KR20170047652A

KR20170047652A - Component mounting apparatus

Info

Publication number: KR20170047652A
Application number: KR1020150148022A
Authority: KR
Inventors: 정하천
Original assignee: 한화테크윈 주식회사
Priority date: 2015-10-23
Filing date: 2015-10-23
Publication date: 2017-05-08

Abstract

An embodiment of the present invention provides a component mounting apparatus. The component mounting apparatus include a substrate seating part on which a substrate can be seated, a component supply part which is disposed apart from the substrate seating part and has a component seated thereon, an adhesive applying part which is disposed between the component supply part and the substrate seating part and applies an adhesive to the component, a transfer mounting part which moves between the component supply part and the adhesive applying part, has at least one component mounted thereon, and cleans the mounted component, and a head which carries out at least one of a transferring process of the component of the component supply part to the transfer mounting part and a transferring process of the component of the transfer mounting part to the adhesive applying part. So, the component mounting apparatus can uniformly apply an adhesive by cleaning a component through the transfer mounting part, thereby minimizing process defects.

Description

[0001] Component mounting apparatus [0002]

An embodiment of the present invention relates to an apparatus, and more particularly, to a component mounting apparatus.

In general, in order to mount an electronic component on a circuit board, the electronic component can be mounted on the circuit board by heating the lead between the electronic component and the circuit board after arranging the component on the circuit board. An adhesive may be applied to the electronic component to increase the adhesion between the electronic component and the circuit board. At this time, the component can be moved to the unit in which the adhesive is received through the movable head, and the adhesive can be applied.

Such a component mounting apparatus is specifically disclosed in Korean Patent Laid-Open Publication No. 1995-0023268 (entitled " Circuit board loading apparatus "). However, in the process of applying the adhesive, foreign matter such as organic matter may be adhered to the electronic part, and the adhesive may not be properly applied, thereby causing defects. Therefore, in order to prevent defects, it is necessary to clean the foreign matter of the electronic parts.

Korean Patent Publication No. 1995-0023268

An embodiment of the present invention is intended to provide a component mounting apparatus.

One embodiment of the present invention provides a plasma processing apparatus comprising: a substrate seating part on which a substrate can be seated; A component supply part spaced apart from the substrate mounting part and on which the component is mounted; An adhesive application unit disposed between the component supply unit and the substrate mounting unit for applying an adhesive to the component; A transporting unit moving between the component supplying unit and the adhesive applying unit, the transporting unit mounting at least one component and cleaning the mounted component; And a head for carrying out at least one of transferring the component of the component supply unit to the transfer mount and transferring the component of the transfer mount to the adhesive application unit.

In one embodiment of the present invention, the head includes: a first head for transmitting a component of the component supply unit to the transport mount; And a second head for transferring at least one component mounted on the conveyance mount to the substrate mount.

According to an embodiment of the present invention, the apparatus may further include a component inspecting part disposed between the adhesive applying part and the substrate seating part, for inspecting the part to be attached to the head and transferred.

In one embodiment of the present invention, the transport mount can clean the component with at least one of plasma, ultrasonic, UV, and IR.

According to an embodiment of the present invention, the transporting unit may include: a transporting unit body moving between the component supplying unit and the adhesive applying unit; And a cleaning unit disposed on the transfer mounting body so as to correspond to a position where the component is mounted.

In one embodiment of the present invention, the transfer mounting section can clean the head.

The component mounting apparatus according to one embodiment of the present invention can uniformly apply the adhesive by cleaning parts through the transferring unit, thereby minimizing the process defects. The component mounting apparatus according to an embodiment of the present invention includes a cleaning section that can clean parts on the transfer receiving section, so that the processing time can be reduced as compared with the case where the cleaning apparatus is separately provided. In addition, the component mounting apparatus according to an embodiment of the present invention not only cleans the component through the transfer mount, but also can clean the component to a head that approaches the transfer mount.

1 is a schematic structural view showing a component mounting apparatus according to an embodiment of the present invention.
Fig. 2 is a view schematically showing a cleaning method of the component mounting apparatus shown in Fig. 1. Fig.
FIG. 3 is a schematic view showing the shape of a cleansing portion of the conveyance mount shown in FIG. 1. FIG.

