KR20170003814A - Printed circuit board for smart key of vehicle and combining method thereof - Google Patents

Abstract

The present invention relates to a printed circuit board for the smart key of a vehicle and a combining method thereof. The printed circuit board includes a main printed circuit board for mounting components for performing data communication and authentication with the vehicle, and at least one sub printed circuit board combined with at least one surface of the main printed circuit board. So, durability and wireless communication function can be improved.

Description

TECHNICAL FIELD [0001] The present invention relates to a printed circuit board for a vehicle smart key,

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a printed circuit board for a vehicle smart key and a method of bonding the same, and more particularly, to a printed circuit board for a vehicle smart key and a combination method thereof for improving durability and wireless communication function .

2. Description of the Related Art Generally, a vehicle smart key is a device that allows a driver to carry a key by bi-directional communication of the vehicle, and can release the lock device and start the vehicle. However, since the conventional smart key is manufactured to be considerably thick in order to ensure the characteristics and durability of a wireless communication device having an antenna, it has been inconvenient for the user to carry the smart key.

Accordingly, in order to reduce the thickness of the smart key, it is possible to form the external shape of the product (smart key) manufactured through the molding after the EMC (Epoxy Mold Compound) molding or the curing process after the potting to be 3 mm or less from the conventional 4 mm, There is a possibility that the probability of non-forming is increased, the performance of the LF (Low Frequency) transmitting / receiving antenna is lowered, and the durability is lowered.

That is, since the thickness of the product (smart key) is thinned, the thickness of the printed circuit board is also thinned, thereby limiting the performance of the LF transmitting / receiving antenna which can be implemented as a pattern in the printed circuit board. The transmitting / receiving distance of the transmitting / receiving antenna may be drastically decreased, and as the thickness of the product is thinner, the durability of the local area is relatively weak in the region where there is no structure between the printed circuit board and the EMC (Epoxy Mold Compound) Can occur.

Furthermore, in order to cope with recently diversified wireless communication environments (for example, a wireless communication environment using LF, RF, NFC, etc.), it is necessary to increase the necessity of mounting additional antennas (or necessity of improving antenna performance) .

That is, there is a demand for a technology that can improve the durability and the wireless communication function while reducing the thickness of the smart key.

BACKGROUND ART [0002] The background art of the present invention is disclosed in Korean Registered Patent No. 10-0486427 (registered on April 21, 2005, a method for manufacturing a printed circuit board for high frequency amplification).

According to an aspect of the present invention, there is provided a printed circuit board for a vehicle smart key and a printed circuit board for a vehicle smart key, which can improve the durability and the wireless communication function even if the thickness of the smart key is reduced. It is an object of the present invention to provide a coupling method.

According to an aspect of the present invention, there is also provided a printed circuit board for a vehicle smart key, which allows a plurality of automotive smart key printed circuit boards to be accurately aligned with each other in a designated position with respect to each other without using a joining member, Coupling method.

A printed circuit board for a vehicle smart key according to an aspect of the present invention includes: a main printed circuit board on which components for performing data communication and authentication with a vehicle are mounted and a groove for receiving a battery is formed; And at least one sub printed circuit board coupled to at least one surface of the main printed circuit board at a matching position.

In the present invention, a multilayer antenna pattern is formed on the sub printed circuit board, and the multilayer antenna pattern may be an integrated antenna that can be used as an LF (Low Frequency), an RF (Radio Frequency) Pattern.

In the present invention, a switching circuit is formed on the main printed circuit board to connect a multilayer antenna pattern formed on the sub printed circuit board to one of an LF input / output terminal, an RF input / output terminal, and an NFC input / output terminal, And an LF antenna pattern is formed at a matching position of the main printed circuit board on which the sub printed circuit board is mounted.

In the present invention, the sub printed circuit board is mounted on the main printed circuit board through a SMD (Surface Mount Device).

In the present invention, at least three matching holes for matching with the main printed circuit board are formed on the sub printed circuit board, and the three matching holes are formed in the central printed circuit board, And a mark corresponding to the matching hole is formed in the main printed circuit board at a position corresponding to the matching hole formed in the sub printed circuit board, do.

In the present invention, at least one semicircular lead hole for soldering is formed on at least one side surface of the sub printed circuit board, and in correspondence with a position where the lead hole is formed at the matching position of the main printed circuit board And a pad (PAD) is formed.

In the present invention, the antenna pattern formed on the main printed circuit board and the sub printed circuit board may be formed by applying an adhesive to the entire surface of the flexible film, and then fusing the metallic copper foil to the metallic copper foil layer of the printed circuit board And is formed by etching treatment according to a pattern defined after the heat treatment and the exposure treatment.

