KR20170018639A

KR20170018639A - Thermal detecting sensor module package and method of fabricating the same

Info

Publication number: KR20170018639A
Application number: KR1020150112521A
Authority: KR
Inventors: 이병수; 김대현; 이우원; 백대선; 김성용
Original assignee: 주식회사 템퍼스; 싸니코전자 주식회사
Priority date: 2015-08-10
Filing date: 2015-08-10
Publication date: 2017-02-20

Abstract

The present invention provides a heat sensor module package and a method of fabricating the same. The heat sensor module package comprises: a substrate; a heat sensor which is mounted on the substrate and is capable of sensing an infrared wave band; a first housing which is bonded to at least a portion of the substrate so as to protect the heat sensor, thereby defining an inner space and has a first opening formed so as to correspond to the heat sensor; an optical member which is formed on the first housing to cover the first opening and is capable of transmitting infrared wave band-light; and a second housing having a second opening which is formed at a position corresponding to the first opening, enveloping the surrounding of the first housing, and disposed spaced apart from the first housing.

Description

TECHNICAL FIELD [0001] The present invention relates to a thermal detecting sensor module package and a manufacturing method thereof,

The present invention relates to a thermal sensor module package and a manufacturing method thereof, and more particularly, to a thermal sensor module package capable of detecting infrared rays and a manufacturing method thereof.

In the case of an infrared sensor, the electromotive force that appears when infrared radiation is input is proportional to the temperature difference between the cold region and the hot region, which depends on how efficiently the input energy is absorbed and used.

Therefore, absorbing as much energy as possible, and designing not to lose the energy once absorbed is a key issue for improving the sensitivity of the infrared sensor.

On the other hand, when hot air or cold air is applied from the side of the infrared sensor, or when an adjacent object is heated, heat is transferred through the housing by convection. Accordingly, an instantaneous temperature difference occurs between the housing and the cooling unit, thereby generating a radiation from the housing and the lens, thereby disturbing the sensor, thereby causing the sensitivity of the sensor to deteriorate.

Korean Patent No. 10-0593555 (2006.06.20)

SUMMARY OF THE INVENTION The present invention provides a thermal sensor module package and method for manufacturing the same that can improve sensitivity of a thermal sensor by minimizing the influence of a temperature difference generated from the outside to solve various problems including the above- . However, these problems are illustrative and do not limit the scope of the present invention.

According to one aspect of the present invention, a thermal sensing sensor module package is provided. The thermal sensing module package includes a substrate; A thermal sensor mounted on the substrate and capable of sensing an infrared wavelength band; A first housing having an inner space defined by at least a portion of an upper surface of the substrate to protect the thermal sensor and having a first opening formed to correspond to the thermal sensor; An optical member formed on the first housing to cover the first opening and capable of passing light in an infrared wavelength band; And a second housing having a second opening formed at a position corresponding to the first opening and surrounding an outer periphery of the first housing, the second housing being spaced apart from the first housing.

In the thermal sensor module package, the first housing and the second housing may be entirely spaced apart from each other on the substrate so that heat is not directly transmitted to each other due to conduction.

In the heat sensing sensor module package, the optical member is disposed between the first housing and the second housing, and the optical member transmits heat directly by conduction between the first housing and the second housing And at least a part of the optical member is in contact with the first housing.

In the heat sensing sensor module package, the optical member may be coupled to the lower surface of the second housing so as to cover the second opening by the heat block adhesive.

Wherein the first housing and the second housing are spaced apart from each other by a distance that the first housing and the second housing are spaced apart from each other by the optical member, And a portion of the second housing that is in contact with the substrate may be spaced apart from each other.

In the thermal sensor module package, the optical member may include a lens or a filter capable of passing light of a specific wavelength band.

In the thermal sensor module package, the internal space may include a read integrated circuit (ROIC) chip.

According to another aspect of the present invention, a thermal sensing sensor module package is provided. The thermal sensor module package includes: a first housing disposed on the infrared sensor at a predetermined distance; And a second housing surrounding an outer periphery of the first housing and being spaced apart from the first housing, wherein the first housing and the second housing have through holes formed at positions corresponding to the infrared sensor, And a lens or a filter bonded between the first housing and the second housing by a heat barrier adhesive may be disposed in the through hole.

