KR20170041488A - Molding Powder Supplying Method - Google Patents
Molding Powder Supplying Method Download PDFInfo
- Publication number
- KR20170041488A KR20170041488A KR1020150140969A KR20150140969A KR20170041488A KR 20170041488 A KR20170041488 A KR 20170041488A KR 1020150140969 A KR1020150140969 A KR 1020150140969A KR 20150140969 A KR20150140969 A KR 20150140969A KR 20170041488 A KR20170041488 A KR 20170041488A
- Authority
- KR
- South Korea
- Prior art keywords
- powder
- molding powder
- molding
- tray
- trajectory
- Prior art date
Links
- 239000000843 powder Substances 0.000 title claims abstract description 451
- 238000000465 moulding Methods 0.000 title claims abstract description 238
- 238000000034 method Methods 0.000 title claims abstract description 33
- 238000000748 compression moulding Methods 0.000 claims abstract description 13
- 238000012546 transfer Methods 0.000 claims description 57
- 230000001133 acceleration Effects 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 229920006336 epoxy molding compound Polymers 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- 241001416181 Axis axis Species 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 230000004308 accommodation Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
Description
The present invention relates to a molding powder supply method. More particularly, the present invention relates to a molding powder supply method for uniformly supplying a molding powder for compression molding onto a release film of a powder tray having a constant feed rate or a constant trajectory.
The compression molding process is performed by pressing a molding powder in a state where an epoxy molding compound (hereinafter referred to as 'molding powder') is supplied on a mold to form a molding part on a semiconductor strip or a semiconductor package do.
The molding powder used in the compression molding process is applied and supplied onto a powder tray equipped with a release film. When the molding powder applied on the release film of the powder tray is unevenly supplied, a wire sweep ) Problems such as defects or voids may occur. In addition, with the recent miniaturization of the semiconductor package and the thinning of the molding part, the process of uniformly and precisely supplying the molding powder is very important for preventing defects.
For this purpose, conventionally, the molding powder is dropped at a constant speed, and the powder tray with the release film is conveyed in a zigzag manner to supply the molding powder. However, in the case of the acceleration section in which the conveyance is started in the state where the powder tray is stopped, And the molding powder is excessively supplied or insufficiently supplied in the corner section of the arc where the transfer direction in which the transfer trajectory draws the arc is switched.
The present invention provides a molding powder supply method for uniformly supplying a molding powder for compression molding on a release film of a powder tray having a constant conveying speed or a trajectory of conveyance.
According to an aspect of the present invention, there is provided a powder supply method for dropping a molding powder for a compression molding process onto a powder tray equipped with a release film to supply powdered powder to a powder tray, (G / sec) of the molding powder to obtain a vibration according to a discharge amount (g / sec) of the molding powder while moving the powder tray along a predetermined trajectory, while supplying the molding powder in a predetermined amount, Calculating a discharge amount of the molding powder according to a vibration applied at a constant speed at a constant speed as a reference discharge amount to obtain a discharge amount of the molding powder according to a transfer trajectory with respect to the reference discharge amount, The discharge amount of the molding powder according to the transfer trajectory, Determining a compensation value for each of the transporting trajectory sections by reflecting the reference discharge amount, calculating the intensity of the vibration applied to the molding powder supplying section for each transporting trajectory section constituting the predetermined trajectory of the powder tray, And feeding the molding powder by vibrating the molding powder supply part with the intensity of the determined vibration while transferring the powder tray to a predetermined transfer locus.
Here, the conveyance trajectory section of the powder tray includes an accelerated conveyance section, a constant velocity linear conveyance section, a curved conveyance section, and a deceleration conveyance section just before the stop of conveyance of the powder tray immediately after the start of conveyance of the powder tray, In the step of determining the compensation value for each locus section, the molding powder may be discharged in the same amount in the powder tray by applying a positive compensation amount or a negative compensation amount in a section according to the respective transfer trajectories based on the reference discharge amount.
The step of determining the compensation value for each of the trajectory segments may include adjusting a discharge amount of the molding powder by applying a negative compensation amount immediately after the start of the feeding start and before the stopping of the feeding of the powder tray, The amount of molding powder can be adjusted by applying a positive compensation amount.
In this case, vibrating the molding powder in the step of supplying the molding powder by vibrating the molding powder supplying part with the intensity of the vibration determined in the step of determining the intensity of the vibration applied to the molding powder supplying part by the above- And amplitude of the molding powder to control the vibration intensity to adjust the discharge amount of the molding powder.
