KR20170000709A - Microwave module and method for packaging thereof - Google Patents
Microwave module and method for packaging thereof Download PDFInfo
- Publication number
- KR20170000709A KR20170000709A KR1020150090022A KR20150090022A KR20170000709A KR 20170000709 A KR20170000709 A KR 20170000709A KR 1020150090022 A KR1020150090022 A KR 1020150090022A KR 20150090022 A KR20150090022 A KR 20150090022A KR 20170000709 A KR20170000709 A KR 20170000709A
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- Prior art keywords
- microwave
- mmic
- signal
- multilayer board
- conductive
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0657—Stacked arrangements of devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0652—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next and on each other, i.e. mixed assemblies
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The present invention relates to a microwave module and a packaging method thereof. The microwave module of the present invention is packaged using a low-priced multilayer board for mounting a plurality of MCM parts. To this end, the microwave module of the present invention includes a housing sequentially stacked, a multi-layer board and a cover. The multilayer board is formed by stacking a plurality of individual boards of Teflon layer so that the circuit patterns for the transmission line, the power supply signal, the control signal and the ground for microwave signal input / output of the microwave module are formed and electrically connected to each other. Conductive through-holes are formed. According to the present invention, by using a multi-layered board made of Teflon, the manufacturing process can be simplified and the manufacturing cost can be shortened by simplifying the process compared to the low temperature co-fired ceramic lamination technique.
Description
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a microwave module, and more particularly, to a microwave module and a packaging method thereof that can be manufactured at low cost by using a multi-layer board of a low-cost Teflon material for mounting an MCM (Multi-Chip Module) component.
The microwave module is mainly applied to a transmission / reception module or a semiconductor high-power amplifier used for civil microwave repeater, military radar, etc., and has various functions including high transmission power amplification, low noise reception signal amplification, phase / .
In the microwave module, the transmitting and receiving modules are packaged by arranging the transmitting and receiving circuits on different substrates and shielding members made of a metal or a radio wave absorber in order to suppress mutual interference caused by the electromagnetic field generated between the transmitting and receiving circuits. However, in the case of such a microwave module, there is a problem that the size and weight of the module become large.
In order to solve such a problem, the transmission / reception module has been manufactured by a lamination technique using a low temperature cofired ceramic (LTCC) material excellent in high frequency characteristics. Such a transmission / reception module improves the integration degree of the transmission / reception circuits, contributes to the miniaturization and performance improvement of the equipment, and is applied to a variety of applications such as a mobile communication field and a safety device for transportation means such as an automobile as well as a radar device for military use have.
However, a microwave module using a low temperature co-fired ceramic lamination process has a high manufacturing cost and a complicated manufacturing method. Particularly, it is difficult to manufacture a plurality of channels on a single board. In addition, if a malfunction occurs in an internal element or a circuit after the microwave module is manufactured or is being operated, there is a disadvantage that the module itself needs to be replaced, and the maintenance cost is also high.
That is, a microwave module using a low temperature cofired ceramic (LTCC) material can be packaged individually for major MMIC parts therein, or an expensive housing or cover material is used, and a low temperature co-fired ceramic board A die-shaped MMIC part is assembled and then packaged in a completely sealed form. These microwave modules are expensive to package materials and process complicated processes, making the manufacturing period and packaging method somewhat complicated.
It is an object of the present invention to provide a microwave module using a low-priced multilayer board for mounting an MCM part and a method of packaging the microwave module.
Another object of the present invention is to provide a microwave module packaged by shortening the manufacturing period and simplifying the manufacturing process and a method of packaging the microwave module.
It is another object of the present invention to provide a microwave module and a package method thereof that can be packaged at low cost and applicable to various product development.
In order to achieve the above objects, the microwave module of the present invention is characterized by using a multi-layered board made of Teflon. Such a microwave module can simplify the process compared with the low temperature co-fired ceramic lamination technique, shortening the manufacturing period and reducing the manufacturing cost.
