KR102463535B1 - Computing module connected to electronic apparatus and operating method thereof - Google Patents

Abstract

Disclosed are a portable computing module removably connected to an electronic device and a method of operating the same. According to various embodiments of the present disclosure, the computing module may include a case, a processor located in the case, a power supply unit supplying first power received from the electronic device to the processor, and heat generated by the processor to the electronic device. It may include a heat transfer unit for transferring it to the device.

Description

A computing module connected to an electronic device and an operating method thereof

The present invention relates to a computing module connected to an electronic device and a method of operating the same. More specifically, it relates to a portable computing module detachably connected to the electronic device and an operating method thereof.

Recently, a high-performance CPU (Central Processing Unit) and GPU (Graphic Processing Unit) have been used in an electronic device for a task requiring a large number of calculations quickly. However, since more power is required in proportion to the performance (eg, processing speed, etc.) of the CPU and GPU, and more heat is generated due to the operation of the CPU and GPU, due to the use of the high-performance CPU and GPU Power consumed by the electronic device and heat generated are increased. Accordingly, for stable operation of the electronic device, heat generated by using a cooling fan and a remote heat exchanger (RHE) may be diffused or radiated to the entire electronic device.

In addition, recently, some functions of an electronic device may be designed in a separable module form to enable connection or separation. For example, there is a system memory module, a hard disk drive (HDD), a CD-ROM, a DVD device, and a Personal Computer Memory Card International Association (PCMCIA) or PC card module that has been variously utilized in a conventional laptop PC. . In addition, a small computing device that implements the basic functions of a PC (Personal Computer) on a stick or a small case has been developed, and a device that can be connected to a TV or monitor or mounted in a dedicated case to perform functions similar to a PC is being developed

In the computing module detachable from other devices, the CPU, the memory, the communication module and the power supply unit for supplying power required by the components included in the computing module as components, to process heat generated by the operation of the computing module A heat treatment structure for the purpose is designed to be included in the computing module.

Accordingly, the CPU/GPU and other processors mounted on the computing module can operate with little power (eg, ARM or ATOM processor, etc.) . Therefore, it is possible to cool the heat generated by the low-power processor through a small passive cooling component or a heat treatment structure.

However, when a high-performance processor is used in the computing module, a power supply unit for supplying sufficient power necessary for the operation of the high-performance processor and a cooling unit for cooling high heat generated by the high-performance processor are required. . In general, a cooling unit such as a power delivery logic unit, a cooling fan, and a heat spread pipe for the high-performance processor is spatially bulky, which becomes an obstacle to downsizing the computing module. In other words, when the computing module includes a power supply unit and a cooling unit for the high-performance processor, it is difficult to manufacture the computing module in a compact size.

In addition, the size of the computing module is different depending on the power required for the operation of the processor and the heat generated by the operation of the processor, so that computing modules including different processors are not physically or electrically compatible with each other. does not

According to various embodiments of the present disclosure, a portable computing module detachably connected to an electronic device includes a case, a processor located in the case, a power supply unit supplying first power received from the electronic device to the processor, and the processor It may include a heat transfer unit that transfers heat generated by the electronic device to the electronic device.

According to various embodiments of the present disclosure, in a method of operating a portable computing module removably connected to an electronic device, the first power received from the electronic device through at least one first area of a case of the computing module is applied to the An operation of supplying to a processor in a computing module, an operation of transmitting a signal for controlling the first power to the electronic device based on an operating state of the processor, and an operation of receiving the adjusted first power based on the signal to the processor It may include the operation of supplying with

According to various embodiments of the present disclosure, an electronic device to which a portable computing module can be detachably connected supplies first power to the computing module in order to operate a connection unit connected to the computing module and a processor in the computing module. It may include a power supply and a cooling unit for cooling by receiving the heat generated by the processor from the computing module.

According to various embodiments of the present disclosure, a method of operating an electronic device to which a portable computing module can be detachably connected includes converting a voltage of power supplied to operate a processor located in the computing module, and Supplying first power to the computing module using the converted voltage through at least one first area of the case, and controlling the first power based on the operating state of the processor received from the computing module It may include an operation of receiving a signal for the purpose and an operation of adjusting the level of the first power based on the signal.

According to various embodiments of the present disclosure, in the computing module, a power supply unit for supplying power to the processor and a cooling unit for cooling the heat generated by the processor are separately arranged in an electronic device to which the computing module can be detachably connected. can In addition, a case for configuring the computing module with a separate heat transfer structure and power transfer structure separated from a connection interface for electrical or data communication with the electronic device may be used. Accordingly, it is possible to reduce the size of the computing module and improve heat transfer efficiency and power supply integrity, while supplying power required by the processor and cooling heat generated by the processor.

In addition, even if the power required and heat generated by the processor are different, the size of the computing module may be manufactured to be the same, so that processors including processors that are physically or electrically different from each other may be physically or electrically compatible with each other.

1A to 1D are block diagrams illustrating structures of an electronic device and a computing module according to a comparative example.
2A to 2C are block diagrams illustrating structures of a computing module and an electronic device according to various embodiments of the present disclosure;
3A to 3C are diagrams for explaining a connection aspect between a computing module and an electronic device according to various embodiments of the present disclosure;
4 illustrates a power transfer flow to a processor in an electronic device according to a comparative example.
5 illustrates a power transfer flow from an electronic device to a processor in a computing module according to various embodiments of the present disclosure;
6 is a flowchart of a method of controlling power supplied from an electronic device by a computing module according to various embodiments of the present disclosure.
7 is a flowchart of a method of transferring power to a computing module by an electronic device according to various embodiments of the present disclosure;
8 illustrates a power transfer flow from a power supply to a processor in a computing module according to various embodiments of the present invention.
9A is a view for explaining a cooling method by an electronic device according to a comparative example.
9B is a diagram for explaining a cooling method by a computing module and an electronic device according to various embodiments of the present disclosure;
10 is a cross-sectional view of a computing module and an electronic device according to various embodiments of the present disclosure;
11 is a view for explaining a method of fixing a cooling unit in a computing module according to various embodiments of the present disclosure.
12 illustrates a power transfer structure and a heat transfer structure between a computing module and an electronic device according to various embodiments of the present disclosure.
13 illustrates a case of a computing module according to various embodiments of the present disclosure.
14A to 14D illustrate structures of a computing module and an electronic device having an opening/closing structure according to various embodiments of the present disclosure.

Hereinafter, various embodiments of the present document will be described with reference to the accompanying drawings. However, it is not intended to limit the technology described in this document to specific embodiments, and it should be understood to include various modifications, equivalents, and/or alternatives of the embodiments of this document. . In connection with the description of the drawings, like reference numerals may be used for like components.

In this document, expressions such as "has," "may have," "includes," or "may include" refer to the presence of a corresponding characteristic (eg, a numerical value, function, operation, or component such as a part). and does not exclude the presence of additional features.

In this document, expressions such as "A or B," "at least one of A and/and B," or "one or more of A or/and B" may include all possible combinations of the items listed together. . For example, "A or B," "at least one of A and B," or "at least one of A or B" means (1) includes at least one A, (2) includes at least one B; Or (3) it may refer to all cases including both at least one A and at least one B.

As used herein, expressions such as "first," "second," "first," or "second," may modify various elements, regardless of order and/or importance, and refer to one element. It is used only to distinguish it from other components, and does not limit the components. For example, the first user equipment and the second user equipment may represent different user equipment regardless of order or importance. For example, without departing from the scope of the rights described in this document, a first component may be referred to as a second component, and similarly, the second component may also be renamed as a first component.

A component (eg, a first component) is "coupled with/to (operatively or communicatively)" to another component (eg, a second component) When referring to "connected to", it will be understood that the certain element may be directly connected to the other element or may be connected through another element (eg, a third element). On the other hand, when it is said that a component (eg, a first component) is "directly connected" or "directly connected" to another component (eg, a second component), the component and the It may be understood that other components (eg, a third component) do not exist between other components.

