KR20170000709A - Microwave module and method for packaging thereof - Google Patents

Microwave module and method for packaging thereof Download PDF

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Publication number
KR20170000709A
KR20170000709A KR1020150090022A KR20150090022A KR20170000709A KR 20170000709 A KR20170000709 A KR 20170000709A KR 1020150090022 A KR1020150090022 A KR 1020150090022A KR 20150090022 A KR20150090022 A KR 20150090022A KR 20170000709 A KR20170000709 A KR 20170000709A
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South Korea
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microwave
mmic
signal
multilayer board
conductive
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KR1020150090022A
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Korean (ko)
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KR101951653B1 (en
Inventor
남병창
한용덕
이희종
이종훈
김호동
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주식회사 유텔
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0657—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0652—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next and on each other, i.e. mixed assemblies

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

The present invention relates to a microwave module and a packaging method thereof. The microwave module of the present invention is packaged using a low-priced multilayer board for mounting a plurality of MCM parts. To this end, the microwave module of the present invention includes a housing sequentially stacked, a multi-layer board and a cover. The multilayer board is formed by stacking a plurality of individual boards of Teflon layer so that the circuit patterns for the transmission line, the power supply signal, the control signal and the ground for microwave signal input / output of the microwave module are formed and electrically connected to each other. Conductive through-holes are formed. According to the present invention, by using a multi-layered board made of Teflon, the manufacturing process can be simplified and the manufacturing cost can be shortened by simplifying the process compared to the low temperature co-fired ceramic lamination technique.

Description

[0001] MICROWAVE MODULE AND METHOD FOR PACKAGING THEREOF [0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a microwave module, and more particularly, to a microwave module and a packaging method thereof that can be manufactured at low cost by using a multi-layer board of a low-cost Teflon material for mounting an MCM (Multi-Chip Module) component.

The microwave module is mainly applied to a transmission / reception module or a semiconductor high-power amplifier used for civil microwave repeater, military radar, etc., and has various functions including high transmission power amplification, low noise reception signal amplification, phase / .

In the microwave module, the transmitting and receiving modules are packaged by arranging the transmitting and receiving circuits on different substrates and shielding members made of a metal or a radio wave absorber in order to suppress mutual interference caused by the electromagnetic field generated between the transmitting and receiving circuits. However, in the case of such a microwave module, there is a problem that the size and weight of the module become large.

In order to solve such a problem, the transmission / reception module has been manufactured by a lamination technique using a low temperature cofired ceramic (LTCC) material excellent in high frequency characteristics. Such a transmission / reception module improves the integration degree of the transmission / reception circuits, contributes to the miniaturization and performance improvement of the equipment, and is applied to a variety of applications such as a mobile communication field and a safety device for transportation means such as an automobile as well as a radar device for military use have.

However, a microwave module using a low temperature co-fired ceramic lamination process has a high manufacturing cost and a complicated manufacturing method. Particularly, it is difficult to manufacture a plurality of channels on a single board. In addition, if a malfunction occurs in an internal element or a circuit after the microwave module is manufactured or is being operated, there is a disadvantage that the module itself needs to be replaced, and the maintenance cost is also high.

That is, a microwave module using a low temperature cofired ceramic (LTCC) material can be packaged individually for major MMIC parts therein, or an expensive housing or cover material is used, and a low temperature co-fired ceramic board A die-shaped MMIC part is assembled and then packaged in a completely sealed form. These microwave modules are expensive to package materials and process complicated processes, making the manufacturing period and packaging method somewhat complicated.

Korean Patent Publication No. 10-2014-0073786 (published on June 17, 2014) Korean Registered Patent No. 10-1496843 (Published Feb. 27, 2015) Korean Patent Registration No. 10-0941694 (Published on February 12, 2010) Korean Patent Registration No. 10-0843174 (Published on July 02, 2008)

It is an object of the present invention to provide a microwave module using a low-priced multilayer board for mounting an MCM part and a method of packaging the microwave module.

Another object of the present invention is to provide a microwave module packaged by shortening the manufacturing period and simplifying the manufacturing process and a method of packaging the microwave module.

It is another object of the present invention to provide a microwave module and a package method thereof that can be packaged at low cost and applicable to various product development.

In order to achieve the above objects, the microwave module of the present invention is characterized by using a multi-layered board made of Teflon. Such a microwave module can simplify the process compared with the low temperature co-fired ceramic lamination technique, shortening the manufacturing period and reducing the manufacturing cost.

