KR20170006948A - Method for manufacturing electronic device and electronic device manufactured using the same - Google Patents

Method for manufacturing electronic device and electronic device manufactured using the same Download PDF

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KR20170006948A
KR20170006948A KR1020150098416A KR20150098416A KR20170006948A KR 20170006948 A KR20170006948 A KR 20170006948A KR 1020150098416 A KR1020150098416 A KR 1020150098416A KR 20150098416 A KR20150098416 A KR 20150098416A KR 20170006948 A KR20170006948 A KR 20170006948A
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electrode layer
film
forming
substrate
electrode
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KR1020150098416A
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KR101706753B1 (en
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이상욱
김학성
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건국대학교 산학협력단
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/28008—Making conductor-insulator-semiconductor electrodes
    • H01L21/28017—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
    • H01L21/28026—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor

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  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electrodes Of Semiconductors (AREA)

Abstract

The present invention relates to a method for manufacturing an electronic device to reduce contact resistance and an electronic device manufactured by using the same. The method for manufacturing an electronic device comprises: a step of preparing a first film; a step of forming a first electrode layer on the first film; a step of forming a second electrode layer which covers the first electrode layer and is extended to the outside of the first film; a step of forming a second film to cover the first film; a step of locating the first and the second film on a substrate; and a step of eliminating the second film.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a method of manufacturing an electronic device,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device manufacturing method and an electronic device manufactured using the same, and more particularly, to an electronic device manufacturing method capable of reducing contact resistance and an electronic device manufactured using the same.

Generally, different films or layers can come into contact with each other when manufacturing electronic devices. In particular, the conductive layers and the conductive films can be brought into contact with each other to transmit an electrical signal.

However, in the conventional electronic device manufacturing method and the electronic device manufactured by the method, there is a problem that the contact resistance can be very high in the films or layers contacting with each other.

It is an object of the present invention to provide an electronic device manufacturing method capable of reducing contact resistance and an electronic device manufactured using the method. However, these problems are exemplary and do not limit the scope of the present invention.

According to one aspect of the present invention, there is provided a method of manufacturing a semiconductor device, comprising: preparing a first film; forming a first electrode layer on the first film; forming a second electrode layer extending outwardly of the first film while covering the first electrode layer And forming a second film to cover the first film, positioning the first film and the second film on the substrate, and removing the second film.

The step of preparing the first film may be a step of preparing a first film on a support, and the step of forming the second electrode layer may be a step of forming a second electrode layer to contact the support.

The forming of the first electrode layer may include forming the first electrode layer such that edges of the first electrode layer are located on the first film.

Forming a first auxiliary electrode layer having the same edge as the edge of the first electrode layer on the first electrode layer, wherein the forming of the second electrode layer comprises: forming a first auxiliary electrode layer on the first auxiliary electrode layer, And forming a second electrode layer extending therefrom. In this case, the first auxiliary electrode layer and the second electrode layer may be formed of the same material.

Meanwhile, the bonding force between the second electrode material and the support used in the step of forming the second electrode layer may be weaker than the bonding force between the first electrode material and the support used in the step of forming the first electrode layer. Specifically, the first electrode material may include palladium, chromium, or titanium, and the second electrode material may include gold, silver, or nickel.

Separating the first membrane and the second membrane from the support between the step of forming the second membrane and the step of positioning the first membrane and the second membrane on the substrate.

At this time, the step of positioning the first film and the second film on the substrate may be a step of positioning the second electrode layer so as to correspond to the third electrode layer on the substrate. Alternatively, the step of positioning the first film and the second film on the substrate may be a step of positioning the second electrode layer in contact with the third electrode layer on the substrate. Furthermore, the third electrode layer may be formed of the same material as the second electrode layer.

The first layer may comprise an organic semiconductor material, graphene, carbon nanotubes, or transition metal dichalcogenide.

The second membrane may be made of a polymer selected from the group consisting of polymethylmethacrylate (PMMA), CYTOP, ethyl lactate, polypropylene carbonate (PPC), or poly (alpha-chloroacrylate-co- Styrene) (ZEP; poly-α-chloroacrylate-co-α-methyl styrene).

