KR20160146303A - Computing module connected to electronic apparatus and operating method thereof - Google Patents

Abstract

Disclosed are a portable computing module connected to be attachable and detachable from an electronic apparatus and an operating method thereof. According to various embodiments of the present invention, the computing module includes a case, a processor located within the case, a power supply unit for supplying first power received from the electronic apparatus to the processor, and a heat transfer unit for transferring heat generated by the processor to the electronic apparatus.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a computing module connected to an electronic device,

The present invention relates to a computing module connected to an electronic device and a method of operating the same. More particularly, the present invention relates to a portable computing module detachably connected to the electronic device and an operation method thereof.

In recent years, a high-performance CPU (Central Processing Unit) and a GPU (Graphic Processing Unit) have been used for an operation that requires quick and large calculation in electronic devices. However, since more power is required in proportion to the performance of the CPU and the GPU (e.g., processing speed), and more heat is generated due to the operation of the CPU and the GPU, the use of the high-performance CPU and GPU The power consumed and the heat generated in the electronic device are increased. Accordingly, heat generated by using a cooling fan and a RHE (Remote Heat Exchanger) can be diffused or emitted to the entire electronic device for stable operation of the electronic device.

In addition, in recent years, some functions of an electronic device can be designed in a detachable module form so that they can be connected or disconnected. For example, there are a PCMCIA (Personal Computer Memory Card International Association) or a PC card module which has been variously used in a system memory module, a HDD (Hard Disk Drive), a CD-ROM, a DVD device and a conventional laptop PC . In addition, a small computing device that implements the basic functions of a personal computer (PC) in a stick or a small case has been developed and connected to a TV or monitor or installed in a special case to perform a function similar to a PC Is being developed.

In another computing device that is detachable from another device, a power supply unit supplies a power required by the CPU, the memory, the communication module, and components included in the computing module as components, a power supply unit that processes heat generated by the operation of the computing module And the like are designed to be included in the computing module.

Accordingly, the CPU / GPU and other processors mounted on the computing module can operate with less power (e.g., an ARM or an ATOM processor) without requiring a large power supply, and thus generate less heat due to the operation voltage or current operation required by the processor . Therefore, it is possible to cool the heat generated by the processor operating at low power through a small passive cooling component or heat treatment structure.

However, when a high-performance processor is used in the computing module, a power supply unit for supplying sufficient power required for operation of the high-performance processor and a cooling unit for cooling high heat generated by the high-performance processor are required . In general, a cooling unit such as a power supply logic unit for a high-performance processor, a cooling fan, and a heat spread pipe is spatially bulky, which is an obstacle to miniaturization of the computing module. In other words, when the computing module includes the power supply unit and the cooling unit for the high-performance processor, it is difficult to make the computing module compact.

In addition, the size of the computing module may be different according to the power required for the operation of the processor and the heat generated by the operation of the processor, so that the computing modules that are different from each other are physically or electrically compatible Do not.

According to various embodiments of the present invention, a portable computing module detachably connected to an electronic device includes a case, a processor located within the case, a power supply for supplying first power received from the electronic device to the processor, And a heat transfer unit for transferring heat generated by the heat transfer unit to the electronic device.

According to various embodiments of the present invention, a method of operation of a portable computing module removably connected to an electronic device comprises: receiving a first power received from the electronic device through at least one first region of a case of the computing module; Receiving a first power that is adjusted based on the signal and transmitting the first power to the electronic device based on the operating state of the processor, Lt; / RTI >

According to various embodiments of the present invention, an electronic device in which a portable computing module can be detachably connected includes a connection unit connected to the computing module, a first power supplying unit for supplying the first power to the computing module for operating the processor in the computing module A power supply unit, and a cooling unit that receives heat generated by the processor and receives the heat from the computing module.

According to various embodiments of the present invention, an operating method of an electronic device in which a portable computing module is detachably connectable includes the steps of: converting a voltage of a power source supplied to operate a processor located in the computing module; Supplying the first power to the computing module using the converted voltage through at least one first region of the case, controlling the first power based on an operating state of the processor received from the computing module, And adjusting the magnitude of the first power based on the signal.

According to various embodiments of the present invention, the computing module includes a power supply for supplying power to the processor and a cooling unit for cooling the heat generated by the processor, in an electronic device detachably connected to the computing module . In addition, a case constituting the computing module with a separate heat transfer structure and a power transfer structure separate from the connection interface for electrical or data communication with the electronic device can be used. Through this, the size of the computing module can be miniaturized, the power required by the processor can be supplied while the heat transfer efficiency and the integrity of the power supply are improved, and the heat generated by the processor can be cooled.

In addition, since the size of the computing module can be made the same even if the power required by the processor and the generated heat are different, the processors can physically or electrically interchange between physically or electrically different processors.

1A to 1D are block diagrams showing the structure of an electronic device and a computing module according to a comparative example.
2A to 2C are block diagrams illustrating the structure of a computing module and an electronic device according to various embodiments of the present invention.
FIGS. 3A through 3C are views for explaining connection patterns between a computing module and an electronic device according to various embodiments of the present invention.
4 shows a flow of power transfer to a processor in an electronic device according to one comparative example.
Figure 5 illustrates a flow of power transfer from an electronic device to a processor in a computing module in accordance with various embodiments of the present invention.
6 is a flow diagram of a method for controlling power supplied from an electronic device by a computing module according to various embodiments of the present invention.
7 is a flow diagram of a method for transferring power to a computing module by an electronic device in accordance with various embodiments of the present invention.
Figure 8 illustrates a flow of power transfer from a power supply to a processor in a computing module in accordance with various embodiments of the present invention.
9A is a view for explaining a cooling method by an electronic device according to a comparative example.
FIG. 9B is a view for explaining a cooling method by a computing module and an electronic device according to various embodiments of the present invention.
10 is a cross-sectional view of a computing module and an electronic device in accordance with various embodiments of the present invention.
11 is a view for explaining a method of fixing a cooling part in a computing module according to various embodiments of the present invention.
Figure 12 illustrates a power transfer structure and a heat transfer structure between a computing module and an electronic device in accordance with various embodiments of the present invention.
Figure 13 illustrates a case of a computing module according to various embodiments of the present invention.
14A to 14D show the structure of a computing module and an electronic device having an open / close structure according to various embodiments of the present invention.

Hereinafter, various embodiments of the present document will be described with reference to the accompanying drawings. It should be understood, however, that this invention is not intended to be limited to the particular embodiments described herein but includes various modifications, equivalents, and / or alternatives of the embodiments of this document . In connection with the description of the drawings, like reference numerals may be used for similar components.

In this document, the expressions "having," " having, "" comprising," or &Quot;, and does not exclude the presence of additional features.

In this document, the expressions "A or B," "at least one of A or / and B," or "one or more of A and / or B," etc. may include all possible combinations of the listed items . For example, "A or B," "at least one of A and B," or "at least one of A or B" includes (1) at least one A, (2) Or (3) at least one A and at least one B all together.

As used herein, the terms "first," "second," "first," or "second," and the like may denote various components, regardless of their order and / or importance, But is used to distinguish it from other components and does not limit the components. For example, the first user equipment and the second user equipment may represent different user equipment, regardless of order or importance. For example, without departing from the scope of the rights described in this document, the first component can be named as the second component, and similarly the second component can also be named as the first component.

(Or functionally or communicatively) coupled with / to "another component (eg, a second component), or a component (eg, a second component) Quot; connected to ", it is to be understood that any such element may be directly connected to the other element or may be connected through another element (e.g., a third element). On the other hand, when it is mentioned that a component (e.g., a first component) is "directly connected" or "directly connected" to another component (e.g., a second component) It can be understood that there is no other component (e.g., a third component) between other components.

As used herein, the phrase " configured to " (or set) to be "configured according to circumstances may include, for example, having the capacity to, To be designed to, "" adapted to, "" made to, "or" capable of ". The term " configured to (or set up) "may not necessarily mean" specifically designed to "in hardware. Instead, in some situations, the expression "configured to" may mean that the device can "do " with other devices or components. For example, a processor configured (or configured) to perform the phrases "A, B, and C" may be implemented by executing one or more software programs stored in a memory device or a dedicated processor (e.g., an embedded processor) , And a generic-purpose processor (e.g., a CPU or an application processor) capable of performing the corresponding operations.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the scope of the other embodiments. The singular expressions may include plural expressions unless the context clearly dictates otherwise. Terms used herein, including technical or scientific terms, may have the same meaning as commonly understood by one of ordinary skill in the art. The general predefined terms used in this document may be interpreted in the same or similar sense as the contextual meanings of the related art and, unless expressly defined in this document, include ideally or excessively formal meanings . In some cases, even the terms defined in this document can not be construed as excluding the embodiments of this document.

