KR20170015022A - Thermoplastic resin composition for laser direct structuring process and article comprising the same - Google Patents
Thermoplastic resin composition for laser direct structuring process and article comprising the same Download PDFInfo
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- KR20170015022A KR20170015022A KR1020150109218A KR20150109218A KR20170015022A KR 20170015022 A KR20170015022 A KR 20170015022A KR 1020150109218 A KR1020150109218 A KR 1020150109218A KR 20150109218 A KR20150109218 A KR 20150109218A KR 20170015022 A KR20170015022 A KR 20170015022A
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- South Korea
- Prior art keywords
- thermoplastic resin
- resin composition
- carbonate
- weight
- parts
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- 229920005992 thermoplastic resin Polymers 0.000 title claims abstract description 91
- 239000011342 resin composition Substances 0.000 title claims abstract description 68
- 238000000034 method Methods 0.000 title claims abstract description 40
- 239000000654 additive Substances 0.000 claims abstract description 35
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 claims abstract description 28
- 230000000996 additive effect Effects 0.000 claims abstract description 27
- 229910052784 alkaline earth metal Inorganic materials 0.000 claims abstract description 7
- 229910000288 alkali metal carbonate Inorganic materials 0.000 claims abstract description 4
- 150000008041 alkali metal carbonates Chemical class 0.000 claims abstract description 4
- 229920005989 resin Polymers 0.000 claims description 39
- 239000011347 resin Substances 0.000 claims description 39
- 229920002554 vinyl polymer Polymers 0.000 claims description 22
- 229910052751 metal Inorganic materials 0.000 claims description 20
- 239000002184 metal Substances 0.000 claims description 20
- 238000007747 plating Methods 0.000 claims description 19
- 239000004431 polycarbonate resin Substances 0.000 claims description 17
- 229920005668 polycarbonate resin Polymers 0.000 claims description 16
- 238000012360 testing method Methods 0.000 claims description 16
- 239000003086 colorant Substances 0.000 claims description 11
- 239000011256 inorganic filler Substances 0.000 claims description 9
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 9
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 8
- 229910001385 heavy metal Inorganic materials 0.000 claims description 8
- 229910052596 spinel Inorganic materials 0.000 claims description 8
- 239000011029 spinel Substances 0.000 claims description 8
- -1 alkaline earth metal carbonate Chemical class 0.000 claims description 7
- 238000002347 injection Methods 0.000 claims description 7
- 239000007924 injection Substances 0.000 claims description 7
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 6
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 claims description 6
- 150000004696 coordination complex Chemical class 0.000 claims description 6
- 238000001746 injection moulding Methods 0.000 claims description 6
- 150000001879 copper Chemical class 0.000 claims description 5
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 4
- 238000000691 measurement method Methods 0.000 claims description 4
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical group [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 claims description 4
- 229910052783 alkali metal Inorganic materials 0.000 claims description 3
- 150000001340 alkali metals Chemical class 0.000 claims description 3
- 150000001342 alkaline earth metals Chemical class 0.000 claims description 3
- AYJRCSIUFZENHW-UHFFFAOYSA-L barium carbonate Chemical compound [Ba+2].[O-]C([O-])=O AYJRCSIUFZENHW-UHFFFAOYSA-L 0.000 claims description 3
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 claims description 3
- 229920006122 polyamide resin Polymers 0.000 claims description 3
- 229920000412 polyarylene Polymers 0.000 claims description 3
- 229920001225 polyester resin Polymers 0.000 claims description 3
- 239000004645 polyester resin Substances 0.000 claims description 3
- 239000011734 sodium Substances 0.000 claims description 3
- 229910000029 sodium carbonate Inorganic materials 0.000 claims description 3
- 239000000178 monomer Substances 0.000 description 12
- 239000000203 mixture Substances 0.000 description 10
- 229920000578 graft copolymer Polymers 0.000 description 8
- 239000010949 copper Substances 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 6
- 238000000354 decomposition reaction Methods 0.000 description 6
- 229920001971 elastomer Polymers 0.000 description 6
- 229920006164 aromatic vinyl copolymer Polymers 0.000 description 5