The microwave module according to the present invention is characterized in that a circuit pattern for inputting and outputting a microwave signal of the microwave module, a power supply signal, a control signal and a grounding circuit pattern are formed and electrically connected to each other, And a conductive through hole for mounting the at least one MMIC part is formed; A housing coupled to a lower portion of the multilayer board and having a bottom plate installed at a position of the conductive through hole to allow heat generated from the MMIC component to be discharged; The MMIC component is housed in the lower part and is coupled to a ground plane formed on an edge of the upper surface of the multilayer board to shield interference caused by signal emission generated in the MMIC part and the transmission line, And a cover covering the top of the multilayer board to protect peripheral circuits mounted on the multilayer board.
In one embodiment of this aspect, the multilayer board comprises: First to third individual boards having the same thickness and fourth individual boards having a thickness smaller than that of the first to third individual boards are laminated.
In another embodiment, the MMIC component and the circuit pattern of the multi-layer board are connected via a wire.
In another embodiment, the lid is made of an aluminum material or an aluminum alloy material.
In another embodiment, the microwave module includes: a receiver for receiving a microwave reception signal from an external electronic device that processes a microwave signal; A transmitter for outputting a microwave transmission signal to the external electronic device; Receiving the microwave receiving signal from the receiving unit to vary the magnitude and phase of the microwave receiving signal and outputting the microwave receiving signal to another external electronic device, receiving the microwave transmitting signal from the other external electronic device, And outputting a microwave transmission signal to the transmission unit; The receiver is provided with a low-noise amplifier MMIC, and the transmitter includes a high-power amplifier MMIC and a drive amplifier MMIC, and the size and phase variable part is provided as a core-chip MMIC.
According to another aspect of the present invention, a method of packaging a microwave module of the present invention is provided.
According to another aspect of the present invention, there is provided a method of packaging a microwave module comprising a multilayer board formed by electrically connecting a plurality of individual boards on which circuit patterns and conductive through holes are formed, the conductive through holes being mutually aligned, ; Bonding the multilayer board to an upper portion of the housing such that the bottom plate of the housing is located in the conductive through hole at an assembly temperature of at least 150 캜; Placing the plurality of MMIC components in the conductive through-holes at an assembly temperature of at least 120 ° C and coupling them to be mounted on the bottom plate; Bonding the pads of the MMIC parts mounted on the bottom plate to the circuit pattern of the multi-layer board so as to be electrically connected; And assembling the lid to an upper portion of the multi-layer substrate on which the MMIC component is mounted at an assembly temperature of at least 120 캜.
In one embodiment of this aspect, the step of joining the cover engages a ground pattern formed on the top edge of the multiple boards of the circuit patterns.
As described above, since the microwave module of the present invention uses a low-cost Teflon board formed by stacking a single process for mounting and packaging a plurality of MMIC parts, the process is simplified compared with the low temperature cofired ceramic lamination technique, And the manufacturing cost can be reduced.
In the microwave module of the present invention, a plurality of MMIC components are mounted on a circuit pattern having a conductive through-hole of a multilayer board coupled to an upper portion of a housing, and a cover is coupled to an upper portion of the multilayer board to package the same. It is possible to suppress the interference due to the signal radiation to the internal space, and the reliability due to the environmental protection of the MMIC component can be enhanced.
Further, the microwave module of the present invention can be variously applied to a product for processing a microwave signal that can accommodate a plurality of channels because there is no restriction factor according to the size of the multilayer board by packaging using a low-cost multilayer board.
1 is a perspective view illustrating a configuration of a microwave module according to the present invention;
FIG. 2 is an exploded perspective view of the microwave module shown in FIG. 1; FIG.
3 is a plan view showing a configuration of a multi-layer board on which the MMIC part shown in Fig. 1 is mounted; Fig.
FIG. 4 is a block diagram showing a configuration of the microwave module shown in FIG. 1; FIG. And
5 is a flowchart showing a package procedure of a microwave module according to the present invention.