In the step of supplying the molding powder by vibrating the molding powder supply unit, a decrease in the load of the molding powder supply unit may not be sensed by the load sensor provided in the molding powder supply unit, or the mold unit may be molded by the trigger unit provided in the molding powder supply unit. And stopping the powder tray when the powder discharge is not sensed and determining the intensity of the vibration applied to the molding powder supply unit according to the transfer trajectory interval at the time when the discharge of the molding powder is resumed.
Fig. 1 shows a perspective view of a molding powder feeder of the present invention.
Fig. 2 shows a state in which the molding powder is supplied through the molding powder supplying apparatus shown in Fig.
3 is a view illustrating a feeding state of the molding powder according to the feeding trajectory of the powder tray to which the molding powder is supplied through the molding powder feeder of the present invention and on which the release film is mounted.
4 shows a block diagram of a molding powder supply method according to the present invention.
Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments described herein but may be embodied in other forms. Rather, the embodiments disclosed herein are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the invention to those skilled in the art. Like reference numerals designate like elements throughout the specification.
FIG. 1 is a perspective view of a molding powder supply apparatus of the present invention, and FIG. 2 shows a state in which molding powder is supplied through the molding powder supply apparatus shown in FIG.
The molding powder supplying apparatus of the present invention can be roughly constituted of a molding powder storing section, a molding powder supplying section, and a powder tray transferring section.
Specifically, the molding
The molding
A molding powder (mp) in the form of an epoxy powder may be provided in the accommodation space inside the
The
A
The load sensor included in the
The molding
The
The
A supply
That is, the supply
The amount of discharge through the
The
There may be a time difference at the time when the vibration is started in the state where the
Therefore, according to the molding powder supplying method of the present invention, in order to prevent the initial non-discharge due to the time difference between the time when the vibration of the molding powder supply device starts and the time when the powder is actually discharged from the
The trigger unit is not limited to a unit for detecting the timing at which discharge is started. The trigger unit may use a time when the molding powder supply device is driven as a trigger signal.
That is, the external force transmitted to the molding powder supply device is judged as an external signal when the molding powder supply device vibrates, and at the time when the vibration of the molding powder supply device starts and the powder is actually discharged from the
It is also possible to measure the time required from the start of supply of the
That is, the time when the molding powder passes the trigger unit is detected to measure the non-discharge time caused by the length of the
The molding powder supply device of the present invention adjusts the vibration intensity of the vibrator provided in the supply
The molding
The
A minute amount of the molding powder can be additionally discharged due to the residual vibration of the molding
The
That is, when supply of the molding powder to the
The shape of the
FIG. 1 shows a state in which a
That is, the state shown in FIG. 1 is a state in which the molding powder supplied through the
The
The
The molding
As described above, the shape of the powder nozzle has a shape that becomes narrower as it goes downward, and the supply process of the powder can be performed in a state where the separation distance from the powder tray is minimized for precise powder supply.
Therefore, in order to prevent the
The molding
The molding powder supply apparatus of the present invention may include a powder tray transfer unit for transferring the powder tray in the X axis and Y axis directions. The powder
That is, each X-axis transfer line and Y-axis transfer line feeds the
The position at which the
As described above, the molding powder supply apparatus of the present invention is characterized in that the intensity of the vibration applied to the powder supply line is adjusted to adjust the amount of molding powder supplied for a predetermined time. This will be described with reference to FIG. 3 and FIG.
FIG. 3 is a view illustrating a feeding state of a molding powder according to a feeding trajectory of a powder tray to which a molding powder is supplied through a molding powder supplying apparatus of the present invention, and FIG. Fig.
As shown in FIG. 3, the molding powder supply device of the present invention supplies molding powder onto a
3, the
The process of supplying the molding powder onto a new one of the powder trays includes a starting point and an end point of the trajectory of the powder tray. Since the
Further, the powder tray, which has been accelerated in the stopped state and reaches the predetermined speed, is then conveyed at a constant speed until it is decelerated by the stop command.
3, there may be an accelerated transfer section A after the transfer start point of the powder tray and a deceleration transfer section B prior to the transfer stop point, as shown in the transfer trajectory of the powder tray shown in FIG. have.
3, the acceleration transfer section A and the deceleration transfer section B of the powder tray are not limited to the beginning and the end of the trajectory, The driving of the
In this accelerated transporting period A and the decelerating transporting period B, if the amount of powder supplied per hour of the powder supplied from the
If the amount of molding powder supplied increases, the thickness of the molding part becomes thicker, which results in a defective product.
In addition, in a section where the trajectory of the powder tray is curved to change the conveying direction of the powder tray, that is, the curved conveying section C, a rectangular area in which molding powder is not sufficiently supplied to the peripheral area may be generated.
That is, in the curved conveying section C of the powder tray shown in FIG. 3, since the molding powder is not sufficiently supplied to the corner area of the release film, the molding part formed through the compression molding process is thin, have.