- 150000001768 cations Chemical class 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- WCMHCPWEQCWRSR-UHFFFAOYSA-J dicopper;hydroxide;phosphate Chemical compound [OH-].[Cu+2].[Cu+2].[O-]P([O-])([O-])=O WCMHCPWEQCWRSR-UHFFFAOYSA-J 0.000 description 5
- 238000002845 discoloration Methods 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 4
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 4
- 229920006026 co-polymeric resin Polymers 0.000 description 4
- 229910044991 metal oxide Inorganic materials 0.000 description 4
- 150000004706 metal oxides Chemical class 0.000 description 4
- 239000002667 nucleating agent Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- RAOSIAYCXKBGFE-UHFFFAOYSA-K [Cu+3].[O-]P([O-])([O-])=O Chemical compound [Cu+3].[O-]P([O-])([O-])=O RAOSIAYCXKBGFE-UHFFFAOYSA-K 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- JGDFBJMWFLXCLJ-UHFFFAOYSA-N copper chromite Chemical compound [Cu]=O.[Cu]=O.O=[Cr]O[Cr]=O JGDFBJMWFLXCLJ-UHFFFAOYSA-N 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 239000008188 pellet Substances 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 230000003746 surface roughness Effects 0.000 description 3
- 229910052718 tin Inorganic materials 0.000 description 3
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- JJLJMEJHUUYSSY-UHFFFAOYSA-L Copper hydroxide Chemical compound [OH-].[OH-].[Cu+2] JJLJMEJHUUYSSY-UHFFFAOYSA-L 0.000 description 2
- 239000005750 Copper hydroxide Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910010413 TiO 2 Inorganic materials 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 238000012662 bulk polymerization Methods 0.000 description 2
- 229910017052 cobalt Inorganic materials 0.000 description 2
- 239000010941 cobalt Substances 0.000 description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 2
- 229910001956 copper hydroxide Inorganic materials 0.000 description 2
- 229910000365 copper sulfate Inorganic materials 0.000 description 2
- PDZKZMQQDCHTNF-UHFFFAOYSA-M copper(1+);thiocyanate Chemical compound [Cu+].[S-]C#N PDZKZMQQDCHTNF-UHFFFAOYSA-M 0.000 description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 2
- 230000002542 deteriorative effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 239000002243 precursor Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 239000011135 tin Substances 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- YKPAABNCNAGAAJ-UHFFFAOYSA-N 1,1-Bis(4-hydroxyphenyl)propane Chemical compound C=1C=C(O)C=CC=1C(CC)C1=CC=C(O)C=C1 YKPAABNCNAGAAJ-UHFFFAOYSA-N 0.000 description 1
- HNDVYGDZLSXOAX-UHFFFAOYSA-N 2,6-dichloro-4-propylphenol Chemical compound CCCC1=CC(Cl)=C(O)C(Cl)=C1 HNDVYGDZLSXOAX-UHFFFAOYSA-N 0.000 description 1
- XKZQKPRCPNGNFR-UHFFFAOYSA-N 2-(3-hydroxyphenyl)phenol Chemical compound OC1=CC=CC(C=2C(=CC=CC=2)O)=C1 XKZQKPRCPNGNFR-UHFFFAOYSA-N 0.000 description 1
- JPICHIOZZCWABG-UHFFFAOYSA-N 6-chloro-1-(4-hydroxyphenyl)-4-[2-(4-hydroxyphenyl)propyl]cyclohexa-2,4-dien-1-ol Chemical compound OC1=CC=C(C=C1)C(CC1=CC(C(C=C1)(O)C1=CC=C(C=C1)O)Cl)C JPICHIOZZCWABG-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920002748 Basalt fiber Polymers 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- 229910015372 FeAl Inorganic materials 0.000 description 1
- 229910000604 Ferrochrome Inorganic materials 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229910017625 MgSiO Inorganic materials 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 239000004419 Panlite Substances 0.000 description 1
- YGYAWVDWMABLBF-UHFFFAOYSA-N Phosgene Chemical compound ClC(Cl)=O YGYAWVDWMABLBF-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910010340 TiFe Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- JAQXDZTWVWLKGC-UHFFFAOYSA-N [O-2].[Al+3].[Fe+2] Chemical compound [O-2].[Al+3].[Fe+2] JAQXDZTWVWLKGC-UHFFFAOYSA-N 0.000 description 1
- QEFDIAQGSDRHQW-UHFFFAOYSA-N [O-2].[Cr+3].[Fe+2] Chemical compound [O-2].[Cr+3].[Fe+2] QEFDIAQGSDRHQW-UHFFFAOYSA-N 0.000 description 1
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- JYMITAMFTJDTAE-UHFFFAOYSA-N aluminum zinc oxygen(2-) Chemical compound [O-2].[Al+3].[Zn+2] JYMITAMFTJDTAE-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000001588 bifunctional effect Effects 0.000 description 1
- VCCBEIPGXKNHFW-UHFFFAOYSA-N biphenyl-4,4'-diol Chemical compound C1=CC(O)=CC=C1C1=CC=C(O)C=C1 VCCBEIPGXKNHFW-UHFFFAOYSA-N 0.000 description 1
- 229920000402 bisphenol A polycarbonate polymer Polymers 0.000 description 1
- 229940106691 bisphenol a Drugs 0.000 description 1
- 238000000071 blow moulding Methods 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 150000004650 carbonic acid diesters Chemical class 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- GRLMDYKYQBNMID-UHFFFAOYSA-N copper iron(3+) oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[Fe+3].[Fe+3].[Cu+2] GRLMDYKYQBNMID-UHFFFAOYSA-N 0.000 description 1