According to another aspect of the present invention, there is provided a method of assembling a printed circuit board for a vehicle smart key, the method comprising the steps of: mounting a component for performing data communication and authentication with a vehicle, Forming at least one mark on at least one side of the at least one sub-printed circuit board to couple the sub-printed circuit board to a predetermined mating position; Wherein at least three matching holes formed in the sub printed circuit board are matched with markers formed on the main printed circuit board in order to connect the sub printed circuit board to a matching position of the main printed circuit board via an SMD step; Soldering the sub printed circuit board matched to the matching position of the main printed circuit board; And soldering and bonding a lead hole formed on at least one side of the sub printed circuit board, which is soldered and coupled to the main printed circuit board, and a pad (PAD) formed on the main printed circuit board .

The method may further include forming at least three matching holes for matching with the main printed circuit board on the sub printed circuit board coupled to the main printed circuit board.

The method may further include forming at least one semicircular lead hole on at least one side of the sub printed circuit board for soldering with the main printed circuit board.

Forming a pad (PAD) on the main printed circuit board for solder connection with the sub printed circuit board corresponding to a position of at least one semicircular lead hole formed in the sub printed circuit board; And further comprising:

In the present invention, a multilayer antenna pattern is formed on the sub printed circuit board, and the multilayer antenna pattern may be an integrated antenna that can be used as an LF (Low Frequency), an RF (Radio Frequency) Pattern, and the main printed circuit board is provided with a switching circuit for connecting a multilayer antenna pattern formed on the sub printed circuit board to one of an LF input / output terminal, an RF input / output terminal, and an NFC input / output terminal, And an LF antenna pattern is formed at a matching position of at least one surface of the main printed circuit board on which the printed circuit board is mounted.

In the present invention, the three matching holes formed in the sub printed circuit board are formed in a predetermined range of the central portion and the two mother portions facing each other, avoiding the antenna pattern formed on the sub printed circuit board do.

According to one aspect of the present invention, a smart key printed circuit board comprising a plurality of smart smart key printed circuit boards can be accurately coupled with each other in a designated position with respect to each other without using a joining member, thereby reducing the thickness of the smart key, And the wireless communication function can be improved.

1 is a flow chart illustrating a card-type wireless transceiver manufacturing process according to an embodiment of the present invention.
FIG. 2 is a sectional view showing a configuration of a card-type vehicle radio transceiver manufactured according to the manufacturing process of the card-type vehicle radio transceiver shown in FIG. 1;
FIG. 3 is a plan view showing a circuit board having an antenna of the card-type vehicle radio transceiver shown in FIG. 1. FIG.
4 is an exemplary diagram showing a configuration of a general antenna.
FIG. 5 is an exemplary diagram illustrating the configuration of a card-type vehicle radio transceiver according to an embodiment of the present invention; FIG.
6 is a cross-sectional view showing the configuration of the antenna of the card-type vehicle radio transceiver shown in Fig.
7 is a flowchart illustrating a manufacturing process of a card-shaped vehicle antenna according to an embodiment of the present invention.
FIG. 8 is an exemplary view showing the antenna size shown in FIG. 4; FIG.
FIG. 9 is an exemplary view for explaining a method of assembling a printed circuit board for a vehicle smart key according to an embodiment of the present invention; FIG.
FIG. 10 is an exemplary view for explaining a detailed shape of the second and third PCBs coupled to the first PCB in FIG. 9; FIG.
11 is a flowchart illustrating a method of coupling a printed circuit board for a vehicle smart key according to an embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a printed circuit board for a vehicle smart key according to an embodiment of the present invention will be described with reference to the accompanying drawings.

In this process, the thicknesses of the lines and the sizes of the components shown in the drawings may be exaggerated for clarity and convenience of explanation. In addition, the terms described below are defined in consideration of the functions of the present invention, which may vary depending on the intention or custom of the user, the operator. Therefore, definitions of these terms should be made based on the contents throughout this specification.

FIG. 1 is a flowchart illustrating a manufacturing process of a card-type radio transceiver according to an embodiment of the present invention. FIG. 2 is a view illustrating a configuration of a card-type vehicle radio transceiver manufactured according to the manufacturing process of the card- And FIG. 3 is a plan view showing a circuit board having the antenna of the card-type vehicle radio transceiver shown in FIG.

1 to 3, a process of manufacturing a card-type wireless transceiver according to an embodiment of the present invention will be described. First, in step S101, data communication with a vehicle is performed on one side of a circuit board (MCU: Micro Control Unit) for transmitting authentication data in response to data received from the vehicle, and then proceeds to step S103.

As shown in Fig. 3, one of the communication-related parts embedded in the circuit board 11 includes antenna coil parts 11a and 11b for communicating data with the vehicle in the X and Y axis directions wound on the bobbins, And an antenna pattern portion 11c for etching and etching the metallic copper foil layer of the circuit board 11 in a predetermined pattern to transmit and receive data to and from the vehicle in the Z-axis direction.