As used herein, the expression "configured to (or configured to)" depends on the context, for example, "suitable for," "having the capacity to ," "designed to," "adapted to," "made to," or "capable of." The term “configured (or configured to)” may not necessarily mean only “specifically designed to” in hardware. Instead, in some circumstances, the expression “a device configured to” may mean that the device is “capable of” with other devices or parts. For example, the phrase “a processor configured (or configured to perform) A, B, and C” refers to a dedicated processor (eg, an embedded processor) for performing the operations, or by executing one or more software programs stored in a memory device. , may mean a generic-purpose processor (eg, a CPU or an application processor) capable of performing corresponding operations.

Terms used in this document are only used to describe specific embodiments, and may not be intended to limit the scope of other embodiments. The singular expression may include the plural expression unless the context clearly dictates otherwise. Terms used herein, including technical or scientific terms, may have the same meanings as commonly understood by one of ordinary skill in the art described in this document. Among the terms used in this document, terms defined in a general dictionary may be interpreted with the same or similar meaning to the meaning in the context of the related art, and unless explicitly defined in this document, ideal or excessively formal meanings is not interpreted as In some cases, even terms defined in this document cannot be construed to exclude embodiments of the present document.

The electronic device according to various embodiments of the present document may include, for example, a smartphone, a tablet personal computer, a mobile phone, a video phone, and an e-book reader. , desktop personal computer, laptop personal computer, netbook computer, workstation, server, personal digital assistant (PDA), portable multimedia player (PMP), MP3 player, mobile It may include at least one of a medical device, a camera, and a wearable device. According to various embodiments, the wearable device may be an accessory type (eg, a watch, ring, bracelet, anklet, necklace, eyeglass, contact lens, or head-mounted-device (HMD)), a fabric or an integral piece of clothing ( It may include at least one of, for example, electronic clothing), a body attachable type (eg, a skin pad or tattoo), or a bioimplantable type (eg, an implantable circuit).

In some embodiments, the electronic device may be a home appliance. Home appliances are, for example, televisions, digital video disk (DVD) players, audio systems, refrigerators, air conditioners, vacuum cleaners, ovens, microwave ovens, washing machines, air purifiers, set-top boxes, home automation controls. panel (home automation control panel), security control panel (security control panel), TV box (eg Samsung HomeSync ^TM , Apple TV ^TM , or Google TV ^TM ), game console (eg Xbox ^TM , PlayStation ^TM ), electronic dictionary , an electronic key, a camcorder, or an electronic picture frame.

In another embodiment, the electronic device may include various medical devices (eg, various portable medical measuring devices (eg, a blood glucose meter, a heart rate monitor, a blood pressure monitor, or a body temperature monitor), magnetic resonance angiography (MRA), magnetic resonance imaging (MRI), Computed tomography (CT), imagers, or ultrasound machines, etc.), navigation devices, satellite navigation systems (global navigation satellite system (GNSS)), event data recorder (EDR), flight data recorder (FDR), automotive infotainment ) devices, ship electronic equipment (e.g. ship navigation devices, gyro compasses, etc.), avionics, security devices, vehicle head units, industrial or domestic robots, automatic teller's machines (ATMs) in financial institutions. , point of sales (POS) in stores, or internet of things (e.g. light bulbs, sensors, electricity or gas meters, sprinkler devices, smoke alarms, thermostats, street lights, toasters) , exercise equipment, hot water tank, heater, boiler, etc.) may include at least one.

According to some embodiments, the electronic device is a piece of furniture or part of a building/structure, an electronic board, an electronic signature receiving device, a projector, or various measuring instruments (eg, water, electricity, gas, or a radio wave measuring device). In various embodiments, the electronic device may be a combination of one or more of the various devices described above. The electronic device according to an embodiment may be a flexible electronic device. In addition, the electronic device according to the embodiment of the present document is not limited to the above-described devices, and may include a new electronic device according to technological development.

Hereinafter, an electronic device according to various embodiments will be described with reference to the accompanying drawings. In this document, the term user may refer to a person who uses an electronic device or a device (eg, an artificial intelligence electronic device) using the electronic device.

1A to 1D are block diagrams illustrating structures of an electronic device and a computing module according to a comparative example.

1A is a block diagram illustrating a structure of an electronic device (eg, a laptop PC) 110 according to a comparative example. As shown in FIG. 1A , individual components (or functional blocks) included in the electronic device 110 are generally composed of a single or a combination of a plurality of units to constitute one electronic device. Since individual components (or functional blocks) included in the electronic device 110 correspond to well-known components, a separate description thereof will be omitted.

The electronic device 110 employs and uses a processor employing a high-performance CPU/GPU for a task that requires a large number of calculations quickly. In general, power required for operation and generated heat increase in proportion to the performance of the CPU and GPU. Therefore, when a high-performance CPU/GPU is used, high power is required for the operation of the high-performance CPU/GPU, and high heat is generated by the operation of the high-performance CPU/GPU, for stable system operation. A power supply structure such as a separate power supply unit and a heat treatment structure such as a cooling unit (eg FAN, RHE (Remote Heat Exchanger), heat pipe, heat spreader, etc.) It should be included in the electronic device 110 .

As such, the electronic device 110 generally includes all individual components necessary for operation and combinations of the individual components. However, when all individual components for operation are included as shown in FIG. 1A , the size of the electronic device 110 increases and portability may decrease.

1B illustrates an electronic device 130 and a computing module 120 connectable to the electronic device 130 according to a comparative example. Recently, the use of the computing module 120 including a configuration that performs basic functions such as a processor such as a CPU/GPU, a memory, and a storage unit and the electronic device 130 connectable to the computing module 120 is increasing. The electronic device 130 is a separate system designed to be connectable to the computing module, and is connected to the computing module 120 to perform a function as a computing system. The computing module 120 and the electronic device 130 may generally supply signals and power through an electrical/mechanical connection structure, and the computing module 120 and the electronic device 130 may be connected or separated. It can be configured to

For example, the computing module 120 and the electronic device 130 may be electrically connected through a main connection interface (I/F) and perform data and/or signal communication.

The electronic device 130 includes a processor that performs data processing for the operation of the electronic device 130, a power supply unit for supplying power to the processor, a memory used for the operation of the processor, and the like, as shown in FIG. 1B. The storage unit may not be included. Hereinafter, the processor may indicate all processors available for the operation of the electronic device 130 such as CPU, GPU, and other processors.

Accordingly, when the electronic device 130 is not connected to the computing module 120 , the electronic device 130 may not operate alone. As such, the electronic device 130 that has no data processing capability alone, and is capable of operations such as data processing through connection with the computing module 120, is, for example, a dummy system (Dumb system), a docking system ( Docking system), carrier (Carrier), container (Container), etc. can be named.

As shown in FIG. 1B , the computing module 120 includes a processor, a cooling unit, and a first power supply unit for supplying power to the processor. When the processor can operate with a small amount of power without supplying a large amount of power, the space occupied by the first power supply unit may not be large. In addition, when the heat generated by the operation of the processor is small, since the heat generated by the processor can be cooled through a small passive cooling unit or a heat treatment structure, a bulky cooling fan; An active cooling unit such as RHE may not be required. As such, when large power is not required for the operation of the processor included in the computing module 120 and heat generated by the operation of the processor is processed through a heat processing structure such as a passive cooling unit, the computing module 120 may be made small and easy to carry.

However, recently, as electronic devices, such as computing systems, perform complicated and diverse processing, and rapid processing is required, a high-performance processor is employed in the computing module 120 . Since the high-performance processor consumes a large amount of power for operation, a volume of a power supply structure (eg, a power supply unit and a power supply rail, etc.) for supplying power to the processor is large, and heat generated by the high-performance processor is large. A bulky heat treatment structure, such as an active cooling unit (eg FAN and RHE, etc.), is required to cool the As such, as the performance of the processor included in the computing module 120 increases, the volume of the cooling unit, which is a power supply structure for supplying power to the processor and a heat treatment structure for processing generated heat, becomes larger. It is difficult to manufacture the computing module 120 in a small size.

In FIG. 1C , a first computing module 140 including a low-performance first processor 141 , and a first electronic device 150 including a first connection unit 151 connectable to the first computing module 140 . , the relationship between the second computing module 160 including the high-performance second processor 161 and the second electronic device 170 including the second connection unit 171 connectable to the second computing module 160 . to explain about it.