BRIEF DESCRIPTION OF THE DRAWINGS The present invention is capable of various modifications and various embodiments, and specific embodiments are illustrated in the drawings and described in detail in the detailed description. It is to be understood, however, that the invention is not to be limited to the specific embodiments, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

In the following embodiments, the terms first, second, etc. may be used to describe various elements, but the elements should not be limited by terms. Terms are used only for the purpose of distinguishing one component from another.

The terms used in the following examples are used only to illustrate specific embodiments and are not intended to limit the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In the following description, the terms "comprises" or "having ", and the like, specify that the presence of stated features, integers, steps, operations, elements, But do not preclude the presence or addition of other features, numbers, steps, operations, components, parts, or combinations thereof.

Embodiments of the present invention may be represented by functional block configurations and various processing steps. These functional blocks may be implemented in a wide variety of hardware and / or software configurations that perform particular functions. For example, embodiments of the invention may be embodied directly in hardware, such as memory, processing, logic, look-up tables, etc., that can perform various functions by control of one or more microprocessors or by other control devices Circuit configurations can be employed. Similar to the components of the embodiments of the present invention may be implemented with software programming or software components, embodiments of the present invention include various algorithms implemented with a combination of data structures, processes, routines, or other programming constructs , C, C ++, Java, assembler, and the like. Functional aspects may be implemented with algorithms running on one or more processors. Embodiments of the present invention may also employ conventional techniques for electronic configuration, signal processing, and / or data processing. Terms such as mechanisms, elements, means, and configurations are widely used and are not limited to mechanical and physical configurations. The term may include the meaning of a series of routines of software in conjunction with a processor or the like.

1 is a schematic structural view showing a component mounting apparatus according to an embodiment of the present invention.

1, the component mounting apparatus 10 may include a substrate mounting portion 110, a component supplying portion 120, an adhesive applying portion 130, a transfer mounting portion 140, and a head.

The substrate seating part 110 can seat the substrate P. [ At this time, the substrate P may be various devices or structures. For example, the substrate P may include a printed circuit board (PCB) having a plurality of component mounting areas so that a circuit pattern for signal transmission is printed and a lattice shape is formed on the surface. The substrate P is not limited to the above and may include all devices and structures in which the component C can be mounted.

The substrate mounting part 110 can sequentially mount the substrate P transferred by the transferring means (not shown). Although not shown, the substrate seating part 110 may be formed with a plurality of suction passages which pass through the upper surface. The substrate seating unit 110 may be fixed to prevent the substrate P from moving using the attraction force generated through the suction channels. The substrate seating part 110 may include a heater, and the heater may preheat the fixed substrate P to a predetermined temperature.

The component supply part 120 is disposed apart from the substrate mounting part 110, and the component C can be seated. At least one component may be seated in the component supply part 120. In one embodiment, the part supply part 120 may be equipped with a wafer W including a plurality of parts. At this time, the wafer W may be subjected to a fabrication process, a back grinding process, and a sawing process. At this time, a plurality of parts C arranged on the wafer W can be separated into individual chip units. The component supply part 120 has a space formed therein and can support the edge area of the wafer W. [ Although not shown, the component supply unit 120 can dispose the component C on the wafer W from the wafer W by disposing an ejector unit (not shown) in the internal space and raising or lowering the ejector unit.

The adhesive applying portion 130 is disposed between the component supplying portion 120 and the substrate mounting portion 110 and is capable of applying an adhesive to the component C. [ The adhesive application unit 130 can apply the adhesive to the mounting surface CA of the component C to enhance the connection between the mounting surface CA of the component C and the electrode surface PA of the substrate P. [ have. The adhesive application portion 130 may include a reservoir 133 in which the encapsulant is accommodated and a body portion 131 surrounding the reservoir 133. The component C moves to the adhesive applying section 130 through the head H to be described later and is immersed in the adhesive contained in the storage tank 133 so that the adhesive agent can be applied to the mounting surface CA of the component C .