Here, the antenna coil units 11a and 11b are provided to perform data communication with the vehicle in the X-axis and Y-axis directions, and the antenna coil units 11a and 11b are formed by winding coils around bobbins The antenna coil portions 11a and 11b of the antenna 11 are provided on the circuit board 11 so as to have an orthogonal angle to each other in the X and Y axis directions.

In the antenna coil units 11a and 11b, an output terminal and an input terminal of the coil are connected to corresponding pins of an MCU (Micro Control Unit), and power is supplied to other corresponding pins of the MCU.

The antenna pattern portion 11c is provided to perform data communication with the vehicle in the Z axis direction having an orthogonal angle to the X axis and the Y axis of the antenna coil portions 11a and 11b, The portion 11c is formed by applying an adhesive to the entire surface of the flexible film and then fusing the metallic copper foil to heat and expose the metallic copper foil layer of the laminated circuit board 11, .

A battery receiving member provided on one side of the circuit board 11 and including battery terminals 13a and 13b connected to the circuit board 11 in the step S103; A reinforcing portion 15a provided on the other surface and connected to the circuit board 11 in a soldering process and an emergency key receiving groove 15b for accommodating the emergency key are formed.

Here, the battery accommodating member is configured such that a current flows between the battery terminals 13a and 13b when the battery is received in the battery receiving groove 13c, and the flow of the current is transmitted to the circuit board 11 do.

The emergency key receiving member is provided so that the reinforcing portion 15a having the emergency key receiving groove 15c is fixed to a predetermined position of the circuit board 11 through a soldering process.

If the circuit board 11, the battery receiving member, and the emergency key receiving member are formed through the above-described steps S101 and S103, the process proceeds to step S105.

The inserting blocks 17 and 19 are inserted into the battery receiving groove 13c and the battery receiving groove 13c in the emergency key receiving member 15c and the battery receiving member in step S105 Molding dies 21 and 23 patterned on the upper and lower surfaces of the battery housing member, the emergency key receiving member and the circuit board 11 are provided on the upper and lower surfaces of the circuit board 11, respectively, 17) 19 with a cavity 25 as a space layer.

In the step S105, the surface of the molds 21 and 23 is cleaned with nitrogen, argon, or hydrogen gas before the molding die is installed on the inserting block and the circuit board 11, To remove the organic material.

Next, in step S107, epoxy resin is filled in the cavity 25 by a high-temperature and high-pressure pressing process to form a resin case 41 for sealing the left and right upper and lower surfaces of the radio transceiver.

Here, in the step S107, the resin case may be formed by a transfer molding method using a thermosetting resin. Since this process is well known in the art, a detailed description thereof will be omitted.

Here, the thermosetting resin may include an epoxy-based resin and a wax component.

After the step S107 is performed, the inserting blocks 17 and 19 are removed from the molding dies 21 and 23, and then the process proceeds to a step S109 where the resin case is fully cured.

In step S109, the temperature of the inserting blocks 17 and 19 and the temperature difference between the resin case 41 are formed and the inserting blocks 17 and 19 are removed from the resin case 41 by heat shrinkage The resin case 41 is kept at the predetermined high temperature (oven) for a predetermined period of time to completely cure the resin case 41.

Then, in step S111, the log sheet and the decoration sheet are attached using the double-sided tape.

According to this configuration, after the adhesive material is applied to the front surface of the flexible film, the metal foil is fused to the surface of the laminated circuit board 11, and the related part 71, which performs data communication between the vehicles through step S101, An antenna coil part (11a) (11b) for data communication with the vehicle in X and Y axis directions in which a coil is wound around the bobbin, and a metallic copper foil layer of the circuit board (11) An antenna pattern portion 11c for transmitting and receiving data to and from the vehicle is formed.

Accordingly, the antenna coil unit 11a receives data from the vehicle in the X-axis direction and the antenna coil unit 11b formed in the Y-axis so as to have an orthogonal angle with respect to the X-axis direction transmits data transmitted in the Y- And the antenna pattern unit 11c receives the data transmitted from the vehicle in the Z-axis direction.

A battery housing member provided on one side of the circuit board 11 and including battery terminals 13a and 13b connected to the circuit board 11; An emergency key receiving member having a reinforcing portion 15a connected to the substrate 11 and an emergency key receiving groove 15b for accommodating the emergency key is formed.

That is, a battery is housed in a battery receiving member which is installed on one side of the circuit board 11 and includes battery terminals 13a and 13b connected to the circuit board 11 and a battery receiving groove 13c, An emergency key is housed in the emergency key receiving member having the reinforcing portion 15a and the emergency key receiving groove 15b connected to the substrate 11 and the battery terminals 13a, Layer.

The battery power is supplied to the communication related parts of the circuit board 11 and the antenna coil parts 11a and 11b and provided to the antenna pattern part 11c so that the communication related parts, , 11b and the antenna pattern portion 11c are driven.