According to another aspect of the present invention, a method of manufacturing a heat sensing sensor module package is provided. The method for manufacturing the thermal sensor module package includes: preparing a substrate; Mounting a thermal sensor on the substrate; Contacting a first housing having a first opening formed at a position corresponding to the heat sensing sensor with at least a portion of an upper surface of the substrate, the first housing being capable of protecting the heat sensing sensor; Forming an optical member on the first housing capable of passing light of a specific wavelength band so as to cover the first opening; And a second housing having a second opening formed at a position corresponding to the first opening so as to surround the outer periphery of the first housing, the second housing being spaced apart from the first housing.

According to an embodiment of the present invention, as described above, a thermal sensing sensor module package having a structure advantageous to miniaturization can be provided, which prevents disturbance of the infrared sensor, reduces the viewing angle and improves the sensitivity of the sensor at low cost, Can be provided. Of course, the scope of the present invention is not limited by these effects.

1 is a schematic view of a thermal sensor module package according to an embodiment of the present invention.
2 is a schematic view of a thermal sensor module package according to a comparative example of the present invention.
FIG. 3 is a flowchart illustrating a method of manufacturing a thermal sensor module package according to an embodiment of the present invention. Referring to FIG.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. It should be understood, however, that the invention is not limited to the disclosed embodiments, but may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, Is provided to fully inform the user. Also, for convenience of explanation, the components may be exaggerated or reduced in size.

It is to be understood that throughout the specification, when an element such as a film, region or substrate is referred to as being "on", "connected to", "laminated" or "coupled to" another element, It is to be understood that elements may be directly "on", "connected", "laminated" or "coupled" to another element, or there may be other elements intervening therebetween. On the other hand, when one element is referred to as being "directly on", "directly connected", or "directly coupled" to another element, it is interpreted that there are no other components intervening therebetween do. Like numbers refer to like elements. As used herein, the term "and / or" includes any and all combinations of one or more of the listed items.

1 is a schematic view illustrating a thermal sensing module package according to an embodiment of the present invention.

1, a thermal sensor module package 100 according to an exemplary embodiment of the present invention includes a substrate 10, a thermal sensor 20, a first housing 30, an optical member 40, And may include a housing 50.

First, the thermal sensor module package 100 may include a substrate 10 having a plurality of through holes and a wiring layer 15 in a lower portion thereof. The substrate 10 may be formed of a single substrate, but may be formed of a first substrate 10a and a second substrate 10b. In this case, the first substrate 10a and the second substrate 10b may be made of the same material. Hereinafter, the first substrate 10a and the second substrate 10b will be described in detail together with the housings 30 and 50. [

The substrate 10 may be, for example, a silicon wafer. Here, the wiring layer 15 can be understood as an electrode formed on the lower side of the substrate 10, and the electrode can be used to electrically connect the circuit element and the sensor element in the logic circuit. The electrode may be formed to protrude on the insulating layer, or may be formed by forming a trench pattern in the insulating layer and then filling it with a metal layer.

In addition, the heat sensing sensor 20 can be mounted on the substrate 10. Fig. The thermal sensor 20 can sense the infrared wavelength band. The thermal sensor 20 is a kind of infrared ray sensor, for example, a photonic type sensor using a photovoltaic effect or a photoconductive effect, a bolometer, a pyroelectric sensor, One of the thermal type sensors, such as a thermopile sensor, may be used.

For example, when the thermopile sensor is used as a thermal sensor, the thermopile sensor can detect the amount of infrared radiation emitted from the object, and can perform minute temperature measurement without self-heating, thereby finely monitoring the temperature of the object Can be used. The thermopile sensor can be manufactured by conventional semiconductor process, and it can be cooled with less heat than other infrared sensors and can have high accuracy and reliability even at low cost.