According to one aspect of the present invention, there is provided a method for manufacturing a semiconductor device, comprising: a substrate; a third electrode layer disposed on the substrate; a second electrode layer disposed on the third electrode layer such that one end thereof is located on the third electrode layer, A first electrode layer disposed on the first film and a second electrode layer covering the first electrode layer and extending to the outside of the first film to contact the exposed portion of the third electrode layer outside the first film, A two-electrode layer is provided.

The edge of the first electrode layer may be located in the first film.

And a first auxiliary electrode layer interposed between the first electrode layer and the second electrode layer and having the same edge as the edge of the first electrode layer. In this case, the first auxiliary electrode layer and the second electrode layer may include the same material.

The first electrode layer may include palladium, chromium, or titanium, and the second electrode layer may include gold, silver, or nickel.

The third electrode layer and the second electrode layer may include the same material.

The first layer may comprise an organic semiconductor material, graphene, carbon nanotubes, or a transition metal dichalcogenide.

According to an embodiment of the present invention as described above, an electronic device manufacturing method capable of reducing a contact resistance and an electronic device manufactured using the method can be realized. Of course, the scope of the present invention is not limited by these effects.

1 to 8 are perspective views schematically showing processes of an electronic device manufacturing method according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. It should be understood, however, that the invention is not limited to the disclosed embodiments, but may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, Is provided to fully inform the user. Also, for convenience of explanation, the components may be exaggerated or reduced in size. For example, the size and thickness of each component shown in the drawings are arbitrarily shown for convenience of explanation, and thus the present invention is not necessarily limited to those shown in the drawings.

In the following embodiments, the x-axis, the y-axis, and the z-axis are not limited to three axes on the orthogonal coordinate system, but can be interpreted in a broad sense including the three axes. For example, the x-axis, y-axis, and z-axis may be orthogonal to each other, but may refer to different directions that are not orthogonal to each other.

On the other hand, when various elements such as layers, films, regions, plates and the like are referred to as being "on " another element, not only is it directly on another element, .

1 to 8 are perspective views schematically showing processes of an electronic device manufacturing method according to an embodiment of the present invention.

First, the first film 20 is prepared as shown in FIG. The first film 20 can be prepared on the support 10 as shown in Fig. Of course, the first film 20 can be processed into a predetermined form if necessary.

For example, the first film 20 may be graphene. In this case, the unpatterned graphene film may be placed on the support 10, and then processed through an electron beam lithography and / or an O 2 plasma process into a ribbon shape extending in the x-axis direction as shown in Fig. It is necessary that the support member 10 and the first film 20 do not have a large bonding force between them in order to facilitate the subsequent separation. Therefore, the first film 20 may be formed as necessary and mechanically peeled from the support 10.

After the first film 20 is prepared as described above, the first electrode layer 22 is formed on the first film 20 as shown in FIG. The first electrode layer 22 may be formed to have a thickness of, for example, approximately 10 nm. When the first electrode layer 22 is formed, the edge of the first electrode layer 22 is positioned on the first film 20 as shown in FIG. That is, the first electrode layer 22 is formed only on the first film 20 so that the first electrode layer 22 does not contact the support body 10. The first electrode material for forming the first electrode layer 22 may include palladium, chromium, or titanium. It can be understood that the first electrode layer 22 formed of such a material is a material having a low contact resistance with the first film 20. The first electrode layer 22 is located only on the first film 20 and does not contact the support body 10 so that the bonding strength with the support body 10 when considering the first electrode material for forming the first electrode layer 22 It may be a high material.

The first electrode layer 22 may be formed on the first film 20 by various methods, for example, electron beam lithography. Specifically, after a mask film covering the first film 20 is formed by polymethylmethacrylate (PMMA) by spin coating or the like, a portion of the PMMA film corresponding to the portion where the first electrode layer 22 is to be formed When irradiated with an electron beam of 100 uC / cm 2 to 200 uC / cm 2 , the portion irradiated with the electron beam of the PMMA film is removed by the developer. An electron beam having a beam energy of 30 keV and an ion implantation dose of 20 pA at a dose of 100 uC / cm 2 (dose) can be used, and as a developer for removing the portion irradiated with the electron beam of the PMMA film, hexyl acetate Acetate) and the like can be used.