That is, the antenna coil part 11a communicates data with the vehicle in the X-axis direction and transmits data transmitted in the Y-axis direction through the antenna coil part 11b formed in the Y-axis so as to have an orthogonal angle with respect to the X- And receives data transmitted in the Z-axis direction through the antenna pattern unit 11c.

In response to the data received through the antenna coil units 11a and 11b and the antenna pattern unit 11c, the authentication-related parts of the circuit board 11 transmit the previously stored authentication data through the antenna, Data is received at the vehicle.

According to the embodiment of the present invention, the thickness of the card-type vehicle radio transceiver can be minimized by forming Athene, which performs data communication with the vehicle in the Z-axis direction, in a predetermined pattern on the metallic copper foil layer on the circuit board Accordingly, it is possible to reduce the size of the product to be light and thin, so that it is easy to hold the product, and the epoxy resin can be prevented from being filled in the inside of the device, thereby making it possible to fundamentally improve the reliability of the product.

In a typical automotive radio transmitter, a circuit board on which electronic components are mounted is placed in a molding die, molded with an epoxy-based thermosetting resin material, and the mounted circuit board is sealed.

In order to receive data transmitted from the vehicle through the LF communication, antennas in the X-, Y-, and Z-axis directions are typically formed, and each of the antennas in the X-, Y-, and Z- . That is, as shown in Fig. 4, the antenna has a structure in which the bobbin 1 is inserted into the cover after winding the coil on the bobbin, and the cover 5 is mounted on the circuit board by a soldering process.

Therefore, the conventional antenna has a size of L, W, and T of 11.8, 3.4, and 2.75 mm, respectively.

5 is a diagram showing a configuration of a card-type vehicle radio transceiver to which the present invention is applied. As shown in Fig. 5, a card-type vehicle radio transceiver to which the present invention is applied includes a coil wound around a bobbin for data communication with a vehicle in X and Y axis directions so as to receive data transmitted from a vehicle through LF communication An output terminal and an input terminal of the coil form an antenna coil part 40 connected to a corresponding pin of an MCU (Micro Control Unit) through an electrical connection of the circuit board.

For convenience of explanation, the antenna coil portions 11a and 11b and the antenna pattern portion 11c of FIG. 3 are denoted by the same reference numerals 40 and 100 in FIG. 5, respectively.

6 is a cross-sectional view showing the configuration of the antenna coil part 40 shown in FIG. 5 in detail. 6, the card-type vehicular antenna coil portion to which the present embodiment is applied includes a bobbin 45 having a through hole 43 into which a core 41 formed of a bar-shaped magnetic material is inserted, And a connecting portion 61 extending from one side of the bobbin 45 and fixing one terminal of the coil 51 wound on the bobbin 45 to the circuit board .

The core 41 is formed of a magnetic material such as nickel zinc ferrite or manganese zinc ferrite, and has a bar shape. The core 41 has the same shape as the through hole 43 of the bobbin 45 and is slidably movable when the core 41 is inserted into the through hole 43.

On the other hand, the bobbin 45 has a rectangular parallelepiped shape of an insulating material. A flange is formed at each edge of a pair of mutually facing surfaces of the main body, and the coil 51 is wound on the other four surfaces.

As shown in Fig. 8, the length of the antenna coil part wound on the coil 51 is set to 8.4 mm or more and 11.0 mm or less, the width is 2.0 mm or 0.03 mm, and the thickness is 1.3 mm.

That is, the size of the antenna coil part is derived from the diameter of the coil 51 and the size of the bobbin 45, and the winding of the coil is set to be the same as that of the conventional winding coil.

Further, the diameter of the coil 51 is derived on the basis of a predetermined relational expression, and the size of the bobbin 45 is derived based on a predetermined relational expression.

For example, an antenna coil part is fabricated with a coil having a predetermined diameter smaller than the diameter of a conventional coil, and the degree of reduction in the size of the entire antenna coil part is monitored. Based on the monitoring result, .

The determined size of the antenna coil part wound with the coil having the predetermined diameter or less is set to 8.4 mm or more and 11.0 mm or less in length, 2.0 mm or 0.03 mm in width, or 1.3 mm in thickness.

A through hole 43 is formed in the longitudinal direction of the rectangular parallelepiped shape of the bobbin 45. The through hole 43 is inserted with a core 41 made of a conductive material.

In the longitudinal direction of the bobbin 45, two terminals, i.e., two connecting portions 61, are fixed. The two terminals are made of a metallic rigid member such as steel or aluminum from the coil 51. One side of the terminal is connected to the coil by soldering or the like and the other side of the terminal is directly connected to the circuit board 81 Respectively.

In the embodiment of the present invention, the coil and the terminal are connected to the circuit board. However, one side of the coil may be directly connected to the circuit board through the soldering process.