An electronic device according to various embodiments of the present document may be, for example, a smartphone, a tablet personal computer, a mobile phone, a video phone, an e-book reader, A desktop personal computer, a laptop personal computer, a netbook computer, a workstation, a server, a personal digital assistant (PDA), a portable multimedia player (PMP) A medical device, a camera, or a wearable device. According to various embodiments, the wearable device may be of the accessory type (e.g., a watch, a ring, a bracelet, a bracelet, a necklace, a pair of glasses, a contact lens or a head-mounted-device (HMD) (E. G., Electronic apparel), a body attachment type (e. G., A skin pad or tattoo), or a bioimplantable type (e.g., implantable circuit).

In some embodiments, the electronic device may be a home appliance. Home appliances include, for example, televisions, digital video disc (DVD) players, audio, refrigerators, air conditioners, vacuum cleaners, ovens, microwaves, washing machines, air cleaners, set- Such as a home automation control panel, a security control panel, a TV box such as Samsung HomeSync ^TM , Apple TV ^TM or Google TV ^TM , a game console such as Xbox ^TM and PlayStation ^TM , , An electronic key, a camcorder, or an electronic frame.

In an alternative embodiment, the electronic device may be any of a variety of medical devices (e.g., various portable medical measurement devices such as a blood glucose meter, a heart rate meter, a blood pressure meter, or a body temperature meter), magnetic resonance angiography (MRA) Navigation systems, global navigation satellite systems (GNSS), event data recorders (EDRs), flight data recorders (FDRs), infotainment (infotainment) systems, ) Automotive electronic equipment (eg marine navigation systems, gyro compass, etc.), avionics, security devices, head units for vehicles, industrial or home robots, automatic teller's machines (ATMs) Point of sale, or internet of things (eg, light bulbs, various sensors, electrical or gas meters, sprinkler devices, fire alarms, thermostats, street lights, Of the emitter (toaster), exercise equipment, hot water tank, a heater, boiler, etc.) may include at least one.

According to some embodiments, the electronic device is a piece of furniture or a part of a building / structure, an electronic board, an electronic signature receiving device, a projector, Water, electricity, gas, or radio wave measuring instruments, etc.). In various embodiments, the electronic device may be a combination of one or more of the various devices described above. An electronic device according to some embodiments may be a flexible electronic device. Further, the electronic device according to the embodiment of the present document is not limited to the above-described devices, and may include a new electronic device according to technological advancement.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An electronic apparatus according to various embodiments will now be described with reference to the accompanying drawings. In this document, the term user may refer to a person using an electronic device or a device using an electronic device (e.g., an artificial intelligence electronic device).

1A to 1D are block diagrams showing the structure of an electronic device and a computing module according to a comparative example.

1A is a block diagram illustrating the structure of an electronic device (e.g., laptop PC) 110 according to one comparative example. As shown in FIG. 1A, the individual components (or functional blocks) included in the electronic device 110 are generally composed of a single unit or a combination of plural units to constitute one electronic apparatus. The individual components (or functional blocks) included in the electronic device 110 correspond to a well-known configuration, and a detailed description thereof will be omitted.

In the electronic device 110, a processor employing a high-performance CPU / GPU is employed in order to perform a task that requires a quick and large calculation. Generally, power and heat generated for operation increase in proportion to the performance of CPU and GPU. Therefore, when a high-performance CPU / GPU is used, a high power is required for operation of the high-performance CPU / GPU, and a high temperature is generated by the operation of the high-performance CPU / GPU. A power supply structure such as a separate power supply unit and a heat treatment structure such as a cooling unit (eg, FAN, Remote Heat Exchanger (RHE), heat pipe, heat spreader, etc.) for spreading generated heat to the entire system or discharging the heat to the outside Must be included in the electronic device 110.

As such, the electronic device 110 typically includes all of the discrete components required for operation and a combination of the discrete components. However, if all of the individual components for operation are included as shown in FIG. 1A, the size of the electronic device 110 becomes large, and the portability may be deteriorated.

FIG. 1B shows an electronic device 130 according to one comparative example and a computing module 120 connectable to the electronic device 130. FIG. In recent years, the use of a computing module 120 including a configuration for performing basic functions such as a CPU / GPU, a processor, a memory, and a storage unit and an electronic device 130 connectable to the computing module 120 is increasing. The electronic device 130 is a separate system designed to be connectable with the computing module, and is connected to the computing module 120 to perform a function as a computing system. The computing module 120 and the electronic device 130 can generally provide signals and power through an electrical / mechanical connection structure, and the computing module 120 and the electronic device 130 can be connected or disconnected Or < / RTI >

For example, the computing module 120 and the electronic device 130 are electrically connected through a main connection interface (I / F) and can perform data and / or signal communication.

  1B, the electronic device 130 includes a processor for performing data processing and the like for operation of the electronic device 130, a power supply for supplying power to the processor, a memory used for the operation of the processor 130, And may not include a storage unit or the like. Hereinafter, the processor may represent all of the processors available for operation of the electronic device 130, such as a CPU, a GPU, and other processors.

Accordingly, if the electronic device 130 is not connected to the computing module 120, the electronic device 130 may not operate only with the electronic device 130. The electronic device 130 is capable of performing data processing and the like through connection with the computing module 120 without any data processing capability or the like as described above. For example, the electronic device 130 includes a dumb system, a docking system Docking system, Carrier, Container and so on.

1B, the computing module 120 includes a processor, a cooling unit, a first power supply unit for supplying power to the processor, and the like. If the processor is capable of operating with less power without a large power supply, the space occupied by the first power supply may not be large. Further, when the heat generated by the operation of the processor is small, the heat generated by the processor can be cooled through a small passive cooling unit or a heat treatment structure. Therefore, a bulky cooling fan, An active cooling unit such as RHE may not be needed. In this way, when a large power is not required for the operation of the processor included in the computing module 120, and the heat generated by the operation of the processor is processed through a thermal processing structure such as a passive cooling unit, (120) is made small and can be easily carried.

In recent years, however, processing of electronic devices such as a computing system has been complicated and diverse, and as a demand for rapid processing has been demanded, a high-performance processor is employed in the computing module 120. Since the high performance processor consumes a large amount of power for operation, the volume of the power supply structure (for example, the power supply and the power supply rail) for supplying power to the processor is large and the heat generated by the high performance processor A bulky heat treatment structure, for example, an active cooling unit (e.g., FAN and RHE), is required to cool the heat exchanger. As the performance of the processor included in the computing module 120 increases, the power supply structure for supplying power to the processor and the volume of the cooling part, which is a heat treatment structure for processing generated heat, It is difficult to manufacture the computing module 120 in a compact size.

1C, a first electronic device 150 including a first computing module 140 including a first processor 141 of low performance and a first connection unit 151 connectable to the first computing module 140, A second computing module 160 including a high performance second processor 161 and a second electronic device 170 including a second connection 171 connectable to the second computing module 160. [ Will be described.

Hereinafter, a low-performance processor causes the power consumed for operation to be less than a preset power, and to assume that the generated heat is a processor that can be processed through a passive cooling section (e.g., a heat sink or the like). In contrast, a high-performance processor allows the power consumed for operation to be greater than a predetermined power and the generated heat to be a processor capable of being processed through active cooling (eg, RHE, fan, heat pipe, etc.). For example, a low performance processor may be a processor typically designed with a Thermal Design Power (TDP) of less than 10 W, and a high performance processor may be a processor designed with a TDP of at least 10 W. Accordingly, a low-performance processor consumes less than 10 W of power for operation, and a high-performance processor consumes 10 W or more for operation. Also, because the low-power processor consumes less power, the heat generated by the operation may also be smaller than the high-performance processor. Therefore, the low-performance processor may not require a separate cooling unit and power supply for operation.

In addition, the first electronic device 150 is an electronic device that performs a simple function without performing a complicated function, and thus is connected to the first computing module 140 including the first processor 141 with low performance It is assumed that the first connection unit 152 is included, and that it does not include many components.

In contrast, the second electronic device 170 is an electronic device performing a complicated function, and thus the second connection unit 174, which can be connected to the second computing module 160 including the second processor 161 of high performance, And it is assumed that it includes many components.