When the first electrode layer 22 is formed by evaporation or the like on the portion of the first film 20 not covered by the PMMA film and the PMMA film is removed by using the patterned PMMA film as a mask, The first electrode layer 22 can be formed only in a predetermined region on the first film 20 as shown in FIG. Of course, the first electrode layer forming material may remain on the PMMA film, but it is removed together with the PMMA film when the PMMA film is removed. Removal of the PMMA film may be performed using a conventional peeling solution, for example, using acetone or chloroform. In addition, the first electrode layer 22 may be formed using a photoresist material in addition to PMMA.

Thereafter, the second electrode layer 24 is formed as shown in FIG. When the second electrode layer 24 is formed, the first electrode layer 22 is covered with the first electrode layer 22 and extends to the outside of the first film 20 as shown in FIG. The second electrode layer 24 can contact the upper surface of the support 10 in the (+ z direction) direction. The second electrode layer 24 may be deposited to a thickness of about 50 nm.

The first electrode layer 22 and the second electrode layer 24 have a common physical property that they are basically electrode layers so that the first electrode layer 22 and the second electrode layer 24 are formed of the same material, And the second electrode layer 24 can be made low. In particular, when the first electrode layer 22 and the second electrode layer 24 are formed of metal, the contact resistance between the first electrode layer 22 and the second electrode layer 24 can be made low. By making the contact resistance between the first electrode layer 22 and the second electrode layer 24 low in a state where the contact resistance between the first film 20 and the first electrode layer 22 is low as described above, The resistance from the first film 20 to the second electrode layer 24 can be kept low.

The second electrode layer 24 extends outside the first layer 20 and contacts the support 10. The second electrode layer 24 may be formed on the support 10 in consideration of the second electrode layer material for forming the second electrode layer 24. [ It is required to be a material with low bonding strength. This is for facilitating separation of the first membrane 20 and the second electrode layer 24 when the membrane is separated from the support 10 as described later. Accordingly, the bonding force between the second electrode material used in the step of forming the second electrode layer 24 and the support body 10 is higher than the bonding strength between the first electrode material used in the step of forming the first electrode layer 22 and the support body 10 ). ≪ / RTI > The second electrode material for forming the second electrode layer 24 may include gold, silver or nickel.

The formation of the second electrode layer 24 so as to cover the first electrode layer 22 may be performed by various methods, for example, using an electron beam lithography method. Specifically, after a mask film covering the first electrode layer 22, the first film 20 and the support 10 is formed by polymethylmethacrylate (PMMA) by a spin coating method or the like, a second electrode layer 24 ) Is to be formed is irradiated with an electron beam of 100 uC / cm 2 to 200 uC / cm 2 , the portion irradiated with the electron beam of the PMMA film is removed by the developer. An electron beam having a beam energy of 30 keV and an ion implantation dose of 20 pA at a dose of 100 uC / cm 2 (dose) can be used, and as a developer for removing the portion irradiated with the electron beam of the PMMA film, hexyl acetate Acetate) and the like can be used.

Using the patterned PMMA film as a mask, the second electrode layer 24 is formed on the first electrode layer 22, the first film 20, and the portion of the support member 10 not covered by the PMMA film through a deposition method or the like The second electrode layer 24 is formed so as to cover the first electrode layer 22 and extend to the outside of the first membrane 20 to contact the support body 10 as shown in FIG. . Of course, the second electrode layer forming material may remain on the PMMA film, but it may be removed together with the PMMA film when the PMMA film is removed. Removal of the PMMA film may be performed using a conventional peeling solution, for example, using acetone or chloroform. In addition, the second electrode layer 24 may be formed using a photoresist material in addition to PMMA.

