KR20170029904A - Soldering System - Google Patents

Soldering System Download PDF

Info

Publication number
KR20170029904A
KR20170029904A KR1020150127064A KR20150127064A KR20170029904A KR 20170029904 A KR20170029904 A KR 20170029904A KR 1020150127064 A KR1020150127064 A KR 1020150127064A KR 20150127064 A KR20150127064 A KR 20150127064A KR 20170029904 A KR20170029904 A KR 20170029904A
Authority
KR
South Korea
Prior art keywords
soldering
object member
laser
unit
light
Prior art date
Application number
KR1020150127064A
Other languages
Korean (ko)
Inventor
조성익
최재익
조진구
Original Assignee
(주)조은테크
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주)조은테크 filed Critical (주)조은테크
Priority to KR1020150127064A priority Critical patent/KR20170029904A/en
Publication of KR20170029904A publication Critical patent/KR20170029904A/en

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/008—Soldering within a furnace
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
    • B23K31/12—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to investigating the properties, e.g. the weldability, of materials
    • B23K31/125—Weld quality monitoring

Abstract

The present invention relates to a soldering system, and more particularly, to a soldering system that performs soldering using a laser.
The present invention comprises a chamber (50) in which a target member stage (90) for forming a sealed process space (S) and on which at least one soldering object (2) to which the solder material (1) A solder material injection part 52 for movably placing the solder material 1 in the soldering object member 2 movably installed in the chamber 50 and seated on the object member stage 90; A laser optical head module (10) movably installed in the chamber (50); A display for displaying an image of the soldering object member 2 on the screen so that the operator can observe the image of the soldering object member 2 photographed by the photographing unit 400, (40); And a control unit (30) for controlling the laser optical head module (10) and the display unit (40).

Description

Soldering System [0002]

The present invention relates to a soldering system, and more particularly, to a soldering system that performs soldering using a laser.

Electronic devices such as LEDs, IC chips, and the like, which use electronic components such as semiconductor devices and wires, are generally mounted on PCBs by soldering materials such as solder.

And the member to be soldered such as an electronic part is generally automatically performed by a soldering system.

The soldering system may have various configurations depending on the object to be soldered. The soldering system may include a support for supporting the member to be soldered, a laser head module for heating the soldering material supported on the support by irradiating laser light to the soldering material, And a photographing unit for photographing a member to be soldered supported by the supporting unit so that the head module can irradiate the soldering material with laser light among the members to be soldered supported by the supporting unit.

On the other hand, when the solder material is oxidized during the soldering, there is a problem that the solder material is defective due to the characteristics of the electronic product operated by electricity, or it is short-circuited due to the defective soldering condition.

In addition, since the laser head module and the photographing unit are separately constructed, the conventional soldering system is complicated in construction. When the position of the soldering object calculated after the photographing of the photographing unit is positioned by the laser head module, It is difficult to carry out the process.

Further, there is a problem that the time required for the whole process is increased due to the execution of the additional process for error alignment due to the occurrence of the position error.

In addition, in the conventional soldering system, it is impossible to observe the performance of the soldering system in real time during the soldering process, and thus the soldering system is operated in spite of the process error, thereby increasing defective products.

It is an object of the present invention to provide a soldering system capable of performing a high quality soldering process by preventing the oxidation of solder material by forming an airtight environment when soldering.

Another object of the present invention is to provide a soldering system capable of simultaneously irradiating a laser beam and photographing an object to be soldered by constituting a configuration for irradiating a soldering object with a laser beam and a configuration for taking an object to be soldered, There is.