Since the first computing module 140 includes the low-performance first processor 141, a separate power supply unit and a cooling unit may not be required. Accordingly, the first computing module 140 can be made compact.

The second computing module 160 includes the second processor 161 of high performance and therefore a separate power supply unit 162 and the cooling unit 163 are provided for the operation of the first processor 161 need. Accordingly, the second computing module 160 can not be manufactured in a small size and is made larger than the first computing module 140.

Since the sizes of the first computing module 140 and the second computing module 160 are different from each other, the sizes of the first connection unit 151 and the second connection unit 171 are also different. Accordingly, the second connection unit 171, which is connectable to the second computing module 160, has a physically large electrical / physical connection structure than the first connection unit 151 that can be connected to the first computing module 140 There is a need.

Therefore, the first electronic device 150 can only be connected to the first computing module 140 through the first connection unit 151, and can not be connected to the second computing module 160. Similarly, the second electronic device 170 can only be connected to the second computing module 160 through the second connection unit 171, and can not be connected to the first computing module 140. As described above, since the size of the first computing module 140 and the size of the second computing module 160 are different from each other, incompatible problems may occur.

1D is a block diagram showing the structure of an electronic device 160 (e.g., a laptop PC or the like) including a processor 161 of high performance. FIG. 1D is a simplified block diagram of the structure of the electronic device 160 to illustrate the power supply for the operation of the processor 161 and the heat treatment generated by the processor 161. FIG.

The electronic device 160 supplies the power supplied from the battery 167 to the processor 161 through a separate power supply unit 162 for supplying power to the processor 161. For example, the power supply unit 162 may DC-DC convert the power supplied from the battery 167 and supply the converted voltage to the processor 161.

The processor 161 operates using the power supplied through the power supply unit 162 and the memory 166 may be a memory used for the operation of the processor 162. The heat generated by the operation of the processor 161 may be transmitted to the first cooling unit 163 or the second cooling unit 164 through the heat pipe 165. The first cooling unit 163 and the second cooling unit 164 may radiate the transferred heat to the outside of the electronic device 160. In addition, though not shown, it is also possible to diffuse the heat generated by the processor as a whole inside the electronic device 160 through a heat spreader or the like.

As described above, in order to stably operate the high-performance processor 161, a power supply and a heat treatment structure are indispensably required. However, since the power supply and heat treatment structure is difficult to miniaturize, it can be a great limitation in implementing a small-sized computing module and the like. Accordingly, generally, a low-performance processor is used in which a consuming electric power is not large and a heat generated is not large and a separate heat treatment structure for cooling the heat is not required for manufacturing a compact computing module. On the contrary, a high-performance processor requiring a separate power supply and heat treatment structure for operation is employed in an electronic device having a relatively small physical space constraint in designing, and is employed in a small-volume electronic device in which portability is emphasized It is common not to.

2A to 2C are block diagrams illustrating the structure of a computing module and an electronic device according to various embodiments of the present invention.

Figure 2a illustrates an electronic device 220 according to various embodiments of the present invention and a computing module 210 connectable to the electronic device 220. [ As described above, a computing module including a high-performance processor is difficult to be made compact due to a power supply for supplying power to the processor and a cooling unit for processing heat generated by the processor.

According to various embodiments of the present invention, a power supply for supplying power to a processor included in the computing module 210 and a cooling unit for processing heat generated by the processor are separately disposed in the electronic device 220 . Accordingly, the computing module 210 may not include a separate power supply unit and a cooling unit in the computing module, even if the computing module 210 includes a high-performance processor. Accordingly, the computing module 210 including the high-performance processor can receive power stably for normal operation, and can generate heat in the same or similar size as a computing module using a low-performance processor . As described above, since the power supply structure and the heat treatment structure are separately disposed in the electronic device 220, the computing module 210 including the high-performance processor can be made compact, 210 can be easily carried.

The electronic device 220 may provide power to the computing module 210 using a first power supply for powering the processor within the computing module 210. For example, the electronic device 220 can DC-DC convert the voltage of the power source supplied from the battery to the computing module 210 through the first power supply unit, and transmit the converted voltage to the computing module 210. The computing module 210 may receive power from the electronic device 220 via a power supply and supply the received power to the processor.

In addition, the computing module 210 may transmit the heat generated by the operation of the processor to the electronic device 220. For example, the computing module 210 may transfer the heat to the electronic device 220 through a heat transfer portion for transferring heat generated by the processor. For example, the computing module 210 may communicate heat generated by the processor to the electronic device 220 by contacting the electronic device 220 directly. The electronic device 220 may process the heat by discharging the heat received from the computing module to the outside of the electronic device 220 through the cooling part or by diffusing the heat into the electronic device 220.

In this way, the computing module 210 does not include a power supply unit and a cooling unit for the operation of the processor, so that the computing module 210 can be made compact even if it includes a high-performance processor. In addition, the power supply to the processor and the structure for transmitting heat generated by the processor may be formed separately from the main connection interface, which is connected to the computing module 210 and the electronic device 220 have. For example, the power supply and heat transfer structure may be located in the case of the computing module 210. The case of the computing module 210 is in direct contact with the electronic device 220 so that the power supply and heat transfer structure can be located in the case of the computing module 210. Accordingly, the entire size of the computing module 210 can be miniaturized, and a large power supply and cooling performance can be achieved while improving the heat transfer efficiency and the integrity of the power supply. Connection methods and connection structures of the computing module 210 and the electronic device 220 will be described later.

2B shows a first computing device 230 including a first processor 231 with a low performance and a first computing device 230 including a first connecting device 241 connectable with the first computing module 230 , A second computing module 250 including a second processor 251 of high performance and a second connection unit 263 connectable to the second computing module 230 Describe the relationship.

2A, a power supply unit 261 for supplying power to the high-performance processor and a cooling unit 262 for cooling the heat generated by the high-performance processor are connected to the second electronic device 260, And the second computing module 250 may not include the power supply unit 261 and the cooling unit 262. Accordingly, the second computing module 250 may be manufactured in the same or similar size as the first computing module 230.

Accordingly, when the first and second computing modules 230 and 250 are electrically and physically compatible with each other, the first electronic device 240 is connected to the first connection unit 241 through the first connection unit 241 And may be connected to the second computing module 250 as well as the first computing module 230. However, since the first electronic device 240 does not include the power supply unit 261 and the cooling unit 262, the second processor 251 may not operate normally, have. Here, the limited performance may be the same or similar to the performance of the first processor 231, which does not require a separate power supply and cooling structure.

Likewise, the second electronic device 260 may be coupled to the first computing module 230 as well as the second computing module 250 via the second connection 263. Since the sizes of the first computing module 230 and the second computing module 250 are the same or similar to each other, the second connection unit 263 may be connected to the first computing module 230.

The size of the second computing module 250 including the high performance second processor 251 may be equal to the size of the first computing module 230 including the low performance first processor 231, The first computing module 230 and the second computing module 250 may be used interchangeably.

The connection unit, such as the first connection unit 241 and the second connection unit 263, may be constructed to be electrically or physically connectable with the computing module. For example, when the electronic device and the computing module are connected by a wired connection such as a USB cable, the connection portion may be formed as a USB port. In addition, when the computing module is inserted into and connected to the electronic device in a sliding manner, the connection unit may be configured to accommodate the computing module. In addition, the connection portion may be formed in an open / close structure including a door. In this case, a first door may be opened to connect the computing module, the computing module may be inserted into the electronic device, and then the door may be closed again. As described above, the connection unit can be manufactured in various structures electrically or physically connectable with the computing module, which is obvious to a person skilled in the art.

As shown in FIG. 2C, the physical and electrical structures of a connection between a computing module including a low-performance processor or a high-performance processor and an electronic device for connection with the computing module can be standardized according to a preset reference. For example, a plurality of computing modules may be standardized according to preset criteria so that they have a predetermined size and electrical connection structure regardless of the performance of the processor. Also, the connection portion of the electronic device may be manufactured to have a physical and electrical structure so as to be connected to a computing module standardized and manufactured according to the preset standard. As described above, each of the plurality of computing modules standardized and manufactured in accordance with the preset reference may be connected to each of the electronic devices including the connection unit standardized according to the preset reference, regardless of the performance of the processor. In addition, the computing modules and the electronic device may be manufactured to have a heat transfer structure according to a preset reference for heat transfer. Thus, heat transfer between the computing modules and the electronic device is also possible.