- UAMZXLIURMNTHD-UHFFFAOYSA-N dialuminum;magnesium;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[Mg+2].[Al+3].[Al+3] UAMZXLIURMNTHD-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000007720 emulsion polymerization reaction Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- FGDAXMHZSNXUFJ-UHFFFAOYSA-N ethene;prop-1-ene;prop-2-enenitrile Chemical group C=C.CC=C.C=CC#N FGDAXMHZSNXUFJ-UHFFFAOYSA-N 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- DMTIXTXDJGWVCO-UHFFFAOYSA-N iron(2+) nickel(2+) oxygen(2-) Chemical compound [O--].[O--].[Fe++].[Ni++] DMTIXTXDJGWVCO-UHFFFAOYSA-N 0.000 description 1
- KEHCHOCBAJSEKS-UHFFFAOYSA-N iron(2+);oxygen(2-);titanium(4+) Chemical compound [O-2].[O-2].[O-2].[Ti+4].[Fe+2] KEHCHOCBAJSEKS-UHFFFAOYSA-N 0.000 description 1
- CUSDLVIPMHDAFT-UHFFFAOYSA-N iron(3+);manganese(2+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[Mn+2].[Fe+3].[Fe+3] CUSDLVIPMHDAFT-UHFFFAOYSA-N 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- MFJNMOFNZSZVAP-UHFFFAOYSA-N magnesium chromium(3+) oxygen(2-) Chemical compound [O-2].[Mg+2].[Cr+3] MFJNMOFNZSZVAP-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920002285 poly(styrene-co-acrylonitrile) Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 229920000638 styrene acrylonitrile Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000010557 suspension polymerization reaction Methods 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 238000003856 thermoforming Methods 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000012463 white pigment Substances 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/16—Surface shaping of articles, e.g. embossing; Apparatus therefor by wave energy or particle radiation, e.g. infrared heating
-
- C08K3/0033—
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/10—Metal compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2300/00—Characterised by the use of unspecified polymers
- C08J2300/22—Thermoplastic resins
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Toxicology (AREA)
- Chemically Coating (AREA)
Abstract
Description
The present invention relates to a thermoplastic resin composition for laser direct structuring process and a molded article comprising the same. More specifically, the present invention relates to a thermoplastic resin composition for laser direct structuring process excellent in impact resistance, color stability, and the like and a molded article containing the same.
A laser direct structuring process (LDS process) may be used to plate a metal layer on at least a part of the surface of the molded article formed from the thermoplastic resin composition. The laser direct structuring step is a step performed before the plating step, and means a step of modifying a region to be plated on the surface of a molded article by irradiating a laser beam onto the region to be plated on the surface of the molded article to have properties suitable for plating. For this purpose, the molded article (thermoplastic resin composition) should contain an additive for direct laser structuring capable of forming metal nuclei by laser. The laser direct structuring additive contained in the molded product decomposes upon laser irradiation to generate metal nuclei. In addition, the area to be plated to which the laser is irradiated has a surface roughness. Due to such metal nuclei and surface roughness, the region to be plated modified with laser becomes suitable for plating.
By using the laser direct structuring process, it is possible to form an electric / electronic circuit on a three-dimensional shape of a molded article quickly and economically. For example, the laser direct structuring process can be utilized in the manufacture of antennas for portable electronic devices, radio frequency identification (RFID) antennas, and the like.
Conventional laser direct structuring additives include heavy metal mixture oxide spinel such as copper chromium oxide spinel; Copper salts such as copper hydroxide, phosphate, copper phosphate, copper sulfate or cuprous thiocyanate; A combination of these, and the like.
Such a nucleating agent is an essential element of a direct laser structuring process. However, a nucleating agent mainly composed of a metal or a metal oxide may undergo addition reaction with a thermoplastic resin to cause discoloration and decomposition of the thermoplastic resin, and a thermoplastic resin When the molded article is produced from the composition, the impact resistance, color stability and the like of the molded article can be lowered.