A capacitor 91 is connected to one end of the coil 51 through a terminal of the connection part 61. The capacitor 91 is directly mounted on the circuit board 81 by soldering to one of the two terminals of the coil 51 and the connecting portion so that the coil 51 and the capacitor 91 are electrically connected to the circuit board 81 ) To form a resonance circuit.

In this antenna coil, the reception sensitivity with the immobilizer of the vehicle is determined according to the characteristics such as the resonance frequency of the resonance circuit (resonance circuit) including the coil 51 and the capacitor 91.

FIG. 7 is an exemplary view showing an antenna coil part manufacturing process of the card-type vehicle radio transceiver shown in FIG. 5 as an embodiment. As shown by way of example only in Fig. 6, the card-type vehicle radio transceiver firstly includes a communication-related part for performing data communication with the vehicle on one side of the circuit board in step S201, A component including an authentication related part (MCU: Micro Control Unit) for transmitting the authentication data is buried, and the process proceeds to step S203.

One of the communication-related parts embedded in the circuit board 11 includes an antenna coil part 40 for communicating data with the vehicle in the X- and Y-axis directions wrapped around the coil on the bobbin as shown in Fig. 7, And an antenna pattern unit 100 for transmitting and receiving data with the vehicle in the Z-axis direction by etching the metallic copper foil layer of the circuit board 41 in a predetermined pattern.

Here, the antenna coil unit 40 is provided to perform data communication with the vehicle in the X-axis and Y-axis directions, and the antenna coil unit 40 is formed by winding a coil 51 around the bobbin 45 The antenna coil part 40 of the antenna device 40 is installed on the circuit board 81 so as to have an orthogonal angle to each other in the X axis direction and the Y axis direction.

The output terminal and the input terminal of the coil 51 of the antenna coil unit 40 are connected to corresponding pins of a micro control unit (MCU) embedded in a predetermined position of the circuit board 81, To be input to the other corresponding pins of the controller.

Hereinafter, a series of steps S201 for embedding the antenna coil part 40 and the authentication-related part in the circuit board 81 will be described in more detail.

The core 41 formed of a rod-shaped magnetic material is wound around a bobbin 45 having a through-hole 43 inserted and inserted through the through-hole 43, A connection part 61 extending from the bobbin 45 along the longitudinal direction of the core and fixed to the bobbin and one side of the bobbin 45 are connected to a predetermined portion of the circuit board 81 And one side of the coil is electrically connected to the circuit board via the connecting portion (S201c, S201d).

A capacitor 91 is buried in a predetermined position of the circuit board 81 and is electrically connected to one terminal of the coil 51 to form a resonant circuit (S201e).

A battery housing member provided on one side of the circuit board 81 and including a battery terminal connected to the circuit board 81 in the step S203; Thereby forming the emergency key receiving member.

When the battery is received in the battery receiving groove, current flows between the battery terminals of the battery housing member, and the flow of the current is electrically connected to the circuit board 81.

The emergency key receiving member is fixed to a predetermined position of the circuit board 81 through a soldering process.

If the circuit board 81, the battery housing member, and the emergency key receiving member are formed through the above-described steps S201 and S203, the process proceeds to step S205.

After inserting the inserting block into each of the interior of the emergency key receiving member and the battery receiving member in step S205, a pattern is formed on each of the battery housing member, the emergency key receiving member, and the upper and lower surfaces of the circuit board 81, And a cavity, which is a space layer with the molding die, is formed on the upper surface and the lower surface of the circuit board 81, respectively.

Next, in step S207, epoxy resin is filled into the cavity by a high-temperature and high-pressure pressing process to form a resin case for sealing left and right upper and lower surfaces of the radio transceiver.

After the execution of step S207, the inserting block is removed from the molding die and the process proceeds to step S209 where the resin case is fully cured.

In step S209, the temperature of the inserting block and the temperature difference of the resin case are formed to remove the inserting block from the resin case by heat shrinkage. Then, the resin case is removed from the resin case at a predetermined high temperature To completely cure the resin case.

In step S211, a log sheet and a decoration sheet are attached using a double-sided tape.

According to such a configuration, a related component that performs data communication between vehicles through step S201 is mounted on the laminated circuit board 81 by applying an adhesive to the front surface of the flexible film and fusing the metallic copper foil, The antenna coil part 40, which communicates data with the vehicle in the X and Y axis directions in which the coil 51 is wound around the bobbin 45, is mounted at a predetermined position, and the metallic copper foil layer of the circuit board 81 is set in a predetermined pattern The antenna pattern portion 100 for transmitting and receiving the vehicle and data in the Z-axis direction is formed.

The circuit board 81 is provided with a battery receiving member having a battery receiving groove electrically connected by the circuit board 81, and an emergency key receiving member having an emergency key receiving groove for receiving the emergency key is formed (S203).

That is, the battery is housed in the battery housing member, the emergency key is housed in the emergency key housing member, and the battery terminal is connected to the conductive layer of the circuit board 41.