Accordingly, the present invention can provide a molding powder supply method for uniformly supplying a molding powder for compression molding to a mold release film of a powder tray for feeding and conveying molding powder having a constant conveying speed or a constant trajectory .
As shown in FIG. 4, the present invention provides a powder feeding method for feeding a molding powder for a compression molding process onto a powder tray equipped with a release film to supply the molding powder to a powder tray, (S100) of obtaining the vibration according to the discharge amount per unit time (g / sec) of the molding powder by supplying the molding powder in a predetermined amount for a predetermined period of time, and moving the powder tray along a predetermined trajectory, A step S200 of obtaining the discharge amount of the molding powder by setting the discharge amount of the molding powder according to the vibration applied at the time of linear movement at a constant speed as the reference discharge amount and obtaining the discharge amount of the molding powder according to the transfer trajectory with respect to the reference discharge amount, A discharge amount of the molding powder according to the transfer trajectory, (S300) of determining a compensation value for each transporting trajectory section by reflecting the amount of the reference trajectory to be applied to the molding powder supplying section according to a transporting section constituting a predetermined transporting trajectory of the powder tray based on the examined compensation value (S500) of vibrating the molding powder supply unit (S500) by vibrating the molding powder supply unit with the intensity of the determined vibration while moving the powder tray to a predetermined transporting trajectory (S400) Method can be provided.
As described above, the compression molding apparatus according to the present invention vibrates the vibrator of the supply
Generally, in the case of a powder supply device that discharges a predetermined amount of powder using vibration, the amount of molding powder discharged through the
Therefore, in order to supply the molding powder by adjusting the vibration intensity of the vibrator of the supply
Accordingly, in the method of supplying molding powder according to the present invention, the molding powder is supplied to the powder tray at a predetermined speed from the powder nozzle in a fixed amount for a predetermined period of time to obtain vibration corresponding to the discharge amount (g / sec) per unit time of the molding powder S100).
Then, a step S100 of obtaining the vibration according to the discharge amount per unit time (g / sec) of the molding powder is carried out. Thereafter, the powder tray is transferred along a predetermined trajectory to supply the molding powder in a predetermined amount, A step S200 of obtaining the discharge amount of the molding powder by setting the discharge amount of the molding powder corresponding to the vibration applied at the constant speed at the constant speed as the reference discharge amount and obtaining the discharge amount of the molding powder according to the transfer trajectory with respect to the reference discharge amount may be performed have. This is because there will be a variation in the molding powder discharge amount depending on the trajectory of trajectory.
After calculating the deviation of the molding powder discharge amount according to the transfer trajectory (S200), the deviation is calculated, and the discharge amount per unit time of the molding powder, the discharge amount of the molding powder according to the transfer trajectory, A step of determining a star compensation value (S400) may be performed. The step S400 of determining the compensation value for each of the trajectory segments may be performed by dividing the constant velocity linear transport segment, the acceleration transport segment, the deceleration transport segment, or the curved transport segment to determine the compensation value for each segment of the transport trajectory .
Determining a compensation value for each transport path segment by reflecting the discharge amount per unit time of the molding powder, the discharge amount of the molding powder corresponding to the transfer path, and the reference discharge amount, and determining the intensity of the vibration based on the compensation value Can determine the required oscillation intensity of the supply
If there is vibration data for a discharge amount that does not exist in the measured data in the step S100 of obtaining the vibration according to the discharge amount per unit time (g / sec) of the molding powder required in the step of determining the intensity of the vibration (S400) , Which can be determined by interpolation (using an approximate calculation method to obtain a summation value between the points based on the summation given to adjacent variables) using vibrations for the proximity discharge amount data.
The vibration applied to the
Accordingly, the step S400 of determining the intensity of the vibration of the molding powder supplying method according to the present invention may be performed in the same manner as in the first embodiment except that the acceleration conveying interval A after the conveyance start point of the powder tray and the deceleration conveyance interval B before the conveyance stop point The discharge amount of the molding powder discharged to the
As described above, the step (S100) of obtaining the vibration according to the discharge amount per unit time (g / sec) of the molding powder is performed by measuring the vibration strength according to the discharge amount of the molding powder supplied to the powder tray, The amount of compensation according to the discharge amount of the deceleration transfer section B and the curved transfer section C before the transfer stop point and the discharge amount-vibration intensity inspection step S100 , It is possible to collect the compensation data by actual measurement.