If necessary, the first auxiliary electrode layer may be formed before the second electrode layer 24 is formed. For example, when the first electrode layer 22 is formed using palladium, chromium, or titanium as described above, the (+ z) upper surface of the first electrode layer 22 can be easily oxidized. In this case, an oxide film exists between the first electrode layer 22 and the second electrode layer 24, so that the contact resistance between the first electrode layer 22 and the second electrode layer 24 can be increased. Therefore, in order to prevent this, oxidation of the upper surface of the first electrode layer 22 can be prevented by forming the first auxiliary electrode layer on the first electrode layer 22 immediately after the first electrode layer 22 is formed. In this case, it can be understood that forming the second electrode layer 24 forms the second electrode layer 24 so as to cover the first auxiliary electrode layer and extend outwardly of the first film 20 to be in contact with the support body 10 . The first auxiliary electrode layer may be formed to a thickness of 30 nm, for example.

For example, when the first electrode layer 22 is formed by depositing the first electrode material after forming the PMMA or the photoresist mask as described above, the first electrode layer 22 may be formed without removing the first electrode material 22, The first auxiliary electrode material may be deposited and then the mask may be removed. The edge of the first auxiliary electrode layer thus formed becomes the same as the edge of the first electrode layer 22. In this case, since the first auxiliary electrode layer is formed immediately after the first electrode layer 22 is formed, the oxidation of the surface of the first electrode layer 22 can be effectively prevented or minimized. The first auxiliary electrode material for forming the first auxiliary electrode layer may include gold, silver or nickel. In particular, when the first auxiliary electrode layer is formed of the same material as the second electrode material, which is a material for forming the second electrode layer 24, there is no potential barrier between the first auxiliary electrode layer and the second electrode layer 24, It can be made very low.

Thereafter, the second film 30 is formed so as to cover the first film 20 as shown in Fig. The second film 30 may be formed by, for example, spin coating. This second film 30 may be combined with the first film 20 and used for transfer of the first film 20.

After the second film 30 is formed, the first film 20 and the second film 30 can be separated from the support 10 as shown in Fig. Separation of the first and second films 20 and 30 from the support 10 can be accomplished in a variety of ways, for example, when the support 10 comprises silicon oxide or silicon, The first membrane 20 and the second membrane 30 can be separated from the support body 10 by immersing the support body 10 in a dissolvable liquid. Such a liquid may be an aqueous solution of potassium hydroxide, an aqueous solution of sodium hydroxide or an aqueous solution of hydrofluoric acid. When the support 10 is immersed in such a liquid, the support 10 is immersed in the liquid in a state in which the first film 20 and the second film 30 are formed, (30) can be separated from the support (10).

At this time, when the support 10 containing silicon oxide or silicon is immersed in a liquid capable of dissolving silicon oxide or silicon, not all of the support 10 is completely dissolved. The second film 30 may be gradually separated from the support 10 while the liquid permeates at the interface between the support 10 and the second film 30 on the side of the support 10, for example.

The first film 20 is fixed to the lower surface of the second film 30 in the (-z direction) and can be separated from the support 10 together with the second film 30. [ Of course, if necessary, the first membrane 20 and the second membrane 30 separated from the support 10 may be immersed in ultrapure water to remove potassium hydroxide aqueous solution or the like remaining in the first membrane 20 or the second membrane 30 A cleaning step such as removing the solution may be performed. In the case of the first film 20 and the second film 30 thus separated, a plurality of grooves are formed on the lower surface of the second film 30 (-z direction), and the first film 20 is formed in the grooves. As shown in FIG.

The second electrode layer 24 in contact with the support body 10 is also separated from the support body 10 when the first film 20 and the second film 30 are separated from the support body 10. At this time, since the bonding force of the second electrode material included in the second electrode layer 24 to the support 10 is low, damage such as tearing to the second electrode layer 24 and the first film 20 occurs The second electrode layer 24, the first film 20, and the like can be separated from the support body 10 without performing the above-described process.