Hereinafter, it is assumed that the low-performance processor is a processor in which the power consumed for operation is less than a preset power and the generated heat is processed through a passive cooling unit (eg, a heat sink). Conversely, in a high-performance processor, it is assumed that the power consumed for operation is greater than or equal to the preset power, and the generated heat is a processor that can be processed through an active cooling unit (eg, RHE, fan, heat pipe, etc.). For example, a low-performance processor may be a processor designed with a TDP (thermal design power) of less than 10 W, and a high-performance processor may be a processor designed with a TDP of 10 W or more. Accordingly, the low-performance processor may consume less than 10W of power for operation, and the high-performance processor may consume more than 10W of power for operation. In addition, since the low-performance processor consumes less power, heat generated by an operation may also be smaller than that of the high-performance processor. Therefore, a separate cooling unit and a power supply unit may not be required for the low performance processor to operate.

In addition, the first electronic device 150 is an electronic device that performs a simple function without performing a complex function, and thus is connected to the first computing module 140 including the low-performance first processor 141 . It is assumed that the first connection part 152 is included as possible and does not include many components.

In contrast, the second electronic device 170 is an electronic device that performs a complex function, and thus a second connection unit 174 connectable to the second computing module 160 including the high-performance second processor 161 . It is assumed that it contains many components.

Since the first computing module 140 includes the low performance first processor 141 , a separate power supply and cooling unit may not be required. Accordingly, the first computing module 140 may be manufactured in a small size.

On the other hand, since the second computing module 160 includes a high-performance second processor 161 , a separate power supply unit 162 and a cooling unit 163 are provided for the operation of the first processor 161 . need. Accordingly, the second computing module 160 cannot be manufactured in a small size, but is manufactured to be larger than that of the first computing module 140 .

As described above, since the sizes of the first computing module 140 and the second computing module 160 are manufactured to be different from each other, the sizes of the first connection part 151 and the second connection part 171 are also different. Accordingly, the second connection unit 171 connectable to the second computing module 160 has an electrical/physical connection structure with a physically larger space than the first connection unit 151 connectable to the first computing module 140 . There is a need.

Accordingly, the first electronic device 150 can be connected only to the first computing module 140 through the first connection unit 151 , and cannot be connected to the second computing module 160 . Likewise, the second electronic device 170 can be connected only to the second computing module 160 through the second connection unit 171 , and cannot be connected to the first computing module 140 . As such, as the sizes of the first computing module 140 and the second computing module 160 are manufactured to be different from each other, a problem of incompatibility may occur.

1D is a block diagram illustrating a structure of an electronic device 160 (eg, a laptop PC, etc.) including a high-performance processor 161 . 1D is a simplified block diagram of the structure of the electronic device 160 in order to explain power supply for the operation of the processor 161 and heat processing generated by the processor 161 .

The electronic device 160 supplies power supplied from the battery 167 to the processor 161 through a separate power supply unit 162 for supplying power to the processor 161 . For example, the power supply unit 162 may DC-DC convert the power supplied from the battery 167 and supply the converted voltage to the processor 161 .

The processor 161 operates using power supplied through the power supply unit 162 , and the memory 166 may be a memory used for the operation of the processor 162 . Heat generated by the operation of the processor 161 may be transferred to the first cooling unit 163 or the second cooling unit 164 through the heat pipe 165 . The first cooling unit 163 and the second cooling unit 164 may radiate the received heat to the outside of the electronic device 160 . Also, although not shown, heat generated by the processor may be spread throughout the electronic device 160 through a heat spreader.

As such, in order to stably operate the high-performance processor 161, a power supply and heat processing structure are essential. However, the power supply and heat processing structure is difficult to miniaturize, which may be a big limitation in implementing a small computing module and the like. Therefore, in general, in order to manufacture a small computing module, a low-performance processor that does not require a separate heat treatment structure for cooling the heat is used because power consumption is not large and heat generated is not large. Conversely, a high-performance processor that requires a separate power supply and heat treatment structure for operation is employed in electronic devices with relatively few restrictions on physical space in design, and is not employed in small-volume electronic devices that emphasize portability. it is common not to

2A to 2C are block diagrams illustrating structures of a computing module and an electronic device according to various embodiments of the present disclosure;

2A illustrates an electronic device 220 and a computing module 210 connectable to the electronic device 220 according to various embodiments of the present disclosure. As described above, a computing module including a high-performance processor is difficult to manufacture in a compact size due to a power supply for supplying power to the processor and a cooling unit for processing heat generated by the processor.

According to various embodiments of the present disclosure, a power supply unit for supplying power to a processor included in the computing module 210 and a cooling unit for processing heat generated by the processor are separately disposed in the electronic device 220 . can do it Accordingly, even if the computing module 210 includes a high-performance processor, a separate power supply and cooling unit may not be included in the computing module. Through this, the computing module 210 including the high-performance processor can receive power stably for normal operation, and can process the generated heat, and is produced in the same or similar size as the computing module using a low-performance processor. can be As described above, since the power supply structure and the heat processing structure are separately disposed in the electronic device 220 , the computing module 210 including a high-performance processor can be manufactured in a compact size, and thus the computing module ( 210) can be easily carried.

The electronic device 220 may supply power to the computing module 210 by using a first power supply for supplying power to the processor in the computing module 210 . For example, the electronic device 220 may DC-DC convert a voltage of power supplied from a battery through the first power supply unit, and transmit the converted voltage to the computing module 210 . The computing module 210 may receive power from the electronic device 220 through a power supply unit and supply the received power to the processor.

Also, the computing module 210 may transfer heat generated by the operation of the processor to the electronic device 220 . For example, the computing module 210 may transfer the heat to the electronic device 220 through a heat transfer unit for transferring heat generated by the processor. For example, the computing module 210 may transfer heat generated by the processor to the electronic device 220 by making direct contact with the electronic device 220 . The electronic device 220 may process the heat by discharging the heat received from the computing module to the outside of the electronic device 220 through a cooling unit or by diffusing it inside the electronic device 220 .

As such, the computing module 210 does not include a power supply unit and a cooling unit for the operation of the processor, and thus may be manufactured in a small size even including a high-performance processor. In addition, a structure for supplying power to the processor and transferring heat generated by the processor may be formed separately from a main connection interface connected to the computing module 210 and the electronic device 220 . have. For example, the power supply and heat transfer structure may be located in a case of the computing module 210 . Since the case of the computing module 210 is in direct contact with the electronic device 220 , the power supply and heat transfer structure may be located in the case of the computing module 210 . Accordingly, while reducing the overall size of the computing module 210 and improving heat transfer efficiency and power supply integrity, a large power supply and cooling performance can be achieved. A connection method and a connection structure of the computing module 210 and the electronic device 220 will be described later.

In FIG. 2B , a first computing module 230 including a low-performance first processor 231 , and a first electronic device 240 including a first connection unit 241 connectable to the first computing module 230 . ), a second computing module 250 including a high-performance second processor 251 and a second electronic device 260 including a second connection unit 263 connectable to the second computing module 230 . to explain the relationship.

As described in FIG. 2A , a power supply unit 261 for supplying power to the high-performance processor and a cooling unit 262 for cooling heat generated by the high-performance processor are provided in the second electronic device 260 . , and the second computing module 250 may not include the power supply unit 261 and the cooling unit 262 . Accordingly, the second computing module 250 may be manufactured to have the same or similar size as the first computing module 230 .

Accordingly, when the electrical and physical connection structures of the first computing module 230 and the second computing module 250 are compatible with each other, the first electronic device 240 connects through the first connection part 241 . It may be connected to the second computing module 250 as well as the first computing module 230 . However, since the first electronic device 240 does not include the power supply unit 261 and the cooling unit 262 , the second processor 251 does not operate normally and may operate with limited performance. have. Here, the limited performance may be the same or similar to that of the first processor 231 that does not require a separate power supply and cooling structure.

Likewise, the second electronic device 260 may be connected to the first computing module 230 as well as the second computing module 250 through the second connection unit 263 . Since the sizes of the first computing module 230 and the second computing module 250 are the same or similar, the second connection unit 263 may also be connected to the first computing module 230 .

As such, the size of the second computing module 250 including the high-performance second processor 251 is the same as the size of the first computing module 230 including the low-performance first processor 231 . Since they may be manufactured identically or similarly, the first computing module 230 and the second computing module 250 may be used interchangeably.