For example, the first computing module 230 including the low-performance first processor 231 and the second computing module 250 including the high-performance second processor 251 may have the same size And the same electrical connection structure. Also, the first computing module 230 and the second computing module 250 may be fabricated to have the same heat transfer structure. In this case, a first connection portion 242 for connection with a computing module included in each of the first electronic device 240, the second electronic device 260, the third electronic device 270, and the Nth electronic device 280 The second connecting unit 263, the third connecting unit 273 and the Nth connecting unit 283 are also connected to the first computing module 230 and the second computing module 250 in the same size and electrical structure . Accordingly, the first computing module 230 and the second computing module 250 are connectable to each other and are compatible with each other. Each of the first electronic device 240, the second electronic device 260, the third electronic device 270 and the Nth electronic device 280 may be connected to the first computing module 230, The heat generated by the module 250 can be received through the cooling units 262, 272, and 282.

The performance of the second processor 251 may be limited, for example, if it does not include a power supply for the high performance second processor 251 and a cooling unit, such as the first electronic device 240.

In contrast, the second electronic device 260, the third electronic device 270, and the Nth electronic device 280 all have a power supply 261, 271, 281 for powering the computing module, The performance of the second processor 251 is not limited and can be normally operated because it includes the cooling units 262, 272, and 282 for processing the transmitted heat.

As described above, since the computing module can be manufactured to have the same size and electrical structure according to a preset reference regardless of the performance of the processor included in the computing module, various electronic devices can be provided with predetermined criteria for connection with the computing module The connection with the various computing modules conforming to the preset criteria may be possible. Likewise, a computing module manufactured in a predetermined size may be connected to various electronic devices including the connection unit.

FIGS. 3A through 3C are views for explaining connection patterns between a computing module and an electronic device according to various embodiments of the present invention.

FIG. 3A illustrates a computing module including a processor and an electronic device detachable from the computing module. 3A, a first computing module including a first processor with a high performance and a second computing module including a second processor with a low performance are installed in an electronic device (e.g., a notebook, a tablet PC, a PC, a TV, a printer, Vehicle, a cleaner, etc.). The electronic device may perform an operation such as data processing by itself, and may perform the data processing or the like using the computing module as the computing module is mounted. Accordingly, as the first computing module and the second computing module are mounted, the electronic device can further process complicated calculations and the like more by using the processor included in the computing module.

On the other hand, the electronic device may perform data processing or the like in accordance with the mounting of one of the first computing module and the second computing module, and may not perform data processing or the like by itself. In this case, the electronic device may operate normally according to the performance of the processor included in the mounted computing module, or at least some functions may be limited.

For example, when a first computing module including a high-performance first processor is mounted, the electronic device can operate normally without limitation of all functions of the electronic device. On the other hand, when a second computing module including a second processor with low performance is mounted, the electronic device restricts functions that can not be performed by the second processor, and only functions that can be performed by the second processor Can be operated. As such, the functionality of the electronic device may be limited depending on the capabilities of the processor included in the mounted computing module.

3A, the second computing module and the third computing module including the second processor and the third processor of the same performance are installed in an electronic device (e.g., a notebook computer, a tablet PC, a PC, a TV, a printer, As shown in Fig. As described above, when the electronic device can not perform its own function, the electronic device can perform the function using the computing module as the computing module including the processor is mounted. The electronic device may be manufactured in various forms, such as a processor, except for a part common to electronic devices, depending on the purpose of use.

For example, it can be made to conform to the characteristics of each electronic device, except for components such as a processor, which are commonly used in electronic devices such as TVs, printers, vacuum cleaners, vehicles, and the like. In addition, the electronic devices can be manufactured to have a physical / electrical structure in which the computing module can be detached. Accordingly, when the computing module is mounted on the electronic device, the electronic device is operable and can operate various electronic devices through one computing module.

Also, if the manufacturer of the second processor and the processor of the third processor are different from each other, various electronic devices can be operated using the computing module when they include a physical / electrical connection structure conforming to a predetermined standard. In this way, the computing module can be used so as to correspond to the usage of various electronic devices by standardizing the size, the electrical connection structure, and the heat transfer structure of the computing module including the various processors according to preset standards, The operation of various electronic devices can be enabled.

FIG. 3B illustrates the operation of the electronic device through the first computing module 310 and the second computing module 320. FIG. The first electronic device 311 may operate using the first computing module 310 as the first computing module 310 is installed. The first electronic device 311 does not include a display itself and can output a screen according to the operation of the electronic device 311 through the external display device 312. [

Also, the second electronic device 321 can operate using the second computing module 320 as the second computing module 320 is installed. The second electronic device 321 can output a screen according to the operation of the electronic device 321 through its own display rather than an external display.

As such, as the computing module is mounted, the electronic device can perform operations, and the electronic device can use other electronic devices connected thereto.

FIG. 3C illustrates various connection methods between the computing module and the electronic device. The electronic device 332 may be wired to the first computing module 330. In this case, the electronic device 332 may communicate with the first computing module 330 via a connection cable, and may supply power.

Also, although not shown, the first computing module 330 may be removably mounted in the form of being inserted into the electronic device 332. For example, the electronic device 332 may have a receiving portion capable of receiving the first computing module 330, and the first computing module 330 may be connected to the electronic device 332 through the receiving portion have. In FIG. 3C, the first computing module 330 and the electronic device 332 are connected through a cable to express that the first computing module 330 and the electronic device 332 can be connected by wire. However, the present invention is not limited thereto. The first computing module 330 and the electronic device 332 may be connected through a connection line or a connection port such as a cable or may be connected through a contact. And is apparent to a person skilled in the art.

In addition, the electronic device 332 may be wirelessly coupled to the second computing module 331. In this case, the electronic device 332 can wirelessly communicate with the second computing module 331 and receive power wirelessly. In addition, the power supply may be received through a separate device.

4 shows a flow of power transfer to a processor in an electronic device according to one comparative example.

4, a method of supplying power for the operation of the processor 410 using the power supplied from the power supply unit / controller 440 included in the electronic device 400 according to one comparative example will be described. Hereinafter, it is assumed that the processor 410 is a high-performance processor requiring a separate power transfer and thermal processing structure.

The processor 410 may include at least one of a CPU, a GPU, and other additional processors. Wherein the electronic device (400) is designed such that the processor (410) includes both a CPU, a GPU, and an additional processor, a power rail for transferring power to each of the CPU, the GPU, (400) can be designed. Accordingly, power for operation of the CPU is transmitted through the CPU power rail 421, and power for operation of the GPU can be transmitted through the GPU power rail 422. Also, although not shown, a separate power rail may be used to deliver power for operation of the additional processor. In this manner, the power supplied to the processor 410 may be supplied to each of the processor units included in the processor 410 through a separate power rail.

The power supply unit / controller 440 may supply a battery included in the electronic device 400 or an external power source to each component in the electronic device 400. If the operation state of the electronic device does not require the operation of the processor 410 such as a low power mode or a sleep mode, the power supply unit / controller 440 may turn off the power supplied to the processor 410 have. Similarly, the power supply / control unit 440 may control the power supplied to the components according to whether the components included in the electronic device 400 are operating.

In general, since processor 410 consumes more power for operation than other components 460, the electronic device 400 may include a separate first power supply (not shown) for supplying power to the processor 410, (420). The first power supply unit 420 may generate a voltage for supplying power to the processor 410 using the power supplied through the power supply unit / controller 440. Generally, in order for a high-performance processor to operate normally, it is necessary to stably supply power with a low voltage and a high current.

The voltage for the operation of the processor 410 or the voltage required by the processor 410 may be relatively small as compared with the voltage of the power supplied from the power supply unit / Accordingly, the first power supply 420 supplies a voltage of the power supplied from the power supply / controller 440 to a voltage required for the operation of the processor 410 or a voltage required by the processor 410, (1).

In addition, the voltage for the operation of the processor 410 or the voltage required by the processor 410 may vary depending on the CPU and the GPU, and may be variable depending on the operation state of the processor 410. The processor 410 may transmit a signal indicating the required voltage to the first power supply unit 420 according to the operation state. The first power supply 420 may perform DC-DC conversion with the voltage required by the processor 410 based on the signal.

The power supply unit 430 may supply power to the processor 410 using the CPU power rail 421 or the GPU power rail 422 with the converted voltage through the first power supply unit 420. [ In addition, the power supply 430 may be connected to the processor 410 using a separate power rail for powering the additional processor, if the processor 410 includes an additional processor in addition to the CPU and GPU. Additional processors can supply power.