Therefore, it is necessary to develop a thermoplastic resin composition for laser direct structuring process and a molded article containing the same, which can improve the impact resistance, color stability and the like by reducing discoloration and decomposition of the thermoplastic resin by the nucleating agent.
The background art of the present invention is disclosed in U.S. Patent Publication No. 2012-0279764.
An object of the present invention is to provide a thermoplastic resin composition for laser direct structuring process which is excellent in impact resistance, color stability and the like.
Another object of the present invention is to provide a molded article formed from the thermoplastic resin composition.
The above and other objects of the present invention can be achieved by the present invention described below.
One aspect of the present invention relates to a thermoplastic resin composition. Wherein the thermoplastic resin composition comprises a thermoplastic resin; Additives for laser direct structuring (LDS); And a carbonate comprising at least one of an alkali metal carbonate and an alkaline earth metal carbonate, wherein the weight ratio of the additive for direct laser structuring and the carbonate is 1: 0.1 to 1: 0.7.
In an embodiment, the thermoplastic resin composition may include 100 parts by weight of the thermoplastic resin, 0.1 to 20 parts by weight of the additive for laser direct structuring, and 0.01 to 14 parts by weight of the carbonate.
In an embodiment, the thermoplastic resin may include at least one of a polycarbonate resin, a rubber-modified aromatic vinyl resin, a polyamide resin, a polyester resin, and a polyarylene ether resin.
In embodiments, the laser direct structuring additive may comprise a nucleating agent comprising at least one of a heavy metal complex oxide spinel and a copper salt.
In an embodiment, the carbonate may comprise at least one carbonate of an alkali metal and carbonate of an alkaline earth metal.
In embodiments, the carbonate is included at least one of potassium carbonate (K 2 CO 3), sodium carbonate (Na 2 CO 3), calcium carbonate (CaCO 3), barium carbonate (BaCO 3) and magnesium carbonate (MgCO 3) can do.
In an embodiment, the thermoplastic resin composition may further include an inorganic filler, a colorant, or a combination thereof.
In an embodiment, the content of the inorganic filler is 20 to 50 parts by weight with respect to 100 parts by weight of the thermoplastic resin, and the content of the colorant may be 1 to 10 parts by weight with respect to 100 parts by weight of the thermoplastic resin.
In a specific example, the thermoplastic resin composition may have a notch Izod impact strength of 10 kgf · cm / cm or more as measured with a 1/8 "thick specimen according to ASTM D256.
In the specific example, the thermoplastic resin composition was prepared as an injection sample having a size of 50 mm x 50 mm x 1 mm, and a 500 g weight was dropped on the specimen according to the Dupont drop measurement method so that the height at which 50% Or more.
In the specific example, the thermoplastic resin composition was measured for initial color (L 0 * , a 0 * , b 0 * ) according to ASTM D1209 for a 50 mm × 90 mm × 3 mm size injection sample, (L 1 * , a 1 * , b 1 * ) after the constant temperature and humidity test were measured in the same manner after exposure for 24 hours under the condition of 85% humidity and the color change (ΔE) The thermoplastic resin composition according to claim 1,
[Formula 1]
Color change (ΔE) =
In the formula 1, ΔL * is a difference between L * values before and after the constant temperature and humidity test (L * 1 -L * 0) and, Δa * is the difference between (a 1 a * values before and after the constant temperature and humidity test * - a 0 * ) And Δb * is the difference (b 1 * - b 0 * ) of the b * value before and after the constant temperature and humidity test.
Another aspect of the present invention relates to a molded article formed from the thermoplastic resin composition.
In an embodiment, the shaped article may comprise a metal layer formed on at least a portion of the surface by a laser direct structuring process and a plating process.
The present invention has the effect of providing a thermoplastic resin composition for laser direct structuring process excellent in impact resistance, color stability and the like and a molded article containing the same.
1 schematically shows a molded article according to one embodiment of the present invention.
Hereinafter, the present invention will be described in detail.
The thermoplastic resin composition according to the present invention can be used in a laser direct structuring process (LDS process), and comprises (A) a thermoplastic resin; (B) Additives for direct laser structuring; And (C) a carbonate comprising at least one of an alkali metal carbonate and an alkaline earth metal carbonate, wherein the weight ratio of the additive for laser direct structuring and the carbonate is 1: 0.1 to 1: 0.7.
(A) a thermoplastic resin
The thermoplastic resin used in the present invention may be a thermoplastic resin used in a resin composition for a direct laser structuring process, and examples thereof include a polycarbonate resin, a rubber modified aromatic vinyl resin, a polyamide resin, a polyester resin, a poly Arylene ether resins, blends thereof, and the like. In one embodiment, the thermoplastic resin may be a blend of a polycarbonate resin or a polycarbonate resin and a rubber-modified aromatic vinyl resin, but is not limited thereto.