The transferring unit 140 moves between the component supplying unit 120 and the adhesive applying unit 130, and at least one component C can be mounted. The transferring unit 140 moves between the component supplying unit 120 and the adhesive applying unit 130 and moves to a position where the component C can temporarily stay before the component C is transferred from the component supplying unit 120 to the adhesive applying unit 130 Can be provided. The transferring unit 140 can temporally load the parts C so that the process time can be shorter than when the parts C are directly moved from the part supplying part 120 to the adhesive applying part 130. [ The transferring unit 140 may be movable in various directions between the component supplying unit 120 and the adhesive applying unit 130. For example, the conveyance mounting portion 140 can be disposed and moved on the conveyance rail 190 formed along one direction. As another embodiment, the transporting unit 140 can move in at least one of the first direction and the second direction, which is different from the first direction, depending on the arrangement of the component supplying unit 120 and the adhesive applying unit 130. [ Hereinafter, for convenience of description, a description will be made mainly on the case where the feeder unit 140 is disposed on the feed rail 190 and linearly moves between the component feeder 120 and the adhesive agent applicator 130 .

The transferring unit 140 can clean the mounted component C. The transferring unit 140 can clean the component C with at least one of plasma, ultrasonic, UV, and IR. At this time, when the component C is formed by a flip chip method, the transfer receiving unit 140 can remove foreign matters before the adhesive application by cleaning the mounting surface of the component C. In the present invention, the type of cleaning is not limited to the above, and may include any form capable of cleaning the mounting surface CA of the component C. Hereinafter, for convenience of description, the case of plasma cleaning will be mainly described. At this time, in the case of plasma cleaning, atmospheric plasma means capable of irradiating plasma at atmospheric pressure can be used.

The transferring unit 140 may include a transferring body 141 and a cleaning unit 143. [ The transfer-carrying body 141 can move between the component supply part 120 and the adhesive application part 130. The cleaning section 143 can be disposed on the transfer mounting body section 141 so as to correspond to the position where the component C is mounted as a means for cleaning the component C. [

The head H may transmit the component C of the component supply unit 120 to the transfer mount 140 or may transfer the component C of the transfer mount 140 to the adhesive application unit 130. The head may be a single unit, and may perform all or a part of the functions, or may be divided into a plurality of units. In the present invention, the number of the heads H is not limited. However, for convenience of description, the description will be focused on the case where the above functions are divided using two heads H.

The head H may consist of a first head 150 and a second head 160. The first head 150 can transfer the component C of the component supply unit 120 to the transfer mount 140. [ The second head 160 can transfer at least one component C mounted on the transport platform 140 to the substrate platform 110. The first head 150 and the second head 160 are composed of a first head body part 153 and a first head nozzle 151, a second head body part 163 and a second head nozzle 161, respectively. . 1, the first head nozzle 151 conveys one part C and the second head nozzle 161 conveys two parts C. However, in the present invention, The number of parts C that can be used is not limited to the above. In another embodiment, the first head nozzle 151 and the second head nozzle 161 can deliver two or more parts C, respectively. Hereinafter, for convenience of explanation, the first head nozzle 151 conveys one part C and the second head nozzle 161 conveys two parts C .

The component mounting apparatus 10 may further include a component inspecting section 170. The component inspection portion 170 can be disposed between the adhesive application portion 130 and the substrate seating portion 110 and can inspect the components C that are attached to and conveyed to the second head 160. [ At this time, the part inspecting section 170 can check whether the adhesive is properly applied to the mounting surface of the part C and the mounting position of the parts C.

Hereinafter, with reference to Fig. 2, a cleaning method of the transfer receiving portion 140 of the component mounting apparatus 10 will be described in detail.

Fig. 2 is a view schematically showing a cleaning method of the component mounting apparatus 10 shown in Fig.

Referring to FIG. 2A, the component mounting apparatus 10 transfers the component C from the component supply unit 120 to the transfer mounting unit 140 via the first head 150. The transferring unit 140 can form a cleaning area A for irradiating a plasma or the like with the cleaning part 143 disposed in the direction of the mounting surface CA of the component C. [ The transferring unit 140 is configured to clean the mounting surface CA of the parts C arranged in the cleaning area A and to close the transfer mounting part 140 to transfer the component C from the component supplying part 120 The first head 150 can be cleaned.