Therefore, the battery power supplies power to the communication related parts of the circuit board 41, the antenna coil part 40, and causes the communication related parts, the antenna coil part 40 and the antenna pattern part 100 to be driven. Therefore, a resonance circuit is formed between the coil 51 and the capacitor 91 of the antenna coil part 40 to perform data communication with the vehicle in the X and Y axis directions.

In response to the data received through the antenna coil unit 40 and the antenna pattern unit 100, the authentication-related parts of the circuit board 81 transmit the previously stored authentication data through the antenna, Lt; / RTI >

According to the embodiment of the present invention, there is provided an antenna manufacturing method of a card-type vehicle radio transceiver in which a coil having a predetermined diameter or less is wound on a bobbin and a bobbin on which a coil is wound is fixed on a circuit board by a soldering process (L = 11.8 mm), the length (W = 3.4 mm), and the height (T = 2.4 mm) as the coil of the antenna is removed and the coil having a diameter of predetermined value or less is wound. (Length L = 11.0 mm), length (width W = 2.0 mm), and height (thickness T = 1.3 mm). Therefore, according to the antenna according to the embodiment of the present invention, the overall size of the antenna can be basically reduced with respect to the same coil winding, so that the vehicle radio transceiver can be downsized.

9 is an exemplary view for explaining a method of assembling a printed circuit board for a vehicle smart key according to an embodiment of the present invention.

9, a PRINTED CIRCUIT BOARD (PCB) for a vehicle smart key according to the present embodiment includes a main PCB 210 (or a first PCB) and a main PCB 210 PCBs 110, 120 (or second and third PCBs) coupled (or mounted) to the PCBs 110, 120.

Although the size of the second and third PCBs 110 and 120 is smaller than that of the first PCB 210 according to the embodiment of the present invention, (110, 120) may be the same size.

Although the first and second PCBs 210 and 120 are shown as being rectangular in the present embodiment, the first and second PCBs 210 and 220 may be formed in a rectangular shape, 2, and 3 PCBs 110 and 120 may be formed in different shapes (e.g., circular, oval triangle, hexagonal, octagonal, etc.).

In this embodiment, the antenna patterns are formed on the second and third PCBs 110 and 120, and the antenna pattern is formed as a multilayer antenna pattern (L1 to L4) as shown in FIG. do. As described above, by forming the antenna pattern into a multilayer antenna (i.e., a multilayer antenna) pattern, the length of the antenna (i.e., the length of the antenna coil) can be increased to improve performance.

For example, the second and third PCBs 110 and 120 may be formed with an antenna pattern so that they can be used as LF, RF (Radio Frequency), and NFC (Near Field Communication) antennas. When the second and third PCBs 110 and 120 are formed of the LF, RF, and NFC integrated antennas as described above, a switching circuit (not shown) is added to the first PCB 210 so that the input / (Radio communication environment using LF, RF, NFC, and the like) diversified by making it possible to connect to the LF input / output terminal, the RF input / output terminal, and the NFC input / output terminal You may.

Meanwhile, the antenna pattern 220 may be formed on the first PCB 210.

However, the antenna pattern 220 formed on the first PCB 210 has a problem that the performance of the LF transmitting / receiving antenna may be restricted as described in the background art when the thickness of the PCB is reduced. Therefore, there is a need to compensate (or supplement) the performance of an antenna (i.e., an LF transmitting / receiving antenna) that is restricted when the thickness of the first PCB 210 is reduced.

Therefore, in the present embodiment, when the thickness of the first PCB 210 is reduced by bonding (or mounting) the second and third PCBs 110 and 120 having the antenna pattern formed thereon to the first PCB 210 The effect of compensating the radio communication performance of the constrained antenna (i.e., the LF transmit / receive antenna) arises.

Also, at least one of the second and third PCBs 110 and 120 is coupled (or mounted) to at least one side (e.g., upper surface or lower surface) of the first PCB 210, An effect of increasing the thickness of the printed circuit board by the thickness of the printed circuit boards 110 and 120 also occurs. That is, even if the EMC becomes thin, the durability of the product (smart key) (for example, durability against external impact, durability against bending or bending force, durability against compression force, etc.) is increased.

In order to prevent deterioration of antenna performance (for example, performance degradation due to interference between antennas) when the first PCB 210 and the second and third PCBs 110 and 120 are coupled, 2, and 3 PCBs 210, 110, and 120 must be correctly coupled with each other at a designated position in a designated direction.

In addition, when the first PCB 210 and the second and third PCBs 110 and 120 are coupled to each other, it is necessary to prevent unnecessary work from being performed (for example, assembly work using a coupling member). This is because whenever workload is added, the work time is increased by that much, resulting in an increase in production cost and a possibility of failure due to the additional labor work.