The microwave module according to the present invention is characterized in that a circuit pattern for inputting and outputting a microwave signal of the microwave module, a power supply signal, a control signal and a grounding circuit pattern are formed and electrically connected to each other, And a conductive through hole for mounting the at least one MMIC part is formed; A housing coupled to a lower portion of the multilayer board and having a bottom plate installed at a position of the conductive through hole to allow heat generated from the MMIC component to be discharged; The MMIC component is housed in the lower part and is coupled to a ground plane formed on an edge of the upper surface of the multilayer board to shield interference caused by signal emission generated in the MMIC part and the transmission line, And a cover covering the top of the multilayer board to protect peripheral circuits mounted on the multilayer board.

In one embodiment of this aspect, the multilayer board comprises: First to third individual boards having the same thickness and fourth individual boards having a thickness smaller than that of the first to third individual boards are laminated.

In another embodiment, the MMIC component and the circuit pattern of the multi-layer board are connected via a wire.

In another embodiment, the lid is made of an aluminum material or an aluminum alloy material.

In another embodiment, the microwave module includes: a receiver for receiving a microwave reception signal from an external electronic device that processes a microwave signal; A transmitter for outputting a microwave transmission signal to the external electronic device; Receiving the microwave receiving signal from the receiving unit to vary the magnitude and phase of the microwave receiving signal and outputting the microwave receiving signal to another external electronic device, receiving the microwave transmitting signal from the other external electronic device, And outputting a microwave transmission signal to the transmission unit; The receiver is provided with a low-noise amplifier MMIC, and the transmitter includes a high-power amplifier MMIC and a drive amplifier MMIC, and the size and phase variable part is provided as a core-chip MMIC.

According to another aspect of the present invention, a method of packaging a microwave module of the present invention is provided.

According to another aspect of the present invention, there is provided a method of packaging a microwave module comprising a multilayer board formed by electrically connecting a plurality of individual boards on which circuit patterns and conductive through holes are formed, the conductive through holes being mutually aligned, ; Bonding the multilayer board to an upper portion of the housing such that the bottom plate of the housing is located in the conductive through hole at an assembly temperature of at least 150 캜; Placing the plurality of MMIC components in the conductive through-holes at an assembly temperature of at least 120 ° C and coupling them to be mounted on the bottom plate; Bonding the pads of the MMIC parts mounted on the bottom plate to the circuit pattern of the multi-layer board so as to be electrically connected; And assembling the lid to an upper portion of the multi-layer substrate on which the MMIC component is mounted at an assembly temperature of at least 120 캜.

In one embodiment of this aspect, the step of joining the cover engages a ground pattern formed on the top edge of the multiple boards of the circuit patterns.

As described above, since the microwave module of the present invention uses a low-cost Teflon board formed by stacking a single process for mounting and packaging a plurality of MMIC parts, the process is simplified compared with the low temperature cofired ceramic lamination technique, And the manufacturing cost can be reduced.

In the microwave module of the present invention, a plurality of MMIC components are mounted on a circuit pattern having a conductive through-hole of a multilayer board coupled to an upper portion of a housing, and a cover is coupled to an upper portion of the multilayer board to package the same. It is possible to suppress the interference due to the signal radiation to the internal space, and the reliability due to the environmental protection of the MMIC component can be enhanced.

Further, the microwave module of the present invention can be variously applied to a product for processing a microwave signal that can accommodate a plurality of channels because there is no restriction factor according to the size of the multilayer board by packaging using a low-cost multilayer board.

1 is a perspective view illustrating a configuration of a microwave module according to the present invention;
FIG. 2 is an exploded perspective view of the microwave module shown in FIG. 1; FIG.
3 is a plan view showing a configuration of a multi-layer board on which the MMIC part shown in Fig. 1 is mounted; Fig.
FIG. 4 is a block diagram showing a configuration of the microwave module shown in FIG. 1; FIG. And
5 is a flowchart showing a package procedure of a microwave module according to the present invention.

The embodiments of the present invention can be modified into various forms and the scope of the present invention should not be interpreted as being limited by the embodiments described below. The present embodiments are provided to enable those skilled in the art to more fully understand the present invention. Therefore, the shapes and the like of the components in the drawings are exaggerated in order to emphasize a clearer explanation.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a perspective view illustrating a configuration of a microwave module according to the present invention, FIG. 2 is an exploded perspective view of the microwave module shown in FIG. 1, and FIG. 3 is a cross- Fig.