Referring to FIG. 2 (b), the transporting unit 140 can clean the parts C while moving from the component supplying unit 120 to the adhesive applying unit 130. The part C is adhered to the mounting area of the substrate P after the adhesive is applied to the mounting area CA. When foreign matter such as organic matter adheres to the mounting area CA of the part C, It can not be applied. If foreign matter adheres to the mounting surface CA of the component C, defects may occur during the process such as reflow for bonding the component C and the substrate P. Further, the joining between the component C and the substrate P is weakened, and progressive failure may occur after the process. However, in the component mounting apparatus 10 according to the present invention, foreign matter adhering to the mounting surface CA of the component C is removed by using the transfer mounting portion 140 including the cleaning portion 143, .

Referring to FIG. 2C, when the transporting unit 140 approaches the adhesive applying unit 130, the second head 160 moves the transporting unit 140 in order to bring the component C from the transporting unit 140, Lt; RTI ID = 0.0 > 140 < / RTI > Since the second head 160 is used in the process of applying the adhesive to the component C, the second head nozzle 161 may be inadvertently contaminated by the adhesive. This adhesive can be removed by cleaning the second head 160 in the vicinity of the cleaning area A of the conveyance mount 140. The above-described method is a case in which the cleaning part 143 of the conveyance mounting part 140 always operates.

In another embodiment, the cleansing portion 143 of the transfer receiving portion 140 may be operated only while the component C is moved from the first head 150 after being mounted. In this case, the operation of the cleaning section 143 is controlled such that the first head 150 and the second head 160 are not always cleaned but are cleaned only when approaching the conveyance mounting section 140 by a predetermined number of times or more .

FIG. 3 is a view schematically showing the shape of the cleaning part 143 of the conveyance mounting part 140 shown in FIG.

3 (a), the cleansing portion 143 of the transfer receiving portion 140 can be disposed at the center of the transfer receiving body portion 141. [ The cleaning section 143 is disposed on the front surface of the conveyance mounting section 140, and can receive and clean all the components C to be mounted.

3 (b), in another embodiment, the cleansing portion 143 of the transfer receiving portion 140 can be disposed on the transfer mounting body portion 141 so as to correspond to the position where the component C is disposed have. Although the figure shows the case where there are two parts C, in the case where more than two parts C are mounted, the cleaning part 143 may be arranged so as to correspond to the number.

As described above, the component mounting apparatus 10 can uniformly apply the adhesive by cleaning parts through the transferring unit 140, thereby minimizing the process defects. In addition, the component mounting apparatus 10 includes the cleaning section 143 that can clean parts on the transfer receiving section 140, so that the process time can be reduced compared with the case where the cleaning apparatus is separately provided. The component mounting apparatus 10 can clean not only the mount surface of the component C but also the head that approaches the transfer mounting section 140. [

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the exemplary embodiments, and that various changes and modifications may be made therein without departing from the scope of the present invention. Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims.

10: Component mounting device
110:
120:
130:
140:
141: Feeding body part
143: Three governments
150: first head
151: first head nozzle
153: first head body part
160: second head
161: second head nozzle
163: second head body part
170:
190: Feed rail

Claims

A substrate seating part on which the substrate can be seated;
A component supply part spaced apart from the substrate mounting part and on which the component is mounted;
An adhesive application unit disposed between the component supply unit and the substrate mounting unit for applying an adhesive to the component;
A transporting unit moving between the component supplying unit and the adhesive applying unit, the transporting unit mounting at least one component and cleaning the mounted component; And
And a head for carrying out at least one of transferring a component of the component supply unit to the transfer mount and transferring the component of the transfer mount to the adhesive application unit.

The method according to claim 1,
The head
A first head for transmitting a component of the component supply unit to the transport mount; And
And a second head for transferring at least one component mounted on the conveyance mount to the substrate mount.

The method according to claim 1,
And a component inspecting portion disposed between the adhesive applying portion and the substrate seating portion and inspecting the component to be attached to the head and to be transported.

The method according to claim 1,
Wherein the transfer mounting section cleans the component with at least one of plasma, ultrasonic waves, UV and IR.

The method according to claim 1,
The transporting unit
A transfer mounting body part moving between the component supplying part and the adhesive applying part; And
And a cleaning unit disposed at the transfer mount body so as to correspond to a position at which the component is mounted.

The method according to claim 1,
And the transfer mounting section cleans the head.