KR20170024632A - 접촉저항을 이용한 나노용접 방법 - Google Patents
접촉저항을 이용한 나노용접 방법 Download PDFInfo
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- KR20170024632A KR20170024632A KR1020150119461A KR20150119461A KR20170024632A KR 20170024632 A KR20170024632 A KR 20170024632A KR 1020150119461 A KR1020150119461 A KR 1020150119461A KR 20150119461 A KR20150119461 A KR 20150119461A KR 20170024632 A KR20170024632 A KR 20170024632A
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- nanowire
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- 238000000034 method Methods 0.000 title claims abstract description 48
- 238000003466 welding Methods 0.000 title claims abstract description 42
- 238000010438 heat treatment Methods 0.000 title description 15
- 239000002070 nanowire Substances 0.000 claims abstract description 100
- 239000000758 substrate Substances 0.000 claims abstract description 33
- 239000000463 material Substances 0.000 claims description 15
- 239000002114 nanocomposite Substances 0.000 claims description 7
- 230000002411 adverse Effects 0.000 abstract description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 20
- 239000002042 Silver nanowire Substances 0.000 description 16
- 238000000576 coating method Methods 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 7
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
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- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 229920001940 conductive polymer Polymers 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910002601 GaN Inorganic materials 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
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- 238000005054 agglomeration Methods 0.000 description 1
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- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
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- 238000005266 casting Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
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- 238000003618 dip coating Methods 0.000 description 1
- 239000002079 double walled nanotube Substances 0.000 description 1
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000007645 offset printing Methods 0.000 description 1
- 238000005325 percolation Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
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- 239000000523 sample Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002109 single walled nanotube Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/0026—Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K11/00—Resistance welding; Severing by resistance heating
- B23K11/0013—Resistance welding; Severing by resistance heating welding for reasons other than joining, e.g. build up welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K11/00—Resistance welding; Severing by resistance heating
- B23K11/002—Resistance welding; Severing by resistance heating specially adapted for particular articles or work
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
-
- B23K2201/18—
-
- B23K2201/36—
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Electric Cables (AREA)
- Powder Metallurgy (AREA)
Abstract
Description
도 2는 직류 전원을 이용한 용접의 직접적인 전기에너지 인가 방식을 나타내는 개념도이다.
도 3은 유도가열을 이용한 용접의 간접적인 전기에너지 인가 방식을 나타내는 개념도이다.
도 4는 본 발명의 나노용접을 적용하기 전의 나노와이어의 SEM 사진이다.
도 5는 본 발명의 나노용접을 적용한 후의 나노와이어의 SEM 사진이다.
도 6은 열처리 방식으로 용접한 경우의 투과도를 나타낸 결과이다.
Claims (8)
- 나노와이어에 전기에너지를 직간접적으로 인가하여, 나노와이어들 간의 접촉부위가 접촉저항에 의하여 서로 용접되도록 하는 나노와이어의 나노용접 방법.
- 제1항에 있어서,
상기 나노와이어는, 금속성 나노와이어 또는 이를 포함하는 나노복합소재인 나노와이어의 나노용접 방법. - ⅰ) 기판에 나노와이어 층을 형성하는 단계; 및
ⅱ) 상기 나노와이어 층에 전류를 발생하여 나노와이어들 간의 접촉부위가 접촉저항에 의하여 서로 용접되는 것을 포함하는 투명전극의 제조방법. - 제3항에 있어서,
상기 기판은 플렉서블 기판 또는 대면적 기판을 포함하는 투명전극의 제조방법. - 제3항 또는 제4항에 있어서,
상기 나노와이어는, 금속성 나노와이어 또는 이를 포함하는 나노복합소재인 투명전극의 제조방법. - 나노와이어에 전기에너지를 직간접적으로 인가하여 나노와이어들 간의 접촉부위를 접촉저항에 의하여 서로 용접시킨 나노와이어 층을 포함하는 투명전극.
- 제6항에 있어서,
상기 나노와이어는, 금속성 나노와이어 또는 이를 포함하는 나노복합소재인 투명전극. - 제6항 또는 제7항의 투명전극을 포함하는 전자소자.
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KR1020150119461A KR101782212B1 (ko) | 2015-08-25 | 2015-08-25 | 접촉저항을 이용한 나노용접 방법 |
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KR1020150119461A KR101782212B1 (ko) | 2015-08-25 | 2015-08-25 | 접촉저항을 이용한 나노용접 방법 |
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KR20170024632A true KR20170024632A (ko) | 2017-03-08 |
KR101782212B1 KR101782212B1 (ko) | 2017-09-27 |
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Cited By (1)
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CN117464155A (zh) * | 2023-12-28 | 2024-01-30 | 合肥国镜仪器科技有限公司 | 一种纳米线焊接方法和焊接装置 |
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US8354593B2 (en) | 2009-07-10 | 2013-01-15 | Nanocomp Technologies, Inc. | Hybrid conductors and method of making same |
KR101518402B1 (ko) | 2014-04-17 | 2015-05-11 | 엔젯 주식회사 | 정전기력을 이용한 용융 침착 모델링 인쇄 장치 |
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- 2015-08-25 KR KR1020150119461A patent/KR101782212B1/ko active IP Right Grant
Non-Patent Citations (3)
Title |
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Chin-Jui Ni et al. Electroless nanowelding of silver nanowires at room temperature. RSC advances. 2014,4,40330-40338 |
Mark L.Bringersma et al. Self-limited plasmonic welding of silver nanowire junction. Nature materials. Vol 11, 241-249, 2012 |
Seung Hwan Ko et al. Fast plasmonic laser nanowelding for Cu-nanowire percolation network for flexible transparant conductors and stretchable electronics. Advanced materials. 2014, 26, 5808-5814 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN117464155A (zh) * | 2023-12-28 | 2024-01-30 | 合肥国镜仪器科技有限公司 | 一种纳米线焊接方法和焊接装置 |
CN117464155B (zh) * | 2023-12-28 | 2024-03-15 | 合肥国镜仪器科技有限公司 | 一种纳米线焊接方法和焊接装置 |
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