After the first film 20 and the second film 30 are separated from the support 10, the first film 20 and the second film 30 are formed as shown in FIG. 6 by forming the trench 40a Aligned with respect to the substrate 40. At this time, the first film 20 may be positioned to correspond to the substrate 40 across the trench 40a of the substrate 40. This is for the first film 20 to float above the trench 40a of the substrate 40 even if at least a part of the second film 30 is removed as described later. When the first film 20 and the second film 30 are aligned with respect to the substrate 40, a second electrode layer 24 electrically connected to the first film 20 is formed on the third electrode layer 24 on the substrate 40, (42). In FIG. 6, the third electrode layer 42 located on the (+ z) plane of the substrate 40 has an island shape, but the present invention is not limited thereto. For example, the third electrode layer 42 may be part of the wiring formed on the upper surface of the substrate 40. The third electrode layer 42 may be formed of the same material as the second electrode layer 24. This is to lower the contact resistance when the third electrode layer 42 comes into contact with the second electrode layer 24 in the future. Alternatively, the third electrode layer 42 formed on the upper surface of the substrate 40 with the same material as the second electrode layer 24 may be electrically connected to the wiring formed on the upper surface of the substrate 40.

After the first film 20 and the second film 30 are aligned with the substrate 40 on which the trench 40a is formed as described above, the second film 30 is formed on the substrate 40, . The attachment of the second film 30 to the substrate 40 does not mean that an adhesive or the like is added between the second film 30 and the substrate 40 but the second film 30 and the substrate 40, As shown in FIG. The second film 30 and the substrate 40 may be weakly adhered to each other by van der Waals force between the second film 30 and the substrate 40.

As the second film 30 is attached to the substrate 40, the first film 20 extending in the x-axis direction crosses the trench 40a of the substrate 40. A part including the central portion of the first film 20 is floated on the trench 40a of the substrate 40 and both ends of the first film 20 are formed on the upper surface of the substrate 40 in the (+ z direction) Contact. That is, if only the first film 20 is considered, the first film 20 is arranged as if it traverses the trench 40a of the substrate 40 like a leg. As the second film 30 is attached to the substrate 40, the second electrode layer 24 contacts the third electrode layer 42 on the substrate 40.

Thereafter, the second film 30 is removed as shown in FIG. Removal of the second film 30 can be performed using a conventional peeling solution. For example, the second film 30 formed of polymethylmethacrylate can be removed using acetone or chloroform. Thus, an electronic device in which the first film 20 traversing the trench 40a of the substrate 40 is disposed on the top surface of the substrate 40 as shown in Fig. 8 can be manufactured.

According to the method of manufacturing an electronic device according to this embodiment, contact resistance between various layers or films in the electronic device as shown in FIG. 8 can be minimized.

Specifically, the first electrode layer 22 is formed of a material having a low contact resistance between the first electrode layer 22 and the first film 20 when the first electrode layer 22 is formed, The contact resistance between the first electrode layer 20 and the first electrode layer 22 can be kept low. The contact resistance between the first electrode layer 22 and the second electrode layer 24 can be made low because the first electrode layer 22 and the second electrode layer 24 have a common physical property as an electrode layer. In particular, when the first electrode layer 22 and the second electrode layer 24 are formed of metal, the contact resistance between the first electrode layer 22 and the second electrode layer 24 can be made low. The first electrode layer 22 and the second electrode layer 24 may be interposed between the first electrode layer 22 and the second electrode layer 24 to prevent oxidation of the upper surface of the first electrode layer 22, The contact resistance between the second electrode layers 24 can be reduced. The contact resistance between the second electrode layer 24 and the third electrode layer 42 can be made low because the second electrode layer 24 and the third electrode layer 42 have a common physical property as an electrode layer. In particular, when the second electrode layer 24 and the third electrode layer 42 are formed of a metal or the same material, the contact resistance between the second electrode layer 24 and the third electrode layer 42 is low can do. As a result, the ultimate contact resistance between the first film 20 and the third electrode layer 42 is extremely low, so that an electronic device with high electrical energy efficiency can be realized.

It may be considered to transfer the first film 20 and the like onto the substrate 40 in a state where only the second electrode layer 24 is formed without forming the first electrode layer 22. [ However, since the second electrode layer 24 must satisfy the requirement that the bonding strength with the support 10 is low, a material having a low contact resistance between the second electrode layer 24 and the first film 20 is selected, (24) can not be formed. However, in the case of the electronic device manufacturing method according to this embodiment, the occurrence of such a problem can be prevented.