SUMMARY OF THE INVENTION The present invention has been made in order to achieve the above-mentioned object of the present invention, and it is an object of the present invention to provide an apparatus and a method for forming solder balls, A chamber 50 in which a target member stage 90 is installed; A solder material injection part 52 for movably placing the solder material 1 in the soldering object member 2 movably installed in the chamber 50 and seated on the object member stage 90; A laser light generator 100 movably installed in the chamber 50 for generating laser light for heating the solder material 1; A first optical system 200 for guiding laser light generated in the laser light generator 100 to the solder material 1; (2) provided on the first optical path (L2) of the laser light and for the portion where the solder material (1) is coupled at the soldering object member (2) to the first light path An optical path dividing unit 300 dividing the optical path dividing unit 300 from the optical path dividing unit 300; And a photographing unit (400) for photographing an image of a target member with respect to a portion where the solder material (1) is joined at the soldering object member (2) divided by the optical path dividing unit (300) (10); A display for displaying an image of the soldering object member 2 on the screen so that the operator can observe the image of the soldering object member 2 photographed by the photographing unit 400, (40); And a control unit (30) for controlling the laser optical head module (10) and the display unit (40).

The chamber 50 is provided with a gas supply part for supplying a gas for performing a process treatment to the process space S and a gas supply part for supplying a gas in the process space S, And an exhaust system 53 for exhausting the exhaust gas to the outside.

The light path dividing unit 300 may be coated with a first coating member that reflects only the visible light band of the light corresponding to the object member image in the soldering object member 2 and transmits the laser light band.

The photographing unit 400 includes a camera unit 410 for photographing the image of the target member with respect to a portion where the solder material 1 is coupled to the image sensing unit 400, And a second optical system 420 for guiding light to the camera unit 410.

The second optical system 420 is installed in the second optical path L1 between the photographing unit 400 and the optical path dividing unit 300 so that the image of the object member through the second optical path L1 And a reflector 600 for reflecting the light of the light source 420 to the camera unit 410 may be additionally provided.

The second optical system 420 may reflect only the laser band in the soldering object member 2 and transmit only the visible light band.

The second optical system 420 may be made of a material at least partially reflecting the laser band and transmitting only the visible light band at the soldering object member 2 or may be coated with a material reflecting the laser band and transmitting only the visible light band have.

The light path dividing unit 300 can transmit the laser band in the member 2 to be soldered and reflect the visible light band.

The light path dividing unit 300 may include a prism made of a material that transmits a laser band in the soldering object member 2 and reflects a visible light band or a prism that transmits a laser band in the soldering object member 2, And a prism coated with a reflective material.

The soldering system and the soldering method according to the present invention have an advantage that a good quality soldering process can be performed by preventing the oxidation of the solder material by forming an enclosed environment when soldering.

Furthermore, the soldering system and the soldering method according to the present invention have an advantage that a better quality soldering process can be performed by preventing the oxidation of the solder material by injecting nitrogen gas into the solder material during soldering.

Further, the soldering system according to the present invention can be configured to simultaneously irradiate laser light and to be soldered by configuring a configuration for irradiating laser light on a soldering object and a configuration for taking a soldering object as one module, This has a stable and rapid advantage.

Further, the soldering system according to the present invention includes a module for irradiating a laser beam to a soldering object to be irradiated with laser light and an object to be soldered at the same time, and a configuration for photographing a soldering object, There is an advantage that real-time observation (monitoring) can be performed.

1 is a conceptual diagram showing a soldering system of the present invention.
Fig. 2 is a block diagram showing the main configuration of the soldering system of Fig. 1; Fig.
FIG. 3A is a conceptual diagram showing an embodiment of the laser optical head module of FIG. 1. FIG.
FIG. 3B is a conceptual view showing a modification of the laser optical head module of FIG. 1. FIG.
Fig. 4 is a conceptual view showing the inside of the chamber of Fig. 1 from above. Fig.
5 is a flow chart showing a soldering method performed by the soldering system of the present invention.

Hereinafter, a soldering system according to the present invention will be described with reference to the accompanying drawings.