The second power supply unit 450 may supply power to the other components 460 except for the processor 410 using the power supplied from the power supply unit / controller 440. Since the power consumed by the other components 460 is smaller than that of the processor 410, a separate power supply unit such as the processor 410 may not be required.

The electronic device 400 including the high-performance processor 410 needs to supply power to the processor 410 stably so that the processor 410 can operate normally. For this, as described above, a CPU power rail 421 for DC-DC conversion of the voltage of the system power supplied at a voltage required by the processor 410 and for transmitting power to the processor 410, (422) should be designed to meet the required power integrity. In general, however, the structure for transferring power to the processor 410 as described above has a large proportion of the space occupied by the electronic device 400, which may be an obstacle to miniaturization of the electronic device 400.

Figure 5 illustrates a flow of power transfer from an electronic device to a processor in a computing module in accordance with various embodiments of the present invention.

5, a method of supplying first power to the processor 510 in the computing module 500 using power supplied from the electronic device 520 according to various embodiments of the present invention will be described. Hereinafter, it is assumed that the processor 510 is a high-performance processor requiring a separate power transfer and thermal processing structure. Also, in the following, the power received from the electronic device 520 is represented by the first power to distinguish it from the power supplied from the power supply in the computing module 500.

The processor 510 may include at least one of a CPU, a GPU, and other additional processors. When the electronic device 500 is designed such that the processor 510 includes both a CPU, a GPU, and an additional processor, the power rail for transferring the first power to each of the CPU, the GPU, and the additional processor is designed to be separately configured . The first power for operation of the CPU is delivered via the first CPU power rail 522 and the second CPU power rail 512 and the first GPU power rail 523 and the second GPU power rail 513, Lt; RTI ID = 0.0 > GPU < / RTI > Also, although not shown, a separate power rail may be used to deliver the first power for operation of the additional processor. As such, the first power supplied to the processor 510 may be supplied to each of the processor units included in the processor 510 via a separate power rail.

The power supply unit / control unit 524 included in the electronic device 520 supplies power to the first power supply unit 521 and the computing module 500 . When the operation state of the electronic device 520 does not require the operation of the processor 510 included in the computing module 500 such as a low power mode or a sleep mode, the power source / It is possible to turn off the power supplied to the battery 510. Likewise, the power supply / control unit 524 may control the power supplied to the computing module 500 depending on whether other components 518 included in the computing module 500 operate.

The first power supply unit 521 may convert the voltage of the power supplied from the power supply unit / controller 524 to a voltage for operation of the processor 510 or a DC-DC conversion to a voltage required by the processor 510 have. The voltage for operation of the processor 510 or the voltage required by the processor 510 may vary depending on the CPU and the GPU and may be variable depending on the operating state of the processor 510. [ The processor 510 may transmit a signal indicating the required voltage to the first power supply unit 521 in the electronic device 520 according to the operation state. The first power supply unit 521 may perform DC-DC conversion with a voltage required by the processor 510 based on the signal. The first power supply unit 521 may transmit the first power to the computing module 500 using the first CPU power rail 522 and the first GPU power rail 523 with the converted voltage.

The power supply unit 511 obtains the converted voltage through the first power supply unit 521 and supplies the converted voltage to the processor 521 using the second CPU power rail 512 or the GPU power rail 513. [ The first power can be supplied to the second power source 510. The power supply unit 511 can distinguish and deliver the first power supplied to the CPU and the GPU. In addition, the first power supply unit 521 and the power supply unit 511 may be provided separately from the CPU and the GPU in order to supply the first power to the additional processor when the processor 510 includes an additional processor in addition to the CPU and the GPU. Power rails may be used to supply the first power to additional processors within the processor 510. [

According to various embodiments of the present invention, a power transfer structure for transferring the first power to the processor 510 included in the computing module 500 is provided between the computing module 500 and the electronic device 520, Respectively. For example, in the computing module 500, a power rail for smooth flow of a low voltage and a large current and a small amount of decoupling capacitors for integrity of a power supply are disposed in the processor 510 A first power supply 521 for generating a voltage required by the processor 510 may be disposed in the electronic device 520. [ The first power supply unit 521 may be controlled by the power supply unit / controller 524 and may be controlled through software installed in the electronic device 520. Also, the first power supply unit 521 may be separately modularized so as to be removable for compatibility between electronic devices.

In addition, the processor 510 may control the first power supply unit 521 by transmitting a signal representing information about the first power required for the operation to the first power supply unit 521. [ By arranging the first power supply unit 521 in the electronic device 520, the size of the computing module 500 can be reduced.

However, when the first power is supplied at a low voltage converted by the first power supply unit 521 as described above, a large current is required to receive the first power. A physical path is required to process the data.

For example, in the case of a processor having a TDP of 15 W, a supply of more than a few tens of amperes is required for the operation of the processor, and a sufficient physical path is required for such a large current flow.

Accordingly, in accordance with various embodiments of the present invention, the electronic device 520 may include a first connection to connect the electronic device 520 and the computing module 500 to supply a first power through the high current At least one first region of the case constituting the computing module 500 may be utilized as a path for power transmission without using a main connection interface such as the interface 514 or the second connection interface 515. [ To this end, the at least one first region may be composed of a material having electrical conductivity for receiving the first power. Also, the at least one first region may be coupled to the power supply 511 so that a first power received from the electronic device 520 may be transmitted to the processor 510. As such, the processor 510 located within the case may receive the first power from the electronic device 520 through the case.

Thereby reducing drop and noise of voltage and current delivered to the computing module 500 from the electronic device 520 by securing sufficient power rails for the flow of large currents and optimizing the length of the power delivery path So that it is easy to secure power integrity. In addition, it is possible to prevent the size of the computing module 500 from increasing due to the addition of a separate component such as a connection portion for the flow of a large current.

The first connection interface 514 and the second connection interface 515 may perform electrical connection and data / control signal communication between the computing module 500 and the electronic device 520. In addition, a uHDMI port 719 may be additionally provided for connection with an external display device or the like. It will be apparent to those skilled in the art that various connection ports may be used for connection to other electronic devices, or components such as a display, etc., contained within the electronic device 520.

As such, the connection interface for performing communication such as electrical connection and data control signal and the structure for transmitting the first power can be separated from each other. In addition, the structure for transferring the heat generated by the operation of the processor 510 may be separated from the connection interface, and the heat transfer structure and the heat transfer method will be described later.

The second power supply unit 516 may supply power to the other components 517 except for the processor 510 using the power supplied from the power supply unit / controller 440. Since the power consumed by the other components 517 is smaller than that of the processor 510, a separate power supply unit such as the processor 510 may not be required.

In this way, a power transmission structure which is a hindrance to miniaturization of the computing module 500 including the high-performance processor 510 is separately disposed in the electronic device 520, and the case of the computing module 500 is connected to the power The size of the computing module 500 can be reduced.

6 is a flow diagram of a method for controlling power supplied from an electronic device by a computing module according to various embodiments of the present invention.

In operation 610, the computing module may receive the first power from the removable electronic device with the computing module through at least one first region of the case of the computing module. The computing module may receive the first power with a voltage converted by the electronic device. As such, the computing module does not include a configuration for converting voltage to power the processor in the computing module, and may receive the converted voltage by the electronic device. In addition, the computing module may obtain a power rail, which is a sufficient power transmission path, by receiving power through the case.

In operation 620, the computing module may provide the received first power to a processor in the computing module. If the processor includes both a CPU and a GPU, the computing module may separate the first power received and supply it to the CPU and the GPU, respectively. In addition, when the processor includes an additional processor in addition to the CPU and the GPU, the first power may be separately supplied to the additional processor.

In operation 630, the computing module may send a signal for controlling the first power to the electronic device based on an operating state of the processor. Depending on the operating state of the processor, the processor may transmit a signal for controlling the first power to the electronic device supplying the first power, because the power required for operation of the processor is different.

In operation 640, the computing module may receive and supply the adjusted first power based on the signal to the processor. As such, even if a power transfer structure for transferring power to the processor is disposed in the electronic device, the processor can receive power required through the control signal.

7 is a flow diagram of a method for transferring power to a computing module by an electronic device in accordance with various embodiments of the present invention.