Connection parts such as the first connection part 241 and the second connection part 263 may be manufactured to be electrically or physically connectable to the computing module. For example, when the electronic device and the computing module are connected through a wire such as a USB cable, the connection unit may be manufactured like a USB port. Also, when the computing module is inserted into and connected to the electronic device in a sliding manner, the connection unit may be manufactured in a structure capable of accommodating the computing module. In addition, the connection part may be manufactured in an opening and closing structure including a door. In this case, in order to connect the computing module, the door may be opened first, the computing module may be inserted into the electronic device, and then the door may be closed again. As such, the connection unit may be manufactured in various structures capable of being electrically or physically connected to the computing module, which is apparent to those skilled in the art.

As shown in FIG. 2C , the physical and electrical structures of a computing module including a low-performance processor or a high-performance processor and a connection part of an electronic device for connection with the computing module may be standardized according to preset criteria. For example, the plurality of computing modules may be standardized and manufactured according to preset criteria to have preset sizes and electrical connection structures regardless of processor performance. In addition, the connection part of the electronic device may also be manufactured to have a physical and electrical structure so as to be connectable to a computing module standardized and manufactured according to the preset standard. In this way, each of the plurality of computing modules standardized and manufactured according to the preset standard may be connected to each of the electronic devices including the connection unit standardized and manufactured according to the preset standard regardless of processor performance. In addition, the computing modules and the electronic device may be manufactured to have a heat transfer structure according to a preset standard for heat transfer. Accordingly, heat transfer between the computing modules and the electronic device is also possible.

For example, the first computing module 230 including the low performance first processor 231 and the second computing module 250 including the high performance second processor 251 may have the same size according to a preset criterion. And it may be manufactured to have the same electrical connection structure. Also, the first computing module 230 and the second computing module 250 may be manufactured to have the same heat transfer structure. In this case, the first connection unit 242 for connection with a computing module included in each of the first electronic device 240 , the second electronic device 260 , the third electronic device 270 , and the N-th electronic device 280 . ), the second connection part 263 , the third connection part 273 , and the N-th connection part 283 also have the same size and electrical structure for connection with the first computing module 230 and the second computing module 250 . can be made with Accordingly, the first computing module 230 and the second computing module 250 can be connected to any electronic device and are compatible with each other. In addition, each of the first electronic device 240 , the second electronic device 260 , the third electronic device 270 , and the N-th electronic device 280 is the first computing module 230 and the second computing module 230 . It is manufactured in a structure capable of receiving heat from the module 250 , and the received heat can be processed through the cooling units 262 , 272 , and 282 .

For example, when a power supply and a cooling unit for the high-performance second processor 251 are not included as in the first electronic device 240 , the performance of the second processor 251 may be limited.

On the contrary, the second electronic device 260 , the third electronic device 270 , and the Nth electronic device 280 all receive power from the power supply units 261 , 271 , 281 for supplying power to the computing module and the computing module. Since the cooling units 262 , 272 , and 282 for processing the transferred heat are included, the performance of the second processor 251 is not limited and can be operated normally.

As described above, since the computing module may be manufactured to have the same size and electrical structure according to a preset standard regardless of the performance of a processor included in the computing module, various electronic devices may use a preset standard for connection with the computing module. If it includes a connection unit conforming to , it may be possible to connect to various computing modules meeting the preset criteria. Similarly, a computing module manufactured in a preset size may be connected to various electronic devices including the connection unit.

3A to 3C are diagrams for explaining a connection aspect between a computing module and an electronic device according to various embodiments of the present disclosure;

3A illustrates a computing module including a processor and an electronic device detachable from the computing module. In (a) of FIG. 3A , a first computing module including a high-performance first processor and a second computing module including a low-performance second processor are electronic devices (eg, notebook computers, tablet PCs, PCs, TVs, printers, A case where it is installed in a vehicle, a vacuum cleaner, etc.) will be described. The electronic device may perform an operation such as data processing by itself, and may perform an operation such as data processing by using the computing module as the computing module is mounted. Accordingly, as the first computing module and the second computing module are mounted, the electronic device may further use a processor included in the computing module to more quickly process complex calculations.

In contrast, as one of the first computing module and the second computing module is mounted, the electronic device may perform an operation such as data processing, and may not be able to perform an operation such as data processing by itself. In this case, the electronic device may operate normally according to the performance of a processor included in a computing module to be mounted, or may operate with at least some functions limited.

For example, when the first computing module including the high-performance first processor is mounted, the electronic device may operate normally without limiting all functions of the electronic device. On the other hand, when a second computing module including a low performance second processor is mounted, the electronic device limits functions that cannot be performed by the second processor and only functions that can be performed by the second processor. can make this work. As such, the function of the electronic device may be limited according to the performance of the processor included in the mounted computing module.

In (b) of FIG. 3A , the second computing module and the third computing module including the second processor and the third processor having the same performance are electronic devices (eg, notebook computers, tablet PCs, PCs, TVs, printers, vehicles, vacuum cleaners, etc.) ) will be described. As described above, when the electronic device cannot perform a function by itself, the electronic device may perform a function by using the computing module as the computing module including the processor is mounted. The electronic device may be manufactured in various forms depending on the purpose of use, except for a common part among electronic devices, such as a processor.

For example, parts such as a processor, which are commonly used in electronic devices such as a TV, a printer, a vacuum cleaner, and a vehicle, may be excluded, and may be manufactured to match the characteristics of each electronic device. In addition, the electronic devices may be manufactured to have a physical/electrical structure in which a computing module is detachable. Accordingly, when the computing module is mounted in the electronic device, the electronic device can operate, and various electronic devices can be operated through one computing module.

In addition, even if the manufacturers of the second processor and the third processor are different, if they include a physical/electrical connection structure according to a preset standard, various electronic devices may be operated using the computing module. In this way, by standardizing the size, electrical connection structure, heat transfer structure, etc. of the computing module including various processors according to preset criteria, the computing module can be used to correspond to the uses of various electronic devices, and one computing module can be used. Through this, various electronic devices may be operated.

In FIG. 3B , the operation of the electronic device through the first computing module 310 and the second computing module 320 will be described. The first electronic device 311 may operate by using the first computing module 310 as the first computing module 310 is mounted. The first electronic device 311 may output a screen according to the operation of the electronic device 311 through the external display device 312 without including a display by itself.

Also, the second electronic device 321 may operate by using the second computing module 320 as the second computing module 320 is mounted. The second electronic device 321 may output a screen according to the operation of the electronic device 321 through its own display instead of an external display.

As described above, as the computing module is mounted, the electronic device may perform an operation, and the electronic device may use another connected electronic device.

In FIG. 3C , various connection methods between the computing module and the electronic device will be described. The electronic device 332 may be connected to the first computing module 330 by wire. In this case, the electronic device 332 may communicate with the first computing module 330 through a connection cable and may supply power.

Also, although not shown, the first computing module 330 may be detachably inserted into the electronic device 332 . For example, the electronic device 332 may have an accommodating part that can accommodate the first computing module 330 , and the first computing module 330 may be connected to the electronic device 332 through the accommodating part. have. In FIG. 3C , it is illustrated that the first computing module 330 and the electronic device 332 are connected through a cable to represent that they can be connected by wire, but is not limited thereto. The first computing module 330 and the electronic device 332 may be connected through a connection line such as a cable or a connection port, and various connection methods such as connection through contact may be used. It is obvious to a person skilled in the art.

Also, the electronic device 332 may be wirelessly connected to the second computing module 331 . In this case, the electronic device 332 may wirelessly communicate with the second computing module 331 and may receive power wirelessly. In addition, the power supply may be received through a separate device.

4 illustrates a power transfer flow to a processor in an electronic device according to a comparative example.

In FIG. 4 , a method of supplying power for the operation of the processor 410 using power supplied from the power supply/control unit 440 included in the electronic device 400 according to a comparative example will be described. Hereinafter, it is assumed that the processor 410 is a high-performance processor requiring a separate power transfer and heat processing structure.