1 to 4, a soldering system according to the present invention includes an object member stage 1 which forms an enclosed process space S and in which at least one soldering object member 2 to which a solder material 1 is to be attached is mounted, A chamber 50 in which a valve seat 90 is installed; A solder material injection part (52) movably installed in the chamber (50) for positioning the solder material (1) on the soldering object member (2) placed on the object member stage (90); A laser optical head module (10) movably installed in the chamber (50); A display unit 40 installed outside the chamber 50 for displaying an image of the soldering object member 2 on the screen so that an operator can observe an image of the soldering object member 2 photographed by the photographing unit 400, Wow; And a control unit 30 for controlling the laser optical head module 10 and the display unit 40.

The soldering process of the soldering system according to the present invention is a process of soldering a solder material 1 to a soldering object member 2 such as a mounting process of mounting an electronic component such as a semiconductor device or a wire on a PCB, And the step of soldering the member 3 is all possible.

Here, the soldering object member 2 may be a PCB on which electronic components such as semiconductor elements are mounted.

The solder material 1 may be made of any material such as a solderable material if the metal material is a solderable material.

For example, the solder material 1 may be formed of a solder paste formed by including a powder such as non-solder in a liquid binder so that the solder material 1 can be injected by a solder material injection portion 52 described later.

The solder material injecting portion 52 is configured to inject a solder material 1 having a fluidity such as a solder paste into the soldering portion of the member 2 to be soldered.

For example, the solder material injection portion 52 may include a syringe needle through which solder material is ejected at an end portion.

The chamber 50 is a structure for forming a closed processing space S so that the solder material 1 can be coupled thereto and is provided with a target member stage 90 on which at least one soldering object member 2 is mounted If it is a structure, various structures are possible.

As an example, the chamber 50 may include an object member stage 1 in which at least one soldering object member 2 to which the solder material 1 is to be coupled is seated, forming an enclosed process space S as shown in FIG. (90); And a solder material injection part 52 for movably placing the solder material 1 in the soldering object member 2 movably installed in the chamber 50 and seated on the object member stage 90 .

At this time, the chamber 50 includes a gas supply unit (not shown) for supplying a gas for performing a process process such as nitrogen, inert gas and the like to the process space S and a gas supply unit And an exhaust system 53 for exhausting the gas in the processing space S to the outside can be provided.

The gas supply unit may have various configurations as a configuration for supplying a gas for performing a process operation such as nitrogen, inert gas, etc. to the process space S.

Wherein the gas supplied by the gas supply is a gas for creating an atmosphere in the chamber 50 so as to minimize the formation of dross or oxide on the surface of the solder material 1 during the soldering process, Various gases can be used as long as they can provide a relatively low oxygen atmosphere in the processing space S.

For example, as the gas supplied by the gas supply unit, an inert gas such as nitrogen (N 2 ), argon (Ar) may be used.

In order to perform a soldering process of a quality higher than that which can be oxidized when the solder material 1 is supplied to the soldering object member 2, the chamber 50 is provided with a soldering object A nitrogen gas injecting unit (not shown) for injecting nitrogen gas into the member 2 may be additionally provided.

The nitrogen gas injector may have various configurations as a configuration for injecting nitrogen gas into the soldering object member 2 placed on the object member stage 90.

The nitrogen gas injector preferably injects nitrogen gas heated to a preset temperature.

4, the soldering system according to the present invention includes a loading unit 60 installed in the chamber 10 to load a member 2 to be soldered, And an unloading unit 70 installed in the chamber 10 for unloading the member 2 to be soldered.

The loading unit 60 can be configured in various manners depending on the loading method of the member 2 to be soldered, in which the member to be soldered 2 is loaded.

As an example, a plurality of objects to be soldered 2 may be loaded with being mounted on a mounting member (not shown).

The unloading unit 70 can be configured in various ways according to the unloading method of the member 2 to be soldered, in which the member to be soldered 2 is unloaded.

As an example, a plurality of objects to be soldered 2 may be unloaded while being mounted on a mounting member.

The laser optical head module 10 can be installed in the chamber 50 to perform a soldering process and to perform a soldering process in real time, .