In operation 710, an electronic device to which a computing module may be detachably connected may convert the voltage of a power source supplied to operate a processor located within the computing module. As described above, the power transmission structure for operating a high-performance processor may be difficult to miniaturize. Thus, the electronic device to which the computing module is connected includes the power transfer structure, so that the computing module can be made compact.

In operation 720, the electronic device may supply the first power to the computing module using the converted voltage through at least one first region of the case of the computing module. The at least one first region may be composed of a material having electrical conductivity for receiving the first power.

In operation 730, the electronic device may receive a signal for controlling the first power based on an operating state of the processor received from the computing module. The processor may have different power requirements for operation depending on the operating state. Thus, the processor may send a signal to the electronic device to control the first power to receive the required power according to its operating state.

In operation 740, the electronic device may adjust the magnitude of the first power based on the received signal. In addition, the electronic device may supply the resized first power to the computing module. Thus, even if the power supply structure is disposed outside the computing module, power to be supplied through communication between the computing module and the electronic device can be controlled.

Figure 8 illustrates a flow of power transfer from a power supply to a processor in a computing module in accordance with various embodiments of the present invention.

In Figure 8, when the electronic device 830 does not include a power supply for supplying the first power to the processor 810 in the computing module 800, the first power supply 812 included in the computing module 800 A method for supplying the second power to the processor 810 will be described. Hereinafter, it is assumed that the processor 810 is a high-performance processor requiring a separate power transfer and thermal processing structure. Hereinafter, as described with reference to FIG. 5, the power supplied through the first power supply unit 812 to distinguish from the first power supplied from the electronic apparatus is represented by the second power.

As shown in FIG. 8, the electronic device 830 may not include a separate power transfer structure for transferring the first power to the processor 810. In this case, the power source / control unit 831 included in the electronic device 830 can directly transmit the battery or the power obtained from the external device to the computing device 800. The power supply unit / controller 831 supplies the power to the computing module 800 through a first connection interface 815 or a second connection interface 816 for performing electrical connection or data / signal communication with the computing module 830 Or may transmit the power through at least one first region of the computing module 800 case. The first power supply unit 812 included in the computing module 800 may control the voltage of the power supplied from the electronic device 830 to a voltage required for the operation of the processor 810 or a voltage required by the processor 810 So that the second power can be supplied. Unlike the first power supply unit included in the electronic device described with reference to FIGS. 4 and 5, the first power supply unit 812 may be a power supply unit for supplying the low power required by the low-performance processor. Therefore, since the first power supply unit 812 is smaller than the first power supply unit included in the electronic device described with reference to FIGS. 4 and 5, the space occupied in the computing module 800 may not be large. Therefore, it does not hinder the compactness of the computing module 800.

The power supply unit 811 acquires the adjusted voltage through the first power supply unit 812 and supplies the regulated voltage to the processor 810 using the CPU power rail 813 or the GPU power rail 814 It is possible to supply the second power. The power supply unit 811 can separately transmit the second power supplied to the CPU and the GPU. In addition, the first power supply unit 812 and the power supply unit 811 may include a separate power supply unit for supplying the second power to the additional processor when the processor 510 includes an additional processor in addition to the CPU and the GPU. Power rails may be used to supply the second power to additional processors within the processor 810. [

Upon receiving power from the first power supply unit 812, the processor 810 transmits to the first power supply unit 812 a signal indicating information about a voltage required by the processor 810 , The first power supply unit 812 may be controlled.

In addition, the computing module 800 may include a second power supply 817 for powering other components 818 except for the processor 810. Since the power consumed by the other components 818 is lower than that of the processor 810, a separate power supply unit such as the processor 810 may not be required.

As such, the computing module 800 may operate in conjunction with an electronic device 830 that does not include a forwarding structure for delivering power to a high performance processor. However, since the processor 810 located in the computing module 800 can not receive power for normal operation, some performance may be limited.

The computing module according to various embodiments of the present invention is operable not only in an electronic device including a power delivery structure for sufficient power supply but also in an electronic device not including the power transfer structure, And the commonality can be increased. In other words, the computing module may operate at high performance depending on whether the electronic device to be connected includes a power transmission structure or may operate at a low performance due to limited performance.

9A is a view for explaining a cooling method by an electronic device according to a comparative example.

An electronic device according to a comparative example may include a cooling unit that emits heat generated by an internal processor 910 to the outside or diffuses to the entire electronic device. The heat generated by the operation of the processor 910 may be transmitted to the cooling unit for heat treatment through the heat pipe 920. Also, the heat generated by the operation of the processor 910 may be diffused into the electronic device through the heat spreader 921. [ The cooling unit may include a remote heat exchanger (RHE) 930, a fan 931, and a heat spreader 932.

The cooling unit may heat the heat generated by the operation of the processor to the outside or diffuse it into the electronic device by using the RHE 930, the fan 931, and the heat spreader 932. A thermal interface material (a thermal transfer material) may be inserted between the processor 910 and the heat pipe 920 and the heat spreader 921 to reduce the thermal resistance and improve the heat radiation effect. However, the processor 910, the heat pipe 920, and the heat spreader 921 are separable for manufacturing and repairing, but it is difficult for the user to intentionally easily detach the heat pipe 920 and the heat spreader 921 for general use.

Since the cooling unit includes the RHE 930, the fan 931, the heat pipe 920 and the heat spreader 932, which are physically bulky, it is difficult to make the cooling unit compact. When the cooling unit is manufactured in a small size, the heat treatment function may not be normally performed. As described above, since the cooling unit is difficult to miniaturize and manufacture, it may be an obstacle in the production of a computing module including a high-performance processor.

FIG. 9B is a view for explaining a cooling method by a computing module and an electronic device according to various embodiments of the present invention.

The computing module according to various embodiments of the present invention may separately place a cooling unit for processing heat generated by the operation of the processor 940 in the computing module in an electronic device to which the computing module is detachably connected.

For example, a cooling section including a bulky RHE 950, a fan 951, and a heat spreader 951 can be placed in the electronic device. In addition, the computing module may be constructed of a heat transfer material having an excellent heat transfer efficiency, and a heat transfer portion 941 of a thin (e.g., thin, sheet, etc.) structure may be disposed for miniaturization of the computing module have. One side of the heat transfer part 941 may be exposed to the outside of the computing module so as to be in contact with the cooling part included in the electronic device.

For example, at least one second region of the case of the computing module corresponding to the heat transfer portion may be formed in an open structure. Therefore, the heat generated by the processor 940 is transferred to the heat transfer part 941, and the heat transfer part 941 is connected to the cooling part included in the electronic device through the at least one second area By direct contact, heat generated by the processor 940 can be transferred to the cooling unit.

The heat transferred to the cooling unit may be discharged to the outside of the electronic device by the RHE 950, the fan 951, and the heat spreader 952 included in the cooling unit, or may be diffused and processed inside the electronic device .

The surface of the heat transfer portion 941 that is in contact with the processor 940 may be joined to the processor 941 using a TIM or directly to the processor 941. [

In addition, since the heat transfer part 941 may be intentionally and frequently detached from the electronic device for the purpose of using the computing module, a gel, rubber, or the like that can be used to lower the thermal resistance is not used. The gel, rubber, and the like may be deformed due to attachment and detachment several times, and the heat transfer characteristics may easily change, which may not be suitable for the heat transfer structure of the computing module. Accordingly, the heat transfer part 941 may be formed of a metallic heat transfer material so that the shape of the heat transfer part 941 may not be deformed due to the detachment.

In addition, since the heat transfer part 941 can transfer heat through the surface contact with the cooling part, the cooling part also has a part that contacts the heat transfer part 941 in order to efficiently transfer heat, ≪ / RTI > However, as described above, the portion of the cooling portion, which is in contact with the heat transfer portion 941, may be formed of a metallic heat transfer material so that the shape of the cooling portion may not be deformed due to the detachment.

As such, a bulky cooling part is separately disposed in the electronic device, so that the computing module can be made compact.

10 is a cross-sectional view of a computing module and an electronic device in accordance with various embodiments of the present invention.

The computing module 1010 and the electronic device 1050 according to various embodiments of the present invention may be removably coupled in various ways. For example, the computing device 1010 may be inserted into the electronic device 1050 in a sliding manner so that the electronic device 1050 and the computing module 1010 may be connected. To this end, the electronic device 1050 may include a coupling structure into which the computing module 1010 can be inserted. Hereinafter, a method in which the computing module 1010 is inserted into the electronic device 1050 to connect the electronic device 1050 to the computing module 1010 will be described.