(A1) Polycarbonate resin
The polycarbonate resin may be a polycarbonate resin used in a conventional thermoplastic resin composition. For example, an aromatic polycarbonate resin prepared by reacting a diphenol (aromatic diol compound) with a precursor such as phosgene, halogen formate, or carbonic acid diester can be used.
Examples of the diphenols include 4,4'-biphenol, 2,2-bis (4-hydroxyphenyl) propane, 2,4-bis (4-hydroxyphenyl) (3-chloro-4-hydroxyphenyl) propane, 2,2-bis (3,5-dichloro-4-hydroxyphenyl) But is not limited thereto. (3,5-dichloro-4-hydroxyphenyl) propane, or 1,1-bis (4-hydroxyphenyl) propane, 2,2- ) Cyclohexane can be used. Specifically, 2,2-bis (4-hydroxyphenyl) propane called bisphenol-A can be used.
The above-mentioned polycarbonate resin may be used with a branched chain. For example, 0.05 to 2 mol% of trifunctional or more polyfunctional compounds, specifically trivalent or more, A phenol group-containing compound may be added.
The polycarbonate resin may be used in the form of a homopolycarbonate resin, a copolycarbonate resin or a blend thereof.
The polycarbonate resin may be partially or wholly substituted with an aromatic polyester-carbonate resin obtained by polymerization reaction in the presence of an ester precursor such as a bifunctional carboxylic acid.
In an embodiment, the polycarbonate resin may have a weight average molecular weight (Mw) measured by gel permeation chromatography (GPC) of 10,000 to 200,000 g / mol, for example, 15,000 to 80,000 g / mol, no.
(A2) Rubber-modified aromatic vinyl resin
Wherein the rubber-modified aromatic vinyl resin comprises 10 to 100% by weight of a graft copolymer resin (a1) in which an aromatic vinyl monomer and a monomer copolymerizable with the aromatic vinyl monomer are graft copolymerized with a rubbery polymer; And 0 to 90% by weight of an aromatic vinyl-based copolymer resin (a2) in which an aromatic vinyl-based monomer and a monomer copolymerizable with the aromatic vinyl-based monomer are copolymerized. That is, the graft copolymer resin (a1) may be used alone as the rubber-modified aromatic vinyl resin, or may be a mixture of the graft copolymer resin (a1) and the aromatic vinyl copolymer resin (a2).
In an embodiment, the graft copolymer resin (a1) can be polymerized by adding an aromatic vinyl monomer, a monomer copolymerizable with the aromatic vinyl monomer, and the like to the rubbery polymer, and the aromatic vinyl copolymer resin (a2) Can be polymerized by adding an aromatic vinyl monomer, a monomer copolymerizable with the aromatic vinyl monomer, and the like. The polymerization can be carried out by a known polymerization method such as emulsion polymerization, suspension polymerization and bulk polymerization. In the case of the above-mentioned bulk polymerization, the graft copolymer resin (a1) can be produced by a single step reaction process without separately preparing the graft copolymer resin (a1) and the aromatic vinyl copolymer resin (a2) A rubber-modified aromatic vinyl resin in the form of being dispersed in the coalescing resin (a2) can be produced. Here, the rubber (rubbery polymer) content in the final rubber-modified aromatic vinyl resin component is preferably 5 to 50% by weight. In addition, the particle size of the rubber may be 0.05 to 6 탆 in Z-average. Within the above range, physical properties such as impact resistance of the resin composition may be excellent.
In a specific example, non-limiting examples of the rubber-modified aromatic vinyl resin include a copolymer obtained by grafting an aromatic vinyl compound styrene monomer and an unsaturated nitrile compound acrylonitrile monomer to a center butadiene rubber- (ABS resin), acrylonitrile-ethylene propylene rubber-styrene copolymer resin (AES resin), acrylic resin (AES resin) such as acrylonitrile-butadiene-styrene copolymer resin A mixture of a graft copolymer resin (a1) and an aromatic vinyl copolymer resin (a2) such as a rhenitrile-acryl rubber-styrene copolymer resin (AAS resin) can be exemplified. Here, the ABS resin may be one in which the g-ABS is dispersed in the styrene-acrylonitrile copolymer resin (SAN resin) as the aromatic vinyl copolymer resin (a2) as the graft copolymer resin (a1) have.