Such a thermopile sensor has two different materials, one of which is made of a junction and the other of which is made of an open structure. When a temperature difference occurs between the contact portion and the open portion, the thermopile sensor is proportional to the temperature difference The temperature can be sensed by using the Seebeck effect, which generates thermoelectric power. In the case of such a thermopile sensor, the electromotive force that appears when infrared radiation is input is relatively proportional to the temperature difference between the low temperature portion and the high temperature portion, which depends on how much the input energy is efficiently absorbed and used.

The thermopile sensor needs to absorb as much energy as possible and it is important to design the sensor so as not to lose the energy once absorbed. In addition to the part that improves the sensitivity of the sensor, In addition to high output sensitivity, fast response characteristics can be important for a thermopile to be applied.

For this purpose, the role of the black body absorbing infrared rays may be relatively important, and such black bodies should be very blackish and at the same time opaque surface materials (reflectance). It may additionally be possible to control by the addition of a substance capable of controlling the thermal conductivity of the material. Here, the specific structure and technique of the thermopile sensor are already well known, and a detailed description thereof will be omitted.

The thermal sensor 20 may include a support layer 21 to support the thermal sensor 20. The support layer 21 is formed on the substrate 10 and may be directly electrically connected to the electrode included in the substrate 10 by providing a metallic anchor in the support layer 21 although not shown here, The substrate 10 and the thermal sensor 20 may be electrically connected to each other by using the conductive wire 29. In this case,

In addition, the thermal sensor 20 may include at least two or more heat elements that can be electrically connected to the above-described electrodes. The entirety of the at least two rows may be connected to, for example, an n-type column body 26 and a cathode terminal that can be connected to a negative terminal, and a p-type column body 27).

The n-type column body 26 and the p-type column body 27 may be formed on the insulating layer 22 and may be connected in series to amplify the electric energy to constitute the thermal sensor 20 . Here, the insulating layer 22 may be, for example, silicon nitride (SiN) or silicon oxide (SiO ₂ ). One end of the n-type column body 26 and one end of the p-type column body 27 may be electrically connected to the wiring layer 15 by using the conductive wire 29.

On the other hand, the thermal sensor 20 may further include an infrared absorbing layer 28. The infrared absorbing layer 28 may include a material having a high infrared absorption rate and may be formed of a material such as a paint, a polymer, a black gold, a black carbon, a carbon nano-tube, An oxide layer or a metal nitride layer, or a black layer formed using nickel chromium (NiCr) or the like.

In addition, the first housing 30 can define the inner space by being bonded to at least a part of the upper surface of the substrate 10 so as to protect the heat-sensing sensor 20. The first housing 30 is formed on at least a part of the substrate 10 so as to include the heat sensing sensor 20 therein. And a first opening 32 formed at a position corresponding to the heat sensing sensor 20 so that infrared rays can be sensed by the heat sensing sensor 20. [ The second housing 50 having the second opening 52 formed at a position corresponding to the first opening 32 so as to surround the outer periphery of the first housing 30 may be disposed apart from the first housing . Here, the first housing 30 and the second housing 50 may be made of a metal material.

In addition, the internal space defined by the first housing 30 may further include a reading integrated circuit (ROIC) chip 17 in addition to the heat sensing sensor 20. [ The reading integrated circuit chip 17 may be electrically connected to the thermal sensor 20 through at least the positive terminal and the negative terminal. Thus, the readout integrated circuit may be provided to process the electromotive force generated in the thermal sensing sensor 20, or may be provided to control the thermal sensing sensor 20.

In addition, the first housing 30 and the second housing 50 may be disposed so as to be entirely apart from each other on the substrate 10 so that heat is not directly transmitted to each other by conduction. The first housing 30 and the second housing 50 may be spaced apart from each other to improve the sensitivity of the heat sensing sensor 20. [ The first housing 30 surrounds the side surface of the first substrate 10a and can be bonded onto at least a part of the second substrate 10b. On the other hand, the second housing 50 is spaced apart from the first housing 30 and can be bonded onto at least a part of the second substrate 10b without being in contact with the first substrate 10a.

In this case, the distances of the first housing 30 and the second housing 50 from each other may be designed so that the distances between the upper surface and the side surface of the respective housings are different from each other. However, The side view can also be spaced. However, this can be designed to be adjusted in some cases, as a distance that can minimize the influence of the amount of incident light or the temperature difference caused by hot wind or cold wind around the sensor.