The embodiments of the present invention can be modified into various forms and the scope of the present invention should not be interpreted as being limited by the embodiments described below. The present embodiments are provided to enable those skilled in the art to more fully understand the present invention. Therefore, the shapes and the like of the components in the drawings are exaggerated in order to emphasize a clearer explanation.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
FIG. 1 is a perspective view illustrating a configuration of a microwave module according to the present invention, FIG. 2 is an exploded perspective view of the microwave module shown in FIG. 1, and FIG. 3 is a cross- Fig.
1 to 3, the
To this end, the
Specifically, the
The
The MMIC
The
The
The
Each of the
The
As described above, the
The
And FIG. 4 is a block diagram showing the configuration of the microwave module shown in FIG.
Referring to FIG. 4, the
Specifically, the
The transmitting
The size and phase
In this embodiment, the receiving
The low-
The driving
The high
5 is a flowchart showing a package procedure of the microwave module according to the present invention.
Referring to FIG. 5, the
In step S210, the
The pads of the
Here, the packaging process using a general low temperature co-fired ceramic board requires a process of assembling the low temperature co-fired ceramic board and the housing at about 280 ° C. and assembling the barrier wall.
Therefore, comparing the packaging process using the low-cost multiple-board according to the present invention and the packaging process using the low-temperature co-fired ceramic board according to the prior art (prior art), the present invention can lower the assembly temperature and simplify the number of processes And the manufacturing period and manufacturing cost are shown in Table 1 below.
As described above, the
While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it should be understood that various changes and modifications may be made therein without departing from the spirit and scope of the invention. Do.
100: Microwave module
110: Housing
120: multilayer board
121: Conducting through hole
122 ~ 126: MMIC parts
123, 125, 127: circuit pattern
130: cover
150:
160:
170: magnitude and phase variable section
Claims (7)
A plurality of individual boards of Teflon material are laminated and combined to form a circuit pattern for a transmission line, a power supply signal, a control signal, and a ground for microwave signal input / output of the microwave module and electrically connected to each other, and at least one MMIC A multilayer board on which conductive through holes are formed for mounting microwave integrated circuit components;
A housing coupled to a lower portion of the multilayer board and having a bottom plate installed at a position of the conductive through hole to allow heat generated from the MMIC component to be discharged;
The MMIC component is housed in the lower part and is coupled to a ground plane formed on an edge of the upper surface of the multilayer board to shield interference caused by signal emission generated in the MMIC part and the transmission line, And a cover covering an upper portion of the multilayer board to protect peripheral circuits mounted on the multilayer board.
Wherein the multilayer board comprises:
Wherein the first to third individual boards having the same thickness and the fourth individual boards having a thickness smaller than that of the first to third individual boards are stacked.
Wherein the MMIC part and the circuit pattern of the multilayer board are connected through a wire.
Wherein the cover is made of an aluminum material or an aluminum alloy material.
The microwave module
A receiver for receiving a microwave reception signal from an external electronic device for processing a microwave signal;
A transmitter for outputting a microwave transmission signal to the external electronic device;
Receiving the microwave receiving signal from the receiving unit to vary the magnitude and phase of the microwave receiving signal and outputting the microwave receiving signal to another external electronic device, receiving the microwave transmitting signal from the other external electronic device, And outputting a microwave transmission signal to the transmission unit;
Wherein the receiving unit is a low noise amplifier MMIC, the transmitting unit is a high power amplifier MMIC and the driving amplifier MMIC, and the size and phase variable unit is a core chip MMIC.
A multilayer board formed by electrically connecting a plurality of individual boards formed with a circuit pattern and a conductive through hole and stacked with the conductive through holes mutually aligned, preparing a housing and a cover;
Bonding the multilayer board to an upper portion of the housing such that the bottom plate of the housing is located in the conductive through hole at an assembly temperature of at least 150 캜;
Placing the plurality of MMIC components in the conductive through-holes at an assembly temperature of at least 120 ° C and coupling them to be mounted on the bottom plate;
Bonding the pads of the MMIC parts mounted on the bottom plate to the circuit pattern of the multi-layer board so as to be electrically connected;
And joining the lid to an upper portion of the multi-layer substrate on which the MMIC component is mounted at an assembly temperature of at least 120 ° C.