That is, the vibration intensity determination step (S400) determines whether the amount of molding powder supplied to the accelerating transfer section A after the transfer start point of the powder tray and the deceleration transfer section B before the transfer stop point is within the molding powder (-) is compensated so as to be equal to the supply amount so as to determine the reduced vibration intensity as compared with the vibration intensity of the straight line conveying section, and the vibration having the reduced vibration intensity as compared with the vibration intensity of the straight line conveying section is supplied to the
The vibration intensity of the vibration applied to the powder supply line or the powder nozzle in the curved conveyance section C of the
Therefore, it is possible to secure a database on the relationship between the intensity of the vibration applied to the powder supply line for supplying the molding powder to the powder tray to be transported at a constant linear velocity and the discharge amount of the molding powder. In the course of supplying the molding powder, The oscillation intensity is determined for each of the accelerated transporting section, the constant velocity linear transporting section, the curved transporting section and the decelerating transporting section to vibrate the powder supply line or the powder nozzle, thereby minimizing the supply amount variation of the powder for each region, So that the defective product can be minimized.
In addition, a compensation value for compensating a time difference that occurs while the molding powder discharged from the
When the change in the load of the molding
The molding powder supply unit may be vibrated with the intensity of the vibration determined in the step S400 of determining the intensity of the vibration applied to the molding powder supply unit by the transfer trajectory section while the powder tray is transferred to the predetermined trajectory by the above- (S500) of supplying the molding powder onto the powder tray may be performed, and the discharge amount or the delivery amount of the molding powder to be supplied to the powder tray may be made uniform in each region or section.
While the present invention has been particularly shown and described with reference to preferred embodiments thereof, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined in the following claims. . It is therefore to be understood that the modified embodiments are included in the technical scope of the present invention if they basically include elements of the claims of the present invention.
1: Molding powder feeder
100: Molding powder storage part
200: Molding powder supply part
400: Powder tray
500: Powder tray transfer part
Claims (5)
Obtaining a vibration according to a discharge amount (g / sec) per unit time of the molding powder by supplying a molding powder in a predetermined amount for a predetermined time to a powder tray transferred at a predetermined speed;
The amount of the molding powder to be supplied is determined by the amount of the molding powder while the powder tray is moved along the predetermined trajectory along the predetermined trajectory while the discharge amount of the molding powder is determined according to the trajectory, Obtaining a discharge amount of the molding powder according to a transfer trajectory with respect to the reference discharge amount;
Determining a compensation value for each transport path segment by reflecting a discharge amount per unit time of the molding powder, a discharge amount of the molding powder according to the transfer path, and the reference discharge amount;
Determining the intensity of vibration applied to the molding powder supply unit for each of the trajectory interval sections constituting the predetermined trajectory of the powder tray based on the calculated compensation value; And
And feeding the molding powder by vibrating the molding powder supplying part with the intensity of the determined vibration while transferring the powder tray to a predetermined trajectory.
Wherein the conveyance trajectory section of the powder tray includes an accelerated conveyance section, a constant velocity linear conveyance section, a curved conveyance section, and a deceleration conveyance section immediately before the stop of conveyance of the powder tray,
The step of determining the compensation value per transporting trajectory section may include applying a positive compensation amount or a negative compensation amount in a section corresponding to each transport trajectory based on the reference discharge amount so that the molding powder is discharged in the same amount in the powder tray Wherein the molding powder is supplied to the mold.
The step of determining the compensation value for each of the trajectory segments may include adjusting a discharge amount of the molding powder by applying a negative compensation amount immediately after the powder tray starts to feed and immediately before stopping the feeding,
Wherein the amount of the molding powder is adjusted by applying a positive compensation amount in a curved conveying section for changing the trajectory of the powder tray.
The vibration of the molding powder in the step of supplying the molding powder by vibrating the molding powder supply part with the intensity of the vibration determined in the step of determining the intensity of the vibration applied to the molding powder supplying part by the above- And adjusting the discharge amount of the molding powder by controlling the intensity of vibration by controlling one of the molding powder and the molding powder.
The step of supplying the molding powder by vibrating the molding powder supply part may include a step of detecting a decrease in the load of the molding powder supply part by a load sensor provided in the molding powder supply part, or by a trigger unit provided in the molding powder supply part, Wherein the step of stopping the powder tray and determining the intensity of the vibration applied to the molding powder supply unit by the transfer trajectory interval at the time when the discharge of the molding powder is resumed is performed .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020150140969A KR20170041488A (en) | 2015-10-07 | 2015-10-07 | Molding Powder Supplying Method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020150140969A KR20170041488A (en) | 2015-10-07 | 2015-10-07 | Molding Powder Supplying Method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20170041488A true KR20170041488A (en) | 2017-04-17 |
Family
ID=58703088
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020150140969A KR20170041488A (en) | 2015-10-07 | 2015-10-07 | Molding Powder Supplying Method |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR20170041488A (en) |
-
2015
- 2015-10-07 KR KR1020150140969A patent/KR20170041488A/en unknown
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