An electronic device such as that shown in Fig. 8 can be used in various fields. For example, in the case where the first film 20 is formed of graphene, the first film 20 is excellent in electrical conductivity and very thin (in the + z direction) thickness of about 500 nm or less, The device can be used as a highly sensitive RF receiver.

Although the substrate 40 is illustrated as having the trench 40a in the drawings, the present invention is applicable to the case where the substrate 40 does not have the trench 40a.

Although the case where the first film 20 is formed of graphenes has been mainly described so far, the present invention is not limited thereto. For example, the first layer 20 may include an organic semiconductor material, a carbon nanotube, or a transition metal dichalcogenide, in addition to graphene. Examples of the transition metal chalcogenide include WS 2 , WSe 2 , WTe 2 , MoS 2 and MoTe 2 . In the case of the second membrane 30, the present invention is not limited to the case where the second membrane 30 is formed of polymethyl methacrylate, and the second membrane 30 may be formed of CYTOP, ethyl lactate, (PPC) or poly (alpha-chloroacrylate-co- alpha -methyl styrene) (ZEP).

For example, when the first film 20 is formed of an organic semiconductor material such as pentacene, it is necessary to lower the contact resistance between the organic semiconductor material and an electrode such as a source electrode or a drain electrode. As described above, the first film 20 is electrically connected to the second electrode layer 24 and the third electrode layer 42 through the first electrode layer 22, thereby lowering the contact resistance, Can be implemented. In this case, the electronic device as shown in Fig. 8 may be understood as a part of the organic thin film transistor.

When transferring the first film 20 formed of the organic semiconductor film onto the substrate 40, the second film 30 formed of CYTOP (an amorphous fluoropolymer product of Asahi Glass Japan) Can be used. In particular, since the second film 30 formed of a cytochrome does not react with an organic solvent such as acetone or chloroform, it is possible to effectively prevent the first film 20 formed of the organic semiconductor material from being damaged.

Although the electronic device manufacturing method has been described so far, the present invention is not limited thereto. For example, an electronic device manufactured by such a manufacturing method is also within the scope of the present invention.

The electronic device according to an embodiment of the present invention includes a substrate 40, a third electrode layer 42, a first film 20, a first electrode layer 22, and a second electrode layer (not shown) 24).

The substrate 40 may be formed of various materials, for example, a glass substrate, or a plastic substrate formed of a resin such as polyimide or the like. The third electrode layer 42 may be disposed on the substrate 40. The third electrode layer 42 is located on the upper surface (+ z direction) of the substrate 40 as shown in FIG. 8 and has an island shape, but the present invention is not limited thereto. For example, the third electrode layer 42 may be part of the wiring formed on the upper surface of the substrate 40.

The first film 20 is located on the substrate 40, specifically on the third electrode layer 42. The first film 20 is not entirely covered with the upper surface of the third electrode layer 42 in the (+ z direction) but is positioned on the third electrode layer 42 such that at least a part of the upper surface of the third electrode layer 42 is exposed . The first layer 20 may comprise an organic semiconductor material, graphene, a carbon nanotube, or a transition metal dichalcogenide. Examples of the transition metal chalcogenide include WS 2 , WSe 2 , WTe 2 , MoS 2 and MoTe 2 .

The first electrode layer 22 is located on the first film 20. At this time, the edge of the first electrode layer 22 is located in the first film 20. The first electrode layer 22 may be formed of a material having a low contact resistance with the first layer 20. The first electrode layer 22 may include, for example, palladium, chromium, or titanium.

The second electrode layer 24 covers the first electrode layer 22 and extends to the outside of the first membrane 20 to contact the exposed portion of the third electrode layer 42 outside the first membrane 20. The first electrode layer 22 and the second electrode layer 24 have a common physical property that they are basically electrode layers so that the first electrode layer 22 and the second electrode layer 24 are formed of the same material, And the second electrode layer 24 can be made low. In particular, when the first electrode layer 22 and the second electrode layer 24 are formed of metal, the contact resistance between the first electrode layer 22 and the second electrode layer 24 can be made low. By making the contact resistance between the first electrode layer 22 and the second electrode layer 24 low in a state where the contact resistance between the first film 20 and the first electrode layer 22 is low as described above, The resistance from the first film 20 to the second electrode layer 24 can be kept low.