In the specific example, when the thermoplastic resin is a combination (blend) of the polycarbonate resin and the rubber-modified aromatic vinyl resin, the polycarbonate resin is contained in an amount of 50 wt% or more, for example, 60 To 95% by weight, and the rubber-modified aromatic vinyl resin may be contained in an amount of 50% by weight or less, for example, 5 to 40% by weight, based on 100% by weight of the total thermoplastic resin. The impact resistance and mechanical properties of the thermoplastic resin composition may be excellent in the above range.
(B) Additives for direct laser structuring
The additive for laser direct structuring (LDS) used in the present invention is capable of forming metal nuclei by a laser, and can be used as an additive for direct laser structuring used in a resin composition for direct laser direct structuring . Herein, the laser refers to light (induced emission light) amplified by induction emission of radiation. The laser has a wavelength of 100 to 400 nm, ultraviolet light of 400 to 800 nm, visible light of 800 to 25,000 nm Infrared, and may be, for example, an infrared ray having a wavelength of 1,000 to 2,000 nm.
In embodiments, the additive for direct laser structuring may comprise a heavy metal mixture oxide spinel and / or a copper salt.
In an embodiment, the heavy metal complex oxide spinel may be represented by the following formula (1).
[Chemical Formula 1]
AB 2 O 4
In the above formula (1), A may be a metal cation having a valence of 2, for example, magnesium, copper, cobalt, zinc, tin, iron, manganese, nickel or a combination thereof and B is a metal cation having a valence of 3, Manganese, nickel, copper, cobalt, tin, titanium, iron, aluminum, chromium, combinations thereof, and the like.
The heavy metal complex oxide spinel represented by the above formula (1) is such that A provides a monovalent cation component of a metal oxide cluster and B provides a monovalent cation component of a metal cation cluster. For example, a metal oxide cluster containing A may have a tetrahedral structure, and a metal oxide cluster including B may have an octahedral structure. Specifically, the heavy metal complex oxide of Formula 1 may be a structure in which oxygen is arranged in a nearly cubic closest packing, B in a gap in an octahedral shape, and A in a gap in a slant shape.
In an embodiment, the heavy metal complex oxide spinel may be at least one selected from the group consisting of magnesium aluminum oxide (MgAl 2 O 4 ), zinc aluminum oxide (ZnAl 2 O 4 ), iron aluminum oxide (FeAl 2 O 4 ), copper iron oxide (CuFe 2 O 4 ) (CuCr 2 O 4 ), manganese iron oxide (MnFe 2 O 4 ), nickel iron oxide (NiFe 2 O 4 ), titanium iron oxide (TiFe 2 O 4 ), iron chromium oxide (FeCr 2 O 4 ) , Magnesium chromium oxide (MgCr 2 O 4 ), combinations thereof, and the like, but are not limited thereto. For example, copper chromium oxide (CuCr 2 O 4 ) can be used. Since the copper chromium oxide (CuCr 2 O 4 ) has a dark color, it can be applied to a case where a color required for a final molded product is a dark color such as black or gray.
In an embodiment, the copper salt is selected from the group consisting of copper hydroxide phosphate, copper phosphate, copper sulfate, cuprous thiocyanate, Combinations thereof, and the like, but the present invention is not limited thereto. For example, copper hydroxide phosphate may be used. The copper hydroxide phosphate is a compound having copper phosphate and copper hydroxide bonded thereto. Specifically, Cu 3 (PO 4 ) 2 .2Cu (OH) 2 , Cu 3 (PO 4 ) 2 Cu (OH) 2 , and the like. The copper hydroxide phosphate does not lower the color reproducibility of the added colorant, and thus a molded article of a desired color can be easily obtained.
In an embodiment, the additive for direct laser structuring may have an average particle size of 0.01 to 50 탆, for example, 0.1 to 30 탆, specifically 0.5 to 10 탆. In the above range, the plating surface can be uniformly formed by direct plating or laser molding.
In the present invention, unless otherwise stated, the average particle diameter means a number average diameter, which means that D50 (particle diameter at the point where the distribution ratio is 50%) is measured.
In an embodiment, the laser direct structuring additive may be included in an amount of 0.1 to 20 parts by weight, for example, 0.5 to 10 parts by weight, based on 100 parts by weight of the thermoplastic resin composition. In the above range, a sufficient amount of metal nuclei for plating (metal deposition) can be formed on the thermoplastic resin composition (molded article) upon laser irradiation.