However, this is for illustrative purposes only, and is not intended to be limiting. For example, the electronic device 1050 may include a separate receiving portion for receiving the computing module 1010, and the receiving portion may be configured to be openable and closable through a door. The computing module 1010 may open the door of the receptacle and may be inserted into the receptacle and connected to the electronic device 1050. As described above, the connection method of the electronic device 1050 and the computing module 1010 is not limited to the sliding method and the method using a separate receiving part, and various methods can be used. .

The computing module 1010 and the electronic device 1050 according to various embodiments of the present invention may be configured to receive power from the electronic device 1050 separately from the computing module 1010 And heat may be transferred from the computing module 1010 to the electronic device 1050. [ For example, the power and heat may be transferred through the case of the computing module 1010.

And may receive power from the electronic device 1050 through the at least one first region 1030, 1031 of the case of the computing module 1010 with the converted voltage. The at least one first region 1030 and 1031 may be formed of an electrically conductive material and may be connected to a power transfer unit for transferring power to the CPU 1020 and the GPU 1021. [ The power transfer unit may supply the received power to the CPU 1020 and the GPU 1021 to allow the CPU 1020 and the GPU 1021 to operate.

The electronic device 1050 can be a voltage for operating the CPU 1020 or the GPU 1021 to transfer the power to the computing module 1010 or a voltage for operating the CPU 1020 or the GPU 1021, It is possible to convert the supplied voltage. The electronic device 1050 may communicate power to the computing module 1010 with the converted voltage using power rails 1060 and 1061 included in the electronic device 1050.

The heat generated due to the operation of the CPU 1020 and the GPU 1021 can be transferred to the heat transfer unit 1040 bonded to the CPU 1020 and the GPU 1021. The heat transfer unit 1040 may be connected to the CPU 1020 and the GPU 1021 using a TIM 1041. [ Also, at least one second region of the case of the computing module 101 corresponding to the heat transfer portion may be formed in an open structure. Accordingly, heat generated by the CPU 1020 and the GPU 1021 through the at least one second region may be transferred to the electronic device 1050. For example, the heat generated by the CPU 1020 and the GPU 1021 can be transferred to the cooling unit 1070 by the direct contact between the heat transfer unit 1040 and the cooling unit 1070 . The cooling unit 1070 can dissipate the heat transferred through the heat transfer unit 1040 to the outside or diffuse it in the electronic device.

The surface of the heat transferring part 1040 in contact with the cooling part 1070 and the surface of the cooling part 1070 in contact with the heat transferring part 1040 may be composed of a metallic heat transfer material. Since the use of the computing module 1010 causes the electronic device to be attached and detached several times, when the heat transfer material is gel or rubber, the shape changes due to the attachment and detachment several times, and the heat transfer characteristic is changed due to the shape change . Thus, the surface can be constituted by a metallic heat-transferring material. However, the heat transfer material made of a solid material may have a heat resistance higher than that of a heat transfer material made of gel, rubber, etc., and thus the heat transfer efficiency may be deteriorated. The heat generated by the CPU 1020 and the GPU 1021 can be efficiently transferred to the electronic device 105 by designing a large contact area between the heat transfer part 1040 and the cooling part 1070. [ can do.

However, the above-described heat transfer and power transmission structure is only for illustrative purposes, and is not limited thereto. The touched surfaces of the computing module 1010 and the electronic device 1050 may be disposed within the computing module 1010 or within the computing device 1010 in an elastic structure for tight coupling to have the necessary electrical and thermal resistance. ). It will be apparent to those of ordinary skill in the art that the computing module 1010 and the electronic device 1050 may be configured in a variety of ways that can interact with each other.

As such, a physically bulky power transfer and heat treatment structure is disposed in the electronic device 1050, so that the computing module 1010 can be made compact.

11 is a view for explaining a method of fixing a cooling part in a computing module according to various embodiments of the present invention.

The heat transfer portion 1110 may be bonded to the processor using a heat transfer material. However, as described above, frequent attaching and detaching occurs for the purpose of using the computing module, and whenever the computing module and the electronic device are attached and detached, the heat transmitting portion 1110 can be brought into contact with and separated from the cooling portion of the electronic device have. Accordingly, the heat transfer part 1110 must be fixedly mounted on the computing module.

For this purpose, the heat transfer part 1110 may be fixedly mounted on a PCM (Printed Circuit Board) in a computing module. 11, the heat transfer part 1110 may be connected to the PCB via the PEMs 1130 and 1131 and may be connected to the heat transfer part 1130 by inserting a support between the PEMs 1130 and 1131. [ 110 may be fixedly mounted to the computing module.

Figure 12 illustrates a power transfer structure and a heat transfer structure between a computing module and an electronic device in accordance with various embodiments of the present invention.

FIG. 12 is a schematic representation of a power transfer and heat transfer structure between the computing module 1200 and the electronic device 1230. For example, the computing module 1200 may receive power from the electronic device 1230 through at least one first region of the case of the computing module 1200. The at least one first region within the computing module 1200 for supplying the power to a processor included in the computing module 1200 includes at least one first region for powering the processor via power rails 1210 and 1211, And may be connected to a power supply unit. The power supply unit may be disposed on the PCB located inside the computing module 1200, or may be disposed in a configuration separate from the PCB.

The electronic device 1230 can convert the voltage of a battery included in the electronic device 1230 or an externally obtained power source to a voltage for operation of the processor or a voltage required by the processor. The electronic device 1230 may utilize power rails 1240 and 1241 to communicate power to the computing module 1200 with the converted voltage.

The computing module 1200 may transmit heat generated by the operation of the processor to the electronic device 1230 through a heat transfer part 1220 included in the computing module 1200. The heat generated by the processor is transmitted to the cooling unit 1230 included in the electronic device 1230 by the direct contact between the heat transfer unit 1220 and the cooling unit 1250 included in the electronic device 1230. [ (1250). The cooling unit 1250 may dissipate heat transferred to the outside or diffuse the heat into the electronic device 1230.

Figure 13 illustrates a case of a computing module according to various embodiments of the present invention.

At least one first region in which a computing module is powered from an electronic device and at least one second region in which the computing module transmits heat to the electronic device may be configured in various shapes, Can be configured in various locations. The at least one first region and the at least one second region may be configured in various positions and shapes of the computing module case according to a connection method, a connection structure, and the like between the electronic device and the computing module.

For example, the at least one first region may be located on a top surface 1310, 1311 of the case of the computing module. In addition, there may be only one of the at least one first region, a plurality of the at least one first regions, a circular shape, not shown, or a polygonal shape. In addition, the at least one first region may be located at the sides 1312, 1313 and may be located at the lower surface 1314 of the case.

In addition, the at least one second region may be formed in an open structure so that the heat transfer portion included in the computing module may directly contact the cooling portion, and the heat transfer portion may be formed through the at least one second region Lt; / RTI > Although not shown, the second region may be plural or may be formed in various shapes and positions.

14A to 14D show the structure of a computing module and an electronic device having an open / close structure according to various embodiments of the present invention.

14A illustrates a case where the area 1410 including the power transfer part and connection ports included in the computing module 1400 is located on the side. The region 1410 may be located inside the case of the computing module 1400 and the case portion of the computing module 1400 corresponding to the region 1410 may be configured in an open / closed structure. For example, the computing module 1400 may be configured to open when it is coupled to an electronic device, and to be closed again when disconnected from the electronic device.

Also, power may be received from the electronic device through at least one first block of areas 1410 that includes the connection ports. At least one first block for receiving the power may be configured to have an area large enough to allow a large current to flow to receive the power. Also, at least one second block included in the area 1410 may be used for data, signal communication with the electronic device.

14B illustrates a cross-sectional view of the computing module 1400 and the electronic device 1420 prior to the computing module 1400 being mounted to the electronic device 1420. FIG. Before the computing module 1400 is mounted to the electronic device 1420, the region 1410 is located within the case of the computing module 1400 and the computing module 1400 corresponding to the region 1410 ) Is closed. In addition, the heat transfer portion of the computing module 1400 may not be disposed in the region 1410 because a large contact area is required for heat transfer efficiency. The heat transfer portion may be disposed to be in direct contact with the cooling portion of the electronic device 1420 through at least one second region of the case of the computing module 1400 formed in an open structure. In addition, the heat transfer part may be bonded to the CPU and the GPU using a heat transfer material (TIM).