The processor 410 may include at least one of a CPU, a GPU, and other additional processors. When the electronic device 400 is designed such that the processor 410 includes all of a CPU, a GPU, and an additional processor, the electronic device is configured such that a power rail for transmitting power to each of the CPU, GPU, and additional processor is configured separately 400 can be designed. Accordingly, power for the operation of the CPU may be transmitted through the CPU power rail 421 , and power for the operation of the GPU may be transmitted through the GPU power rail 422 . Also, although not shown, power for the operation of the additional processor may be transmitted using a separate power rail. In this way, the power supplied to the processor 410 may be supplied to each of the processor units included in the processor 410 through a separate power rail.

The power supply/control unit 440 may supply a battery included in the electronic device 400 or power input from the outside to each component in the electronic device 400 . In addition, when the operating state of the electronic device does not require the operation of the processor 410 such as a low power mode or a sleep mode, the power supply/control unit 440 may turn off the power supplied to the processor 410 . have. Similarly, the power supply/control unit 440 may control the power supplied to the components according to whether the components included in the electronic device 400 operate.

In general, since the processor 410 consumes more power for operation than the other components 460 , the electronic device 400 uses a separate first power supply to supply power to the processor 410 . 420 may be included. The first power supply unit 420 may generate a voltage for supplying power to the processor 410 using the power supplied through the power supply/control unit 440 . In general, in order for a high-performance processor to operate normally, it is necessary to stably supply power with a low voltage and a high current.

As such, the voltage for the operation of the processor 410 or the voltage required by the processor 410 may be relatively small compared to the voltage of the power supplied from the power supply/controller 440 . Accordingly, the first power supply unit 420 converts the voltage of the power supplied from the power supply unit/control unit 440 into a voltage for the operation of the processor 410 or a voltage required by the processor 410 . (conversion) is possible.

In addition, the voltage for the operation of the processor 410 or the voltage required by the processor 410 may vary depending on the CPU and GPU, and may vary according to the operating state of the processor 410 . The processor 410 may transmit a signal indicating information on a voltage required according to an operating state to the first power supply 420 . The first power supply 420 may perform DC-DC conversion to a voltage required by the processor 410 based on the signal.

The power supply unit 430 may supply power to the processor 410 using the CPU power rail 421 or the GPU power rail 422 as a voltage converted through the first power supply unit 420 . In addition, when the processor 410 includes an additional processor in addition to the CPU and GPU, the power supply unit 430 uses a separate power rail for supplying power to the additional processor within the processor 410 . It can be powered by an additional processor.

The second power supply unit 450 may supply power to other components 460 except for the processor 410 by using the power supplied from the power supply/control unit 440 . Since the other components 460 consume less power than the processor 410 , a separate power supply unit may not be required like the processor 410 .

As described above, in the electronic device 400 including the high-performance processor 410 , it is necessary to stably supply power to the processor 410 in order for the processor 410 to operate normally. To this end, as described above, the CPU power rail 421 and the GPU power rail that DC-DC converts the voltage of the system power supplied to the voltage required by the processor 410 and transmits the power to the processor 410 . (422) must be designed to satisfy the required power integrity (Power Integrity). However, in general, the structure for transmitting power to the processor 410 as described above occupies a large portion of the space in the electronic device 400 , and thus may become an obstacle to downsizing the electronic device 400 .

5 illustrates a power transfer flow from an electronic device to a processor in a computing module according to various embodiments of the present disclosure;

In FIG. 5 , a method of supplying first power to the processor 510 in the computing module 500 using power supplied from the electronic device 520 according to various embodiments of the present disclosure will be described. Hereinafter, it is assumed that the processor 510 is a high-performance processor requiring a separate power transfer and heat processing structure. In addition, hereinafter, power received from the electronic device 520 is referred to as first power in order to distinguish it from power supplied from a power supply in the computing module 500 .

The processor 510 may include at least one of a CPU, a GPU, and other additional processors. When the electronic device 500 is designed such that the processor 510 includes all of the CPU, GPU, and additional processor, a power rail for transmitting the first power to each of the CPU, GPU, and additional processor is designed to be configured separately can be Accordingly, the first power for the operation of the CPU is transmitted through the first CPU power rail 522 and the second CPU power rail 512 , and the first GPU power rail 523 and the second GPU power rail 513 . The first power for the operation of the GPU may be transmitted through . Also, although not shown, the first power for the operation of the additional processor may be transmitted using a separate power rail. As such, the first power supplied to the processor 510 may be supplied to each of the processor units included in the processor 510 through a separate power rail.

The power supply/control unit 524 included in the electronic device 520 supplies the battery included in the electronic device 520 or power obtained from the outside to the first power supply 521 and the computing module 500 . can In addition, when the operating state of the electronic device 520 does not require the operation of the processor 510 included in the computing module 500, such as a low power mode or a sleep mode, the power supply/control unit 524 is the processor The power supplied to the 510 may be turned off. Similarly, the power supply/control unit 524 may control the power supplied to the computing module 500 according to whether other components 518 included in the computing module 500 operate.

The first power supply unit 521 may DC-DC convert the voltage of the power supplied from the power supply/control unit 524 to a voltage for the operation of the processor 510 or a voltage required by the processor 510 . have. The voltage for the operation of the processor 510 or the voltage required by the processor 510 may vary depending on the CPU and GPU, and may vary according to the operating state of the processor 510 . The processor 510 may transmit a signal representing information on a voltage required according to an operating state to the first power supply unit 521 in the electronic device 520 . The first power supply unit 521 may perform DC-DC conversion to a voltage required by the processor 510 based on the signal. The first power supply unit 521 may transmit first power to the computing module 500 using the converted voltage using the first CPU power rail 522 and the first GPU power rail 523 .

The power supply unit 511 obtains a converted voltage through the first power supply unit 521 , and uses the second CPU power rail 512 or GPU power rail 513 as the converted voltage to the processor First power may be supplied to 510 . The power supply unit 511 may divide and transmit the first power supplied to the CPU and the GPU. In addition, the first power supply unit 521 and the power supply unit 511 are separate for supplying first power to the additional processor when the processor 510 includes an additional processor in addition to the CPU and GPU. A power rail may be used to supply first power to an additional processor in the processor 510 .

As described above, according to various embodiments of the present disclosure, a power transmission structure for transmitting first power to the processor 510 included in the computing module 500 includes the computing module 500 and the electronic device 520 . may be disposed separately. For example, a power rail for smooth flow of low voltage and large current to the processor 510 and a small amount of decoupling capacitor for the integrity of the supplied power are disposed in the computing module 500, and the like , a first power supply 521 for generating a voltage required by the processor 510 may be disposed in the electronic device 520 . The first power supply unit 521 may be controlled by the power supply/control unit 524 , or may be controlled through software installed in the electronic device 520 . Also, the first power supply unit 521 may be separately modularized to be detachable for compatibility between electronic devices.

In addition, the processor 510 may control the first power supply 521 by transmitting a signal indicating information on first power required for operation to the first power supply 521 . By disposing the first power supply unit 521 in the electronic device 520 as described above, the size of the computing module 500 may be reduced.

However, as described above, when the first power is supplied to the low voltage converted by the first power supply unit 521, a large current is required to receive the first power, and such a large current flow A physical path that can process

For example, in the case of a processor having a TDP of 15 W, it is necessary to supply a current of several tens of amperes or more for the operation of the processor, and a sufficient physical path is required for the flow of such a large current.

Accordingly, according to various embodiments of the present disclosure, the electronic device 520 provides a first connection connecting the electronic device 520 and the computing module 500 to supply first power through the large current. At least one first area of the case constituting the computing module 500 may be used as a path for power transmission without using a main connection interface such as the interface 514 or the second connection interface 515 . To this end, the at least one first region may be made of a material having electrical conductivity in order to receive the first power. Also, the at least one first region may be connected to the power supply unit 511 , so that the first power received from the electronic device 520 may be transferred to the processor 510 . As such, the processor 510 located in the case may receive the first power from the electronic device 520 through the case.

Through this, by securing a sufficient power rail for the flow of large current and optimizing the length of the power transmission path, the drop and noise of voltage and current transmitted from the electronic device 520 to the computing module 500 are reduced. It is easy to secure power integrity. In addition, it is possible to prevent the size of the computing module 500 from increasing due to the addition of a separate component such as a connection part for the flow of a large current.

The first connection interface 514 and the second connection interface 515 may perform electrical connection between the computing module 500 and the electronic device 520 and communication such as data/control signals. In addition, it may additionally include a uHDMI port 719 for connection to an external display device or the like. In addition, it is apparent to those skilled in the art that various connection ports may be used for connection with other electronic devices or components such as a display included in the electronic device 520 .