Therefore, in this embodiment, in order to solve the above-mentioned problems (for example, precise joining of the second and third PCBs to the designated position of the first PCB, elimination of additional operation such as assembly of the coupling member, etc.) 3 PCBs 110 and 120 are directly coupled (or mounted) to the first PCB 210 through a SMD (Surface Mount Device).

In addition to the above SMD, wave soldering and mechanical bonding may be applied after hole insertion.

For example, referring to FIG. 10, at least three holes (i.e., matching holes) H1, H2, and H3 for matching (i.e., aligning) the second and third PCBs 110 and 120 are formed. At this time, the three matching holes H1, H2, and H3 are formed at the center portion of the second and third PCBs 110 and 120 and the opposite corner portions thereof, respectively, avoiding the antenna pattern ANT. However, the three matching holes H1, H2, and H3 are not necessarily limited to the above described positions.

On the first PCB 210, markings (not shown) corresponding to the holes H1, H2 and H3 formed in the second and third PCBs 110 and 120 are formed, 120 are coupled (or mounted) to the mating positions of the first PCB 210.

However, when the second and third PCBs 110 and 120 are coupled (or mounted) to the first PCB 210 by using the SMD as described above, a general component having many legs (e.g., a resistor, an IC, , The second and third PCBs 110 and 120 may not be rigidly coupled (or mounted) due to their relatively large area and legs.

Therefore, it is necessary to supplement the second and third PCBs 110 and 120 to improve the rigidity when the PCBs 110 and 120 are coupled (or mounted) to the first PCB 210.

9, at least one semicylindrical lead hole LH1 (that is, a hole for soldering) is formed on at least one side of the second and third PCBs 110 and 120. In this case, And a pad (PAD) is formed on the first PCB 210 corresponding to the position where the lead hole LH1 is formed.

For example, the lead hole LH1 and the pad PAD may be formed of nickel that is well soldered. However, the lead hole (LH1) and the pad (PAD) are not necessarily made of nickel, but may be formed of other materials that can be soldered well.

The lead hole LH1 and the pad PAD are soldered to each other during soldering so that the connection or mounting of the second and third PCBs 110 and 120 with respect to the first PCB 210 becomes more robust It is effective.

When the coupling (or mounting) of the second and third PCBs 110 and 120 is completed with respect to the first PCB 210 as described above, ) So as not to be exposed to the outside.

11 is a flowchart illustrating a method of combining a printed circuit board for a vehicle smart key according to an embodiment of the present invention.

(Or mounting) at least one of the second and third PCBs 110 and 120 to the matching position on at least one side (e.g., upper side, lower side) of the first PCB 210 as shown in FIG. 11 One or more markers (not shown) are formed (S301).

The first PCB 210 is mounted with components (e.g., passive components, MCU, etc.) (not shown) for performing data communication with the vehicle and authentication, and a groove (not shown) for storing the battery is formed.

An LF antenna pattern (220 in FIG. 9) is formed in the first PCB 210 to transmit and receive data to and from the vehicle in the Z axis direction at a position (or region) where the second and third PCBs 110 and 120 are coupled do.

At least three holes H1, H2 and H3 for matching are formed on the second and third PCBs 110 and 120 connected to (or mounted on) the first PCB 210 (S302).

At this time, the three matching holes H1, H2, and H3 are disposed at the central portion of the second and third PCBs 110 and 120 and the opposite sides of the third and fourth PCBs 110 and 120, (Range) of the two corner portions that are formed.

For reference, the antenna pattern is provided to perform data communication with the vehicle in the Z-axis direction having an orthogonal angle to the X-axis Y-axis antenna coil. After the adhesive is applied to the front surface of the flexible film, the metallic copper foil is fused The metallic copper foil layer of the laminated printed circuit board is subjected to heat treatment and exposure treatment followed by etching treatment according to a predefined pattern.

Also, at least one side of the second and third PCBs 110 and 120 is connected to the first and second PCBs 110 and 120 to firmly couple (or mount) the second and third PCBs 110 and 120 to the first PCB 210 At least one semicircular lead hole LH1 is formed (S303).

A pad (PAD) is formed on the first PCB 210 corresponding to the position where the lead hole LH1 is formed (S304).

For example, the lead hole LH1 and the pad PAD are formed of any material that can be soldered well.

In order to couple (or mount) at least one of the second and third PCBs 110 and 120 to the matching position of the first PCB 210 through a SMD (Surface Mount Device), the second and third PCBs 110 H2, and H3 formed on the second PCB 120 are aligned with the mark (not shown) formed on the first PCB 210 (S305).

Next, the second and third PCBs 110 and 120 matched to the matching positions of the first PCBs 210 are soldered (or soldered) (S306).

A lead hole LH1 formed on one side of the second and third PCBs 110 and 120 soldered (or soldered) to the first PCB 210 and a pad (not shown) formed on the first PCB 210 PAD) are coupled by soldering (or soldering) (S307).