The first housing 30 and the second housing 50 are separated from each other not only by the upper surface and the side surface but also by the portion contacting the substrate 10 by the hot air and the cold air flowing from the side surface or the front surface of the heat sensing sensor 20 It is possible to prevent disturbance of the thermal sensor 20 by blocking the radiation generated by the heating of the second housing 50 by the first housing 30.

In addition, the thermal sensor module package 100 may further include an optical member 40 capable of passing light (I) in an infrared wavelength band. The optical member 40 may include, for example, a lens or a filter capable of passing light in a specific wavelength band, that is, an infrared wavelength band.

The optical member 40 is disposed between the first housing 30 and the second housing 50 so as to block direct transmission of heat by conduction between the first housing 30 and the second housing 50 The first housing 30 can be coupled with the second housing 50 by using the heat seal adhesive 45. That is, the opposite side of the optical member 40 contacting the second housing 50 using the heat shield adhesive 45 may be formed in a region where the first opening 32 is located while being in contact with the first housing 30 . The optical member 40 is coupled to the lower surface of the second housing 50 so as to cover the second opening 52 by the heat shield adhesive 45 and is fixed to the first housing 32 so as to cover the first opening 32. [ (Not shown). Here, the heat block adhesive 45 may be, for example, PR (photo resist) as a medium having low heat transfer.

The first housing 30 and the second housing 50 are disposed so that the distances between the first housing 30 and the second housing 50 are spaced apart from each other by a distance distanced by the optical member 40 However, it may be designed such that the radiant heat generated in the second housing 50 is separated from the first housing 30 only by a distance.

In addition, the infrared rays incident on the square of the thermal sensor module package 100 are blocked by the two first and second housings 30 and 50, and the viewing angle is narrowed. 1, the light I in the infrared wavelength band incident on the sensor at the periphery of the second opening 52, that is, the end portion of the second housing 50, Since the light I in the infrared wavelength band is reflected by the first housing 30 so that the light I in the infrared wavelength band does not reach the thermal sensor 20 through the optical member 40, Temperature interference by other objects can be minimized.

2 is a schematic view of a thermal sensor module package according to a comparative example of the present invention.

2, a thermal sensing module package 110 according to a comparative example of the present invention includes a substrate 10, a thermal sensor 20 (not shown) included in the thermal sensing module package 100 described with reference to FIG. 1, And the first housing 30 are all the same, a detailed description thereof will be omitted.

The thermal sensor module package 110 includes only the first housing 30 surrounding the thermal sensor 20 so that the thermal sensor module package 110 can be mounted on the side of the thermal sensor 20, When the object is heated, heat can be transferred through the first housing 30 by convection. The first housing 30 is heated by the heat applied from the outside and is transmitted to the cold junction of the heat sensing sensor 20 through the metal substrate 10 . Accordingly, an instantaneous temperature difference occurs between the first housing 30 and the cooling joint of the heat sensing sensor 20. That is, a radiation is generated in the first housing 30 and the optical member 40 heated or cooled by the hot wind or the cold wind, and the radiation is transmitted to the heat sensing sensor 20 together with the light I in the infrared wavelength band The sensor 20 is disturbed until it reaches the equilibrium state.

In order to solve such a problem, it is possible to implement a thermal sensor module package in which the sensitivity can be improved at low cost by referring to the manufacturing method of the thermal sensor module package of FIG.

3 is a flowchart illustrating a method of manufacturing a thermal sensor module package according to an embodiment of the present invention.

Referring to FIG. 3, the method for manufacturing the thermal sensor module package 100 includes preparing a substrate (S100), mounting a thermal sensor on the substrate (S200), protecting the thermal sensor, (S300) of joining a first housing having a first opening formed on a heat sensing sensor to at least a part of the upper surface of the substrate so as to transmit heat to the heat sensing sensor, (S400) of forming an optical member capable of passing light through the first housing (S400); and a second housing having a second opening formed at a position corresponding to the first opening so as to surround the outer periphery of the first housing, (S500) of arranging them apart from each other with respect to the housing.