In this way, a connection interface for performing electrical connection and communication such as a data control signal and a structure for transmitting the first power may be separated from each other. In addition, a structure for transferring heat generated by the operation of the processor 510 may also be separated from the connection interface, and the heat transfer structure and heat transfer method will be described later.

The second power supply unit 516 may supply power to other components 517 other than the processor 510 by using the power supplied from the power supply/control unit 440 . Since the other components 517 consume less power than the processor 510 , a separate power supply unit may not be required like the processor 510 .

In this way, a power transmission structure that is an obstacle to miniaturization of the computing module 500 including the high-performance processor 510 is separated and disposed in the electronic device 520 , and the case of the computing module 500 is provided with power. By using it as a transfer path, the size of the computing module 500 can be reduced.

6 is a flowchart of a method of controlling power supplied from an electronic device by a computing module according to various embodiments of the present disclosure.

In operation 610, the computing module may receive first power from the electronic device detachable from the computing module through at least one first area of the case of the computing module. The computing module may receive the first power as a voltage converted by the electronic device. As such, the computing module may receive the voltage converted by the electronic device without including a configuration for converting a voltage in order to supply power to a processor in the computing module. In addition, the computing module may secure a power rail that is a sufficient power transmission path by receiving power through the case.

In operation 620, the computing module may supply the received first power to a processor in the computing module. When the processor includes both the CPU and the GPU, the computing module may separate the received first power and supply it to the CPU and the GPU, respectively. Also, when the processor includes an additional processor other than the CPU and the GPU, the first power may be separately separated and supplied to the additional processor.

In operation 630, the computing module may transmit a signal for controlling the first power to the electronic device based on the operating state of the processor. Since the power required for the operation of the processor is different according to the operating state of the processor, the processor may transmit a signal for controlling the first power to the electronic device supplying the first power.

In operation 640, the computing module may receive the first power adjusted based on the signal and supply it to the processor. As described above, even if a power transmission structure for transmitting power to the processor is disposed in the electronic device, the processor may receive the required power through a control signal.

7 is a flowchart of a method of transferring power to a computing module by an electronic device according to various embodiments of the present disclosure;

In operation 710 , the electronic device to which the computing module is detachably connected may convert a voltage of power supplied to operate a processor located in the computing module. As described above, it may be difficult to miniaturize and manufacture a power transmission structure for operating a high-performance processor. Accordingly, since the electronic device to which the computing module is connected includes the power transmission structure, the computing module may be manufactured in a compact size.

In operation 720, the electronic device may supply first power to the computing module using the converted voltage through at least one first area of the case of the computing module. The at least one first region may be made of a material having electrical conductivity to receive the first power.

In operation 730, the electronic device may receive a signal for controlling the first power based on the operating state of the processor received from the computing module. The processor may have different power required for its operation according to an operating state. Accordingly, the processor may transmit a signal for controlling the first power to the electronic device in order to receive power required according to its operating state.

In operation 740, the electronic device may adjust the level of the first power based on the received signal. Also, the electronic device may supply the size-adjusted first power to the computing module. As such, even if the power supply structure is disposed outside the computing module, power supplied through communication between the computing module and the electronic device may be controlled.

8 illustrates a power transfer flow from a power supply to a processor in a computing module according to various embodiments of the present invention.

In FIG. 8 , when the electronic device 830 does not include a power supply for supplying first power to the processor 810 in the computing module 800 , the first power supply 812 included in the computing module 800 . ) to provide a method of supplying the second power to the processor 810 using the . Hereinafter, it is assumed that the processor 810 is a high-performance processor requiring a separate power transfer and heat processing structure. Hereinafter, as described with reference to FIG. 5 , power supplied through the first power supply unit 812 is denoted as second power in order to distinguish it from the first power supplied from the electronic device.

As shown in FIG. 8 , the electronic device 830 may not include a separate power transmission structure for transmitting the first power to the processor 810 . In this case, the power supply/controller 831 included in the electronic device 830 may directly transmit a battery included in the electronic device 830 or power obtained from the outside to the computing device 800 . The power supply/control unit 831 transmits the power to the computing module 800 through a first connection interface 815 or a second connection interface 816 that performs electrical connection or data/signal communication with the computing module 830 . ), or the power may be transmitted through at least one first area of the case of the computing module 800 . The first power supply unit 812 included in the computing module 800 is a voltage for the operation of the processor 810 or a voltage required by the processor 810 , and is a voltage of power received from the electronic device 830 . may be adjusted to supply the second power. Unlike the first power supply unit included in the electronic device described with reference to FIGS. 4 and 5 , the first power supply unit 812 may be a power supply unit for supplying low power required by a low-performance processor. Accordingly, since the first power supply 812 is smaller in size than the first power supply included in the electronic device described with reference to FIGS. 4 and 5 , the space occupied by the computing module 800 may not be large. Accordingly, there is no obstacle to making the computing module 800 small.

The power supply 811 obtains the regulated voltage through the first power supply 812 , and uses the regulated voltage to the processor 810 using the CPU power rail 813 or the GPU power rail 814 . Second power may be supplied. The power supply unit 811 may separately transmit the second power supplied to the CPU and the GPU. In addition, the first power supply unit 812 and the power supply unit 811 are separate for supplying second power to the additional processor when the processor 510 includes an additional processor in addition to the CPU and GPU. A second power may be supplied to an additional processor in the processor 810 using a power rail.

As power is supplied through the first power supply unit 812 , the processor 810 transmits a signal indicating information about the voltage required by the processor 810 to the first power supply unit 812 . , the first power supply unit 812 may be controlled.

Also, the computing module 800 may include a second power supply unit 817 for supplying power to other components 818 other than the processor 810 . Since the other components 818 consume less power than the processor 810 , a separate power supply unit may not be required like the processor 810 .

As such, the computing module 800 may operate even if it is connected to the electronic device 830 that does not include a message transmission structure for transmitting power to the high-performance processor. However, since the processor 810 located in the computing module 800 cannot receive power for normal operation, it may operate with limited performance.

The computing module according to various embodiments of the present disclosure can operate not only in an electronic device including a power transmission structure for supplying sufficient power, but also in an electronic device not including the power transmission structure, and accordingly, Commonality can be increased. In other words, the computing module may operate with high performance depending on whether a connected electronic device includes a power transmission structure, or may operate with low performance due to limited performance.

9A is a view for explaining a cooling method by an electronic device according to a comparative example.

The electronic device according to a comparative example may include a cooling unit that radiates heat generated by the processor 910 located therein to the outside or diffuses it throughout the electronic device. Heat generated by the operation of the processor 910 may be transferred to a cooling unit for heat treatment through the heat pipe 920 . In addition, heat generated by the operation of the processor 910 may be diffused into the electronic device through the heat spreader 921 . The cooling unit may include a remote heat exchanger (RHE) 930 , a fan 931 , and a heat spreader 932 .

The cooling unit may radiate heat generated by the operation of the processor to the outside using the RHE 930 , the fan 931 , and the heat spreader 932 or diffuse it into the electronic device. A thermal interface material (TIM) may be inserted between the processor 910 , the heat pipe 920 , and the heat spreader 921 to reduce thermal resistance, thereby increasing the heat dissipation effect. However, although the processor 910, the heat pipe 920, and the heat spreader 921 are detachable for manufacturing and repair, it is difficult for a user to intentionally easily detach the processor 910 for the purpose of general use.

Since the cooling unit includes a physically bulky RHE 930 , a fan 931 , a heat pipe 920 , and a heat spreader 932 , it is difficult to manufacture in a compact size. When the cooling unit is manufactured in a small size, the heat treatment function may not be normally performed. As such, since it is difficult to miniaturize the cooling unit, it may become an obstacle in manufacturing a computing module including a high-performance processor.

9B is a diagram for explaining a cooling method by a computing module and an electronic device according to various embodiments of the present disclosure;

In the computing module according to various embodiments of the present disclosure, a cooling unit for processing heat generated by the operation of the processor 940 in the computing module may be separately disposed in an electronic device to which the computing module is detachably connected.

