.5       79.0      61.6      40       94.8      75.9       81.8      64.1      50       97.4      77.9       83.5      65.5      60       98.7      79.0       84.4      66.4

As can be seen in Table 1, in the case of a heat-radiating plate coated with a SrCO 3 -based (SrCO 3 , SiC, Al 2 O 3 ) composition, Or more. From this, the heat radiation effect of the coating of the SrCO 3 composition was confirmed.

30 g of SrOAl 2 O 3 : Eu were mixed with isopropyl alcohol of the same weight and then pulverized with a ball mill until the particle size became about 10 to 15 μm. After that, 20 g of SiC and 5 g of Y 2 O 3 were added and milled for about 9 hours by a ball mill, and the volatile components were removed by heating the pulverized mixture. The size of the obtained powder was about 1 to 3 탆. 5 g of isopropyl alcohol, 44 g of oily silica sol, and 26 g of resin were mixed with 11 g of the mixed powder composition and stirred well to obtain a liquid composition for coating.

The liquid composition thus obtained was spray-coated on a surface of a heat-radiating plate of 150 mm x 150 mm by spraying to a thickness of about 15 to 30 탆 and dried at 80 캜 for about 1 hour, as in Example 1, to obtain a final heat radiation coating.

30 g of La 2 O 3 were mixed with isopropyl alcohol of the same weight and then milled with a ball mill to a particle size of about 10 to 15 μm. After that, 20 g of AlN and 5 g of Y 2 O 3 were added and milled for about 9 hours by a ball mill, and the volatile components were removed by heating the pulverized mixture. The size of the obtained powder was about 1 to 3 탆. 5 g of isopropyl alcohol, 44 g of oily silica sol and 26 g of resin were mixed with 115 g of the mixed powder composition and stirred well to obtain a liquid composition for coating.

The liquid composition thus obtained was spray-coated on a surface of a heat-radiating plate of 150 mm x 150 mm by spraying to about 15 to 30 탆 and dried at 80 캜 for about 1 hour as in Example 1 to obtain a final heat-radiating coating.

The same tests as in Example 1 were performed on the heat sinks coated with the SrOAl 2 O 3 : Eu system and La 2 O 3 system composition, and the temperatures measured for 1 hour are also shown in Table 2 below.


Time (minutes) SrOAl 2 O 3 : Eu-based coating La 2 O 3 coating       T1 (° C)      T2 (占 폚)       T1 (° C)      T2 (占 폚)      10       60.0      45.7       62.8      50.0      20       72.7      54.3       74.6      59.0      30       78.1      58.3       79.6      61.7      40       80.7      60.6       82.1      63.9      50       82.4      61.7       83.5      65.2      60       83.0      62.3       84.5      66.0

As can be seen from Table 2, in the case of a heat sink coated with a SrOAl 2 O 3 : Eu system and a La 2 O 3 system composition, the temperature of both the T1 and the T2 was about 10 ° C or more Showed a low temperature. From this, the heat radiation effect of SrOAl 2 O 3 : Eu system and La 2 O 3 system coating was confirmed.

According to the present invention, there is provided a heat radiating coating formed by coating a liquid composition composed of the above powder composition and a UV solution or PCB ink on a coating material. At this time, it is preferable that 200 to 2000 parts by weight of UV solution or PCB ink is used for 100 parts by weight of the above powder composition. This liquid composition can be used in place of the PCB ink or UV solution used in conventional processes for the manufacture of circuit boards, and the performance of the circuit board obtained using the liquid composition according to the present invention is the same as that of the conventional liquid composition, The heat dissipation is performed much faster than the area coated with the conventional PCB ink or UV solution, so that the PCB itself is rapidly cooled. It is more preferable that the UV solution or the PCB ink is 400 to 700 parts by weight based on 100 parts by weight of the powder composition.

9 shows a circuit board in which 35 g of the SrCO 3 -based composition obtained in Example 1 is mixed with 100 g of PCB ink onto a circuit board by a process known in the art. According to the experiments of Applicants, the compositions according to the present invention are not only well mixed with PCB inks or UV solutions, but are also processes known in the art to apply PCB inks or UV solutions containing the compositions according to the invention onto circuit boards It can be seen that

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is evident that many alternatives, modifications and variations will be apparent to those skilled in the art.