Figure 14C illustrates a cross-sectional view of the computing module 1400 and the electronic device 1420 when the computing module 1400 is mounted to the electronic device 1420. [ As the computing module 1400 is mounted to the electronic device 1420, the case of the computing module 1400 corresponding to the region 1410 is opened. For example, the case of the computing module 1400 corresponding to the first area may be formed in a door structure, and a spring supporting the case as the case is pushed by the electronic device 1420 So that the first region 1410 can be exposed to the outside. The first region 1410 exposed to the outside may be coupled to the connection portion 1430 of the electronic device 1420. The first region 1410 and the connection portion 1430 of the electronic device 1420 are coupled to each other so that power supply and communication between the computing module 1400 and the electronic device 1420 can be performed.

FIG. 14D shows an entire cross-sectional view of the case where the computing module 1400 is mounted on the electronic device 1420. FIG. The first region 1410 is exposed to the outside as the case corresponding to the first region 1410 is opened and the first region 1410 exposed to the outside is connected to the connection portion 1430 of the electronic device 1420 ). In this way, the first region 1410 and the connection portion 1430 can be designed and manufactured to be connectable with each other.

Each of the components described in this document may be composed of one or more components, and the name of the component may be changed according to the type of the electronic device. In various embodiments, the electronic device may comprise at least one of the components described herein, some components may be omitted, or may further include additional other components. In addition, some of the components of the electronic device according to various embodiments may be combined into one entity, so that the functions of the components before being combined can be performed in the same manner.

As used in this document, the term "module" may refer to a unit comprising, for example, one or a combination of two or more of hardware, software or firmware. A "module" may be interchangeably used with terms such as, for example, unit, logic, logical block, component, or circuit. A "module" may be a minimum unit or a portion of an integrally constructed component. A "module" may be a minimum unit or a portion thereof that performs one or more functions. "Modules" may be implemented either mechanically or electronically. For example, a "module" may be an application-specific integrated circuit (ASIC) chip, field-programmable gate arrays (FPGAs) or programmable-logic devices And may include at least one.

At least a portion of a device (e.g., modules or functions thereof) or a method (e.g., operations) according to various embodiments may include, for example, computer-readable storage media in the form of program modules, As shown in FIG. When the instruction is executed by a processor, the one or more processors may perform a function corresponding to the instruction. The computer readable storage medium may be, for example, a memory.

The computer readable recording medium may be a hard disk, a floppy disk, a magnetic media (e.g., a magnetic tape), an optical media (e.g., a compact disc read only memory (CD-ROM) digital versatile discs, magneto-optical media such as floptical disks, hardware devices such as read only memory (ROM), random access memory (RAM) Etc. The program instructions may also include machine language code such as those produced by a compiler, as well as high-level language code that may be executed by a computer using an interpreter, etc. The above- May be configured to operate as one or more software modules to perform the operations of the embodiment, and vice versa.

Modules or program modules according to various embodiments may include at least one or more of the elements described above, some of which may be omitted, or may further include additional other elements. Operations performed by modules, program modules, or other components in accordance with various embodiments may be performed in a sequential, parallel, iterative, or heuristic manner. Also, some operations may be performed in a different order, omitted, or other operations may be added. And the embodiments disclosed in this document are presented for the purpose of explanation and understanding of the disclosed technology and do not limit the scope of the technology described in this document. Accordingly, the scope of this document should be interpreted to include all modifications based on the technical idea of this document or various other embodiments.

Claims (34)

A portable computing module detachably coupled to an electronic device,
case;
A processor located within said case;
A power supply for supplying a first power received from the electronic device to the processor; And
A heat transfer unit for transferring heat generated by the processor to the electronic device,
Lt; / RTI > The method according to claim 1,
The power supply unit,
And receive the first power through at least one first region of the case. 3. The method of claim 2,
Wherein the at least one first region comprises:
And is coupled to the power supply. ≪ RTI ID = 0.0 > 31. < / RTI > The method according to claim 1,
Wherein the first power comprises:
And is received as a voltage converted by the electronic device to be supplied to the processor. The method according to claim 1,
The heat-
And transmits heat generated by the processor through the at least one second region of the case to the electronic device. 6. The method of claim 5,
Wherein the at least one second region comprises:
Wherein the heat transfer portion is formed in a structure that is open to be in direct contact with the electronic device. The method according to claim 6,
The heat-
Wherein the heat generated by the processor is communicated to the electronic device by direct contact with a cooling portion of the electronic device through the at least one second region. The method according to claim 6,
Wherein the area of the heat transfer portion in contact with the electronic device is comprised of a thin, metallic heat transfer material. The method according to claim 1,
The heat-
Wherein the heat transfer material is bonded to the processor using a heat transfer material. The method according to claim 1,
At least one connection interface for communicating with the electronic device
Lt; / RTI > The method according to claim 1,
The processor comprising:
And transmit a signal for controlling the first power to the electronic device based on an operating state of the processor. The method according to claim 1,
A power supply for supplying a second power to the processor using power supplied from the electronic device when the first power is not received from the electronic device,
Lt; / RTI > 13. The method of claim 12,
The power supply unit,
And adjusts the magnitude of the second power such that heat generated by the processor is processable in the computing module. A method of operating a portable computing module removably coupled to an electronic device,
Providing a first power received from the electronic device through at least one first region of a case of the computing module to a processor in the computing module;
Transmitting a signal for controlling the first power to the electronic device based on an operating state of the processor; And
Receiving the adjusted first power based on the signal and supplying it to the processor
Gt; a < / RTI > computing module. 15. The method of claim 14,
Wherein the at least one first region comprises:
And is configured to be electrically conductive to receive the first power. 15. The method of claim 14,
Wherein the first power comprises:
And is received with the voltage converted by the electronic device to be supplied to the processor. 15. The method of claim 14,
Wherein heat generated by the processor through at least one second region of the case of the computing module is communicated to the electronic device. 18. The method of claim 17,
Wherein the at least one second region comprises:
Wherein the heat transfer portion is formed in a structure that is open to be in direct contact with the electronic device. 19. The method of claim 18,
Wherein heat generated by the processor is transferred to the electronic device by direct contact with a cooling portion of the electronic device through the at least one second region. An electronic device in which a portable computing module can be detachably connected,
A connection unit connected to the computing module;
A power supply for supplying a first power to the computing module to operate a processor in the computing module; And
A cooling unit for receiving heat generated by the processor from the computing module,
≪ / RTI > 21. The method of claim 20,
The power supply unit,
And supplies the first power through at least one first region of the case of the computing module. 22. The method of claim 21,
The at least one first region
And is configured to be electrically conductive to receive the first power. 21. The method of claim 20,
A power supply unit for supplying power
Further comprising:
The power supply unit
And converts the voltage of a power supply supplied from the power supply unit to operate the processor to supply the first power. 21. The method of claim 20,
The cooling unit includes:
Wherein heat generated by the processor is received through at least one second region of the case of the computing module. 25. The method of claim 24,
Wherein the at least one second region comprises:
Wherein the heat transfer portion is formed in a structure that is opened to be in direct contact with the electronic device. 26. The method of claim 25,
The cooling unit includes:
Wherein the heat generated by the processor is transmitted by direct contact with the electronic device through the at least one second region. 21. The method of claim 20,
And at least one region corresponding to the cooling portion of the connection portion is made of a thin metallic heat transfer material. 21. The method of claim 20,
At least one connection interface for communicating with the computing module,
≪ / RTI > 21. The method of claim 20,
The power supply unit,
And adjusts the magnitude of the first power based on a signal for controlling the first power based on an operating state of the processor received from the computing module. A method of operating an electronic device in which a portable computing module can be detachably connected,
Converting a voltage of a power source supplied to operate a processor located in the computing module;
Supplying a first power to the computing module using the converted voltage through at least one first region of a case of the computing module;
Receiving a signal for controlling the first power based on an operating state of the processor received from the computing module; And
An operation of adjusting the magnitude of the first power based on the signal
≪ / RTI > 31. The method of claim 30,
The at least one first region
And is configured to be electrically conductive to receive the first power. 31. The method of claim 30,
Wherein heat generated by the processor through at least one second region of the case of the computing module is communicated from the computing module. 33. The method of claim 32,
Wherein the at least one second region comprises:
Wherein the heat transfer portion is formed in a structure that is opened to be in direct contact with the electronic device. 34. The method of claim 33,
Wherein the heat generated by the processor is communicated from the computing module by direct contact with the computing module through the at least one second region.

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