For example, a cooling unit including a bulky RHE 950 , a fan 951 , and a heat spreader 951 may be disposed in the electronic device. In addition, the computing module is made of a heat transfer material having excellent heat transfer efficiency, and a heat transfer unit 941 having a sufficiently thin form (eg, thin, sheet structure, etc.) can be disposed in order to miniaturize the computing module. have. One surface of the heat transfer unit 941 may be exposed to the outside of the computing module to be in contact with a cooling unit included in the electronic device.

For example, at least one second area of the case of the computing module corresponding to the heat transfer unit may be formed in an open structure. Therefore, the heat generated by the processor 940 is transferred to the heat transfer unit 941 , and the heat transfer unit 941 is connected to a cooling unit included in the electronic device through the at least one second region. By direct contact, heat generated by the processor 940 may be transferred to the cooling unit.

The heat transferred to the cooling unit may be discharged to the outside of the electronic device or diffused inside the electronic device to be processed by the RHE 950 , the fan 951 , and the heat spreader 952 included in the cooling unit. .

A surface of the heat transfer unit 941 in contact with the processor 940 may be bonded to the processor 941 using a TIM or may be directly bonded to the processor 941 .

In addition, since the heat transfer unit 941 can be intentionally and frequently detachably attached to and detached from the electronic device for the purpose of using the computing module, gels, rubbers, etc. that can be used to reduce thermal resistance are not used. The gel, rubber, etc. may be unsuitable as a heat transfer structure of the computing module because shape deformation occurs due to multiple attachment and detachment, and thus heat transfer characteristics may be easily changed. Accordingly, the heat transfer unit 941 may be formed of a metallic heat transfer material so that the shape is not deformed due to attachment and detachment several times.

In addition, since the heat transfer unit 941 may transfer heat through surface contact with the cooling unit, a portion in contact with the heat transfer unit 941 is a heat transfer material in order to efficiently receive heat transfer to the cooling unit as well. can be composed of However, as described above, the portion in contact with the heat transfer unit 941 of the cooling unit may be made of a metallic heat transfer material so that the shape is not deformed due to multiple attachment and detachment.

As described above, since the bulky cooling unit is separately disposed in the electronic device, the computing module may be manufactured in a compact size.

10 is a cross-sectional view of a computing module and an electronic device according to various embodiments of the present disclosure;

The computing module 1010 and the electronic device 1050 according to various embodiments of the present disclosure may be detachably connected in various ways. For example, the computing module 1010 may be inserted into the electronic device 1050 in a sliding manner to connect the electronic device 1050 and the computing module 1010 . To this end, the electronic device 1050 may include a coupling structure into which the computing module 1010 can be inserted. Hereinafter, a method in which the computing module 1010 is inserted into the electronic device 1050 and the electronic device 1050 and the computing module 1010 are connected will be mainly described.

However, this is only for the purpose of explanation and is not limited thereto. For example, the electronic device 1050 may include a separate accommodating part for accommodating the computing module 1010 , and the accommodating part may have a structure that can be opened and closed through a door. The computing module 1010 may open a door of the accommodating part and may be inserted into the accommodating part to be connected to the electronic device 1050 . As such, a method for connecting the electronic device 1050 and the computing module 1010 is not limited to the above-described sliding method and a method using a separate accommodation unit, and various methods may be used for those skilled in the art. it is clear to

The computing module 1010 and the electronic device 1050 according to various embodiments of the present disclosure transmit power from the electronic device 1050 to the computing module 1010 separately from a main connection interface for electrical connection and communication of data and signals. ), and heat may be transferred from the computing module 1010 to the electronic device 1050 . For example, the power and heat may be transferred through the case of the computing module 1010 .

Power may be received as a converted voltage from the electronic device 1050 through at least one first area 1030 , 1031 of a case of the computing module 1010 . The at least one first region 1030 , 1031 may be made of an electrically conductive material, and may be connected to a power transmission unit for transmitting power to the CPU 1020 and the GPU 1021 . The power transmitter supplies the received power to the CPU 1020 and the GPU 1021 , so that the CPU 1020 and the GPU 1021 operate.

The electronic device 1050 uses a voltage for operating the CPU 1020 or GPU 1021 or a voltage required by the CPU 1020 or GPU 1021 to transfer the power to the computing module 1010 . It is possible to convert the voltage supplied from The electronic device 1050 may transmit power to the computing module 1010 using the converted voltage using the power rails 1060 and 1061 included in the electronic device 1050 .

Heat generated by the operation of the CPU 1020 and the GPU 1021 may be transferred to the heat transfer unit 1040 bonded to the CPU 1020 and the GPU 1021 . The heat transfer unit 1040 may be bonded to the CPU 1020 and the GPU 1021 using a TIM 1041 . In addition, at least one second area of the case of the computing module 101 corresponding to the heat transfer unit may be formed in an open structure. Accordingly, heat generated by the CPU 1020 and the GPU 1021 may be transferred to the electronic device 1050 through the at least one second area. For example, when the heat transfer unit 1040 and the cooling unit 1070 are in direct contact, heat generated by the CPU 1020 and the GPU 1021 may be transferred to the cooling unit 1070 . . The cooling unit 1070 may dissipate the heat received through the heat transfer unit 1040 to the outside or diffuse it inside the electronic device for processing.

A surface of the heat transfer unit 1040 in contact with the cooling unit 1070 and a surface in contact with the heat transfer unit 1040 of the cooling unit 1070 may be formed of a metallic heat transfer material. Since the computing module 1010 is attached and detached from the electronic device several times for the purpose of using it, when the heat transfer material is gel or rubber, the shape is changed due to attachment and detachment several times, and the heat transfer characteristics are changed due to the shape deformation. can Thus, it is possible to construct the surface with a metallic heat transfer material. However, a heat transfer material composed of a solid has a higher thermal resistance than a heat transfer material composed of a gel, rubber, etc., and thus heat transfer efficiency may be deteriorated. Accordingly, by designing a large contact area between the heat transfer unit 1040 and the cooling unit 1070 , the heat generated by the CPU 1020 and the GPU 1021 is efficiently transferred to the electronic device 105 . can do.

However, the above-described structure of heat transfer and power transfer is merely an example for the purpose of description and is not limited thereto. The contact surface of the computing module 1010 and the electronic device 1050 has an elastic structure inside the computing module 1010 or the electronic device 1050 for tight coupling so as to have necessary electrical resistance and thermal resistance. ) can also be configured internally. As described above, it is clear to those skilled in the art that the computing module 1010 and the electronic device 1050 may be configured in various ways to enable interaction.

As described above, since a physically bulky power transmission and heat processing structure is disposed in the electronic device 1050 , the computing module 1010 may be manufactured in a compact size.

11 is a view for explaining a method of fixing a cooling unit in a computing module according to various embodiments of the present disclosure.

The heat transfer unit 1110 may be bonded to the processor using a heat transfer material. However, as described above, attachment and detachment occurs frequently for the purpose of use of the computing module, and whenever the computing module and the electronic device are attached or detached, the heat transfer unit 1110 may be in contact with and separated from the cooling portion of the electronic device. have. Accordingly, the heat transfer unit 1110 must be fixedly mounted on the computing module.

To this end, the heat transfer unit 1110 may be fixedly mounted on a printed circuit board (PCM) in the computing module. 11 , the heat transfer unit 1110 may be connected to the PCB through PEMs 1130 and 1131 , and by inserting a support between the PEMs 1130 and 1131 , the heat transfer unit ( 110) may be fixedly mounted to the computing module.

12 illustrates a power transfer structure and a heat transfer structure between a computing module and an electronic device according to various embodiments of the present disclosure.

12 is a diagram schematically illustrating a structure of power transfer and heat transfer between the computing module 1200 and the electronic device 1230 . For example, the computing module 1200 may receive power from the electronic device 1230 through at least one first area of the case of the computing module 1200 . In order to supply the power to the processor included in the computing module 1200 , the at least one first area inside the computing module 1200 is configured to supply power to the processor through the power rails 1210 and 1211 . It may be connected to a power supply. The power supply unit may be disposed on a PCB located inside the computing module 1200 or may be disposed as a separate component from the PCB.

The electronic device 1230 may convert a voltage of a battery included in the electronic device 1230 or an externally acquired power voltage into a voltage for operating the processor or a voltage required by the processor. The electronic device 1230 may transmit power to the computing module 1200 using the converted voltage using the power rails 1240 and 1241 .