Wherein the step of joining the lid is coupled to a ground pattern formed on an upper edge of the multiple boards among the circuit patterns.
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KR1020150090022A KR101951653B1 (en) | 2015-06-24 | 2015-06-24 | Microwave module and method for packaging thereof |
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KR1020150090022A KR101951653B1 (en) | 2015-06-24 | 2015-06-24 | Microwave module and method for packaging thereof |
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KR20170000709A true KR20170000709A (en) | 2017-01-03 |
KR101951653B1 KR101951653B1 (en) | 2019-02-25 |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20220061424A (en) * | 2020-11-06 | 2022-05-13 | 주식회사 유텔 | Transmit/receive module based on multilayer liquid crystal polymer multilayer substrate |
USD986249S1 (en) * | 2021-08-30 | 2023-05-16 | Samsung Electronics Co., Ltd. | Solid state drive memory device |
USD986900S1 (en) * | 2021-08-30 | 2023-05-23 | Samsung Electronics Co., Ltd. | Solid state drive memory device |
USD996424S1 (en) * | 2020-06-09 | 2023-08-22 | Samsung Electronics Co., Ltd. | Solid state drive memory device |
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JP2002368561A (en) * | 2001-06-04 | 2002-12-20 | Hitachi Ltd | Waveguide mmic module |
KR100843174B1 (en) | 2000-12-15 | 2008-07-02 | 톰슨 라이센싱 | Process for securing a microwave module to a support |
KR100941694B1 (en) | 2009-08-28 | 2010-02-12 | 삼성탈레스 주식회사 | Printed circuit board for transceiver module |
KR20140073786A (en) | 2012-12-07 | 2014-06-17 | 국방과학연구소 | Microwave transmit/receive module and packaging method for the same |
KR101496843B1 (en) | 2007-06-14 | 2015-02-27 | 레이티언 캄파니 | Microwave integrated circuit package and method for forming such package |
-
2015
- 2015-06-24 KR KR1020150090022A patent/KR101951653B1/en active IP Right Grant
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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KR100843174B1 (en) | 2000-12-15 | 2008-07-02 | 톰슨 라이센싱 | Process for securing a microwave module to a support |
JP2002368561A (en) * | 2001-06-04 | 2002-12-20 | Hitachi Ltd | Waveguide mmic module |
KR101496843B1 (en) | 2007-06-14 | 2015-02-27 | 레이티언 캄파니 | Microwave integrated circuit package and method for forming such package |
KR100941694B1 (en) | 2009-08-28 | 2010-02-12 | 삼성탈레스 주식회사 | Printed circuit board for transceiver module |
KR20140073786A (en) | 2012-12-07 | 2014-06-17 | 국방과학연구소 | Microwave transmit/receive module and packaging method for the same |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD996424S1 (en) * | 2020-06-09 | 2023-08-22 | Samsung Electronics Co., Ltd. | Solid state drive memory device |
USD997939S1 (en) * | 2020-06-09 | 2023-09-05 | Samsung Electronics Co., Ltd. | Solid state drive memory device |
US11979996B2 (en) | 2020-06-09 | 2024-05-07 | Samsung Electronics Co., Ltd. | Memory device and electronic device including the same |
KR20220061424A (en) * | 2020-11-06 | 2022-05-13 | 주식회사 유텔 | Transmit/receive module based on multilayer liquid crystal polymer multilayer substrate |
USD986249S1 (en) * | 2021-08-30 | 2023-05-16 | Samsung Electronics Co., Ltd. | Solid state drive memory device |
USD986900S1 (en) * | 2021-08-30 | 2023-05-23 | Samsung Electronics Co., Ltd. | Solid state drive memory device |
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