1 to 3, the microwave module 100 of the present invention is packaged using an inexpensive multi-layer board 120 for mounting a plurality of MMIC components 122, 124, 126 and 128.

To this end, the microwave module 100 of the present invention includes a housing 110, a multi-layer board 120, and a cover 130.

Specifically, the housing 110 is coupled to a lower portion of the multi-layer board 120, and a bottom plate 112 is installed at a position corresponding to a conductive through hole (121 in FIG. 2) of the multi-layer board 120. The housing 110 is formed in a generally flat plate shape and is made of a conductive metal material, for example, an aluminum material or an aluminum alloy material.

The bottom plate 112 is made of a metallic heat transfer member such as a 1 mm thick tungsten copper alloy (CuW) material by coupling an MMIC (monolithic microwave integrated circuit) part 126 having a large calorific value to the upper part by a low temperature soldering method . The bottom plate 112 is installed at the position of the conductive through hole 121 formed in the multilayer board 120 to heat the heat generated from the at least one MMIC component 126 mounted on the multilayer board 120 to the housing 110 And is discharged to the outside.

The MMIC part 126 is connected to the circuit pattern 123 formed with the conductive through hole 121 of the multilayer board 120 in the state where the MMIC part 126 is assembled to the bottom plate 112 of the housing 110, A bonded multi-layer board 120 is disposed on top. That is, the MMIC component 126 is mounted at a position corresponding to the conductive through hole 121, and the housing 110 is mounted on the conductive through-hole 121 of the multi-layer board 120 with the mounted MMIC component 126 Assembled.

The multilayer board 120 is formed by stacking a plurality of discrete boards of low cost Teflon material through a single process, and stacking a plurality of discrete boards. The multi-layer board 120 includes a transmission line for inputting / outputting microwave transmission / reception signals between the microwave module 100 and external electronic devices (not shown), a power supply signal for supplying power, A plurality of MMIC components 122 to 126 and a peripheral circuit 128 for power stabilization and pulse drive function are formed in the mounting area do. The ground pattern 125 formed on the upper edge of the circuit patterns 123, 125, and 127 is engaged with the lower surface of the cover 130.

The multilayer board 120 is formed with a conductive through hole 121 at a position where at least one MMIC component 126 is mounted. The conductive through-holes 121 are formed to penetrate the upper and lower surfaces of the multi-layer board 120 up and down. The conductive through-hole 121 is provided with a bottom plate 112 coupled to the housing 110 and the MMIC component 126 is disposed above the bottom plate 112.

The multilayer board 120 of this embodiment is stacked with four separate boards. The multilayer board 120 consists of three discrete boards having the same thickness (e.g., 0.2 mm) and one discrete board having a greater thickness (e.g., 0.3 mm). Each of the individual boards is stacked and coupled so that the circuit patterns 123, 125, and 127 formed on the multi-layer board 120 are electrically connected to each other. That is, each of the individual boards is formed with a circuit pattern for transmission lines, a power supply signal, a control signal, and a ground, and a circuit pattern is connected between the individual boards. Conductive through holes 121 are formed in the same area of each of the individual boards . These individual boards are stacked so that the conductive through holes 121 formed in each are aligned.

Each of the MMIC parts 122 to 126 and the peripheral circuit 128 are connected to the circuit pattern 123 of the multilayer board 120 through a wire. The wire is made of, for example, 1 mil thick gold (Au) material.

The cover 130 is made of a conductive metal material such as aluminum (Al) or aluminum alloy. The cover 130 includes MMIC parts 122 to 126 and a peripheral circuit 128 And is coupled to the ground pattern 125 formed on the top edge of the multilayer board 120. [ The cover 130 shields the MMIC components 122 to 126 and the peripheral circuits 128 from external environment by shielding the interference caused by the signal radiation generated in the MMIC parts 122 to 126 and the transmission line 127, (120).

As described above, the microwave module 100 of the present invention uses a low-cost Teflon board 120 laminated and formed in a single process for mounting and packaging a plurality of MMIC parts 122 to 126, The manufacturing time can be shortened and the manufacturing cost can be reduced as compared with the ceramic lamination technique.