The computing module 1200 may transfer heat generated by the operation of the processor to the electronic device 1230 through the heat transfer unit 1220 included in the computing module 1200 . For example, when the heat transfer unit 1220 and the cooling unit 1250 included in the electronic device 1230 are in direct contact with each other, heat generated by the processor is transferred to the cooling unit included in the electronic device 1230 . may be passed to (1250). The cooling unit 1250 may dissipate the received heat to the outside or diffuse it inside the electronic device 1230 for processing.

13 illustrates a case of a computing module according to various embodiments of the present disclosure.

At least one first area in which the computing module receives power from the electronic device and at least one second area in which the computing module transfers heat to the electronic device may be configured in various shapes, It can be configured in various positions. The at least one first area and the at least one second area may be configured in various positions and shapes of the computing module case according to a connection method and a connection structure between the electronic device and the computing module.

For example, the at least one first area may be located on the upper surfaces 1310 and 1311 of the case of the computing module. In addition, the at least one first area may be present in one or a plurality, and although not shown, may be circular or polygonal. In addition, the at least one first area may be located on the side surfaces 1312 and 1313 or on the lower surface 1314 of the case.

In addition, the at least one second area may be formed in an open structure such that a heat transfer unit included in the computing module may directly contact the cooling unit, and the heat transfer unit may be externally connected through the at least one second area. may be exposed to Although not shown, the second region may be plural, and may be configured in various shapes and positions.

14A to 14D illustrate structures of a computing module and an electronic device having an opening/closing structure according to various embodiments of the present disclosure.

14A illustrates a case in which the region 1410 including the power transmitter and connection ports included in the computing module 1400 is located on the side. The region 1410 may be located inside the case of the computing module 1400 , and a case portion of the computing module 1400 corresponding to the region 1410 may have an opening/closing structure. For example, the computing module 1400 may be configured to be opened when coupled to the electronic device and closed again when separated from the electronic device.

Also, power may be received from the electronic device through at least one first block of the area 1410 including the connection ports. At least one first block for receiving the power may be configured to have an area large enough to allow a large current to flow in order to receive the power. Also, at least one second block included in the area 1410 may be used for data and signal communication with the electronic device.

14B illustrates a cross-sectional view of the computing module 1400 and the electronic device 1420 before the computing module 1400 is mounted on the electronic device 1420 . Before the computing module 1400 is mounted on the electronic device 1420 , the region 1410 is located inside the case of the computing module 1400 , and the computing module 1400 corresponding to the region 1410 . ) is closed. Also, the heat transfer unit of the computing module 1400 may not be disposed in the region 1410 because a large contact area is required for heat transfer efficiency. The heat transfer unit may be disposed to directly contact the cooling unit of the electronic device 1420 through at least one second area of the case of the computing module 1400 formed in an open structure. In addition, the heat transfer unit may be bonded to the CPU and the GPU using a heat transfer material (TIM).

14C is a cross-sectional view of the computing module 1400 and the electronic device 1420 when the computing module 1400 is mounted on the electronic device 1420 . As the computing module 1400 is mounted on the electronic device 1420 , the case of the computing module 1400 corresponding to the area 1410 is opened. For example, the case of the computing module 1400 corresponding to the first area may have a door structure, and as the case is pushed by the electronic device 1420, a spring supporting the case As a result, the first region 1410 may be exposed to the outside. The first region 1410 exposed to the outside may be coupled to the connection part 1430 of the electronic device 1420 . As the first region 1410 and the connector 1430 of the electronic device 1420 are coupled, power supply and communication between the computing module 1400 and the electronic device 1420 may be performed.

14D illustrates an overall cross-sectional view of the computing module 1400 mounted on the electronic device 1420 . The first area 1410 is exposed to the outside as a case corresponding to the first area 1410 is opened, and the exposed first area 1410 is a connection part 1430 of the electronic device 1420 . ) can be associated with In this way, the first region 1410 and the connecting portion 1430 may be designed and manufactured in advance to be connectable to each other.

Each of the components described in this document may be composed of one or more components, and the name of the component may vary depending on the type of the electronic device. In various embodiments, the electronic device may be configured to include at least one of the components described in this document, and some components may be omitted or may further include additional other components. In addition, since some of the components of the electronic device according to various embodiments are combined to form a single entity, the functions of the components prior to being combined may be identically performed.

As used herein, the term “module” may refer to, for example, a unit including one or a combination of two or more of hardware, software, or firmware. The term “module” may be used interchangeably with terms such as, for example, unit, logic, logical block, component, or circuit. A “module” may be a minimum unit or a part of an integrally configured component. A “module” may be a minimum unit or a part of performing one or more functions. A “module” may be implemented mechanically or electronically. For example, a “module” may be one of an application-specific integrated circuit (ASIC) chip, field-programmable gate arrays (FPGAs) or programmable-logic device, known or to be developed, that performs certain operations. It may include at least one.

At least a portion of an apparatus (eg, modules or functions thereof) or a method (eg, operations) according to various embodiments is, for example, a computer-readable storage medium in the form of a program module It can be implemented as a command stored in . When the instruction is executed by a processor, the one or more processors may perform a function corresponding to the instruction. The computer-readable storage medium may be, for example, a memory.

Computer-readable recording media include hard disks, floppy disks, magnetic media (eg, magnetic tape), optical media (eg, compact disc read only memory (CD-ROM), DVD ( digital versatile disc), magneto-optical media (such as floppy disk), hardware devices (such as read only memory (ROM), random access memory (RAM), or flash memory, etc.) ), etc. In addition, the program instructions may include not only machine language codes such as those generated by a compiler, but also high-level language codes that can be executed by a computer using an interpreter, etc. The above-described hardware devices include various It may be configured to operate as one or more software modules to perform the operations of the embodiments, and vice versa.

A module or program module according to various embodiments may include at least one or more of the above-described components, some may be omitted, or may further include additional other components. Operations performed by a module, a program module, or other components according to various embodiments may be executed sequentially, in parallel, iteratively, or in a heuristic manner. Also, some operations may be executed in a different order, omitted, or other operations may be added. In addition, the embodiments disclosed in this document are presented for explanation and understanding of the disclosed and technical content, and do not limit the scope of the technology described in this document. Accordingly, the scope of this document should be construed to include all modifications or various other embodiments based on the technical spirit of this document.

Claims (34)

A portable computing module removably connected to an electronic device, the portable computing module comprising:
case;
a processor located within the case;
a power supply configured to supply first power received from the electronic device to the processor;
a heat transfer unit configured to transfer heat generated by the processor to the electronic device; and
a power supply configured to supply second power to the processor by adjusting a voltage of power supplied from the electronic device when the first power is not received from the electronic device;
wherein the power supply is further configured to scale the second power such that heat generated by the processor is processable within the computing module.
computing module. According to claim 1,
The power supply unit,
and receive the first power through at least one first area of the case. delete According to claim 1,
The first power is
a computing module received as a voltage converted by the electronic device for supply to the processor. According to claim 1,
The heat transfer unit,
A computing module for transferring heat generated by the processor to the electronic device through at least one second area of the case. delete delete delete According to claim 1,
The heat transfer unit,
A computing module bonded to the processor using a heat transfer material. According to claim 1,
The computing module further comprising at least one connection interface connected to the electronic device to perform communication. According to claim 1,
The processor is
A computing module configured to transmit a signal for controlling the first power to the electronic device based on an operating state of the processor. delete delete A method of operating a portable computing module removably connected to an electronic device, the method comprising:
supplying the first power received from the electronic device to a processor in the computing module through at least one first area of the case of the computing module;
transmitting a signal for controlling the first power to the electronic device based on the operating state of the processor;
receiving the adjusted first power based on the signal and supplying it to the processor;
supplying second power to the processor by adjusting a voltage of power supplied from the electronic device when the first power is not received from the electronic device; and
and adjusting the magnitude of the second power so that heat generated by the processor can be processed within the computing module.
Way. 15. The method of claim 14,
the at least one first area,
and a material having electrical conductivity to receive the first power. delete 15. The method of claim 14,
Heat generated by the processor is transferred to the electronic device through at least one second area of the case of the computing module. delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete

Images