Meanwhile, in order to easily separate the second electrode layer 24 from the support 10 (see FIG. 3 or FIG. 4) during the manufacturing process, the second electrode layer 24 may be formed of a material having a low bonding force with the support . Examples of the material for forming the second electrode layer 24 include gold, silver, and nickel. The contact resistance between the second electrode layer 24 and the third electrode layer 42 can be drastically reduced by including the same material in the second electrode layer 24 and the third electrode layer 42.

If necessary, a first auxiliary electrode layer (not shown) having the same edge as the edge of the first electrode layer 22 may be interposed between the first electrode layer 22 and the second electrode layer 24. This may include palladium, chromium, or titanium as described above for the first electrode layer 22 formed of a material having a low contact resistance with the first film 20. In the manufacturing process of the first electrode layer 22, (+ Z direction) of the upper surface can be easily oxidized. Therefore, in order to prevent this, the formation of the oxide film can be prevented by forming the first auxiliary electrode layer immediately after the first electrode layer 22 is formed. Such a first auxiliary electrode layer may comprise gold, silver or nickel. In particular, when the first auxiliary electrode layer is formed of the same material as the second electrode material, which is a material for forming the second electrode layer 24, there is no potential barrier between the first auxiliary electrode layer and the second electrode layer 24, It can be made very low.

In such an electronic device according to the present embodiment, the contact resistance between various layers or films can be minimized. Specifically, the first electrode layer 22 and the first electrode layer 22 are formed so as to form the first electrode layer 22 with a material having a low contact resistance between the first electrode layer 22 and the first film 20, It is possible to keep the contact resistance low. The contact resistance between the first electrode layer 22 and the second electrode layer 24 can be made low because the first electrode layer 22 and the second electrode layer 24 have a common physical property as an electrode layer. The first electrode layer 22 and the second electrode layer 24 may be interposed between the first electrode layer 22 and the second electrode layer 24 to prevent oxidation of the upper surface of the first electrode layer 22, The contact resistance between the second electrode layers 24 can be reduced. The contact resistance between the second electrode layer 24 and the third electrode layer 42 can be made low because the second electrode layer 24 and the third electrode layer 42 have a common physical property as an electrode layer. In particular, when the second electrode layer 24 and the third electrode layer 42 are formed of a metal or the same material, the contact resistance between the second electrode layer 24 and the third electrode layer 42 is low can do. As a result, the ultimate contact resistance between the first film 20 and the third electrode layer 42 is extremely low, so that an electronic device with high electrical energy efficiency can be realized.

The electronic device according to the present embodiment shown in Fig. 8 can be used in various fields. For example, when the first film 20 includes graphene, the first film 20 has excellent conductivity and a very thin thickness (in the + z direction) of about 500 nm or less, Can be used as a highly sensitive RF receiver.

Alternatively, for example, when the first film 20 is formed of an organic semiconductor material such as pentacene, it is necessary to lower the contact resistance between the organic semiconductor material and an electrode such as a source electrode or a drain electrode. As described above, the first film 20 is electrically connected to the second electrode layer 24 and the third electrode layer 42 through the first electrode layer 22, thereby lowering the contact resistance, Can be implemented. In this case, the electronic device according to the present embodiment may be understood as a part of the organic thin film transistor.

Although the substrate 40 is illustrated as having the trench 40a in the drawings, the present invention is applicable to the case where the substrate 40 does not have the trench 40a.

While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the invention. Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims.