The microwave module 100 according to the present invention includes a plurality of MMIC parts 122 to 126 mounted on a circuit pattern 123 having conductive through holes 121 of a multilayer board 120 coupled to an upper part of the housing 110 And the package 130 is coupled to the upper part of the multilayer board 120 to reduce the manufacturing cost compared to the conventional packaging method using the low temperature co-fired ceramic board. Further, Applicable.

And FIG. 4 is a block diagram showing the configuration of the microwave module shown in FIG.

Referring to FIG. 4, the microwave module 100 of the present invention is provided between external electronic devices (not shown) for processing microwave signals. That is, the microwave module 100 includes a receiving unit 150, a transmitting unit 160, and a magnitude and phase varying unit 170.

Specifically, the receiver 150 receives the microwave reception signal RX IN from the external electronic device to remove noise and amplify the noise, amplifies the demodulated and amplified microwave reception signal RX IN to the magnitude and phase changing unit 170, .

The transmitting unit 160 receives and amplifies the microwave transmitting signal TX IN whose magnitude and phase are varied in the magnitude and phase changing unit 170 and outputs the amplified microwave transmitting signal TX OUT to the external electronic device.

The size and phase variable unit 170 includes a switch that is automatically switched according to the transmission / reception state of a microwave signal and receives a microwave reception signal RX IN from the reception unit 150 to generate a microwave reception signal RX IN And a microwave reception signal RX OUT which is varied to a different external electronic device by varying the phase and switches are switched to receive microwave transmission signals TX IN from other external electronic devices to generate microwave transmission signals TX IN And outputs the microwave transmission signal TX IN, which is variable to the transmission unit 160, by varying the phase.

In this embodiment, the receiving unit 150 is provided with a low noise amplifier (LNA) MMIC 152, and the transmitting unit 160 includes a High Power Amplifier (HPA) MMIC 162, a driving amplifier amplifier: DRA) MMIC. The size and phase variable unit 170 is provided as a core-chip MMIC.

The low-noise amplifier MMIC 152 amplifies the noise by minimizing the noise since the power of the microwave reception signal RX IN received at the reception unit has a very low power level due to the influence of attenuation and noise.

The driving amplifier MMIC 164 receives the microwave transmitting signal TX IN transmitted from the core chip MMIC 170 to increase the power and gain of the microwave transmitting signal TX OUT output from the high power amplifier MMIC 162, And provides the amplified power to the high-power amplifier MMIC 162. The high-power amplifier MMIC 162 amplifies the power of the high-

The high power amplifier MMIC 162 amplifies the power of the microwave transmitting signal TX IN amplified from the driving amplifier MMIC 164 and outputs the microwave transmitting signal TX OUT to the external electronic device.

5 is a flowchart showing a package procedure of the microwave module according to the present invention.

Referring to FIG. 5, the microwave module 100 of the present invention prepares a material, that is, a multilayer board 120, a housing 110, and a cover 130 in step S200. The multilayer board 120 is formed by electrically connecting a plurality of individual boards having the circuit patterns 123, 125 and 127 and the conductive through holes 121 and electrically connecting the conductive through holes 121 to each other.

In step S210, the multi-layer board 120 and the housing 110 are coupled at an assembly temperature of about 150 占 폚. At this time, the multilayer board 120 is coupled to the upper portion of the housing 110 so that the bottom plate 112 is positioned in the conductive through hole 121. The plurality of MMIC parts 122 to 126 are placed in the conductive through holes 121 of the multilayer board 120 and are coupled to be mounted on the bottom plate 112 of the housing 110 in step S220. At this time, the assembly temperature of the multilayer board 120 and the housing 110 is set to about 120 캜.

The pads of the MMIC parts 122 to 126 mounted on the bottom plate 112 and the circuit patterns 123 of the multi-layer board 120 are wire-bonded to each other through the wires in step S230. Subsequently, at step S240, the lid 130 is assembled to the upper portion of the multi-layer substrate 120 on which the MMIC components 122 to 126 are mounted at an assembly temperature of about 120 캜. At this time, the lid 130 is joined to the ground pattern 125 formed on the upper edge of the multiple boards 120.

Here, the packaging process using a general low temperature co-fired ceramic board requires a process of assembling the low temperature co-fired ceramic board and the housing at about 280 ° C. and assembling the barrier wall.