For example, the laser optical head module 10 includes a laser light generator 100 for generating laser light for heating the solder material 1, as shown in FIGS. 3A and 3B; A first optical system 200 for guiding laser light generated in the laser light generating unit 100 to the solder material 1; The image of the object 2 to be soldered with respect to the portion where the solder material 1 is bonded on the first optical path L2 of the laser light and the soldering object member 2 is divided from the first optical path L2 An optical path dividing unit 300; And a photographing unit 400 for photographing an image of a target member with respect to a portion where the solder material 1 is joined at the soldering object member 2 divided by the light path dividing unit 300.

The laser light generator 100 may be configured to generate laser light for heating the solder material 1 on the member to be soldered 2 and may have any configuration as long as it can generate laser light.

The first optical system 200 is configured to guide laser light generated in the laser light generating unit 100 to the solder material 1, and may be composed of one or more lenses.

In particular, the first optical system 200 may be installed near the laser light generating unit 100 and directly above the soldering object member 2, as shown in FIGS. 3A and 3B.

The optical path dividing unit 300 is provided on the first optical path L2 of the laser light and has an image of the soldering object member 2 with respect to a portion where the soldering material 1 is bonded at the soldering object member 2 Various configurations are possible as the configuration for dividing from the first optical path L2.

For example, the optical path division unit 300 may be formed of a beam splitter such as a semi-transmissive mirror or a prism that divides a part of light.

In the meantime, it is preferable that the light divided by the light path dividing unit 300 is guided to the visible ray region as the light to be divided for photographing the object member image by the photographing unit.

Therefore, it is preferable that the optical path dividing unit 300 is coated with a first coating member that reflects only the visible light band among the light corresponding to the object member image in the soldering object member 2 and transmits the laser light band.

That is, the optical path dividing unit 300 can transmit the laser band in the member to be soldered 2 and reflect the visible light band.

The light path dividing unit 300 may include a prism made of a material that transmits a laser band and reflects a visible light band in the member to be soldered 2 or a prism coated with a material that transmits a laser band and reflects a visible light band, . ≪ / RTI >

The photographing unit 400 may be configured in various manners as a configuration for photographing an image of a target member divided by the optical path dividing unit 300.

For example, the photographing unit 400 includes a camera unit 410 for photographing an image of a target member with respect to a portion to which the solder material 1 is coupled, And a second optical system 420 for guiding the light to the camera unit 410.

The camera unit 410 may be a digital camera or the like as a configuration for capturing an image of a target member with respect to a portion where the solder material 1 is coupled.

The second optical system 420 may include at least one lens, a mirror, or the like, for guiding the light of the objective member image divided from the optical path dividing unit 300 to the camera unit 410.

The second optical system is provided in the second optical path L1 between the photographing unit 400 and the optical path dividing unit 300 so that the light of the object member image through the second optical path L1 A reflection portion 600 for reflecting the light to the light source 410 may be additionally provided.

The reflector 600 is installed on the second optical path L1 between the photographing unit 400 and the optical path dividing unit 300 and transmits the light of the object member image through the second optical path L1 to the camera 100. [ A mirror or the like may be used as the structure for reflecting the light to the unit 410.

On the other hand, in the second optical system 420, it is preferable that the photographing unit 400 photographs light in the visible light region, so that the laser band can be reflected by the soldering object member 2 and only the visible light band can be transmitted.

To this end, the second optical system 420 may be made of a material at least a part of which reflects the laser band in the soldering object member 2 and transmits only the visible light band, or may be formed of a material that reflects the laser band and transmits only the visible light band. .

The display unit 40 may be configured to display an image of a target member on a screen so that an operator can observe the image of the target member taken by the photographing unit 400.

For example, the display unit 40 may be a monitor having a display screen, such as an LCD, an OLED, or the like.

The soldering system may further include an operation unit (not shown) for receiving an operation control of the laser optical head module 10 according to the state of the object member image displayed on the display unit 500.