10: Support 20: First membrane
22: first electrode layer 24: second electrode layer
30: second film 40: substrate
40a: Trench 42: Third electrode layer

Claims (20)

Preparing a first membrane;
Forming a first electrode layer on the first film;
Forming a second electrode layer covering the first electrode layer and extending outside the first membrane;
Forming a second film to cover the first film;
Placing a first film and a second film on a substrate; And
Removing the second membrane;
The method comprising the steps of: The method according to claim 1,
Wherein the step of preparing the first film is a step of preparing a first film on a support, and the step of forming the second electrode layer is a step of forming a second electrode layer to be in contact with a support. 3. The method of claim 2,
Wherein the forming of the first electrode layer is a step of forming a first electrode layer such that an edge of the first electrode layer is located on the first film. The method of claim 3,
Forming a first auxiliary electrode layer having the same edge as the edge of the first electrode layer on the first electrode layer, wherein the forming of the second electrode layer comprises: forming a first auxiliary electrode layer on the first auxiliary electrode layer, And forming an extended second electrode layer. 5. The method of claim 4,
Wherein the first auxiliary electrode layer and the second electrode layer are formed of the same material. 6. The method according to any one of claims 2 to 5,
Wherein a bonding force between the second electrode material and the support used in the step of forming the second electrode layer is weaker than a bonding force between the first electrode material and the support used in the step of forming the first electrode layer. The method according to claim 6,
Wherein the first electrode material comprises palladium, chromium or titanium and the second electrode material comprises gold, silver or nickel. 3. The method of claim 2,
Further comprising separating the first film and the second film from the support between the step of forming the second film and the step of positioning the first film and the second film on the substrate. 9. The method of claim 8,
Wherein positioning the first and second films on a substrate comprises positioning the second electrode layer to correspond to a third electrode layer on the substrate. 9. The method of claim 8,
Wherein positioning the first and second films on the substrate is to position the second electrode layer in contact with the third electrode layer on the substrate. 11. The method according to claim 9 or 10,
And the third electrode layer is formed of the same material as the second electrode layer. The method according to claim 1,
Wherein the first film comprises an organic semiconductor material, graphene, carbon nanotubes, or a transition metal dichalcogenide. The method according to claim 1,
The second membrane may be made of a polymer selected from the group consisting of polymethylmethacrylate (PMMA), CYTOP, ethyl lactate, polypropylene carbonate (PPC), or poly (alpha-chloroacrylate-co- Styrene) (ZEP; poly-α-chloroacrylate-co-α-methylstyrene). Board;
A third electrode layer disposed on the substrate;
A first film located on the third electrode layer, the first film being positioned on the third electrode layer and a part of an upper surface of the third electrode layer being exposed;
A first electrode layer disposed on the first film; And
A second electrode layer covering the first electrode layer and extending outwardly of the first membrane to contact a portion of the third electrode layer exposed outside the first membrane;
And an electronic device. 15. The method of claim 14,
And an edge of the first electrode layer is located in the first film. 16. The method of claim 15,
And a first auxiliary electrode layer interposed between the first electrode layer and the second electrode layer and having the same edge as the edge of the first electrode layer. 17. The method of claim 16,
Wherein the first auxiliary electrode layer and the second electrode layer comprise the same material. 18. The method according to any one of claims 14 to 17,
Wherein the first electrode layer comprises palladium, chromium or titanium and the second electrode layer comprises gold, silver or nickel. 18. The method according to any one of claims 14 to 17,
Wherein the third electrode layer and the second electrode layer comprise the same material. 18. The method according to any one of claims 14 to 17,
Wherein the first film comprises an organic semiconductor material, graphene, a carbon nanotube, or a transition metal dichalcogenide.
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Publication number Priority date Publication date Assignee Title
KR20060113756A (en) * 2003-12-26 2006-11-02 후지제롯쿠스 가부시끼가이샤 Rectifying device and electronic circuit employing same, and process for producing rectifying device
KR20100111999A (en) * 2009-04-08 2010-10-18 한국전자통신연구원 Field effect transistor having graphene channel layer
KR20140028603A (en) * 2012-08-29 2014-03-10 삼성전자주식회사 Graphene device and method of manufacturing the same

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KR20060113756A (en) * 2003-12-26 2006-11-02 후지제롯쿠스 가부시끼가이샤 Rectifying device and electronic circuit employing same, and process for producing rectifying device
KR20100111999A (en) * 2009-04-08 2010-10-18 한국전자통신연구원 Field effect transistor having graphene channel layer
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