Claims (12)

SrCO 3, BaCO 3, BaTiO 3 , Eu 2 O 3, GeO, La 2 O, Sr 4 Al 14 O 25: Eu, dy, SrOAl 2 O 3: at least one of the first group of substances consisting of Eu,
AlN, BN, SiC, Si 3 N 4 ,
A third group material consisting of Al 2 O 3 , Y 2 O 3 , C (graphite), and MnO 2 , wherein the second group material is composed of 40 to 80 parts by weight per 100 parts by weight of the first group material And the third group material is a powder mixed with 10 to 40 parts by weight. The composition of claim 1, wherein the second group material is 50 to 60 parts by weight based on 100 parts by weight of the first group material. The composition of claim 1, wherein the third group material is 20 to 30 parts by weight based on 100 parts by weight of the first group material. The composition for heat radiation coating according to claim 1, wherein the powder has a size of 0.05 to 10 mu m. A heat radiation coating formed by spraying a liquid composition composed of the composition according to claim 1, an alcohol, an oily silica sol and resin on a coating material and drying the composition, wherein the alcohol is used in an amount of 5 to 30 parts by weight Wherein the oil-based silica sol is 200-350 parts by weight and the resin is 100-150 parts by weight. 6. The heat dissipation coating of claim 5, wherein the liquid composition is agitated before spraying. The heat dissipation coating according to claim 6, wherein the stirring is performed at a temperature ranging from room temperature to 100 ° C. The heat dissipation coating according to claim 5, wherein the liquid composition is sprayed on the coating material to a thickness of 1 to 50 탆. A coating formed by coating the composition according to claim 1 and a liquid composition composed of a UV solution or PCB ink on a coating material, wherein the UV solution or the PCB ink is 200 to 2000 parts by weight per 100 parts by weight of the composition according to claim 1 Features heat-resistant coating. 10. The thermal barrier coating of claim 9, wherein the liquid composition is used in place of a conventional PCB ink or UV solution used in circuit boards. 11. The composition according to claim 10, wherein the UV solution or the PCB ink is 400 to 700 parts by weight based on 100 parts by weight of the composition according to claim 1. A process for preparing a composition according to claim 1,
Mixing and pulverizing the material selected from the second group and the alcohol at the same weight ratio,
Mixing the material selected from the first group and the material selected from the third group with 40 to 80 parts by weight of the second group material and 10 to 40 parts by weight of the third group material with respect to 100 parts by weight of the first group material, And
And removing the alcohol to obtain a powder. ≪ RTI ID = 0.0 > 11. < / RTI >
KR1020150151470A 2015-10-30 2015-10-30 Composition used in coating for dissipating heat, coating including the same and manufacturing method of the same KR102039085B1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102289362B1 (en) * 2021-02-17 2021-08-11 김종률 Composite for radiant heat coating, paint for radiant heat coating, radiant heat seat

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09511981A (en) * 1994-04-14 1997-12-02 ザ・ダウ・ケミカル・カンパニー Silicon nitride / silicon carbide composite powders, their manufacture and densification materials made using this composite powder
JP2009094110A (en) * 2007-10-03 2009-04-30 Denki Kagaku Kogyo Kk Heat dissipation member, its sheet, and its production method
KR100972753B1 (en) * 2009-11-19 2010-07-28 탁명수 Aluminum nitride coating composite for sinking heat, heat sink using the composite and manufacturing method of the heat sink
JP2014183257A (en) * 2013-03-21 2014-09-29 Stanley Electric Co Ltd Thermal interface material and its manufacturing method, and heat dissipation device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09511981A (en) * 1994-04-14 1997-12-02 ザ・ダウ・ケミカル・カンパニー Silicon nitride / silicon carbide composite powders, their manufacture and densification materials made using this composite powder
JP2009094110A (en) * 2007-10-03 2009-04-30 Denki Kagaku Kogyo Kk Heat dissipation member, its sheet, and its production method
KR100972753B1 (en) * 2009-11-19 2010-07-28 탁명수 Aluminum nitride coating composite for sinking heat, heat sink using the composite and manufacturing method of the heat sink
JP2014183257A (en) * 2013-03-21 2014-09-29 Stanley Electric Co Ltd Thermal interface material and its manufacturing method, and heat dissipation device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102289362B1 (en) * 2021-02-17 2021-08-11 김종률 Composite for radiant heat coating, paint for radiant heat coating, radiant heat seat

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