(C) Carbonate
The carbonate used in the present invention is capable of reducing the discoloration and decomposition of the thermoplastic resin by the additive for direct direct structuring during molding of the thermoplastic resin composition, and includes a carbonate of an alkali metal, a carbonate of an alkaline earth metal, can do. For example, it can include such as potassium carbonate (K 2 CO 3), sodium carbonate (Na 2 CO 3), calcium carbonate (CaCO 3), barium carbonate (BaCO 3), magnesium carbonate (MgCO 3), combinations thereof, have.
In an embodiment, the laser direct structuring additive may be included in an amount of 0.01 to 14 parts by weight, for example 0.05 to 7 parts by weight, based on 100 parts by weight of the thermoplastic resin composition. Within the above range, discoloration and decomposition of the thermoplastic resin by the additive for direct laser structuring during molding of the thermoplastic resin composition can be reduced.
In the thermoplastic resin composition of the present invention, the weight ratio (B: C) of the additive for laser direct structuration (B) and the carbonate (C) may be 1: 0.1 to 1: 0.7, for example, 1: 0.11 to 1: have. When the weight ratio is less than 1: 0.1, discoloration or decomposition of the thermoplastic resin by the additive for direct laser structuring may not be reduced when the thermoplastic resin composition is molded. When the weight ratio is more than 1: 0.7, the thermoplastic resin composition ), There is a possibility that a sufficient amount of metal nuclei can not be formed in the plating (metal vapor deposition), and the content of the carbonate exceeds the optimum amount, and the decomposition of the thermoplastic resin may occur rather.
The thermoplastic resin composition according to one embodiment of the present invention may further contain additives such as an inorganic filler, a colorant, or a combination thereof, other than the additive for direct laser structuring and the carbonate, in order to improve mechanical properties such as impact resistance and rigidity, As shown in FIG.
If necessary, any additive conventionally used in the thermoplastic resin composition may be further added within the range not hindering the effect of the present invention. Examples of the additives include, but are not limited to, stabilizers, antioxidants, antistatic agents, flow improvers, release agents and the like.
In an embodiment, the inorganic filler may be glass fiber, talc, wollastonite, whisker, silica, mica, basalt fiber, mixture thereof, but is not limited thereto.
In an embodiment, the average particle size of the inorganic filler may be, for example, 50 nm to 100 m. Within the above range, mechanical properties and the like can be improved without deteriorating other physical properties such as appearance characteristics.
In an embodiment, the content of the inorganic filler may be 5 to 90 parts by weight, for example, 20 to 50 parts by weight, based on 100 parts by weight of the thermosetting resin. Within the above range, a thermoplastic resin composition having excellent impact resistance, rigidity and the like can be obtained.
In embodiments, the colorant may be a pigment, for example, TiO 2, ZnO, BaSO 4, MgSiO 4, ZnS, Sb 2 O 3, combinations of these, and the like other than the laser direct structuring additive and carbonates for . The colorant may be coated or uncoated.
In an embodiment, the content of the coloring agent may be 0.1 to 20 parts by weight, for example, 1 to 10 parts by weight, based on 100 parts by weight of the thermosetting resin. Within the above range, a thermoplastic resin composition (molded product) having various colors can be obtained without deteriorating other physical properties.
The thermoplastic resin composition according to one embodiment of the present invention may be in the form of a pellet obtained by melt-extruding 200 to 280, such as 250 to 260, by mixing the above components and using a conventional twin-screw extruder.
In an embodiment, the thermoplastic resin composition may have a notched Izod impact strength of 10 kgf · cm / cm or more, for example, 10 to 40 kgf · cm / cm measured with a 1/8 "thick specimen according to ASTM D256 .
In the specific example, the thermoplastic resin composition was prepared as an injection sample having a size of 50 mm x 50 mm x 1 mm, and a 500 g weight was dropped on the specimen according to the Dupont drop measurement method so that the height at which 50% For example, 35 to 50 cm.
In the specific example, the thermoplastic resin composition was prepared as an injection sample having a size of 50 mm × 90 mm × 3 mm. The initial color (L 0 * , a 0 * , b 0 * ) was measured according to ASTM D1209, (L 1 * , a 1 * , b 1 * ) were measured by the same method and then the color change (ΔE ) May be 3 or less, for example, 0.1 to 2.8.
[Formula 1]
Color change (ΔE) =
In the formula 1, ΔL * is a difference between L * values before and after the constant temperature and humidity test (L * 1 -L * 0) and, Δa * is the difference between (a 1 a * values before and after the constant temperature and humidity test * - a 0 * ) And Δb * is the difference (b 1 * - b 0 * ) of the b * value before and after the constant temperature and humidity test.