The operation unit is configured to receive an operation control of the laser optical head module 10 according to the state of the image of the object member displayed on the display unit 500. The operator can perform operation canceling, 1), a control signal such as an operation stop, and the like.

In addition, the operation unit may further include an input device 90 for inputting information of an operator's observation result on the image of the object member displayed on the display unit 500.

Specifically, the observer can perform various operations such as inputting an abnormality of the soldering process or manually switching the automatic soldering operation through the input device 90 of the operating section.

The controller 30 controls the laser optical head module 10, the display unit 40, and the like.

Specifically, the control unit 30 controls driving and operation of the laser optical head module 10, control of the display unit 40, control of the exhaust system 52 for controlling the vacuum pressure in the processing space S, and the like And may be configured as a member or a plurality of members as a logical configuration rather than a single physical configuration.

In addition, the control unit 30 may be configured to control at least part of the program in the form of a program.

That is, the soldering system includes a solder material supply step (T1) for supplying a soldering material (1) to the soldering object member (2) as shown in FIG. 5; A spraying step (T2) of spraying nitrogen gas onto the soldering object member (2); A soldering step (T3) may be performed in which the soldering material (1) is irradiated with laser light and soldered.

At this time, the injecting step T2 is a step for injecting nitrogen gas into the soldering object member 2. In addition to forming a nitrogen atmosphere in the chamber 50 to prevent oxidation of the soldering material 1, The soldering material 1 may be preheated so that a high-quality soldering process can be performed in the soldering step T3.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention as defined in the appended claims. It is to be understood that both the technical idea and the technical spirit of the invention are included in the scope of the present invention.

10: laser optical head module 30:
40: display part 52: solder material injection part
90: target member stage

Claims (9)

A chamber 50 in which a target member stage 90 forming a sealed process space S and on which at least one soldering object member 2 to which the solder material 1 is to be attached is seated is installed;
A solder material injection part 52 for movably placing the solder material 1 in the soldering object member 2 movably installed in the chamber 50 and seated on the object member stage 90;
A laser light generator 100 movably installed in the chamber 50 for generating laser light for heating the solder material 1; A first optical system 200 for guiding laser light generated in the laser light generator 100 to the solder material 1; (2) provided on the first optical path (L2) of the laser light and for the portion where the solder material (1) is coupled at the soldering object member (2) to the first light path An optical path dividing unit 300 dividing the optical path dividing unit 300 from the optical path dividing unit 300; And a photographing unit (400) for photographing an image of a target member with respect to a portion where the solder material (1) is joined at the soldering object member (2) divided by the optical path dividing unit (300) (10);
A display for displaying an image of the soldering object member 2 on the screen so that the operator can observe the image of the soldering object member 2 photographed by the photographing unit 400, (40);
And a control unit (30) for controlling the laser optical head module (10) and the display unit (40). The method according to claim 1,
The chamber (50)
A gas supply part for supplying an inert gas to the processing space S and an exhaust system 53 for discharging the gas in the processing space S to the outside while maintaining a predetermined pressure in the processing space S ) Is mounted on the substrate (10). The method according to claim 1,
The light path dividing unit 300,
Is coated with a first coating member that reflects only the visible light band of the light corresponding to the object member image in the soldering object member (2) and transmits the laser light band. The method according to claim 1,
The photographing unit (400)
A camera unit 410 for capturing an image of the target member with respect to a portion where the solder material 1 is bonded,
And a second optical system (420) for guiding the light of the object member image divided from the light path dividing unit (300) to the camera unit (410). The method of claim 3,
The second optical system includes:
The camera unit 410 is installed in the second optical path L1 between the photographing unit 400 and the optical path splitter 300 and transmits light of the object member image through the second optical path L1. And a reflector (600) for reflecting the light onto the substrate. The method of claim 3,
Wherein the second optical system (420) reflects a laser band in the soldering object member (2) and transmits only a visible light band. The method of claim 6,
At least a part of the second optical system 420 may be made of a material that reflects the laser band and transmits only the visible light band at the soldering object member 2 or may be coated with a material that reflects the laser band and transmits only the visible light band Features a soldering system. The method according to claim 1,
Wherein the light path dividing unit (300) transmits the laser band in the soldering object member (2) and reflects the visible light band. The method of claim 8,
The light path dividing unit 300 may include a prism made of a material that transmits a laser band in the soldering object member 2 and reflects a visible light band or a prism that transmits a laser band in the soldering object member 2, And a prism coated by a reflective material.
KR1020150127064A 2015-09-08 2015-09-08 Soldering System KR20170029904A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020150127064A KR20170029904A (en) 2015-09-08 2015-09-08 Soldering System