Therefore, comparing the packaging process using the low-cost multiple-board according to the present invention and the packaging process using the low-temperature co-fired ceramic board according to the prior art (prior art), the present invention can lower the assembly temperature and simplify the number of processes And the manufacturing period and manufacturing cost are shown in Table 1 below.

division Manufacturing Period Manufacturing cost Conventional technology 8 weeks 80,000 won each Invention 2 weeks 10,000 won per piece

As described above, the microwave module 100 of the present invention can reduce the manufacturing cost compared with the low temperature co-fired ceramic lamination technique by forming the inexpensive multilayer board 120 in a single process, and the size of the multilayer board 120 And can be applied to various products that process microwave signals that can accommodate multiple channels. In addition, the microwave module 100 of the present invention can suppress the interference due to signal radiation to the internal space through the shielding technique using the lid 130, and the reliability by the environmental protection of the MMIC components 122 to 126 .

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it should be understood that various changes and modifications may be made therein without departing from the spirit and scope of the invention. Do.

100: Microwave module
110: Housing
120: multilayer board
121: Conducting through hole
122 ~ 126: MMIC parts
123, 125, 127: circuit pattern
130: cover
150:
160:
170: magnitude and phase variable section

Claims (7)

A microwave module comprising:
A plurality of individual boards of Teflon material are laminated and combined to form a circuit pattern for a transmission line, a power supply signal, a control signal, and a ground for microwave signal input / output of the microwave module and electrically connected to each other, and at least one MMIC A multilayer board on which conductive through holes are formed for mounting microwave integrated circuit components;
A housing coupled to a lower portion of the multilayer board and having a bottom plate installed at a position of the conductive through hole to allow heat generated from the MMIC component to be discharged;
The MMIC component is housed in the lower part and is coupled to a ground plane formed on an edge of the upper surface of the multilayer board to shield interference caused by signal emission generated in the MMIC part and the transmission line, And a cover covering an upper portion of the multilayer board to protect peripheral circuits mounted on the multilayer board.
The method according to claim 1,
Wherein the multilayer board comprises:
Wherein the first to third individual boards having the same thickness and the fourth individual boards having a thickness smaller than that of the first to third individual boards are stacked.
3. The method of claim 2,
Wherein the MMIC part and the circuit pattern of the multilayer board are connected through a wire.
4. The method according to any one of claims 1 to 3,
Wherein the cover is made of an aluminum material or an aluminum alloy material.
5. The method of claim 4,
The microwave module
A receiver for receiving a microwave reception signal from an external electronic device for processing a microwave signal;
A transmitter for outputting a microwave transmission signal to the external electronic device;
Receiving the microwave receiving signal from the receiving unit to vary the magnitude and phase of the microwave receiving signal and outputting the microwave receiving signal to another external electronic device, receiving the microwave transmitting signal from the other external electronic device, And outputting a microwave transmission signal to the transmission unit;
Wherein the receiving unit is a low noise amplifier MMIC, the transmitting unit is a high power amplifier MMIC and the driving amplifier MMIC, and the size and phase variable unit is a core chip MMIC.
A method of packaging a microwave module comprising:
A multilayer board formed by electrically connecting a plurality of individual boards formed with a circuit pattern and a conductive through hole and stacked with the conductive through holes mutually aligned, preparing a housing and a cover;
Bonding the multilayer board to an upper portion of the housing such that the bottom plate of the housing is located in the conductive through hole at an assembly temperature of at least 150 캜;
Placing the plurality of MMIC components in the conductive through-holes at an assembly temperature of at least 120 ° C and coupling them to be mounted on the bottom plate;
Bonding the pads of the MMIC parts mounted on the bottom plate to the circuit pattern of the multi-layer board so as to be electrically connected;
And joining the lid to an upper portion of the multi-layer substrate on which the MMIC component is mounted at an assembly temperature of at least 120 ° C.
The method according to claim 6,
Wherein the step of joining the lid is coupled to a ground pattern formed on an upper edge of the multiple boards among the circuit patterns.
KR1020150090022A 2015-06-24 2015-06-24 Microwave module and method for packaging thereof KR101951653B1 (en)

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KR20220061424A (en) * 2020-11-06 2022-05-13 주식회사 유텔 Transmit/receive module based on multilayer liquid crystal polymer multilayer substrate
USD986249S1 (en) * 2021-08-30 2023-05-16 Samsung Electronics Co., Ltd. Solid state drive memory device
USD986900S1 (en) * 2021-08-30 2023-05-23 Samsung Electronics Co., Ltd. Solid state drive memory device

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