The molded article according to the present invention is formed from the thermoplastic resin composition. For example, the thermoplastic resin composition can be used to produce a molded article by a molding method such as injection molding, double injection molding, blow molding, extrusion molding, or thermoforming. The molded article can be easily formed by a person having ordinary skill in the art to which the present invention belongs.
1 schematically shows a molded article according to one embodiment of the present invention. In the drawings, the size of elements constituting the invention is exaggerated for clarity of description, and is not limited thereto. 1, the molded
In the embodiment, the laser direct structuring additive contained in the molded
In an embodiment, the metallization process may be performed through a conventional plating process. For example, it is possible to form the metal layer 20 (electrically conductive path) on the laser-irradiated area of the surface of the molded
As described above, a molded product having a metal layer formed on at least a part of its surface by a laser direct structuring process can be easily formed by a person having ordinary skill in the art to which the present invention belongs.
Hereinafter, the present invention will be described in more detail by way of examples, but these examples are for illustrative purposes only and should not be construed as limiting the present invention.
Example
Hereinafter, specifications of each component used in Examples and Comparative Examples are as follows.
(A) Polycarbonate resin
A bisphenol-A polycarbonate resin (Teijin, product name: Panlite® L-1225WX) was used.
(B) Additives for direct laser structuring
Copper hydroxide phosphate (Cu 3 (PO 4 ) 2 .CU (OH) 2 , manufacturer: Merck, product name: IRIOTEC 8840) was used.
(C) Carbonate
(C1) was used as calcium carbonate (CaCO 3).
(C2) was used as potassium carbonate (K 2 CO 3).
(D) inorganic filler
Glass fiber (manufacturer: Nitto Boseki, aspect ratio: 4) was used.
(E) Colorant
As the white pigment, titanium dioxide (TiO 2 , manufacturer: KRONOS, product name: KRONOS 2233) was used.
Examples 1 to 3 and Comparative Examples 1 to 3
Each of the above components was added in the amounts shown in Table 1 and extruded at a nozzle temperature of 250 to 270 using a twin-screw extruder having L / D = 36 and 45 mm in diameter to prepare pellets (thermoplastic resin composition) Respectively. The prepared pellets were dried at 100 ° C. for more than 3 hours and then injected in a 6 Oz injection machine (molding temperature 280, mold temperature: 60) to prepare specimens. The properties of the prepared specimens were evaluated by the following methods, and the results are shown in Table 1 below.
How to measure property
(1) Notch Izod impact strength (unit: kgf cm / cm): A notch was formed on a 1/8 "Izod (IZOD) specimen by the evaluation method described in ASTM D256.
(2) Evaluation of impact resistance (unit: cm): An injection specimen having a size of 50 mm × 50 mm × 1 mm was prepared, and a 500 g weight was dropped on the specimen according to the Dupont drop measurement method. The height was measured and evaluated. The higher the measured height, the better the impact resistance.
(L 0 * , a 0 * , b 0 * ) was measured according to ASTM D1209, and the initial color was measured at 85 ° C, (L 1 * , a 1 * , b 1 * ) after a constant temperature and humidity test were measured in the same manner as in Example 1, To calculate the color change (? E). The smaller the color change, the better the color stability.
[Formula 1]
Color change (ΔE) =
In the formula 1, ΔL * is a difference between L * values before and after the constant temperature and humidity test (L * 1 -L * 0) and, Δa * is the difference between (a 1 a * values before and after the constant temperature and humidity test * - a 0 * ) And Δb * is the difference (b 1 * - b 0 * ) of the b * value before and after the constant temperature and humidity test.
From the results shown in Table 1, it can be seen that the thermoplastic resin composition of the present invention has excellent impact resistance even after injection molding, and excellent color stability even after injection molding and constant temperature and humidity test.
On the other hand, in the case where no carbonate is used (Comparative Example 1) and the weight ratio of the additive to the laser direct structuring additive is out of the range of the present invention (Comparative Examples 2 and 3) The impact resistance and the color stability are deteriorated.
It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (13)
Additives for laser direct structuring (LDS); And
A carbonate comprising at least one of an alkali metal carbonate and an alkaline earth metal carbonate,
Wherein the weight ratio of the laser direct structuring additive and the carbonate is 1: 0.1 to 1: 0.7.
[Formula 1]
Color change (ΔE) =
In the formula 1, ΔL * is a difference between L * values before and after the constant temperature and humidity test (L * 1 -L * 0) and, Δa * is the difference between (a 1 a * values before and after the constant temperature and humidity test * - a 0 * ) And Δb * is the difference (b 1 * - b 0 * ) of the b * value before and after the constant temperature and humidity test.
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