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020150127064A KR20170029904A (en) 2015-09-08 2015-09-08 Soldering System

Publications (1)

Publication Number Publication Date
KR20170029904A true KR20170029904A (en) 2017-03-16

Family

ID=58497792

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150127064A KR20170029904A (en) 2015-09-08 2015-09-08 Soldering System

Country Status (1)

Country Link
KR (1) KR20170029904A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200001712U (en) 2019-01-23 2020-07-31 강석현 Assembly type footing board
US10886248B2 (en) 2018-01-10 2021-01-05 Samsung Electronics Co., Ltd. Laser bonding apparatus, method of bonding semiconductor devices, and method of manufacturing semiconductor package
KR102301624B1 (en) * 2020-11-10 2021-09-13 챔프다이아(주) Vacuum welding apparatus
KR20230039993A (en) * 2021-09-15 2023-03-22 엘에스이브이코리아 주식회사 Laser Soldering System

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10886248B2 (en) 2018-01-10 2021-01-05 Samsung Electronics Co., Ltd. Laser bonding apparatus, method of bonding semiconductor devices, and method of manufacturing semiconductor package
KR20200001712U (en) 2019-01-23 2020-07-31 강석현 Assembly type footing board
KR102301624B1 (en) * 2020-11-10 2021-09-13 챔프다이아(주) Vacuum welding apparatus
KR20230039993A (en) * 2021-09-15 2023-03-22 엘에스이브이코리아 주식회사 Laser Soldering System
WO2023043058A1 (en) * 2021-09-15 2023-03-23 엘에스이브이코리아 주식회사 Laser soldering system

Similar Documents

Publication Publication Date Title
KR20170029904A (en) Soldering System
US6696668B2 (en) Laser soldering method and apparatus
JP3962782B1 (en) Soldering inspection method, solder bonding method, and solder bonding apparatus
US8269140B2 (en) Method and apparatus for laser soldering
CN112996628B (en) Laser processing device and laser processing method
JPH03193282A (en) Laser soldering device for smd-element
TWI403378B (en) Bonding device
TWI775845B (en) Laser soldering method and device
CN113056346B (en) Laser processing device and laser processing method
EP3766623A1 (en) Laser power control device, laser processing device, and laser power control method
JPH10145094A (en) Parts mounting device
JP5120751B2 (en) Bonding equipment
JP2005275135A (en) Method and apparatus for correcting defective pixel of liquid crystal display
KR20170014768A (en) Laser device for cutting fluorescent film
JP7255837B2 (en) Laser soldering method and equipment
KR20160114249A (en) Soldering system
JP6836938B2 (en) Manufacturing method of die bonding equipment and semiconductor equipment
KR20160114248A (en) Laser optic head moule, and soldering system having the same
WO2016153099A1 (en) Laser optic head module and soldering system having same
JP2006261410A (en) Component mounting head and component mounting method
CN117020449A (en) Laser processing device and laser processing method
US20240139877A1 (en) Laser devices and methods for laser metal deposition
JP2011066189A (en) Component crimping device
KR102384806B1 (en) Mounting device and manufacturing method of semiconductor device
JP2011009243A (en) Method of melting solder, method of manufacturing packaging substrate, and solder melting apparatus

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E601 Decision to refuse application