When the coupling (or mounting) of the second and third PCBs 110 and 120 is completed with respect to the first PCB 210 as described above, ) So that the resin case is formed so as not to be exposed to the outside and is cured.

However, since the process of forming the resin case is a generally known process, a detailed description thereof will be omitted.

As described above, the present embodiment reduces the thickness of the smart key by allowing a plurality of the smart key printed circuit boards for a vehicle to be accurately combined with each other in a designated direction (that is, a matching position) without using a joining member It has the effect of improving the durability and the wireless communication function.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, I will understand the point. Accordingly, the technical scope of the present invention should be defined by the following claims.

210: first PCB 220: antenna pattern formed on first PCB
110: second PCB 120: third PCB
LH1: lead hole PAD: Pad connected by soldering to the lead hole
H1 to H3: matching hole ANT: antenna pattern formed on second and third PCBs

Claims (13)

A main printed circuit board on which components for performing data communication and authentication with the vehicle are mounted and a groove is formed for receiving the battery; And
And at least one sub printed circuit board coupled to at least one mating position of at least one side of the main printed circuit board.
The method according to claim 1,
A multilayer antenna pattern is formed on the sub printed circuit board,
Wherein the multilayer antenna pattern is a monolithic antenna pattern that can be used as an LF (Low Frequency), an RF (Radio Frequency), and an NFC (Near Field Communication) antenna.
The method according to claim 1,
The main printed circuit board includes a switching circuit for connecting a multilayer antenna pattern formed on the sub printed circuit board to one of an LF input / output terminal, an RF input / output terminal, and an NFC input / output terminal,
Wherein an LF antenna pattern is formed at a matching position of the main printed circuit board on which the sub printed circuit board is mounted.
The printed circuit board according to claim 1,
Wherein the printed circuit board is mounted on the main printed circuit board through a SMD (Surface Mount Device).
The method according to claim 1,
At least three matching holes for matching with the main printed circuit board are formed on the sub printed circuit board, and the three matching holes are formed in a central portion and two Each formed within a predetermined range of the mother portion,
Wherein a mark corresponding to the matching hole is formed in the main printed circuit board at a position corresponding to the matching hole formed in the sub printed circuit board.
The method according to claim 1,
At least one semicircular lead hole for soldering is formed on at least one side surface of the sub printed circuit board,
Wherein a pad (PAD) is formed corresponding to a position where the lead hole is formed at a matching position of the main printed circuit board.
The method according to claim 1,
The antenna pattern formed on the main printed circuit board and the sub printed circuit board,
Characterized in that the flexible copper foil is formed by heat-treating and exposing the metallic copper foil layer on a laminated printed circuit board after applying an adhesive to a front surface of a flexible film and then fusing the metallic foil, Printed circuit board for smart key.
A main printed circuit board on which a component for performing data communication with the vehicle and authentication is mounted, and at least one sub-printed circuit board is coupled to a predetermined matching position on at least one side of a top and bottom surface of a main printed circuit board, ≪ / RTI >
Wherein at least three matching holes formed in the sub printed circuit board are matched with markers formed on the main printed circuit board in order to connect the sub printed circuit board to a matching position of the main printed circuit board via an SMD step;
Soldering the sub printed circuit board matched to the matching position of the main printed circuit board; And
And bonding the lead pads formed on at least one side of the sub printed circuit board soldered to the main printed circuit board and the pads formed on the main printed circuit board by soldering. Method of joining printed circuit board for smart key.
9. The method of claim 8,
And forming at least three matching holes for matching with the main printed circuit board on the sub printed circuit board coupled to the main printed circuit board. Way.
9. The method of claim 8,
And forming at least one semicircular lead hole for solder coupling with the main printed circuit board on at least one side of the sub printed circuit board. .
9. The method of claim 8,
And forming a pad (PAD) on the main printed circuit board for solder connection with the sub printed circuit board corresponding to a position of at least one or more semicircular lead holes formed in the sub printed circuit board Of the printed circuit board for a vehicle smart key.
9. The method of claim 8,
A multilayer antenna pattern is formed on the sub printed circuit board. The multilayer antenna pattern is an integrated antenna pattern that can be used as an LF (Low Frequency), an RF (Radio Frequency), and an NFC (Near Field Communication)
The main printed circuit board includes a switching circuit for connecting a multilayer antenna pattern formed on the sub printed circuit board to one of an LF input / output terminal, an RF input / output terminal, and an NFC input / output terminal,
Wherein an LF antenna pattern is formed at a matching position of at least one surface of the main printed circuit board on which the sub printed circuit board is mounted.
10. The printed circuit board according to claim 9, wherein the three matching holes formed in the sub printed-
Wherein the main printed circuit board and the printed circuit board are formed in a predetermined range of a center portion and two mother portions facing each other so as to avoid an antenna pattern formed on the sub printed circuit board.

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