1, the thermal sensor module package 100 is disposed on at least a portion of the substrate 10 on which the infrared sensor 20 is mounted, and the infrared sensor 20 is disposed inside And a second housing 50 spaced apart from the first housing 30. The first housing 30 may include a first housing 30, The first housing 30 and the second housing 50 have through holes formed at positions corresponding to the infrared sensor 20. The through holes are formed by the first opening 32 and the second opening 52 Can be understood.

A lens or a filter capable of passing light of an infrared wavelength band is disposed between the first housing 30 and the second housing 50 by the heat insulating adhesive 45 in the through hole, It is possible to implement the thermal sensor module package 100 in which the reduction phenomenon due to the heat is reduced.

As described above, disturbance of the thermal infrared sensor can be prevented by blocking the radiation of the second metal can by the hot air flowing from the side or the front or by the cold air. In addition, it is possible to implement a thermal sensor module package that has the effect of blocking two infrared ray incident on a square by two metal cans and narrowing a viewing angle.

While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims. Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims.

10: substrate
15:
17: Read Integrated Circuit (ROIC) chip
20: Thermal sensor
21: Support layer
22: Insulating layer
26: n type thermal whole
27: p-type thermal whole
28: infrared absorbing layer
29: conductive wire
30: first housing
32: first opening
40: optical member
45: heat seal adhesive
50: second housing
52: second opening
100, 110: Thermal sensor module package

Claims

Board;
A thermal sensor mounted on the substrate and capable of sensing an infrared wavelength band;
A first housing having an inner space defined by at least a portion of an upper surface of the substrate to protect the thermal sensor and having a first opening formed to correspond to the thermal sensor;
An optical member formed on the first housing to cover the first opening and capable of passing light in an infrared wavelength band; And
A second housing having a second opening formed at a position corresponding to the first opening and surrounding an outer periphery of the first housing, the second housing being spaced apart from the first housing;
/ RTI >
Thermal sensor module package.

The method according to claim 1,
Wherein the first housing and the second housing are spaced apart from each other on the substrate so that heat is not directly transmitted to the first housing and the second housing by conduction,
Thermal sensor module package.

The method according to claim 1,
Wherein the optical member is disposed between the first housing and the second housing,
Wherein the optical member is coupled to the second housing using a heat block adhesive so as to block direct transfer of heat by conduction between the first housing and the second housing, Which contacts the housing,
Thermal sensor module package.

The method of claim 3,
Wherein the optical member is coupled to the lower surface of the second housing to cover the second opening by the heat-
Thermal sensor module package.

3. The method of claim 2,
The side walls of the first housing and the second housing are spaced apart from each other by a distance at which the first housing and the second housing are spaced apart from each other by the optical member,
Wherein the first housing and the second housing are disposed so as to be spaced apart from each other,
Thermal sensor module package.

The method according to claim 1,
Wherein the optical member includes a lens or a filter capable of passing light of a specific wavelength band,
Thermal sensor module package.

The method according to claim 1,
Wherein the internal space includes a read integrated circuit (ROIC) chip,
Thermal sensor module package.

A first housing disposed on the infrared sensor at a predetermined distance; And
A second housing surrounding the outer periphery of the first housing, the second housing being spaced apart from the first housing;
/ RTI >
Wherein the first housing and the second housing have through holes formed at positions corresponding to the infrared sensor, and the through holes are a lens bonded between the first housing and the second housing by a thermal barrier adhesive or The filter is placed,
Thermal sensor module package.

Preparing a substrate;
Mounting a thermal sensor on the substrate;
Bonding a first housing having a first opening formed in a position corresponding to the heat sensing sensor to at least a part of an upper surface of the substrate, the first housing being capable of protecting the heat sensing sensor;
Forming an optical member on the first housing capable of passing light of a specific wavelength band so as to cover the first opening; And
Disposing a second housing apart from the first housing, the second housing having a second opening formed at a position corresponding to the first opening so as to surround an outer periphery of the first housing;
/ RTI >
Method of manufacturing a thermal sensor module package.